CN116333576B - Weather-resistant backboard inner layer coating composition and application thereof - Google Patents
Weather-resistant backboard inner layer coating composition and application thereof Download PDFInfo
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- CN116333576B CN116333576B CN202310327666.7A CN202310327666A CN116333576B CN 116333576 B CN116333576 B CN 116333576B CN 202310327666 A CN202310327666 A CN 202310327666A CN 116333576 B CN116333576 B CN 116333576B
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- 239000008199 coating composition Substances 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 239000004611 light stabiliser Substances 0.000 claims abstract description 42
- 238000006243 chemical reaction Methods 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims abstract description 22
- 230000008033 biological extinction Effects 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 15
- -1 trifluorochloroethylene vinyl ether Chemical compound 0.000 claims description 28
- 239000002245 particle Substances 0.000 claims description 17
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 15
- 229920001296 polysiloxane Polymers 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 13
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 11
- 229920001577 copolymer Polymers 0.000 claims description 11
- 150000001412 amines Chemical class 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 7
- 229920001228 polyisocyanate Polymers 0.000 claims description 6
- 239000005056 polyisocyanate Substances 0.000 claims description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 5
- YXRKNIZYMIXSAD-UHFFFAOYSA-N 1,6-diisocyanatohexane Chemical compound O=C=NCCCCCCN=C=O.O=C=NCCCCCCN=C=O.O=C=NCCCCCCN=C=O YXRKNIZYMIXSAD-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 229910052775 Thulium Inorganic materials 0.000 claims description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- 229920001567 vinyl ester resin Polymers 0.000 claims description 3
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 claims description 2
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 150000002815 nickel Chemical class 0.000 claims description 2
- 239000006224 matting agent Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 27
- 238000000576 coating method Methods 0.000 abstract description 27
- 230000032683 aging Effects 0.000 abstract description 11
- 238000002834 transmittance Methods 0.000 abstract description 10
- 239000002313 adhesive film Substances 0.000 abstract description 6
- 238000004383 yellowing Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 67
- 239000013638 trimer Substances 0.000 description 12
- 229920001400 block copolymer Polymers 0.000 description 11
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 239000005038 ethylene vinyl acetate Substances 0.000 description 10
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- XPBBUZJBQWWFFJ-UHFFFAOYSA-N fluorosilane Chemical compound [SiH3]F XPBBUZJBQWWFFJ-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000006750 UV protection Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000012752 auxiliary agent Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 150000002910 rare earth metals Chemical class 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/32—Radiation-absorbing paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Paints Or Removers (AREA)
Abstract
The invention relates to the technical field of solar photovoltaic back plates, in particular to a weather-proof back plate inner layer coating composition and application thereof. The back plate inner layer coating composition comprises the following components in parts by weight: 40-60% of FEVE fluorocarbon resin, 20-40% of solvent, 1-5% of curing agent, 10-20% of tackifying resin, 0.5-5% of down-conversion material, 1-5% of extinction powder and 0.5-5% of light stabilizer. The inner layer coating of the backboard has excellent thermal stability and bonding performance with the adhesive film, and can improve the light transmittance of the backboard and yellowing value after aging.
Description
Technical Field
The invention relates to the technical field of solar photovoltaic back plates, in particular to a weather-proof back plate inner layer coating composition and application thereof.
Background
The backboard is used as a key part of the crystalline silicon solar module, and plays a vital role in the safety of the module, the service life and the reduction of power attenuation. In order to achieve the purpose of protecting the battery piece, the back plate needs to have good mechanical strength and toughness, weather resistance, insulation, water vapor barrier, corrosion resistance, wind sand abrasion resistance and other various balance performances.
The back sheet structure can be broadly divided into an outer layer (also called air layer), an intermediate layer and an inner layer (or tie layer). The choice and collocation of each layer of material influences the overall performance of the backboard, and currently, a fluorine-containing film, a fluorine-containing coating or a non-fluorine coating is mainly used as the outer layer of the backboard, so that the outer layer of the backboard can be used for more than 25 years under the effect of outdoor comprehensive ageing stress. The importance of the inner layer of the back plate is often easily ignored because the inner layer of the back plate is not in direct contact with outdoor environmental stress. In addition, the inner layer material of the backboard in the market is more in variety, and the inner layer of the backboard is used as one of the protective layers of the PET polyester material in the middle layer, so that the backboard needs to have good ultraviolet blocking effect to avoid the PET from being damaged by ultraviolet.
FEVE is a copolymer resin of fluoroolefin and vinyl ether (ester), is a common material for the inner layer of the back plate, has the advantages of better weather resistance and high temperature resistance than E layer, and can be directly coated on the surface of PET without a glue layer, thereby saving the cost of glue. The FEVE coating has the advantages of inferior weather resistance and compactness as compared with a fluorine film, inferior adhesive force and mechanical property as compared with the E layer, and relatively short outdoor verification time, and is not recommended to be used under the climatic conditions of large temperature difference and large cold and hot stress.
In order to improve the ultraviolet resistance and the adhesive property of the inner layer, a plurality of auxiliary agents with anti-aging function are introduced into the fluorocarbon formula system in the material processing process, so that the fluorocarbon formula system is an effective strategy. In order to ensure light transmittance, the transparent back plate cannot be added with ultraviolet screening agents such as titanium dioxide and the like, and ultraviolet aging resistance is realized by using auxiliary agents such as organic ultraviolet absorbers and the like, but when the compatibility of a bonding layer formula system and additives such as light stabilizers and the like is poor, a series of problems such as weather resistance, adhesion with EVA adhesive films, light transmittance reduction and the like can be caused. Therefore, in order to improve the ultraviolet resistance of fluorocarbon bonding layers without significantly increasing the cost, comprehensive consideration and system optimization of the bonding layer formulation are required.
Therefore, it is highly desirable to develop a backsheet inner layer coating composition that solves the above-mentioned technical problems.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a back plate inner layer coating composition with excellent adhesive property, good light transmittance and strong weather resistance and application thereof.
The invention is realized by the following technical scheme:
a back plate inner layer coating composition comprises the following components in percentage by weight:
preferably, the FEVE fluorocarbon resin is at least one of chlorotrifluoroethylene vinyl ether and chlorotrifluoroethylene vinyl ester.
More preferably, the FEVE fluorocarbon resin has a hydroxyl value of 50-60mgKOH/g and a solid content of 50-60%.
FEVE fluorocarbon resins are copolymers of fluoroolefins and alkyl vinyl ethers or alternatively fluoroolefins and alkyl vinyl esters. In the molecular structure of the copolymer, the fluoroolefin units provide weather resistance and corrosion resistance; vinyl units provide solubility, clarity, gloss, hardness of the resin; the carboxyl groups provide pigment wetting, adhesion.
Preferably, the tackifying resin is a polysiloxane-imide block copolymer.
More preferably, the polysiloxane-imide block copolymer M w The molecular weight is 10,000-100,000.
More preferably, the polysiloxane is present in the copolymer in a mass fraction of 30 to 50wt%.
The fluorocarbon resin has weak intermolecular force and small polarizability of fluorine atoms, which directly results in extremely low surface energy and higher chemical inertia of the fluorocarbon coating, and is difficult to realize good adhesion with EVA (ethylene vinyl acetate) when being directly used as the inner layer of the backboard. In order to solve the problem of low adhesion between the fluorocarbon coating and EVA, the invention mixes tackifying resin with FEVE resin, and selects polysiloxane-imide blocks with specific structures as the tackifying resin. The copolymer has excellent heat stability, irradiation resistance, good mechanical strength and good flexibility. The incorporation of the silicone segment in the polyimide backbone increases the free volume of the copolymer and enhances flexibility. The weather-proof bonding layer of the backboard can effectively bear mechanical stress and adapt to volume expansion, and structural stability, thermal stability and bonding performance are improved.
Preferably, the down-conversion material is a fluorosilane polymer modified rare earth doped down-conversion material.
More preferably, the down-conversion material is Ca 2 V 2 O 7 :7％Yb 3+ 、SrMoO 4 :10％Yb 3+ 、YVO 4 :1％Tm 3+ 、CYP:15％Ce 3+ One or more of them.
The down-conversion material can adjust the absorption spectrum of the solar cell and improve the light collection and conversion efficiency of the cell. The down-conversion material is also called Stokes effect, and is characterized by that after absorbing a high-energy photon (UV light), it can spontaneously produceTwo or more low energy photons (visible light) are emitted, i.e. high energy short wave radiation is absorbed, and low energy long wave radiation is emitted. The down-conversion can transfer short wave photons (ultraviolet or blue) to a long wave photon region where the solar cell spectral response is more sensitive. Tm (Tm) 3+ 、Yb 3 + 、Ce 3+ The plasma has charge transfer absorption band in ultraviolet region, is easy to be excited by ultraviolet light, and the emission line is mainly located in visible region, often used as down-conversion activator. The rare earth doped down-conversion material modified by the fluorosilane polymer is added, and the preferable down-conversion material has strong absorption in the wave band of 200-500nm, and can convert ultraviolet light irradiated to the inner layer of the backboard into visible light or near infrared light and other light which can be absorbed by the solar cell. The damage of ultraviolet light to the backboard is effectively avoided, and meanwhile, the light collection and conversion efficiency of the battery can be improved. In addition, the fluorosilane polymer modified down-conversion material has more excellent ageing resistance and formula system compatibility.
Preferably, the curing agent is an HDI type polyisocyanate.
More preferably, the curing agent is selected from one or more of HDI biuret polyisocyanate, HDI trimer, HDI-TDI mixed polymer and HDI-TMP adduct.
More preferably, the curing agent is an HDI trimeric polyisocyanate curing agent.
FEVE coating curing agents are selected by taking into consideration the reactivity with the host resin, the blocking resistance after initial curing of the coating, the weather resistance, and the like. Selected from the group consisting of HDI-based polyisocyanate-based curing agents, most preferably trimeric-based HDI-based curing agents. The HDI trimer has excellent ultraviolet resistance, higher reaction activity and high hardness of a coating; the blocked HDI trimer has excellent damp-heat resistance, can not be completely unblocked in a short time at high temperature, and the blocked isocyanate slowly unblocks in a long-time damp-heat aging process to release-NCO groups which are decomposed and broken with-OH or-NH generated by macromolecular chain segments in the coating 2 The segments are crosslinked, so that the crosslinking degree of the coating after humid heat aging is ensured, and the effective winding of the resin molecular chain and the EVA molecular chain in the coating is ensured. HDI curing agent multi-collocation reaction catalystThe catalyst can accelerate the reaction of-NCO and-OH to a certain extent, and improve the anti-blocking performance of the coating.
Preferably, the extinction powder is SiO 2 The particle size distribution of the extinction powder is 9-11 μm.
SiO addition 2 After that, when the light irradiates the surface of the paint, due to SiO 2 The particles are larger than half of the wavelength of visible light, and the surface of the coating has certain roughness, so that the scattering and refracting effects on incident light are enhanced, the transmitted light is reduced, and the light transmittance of the coating is reduced. Along with SiO 2 The addition amount is increased, and the light transmittance influence of the coating is reduced. As the particle size of the inorganic particles increases, the coating effect of the resin on the inorganic particles is poor; the haze increase was not significant with increasing amounts of particles. When the amount is increased to 1 to 5wt%, the blocking resistance of the coating layer can also be achieved.
Preferably, the solvent is selected from at least one of aromatic hydrocarbon, ketone and ester.
More preferably, the solvent is selected from one or more of dimethyl carbonate, propylene glycol methyl ether acetate, isobutyl ester, n-butanol and ethanol.
Preferably, the light stabilizer comprises one or a combination of a plurality of benzotriazole light stabilizers, hindered amine light stabilizers, benzophenone light stabilizers and organic nickel salt light stabilizers.
Preferably, the back sheet inner layer coating composition further comprises at least one of a leveling agent and a dispersing agent.
The invention also relates to application of the back plate inner layer coating composition in preparation of a solar cell back plate.
The beneficial effects of the invention are as follows:
(1) The invention adds the fluorosilane polymer modified rare earth doped down-conversion material to replace the traditional ultraviolet absorbent, the selected down-conversion material has strong absorption in the wave band of 200-500nm, can convert ultraviolet light irradiated to the inner layer of the backboard into visible light or near infrared light and other light which can be absorbed by the solar cell, effectively avoids the damage of the ultraviolet light to the backboard, and can also improve the light collection and conversion efficiency of the cell. In addition, the fluorosilane polymer modified down-conversion material has more excellent ageing resistance and formula system compatibility.
(2) The invention adopts polysiloxane-imide segmented copolymer material as tackifying resin, and the copolymer has excellent heat stability, irradiation resistance, good mechanical strength and softness. The incorporation of the silicone segment in the polyimide backbone results in increased free volume, flexibility and adhesion of the copolymer. The back plate bonding layer can effectively bear mechanical stress and adapt to volume expansion, structural stability, thermal stability and bonding performance are improved, and the back plate bonding layer has more excellent comprehensive performance than a back plate added with polyacrylate tackifying resin.
Drawings
Fig. 1 is a schematic structural diagram of a transparent back sheet for a solar cell according to the present invention.
Reference numerals illustrate: 1-weather-resistant layer, 2-glue layer, 3-support substrate, 4-water oxygen barrier layer, 5-weather-resistant bonding layer.
Detailed Description
The invention will be further described with reference to specific embodiments, and advantages and features of the invention will become apparent from the description. These examples are merely exemplary and do not limit the scope of the invention in any way. It will be understood by those skilled in the art that various changes and substitutions of details and forms of the technical solution of the present invention may be made without departing from the spirit and scope of the present invention, but these changes and substitutions fall within the scope of the present invention.
Example 1
The back plate inner layer coating composition comprises the following components in parts by weight:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 50KOH/g, solids content 50%) 40%
Solvent: propylene glycol methyl ether acetate 40%
Curing agent: trimer type HDI
(Desmodur N 3300) 1％
Tackifying resin: polysiloxane-imide block copolymers
(mw=10,000, polysiloxane content 30 wt%) 16%
Down-conversion material Ca 2 V 2 O 7 ：7％Yb 3+ 0.5％
Extinction powder SiO 2 (particle diameter 9 μm) 2%
Light stabilizer hindered amine light stabilizer
(light stabilizer 622 of Shanghai Fender chemical industry) 0.5%
Drying at 150 deg.c and curing at 60 deg.c for 72 hr to obtain weather resistant adhesive layer of thickness 8 microns.
Example 2
The back plate inner layer coating composition comprises the following components in parts by weight:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 55KOH/g, solids content 55%) 43%
Solvent: dimethyl carbonate 30%
Curing agent: trimer type HDI
(Tosoh HXR 90B) 2%
Tackifying resin: polysiloxane-imide block copolymers
(mw=20,000, polysiloxane content 40 wt%) 20%
Down-conversion material SrMoO 4 :10％Yb 3+ 1％
Extinction powder SiO 2 (particle size 10 μm) 3%
Light stabilizer benzotriazole light stabilizer
(Tiangang auxiliary light stabilizer 788) 1%
Drying at 150 deg.c and curing at 60 deg.c for 72 hr to obtain weather resistant adhesive layer of 9 micron thickness.
Example 3
The back plate inner layer coating composition comprises the following components in parts by weight:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 60KOH/g, solids 60%) 50%
Solvent: propylene glycol methyl ether acetate 27%
Curing agent: trimer type HDI
(Desmodur N 3390) 3％
Tackifying resin: polysiloxane-imide block copolymers
(mw=35,000, polysiloxane content 35 wt%) 13%
Down-conversion material YVO 4 :1％Tm 3+ 4％
Extinction powder SiO 2 (particle size 11 μm) 1%
Light stabilizer benzophenone light stabilizer
(2, 2' -dihydroxy-4-methoxybenzophenone) 2%
Drying at 150 deg.c and curing at 60 deg.c for 72 hr to obtain weather resistant adhesive layer of thickness 10 microns.
Example 4
The back plate inner layer coating composition comprises the following components in parts by weight:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 60KOH/g, solids content 50%) 56%
Solvent: propylene glycol methyl ether acetate/dimethyl carbonate=1/1 (V/V) 20%
Curing agent: trimer type HDI
(Desmodur N 3300) 1％
Tackifying resin: polysiloxane-imide block copolymers
(mw=50,000, polysiloxane content 40 wt%) 14%
Down-conversion material CYP 15% Ce 3+ 3％
Extinction powder SiO 2 (particle size 10 μm) 1%
Light stabilizer benzotriazole and hindered amine compound light stabilizer
(Tiangang auxiliary light stabilizer HS 3310) 5%
Drying at 150 deg.c and curing at 60 deg.c for 72 hr to obtain weather resisting adhesive layer of 11 micron thickness.
Example 5
The back plate inner layer coating composition comprises the following components in parts by weight:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value: 55KOH/g, solids content: 50%) 42%
Solvent: propylene glycol methyl ether acetate 30%
Curing agent: trimer type HDI
(Desmodur N 3300) 5％
Tackifying resin: polysiloxane-imide block copolymers
(mw=80,000, polysiloxane content 50 wt%) 10%
Down-conversion material Ca 2 V 2 O 7 ：7％Yb 3+ 5％
Extinction powder SiO 2 (particle diameter 9 μm) 5%
Light stabilizer hindered amine light stabilizer
(light stabilizer 783) 3% of Shanghai Fender chemical industry
Drying at 150 deg.c and curing at 60 deg.c for 72 hr to obtain weather resistant adhesive layer of thickness 12 microns.
Example 6
The back plate inner layer coating composition comprises the following components in parts by weight:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 50KOH/g, solids content 60%) 60%
Solvent: propylene glycol methyl ether acetate 20%
Curing agent: trimer type HDI
(Tosoh HXR 90B) 1%
Tackifying resin: polysiloxane-imide block copolymers
(mw=100,000, polysiloxane content 30 wt%) 15%
Down-conversion material Ca 2 V 2 O 7 ：7％Yb 3+ 1.5％
Extinction powder SiO 2 (particle size 10 μm) 2%
Light stabilizer hindered amine light stabilizer
(Tiangang auxiliary agent light stabilizer HS-508) 0.5%
Drying at 150 deg.c and curing at 60 deg.c for 72 hr to obtain weather resistant adhesive layer of thickness 8 microns.
Comparative example 1
The only difference compared to example 1 is that the down-converting material is replaced by an ultraviolet absorber, in particular as follows:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 50KOH/g, solids content 50%) 40%
Solvent: propylene glycol methyl ether acetate 40%
Curing agent: trimer type HDI
(Desmodur N 3300) 1％
Tackifying resin: polysiloxane-imide block copolymers
(mw=10,000, polysiloxane content 30 wt%) 16%
Ultraviolet absorber: 2-hydroxy-4-methoxybenzophenone 0.5%
Extinction powder SiO 2 (particle diameter 9 μm) 2%
Light stabilizer hindered amine light stabilizer
(Shanghai Feng Rui chemical light stabilizer 622) 0.5%.
Comparative example 2
The only difference compared to example 1 is the tackifying resin, which is specifically as follows:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 50KOH/g, solids content 50%) 40%
Solvent: propylene glycol methyl ether acetate 40%
Curing agent: trimer type HDI
(Desmodur N 3300) 1％
Tackifying resin: polyacrylic resin 16%
Down-conversion material Ca 2 V 2 O 7 ：7％Yb 3+ 0.5％
Extinction powder SiO 2 (particle diameter 9 μm) 2%
Light stabilizer hindered amine light stabilizer
(Shanghai Feng Rui chemical light stabilizer 622) 0.5%.
Comparative example 3
The only difference compared to example 1 is the tackifying resin and the down-conversion material, which are specifically as follows:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 50KOH/g, solids content 50%) 40%
Solvent: propylene glycol methyl ether acetate 40%
Curing agent: trimer type HDI
(Desmodur N 3300) 1％
Tackifying resin: polyacrylic resin 16%
Ultraviolet absorber: 2-hydroxy-4-methoxybenzophenone 0.5%
Extinction powder SiO 2 (particle diameter 9 μm) 2%
(Shanghai Feng Rui chemical light stabilizer 622) 0.5%.
Comparative example 4
The back plate inner layer coating composition comprises the following components in parts by weight:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 50KOH/g, solids content 50%) 40%
Solvent: propylene glycol methyl ether acetate 40%
Curing agent: trimer type HDI
(Desmodur N 3300) 1％
Tackifying resin: polysiloxane-imide block copolymers
(mw=300,000, polysiloxane content 70 wt%) 16%
Down-conversion material Ca 2 V 2 O 7 ：7％Yb 3+ 0.5％
Extinction powder SiO 2 (particle diameter 9 μm) 2%
Light stabilizer hindered amine light stabilizer
(Shanghai Feng Rui chemical light stabilizer 622) 0.5%.
The preparation process is the same as in example 1.
Comparative example 5
The back plate inner layer coating composition comprises the following components in parts by weight:
FEVE fluorocarbon resin: chlorotrifluoroethylene vinyl ether
(hydroxyl value 50KOH/g, solids content 50%) 40%
Solvent: propylene glycol methyl ether acetate 40%
Curing agent: trimer type HDI
(Desmodur N 3300) 1％
Tackifying resin: polysiloxane-imide block copolymers
(mw=8,000, polysiloxane content 20 wt%) 16%
Down-conversion material Ca 2 V 2 O 7 ：7％Yb 3+ 0.5％
Extinction powder SiO 2 (particle diameter 9 μm) 2%
Light stabilizer hindered amine light stabilizer
(Shanghai Feng Rui chemical light stabilizer 622) 0.5%.
The preparation process is the same as in example 1.
Application example
The transparent backboard of the solar cell is shown in fig. 1, and comprises a weather-resistant layer 1, a glue layer 2, a supporting substrate 3, a water-oxygen barrier layer 4 and a weather-resistant bonding layer 5 from bottom to top in sequence, and the preparation process is as follows:
first, preparing a water-oxygen barrier layer:
oxygen plasma treatment is carried out on the inner surface of the 200 mu m supporting substrate PET, and then SiN is deposited by adopting PECVD equipment x An inorganic barrier layer made of SiH 4 And NH 3 As raw material SiH 4 /NH 3 ＝0.6，N 2 Flow rate 5ml/min, pressure 53.329Pa, RF frequency 160Khz, power 240W, siN x The layer thickness is 250nm; then micro-gravure coating an organic barrier layer of organosilicon modified polyacrylate (silicone acrylic emulsion, baolijia chemical BLJ-KD 96) with the thickness of 2 μm after drying, and completing the preparation of the water-oxygen barrier layer.
And secondly, coating the inner layer coating of the backboard on the surface of the water-oxygen barrier layer to obtain a weather-resistant bonding layer, wherein the coating liquid formula and the process refer to the coating formula and the process of any inner layer coating of the backboard in examples 1-6 or comparative examples 1-5, and the transparent backboard semi-finished product XPC is obtained.
Thirdly, carrying out corona treatment on the outer surface of the XPC sample wafer supporting substrate, and then coating a two-component polyurethane adhesive to obtain a glue layer, wherein the two-component polyurethane adhesive takes polyester polyol (Korsche Desmophen 670) as a main agent and a trimer of diisocyanate (Korsche curing agent N3390) as a curing agent, the ratio of the main agent to the curing agent is 40:1, and the glue coating amount is 8g/m 2 And (3) compositing a PVDF film with the thickness of 25 mu m on the surface to obtain a weather-resistant layer, and drying and curing at 55 ℃ for 4 days to finish the preparation of the TPC solar cell transparent backboard.
Testing
The solar cell transparent back sheet and the weather-resistant adhesive layer prepared by the preparation method of the application examples in examples 1 to 6 and comparative examples 1 to 5 were subjected to measurement of light transmittance in the 400-1100nm band.
Attaching a weather-resistant bonding layer surface of a solar cell transparent backboard to an EVA packaging adhesive film, vacuumizing for 10min at 150 ℃, and hot-pressing for 10min to bond the weather-resistant bonding layer surface and the EVA packaging adhesive film, and testing the bonding force between the weather-resistant bonding layer and the EVA packaging adhesive film; PCT (test conditions 121 ℃,2atm,100% humidity) was aged for 24 hours, and the adhesion was measured again; adhesion rating was again determined after PCT aging for 48 hours.
And (3) irradiating the transparent backboard of the solar cell with 300kWh ultraviolet light, and measuring yellowing delta b of the weather-resistant adhesive layer near the EVA side before and after ultraviolet light irradiation.
The test criteria/methods for the above performance are as follows:
transmittance: measuring with ultraviolet spectrophotometer;
Δb: the measurement is carried out according to the methods of GB/T3979-2008 and GB/T7921-2008;
adhesive force: the measurement is carried out according to the cross-cut test method of GB/T928-1998 colored paint and varnish film;
adhesion rating:
level 0: the cutting edge is completely smooth, and no lattice falls off;
stage 1: there is little coating shedding at the kerf intersections, but the cross-cut area cannot be affected by more than 5%.
2 stages: at the intersection of the cuts and/or along the edges of the cuts, the coating falls off, the affected cross-cut area being significantly greater than 5%, but not significantly greater than 15%.
3 stages: the cross-cut area at which the coating falls off in large fragments along part or all of the cut edge and/or is affected by partial or total flaking at different locations of the lattice is significantly greater than 15%, but not significantly greater than 35%.
The results of the above performance tests are shown in table 1 below:
table 1 comparison of test data for examples and comparative examples
As can be seen from the performance data of Table 1, the weather-resistant bonding layer formed by curing the weather-resistant bonding layer coating liquid provided by the invention has higher light transmittance, bonding performance and aging resistance. As can be seen from examples 1-6 and comparative examples 1-5, the weather-resistant adhesive layer and EVA adhesive film of the present invention show excellent initial adhesion under the synergistic effect of the tackifying resin and the surface-modified down-conversion material, and the adhesion and adhesion are superior to those of the comparative examples after PCT-24hr and 48hr aging. Meanwhile, after the down-conversion material replaces the traditional ultraviolet absorbing material, the light transmittance of the backboard and the weather-proof bonding layer is improved, and the yellowing value is reduced after aging.
The foregoing detailed description is directed to one of the possible embodiments of the present invention, which is not intended to limit the scope of the invention, but is to be accorded the full scope of all such equivalents and modifications so as not to depart from the scope of the invention.
Claims (4)
1. The back plate inner layer coating composition is characterized by comprising the following components in percentage by weight:
the FEVE fluorocarbon resin is at least one of trifluorochloroethylene vinyl ether and trifluorochloroethylene vinyl ester; the hydroxyl value of the FEVE fluorocarbon resin is 50-60mgKOH/g, and the solid content is 50-60%;
the tackifying resin is polysiloxane-imide segmented copolymer, and the polysiloxane-imide segmented copolymer M w The molecular weight is 10, 000-100, 000, and the mass fraction of polysiloxane in the copolymer is 30-50wt%;
the down-conversion material is Ca 2 V 2 O 7 :7％Yb 3+ 、SrMoO 4 :10％Yb 3+ 、YVO 4 :1％Tm 3+ 、CYP:15％Ce 3+ One or more of them.
2. The back sheet inner layer coating composition according to claim 1, wherein the curing agent is an HDI-type polyisocyanate selected from one or more of HDI biuret polyisocyanate, HDI trimer, HDI-TDI mixed polymer, HDI-TMP adduct.
3. The back sheet inner layer coating composition according to claim 1, wherein the matting agent is SiO 2 Particles, wherein the particle size distribution of the extinction powder is 9-11 mu m; the solvent is one or more selected from dimethyl carbonate, propylene glycol methyl ether acetate, isobutyl ester, n-butyl alcohol and ethanol; the light stabilizer comprises one or a combination of a plurality of benzotriazole light stabilizer, hindered amine light stabilizer, benzophenone light stabilizer and organic nickel salt light stabilizer.
4. Use of the backsheet inner layer coating composition of any one of claims 1-3 for the preparation of a solar cell backsheet.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101641395A (en) * | 2007-03-28 | 2010-02-03 | 沙伯基础创新塑料知识产权有限公司 | Cross linked polysiloxane/polyimide copolymers, methods of making, blends thereof, and articles derived therefrom |
| CN111690335A (en) * | 2020-04-29 | 2020-09-22 | 乐凯胶片股份有限公司 | Transparent back plate for packaging solar cell |
| CN115274897A (en) * | 2022-07-18 | 2022-11-01 | 江苏中来新材科技有限公司 | High-reflection light conversion photovoltaic backboard and double-sided photovoltaic assembly |
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2023
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101641395A (en) * | 2007-03-28 | 2010-02-03 | 沙伯基础创新塑料知识产权有限公司 | Cross linked polysiloxane/polyimide copolymers, methods of making, blends thereof, and articles derived therefrom |
| CN111690335A (en) * | 2020-04-29 | 2020-09-22 | 乐凯胶片股份有限公司 | Transparent back plate for packaging solar cell |
| CN115274897A (en) * | 2022-07-18 | 2022-11-01 | 江苏中来新材科技有限公司 | High-reflection light conversion photovoltaic backboard and double-sided photovoltaic assembly |
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