CN116321804A - Method for manufacturing slot wall wiring of printed circuit board and printed circuit board - Google Patents
Method for manufacturing slot wall wiring of printed circuit board and printed circuit board Download PDFInfo
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- CN116321804A CN116321804A CN202310291642.0A CN202310291642A CN116321804A CN 116321804 A CN116321804 A CN 116321804A CN 202310291642 A CN202310291642 A CN 202310291642A CN 116321804 A CN116321804 A CN 116321804A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 78
- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims description 82
- 229920005989 resin Polymers 0.000 claims description 82
- 238000005530 etching Methods 0.000 claims description 20
- 238000005260 corrosion Methods 0.000 claims description 10
- 230000007797 corrosion Effects 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 69
- 229920001187 thermosetting polymer Polymers 0.000 description 15
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a method for manufacturing slot wall wiring of a printed circuit board and the printed circuit board, and relates to the technical field of printed circuit board manufacturing, wherein the method comprises the following steps: providing a core plate with surface metal layers on the upper surface and the lower surface; manufacturing slotted holes communicated with the upper surface and the lower surface of the core plate at preset positions on the surface of the core plate; manufacturing a first conductive circuit on the side wall of the slot hole, manufacturing a second conductive circuit on the surface of the surface metal layer, wherein the first conductive circuit is connected with the second conductive circuit, and the line width of the first conductive circuit is equal to that of the second conductive circuit; respectively performing solder resist and coating treatment on the upper and lower surfaces of the core plate to obtain a printed circuit board; the signal in the circuit board can be transmitted through the conductive lines in the slotted holes on different layers, and the impedance of the conductive lines in the slotted holes is the same as the impedance of the conductive lines in other layers, so that the reflection and attenuation of the signal through holes are reduced, and the transmission quality of the signal is improved.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a slot wall wiring manufacturing method of a printed circuit board and the printed circuit board.
Background
Along with the development of technology, people have higher and higher signal transmission requirements in a printed circuit board (Printed Circuit Board, PCB), and along with the development of the printed circuit board towards high frequency, high speed and high density, when signals are transmitted between different layers of the PCB, signal holes are formed between different layers, so that the signals are transmitted through metal layers or metal columns of the signal holes, however, when the high-speed signals are transmitted through the signal holes in the Z direction, the signals are reflected and attenuated due to the fact that the impedance of the signal holes is not matched with the impedance of a circuit in an XY plane, and the transmission quality of the signals is affected.
Disclosure of Invention
Based on the above, it is necessary to provide a method for manufacturing slot wall routing of a printed circuit board and a printed circuit board, so as to solve the problems in the prior art that when a high-speed signal in the printed circuit board is transmitted through a signal hole in the Z direction, the impedance of the signal hole is not matched with the impedance of a circuit in the XY plane, so that the signal is reflected and attenuated, and the transmission quality of the signal is affected.
In a first aspect, the present invention provides a method for manufacturing a slot wall trace of a printed circuit board, including:
providing a core plate with surface metal layers on the upper surface and the lower surface;
manufacturing slotted holes communicated with the upper surface and the lower surface of the core plate at preset positions on the surface of the core plate;
manufacturing a first conductive circuit on the side wall of the slot hole, manufacturing a second conductive circuit on the surface of the surface metal layer, wherein the first conductive circuit is connected with the second conductive circuit, and the line width of the first conductive circuit is equal to that of the second conductive circuit;
and respectively performing solder resist and coating treatment on the upper and lower surfaces of the core plate to obtain the printed circuit board.
The scheme has the following beneficial effects:
according to the method for manufacturing the slot wall wiring of the printed circuit board, the slot is manufactured at the preset position on the core board, the conductive circuit is manufactured on the side wall of the slot, so that the line width of the conductive circuit on the inner wall of the slot is equal to that of the conductive circuit connected with the conductive circuit.
Optionally, fabricating a first conductive line on a sidewall of the slot hole includes:
electroplating metal on the side wall of the slot to form a surface metal layer connecting the upper surface and the lower surface of the core plate;
filling a corrosion-resistant resin in the slot hole, and etching away part of the corrosion-resistant resin to make the line width and the line distance of the remained corrosion-resistant resin equal to those of the second conductive circuit to be manufactured;
and etching the slotted hole metal layer uncovered by the reserved resist resin, and removing the reserved resist resin to form the first conductive circuit.
Optionally, the etching away part of the resist resin includes:
and etching the depth of one half of the anti-corrosion resin at the first end face of the slot hole and the depth of the other half of the anti-corrosion resin at the second end face of the slot hole by adopting a laser etching mode.
Optionally, after filling the slot with the resist, the method includes:
and grinding the resist resin overflowed from the slot opening of the slot by a mechanical grinding mode.
Optionally, the manufacturing a first conductive circuit on a sidewall of the slot hole, and manufacturing a second conductive circuit on a surface of the surface metal layer includes:
electroplating metal on the side wall of the slot to form a surface metal layer connecting the upper surface and the lower surface of the core plate;
filling a slot hole with a resist resin, printing the resist resin on the surface of the surface metal layer of the core plate, and baking the resist resin in the slot hole and on the surface of the surface metal layer;
and exposing, developing and etching the resist resin in the slotted hole and on the surface of the surface metal layer to remove the resist resin, forming the first conductive circuit on the side wall of the slotted hole, and forming the second conductive circuit on the surface metal layer.
Optionally, a resist resin is printed on the surface of the surface metal layer of the core plate by a silk screen printing mode.
Optionally, exposing the resist resin in the slot and on the surface of the surface metal layer, including:
and exposing the resist resin on the surface of the surface metal layer by an exposure machine for one time, and exposing the two end faces of the resist resin in the slot hole for two times respectively.
Optionally, through a mechanical drilling mode, slots with preset lengths and widths are drilled at preset positions on the surface of the core plate, so that two opposite surfaces of the slots are in a planar structure.
In a second aspect, the present invention provides a printed circuit board comprising:
the core plate is provided with a slotted hole communicated with the upper surface and the lower surface of the core plate at a preset position on the surface of the core plate;
a first conductive circuit is arranged on the side wall of the slot hole, a second conductive circuit connected with the first conductive circuit is arranged on the upper surface and the lower surface of the core plate, and the line width of the first conductive circuit is equal to that of the second conductive circuit;
and the upper surface and the lower surface of the core plate are provided with solder masks.
The scheme has the following beneficial effects:
according to the printed circuit board, the slotted holes are arranged at the preset positions on the core plate, the conductive circuits are arranged on the side walls of the slotted holes, the line width of the conductive circuits on the inner walls of the slotted holes is equal to that of the conductive circuits connected with the slotted holes, through the design structure, signals in the circuit board can be transmitted through the conductive circuits in the slotted holes on different layers, the impedance of the conductive circuits in the slotted holes is the same as that of the conductive circuits in other layers, and therefore reflection and attenuation of signal through holes are reduced, and the transmission quality of signals is improved.
Optionally, the slot hole is in a rectangular structure with two elliptical ends, the slot hole comprises a planar side wall and an arc side wall, and the first conductive circuit is arranged on the planar side wall of the slot hole.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of a method for manufacturing slot wall traces of a printed circuit board according to an embodiment of the invention;
FIG. 2 (a) is a schematic illustration of a core plate with slots drilled therein according to one embodiment of the present invention;
FIG. 2 (b) is a schematic diagram of a metal layer formed on the inner wall of a slot according to an embodiment of the present invention;
FIG. 2 (c) is a schematic view of a method for filling a slot with a resist resin according to an embodiment of the present invention;
FIG. 2 (d) is a schematic illustration of an etch resist resin according to an embodiment of the present invention;
FIG. 2 (e) is a schematic diagram of a conductive trace formed in a slot according to one embodiment of the present invention;
FIG. 2 (f) is a schematic diagram of a solder mask layer formed on a surface of a core board according to an embodiment of the present invention;
FIG. 3 (a) is a schematic view of another embodiment of the present invention for filling a slot with a resist resin;
FIG. 3 (b) is a schematic view of another etch resist resin provided in an embodiment of the present invention;
FIG. 4 is a schematic diagram of a printed circuit board according to an embodiment of the present invention;
the symbols are as follows:
100. a core plate; 110. a first surface metal layer; 120. a second surface metal layer; 130. a slot hole; 131. a slot metal layer; 132. a thermosetting resist resin; 133. a first circuit pattern; 134. a first conductive line; 135. a photosensitive resist resin; 136. a second circuit pattern; 140. a second conductive line; 200. and (5) a solder mask layer.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the invention more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments.
It is to be understood that the embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.
It will be further understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.
It will be further understood that the terms "upper," "lower," "left," "right," "front," "rear," "bottom," "middle," "top," and the like may be used herein to describe various elements and that the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings merely to facilitate describing the invention and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operate in a particular orientation, and that these elements should not be limited by these terms.
These terms are only used to distinguish one element from another element. For example, a first element could be termed a "upper" element, and, similarly, a second element could be termed a "upper" element, depending on the relative orientation of the elements, without departing from the scope of the present disclosure.
It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In one embodiment, a method for manufacturing a printed circuit board with hole wall traces as shown in fig. 1 is provided, and the method may include the following steps:
step S100: a core board having surface metal layers on both upper and lower surfaces is provided.
Referring to fig. 2 (a), a core plate 100 is provided, wherein a lower surface of the core plate 100 has a first surface metal layer 110, and an upper surface of the core plate 100 has a second surface metal layer 120; the core board 100 may have no conductive circuit inside, i.e., the core board 100 is a double-sided circuit board structure, the core board 100 may have a plurality of conductive circuit layers inside, and the core board 100 is a multi-layer circuit board structure.
Step S200: and manufacturing slotted holes communicated with the upper surface and the lower surface of the core plate at preset positions on the surface of the core plate.
Referring to fig. 2 (a), a slot 130 is drilled at a preset position of the first surface metal layer 110 or a preset position of the second surface metal layer 120 on the lower surface of the core plate 100 by means of mechanical drilling, a drill bit with a preset diameter may be selected when the slot 130 is drilled, a circular hole is drilled in the core plate, and then the drill bit is moved left and right by a preset distance with reference to the circular hole, forming a rectangular structure with two ends of an ellipse, such that the slot 130 includes a planar sidewall and a circular arc sidewall, and the slot 130 connects the upper and lower surfaces of the core plate 100.
Step S300: and manufacturing a first conductive circuit on the side wall of the slot hole, manufacturing a second conductive circuit on the surface of the surface metal layer, wherein the first conductive circuit is connected with the second conductive circuit, and the line width of the first conductive circuit is equal to that of the second conductive circuit.
In this embodiment, two methods for manufacturing a first conductive trace in a slot and a second conductive trace on an upper surface and a lower surface of a core board are provided, where the first manufacturing method may include the following steps:
step S301: electroplating metal on the side wall of the slot to form a surface metal layer connecting the upper and lower surfaces of the core plate.
Referring to fig. 2 (b), after the slot 130 is fabricated in step S200, copper deposition is performed on the sidewall of the slot 130 to form a slot metal layer 131, where the slot metal layer 131 may be made of copper, and the thickness of the slot metal layer is the same as that of the conductive line to be connected, or may be set according to actual design requirements.
In the present embodiment, if the core 100 is a dual-layer circuit board structure, the slot metal layer 131 connects the first surface metal layer 110 on the lower surface of the core 100 and the second surface metal layer 120 on the upper surface; if the core 100 is also provided with conductive traces, the slot metal layer 131 connects the first surface metal layer 110 on the lower surface of the core 100, the second surface metal layer 120 on the upper surface, and the conductive traces inside the core 100.
Step S302: and filling the slot hole with a resist resin, and etching away part of the resist resin to make the line width and the line distance of the remained resist resin equal to those of the second conductive line to be manufactured.
Referring to fig. 2 (c), a thermosetting resist resin 132 is filled on the surface of the slot metal layer 131 on the side wall of the slot 130 such that the filled thermosetting resist resin 132 fills the slot 130.
When the slot 130 is filled with the thermosetting resist resin 132, in order to ensure that the slot 130 can be filled with the thermosetting resist resin 132, the thermosetting resist resin overflows from the slot opening of the slot 130, and the overflowed thermosetting resist resin needs to be ground away by mechanical grinding, so that the thermosetting resist resin is prevented from remaining on the first surface metal layer 110 and the second surface metal layer 120 on the upper surface of the core 100, and the subsequent production of the second conductive lines on the first surface metal layer 110 and the second surface metal layer 120 is prevented.
According to the line width and the line distance of the first conductive line to be manufactured in the slot 130, a UV laser etching method is adopted to etch away part of the thermosetting resist resin 132 in the slot 130, so that the remaining thermosetting resist resin forms a first line pattern 133 as shown in fig. 2 (d), and the line width and the line distance of the line in the first line pattern 133 are equal to the line width and the line distance of the second conductive line on the upper and lower surfaces of the core board 100 to be manufactured, so that the impedance of the first conductive line and the impedance of the second conductive line in the slot 130 are the same.
When the thermosetting resist resin in the slot 130 is etched, the etching can be performed twice, firstly, one end face of the slot 130 is etched to half the depth of the thermosetting resist resin in the slot 130, and then the other end face is etched to half the depth, so that the etching of the thermosetting resist resin in the slot 130 is completed; the etching mode can make the thicker thermosetting resist resin simpler in etching.
Step S303: and etching the slotted hole metal layer uncovered by the reserved resist resin, and removing the reserved resist resin to form the first conductive circuit.
Referring to fig. 2 (d), the slot metal layer covered by the first circuit pattern 133 is a portion to be reserved, the slot metal layer uncovered by the first circuit pattern 133 is etched, and the thermosetting resin on the circuit is removed by using an alkaline stripping solution, so as to manufacture the first conductive circuit 134 as shown in fig. 2 (e).
After the first conductive traces 134 in the slots 130 are formed, dry films for forming second conductive traces are attached to the upper and lower surfaces of the core board 100, and then exposure, development, etching, and removal of the dry films are performed to obtain a second trace pattern 140 as shown in fig. 2 (f).
In this embodiment, the second method for manufacturing the first conductive trace in the slot and the second conductive trace on the upper and lower surfaces of the core board may include the following steps:
step S3001: electroplating metal on the side wall of the slot to form a surface metal layer connecting the upper and lower surfaces of the core plate.
The method in step S3001 is the same as that in step S301, and will not be described here.
Step S3002: and filling the slot with a resist resin, printing the resist resin on the surface of the metal layer on the surface of the core plate, and baking the resist resin in the slot and on the surface of the metal layer on the surface.
Referring to fig. 3 (a), the photosensitive resist 135 is filled on the surface of the slot metal layer 131 on the slot sidewall such that the filled photosensitive resist 135 fills the slot; then, printing photosensitive resist resin on the first surface metal layer on the lower surface of the core plate and the second surface metal layer on the upper surface of the core plate in a silk screen printing mode, and baking the resist resin in the slot holes and on the surfaces of the surface metal layers to remove the solvent in the photosensitive resin.
Step S3003: exposing, developing and etching the resist resin in the slot and on the surface of the surface metal layer to remove the resist resin, forming a first conductive circuit on the side wall of the slot, and forming a second conductive circuit on the surface metal layer.
The LDI exposure machine is adopted to expose the photosensitive resist resin on the first surface metal layer on the lower surface of the core plate, the photosensitive resist resin on the second surface metal layer on the upper surface of the core plate and the photosensitive resist resin in the slot hole respectively, and the photosensitive resist resin on the first surface metal layer on the lower surface of the core plate and the photosensitive resist resin on the second surface metal layer on the upper surface of the core plate can be exposed once because of thinner thickness, and the photosensitive resist resin in the slot hole is thicker, and the two end faces of the resist resin in the slot hole can be exposed twice respectively, so that the photosensitive resist resin in the slot hole is fully exposed.
Developing the exposed photosensitive resist resin to obtain a second circuit pattern 136 shown in fig. 3 (b), etching the area covered by the second circuit pattern 136, reserving a slotted hole metal layer covered by the second circuit pattern 136, and removing the photosensitive resist resin in the slotted hole to obtain a first conductive circuit; and the exposed photosensitive resist resin on the upper and lower surfaces of the core plate is subjected to the operations of developing, etching, removing the photosensitive resist resin and the like to obtain a second conductive circuit.
Step S400: and respectively performing solder resist and coating treatment on the upper and lower surfaces of the core plate to obtain the printed circuit board.
Referring to fig. 2 (f), after the first conductive trace 134 and the second conductive trace 140 are manufactured, the upper and lower surfaces of the core board are subjected to a solder resist and a coating process to form a solder resist layer 200, thereby obtaining a manufactured printed circuit board.
According to the method for manufacturing the slot wall wiring of the printed circuit board, the slot is manufactured at the preset position on the core board, the conductive line is manufactured on the side wall of the slot, so that the line width of the conductive line on the inner wall of the slot is equal to that of the conductive line connected with the conductive line.
In one embodiment, a printed circuit board as shown in fig. 4 is provided, the printed circuit board comprising: the core plate 100, wherein, the preset position of the surface of the core plate 100 is provided with a slot 130 communicating the upper and lower surfaces of the core plate 100; the side wall of the slot 130 is provided with a first conductive line 134, the upper and lower surfaces of the core plate 100 are provided with a second conductive line 140 connected with the first conductive line 134, and the line width of the first conductive line 134 is equal to that of the second conductive line 140; the upper and lower surfaces of the core board 100 are provided with solder resists 200.
Further, the core 100 is provided with a plurality of layers of internal conductive traces connected to the first conductive traces 134 therein to form a multi-layer circuit board structure.
Further, the slot 130 has a rectangular structure with two oval ends, the slot 130 includes a planar sidewall and an arc sidewall, and the first conductive trace 134 is disposed on the planar sidewall of the slot 130.
Further, the first conductive line 134 and the second conductive line 140 have equal line pitches, and the material of the first conductive line 134 and the second conductive line 140 is copper.
According to the printed circuit board, the slots are arranged at the preset positions on the core board, the conductive lines are arranged on the side walls of the slots, the line widths of the conductive lines on the inner walls of the slots are equal to those of the conductive lines connected with the slots, through the design structure, signals in the circuit board can be transmitted through the conductive lines in the slots on different layers, the impedance of the conductive lines in the slots is the same as that of the conductive lines in other layers, and therefore signal via hole reflection and attenuation are reduced, and the transmission quality of the signals is improved.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (10)
1. A method for manufacturing slot wall wiring of a printed circuit board is characterized by comprising the following steps:
providing a core plate with surface metal layers on the upper surface and the lower surface;
manufacturing slotted holes communicated with the upper surface and the lower surface of the core plate at preset positions on the surface of the core plate;
manufacturing a first conductive circuit on the side wall of the slot hole, manufacturing a second conductive circuit on the surface of the surface metal layer, wherein the first conductive circuit is connected with the second conductive circuit, and the line width of the first conductive circuit is equal to that of the second conductive circuit;
and respectively performing solder resist and coating treatment on the upper and lower surfaces of the core plate to obtain the printed circuit board.
2. The method of claim 1, wherein fabricating a first conductive trace on a sidewall of the slot comprises:
electroplating metal on the side wall of the slot to form a surface metal layer connecting the upper surface and the lower surface of the core plate;
filling a corrosion-resistant resin in the slot hole, and etching away part of the corrosion-resistant resin to make the line width and the line distance of the remained corrosion-resistant resin equal to those of the second conductive circuit to be manufactured;
and etching the slotted hole metal layer uncovered by the reserved resist resin, and removing the reserved resist resin to form the first conductive circuit.
3. The method for manufacturing the slot wall trace of the printed circuit board according to claim 2, wherein the etching away part of the resist resin comprises:
and etching the depth of one half of the anti-corrosion resin at the first end face of the slot hole and the depth of the other half of the anti-corrosion resin at the second end face of the slot hole by adopting a laser etching mode.
4. The method of manufacturing slot wall traces of a printed circuit board according to claim 2, characterized by comprising, after filling the slot with a resist resin:
and grinding the resist resin overflowed from the slot opening of the slot by a mechanical grinding mode.
5. The method of claim 1, wherein fabricating a first conductive trace on a sidewall of the slot and fabricating a second conductive trace on a surface of the surface metal layer, comprises:
electroplating metal on the side wall of the slot to form a surface metal layer connecting the upper surface and the lower surface of the core plate;
filling a slot hole with a resist resin, printing the resist resin on the surface of the surface metal layer of the core plate, and baking the resist resin in the slot hole and on the surface of the surface metal layer;
and exposing, developing and etching the resist resin in the slotted hole and on the surface of the surface metal layer to remove the resist resin, forming the first conductive circuit on the side wall of the slotted hole, and forming the second conductive circuit on the surface metal layer.
6. The method of manufacturing slot wall traces of a printed circuit board according to claim 5, wherein the surface of the metal layer of the surface of the core board is printed with a resist resin by means of screen printing.
7. The method of claim 5, wherein exposing the resist resin in the slot and on the surface of the metal layer comprises:
and exposing the resist resin on the surface of the surface metal layer by an exposure machine for one time, and exposing the two end faces of the resist resin in the slot hole for two times respectively.
8. The method for manufacturing slot wall traces of a printed circuit board according to claim 1, wherein slots of a predetermined length and width are drilled at predetermined positions on the surface of the core board by means of mechanical drilling, so that two opposite surfaces of the slots are in a planar structure.
9. A printed circuit board, comprising:
the core plate is provided with a slotted hole communicated with the upper surface and the lower surface of the core plate at a preset position on the surface of the core plate;
a first conductive circuit is arranged on the side wall of the slot hole, a second conductive circuit connected with the first conductive circuit is arranged on the upper surface and the lower surface of the core plate, and the line width of the first conductive circuit is equal to that of the second conductive circuit;
and the upper surface and the lower surface of the core plate are provided with solder masks.
10. The printed circuit board of claim 9, wherein the slot has a rectangular structure with two ends being oval, the slot comprises a planar sidewall and an arc sidewall, and the first conductive trace is disposed on the planar sidewall of the slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310291642.0A CN116321804A (en) | 2023-03-14 | 2023-03-14 | Method for manufacturing slot wall wiring of printed circuit board and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310291642.0A CN116321804A (en) | 2023-03-14 | 2023-03-14 | Method for manufacturing slot wall wiring of printed circuit board and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116321804A true CN116321804A (en) | 2023-06-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310291642.0A Pending CN116321804A (en) | 2023-03-14 | 2023-03-14 | Method for manufacturing slot wall wiring of printed circuit board and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116321804A (en) |
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2023
- 2023-03-14 CN CN202310291642.0A patent/CN116321804A/en active Pending
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