CN116321670A - Circuit board and manufacturing method thereof - Google Patents

Abstract

The invention is a circuit board and its manufacturing method. The circuit board includes an insulating part, a bearing layer disposed on the insulating part, and a metal shell disposed in the insulating part and thermally coupled to the bearing layer. The metal shell has a first inner surface, a second inner surface opposite to the first inner surface, a third inner surface connecting the first inner surface and the second inner surface, and a closed space, wherein the second inner surface is between the first inner surface and the second inner surface. Between the bearing layers, the airtight space is surrounded by the first inner surface, the second inner surface and the third inner surface. The circuit board also includes a heat exchange fluid distributed within the enclosed space. The circuit board also includes a first porous material distributed in the closed space, wherein the first porous material is arranged on the first inner surface. In this way, the heat dissipation efficiency of the circuit board is increased.

Description

Circuit board and manufacturing method thereof

technical field

The disclosure provides a circuit board and a manufacturing method thereof, especially a circuit board with a heat dissipation effect and a manufacturing method thereof.

Background technique

Current electronic devices, such as mobile phones or tablet computers, include electronic components and circuit boards, wherein the electronic components are, for example, integrated circuits (ICs) mounted on the circuit boards. The heat energy generated by electronic components during operation usually accumulates in the electronic components and circuit boards. The accumulated heat energy may cause the electronic components to overheat, thereby affecting the performance of the electronic components, and even causing the electronic components to burn out. Therefore, the circuit board with heat dissipation effect can help to suppress the temperature rise of the electronic components, thereby improving the performance of the electronic components.

Contents of the invention

According to some embodiments of the present disclosure, a circuit board includes an insulating part, a bearing layer disposed on the insulating part, and a metal shell disposed in the insulating part and thermally coupled to the bearing layer. The metal shell has a first inner surface, a second inner surface opposite to the first inner surface, a third inner surface connecting the first inner surface and the second inner surface, and a closed space, wherein the second inner surface is between the first inner surface and the second inner surface. Between the bearing layers, the airtight space is surrounded by the first inner surface, the second inner surface and the third inner surface. The circuit board also includes a heat exchange fluid distributed within the enclosed space. The circuit board also includes a first porous material distributed in the closed space, wherein the first porous material is arranged on the first inner surface.

In some embodiments, the circuit board further includes electronic components disposed on the carrying layer and thermally coupled to the metal shell through the carrying layer, wherein the electronic components are not electrically connected to the metal shell. The circuit board further includes a heat sink disposed under the metal shell and thermally coupled to the metal shell, wherein the metal shell is located between the electronic component and the heat sink.

In some embodiments, the orthographic projection of the electronic component on the second inner surface and the orthographic projection of the heat sink on the second inner surface are separated from each other.

In some embodiments, the circuit board further includes a first heat conduction column, configured in the insulating portion, connected to the bearing layer and the metal shell, and located between the bearing layer and the metal shell.

In some embodiments, the insulation part includes a first dielectric layer and a second dielectric layer, the metal shell is located between the first dielectric layer and the second dielectric layer, and the first heat conduction column is disposed in the first dielectric layer. , and thermally couple the bearing layer and the metal shell.

In some embodiments, the circuit board further includes a second heat conduction column, disposed on the second dielectric layer, connected to the heat sink and the metal shell, and located between the heat sink and the metal shell.

In some embodiments, the insulating portion completely covers the metal shell.

In some embodiments, the first porous material contacts the metal shell.

In some embodiments, the heat exchange fluid includes liquids and gases.

In some embodiments, the circuit board further includes a second porous material disposed on the third inner surface.

In some embodiments, the circuit board further includes a third porous material disposed on the second inner surface.

According to some other embodiments of the present disclosure, a method of manufacturing a circuit board includes forming a groove in the first insulating part, forming a first metal sub-shell in the groove, disposing a first porous material in the first metal sub-shell adding heat exchange fluid into the first metal sub-shell, forming the second metal sub-shell on the second insulating part, and pressing the first insulating part and the second insulating part. Pressing the first insulating part and the second insulating part so that the first metal sub-shell and the second metal sub-shell form a metal shell with a closed space, wherein the heat exchange fluid and the first pore material are sealed in the closed space of the metal shell .

In some embodiments, the method of forming the first metal subshell includes conformally depositing metal along an inner surface of the groove.

In some embodiments, the method of manufacturing a circuit board further includes placing a second porous material in the first metal sub-shell before laminating the first insulating part and the second insulating part, wherein the position of the second porous material is the same as that of the first insulating part. The position of the porous material is different.

In some embodiments, the method of manufacturing a circuit board further includes placing a third porous material within the second metal sub-case after forming the second metal sub-case.

In some embodiments, the method of manufacturing a circuit board further includes forming a first thermally conductive post in the first insulating portion, and forming a second thermally conductive post in the second insulating portion.

In some embodiments, the method of manufacturing the circuit board further includes disposing the electronic component on the second insulating portion, wherein the second heat conduction column is thermally coupled to the electronic component and the second metal sub-case.

In some embodiments, the method for manufacturing a circuit board further includes disposing a heat sink under the first insulating part, wherein the first heat conduction column is thermally coupled to the heat sink and the first metal sub-case, and the electronic component is placed on the front of the first metal sub-case. The projection and the orthographic projection of the heat sink on the first metal sub-shell are separated from each other.

The circuit board and its manufacturing method provided by the embodiments of the present disclosure can increase the heat conduction path, thereby increasing the heat dissipation efficiency of the circuit board, thereby improving the performance of electronic components.

Description of drawings

When reading the following implementation methods with accompanying drawings, the viewpoints of the disclosure can be clearly understood. It should be noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of discussion.

FIG. 1 illustrates a schematic top view of a circuit board according to some embodiments of the present disclosure.

FIG. 2A shows a cross-sectional view of a circuit board along line A-A of FIG. 1 according to some embodiments of the present disclosure.

FIG. 2B shows a cross-sectional view of the circuit board along the line B-B of FIG. 1 according to some embodiments of the present disclosure.

3 , 4 , 5 , 6 , 7 and 8 illustrate cross-sectional views of various stages of manufacturing a circuit board according to some embodiments of the present disclosure.

FIG. 9 illustrates a top view of a circuit board according to other embodiments of the present disclosure.

[Description of main component symbols]

100: Circuit board 110: Insulation part

110A: first insulating part 110B: second insulating part

111: first dielectric layer 112: second dielectric layer

113: third dielectric layer 120: metal shell

121: first inner surface 122: second inner surface

123: third inner surface 124: confined space

130: bearing layer 141: first thermal conduction column

142: second heat transfer column 150: heat exchange fluid

160: Porous material 161: First porous material

162: second porous material 163: third porous material

170: electronic components 180: heat sink

190: circuit layer 200: circuit board

220: metal shell 300: groove

310A: metal layer 310B: metal layer

400: metal layer 500: first metal subshell

700: second metal sub-shell A-A: section line

B-B: section line X, Y, Z: reference coordinate axis

Detailed ways

When an element is referred to as being "on", it can generally mean that the element is directly on other elements, or there may be other elements present in between. Conversely, when an element is said to be "directly on" another element, it cannot have other elements in between. As used herein, the word "and/or" includes any combination of one or more of the associated listed items.

It is understandable that terms such as first, second and third are used herein to describe various elements, components, regions, layers and/or blocks. But these elements, components, regions, layers and/or blocks should not be limited by these terms. These terms are limited to identifying a single element, component, region, layer and/or block. Therefore, a first element, component, region, layer and/or block hereinafter may also be referred to as a second element, component, region, layer and/or block without departing from the original meaning of the present disclosure.

The heat energy generated by electronic components during operation can be discharged through the heat sink on the circuit board to avoid excessive concentration of heat energy in the electronic components and the circuit board and cause overheating of the electronic components, thereby affecting the performance of the electronic components. The circuit board dissipates heat Efficiency is affected by the configuration of the heat conduction path between the electronic components and the heat sink and the speed of heat conduction. Embodiments of the present disclosure provide a circuit board with a heat dissipation effect and a manufacturing method thereof. By increasing the heat conduction path, it is helpful to improve the flexibility of the arrangement between the electronic component and the heat sink and improve the heat dissipation efficiency of the circuit board, thereby Improve the performance of electronic components.

Please refer to FIG. 1 , which is a top view of a circuit board 100 according to some embodiments of the present disclosure. The circuit board 100 may have an insulating portion 110, a metal shell 120 disposed in the insulating portion 110, an electronic component 170 disposed on the insulating portion 110, and a heat sink 180 disposed under the insulating portion 110, wherein FIG. 1 is drawn with a broken line An exemplary configuration of the metal shell 120 inside the insulating part 110 and the heat sink 180 under the insulating part 110 is shown.

As shown in FIG. 1 , the range of the metal shell 120 covers the electronic component 170 and the heat sink 180 . When the position of the electronic component 170 and the position of the heat sink 180 are adjusted according to product design and manufacturing requirements, the range of the metal shell 120 can also be adjusted correspondingly with the position of the electronic component 170 and the position of the heat sink 180 . In the embodiment shown in FIG. 1 , the position of the electronic component 170 and the position of the heat sink 180 are separated from each other in the horizontal direction (eg, separated from each other in the direction of the X axis). In some other embodiments, the position of the electronic component 170 and the position of the heat sink 180 may partially overlap in the horizontal direction (not shown).

Please refer to FIG. 2A and FIG. 2B at the same time. FIG. 2A is a cross-sectional view of the circuit board 100 along the section line A-A in FIG. 1 according to some embodiments of the disclosure, and FIG. 2B is a diagram of the circuit board according to some embodiments of the disclosure. 100 is a cross-sectional view along the section line B-B in FIG. 1 . It should be noted that, for clarity, FIG. 1 is simplified and only depicts some components of the circuit board 100 , so components between FIG. 1 (top view) and FIG. 2A/2B (cross-sectional view) may not be completely corresponding.

The electronic component 170 is disposed above the insulating portion 110 and the metal shell 120, and the heat sink 180 is disposed below the insulating portion 110 and the metal shell 120. It should be noted that the heat sink 180 is only shown in the cross-sectional view of FIG. 2B due to the viewing angle. middle.

The insulating part 110 can be a multilayer structure, which has a first dielectric layer 111 interposed between the electronic component 170 and the metal case 120, a second dielectric layer 112 interposed between the heat sink 180 and the metal case 120, and a third The dielectric layer 113 is interposed between the first dielectric layer 111 and the second dielectric layer 112 . The electronic component 170 is disposed on the first dielectric layer 111 and the heat sink 180 is disposed under the second dielectric layer 112 . It is worth mentioning that although the first dielectric layer 111 and the second dielectric layer 112 are shown as a single layer in FIG. 2A and FIG. and the third dielectric layer 113 may have any number of dielectric layers, respectively.

The material of the insulating part 110 may include epoxy glass cloth laminated board (FR-4), epoxy resin (epoxy resin), prepreg material (prepreg, PP) or ceramics, but not limited thereto.

The metal shell 120 is embedded in the insulating part 110 . The metal shell 120 is disposed between the first dielectric layer 111 and the second dielectric layer 112 and extends in the third dielectric layer 113 . In other words, the insulating part 110 covers the metal shell 120 . The metal shell 120 is disposed between the electronic component 170 and the heat sink 180 , so the vertical dimension of the metal shell 120 (eg, the dimension along the Z axis) is smaller than or equal to the vertical distance between the electronic component 170 and the heat sink 180 . In some embodiments, the size of the metal shell 120 in the vertical direction (eg, the size in the Z-axis direction) may be greater than the thickness of the single dielectric layer.

The metal shell 120 may include a first inner surface 121 , a second inner surface 122 , and a third inner surface 123 , wherein the first inner surface 121 and the second inner surface 122 are opposite to each other. The first inner surface 121 is adjacent to the heat sink 180 , the second inner surface 122 is adjacent to the electronic component 170 , and the third inner surface 123 connects the first inner surface 121 and the second inner surface 122 . Furthermore, the metal shell 120 may further include a closed space 124 surrounded by the first inner surface 121 , the second inner surface 122 and the third inner surface 123 , wherein the closed space 124 is basically defined by the metal shell 120 . Since the metal shell 120 is disposed in the insulating portion 110 , the enclosed space 124 of the metal shell 120 can make the insulating portion 110 present a hollow structure. In some embodiments, the material of the metal shell 120 may include metal (such as copper) or alloy.

The circuit board 100 may further have a bearing layer 130 , a first heat conduction column 141 and a second heat conduction column 142 . The carrying layer 130 is disposed on the insulating portion 110 (for example, on the first dielectric layer 111 ), and the electronic component 170 is disposed on the carrying layer 130 and thermally coupled to the carrying layer 130 . The first heat conducting column 141 is disposed in the insulating portion 110 and located between the bearing layer 130 and the metal shell 120 . The first heat conducting column 141 can connect the carrying layer 130 and the metal shell 120 . Specifically, the first heat conduction column 141 is disposed in the first dielectric layer 111 and is thermally coupled to the bearing layer 130 and the metal shell 120 . Therefore, the electronic component 170 can be thermally coupled to the metal case 120 via the carrying layer 130 and the first heat conducting post 141 .

In some embodiments, the carrier layer 130 and the first thermally conductive pillar 141 are used for heat conduction, but not for current conduction. Therefore, the electronic component 170 is not electrically connected to the metal shell 120 , so that the electrical signal routing and the heat conduction path do not interfere with each other to reduce the performance of the electronic component 170 or interfere with the operation of the electronic component 170 , thereby simplifying the system design. In some embodiments, the first heat conduction column 141 can be omitted, so that the electronic component 170 is thermally coupled to the metal shell 120 through the carrying layer 130 .

The second heat conducting column 142 is disposed in the insulating portion 110 and located between the heat sink 180 and the metal shell 120 . The second heat conducting column 142 can connect the heat sink 180 and the metal shell 120 . Specifically, the second heat conducting column 142 is disposed in the second dielectric layer 112 and is thermally coupled to the heat sink 180 and the metal shell 120 . Similar to the first heat conduction pillar 141 , the second heat conduction pillar 142 provides the function of heat conduction, and the heat sink 180 can be thermally coupled to the metal shell 120 through the second heat conduction pillar 142 , but the second heat conduction pillar 142 is not used for current conduction.

The materials of the bearing layer 130 , the first heat conduction column 141 and the second heat conduction column 142 may include materials with thermal conductivity, such as metal, ceramics, and the like. In some embodiments, the material of the bearing layer 130 , the first heat conduction pillar 141 and the second heat conduction pillar 142 may be copper.

The circuit board 100 also has a heat exchange fluid 150 disposed within the metal shell 120 . In detail, the heat exchange fluid 150 is sealed in the metal shell 120 and distributed in the closed space 124 . In some embodiments, heat exchange fluid 150 may flow within confined space 124 . The heat exchange fluid 150 exists in a liquid state and a gas state in the metal shell 120 .

The material (in liquid state) of the heat exchange fluid 150 may include ammonia, acetone, methanol, ethanol, hydrogen peroxide, pure water, other suitable materials, or a combination of the above materials. Since the heat exchange fluid 150 absorbs and releases thermal energy by phase change (discussed later), the material selection of the heat exchange fluid 150 should take into account the temperature range during operation of the circuit board 100 to ensure that the heat exchange fluid 150 will be at the same temperature. A phase change occurs in the temperature range. In some embodiments, the operating temperature of the circuit board 100 is between -70° C. and 200° C., so a material that undergoes a phase change between -70° C. and 200° C. can be selected as the heat exchange fluid 150 .

The circuit board 100 may further have a porous material 160 disposed in the metal shell 120 . In detail, the porous material 160 is sealed in the metal shell 120 and distributed in the closed space 124 . In some embodiments, the porous material 160 is disposed on the inner surface of the metal shell 120 . In some embodiments, the porous silicon material 160 may directly contact the metal shell 120 . The porous material 160 may include, for example, metal, ceramics, etc., to provide a heat conduction function. In some embodiments, the material of the porous material 160 may include copper, gold, silver, aluminum, and the like. In some embodiments, the porous material 160 may be copper fibers.

The porous structure of the porous material 160 is sufficient for the heat exchange fluid 150 to be adsorbed therein. In addition, the porous structure of the porous material 160 may increase the surface area of the porous material 160 . The increased surface area may increase the area contacting the heat exchange fluid 150 , thereby improving the transfer of thermal energy between the porous material 160 and the heat exchange fluid 150 .

When the electronic component 170 is in operation, the generated heat energy can be rapidly conducted to the metal shell 120 through the carrying layer 130 and the first heat conducting column 141 . A region of the metal shell 120 close to the electronic component 170 is a heat input area, and another area of the metal shell 120 close to the heat sink 180 is a heat output area. In the heat input area, the metal shell 120 can directly conduct heat energy to the liquid heat exchange fluid 150 , or conduct heat energy to the liquid heat exchange fluid 150 through the porous material 160 . The liquid heat exchange fluid 150 absorbs heat energy and evaporates into a gaseous heat exchange fluid 150 , and the gaseous heat exchange fluid 150 moves toward the heat sink 180 , that is, the heat exchange fluid 150 moves from the heat input area to the heat output area.

When the gaseous heat exchange fluid 150 reaches the heat output area, the gaseous heat exchange fluid 150 can be condensed into a liquid heat exchange fluid 150, and at the same time, during the phase change of the heat exchange fluid 150, heat energy is released and transferred to the metal shell 120 and porous material 160. The heat energy is further conducted to the heat dissipation element 180 through the second heat conduction column 142 , and then discharged by the heat dissipation element 180 to prevent heat energy from accumulating in the circuit board 100 .

After the gaseous heat exchange fluid 150 is condensed into the liquid heat exchange fluid 150, the liquid heat exchange fluid 150 can be adsorbed in the porous material 160, and due to the capillary phenomenon, it will flow from the heat output area (the area of the metal shell 120 adjacent to the heat sink 180) Move to the heat input area (the area where the metal shell 120 is adjacent to the electronic component 170 ). In this way, the heat exchange fluid 150 can circulate repeatedly in the metal shell 120 , and the heat energy generated by the electronic component 170 can be continuously conducted from the electronic component 170 to the heat sink 180 to be discharged in the above-mentioned manner.

The configuration of the porous material 160 facilitates circulation of the heat exchange fluid 150 . In some embodiments, the porous material 160 has at least the first porous material 161 disposed on the first inner surface 121 to facilitate the movement of the heat exchange fluid 150 in the horizontal direction (eg, on the XY plane). In some embodiments, the first porous material 161 directly contacts the first inner surface 121 to conduct heat energy with the metal shell 120 .

In the embodiment where the first porous material 161 is present, the porous material 160 may further have a second porous material 162 disposed on the third inner surface 123 . In this embodiment, the second porous material 162 can conduct heat energy in the vertical direction (eg, the Z-axis direction) or assist the heat exchange fluid 150 to move in the vertical direction (eg, the Z-axis direction). In the embodiment where the first porous material 161 and the second porous material 162 exist, the porous material 160 may further have a third porous material 163 disposed on the second inner surface 122 to provide additional thermal energy conduction.

The closed space 124 of the metal shell 120 can determine the distribution range of the heat exchange fluid 150 , and the porous material 160 in the metal shell 120 can facilitate the flow and circulation of the heat exchange fluid 150 . When the metal shell 120 is located between the electronic component 170 and the heat sink 180 and is thermally coupled to the two, the metal shell 120 can form a heat conduction path between the electronic component 170 and the heat sink 180 . In other words, the metal shell 120 can be adjusted according to system design or process requirements, thereby adjusting the heat conduction path between the electronic component 170 and the heat sink 180 .

In some embodiments, the heat conduction path between the electronic component 170 and the heat sink 180 can be designed to extend in the horizontal direction (for example, extend on the XY plane), as shown in FIG. 1 . In this embodiment, the orthographic projection of the electronic component 170 may not overlap the orthographic projection of the heat sink 180 . In other words, the orthographic projection of the electronic component 170 on the first inner surface 121 and the orthographic projection of the heat sink 180 on the first inner surface 121 are separated from each other. Likewise, the orthographic projection of the first thermally conductive column 141 may not overlap the orthographic projection of the second thermally conductive column 142 . Of course, in other unillustrated embodiments, the orthographic projection of the electronic component 170 on the first inner surface 121 can also overlap the orthographic projection of the heat sink 180 on the first inner surface 121, which still belongs to the protection intended by this disclosure. scope.

Therefore, the enclosed space 124 of the metal shell 120 together with the heat exchange fluid 150 and the porous material 160 can provide more multiple heat conduction paths, so as to increase the design flexibility of the circuit board 100, and can also quickly conduct heat energy generated by the electronic components 170 to The heat sink 180 is used to improve the heat dissipation efficiency of the circuit board 100 .

The circuit board 100 also includes a circuit layer 190 . The insulation part 110 electrically isolates the circuit layer 190 from the metal shell 120 , so the circuit layer 190 is not electrically connected to the metal shell 120 . Therefore, the circuit layer 190 and the heat conduction path for transmitting electrical signals will not affect each other to reduce the performance of the electronic component 170 or interfere with the operation of the electronic component 170 , and also help to simplify the system design.

3 , 4 , 5 , 6 , 7 and 8 are cross-sectional views illustrating various stages of manufacturing the circuit board 100 according to some embodiments of the present disclosure. The reference sections of Figs. 3, 4, 5, 6, 7 and 8 are consistent with Fig. 2A.

It should be noted that, unless otherwise specified, when the following embodiments are shown or described as a series of operations or events, the description order of these operations or events should not be limited. For example, some operations or events may be undertaken in a different order than in the present disclosure, some operations or events may occur concurrently, some operations or events may not be required, and/or some operations or events may be repeated. Moreover, the actual manufacturing process may require additional operations before, during, or after each step to completely form the circuit board 100 . Therefore, this disclosure may briefly illustrate some of these additional operations.

Referring to FIG. 3 , firstly, a groove 300 is formed in the first insulating portion 110A. The first insulating part 110A is a multi-layer structure, and the second dielectric layer 112 and the third dielectric layer 113 as shown in FIG. ) may be formed in the first insulating part 110A. The groove 300 may be formed by laser drilling, mechanical drilling, other suitable techniques, or a combination thereof. In some embodiments, the metal layer 310A is distributed on the first insulating portion 110A. In some embodiments, the metal layer 310B is disposed on the bottom surface of the groove 300 . In some embodiments, metal layer 310A and metal layer 310B are formed from different metal sheets.

Please refer to FIG. 4 and FIG. 5 at the same time. Next, a first metal sub-shell 500 is formed in the groove 300 . In FIG. 4 , the step of forming the first metal sub-shell 500 may include conformally depositing metal along the inner surface of the groove 300 such that the metal layer 400 is formed on the side surface of the groove 300 . Deposition methods may include evaporation, sputtering, electroplating, other suitable deposition techniques, or combinations thereof. For example, forming the metal layer 400 may include using an electroplating process. In an embodiment using an electroplating process, the metal layer 400 can be conformally deposited on the groove 300 by adjusting electroplating parameters (eg, current density). In FIG. 5 , the metal layer 310A is patterned to form the wiring layer 190 . The metal layer 400 and the metal layer 310B jointly form the first metal sub-shell 500 in the groove 300 , wherein the first metal sub-shell 500 and the circuit layer 190 are separated from each other without electrical connection.

Referring to FIG. 6 , the first porous material 161 is disposed in the first metal sub-shell 500 . In detail, the first porous material 161 is disposed on the bottom surface of the first metal sub-case 500 . In some embodiments, the first porous material 161 contacts the first metal sub-shell 500 .

In some embodiments, the first porous material 161 is flat and its horizontal dimension (for example, the size of the XY plane) is the same as or larger than the bottom surface of the first metal sub-shell 500, so the edges of the first porous material 161 can be cut or abutted. It touches the side wall of the first metal sub-shell 500 to be fixed in the first metal sub-shell 500 . After configuring the first porous material 161 , a second porous material 162 may be further configured in the first metal sub-shell 500 . The arrangement position of the second porous material 162 is different from that of the first porous material 161 . For example, the second porous material 162 can be disposed on the sidewall of the first metal sub-shell 500 .

Please continue to refer to FIG. 6 , adding the heat exchange fluid 150 into the first metal sub-shell 500 . In detail, the heat exchange fluid 150 in a liquid state is added into the first metal sub-shell 500 . The volume or weight of the heat exchange fluid 150 in liquid state added to the first metal sub-shell 500 is determined according to product design, application temperature range, and material properties of the working fluid.

Referring to FIG. 7 , a second metal sub-shell 700 is formed on the second insulating portion 110B. The second insulating part 110B is the first dielectric layer 111 of FIG. 2A , and the first thermally conductive pillar 141 may be formed in the second insulating part 110B, and the carrying layer 130 may be formed on the second insulating part 110B.

The second metal sub-shell 700 may be formed by patterning the metal layer after depositing the metal layer. Deposition methods may include evaporation, sputtering, electroplating, other suitable deposition techniques, or combinations thereof. For example, an electroplating process is used. In some embodiments, after forming the second metal sub-shell 700 , the third porous material 163 is placed within the second metal sub-shell 700 .

Referring to FIG. 8 , the structure in FIG. 6 and the structure in FIG. 7 are laminated. In detail, the first insulating portion 110A and the second insulating portion 110B are press-bonded to form the insulating portion 110, and the first metal sub-shell 500 (see FIG. 6 ) and the second metal sub-shell 700 (see FIG. 7 ) are aligned with each other. And combined into a metal shell 120 with a closed space 124 . After pressing, the first porous material 161 and the heat exchange fluid 150 originally disposed in the first metal sub-shell 500 are sealed in the closed space 124 of the metal shell 120 . In some embodiments, second porous material 162 is sealed within metal shell 120 . In some embodiments, third porous material 163 is sealed within metal shell 120 .

After the metal shell 120 is formed, the electronic component 170 can be arranged on the structure of FIG. 8 (for example, arranged on the carrier layer 130) and the heat sink 180 can be arranged under the structure of FIG. 8, thereby forming the structure shown in FIGS. 2A and 2B The circuit board 100, wherein the circuit board 100 is as described above, and will not be described in detail here.

Please refer to FIG. 9 , which shows a top view of a circuit board 200 according to another embodiment of the present disclosure. The circuit board 200 in FIG. 9 is similar to the circuit board 100 in FIG. 1 , the difference between the two lies in the shape of the metal shell 220 in FIG. 9 . Since the position of the electronic component 170 and the position of the heat sink 180 are separated from each other in the X-axis direction and the Y-axis direction at the same time, the shape of the metal shell 220 on the horizontal plane (for example, on the XY plane) can have a bend to connect Electronic components 170 and heat sink 180 . For example, in FIG. 9 , the shape of the metal shell 220 on the horizontal plane (for example, on the XY plane) can be designed as an L shape. Briefly, FIG. 9 provides an exemplary configuration of a metal shell 220 to illustrate the electronic components using the metal shell 220, the heat exchange fluid 150 (see FIG. The thermal conduction path between 170 and heat sink 180 may be non-linear.

Based on the above, the embodiments of the disclosure provide a circuit board with a heat dissipation effect and its manufacturing method. A metal shell with a closed space, a heat exchange fluid and a porous material are arranged in the circuit board to increase the configuration of the heat conduction path Flexibility, so as to increase the heat dissipation efficiency of the circuit board and enhance the freedom of circuit board design and manufacturing process, thereby improving the performance of electronic components.

The features of several embodiments of the present disclosure are briefly described above, so that those skilled in the art can understand the present disclosure more easily. Those skilled in the art should understand that this description can be easily used as a basis for other structural or process changes or designs to achieve the same purpose and/or obtain the same advantages as the embodiments of the present invention. Anyone with ordinary knowledge in the technical field can also understand that the structures equivalent to the above do not depart from the spirit and protection scope of the present invention, and can be modified, substituted and Revise.

Claims (18)

1. A circuit board, comprising:

an insulating part;

a carrier layer disposed on the insulating portion;

a metal shell disposed in the insulating portion and thermally coupled to the carrier layer, wherein the metal shell has:

a first inner surface;

a second inner surface opposite to the first inner surface, wherein the second inner surface is between the first inner surface and the carrier layer;

a third inner surface connecting the first inner surface and the second inner surface; and

a closed space surrounded by the first inner surface, the second inner surface and the third inner surface;

a heat exchange fluid distributed in the enclosed space; and

the first pore material is distributed in the closed space and is configured on the first inner surface.

2. The circuit board of claim 1, further comprising:

the electronic element is arranged on the bearing layer and is thermally coupled with the metal shell through the bearing layer, wherein the electronic element is not electrically connected with the metal shell; and

the heat dissipation piece is arranged below the metal shell and is thermally coupled with the metal shell, wherein the metal shell is positioned between the electronic element and the heat dissipation piece.

3. The circuit board of claim 2, wherein the front projection of the electronic component on the first inner surface and the front projection of the heat sink on the first inner surface are separated from each other.

4. The circuit board of claim 1, further comprising:

the first heat conduction column is arranged in the insulating part, connects the bearing layer and the metal shell and is positioned between the bearing layer and the metal shell.

5. The circuit board of claim 4, wherein the insulating portion comprises a first dielectric layer and a second dielectric layer, the metal shell is located between the first dielectric layer and the second dielectric layer, and the first conductive post is disposed in the first dielectric layer and thermally couples the carrier layer and the metal shell.

6. The circuit board of claim 5, further comprising:

the second heat conduction column is arranged in the second dielectric layer, connects the heat dissipation piece and the metal shell and is positioned between the heat dissipation piece and the metal shell.

7. The circuit board of claim 1, wherein the insulating portion completely encapsulates the metal shell.

8. The circuit board of claim 1, wherein the first porous material contacts the metal shell.

9. The circuit board of claim 1, wherein the heat exchange fluid comprises a liquid and a gas.

10. The circuit board of claim 1, further comprising:

and a second porous material disposed on the third inner surface.

11. The circuit board of claim 10, further comprising:

and a third porous material disposed on the second inner surface.

12. A method of manufacturing a circuit board, comprising:

forming a groove in the first insulating portion;

forming a first metal sub-shell in the groove;

disposing a first pore material within the first metal sub-shell;

adding a heat exchange fluid into the first metal sub-shell;

forming a second metal sub-shell on the second insulating part; and

and pressing the first insulating part and the second insulating part to enable the first metal sub-shell and the second metal sub-shell to form a metal shell with a closed space, wherein the heat exchange fluid and the first pore material are sealed in the closed space of the metal shell.

13. The method of manufacturing a circuit board of claim 12, wherein the method of forming the first metal sub-shell comprises conformally depositing metal along an inner surface of the recess.

14. The method of manufacturing a circuit board according to claim 12, further comprising:

before the first insulating part and the second insulating part are pressed, a second pore material is placed in the first metal sub-shell, wherein the position of the second pore material is different from that of the first pore material.

15. The method of manufacturing a circuit board according to claim 12, further comprising:

after forming the second metal sub-shell, a third pore material is placed within the second metal sub-shell.

16. The method of manufacturing a circuit board according to claim 12, further comprising:

forming a first heat conductive pillar in the first insulating portion; and

a second heat conductive pillar is formed in the second insulating portion.

17. The method of manufacturing a circuit board as defined in claim 16, further comprising:

and disposing an electronic component on the second insulating portion, wherein the second heat conductive post is thermally coupled to the electronic component and the second metal sub-case.

18. The method of manufacturing a circuit board as defined in claim 17, further comprising:

and disposing a heat sink under the first insulating portion, wherein the first heat conductive post is thermally coupled to the heat sink and the first metal sub-case, and an orthographic projection of the electronic component on the first metal sub-case and an orthographic projection of the heat sink on the first metal sub-case are separated from each other.

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