CN116321670A - Circuit board and manufacturing method thereof - Google Patents

Abstract

The invention relates to a circuit board and a manufacturing method thereof. The circuit board comprises an insulating part, a bearing layer arranged on the insulating part, and a metal shell arranged in the insulating part and thermally coupled with the bearing layer. The metal shell is provided with a first inner surface, a second inner surface opposite to the first inner surface, a third inner surface connecting the first inner surface and the second inner surface and a closed space, wherein the second inner surface is arranged between the first inner surface and the bearing layer, and the closed space is surrounded by the first inner surface, the second inner surface and the third inner surface. The circuit board further includes a heat exchange fluid distributed within the enclosed space. The circuit board further includes a first porous material disposed within the enclosed space, wherein the first porous material is disposed on the first inner surface. Thereby increasing the heat dissipation efficiency of the circuit board.

Description

Circuit board and manufacturing method thereof

Technical Field

The present disclosure provides a circuit board and a method for manufacturing the same, and more particularly, to a circuit board with heat dissipation effect and a method for manufacturing the same.

Background

Current electronic devices, such as mobile phones or tablet computers, include electronic components, such as integrated circuits (Integrated Circuit, ICs), and circuit boards, on which the electronic components are mounted. The heat energy generated by the electronic component during the operation process is generally accumulated in the electronic component and the circuit board, and the accumulated heat energy may cause the electronic component to overheat, thereby affecting the performance of the electronic component and even causing the electronic component to burn out. Therefore, the circuit board with the heat dissipation effect can help to inhibit the temperature rise of the electronic element, thereby improving the efficiency of the electronic element.

Disclosure of Invention

According to some embodiments of the present disclosure, a circuit board includes an insulating portion, a carrier layer disposed on the insulating portion, and a metal shell disposed within the insulating portion and thermally coupled to the carrier layer. The metal shell is provided with a first inner surface, a second inner surface opposite to the first inner surface, a third inner surface connecting the first inner surface and the second inner surface and a closed space, wherein the second inner surface is arranged between the first inner surface and the bearing layer, and the closed space is surrounded by the first inner surface, the second inner surface and the third inner surface. The circuit board further includes a heat exchange fluid distributed within the enclosed space. The circuit board further includes a first porous material disposed within the enclosed space, wherein the first porous material is disposed on the first inner surface.

In some embodiments, the circuit board further includes an electronic component disposed on the carrier layer and thermally coupled to the metal shell via the carrier layer, wherein the electronic component is not electrically connected to the metal shell. The circuit board further comprises a heat dissipation member disposed under the metal shell and thermally coupled to the metal shell, wherein the metal shell is located between the electronic component and the heat dissipation member.

In some embodiments, the front projection of the electronic component on the second inner surface and the front projection of the heat sink on the second inner surface are separated from each other.

In some embodiments, the circuit board further includes a first heat conductive post disposed in the insulating portion, connecting the carrier layer and the metal shell, and located between the carrier layer and the metal shell.

In some embodiments, the insulating portion includes a first dielectric layer and a second dielectric layer, the metal shell is located between the first dielectric layer and the second dielectric layer, and the first heat conductive pillar is disposed in the first dielectric layer and thermally couples the carrier layer and the metal shell.

In some embodiments, the circuit board further includes a second heat conductive post disposed on the second dielectric layer, connecting the heat sink and the metal shell, and between the heat sink and the metal shell.

In some embodiments, the insulating portion completely encases the metal shell.

In some embodiments, the first pore material contacts the metal shell.

In some embodiments, the heat exchange fluid comprises a liquid and a gas.

In some embodiments, the circuit board further includes a second porous material disposed on the third inner surface.

In some embodiments, the circuit board further includes a third porous material disposed on the second inner surface.

According to other embodiments of the present disclosure, a method of manufacturing a circuit board includes forming a recess in a first insulating portion, forming a first metal sub-shell within the recess, disposing a first pore material within the first metal sub-shell, adding a heat exchange fluid to the first metal sub-shell, forming a second metal sub-shell on a second insulating portion, and bonding the first insulating portion and the second insulating portion. The first insulating part and the second insulating part are pressed together to enable the first metal sub-shell and the second metal sub-shell to form a metal shell with a closed space, wherein the heat exchange fluid and the first pore material are sealed in the closed space of the metal shell.

In some embodiments, a method of forming a first metal sub-shell includes conformally depositing metal along an inner surface of a groove.

In some embodiments, the method of manufacturing a circuit board further includes placing a second void material within the first metal sub-shell prior to bonding the first insulating portion and the second insulating portion, wherein the location of the second void material is different from the location of the first void material.

In some embodiments, the method of manufacturing a circuit board further includes placing a third pore material within the second metal sub-shell after forming the second metal sub-shell.

In some embodiments, the method of manufacturing a circuit board further includes forming a first thermally conductive post in the first insulating portion and forming a second thermally conductive post in the second insulating portion.

In some embodiments, the method of manufacturing a circuit board further includes disposing an electronic component on the second insulating portion, wherein the second thermally conductive post thermally couples the electronic component and the second metal sub-housing.

In some embodiments, the method of manufacturing a circuit board further includes disposing a heat sink under the first insulating portion, wherein the first heat conductive post thermally couples the heat sink and the first metal sub-housing, and an orthographic projection of the electronic component on the first metal sub-housing and an orthographic projection of the heat sink on the first metal sub-housing are separated from each other.

The circuit board and the manufacturing method thereof provided by the embodiment of the invention can increase the heat conduction path, thereby increasing the heat dissipation efficiency of the circuit board and improving the efficiency of the electronic element.

Drawings

The following methods are read in conjunction with the accompanying drawings to provide a clear understanding of the aspects of the present disclosure. It should be noted that the various features are not drawn to scale according to industry standard practices. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of discussion.

Fig. 1 depicts a simplified top view of a circuit board according to some embodiments of the present disclosure.

Fig. 2A illustrates a cross-sectional view of a circuit board along section line A-A of fig. 1, according to some embodiments of the present disclosure.

Fig. 2B illustrates a cross-sectional view of the circuit board along section line B-B of fig. 1, according to some embodiments of the present disclosure.

Fig. 3, 4, 5, 6, 7, and 8 illustrate cross-sectional views of various stages of manufacturing a circuit board according to some embodiments of the present disclosure.

Fig. 9 illustrates a top view of a circuit board according to further embodiments of the present disclosure.

[ Main element symbols description ]

100 circuit board 110 insulation part

110A first insulating portion 110B second insulating portion

111 first dielectric layer 112 second dielectric layer

113 third dielectric layer 120 metal shell

121 first inner surface 122 second inner surface

123 third inner surface 124 closed space

130 bearing layer 141, first heat conduction column

142 second heat conductive column 150 heat exchange fluid

160 pore material 161 first pore material

162 second pore material 163 third pore material

170 electronic component 180, heat sink

190 circuit layer 200 circuit board

220 metal shell 300 groove

310A metal layer 310B metal layer

400 metal layer 500 first metal sub-shell

700 second metal sub-shell A-A section line

B-B, section X, Y, Z, reference coordinate axes

Detailed Description

When an element is referred to as being "on" …, it can be broadly interpreted as referring to the element directly on the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly on" another element, it can be without other elements present therebetween. As used herein, the term "and/or" includes any combination of one or more of the listed associated items.

The terms first, second, third, etc. are used herein to describe various elements, components, regions, layers and/or blocks. These elements, components, regions, layers and/or blocks should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another. Accordingly, a first element, component, region, layer and/or section discussed below could be termed a second element, component, region, layer and/or section without departing from the spirit of the present disclosure.

The heat energy generated by the electronic component in the operation process can be discharged through the heat dissipation part on the circuit board, so that the overheat of the electronic component caused by the excessive concentration of the heat energy in the electronic component and the circuit board is avoided, and the performance of the electronic component is further affected, wherein the heat dissipation efficiency of the circuit board is affected by the heat energy conduction path configuration and the heat energy conduction speed between the electronic component and the heat dissipation part. The embodiment of the disclosure provides a circuit board with a heat dissipation effect and a manufacturing method thereof, which are beneficial to improving the elasticity of the arrangement between an electronic element and a heat dissipation piece and improving the heat dissipation efficiency of the circuit board by increasing a heat conduction path, thereby improving the efficiency of the electronic element.

Referring to fig. 1, fig. 1 is a top view of a circuit board 100 according to some embodiments of the disclosure. The circuit board 100 may have an insulating portion 110, a metal shell 120 disposed within the insulating portion 110, an electronic component 170 disposed on the insulating portion 110, and a heat sink 180 disposed under the insulating portion 110, wherein fig. 1 depicts an exemplary configuration of the metal shell 120 inside the insulating portion 110 and the heat sink 180 under the insulating portion 110 in broken lines.

As shown in fig. 1, the metal case 120 covers the electronic component 170 and the heat sink 180. When the position of the electronic component 170 and the position of the heat sink 180 are adjusted according to the product design and manufacturing requirements, the range of the metal shell 120 can also be adjusted correspondingly according to the position of the electronic component 170 and the position of the heat sink 180. In the embodiment shown in fig. 1, the position of the electronic component 170 and the position of the heat sink 180 are separated from each other in the horizontal direction (e.g., separated from each other in the X-axis direction). In some other embodiments, the position of the electronic component 170 and the position of the heat sink 180 may partially overlap in the horizontal direction (not depicted).

Referring to fig. 2A and 2B, fig. 2A is a cross-sectional view of the circuit board 100 along a line A-A of fig. 1 according to some embodiments of the present disclosure, and fig. 2B is a cross-sectional view of the circuit board 100 along a line B-B of fig. 1 according to some embodiments of the present disclosure. It should be noted that fig. 1 is simplified to depict only some elements of the circuit board 100 for clarity of illustration, so the elements between fig. 1 (top view) and fig. 2A/2B (cross-sectional view) may not necessarily correspond exactly.

The electronic component 170 is disposed above the insulating portion 110 and the metal case 120, and the heat sink 180 is disposed below the insulating portion 110 and the metal case 120, and it should be noted that the heat sink 180 is only shown in the cross-sectional view of fig. 2B due to the view angle.

The insulating portion 110 may be a multi-layered structure having a first dielectric layer 111 interposed between the electronic component 170 and the metal case 120, a second dielectric layer 112 interposed between the heat spreader 180 and the metal case 120, and a third dielectric layer 113 interposed between the first dielectric layer 111 and the second dielectric layer 112. The electronic device 170 is disposed on the first dielectric layer 111 and the heat spreader 180 is disposed under the second dielectric layer 112. It should be noted that, although the first dielectric layer 111 and the second dielectric layer 112 are illustrated as a single layer in fig. 2A and 2B, in practice, the first dielectric layer 111, the second dielectric layer 112 and the third dielectric layer 113 may have any number of dielectric layers, respectively.

The material of the insulating portion 110 may include, but is not limited to, epoxy glass laminate (FR-4), epoxy resin (epoxy resin), prepreg (PP), or ceramic.

The metal shell 120 is embedded in the insulating part 110. The metal shell 120 is disposed between the first dielectric layer 111 and the second dielectric layer 112 and extends within the third dielectric layer 113. In other words, the insulating part 110 covers the metal case 120. The metal case 120 is disposed between the electronic component 170 and the heat sink 180, and thus a dimension of the metal case 120 in a vertical direction (e.g., a dimension in a Z-axis direction) is less than or equal to a vertical distance between the electronic component 170 and the heat sink 180. In some embodiments, the dimension of the metal shell 120 in the vertical direction (e.g., the dimension in the Z-axis direction) may be greater than the thickness of the single dielectric layer.

The metal shell 120 may include a first inner surface 121, a second inner surface 122, and a third inner surface 123, wherein the first inner surface 121 and the second inner surface 122 are opposite to each other. The first inner surface 121 is adjacent to the heat sink 180, the second inner surface 122 is adjacent to the electronic component 170, and the third inner surface 123 connects the first inner surface 121 and the second inner surface 122. Furthermore, the metal shell 120 may further include a closed space 124 surrounded by the first inner surface 121, the second inner surface 122 and the third inner surface 123, wherein the closed space 124 is substantially defined by the metal shell 120. Since the metal shell 120 is disposed in the insulating portion 110, the closed space 124 of the metal shell 120 can make the insulating portion 110 have a hollow structure. In some embodiments, the material of the metal shell 120 may include a metal (e.g., copper) or an alloy.

The circuit board 100 may further have a carrier layer 130, a first heat conductive post 141 and a second heat conductive post 142. The carrier layer 130 is disposed on the insulating portion 110 (e.g., on the first dielectric layer 111), and the electronic component 170 is disposed on the carrier layer 130 and thermally coupled to the carrier layer 130. The first heat conductive post 141 is disposed in the insulating part 110 and between the bearing layer 130 and the metal case 120. The first heat conductive posts 141 may connect the carrier layer 130 and the metal case 120. Specifically, the first heat conductive pillars 141 are disposed in the first dielectric layer 111 and thermally couple the carrier layer 130 and the metal case 120. Accordingly, the electronic element 170 may be thermally coupled to the metal case 120 via the carrier layer 130 and the first heat conductive post 141.

In some embodiments, the carrier layer 130 and the first heat conductive pillars 141 are used for heat conduction, but not for current conduction. Therefore, the electronic component 170 is not electrically connected to the metal case 120, so that the electrical signal trace and the heat conduction path do not affect each other, thereby reducing the performance of the electronic component 170 or interfering with the operation of the electronic component 170, thereby simplifying the system design. In some embodiments, the first heat conductive pillars 141 may be omitted, so that the electronic component 170 is thermally coupled to the metal case 120 through the carrier layer 130.

The second heat conductive post 142 is disposed in the insulating part 110 and between the heat sink 180 and the metal case 120. The second heat conductive post 142 may connect the heat sink 180 and the metal case 120. Specifically, the second heat conductive pillars 142 are disposed in the second dielectric layer 112 and thermally couple the heat sink 180 and the metal case 120. Similar to the first heat conductive post 141, the second heat conductive post 142 provides a heat conduction function, and the heat sink 180 may be thermally coupled to the metal case 120 through the second heat conductive post 142, but the second heat conductive post 142 is not used for current conduction.

The materials of the bearing layer 130, the first and second heat conductive pillars 141 and 142 may include materials having heat conductivity, such as metal, ceramic, and the like. In some embodiments, the material of the bearing layer 130, the first heat conductive pillars 141, and the second heat conductive pillars 142 may be copper.

The circuit board 100 also has a heat exchange fluid 150 disposed within the metal shell 120. In detail, the heat exchange fluid 150 is sealed in the metal case 120 and distributed within the closed space 124. In some embodiments, the heat exchange fluid 150 may flow in the enclosed space 124. The heat exchange fluid 150 exists in a liquid state and a gaseous state in the metal shell 120.

The material (liquid state) of the heat exchange fluid 150 may include ammonia, acetone, methanol, ethanol, heptanes, pure water, other suitable materials, or combinations thereof. Since the heat exchange fluid 150 absorbs and releases thermal energy (discussed below) via a phase change, the materials of the heat exchange fluid 150 are selected to take into account the temperature range of the circuit board 100 during operation to ensure that the heat exchange fluid 150 undergoes a phase change within the same temperature range. In some embodiments, the circuit board 100 operates at a temperature between-70 ℃ and 200 ℃, so materials that produce a phase change between-70 ℃ and 200 ℃ may be selected as the heat exchange fluid 150.

The circuit board 100 may further have a void material 160 disposed within the metal shell 120. In detail, the pore material 160 is sealed in the metal case 120 and distributed within the closed space 124. In some embodiments, the pore material 160 is disposed on an inner surface of the metal shell 120. In some embodiments, the porous silicon material 160 may directly contact the metal shell 120. The pore material 160 may include, for example, metal, ceramic, etc., to provide a thermally conductive function. In some embodiments, the material of the pore material 160 may include copper, gold, silver, aluminum, and the like. In some embodiments, the pore material 160 may be copper fibers.

The pore structure of the pore material 160 is sufficient to allow the heat exchange fluid 150 to be adsorbed therein. In addition, the pore structure of the pore material 160 may increase the surface area of the pore material 160. The increased surface area may increase the area in contact with the heat exchange fluid 150, thereby enhancing thermal energy conduction between the pore material 160 and the heat exchange fluid 150.

When the electronic component 170 is operated, the generated heat energy can be rapidly conducted to the metal case 120 through the carrier layer 130 and the first heat conductive pillars 141. One area of the metal case 120 close to the electronic component 170 is a thermal energy input area, and another area of the metal case 120 close to the heat sink 180 is a thermal energy output area. In the thermal energy input region, the metal shell 120 may conduct thermal energy directly to the liquid heat exchange fluid 150 or via the porous material 160 to the liquid heat exchange fluid 150. The heat exchange fluid 150 in a liquid state absorbs heat energy to evaporate into the heat exchange fluid 150 in a gaseous state, and the heat exchange fluid 150 in a gaseous state moves toward the heat sink 180, that is, the heat exchange fluid 150 moves from the heat energy input region to the heat energy output region.

When the gaseous heat exchange fluid 150 reaches the thermal energy output zone, the gaseous heat exchange fluid 150 may condense into a liquid heat exchange fluid 150, and at the same time, during the phase change of the heat exchange fluid 150, thermal energy is released and transferred to the metal shell 120 and the pore material 160. The heat energy is further conducted to the heat sink 180 through the second heat conductive pillars 142, and then is discharged from the heat sink 180, so as to avoid the heat energy accumulating in the circuit board 100.

After the gaseous heat exchange fluid 150 condenses into a liquid heat exchange fluid 150, the liquid heat exchange fluid 150 may be absorbed in the pore material 160 and move from the thermal energy output region (the region of the metal shell 120 adjacent to the heat sink 180) to the thermal energy input region (the region of the metal shell 120 adjacent to the electronic component 170) due to capillary phenomenon. In this way, the heat exchange fluid 150 can be repeatedly circulated in the metal shell 120, and the heat energy generated by the electronic component 170 can be continuously conducted from the electronic component 170 to the heat sink 180 for being discharged in the above manner.

The configuration of the pore material 160 facilitates circulation of the heat exchange fluid 150. In some embodiments, the pore material 160 has at least a first pore material 161 disposed on the first inner surface 121 to assist in the movement of the heat exchange fluid 150 in a horizontal direction (e.g., in the XY plane). In some embodiments, the first pore material 161 directly contacts the first inner surface 121 to conduct heat energy with the metal shell 120.

In embodiments where the first pore material 161 is present, the pore material 160 may further have a second pore material 162 disposed on the third inner surface 123. In this embodiment, the second porous material 162 may conduct thermal energy in a vertical direction (e.g., the Z-axis direction) or assist in moving the heat exchange fluid 150 in a vertical direction (e.g., the Z-axis direction). In embodiments where first pore material 161 and second pore material 162 are present, pore material 160 may further have a third pore material 163 disposed on second inner surface 122 to provide additional thermal energy conduction.

The enclosed space 124 of the metal shell 120 may determine the extent of the distribution of the heat exchange fluid 150, while the porous material 160 within the metal shell 120 may facilitate the flow and circulation of the heat exchange fluid 150. When the metal case 120 is disposed between the electronic component 170 and the heat sink 180 and thermally coupled to the electronic component, the metal case 120 can form a thermal conduction path between the electronic component 170 and the heat sink 180. In other words, the metal shell 120 can be adjusted according to the system design or the process requirements, thereby adjusting the thermal conduction path between the electronic device 170 and the heat sink 180.

In some embodiments, the thermal energy conduction path between the electronic component 170 and the heat sink 180 may be designed to extend in a horizontal direction (e.g., extend in an XY plane), as shown in fig. 1. In this embodiment, the front projection of the electronic component 170 may not overlap the front projection of the heat sink 180. In other words, the front projection of the electronic component 170 on the first inner surface 121 and the front projection of the heat sink 180 on the first inner surface 121 are separated from each other. Likewise, the orthographic projection of the first heat conductive post 141 may not overlap the orthographic projection of the second heat conductive post 142. Of course, in other embodiments not shown, the front projection of the electronic component 170 on the first inner surface 121 may overlap the front projection of the heat sink 180 on the first inner surface 121, which is still within the scope of the present disclosure.

Therefore, the enclosed space 124 of the metal shell 120, together with the heat exchange fluid 150 and the pore material 160, can provide a plurality of heat conduction paths to increase the design flexibility of the circuit board 100, and can also rapidly conduct the heat generated by the electronic component 170 to the heat sink 180 to increase the heat dissipation efficiency of the circuit board 100.

The circuit board 100 also includes a wiring layer 190. The insulating portion 110 electrically isolates the circuit layer 190 from the metal case 120, so that the circuit layer 190 is not electrically connected to the metal case 120. Therefore, the circuit layer 190 and the heat conduction path for transmitting the electrical signal do not affect each other to reduce the performance of the electronic device 170 or interfere with the operation of the electronic device 170, and also help to simplify the system design.

Fig. 3, 4, 5, 6, 7, and 8 are cross-sectional views illustrating various stages in the manufacture of a circuit board 100 in accordance with some embodiments of the present disclosure. The reference cross-sections of fig. 3, 4, 5, 6, 7 and 8 correspond to fig. 2A.

It should be noted that when the following embodiments are illustrated or described as a series of acts or events, the order of the description of the acts or events should not be limited, unless otherwise noted. For example, some operations or events may take on a different order than the present disclosure, some may occur simultaneously, some may not be employed, and/or some may be repeated. Furthermore, the actual process may require additional operations before, during, or after each step to complete the circuit board 100. Thus, the present disclosure may briefly describe some of the additional operations.

Referring to fig. 3, first, a recess 300 is formed in the first insulating portion 110A. The first insulating portion 110A is a multi-layered structure, and the second dielectric layer 112 and the third dielectric layer 113 shown in fig. 2A are formed in a subsequent process, and the second conductive pillars 142 (see the cross-sectional view of fig. 2B) may be formed in the first insulating portion 110A. The grooves 300 may be formed by laser drilling, mechanical drilling, other suitable techniques, or a combination thereof. In some embodiments, the metal layer 310A is distributed on the first insulating portion 110A. In some embodiments, metal layer 310B is disposed on the bottom surface of recess 300. In some embodiments, metal layer 310A and metal layer 310B are formed from different metal sheets.

Referring to fig. 4 and 5, a first metal sub-shell 500 is formed in the recess 300. In fig. 4, the step of forming the first metal sub-shell 500 may include conformally depositing metal along on the inner surfaces of the groove 300 such that the metal layer 400 is formed on the side surfaces of the groove 300. The deposition means may include evaporation, sputtering, electroplating, other suitable deposition techniques, or combinations thereof. For example, forming the metal layer 400 may include using an electroplating process. In embodiments employing an electroplating process, the metal layer 400 may be conformally deposited on the recess 300 by adjusting electroplating parameters (e.g., current density). In fig. 5, metal layer 310A is patterned to form wiring layer 190. The metal layer 400 and the metal layer 310B together form a first metal sub-case 500 within the recess 300, wherein the first metal sub-case 500 and the circuit layer 190 are separated from each other without electrical connection.

Referring to fig. 6, a first void material 161 is disposed within a first metal sub-shell 500. In detail, the first pore material 161 is disposed on the bottom surface of the first metal sub-case 500. In some embodiments, the first pore material 161 contacts the first metal sub-shell 500.

In some embodiments, the first void material 161 is flat and has a horizontal dimension (e.g., the dimension of the XY plane) that is the same or greater than the bottom surface of the first metal sub-shell 500, so that edges of the first void material 161 may be cut or abutted against sidewalls of the first metal sub-shell 500 to be secured in the first metal sub-shell 500. After disposing the first void material 161, the second void material 162 may be further disposed within the first metal sub-shell 500. The second pore material 162 is configured differently from the first pore material 161. For example, the second pore material 162 may be disposed on a sidewall of the first metal sub-shell 500.

With continued reference to fig. 6, a heat exchange fluid 150 is added to the first metal sub-shell 500. In detail, the heat exchange fluid 150 in a liquid state is added into the first metal sub-case 500. The volume or weight of the heat exchange fluid 150 in a liquid state added to the first metal sub-shell 500 depends on the product design, the application temperature range, and the working fluid material characteristics.

Referring to fig. 7, a second metal sub-case 700 is formed on the second insulating portion 110B. The second insulating portion 110B is the first dielectric layer 111 of fig. 2A, and the first heat conductive post 141 may be formed in the second insulating portion 110B, and the carrier layer 130 may be formed on the second insulating portion 110B.

The second metal sub-shell 700 may be formed by patterning a metal layer after depositing the metal layer. The deposition means may include evaporation, sputtering, electroplating, other suitable deposition techniques, or combinations thereof. For example, an electroplating process is used. In some embodiments, after forming the second metal sub-shell 700, the third pore material 163 is placed within the second metal sub-shell 700.

Referring to fig. 8, the structure of fig. 6 and the structure of fig. 7 are laminated. In detail, the first and second insulating parts 110A and 110B are pressed to form the insulating part 110, and the first and second metal sub-cases 500 (see fig. 6) and 700 (see fig. 7) are aligned with each other and combined into the metal case 120 having the closed space 124. After the lamination, the first pore material 161 and the heat exchange fluid 150 originally disposed in the first metal sub-shell 500 are both sealed in the closed space 124 of the metal shell 120. In some embodiments, the second porous material 162 is sealed in the metal shell 120. In some embodiments, the third porous material 163 is sealed in the metal shell 120.

After forming the metal shell 120, the configurable electronic component 170 is on the structure of fig. 8 (e.g., configured on the carrier layer 130) and the heat sink 180 is configured under the structure of fig. 8, thereby forming the circuit board 100 as shown in fig. 2A and 2B, wherein the circuit board 100 is as previously described and not described in detail herein.

Referring to fig. 9, fig. 9 illustrates a top view of a circuit board 200 according to other embodiments of the present disclosure. The circuit board 200 of fig. 9 is similar to the circuit board 100 of fig. 1, with the difference being the topography of the metal shell 220 of fig. 9. Since the position of the electronic component 170 and the position of the heat sink 180 are separated from each other in both the X-axis direction and the Y-axis direction, the morphology of the metal case 220 in the horizontal plane (e.g., in the XY plane) may have a bend to connect the electronic component 170 and the heat sink 180. For example, in fig. 9, the morphology of the metal shell 220 in the horizontal plane (e.g., in the XY plane) may be designed in an L-shape. Briefly, fig. 9 provides an exemplary configuration of a metal shell 220 to illustrate that the thermally conductive path between the electronic component 170 and the heat sink 180 may be non-linear with the use of the metal shell 220, the heat exchange fluid 150 (see fig. 2A), and the pore material 160 (see fig. 2A).

In view of the foregoing, embodiments of the present disclosure provide a circuit board with heat dissipation effect and a method for manufacturing the same, in which a metal shell with a closed space, a heat exchange fluid and a pore material are disposed in the circuit board to increase the configuration flexibility of a heat conduction path, thereby increasing the heat dissipation efficiency of the circuit board and improving the degree of freedom in the design and manufacturing process of the circuit board, so as to improve the performance of electronic components.

The foregoing generally describes features of several embodiments of the present disclosure, so that those of ordinary skill in the art may readily understand the present disclosure. It should be appreciated by those skilled in the art that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes and/or obtaining the same advantages of the embodiments of the present invention. Those skilled in the art should also realize that equivalent constructions do not depart from the spirit and scope of the invention, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Claims (18)

1. A circuit board, comprising:

an insulating part;

a carrier layer disposed on the insulating portion;

a metal shell disposed in the insulating portion and thermally coupled to the carrier layer, wherein the metal shell has:

a first inner surface;

a second inner surface opposite to the first inner surface, wherein the second inner surface is between the first inner surface and the carrier layer;

a third inner surface connecting the first inner surface and the second inner surface; and

a closed space surrounded by the first inner surface, the second inner surface and the third inner surface;

a heat exchange fluid distributed in the enclosed space; and

the first pore material is distributed in the closed space and is configured on the first inner surface.

2. The circuit board of claim 1, further comprising:

the electronic element is arranged on the bearing layer and is thermally coupled with the metal shell through the bearing layer, wherein the electronic element is not electrically connected with the metal shell; and

the heat dissipation piece is arranged below the metal shell and is thermally coupled with the metal shell, wherein the metal shell is positioned between the electronic element and the heat dissipation piece.

3. The circuit board of claim 2, wherein the front projection of the electronic component on the first inner surface and the front projection of the heat sink on the first inner surface are separated from each other.

4. The circuit board of claim 1, further comprising:

the first heat conduction column is arranged in the insulating part, connects the bearing layer and the metal shell and is positioned between the bearing layer and the metal shell.

5. The circuit board of claim 4, wherein the insulating portion comprises a first dielectric layer and a second dielectric layer, the metal shell is located between the first dielectric layer and the second dielectric layer, and the first conductive post is disposed in the first dielectric layer and thermally couples the carrier layer and the metal shell.

6. The circuit board of claim 5, further comprising:

the second heat conduction column is arranged in the second dielectric layer, connects the heat dissipation piece and the metal shell and is positioned between the heat dissipation piece and the metal shell.

7. The circuit board of claim 1, wherein the insulating portion completely encapsulates the metal shell.

8. The circuit board of claim 1, wherein the first porous material contacts the metal shell.

9. The circuit board of claim 1, wherein the heat exchange fluid comprises a liquid and a gas.

10. The circuit board of claim 1, further comprising:

and a second porous material disposed on the third inner surface.

11. The circuit board of claim 10, further comprising:

and a third porous material disposed on the second inner surface.

12. A method of manufacturing a circuit board, comprising:

forming a groove in the first insulating portion;

forming a first metal sub-shell in the groove;

disposing a first pore material within the first metal sub-shell;

adding a heat exchange fluid into the first metal sub-shell;

forming a second metal sub-shell on the second insulating part; and

and pressing the first insulating part and the second insulating part to enable the first metal sub-shell and the second metal sub-shell to form a metal shell with a closed space, wherein the heat exchange fluid and the first pore material are sealed in the closed space of the metal shell.

13. The method of manufacturing a circuit board of claim 12, wherein the method of forming the first metal sub-shell comprises conformally depositing metal along an inner surface of the recess.

14. The method of manufacturing a circuit board according to claim 12, further comprising:

before the first insulating part and the second insulating part are pressed, a second pore material is placed in the first metal sub-shell, wherein the position of the second pore material is different from that of the first pore material.

15. The method of manufacturing a circuit board according to claim 12, further comprising:

after forming the second metal sub-shell, a third pore material is placed within the second metal sub-shell.

16. The method of manufacturing a circuit board according to claim 12, further comprising:

forming a first heat conductive pillar in the first insulating portion; and

a second heat conductive pillar is formed in the second insulating portion.

17. The method of manufacturing a circuit board as defined in claim 16, further comprising:

and disposing an electronic component on the second insulating portion, wherein the second heat conductive post is thermally coupled to the electronic component and the second metal sub-case.

18. The method of manufacturing a circuit board as defined in claim 17, further comprising:

and disposing a heat sink under the first insulating portion, wherein the first heat conductive post is thermally coupled to the heat sink and the first metal sub-case, and an orthographic projection of the electronic component on the first metal sub-case and an orthographic projection of the heat sink on the first metal sub-case are separated from each other.

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