CN112839476A - Temperature equalizing part, terminal and forming method of temperature equalizing part - Google Patents

Temperature equalizing part, terminal and forming method of temperature equalizing part Download PDF

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Publication number
CN112839476A
CN112839476A CN201911157636.6A CN201911157636A CN112839476A CN 112839476 A CN112839476 A CN 112839476A CN 201911157636 A CN201911157636 A CN 201911157636A CN 112839476 A CN112839476 A CN 112839476A
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CN
China
Prior art keywords
cover plate
cavity
temperature equalizing
notch
thickness direction
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Pending
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CN201911157636.6A
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Chinese (zh)
Inventor
孙永富
施健
靳林芳
吴会鹏
胡锦炎
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Priority to CN201911157636.6A priority Critical patent/CN112839476A/en
Publication of CN112839476A publication Critical patent/CN112839476A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Telephone Set Structure (AREA)

Abstract

The application relates to the technical field of electronic products, in particular to a temperature-equalizing part, a terminal and a forming method of the temperature-equalizing part, wherein the temperature-equalizing part comprises a body part, the body part is provided with a first cavity, and the body part further comprises a channel communicated with the first cavity; the body part is provided with a notch, and the notch is positioned on at least one side of the channel along the thickness direction, so that the body part at least comprises a first matching surface and a second matching surface. By means of the temperature equalizing part, the terminal and the forming method of the temperature equalizing part, the stability of fixing the temperature equalizing part in a limited space is improved while the good heat dissipation effect of an electronic product can be guaranteed, and local tilting is avoided.

Description

Temperature equalizing part, terminal and forming method of temperature equalizing part
Technical Field
The application relates to the technical field of electronic products, in particular to a temperature equalizing part, a terminal and a forming method of the temperature equalizing part.
Background
Along with the mobile phone intelligent degree is higher and higher, more heat is produced in its dominant frequency upgrading, and too much heat causes the mobile phone temperature rise too high, has not only reduced the life of inside spare part, and heat transfer to cell phone case influences user's directly perceived experience moreover.
In order to solve the problem of heat dissipation of the mobile phone, the inside of the mobile phone is provided with the temperature equalizing part, and although the temperature equalizing part is added, the problem of difficulty in heat dissipation inside the mobile phone can be solved, the thickness of the mobile phone is correspondingly increased in order to ensure the stability of the temperature equalizing part fixed inside the mobile phone. According to the requirement of the thin whole mobile phone, the fixing space of the temperature equalizing part is limited due to the fact that the thickness of the whole mobile phone cannot be increased, and under the condition, when the temperature equalizing part is fixed in the mobile phone, the part, used for injecting liquid, of the temperature equalizing part is prone to being partially tilted compared with other parts, and the stability of the product is not facilitated.
Disclosure of Invention
The application aims to provide a temperature-equalizing part, a terminal and a forming method of the temperature-equalizing part, which can improve the stability of the temperature-equalizing part in a limited space and avoid local tilting while ensuring a better heat dissipation effect of a mobile phone.
In a first aspect, a temperature equalization member is provided, comprising: the device comprises a body part, a first cavity and a channel, wherein the body part is provided with the first cavity and the channel is communicated with the first cavity;
the body part is provided with a notch, and the notch is positioned on at least one side of the channel along the thickness direction, so that the body part at least comprises a first matching surface and a second matching surface.
Owing to correspond the setting of the breach of channel position, see from the thickness direction, the body thickness attenuate of breach part, when connecting through sticky fixed, in the part of body thickness attenuate, sticky thickness is thicker, simultaneously the first fitting surface and/or the second fitting surface of breach part can the direct contact viscose, thereby make the increase of adhesive area, consequently, can make the body bonding that corresponds the channel part more firm, thereby improve the stability that samming part is fixed in limited space when can guarantee the better radiating effect of cell-phone, avoid local perk.
In one possible design, the body portion includes, in a thickness direction, a first cover plate and a second cover plate;
the notch is located the first apron and/or the second apron.
In one possible design, the body portion includes, in a thickness direction, a first cover plate and a second cover plate;
the first cover plate at least partially extends out of the second cover plate along the width direction, so that the gap is formed between the first cover plate and the second cover plate; or the second cover plate at least partially extends out of the first cover plate, so that the gap is formed between the first cover plate and the second cover plate.
Through the cooperation form of two kinds of differences formation breach, satisfy different user demands, can be adapted to in the center of difference, improve the application scope of samming part.
In a possible design, the first cover plate is provided with a first recess, and/or the second cover plate is provided with a second recess, the first recess and/or the second recess forming the first cavity, the channel being provided in one of the first cover plate and the second cover plate.
In one possible design, the temperature equalization member further includes a bridge portion that protrudes outward with respect to the body portion in the width direction;
the width of the overlapping part is 0.5mm-2mm along the width direction.
When the number of the arranged channels is odd, the stability and the layering of the bonding part are better when the temperature equalizing part is matched with the middle frame. Or when the temperature equalizing component is fixed on the middle frame with the shoulder, the lapping part is arranged to be abutted against the shoulder so as to ensure the stability of the matching of the temperature equalizing component and the middle frame.
In a second aspect, a terminal is provided, where the terminal includes a middle frame and a temperature equalizing component, where the temperature equalizing component is any one of the above temperature equalizing components, the middle frame has a second cavity, and the temperature equalizing component is disposed in the second cavity and is fixedly connected to the middle frame.
Through the setting of this kind of samming part, the heat that can absorb the terminal production to when reaching the effect of cooling, the thickness of attenuate the center satisfies the demand of terminal thickness attenuate.
In one possible design, the temperature equalizing component is connected with the middle frame through an adhesive part, and the adhesive part comprises a first adhesive layer and a second adhesive layer;
along the thickness direction, the first bonding layer is positioned on the bottom wall of the second cavity, the first bonding layer at least covers the contact position of the body part and the bottom wall of the second cavity, the second bonding layer is arranged on the notch, and the second bonding layer is positioned between the body part and the first bonding layer; or,
along the thickness direction, first adhesive linkage is located the second cavity diapire, the second adhesive linkage set up in the breach, first adhesive linkage with the second adhesive linkage all glues in the second cavity diapire, the thickness of second adhesive linkage is greater than the thickness of first adhesive linkage. Can realize in limited space, when the samming part can realize better cooling effect, can avoid the local perk of samming part, break away from with the fixed of center.
In a possible design, the middle frame further includes a third cavity penetrating through the bottom wall of the second cavity, and the bonding portion includes a second bonding layer;
and a shoulder is formed between the third cavity and the second cavity along the thickness direction, and the first matching surface and the second matching surface are at least partially abutted against the shoulder and are fixedly connected through the second bonding layer.
In one possible design, the terminal further includes a support sheet, and the bonding portion further includes a first bonding layer;
the support sheet is fixedly connected with the body part through the first bonding layer, and the first bonding layer at least covers the position, in the body part, of the support sheet, which is in contact with the support sheet.
The second bonding layer is used for bonding the body part of the gap part and the middle frame, and the first bonding layer is used for fixing the part of the uniform temperature component, which is in contact with the support sheet, so that the uniform temperature component, the support sheet and the middle frame are bonded together firmly and are not easy to fall off.
In a third aspect, a method for forming a temperature equalization member is provided, the temperature equalization member comprising a body portion including a channel, the method comprising:
and processing a notch at the position of the body part corresponding to the channel along the thickness direction, so that the notch at least comprises a first matching surface and a second matching surface.
The temperature equalizing component is processed into a structure with different thicknesses, so that when the temperature equalizing component is matched with the middle frame, the adhesive area and the adhesive thickness of the part easy to tilt are increased, and the matched middle frame can be thinned on the basis of improving the firmness of adhesion.
In one possible design, the body portion includes, in a thickness direction, a first cover plate and a second cover plate;
processing the notch at the position of the body part corresponding to the channel along the thickness direction so that the notch at least comprises a first matching surface and a second matching surface, wherein the forming method comprises the following steps:
and machining the notch on the first cover plate and/or the second cover plate along the thickness direction.
In one possible design, the body portion includes, in the thickness direction, a first cover plate and a second cover plate;
along the thickness direction, the position of the body part corresponding to the channel is processed with the notch, so that the notch at least comprises a first matching surface and a second matching surface, and the forming method comprises the following steps:
and matching the first cover plate with the second cover plate, and enabling any one of the first cover plate and the second cover plate to at least partially protrude from the other one along the width direction, so that the gap is formed between the first cover plate and the second cover plate.
Through the form that first apron and second apron dislocation cooperation formed the breach, avoid adopting processing modes such as etching, punching press to process out the breach, reduced the processing step, reduced the processing degree of difficulty to practice thrift the cost.
The method can form the temperature equalizing part with different thicknesses without influencing the stability of the temperature equalizing part.
In a possible design, a plurality of support pillars are arranged in the first groove, and when the first groove is machined, the support pillars and the first groove are integrally formed in an etching mode. The processing quality is improved, the processing difficulty is reduced, and the processing cost is saved.
In one possible design, the body portion further has a first cavity, the channel being in communication with the first cavity; the molding method further includes:
and after the first cavity is injected with liquid and vacuumized through the channel, the channel is sealed. So as to ensure that the temperature equalizing part has better cooling effect.
In one possible design, before the first cover plate is matched with the second cover plate, a channel communicated with the first cavity is machined in the first cover plate and/or the second cover plate. The setting of this passageway can be adjusted according to actual conditions, satisfies different user demands.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
Fig. 1 is an exploded cross-sectional view of a terminal according to an embodiment of the present application, wherein H indicated by an arrow is a thickness direction of a temperature equalizing member;
fig. 2 is an exploded cross-sectional view of another terminal according to an embodiment of the present application;
fig. 3 is an exploded cross-sectional view of another terminal according to an embodiment of the present application;
fig. 4 is an exploded cross-sectional view of another terminal according to an embodiment of the present application;
fig. 5 is a cross-sectional view of a temperature equalizing member formed by combining a first cover plate and a second cover plate into a notch according to an embodiment of the present disclosure, where H is a thickness direction of the temperature equalizing member and W is a width direction of the temperature equalizing member;
FIG. 6 is a cross-sectional view of another temperature equalization member with a gap formed by combining a first cover plate and a second cover plate according to an embodiment of the present disclosure;
FIG. 7 is a sectional view of another temperature equalization member with a gap combined by a first cover plate and a second cover plate according to an embodiment of the present application;
FIG. 8 is a cross-sectional view of another embodiment of a temperature equalization member with a gap formed by a first cover plate and a second cover plate;
fig. 9 is a cross-sectional view of a temperature equalizing member with a notch formed in a first cover plate and/or a second cover plate according to an embodiment of the present disclosure;
FIG. 10 is a cross-sectional view of another temperature equalization member with a notch formed in the first cover plate and/or the second cover plate according to an embodiment of the present disclosure;
fig. 11 is a cross-sectional view of a temperature equalizing member with a notch formed in a first cover plate and/or a second cover plate according to an embodiment of the present disclosure;
fig. 12 is a schematic structural view of the body portion formed by pressing the tubes, where H indicated by an arrow is a thickness direction of the temperature equalizing member, and W is a width direction of the temperature equalizing member; fig. 13 is a schematic view illustrating a processing procedure of a temperature equalizing member in step S1 according to an embodiment of the present disclosure;
fig. 14 is a schematic view illustrating a processing procedure of a temperature equalizing member in step S2 according to an embodiment of the present disclosure;
fig. 15 is a schematic view illustrating a processing procedure of a temperature equalizing member in step S3 according to an embodiment of the present disclosure;
fig. 16 is an exploded view of a terminal according to an embodiment of the present application;
FIG. 17 is a schematic structural diagram of a temperature equalization component according to an embodiment of the present disclosure;
FIG. 18 is an enlarged view of a portion A of FIG. 17;
FIG. 19 is a schematic structural diagram of another temperature equalization component provided in an embodiment of the present application;
fig. 20 is a schematic structural view of another temperature equalizing member according to an embodiment of the present application, wherein the direction indicated by the arrow is the length direction of the temperature equalizing member.
Reference numerals:
1-a soaking part; 2-middle frame; 21-a second cavity; 22-a third cavity; 3-an adhesive part; 31-a first adhesive layer; 32-a second adhesive layer; 4-a body portion; 41-a first cover plate; 411-a first groove; 412-support column; 413-notch; 413 a-a first mating surface; 413 b-a second mating surface; 413 c-a first length; 413 d-a second length; 413 e-locating holes; 42-a second cover plate; 421-a second groove; 43-a first cavity; 44-a capillary structure; 45-channel; 46-a lap joint; 47-sealing face; 5-a battery compartment; 6-a heat generating portion; 7-upper shell; 8-a support sheet; 9-chip; 10-circuit board.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Detailed Description
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
An embodiment of the present application provides a terminal, which is a device for communicating with a host, and may be an electronic device that needs internal heat dissipation, such as a mobile phone and a tablet computer, and is not limited specifically herein.
Hereinafter, a mobile phone will be described in detail as an example, and as shown in fig. 1, 2, 3, 4, and 16, the terminal includes a middle frame 2 and a temperature equalizing member, and when the temperature equalizing member is applied to the mobile phone, the parts are integrally mounted with reference to the middle frame 2. The structure of the middle frame 2 is shown in fig. 1, the middle frame 2 is provided with a second cavity 21, and the temperature equalizing component is arranged in the second cavity 21 and fixedly connected with the middle frame 2. When the battery pack is mounted, the temperature equalizing member is placed in the second cavity 21 and connected to the middle frame 2 through the adhesive portion 3, and along the thickness direction H (as indicated by an arrow in fig. 1), a temperature equalizing portion 1 (generally, a heat conductive sheet such as graphite) is provided on one side of the middle frame 2, the temperature equalizing portion 1 covers at least the second cavity 21, and a battery compartment 5 for mounting a battery and a heat generating portion 6 are provided on the other side and are sealed by the upper case 7. And the matched terminal is arranged, and the temperature equalizing part, the battery bin 5, the heating part 6 and other parts are arranged on two sides of the middle frame 2, so that the parts, such as the battery, the heating part 6 and the like, which can generate large heat can be radiated through the corresponding temperature equalizing part during operation, and the service effect and the service life of the mobile phone are ensured.
In addition, the middle frame 2 may also be a structure as shown in fig. 3, on the basis of having the first cavity 21, the middle frame 2 further includes a third cavity 22 penetrating through the bottom of the second cavity 21, one of the third cavity 22 and the second cavity 21 is provided with a support sheet 8 (which may be a copper sheet or may be another structure capable of conducting heat), and the support sheet 8 isolates the temperature equalizing component disposed in the second cavity 21 and/or the third cavity 22 from the chip 9, the circuit board 10 and the like disposed outside the middle frame 2, so that the temperature equalizing component is mounted in the middle frame 2, and the heat generated by the chip 9 and the circuit board 10 is dissipated by the temperature equalizing component.
In a possible design, when the support sheet 8 is used to isolate the temperature equalization member from other components, at least a portion of the support sheet 8 may abut against the middle frame 2 (as shown in fig. 4), or may abut against the middle frame 2 through the temperature equalization member after being connected to the temperature equalization member (as shown in fig. 3), as long as it is ensured that the middle frame 2 can also play a role of support while connecting corresponding components, and no specific limitation is made herein.
It should be noted that the structure of the middle frame 2 and the matching position of the middle frame 2 and each connected matching component may also be in other forms, as long as the temperature equalizing component and other components can be better installed to realize the heat dissipation of the temperature equalizing component to the component generating heat, and the structure is not particularly limited herein.
With continuous optimization of electronic products such as mobile phones and the like, the designed thickness of the electronic products is thinner and thinner, and in order to adapt to the situation, temperature equalizing components used for heat dissipation in the electronic products need to be installed in a limited space, and good heat dissipation effect on corresponding components can be guaranteed. After the temperature equalizing member is integrally thinned, when the temperature equalizing member is mounted on the middle frame 2, because the temperature equalizing member includes the body portion 4, the body portion 4 has a first cavity 43, the body portion 4 further includes a channel 45 communicated with the first cavity 43, and the first cavity 43 is a vacuum cavity in which a capillary structure 44 is built and a working medium (generally, pure water) is injected. The capillary structure 44 may be a honeycomb structure with micropores formed by machining, and may be sintered copper powder, grooves, sintered mesh, etc., which is not limited herein. The capillary structure 44 can store the working medium injected into the first cavity 43, when the temperature equalizing part is used, the outer wall of the temperature equalizing part on one side provided with the capillary structure 44 is in contact fit with the heat source part, so that heat transfer is performed, after the heat generating part generates heat, the temperature equalizing part on one side in contact with the heat absorbs the heat and transfers the heat to the capillary structure 44 in the first cavity 43, so that the working medium in the vacuum first cavity 43 is heated to form steam, the steam can be diffused to a low-pressure area (namely a low-temperature area) from a high-pressure area by utilizing the latent heat of the steam, and the steam can be rapidly condensed into a liquid state and release heat energy when contacting the inner wall with lower temperature; the condensed liquid working medium returns to the heat source by the capillary force of the capillary structure 44, thereby completing a heat conduction cycle, forming a two-way circulation system with two coexisting vapor and liquid phases of the working medium, and the internal pressure of the first cavity 43 can be kept balanced with the change of the temperature.
The arrangement of the channel 45 is used for injecting liquid into the first cavity 43 and vacuumizing the first cavity, and the number of the channels 45 can be 1 or more, and can be adaptively adjusted according to actual requirements.
Among the temperature equalizing components, the arrangement of the channels 45 weakens the structure of the temperature equalizing components at the corresponding channel 45 parts and is easy to deform, so when the temperature equalizing components are fixedly connected with the middle frame 2 through the bonding parts 3, the temperature equalizing components provided with the channels 45 are easy to tilt up, so that the temperature equalizing components are separated from the bonding parts 3, the contact area of the middle frame 2 or the supporting sheets 8 which are connected with the bonding parts is reduced, the heat absorbed by the temperature equalizing components from the heating parts such as the chip 9 and the heating part 6 is reduced, and the heat dissipation effect is further influenced.
In view of the situation that such a temperature equalizing member is easily tilted locally, the embodiment of the present application improves the temperature equalizing member accordingly, as shown in fig. 5, the main body has a notch 413, and the notch 413 is located on at least one side of the channel 45 along the thickness direction, so that the main body 4 at least includes a first mating surface 413a and a second mating surface 413b, and the first mating surface 413a and the second mating surface 413b are located on different planes or different curved surfaces.
In one possible design, as shown in fig. 5, 17 and 18, the first mating face 413a and the second mating face 413b may be planes perpendicular to each other, and the plane in which the second mating face 413b is located is arranged along the thickness direction H of the body portion 4 in the thickness direction H. In the cross section of the body portion 4, the second mating face 413b has a first length 413c along the thickness direction H, the first mating face 413a has a second length 413d along the width direction W, the second length 413d is greater than or equal to the first length 413c, and the ratio of the first length 413c to the thickness of the body portion 4 is between 1/3-2/3, which is 1/2. The first length 413c and the second length 413d are different, and the ratio of the first length 413c to the second length 413d is between 1/5-4/5, optionally 1/5.
The body portion 4 of the temperature equalizing member, which is provided with the passage 45 in the thickness direction H, is thinned by providing the corresponding notch 413 at a position corresponding to the passage 45, and the first mating surface 413a and the second mating surface 413b are formed at the same time. When the middle frame 2 is connected with the temperature equalizing component, at least part of the gap 413 can be filled with the bonding part 3, so that the bonding part 3 positioned at the part of the gap 413 is more than other parts along the thickness direction H, and the bonding area is increased at the part which is easy to be tilted through the first matching surface 413a and the second matching surface 413b, so that the part is more firmly fixed. Therefore, the stability of fixing the temperature equalizing part in a limited space can be improved while the better heat dissipation effect of the mobile phone can be ensured, and the local tilting is avoided.
Specifically, the bonding portion 3 includes a first bonding layer 31 and a second bonding layer 32, and when the temperature equalization member with the notch 413 is fixedly connected to the middle frame 2 through the bonding portion 3, the specific structure thereof is matched as follows:
when the temperature equalizing member is fixedly connected to the middle frame 2 having only the second cavity 21, the first adhesive layer 31 and the second adhesive layer 32 may be disposed at positions, as shown in fig. 1, along the thickness direction H, where the first adhesive layer 31 is located on the bottom wall of the second cavity 21, the first adhesive layer 31 covers at least a position where the body portion 4 contacts with the bottom wall of the second cavity 21, the second adhesive layer 32 is disposed at the notch 413, and the second adhesive layer 32 is located between the body portion 4 and the first adhesive layer 31. The bonding mode is not obvious in boundary distinction between the first bonding layer 31 and the second bonding layer 32, and the bonding between the temperature equalizing component and the middle frame 2 can be quickly and conveniently realized.
In a possible design, when the temperature equalizing member is fixedly connected to the middle frame 2 having only the second cavity 21, the first adhesive layer 31 and the second adhesive layer 32 may also be disposed at positions, as shown in fig. 2, along the thickness direction H, where the first adhesive layer 31 is located on the bottom wall of the second cavity 21, the second adhesive layer 32 is disposed at the notch 413, the first adhesive layer 31 and the second adhesive layer 32 are both adhered to the bottom wall of the second cavity 21, and the thickness of the second adhesive layer 32 is greater than that of the first adhesive layer 31. When samming part bonds with second cavity 21 diapire, along thickness direction H, breach 413 is towards second cavity 21 diapire, in order to guarantee the stability of bonding, all directly with second cavity 21 diapire fixed connection with first adhesive linkage 31 and second adhesive linkage 32, makes first adhesive linkage 31 and second adhesive linkage 32 not influenced each other, avoids that one of them bonding effect is not good and makes the samming part wholly drop from 2 diapalls of second cavity.
No matter which kind of bonding form of adoption above-mentioned, the homoenergetic can be realized in limited space, and when the samming part can realize better cooling effect, can avoid the local perk of samming part, break away from with the fixed of center.
In addition, as shown in fig. 3, the middle frame 2 further has a third cavity 22, the third cavity 22 penetrates through the bottom wall of the second cavity 21, a shoulder is formed between the third cavity 22 and the second cavity 21 along the thickness direction H, and when the temperature equalizing member is fixedly connected in the second cavity 21 and the third cavity 22 penetrating through the middle frame 2, the first mating surface 413a and the second mating surface 413b at least partially abut against the shoulder and are fixedly connected through the second adhesive layer 32. The support sheet 8 is fixedly connected to the body portion 4 through the first adhesive layer 31, and the first adhesive layer 31 covers at least a position of the body portion 4 contacting the support sheet 8 in the thickness direction H.
The second adhesive layer 32 is used for adhering the body part 4 of the notch 413 part to the middle frame 2, and the first adhesive layer 31 is used for fixing the part of the temperature-equalizing part, which is in contact with the support sheet 8, so that the temperature-equalizing part, the support sheet 8 and the middle frame 2 are adhered to each other firmly and are not easy to fall off.
In the above, the first adhesive layer 31 and the second adhesive layer 32 are matched differently to adapt to different structures of the middle frame 2, and the purpose of the adhesive is to increase the adhesive area of the easy-to-tilt part in the limited space of the middle frame 2, so that the adhesion is firmer. Therefore, when the middle frame 2 and the temperature equalizing component are bonded, the first adhesive layer 31 and the second adhesive layer 32 can be adaptively adjusted according to different conditions, so long as the portion of the notch 413 which is arranged is larger in adhesive area and thicker in adhesive, so that the portion is more firmly bonded, and local tilting is avoided.
In a possible design, in order to make the temperature equalizing member capable of meeting the matching requirements of different electronic products, as shown in fig. 17 and 20, along the length direction of the main body 4 (as indicated by an arrow in fig. 20), the length of the main body 4 where the passage 45 is provided and the thickness of the reduced thickness portion is the same as or different from the length of the main body 4, which is not specifically limited herein, and the following description will be specifically made by taking the same length as the following two as an example:
as a specific embodiment, as shown in fig. 5 to 11 (the direction H indicated by the arrow is the thickness direction, and W is the width direction of the temperature equalizing member), in order to avoid the occurrence of defects such as leakage of the temperature equalizing member by erroneously damaging the sealing property of the first cavity 43 when the notch 413 is machined, and to enable the temperature equalizing member to be fitted to the middle frame 2 having a different structure, the specific structure of the temperature equalizing member will be described in detail below, in which the body portion 4 includes the first cover plate 41 and the second cover plate 42 in the thickness direction H;
specifically, as shown in fig. 9, 10 and 11, a notch 413 is formed in the main body 4, so that the main body 4 is not thick, and the notch 413 is located in the first cover plate 41 and/or the second cover plate 42. After the first cover plate 41 and the second cover plate 42 are connected, the body portion 4 formed by the first cover plate 41 and the second cover plate 42 may be a regular rectangular parallelepiped structure, on this basis, the notch 413 is provided for the first cover plate 41 or the second cover plate 42 provided with the channel 45, while the uniform temperature component is not of equal thickness, the contact area of the first cover plate 41 and the second cover plate 42 is large, and the width of the sealing surface 47 reserved on the two side walls of the first cavity 43 and used for sealing and connecting the first cover plate 41 and the second cover plate 42 is at least greater than or equal to the thickness of the second cover plate 42 of the first cover plate 41 or 1/2 of 1/2 along the width direction W, thereby ensuring better sealing effect when the first cover plate 41 and the second cover plate 42 are connected.
In a possible design, the notch 413 may also be formed by different matching forms of the first cover plate 41 and the second cover plate 42, so that the notch 413 is not directly machined on the first cover plate 41 and/or the second cover plate 42, and the machining cost is saved. As shown in fig. 4, 5 and 6, the first cover plate 41 at least partially extends beyond the second cover plate 42 along the width direction W, so that a gap 413 is formed between the first cover plate 41 and the second cover plate 42; alternatively, the second cover plate 42 extends at least partially beyond the first cover plate 41 such that a gap 413 is formed between the first cover plate 41 and the second cover plate 42. According to the number of the channels 45, when the first cover plate 41 and the second cover plate 42 are matched, the corresponding positions of the first cover plate 41 and the second cover plate 42 are adaptively adjusted, so that the corresponding positions of the channels 45 can form corresponding notches 413 through the matching of the first cover plate 41 and the second cover plate 42.
The first cover plate 41 and the second cover plate 42 may have the same or different structures, and are adaptively adjusted according to the number of the channels 45 and the position requirement of the notches 413, which is not specifically limited herein.
It should be emphasized here that when the first cover plate 41 and the second cover plate 42 are formed with the notches 413 in a staggered manner, the width of the sealing surface 47 formed on one side by the sealing engagement is greater than or equal to 1/2, and the thickness of the second cover plate 42 of the first cover plate 41 or 1/2. After the respective cut-outs 413 have been produced in the first cover plate 41 and/or the second cover plate 42, the first cover plate 41 and the second cover plate 42 are aligned in the thickness direction H and then sealingly connected, and the width of the single-sided sealing surface 47 formed by the sealing engagement is likewise greater than or equal to 1/2 of the thickness of the second cover plate 42 of the first cover plate 41 or 1/2. Also, in one possible design, the width of the one-sided sealing surface 47 is between 1 and 3 times the thickness of the first cover plate 41 or the second cover plate 42. The thickness reduction of the position of the channel 45 for injecting liquid and vacuumizing is realized in different forms of arranging the notch 413, the sealing effect between the first cover plate 41 and the second cover plate 42 cannot be influenced by the arrangement of the notch 413, and the use performance of the temperature equalizing component is ensured.
More specifically, no matter which type of arrangement of the notch 413 is adopted, in order to realize the heat dissipation performance of the temperature equalizing component, the first cover plate 41 is provided with a first groove 411, and/or the second cover plate 42 is provided with a second groove 421, the first groove 411 and/or the second groove 421 form the first cavity 43, and the channel 45 is arranged on one of the first cover plate 41 and the second cover plate 42. When the first cover 41 is provided with the first recess 411, the first recess 411 and the second cover 42 enclose the first cavity 43 after the first cover 41 is matched with the second cover 42, or when the second cover 42 is provided with the second recess 421, the second recess 421 and the first cover 41 enclose the first cavity 43 after the first recess 421 is matched with the second cover 42, or when the first cover 41 is provided with the first recess 411 and the second cover 42 is provided with the second recess 421, the first recess 411 and the second recess 421 enclose the first cavity 43 after the first cover 41 is matched with the second cover 42. Meanwhile, the channel 45 communicates the first cavity 43 with the outside, so that the first cavity 43 is vacuumized, injected with liquid working medium and the like through the channel 45, and a temperature equalizing part with a heat dissipation function is formed.
It should be emphasized that, according to different requirements, the combination of the first recess 411 and/or the second recess 421 for forming the first cavity 43 is not limited, and the first recess 411 and the second recess 421 may be configured as the same recess, or may be different recesses, as long as it can be ensured that the formed first cavity 43 is communicated with the outside only through the channel 45 when the first cover plate 41 and the second cover plate 42 are mated.
In addition, as shown in fig. 8, when the number of the passages 45 is odd, the temperature equalizing member further includes a bridging portion 46, and the bridging portion 46 protrudes outward relative to the main body portion 4 in the width direction W, in order to improve the stability when the temperature equalizing member is fitted to the middle frame 2 and the layering of the adhesive portion 3; so as to improve the stability of matching and the firmness of bonding. In one possible design, the width of the bridge 46 may be 0.5-2mm in the width direction W, for example, the width of the bridge 46 may be 0.6mm, 2mm, etc. Of course, the width of the bridging portion 46 may be different according to the kind and size of the electronic device, i.e. the width of the bridging portion 46 is not limited to 0.5-2 mm.
Specifically, the bridging portion 46 is located on the first cover plate 41 and/or the second cover plate 42, and the bridging portion 46 may be integrally formed with the body portion 4, or may be connected by welding or the like, which is not limited herein. Wherein, when the bridging portion 46 is integrally formed with the main body portion 4, and the bridging portion 46 is located on the first cover plate 41 or the second cover plate 42, the bridging portion 46 can be formed by the dislocation fit of the first cover plate 41 and the second cover plate 42, so as to form the bridging portion 46 protruding outward from the main body portion 4. Alternatively, when the bridging portion 46 is located on the first cover plate 41 and/or the second cover plate 42, the bridging portion 46 may be implemented by machining corresponding slots on the first cover plate 41 and the second cover plate 42. It should be emphasized here that the position of the overlapping portion 46 disposed on the first cover plate 41 and/or the second cover plate 42 and the thickness of the overlapping portion 46 along the thickness direction H are adjusted accordingly by the position and thickness of the notch 413 symmetrically disposed thereon, so long as it is ensured that the temperature equalizing member can be smoothly connected in the middle frame 2 when the notch 413 and the groove respectively abut against the shoulder when the middle frame 2 is fitted.
In a possible design, as shown in fig. 19, the first mating surface 413a is provided with a positioning hole 413e along the thickness direction H, and the positioning hole 413e can be used for positioning when the main body 4 is machined or when the main body is fixedly connected with a component such as the middle frame 2, so as to ensure better mating accuracy and avoid deviation. It should be emphasized that the positions and the number of the positioning holes 413e located on the first mating surface 413a are not particularly limited as long as the positions of the passages 45 can be avoided and the interference with the provided passages 45 is avoided. The positioning hole 413e arranged on the first matching surface 413a can improve the positioning accuracy, and meanwhile, the sealing performance inside the first cavity 43 cannot be damaged, and the space of the first cavity 43 is reduced to reduce the heat dissipation performance, so that the good heat dissipation effect of the temperature equalizing part is ensured.
As shown in fig. 13, 14 and 15, the embodiment of the present application further provides a forming method suitable for such a temperature equalization part with different thicknesses: the molding method comprises the following steps: along the thickness direction H, the main body 4 is formed with a notch 413 at a position corresponding to the channel 45, so that the notch 413 includes at least a first mating surface 413a and a second mating surface 413 b. The temperature equalizing part is processed into a structure with different thicknesses, so that when the temperature equalizing part is matched with the middle frame 2, the adhesive area of the part easy to warp is increased, and the matched middle frame 2 can be thinned on the basis of improving the bonding firmness.
In order to machine the notch 413 at the corresponding position without affecting the stability of the temperature equalizing member, the main body 4 includes a first cover plate 41 and a second cover plate 42 along the thickness direction H, and the machining method may specifically include: along the thickness direction H, a notch 413 is machined in the first cover plate 41 and/or the second cover plate 42, and the first cover plate 41 and the second cover plate 42 are matched.
In another specific embodiment, the molding method may also include: the notch 413 is formed by the first cover plate 41 and the second cover plate 42 being fitted in a staggered manner, that is, the first cover plate 41 and the second cover plate 42 are fitted together, and either one of the first cover plate 41 and the second cover plate 42 is at least partially protruded from the other in the width direction W, so that the notch 413 is formed between the first cover plate 41 and the second cover plate 42. The notch 413 is formed by the first cover plate 41 and the second cover plate 42 in a staggered matching mode, the notch 413 is prevented from being machined by adopting machining modes such as etching and stamping, machining steps are reduced, machining difficulty is reduced, and therefore cost is saved.
In any of the above-described manners to form the notch 413, before the notch 413 is machined in the main body 4, the molding method may further include step S1: as shown in fig. 13, a first cover plate 41 and a second cover plate 42 (which may be the same cover plate or different cover plates according to requirements) are selected, a first groove 411 is formed in the first cover plate 41 and/or a second groove 421 is formed in the second cover plate 42 according to requirements, so as to form a first cavity 43 through the matching of the corresponding grooves, and meanwhile, a required channel 45 is formed in the corresponding first cover plate 41 and/or second cover plate 42, so that the channel 45 is communicated with the first cavity 43 and the outside.
In a possible design, in this step, the capillary structure 44 is required in the first cavity 43, in order to reduce the vibration of the capillary structure 44 in the first cavity 43, the second groove 421 of the second cover plate 42 is used for placing the capillary structure 44, and a plurality of support pillars 412 are arranged in the first groove 411 of the first cover plate 41 to support the capillary structure 44.
In addition, when the capillary structure 44 is connected to the second cover plate 42 by sintering or the like, the plurality of support pillars 412 provided on the first cover plate 41 may also serve to support the upper and lower cover plates during vacuum pumping, so as to avoid the recess.
In the above steps, in order to improve the processing efficiency and the quality of the formed structure, the first groove 411, the second groove 421, the notch 413, and the support pillar 412 disposed in the first groove 411 may be processed by etching, stamping, electroplating, depositing, and the like, so that the first groove 411 and the support pillar 412 are integrally formed.
After completion of step S1, as shown in fig. 12, step S2 is performed: the notch 413 is formed at a position of the main body 4 corresponding to the channel 45, and the notch 413 may be formed in two different forms, and the formation of the first cavity 43 is not affected by the arrangement of the notch 413.
After completion of step S2, as shown in fig. 15, step S3 is performed: along the thickness direction H, the capillary structure 44 is placed in the second groove 421, and then the first cover plate 41 and the second cover plate 42 are in sealing fit to seal the first cavity 43, thereby forming the temperature equalization part.
Wherein a channel 45 communicating with the first cavity 43 is machined in the first cover plate 41 and/or the second cover plate 42 before the first cover plate 41 is mated with the second cover plate 42. The setting of this passageway 45 can be adjusted according to actual conditions, satisfies different user demands. Generally, for the convenience of processing and saving processing cost, the channel 45 is divided into two parts and respectively disposed on the first cover plate 41 and the second cover plate 42, and when the first cover plate 41 and the second cover plate 42 are mated, the channel 45 is combined to form a through hole communicated with the first cavity 43.
In another embodiment, as shown in fig. 12, the main body 4 may also be a heat pipe with a tubular structure, and in one possible design, the heat pipe may be a round pipe or a flat pipe, and after the capillary structure 44 is placed in the heat pipe to form a uniform temperature component with different thicknesses, the two ends of the heat pipe are rolled and thinned along the length direction of the heat pipe (i.e., the width direction W of the main body 4 shown in fig. 12), so that the inner wall surfaces of the heat pipe are attached to form the notch 413. The main body 4 is assembled to the center frame 2, thereby achieving the overall thinning. In a possible design, in order to ensure the stability of the fitting between the flat tubular body portion 4 and the middle frame 2, the surfaces of the flat tubes may be subjected to a pressing process, so that the surfaces of the body portion 4 after the pressing process are flat.
In addition, in the process of grinding and thinning both ends of the tube, in order to vacuumize and inject liquid into the body portion 4, the grinding and thinning at least includes two steps: firstly, the two ends of the pipe are pressed, and the channels 45 are reserved at the two ends through a mould and the like in the pressing process, so that only the channels 45 are communicated with the outside and the inner cavity of the pipe after the pressing process. After the inside is injected with liquid and vacuumized through the channel 45, the two ends of the tube are further pressed to seal the channel 45, so that the temperature equalizing part with different thicknesses is formed.
In order to form the temperature equalizing member with the temperature reducing function, the method further includes step S4, in which the first cavity 43 is filled with liquid and evacuated through the passage 45, and then the passage 45 is sealed. In a possible design, when the channel 45 is sealed, the channel 45 may be directly sealed by laser welding, TIG welding, resistance welding, or the like, or the channel 45 may be sealed by at least partially coating an adhesive such as glue inside the channel 45 and then pressing the temperature equalizing member at the corresponding channel 45 portion in the thickness direction, or the combination of the above-mentioned direct sealing and pressing sealing is not limited herein.
In one possible design, when the main body 4 has a plurality of passages 45, there is a possibility that some of the passages 45 may interfere with the inner fitting portion of the inner frame 2, and in order to avoid such a problem, the main body 4 provided with the passages 45 where interference occurs may be press-bent adaptively according to the structure of the inner frame 2 fitted with the temperature equalizing member after the passages 45 are sealed by laser welding, TIG welding, resistance welding, or the like.
In summary, with the temperature equalizing member provided by the present application, due to the provision of the notch 413 corresponding to the position of the channel 45, when the terminal is formed by fixedly connecting the adhesive part 3 and the inside of the mobile phone, the thickness of the adhesive is thicker at the part with the thinner main body part 4, and the first mating surface 413a and the second mating surface 413b of the notch 413 can directly contact the adhesive, so that the adhesive area is increased, and the main body part 4 corresponding to the channel 45 can be adhered more firmly. Therefore, the stability of fixing the temperature equalizing part in a limited space can be improved while the better heat dissipation effect of the mobile phone can be ensured, and the local tilting is avoided.
By forming the uniform-thickness part by the forming method provided by the application, the notch 413 can be arranged, and the sealing performance of the first cavity 43 can be prevented from being damaged by mistake when the notch 413 is processed, so that the uniform-thickness part has defects such as leakage and the like.
It should be noted that a portion of this patent document contains material which is subject to copyright protection. The copyright owner reserves the copyright rights whatsoever, except for making copies of the patent files or recorded patent document contents of the patent office.

Claims (13)

1. A temperature uniforming member, characterized in that the temperature uniforming member comprises a body portion (4), the body portion (4) having a first cavity (43), the body portion (4) further comprising a passage (45) communicating with the first cavity (43);
the body part is provided with a notch which is positioned on at least one side of the channel along the thickness direction, so that the body part (4) at least comprises a first matching surface (413a) and a second matching surface (413 b).
2. Temperature equalizing member according to claim 1, characterized in that said body portion (4) comprises, in the thickness direction, a first cover plate (41) and a second cover plate (42);
the notch (413) is located in the first cover plate (41) and/or the second cover plate (42).
3. Temperature equalizing member according to claim 1, characterized in that said body portion (4) comprises, in the thickness direction, a first cover plate (41) and a second cover plate (42);
the first cover plate (41) at least partially extends out of the second cover plate (42) along the width direction, so that the gap (413) is formed between the first cover plate (41) and the second cover plate (42); alternatively, the second cover plate (42) extends at least partially beyond the first cover plate (41) such that the gap (413) is formed between the first cover plate (41) and the second cover plate (42).
4. A temperature equalizing member according to claim 2 or 3, characterized in that the first cover plate (41) is provided with a first recess (411) and/or the second cover plate (42) is provided with a second recess (421), the first recess (411) and/or the second recess (421) forming the first cavity (43), the channel (45) being provided in one of the first cover plate (41) and the second cover plate (42).
5. The temperature equalization member as claimed in any one of claims 1 to 3, further comprising a bridging portion (46), wherein the bridging portion (46) protrudes outwardly with respect to the body portion (4) in a width direction;
the width of the overlapping part (46) along the width direction is between 0.5mm and 2 mm.
6. A terminal, comprising a middle frame (2) and a temperature equalizing component, wherein the temperature equalizing component is the temperature equalizing component of any one of claims 1 to 5, the middle frame (2) is provided with a second cavity (21), and the temperature equalizing component is arranged in the second cavity (21) and is fixedly connected with the middle frame (2).
7. A terminal according to claim 6, characterized in that said temperature equalizing member is connected to said middle frame (2) by means of an adhesive portion (3), said adhesive portion (3) comprising a first adhesive layer (31) and a second adhesive layer (32);
the first adhesive layer (31) is positioned on the bottom wall of the second cavity (21) along the thickness direction, the first adhesive layer (31) at least covers the position where the body part (4) is contacted with the bottom wall of the second cavity (21), the second adhesive layer (32) is arranged on the notch (413), and the second adhesive layer (32) is positioned between the body part (4) and the first adhesive layer (31); or,
along the thickness direction, first adhesive linkage (31) are located second cavity (21) diapire, second adhesive linkage (32) set up in breach (413), first adhesive linkage (31) with second adhesive linkage (32) all glue in second cavity (21) diapire, the thickness of second adhesive linkage (32) is greater than the thickness of first adhesive linkage (31).
8. A terminal according to claim 6, characterized in that said middle frame (2) further comprises a third cavity (22) extending through the bottom wall of said second cavity (21), said adhesive portion (3) comprising a second adhesive layer (32);
a shoulder is formed between the third cavity (22) and the second cavity (21) along the thickness direction, and the first matching surface (413a) and the second matching surface (413b) are at least partially abutted against the shoulder and fixedly connected through the second adhesive layer (32).
9. A terminal according to claim 8, characterized in that the terminal further comprises a support sheet (8), the adhesive part (3) further comprising a first adhesive layer (31);
the support sheet (8) is fixedly connected with the body part (4) through the first bonding layer (31), and the first bonding layer (31) at least covers the position, in the body part (4), of the support sheet (8) in contact with the support sheet (8) along the thickness direction.
10. A method of forming a temperature uniforming member including a body portion (4), the body portion (4) including a channel (45), the method comprising:
and machining a notch (413) on the position of the body part (4) corresponding to the channel (45) along the thickness direction, so that the notch (413) at least comprises a first matching surface (413a) and a second matching surface (413 b).
11. The method of forming a temperature equalizing member as claimed in claim 10, wherein said body portion (4) comprises a first cover plate (41) and a second cover plate (42) in a thickness direction;
when the notch (413) is machined at the position of the body part (4) corresponding to the channel (45) along the thickness direction, so that the notch (413) at least comprises a first matching surface (413a) and a second matching surface (413b), the forming method comprises the following steps:
the notches (413) are machined in the first cover plate (41) and/or the second cover plate (42) in the thickness direction.
12. The method of forming a temperature equalization member as claimed in claim 10, wherein the body portion (4) includes a first cover plate (41) and a second cover plate (42) in the thickness direction;
when the notch (413) is machined at the position of the body part (4) corresponding to the channel (45) along the thickness direction, so that the notch (413) at least comprises a first matching surface (413a) and a second matching surface (413b), the forming method comprises the following steps:
and matching the first cover plate (41) with the second cover plate (42), and enabling any one of the first cover plate (41) and the second cover plate (42) to at least partially protrude from the other one along the width direction, so that the gap (413) is formed between the first cover plate (41) and the second cover plate (42).
13. A method for forming a temperature equalizing member as claimed in any one of claims 10 to 12, wherein said body portion (4) further has a first cavity (43), said passage (45) communicating with said first cavity (43); the molding method further includes:
and after the liquid injection and the vacuum pumping are carried out in the first cavity (43) through the channel (45), the channel (45) is sealed.
CN201911157636.6A 2019-11-22 2019-11-22 Temperature equalizing part, terminal and forming method of temperature equalizing part Pending CN112839476A (en)

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