CN116313916B - Semiconductor component packaging equipment - Google Patents
Semiconductor component packaging equipment Download PDFInfo
- Publication number
- CN116313916B CN116313916B CN202310308418.8A CN202310308418A CN116313916B CN 116313916 B CN116313916 B CN 116313916B CN 202310308418 A CN202310308418 A CN 202310308418A CN 116313916 B CN116313916 B CN 116313916B
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- Prior art keywords
- air
- block
- air outlet
- pipe
- conveyor belt
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 84
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 239000000428 dust Substances 0.000 claims abstract description 81
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 238000011084 recovery Methods 0.000 claims abstract description 12
- 238000005452 bending Methods 0.000 claims description 51
- 230000000903 blocking effect Effects 0.000 claims description 43
- 238000009826 distribution Methods 0.000 claims description 17
- 230000007306 turnover Effects 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 12
- 238000001179 sorption measurement Methods 0.000 claims description 10
- 239000012634 fragment Substances 0.000 abstract description 19
- 229920005989 resin Polymers 0.000 abstract description 16
- 239000011347 resin Substances 0.000 abstract description 16
- 239000007921 spray Substances 0.000 abstract description 7
- 238000004140 cleaning Methods 0.000 description 22
- 238000005422 blasting Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 238000004064 recycling Methods 0.000 description 8
- 238000001914 filtration Methods 0.000 description 7
- 238000007664 blowing Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 239000002360 explosive Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a semiconductor component packaging device, which comprises: a conveyor belt; the dust removal recovery mechanism comprises air collecting blocks arranged at two ends of the conveyor belt and air outlet blocks movably arranged at two ends of the conveyor belt, and the air outlet blocks are driven to release air flow so as to enable the air flow to enter the air collecting blocks through the conveyor belt. Before filling the semiconductor element resin, the semiconductor element packaging equipment provided by the application is placed on a conveyor belt, then an air outlet block is driven to spray air flow so as to blow away dust and fragments on the semiconductor element, and then the air flow enters into an air receiving block, so that the dust and fragments are prevented from being diffused in the air after being blown away by the air flow, the environment of a dust-free workshop can be kept, the blown air can be collected by the air receiving block and does not participate in subsequent circulation, and the surface of the conveyor belt can be kept in a dust-free state.
Description
Technical Field
The application relates to the technical field of semiconductor packaging, in particular to semiconductor component packaging equipment.
Background
The semiconductor package is to adhere the cut wafer combination on the substrate, then use the metal thin wire to weld, and fill the plastic shell into the resin to package after welding.
According to patent number CN114589159a, publication (bulletin) day: 2022-06-07, a semiconductor components packaging structure cleaning equipment is disclosed, belongs to semiconductor components packaging structure cleaning field, and this semiconductor components packaging structure cleaning equipment includes: the conveyer is provided with a conveyer belt, vertical plates are uniformly arranged on the periphery of the conveyer belt at intervals, and semiconductor components are placed in the limiting grooves; the air blowing assembly comprises an air outlet head, a fan, a first dust collection head and a dust collector, wherein the air outlet head is arranged above the conveying belt, the fan is communicated with the air outlet head, and the dust collector is communicated with the first dust collection head. In the whole use process, the dust removal treatment of the inside of the packaging structure is realized, and the air drying of residual epoxy resin is also realized by blowing air to the vertical plate inside the packaging structure, so that the influence of dust and residual epoxy resin on the packaging of semiconductor components is avoided, and the packaging quality of semiconductor elements is improved.
In the prior art including the above patent, before the workpiece is welded with the fine metal wire and resin filling and packaging are carried out, the workpiece needs to be cleaned to remove dust and fragments on the workpiece, the dust and fragments are always blown away by air flow, but the dust and fragments blown up by the air flow are not easy to collect and are easy to diffuse in a dust-free workshop.
Disclosure of Invention
The application aims to provide semiconductor component packaging equipment, which aims to solve the problem that dust and fragments blown up by air flow are easy to diffuse in a dust-free workshop.
In order to achieve the above object, the present application provides the following technical solutions: a semiconductor component packaging apparatus comprising:
a conveyor belt;
the dust removal recovery mechanism comprises air collecting blocks arranged at two ends of the conveyor belt and air outlet blocks movably arranged at two ends of the conveyor belt, and the air outlet blocks are driven to release air flow so as to enable the air flow to enter the air collecting blocks through the conveyor belt.
Preferably, the air outlet block is rotatably connected to the air receiving block, and the air outlet block is intermittently turned into the air receiving block to be deflated.
Preferably, the device further comprises a total gas pipe, wherein a gas distribution pipe is fixedly communicated between the total gas pipe and the gas outlet block, and the gas outlet block is driven to be far away from or close to the gas distribution pipe.
Preferably, an air bag is arranged on the air distribution pipe, a bending air blocking part is fixedly communicated between the air distribution pipe and the air outlet block, and the bending air blocking part is driven to be bent and blocked so as to drive the air bag to expand and push the air outlet block to turn over.
Preferably, the device further comprises an auxiliary recovery mechanism, wherein the auxiliary recovery mechanism comprises guide circular arc plates and a main air outlet pipe which are symmetrically arranged on the conveyor belt, and the guide circular arc plates and the air collecting blocks are fixedly communicated with the main air outlet pipe.
Preferably, the main air outlet pipe is rotationally connected with an air outlet head, the air outlet head is driven to turn to two termination positions, and the central axes of the two termination positions are parallel to the central axis of the main air outlet pipe.
Preferably, the folding stretching piece and the fixing plate are arranged on the bending air blocking portion, the adsorption piece is arranged on the folding stretching piece and is driven to be adsorbed on the fixing plate so as to block the bending air blocking portion.
Preferably, the air outlet head is provided with a turnover hole, and the turnover hole is driven to blow up so as to drive the air outlet head to turn over.
Preferably, a first communication pipe is fixedly communicated between the guide circular arc plate and the main air outlet pipe, the first communication pipe faces the air collecting block, and an auxiliary exhaust pipe is fixedly communicated between the air collecting block and the main air outlet pipe.
Preferably, the device further comprises a total gas delivery pipe and a gas outlet block, wherein the gas outlet head turns over along with the turning over of the gas outlet block.
In the above technical scheme, the semiconductor component packaging equipment provided by the application has the following beneficial effects: before the semiconductor element resin is filled, the semiconductor element resin is placed on a conveyor belt, then an air outlet block is driven to spray air flow so as to blow away dust and chips on the semiconductor element, then the air flow enters into an air collecting block, so that the dust and the chips are prevented from being scattered in the air after being blown away by the air flow, the environment of a dust-free workshop can be kept, the blown air can be collected by the air collecting block and does not participate in subsequent circulation, and the surface of the conveyor belt can be kept in a dust-free state.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic view of an embodiment of the present application;
FIG. 2 is an overall explosion schematic provided by an embodiment of the present application;
FIG. 3 is an enlarged schematic view of FIG. 2 at A;
FIG. 4 is a schematic overall cross-sectional view of an embodiment of the present application;
FIG. 5 is an enlarged schematic view of FIG. 4 at B;
FIG. 6 is an enlarged schematic view of FIG. 4 at C;
fig. 7 is a schematic view of the removal section at D in fig. 2.
Reference numerals illustrate:
1. a conveyor belt; 11. a total gas pipe; 2. a dust removal and recovery mechanism; 20. a gas distribution pipe; 200. an air bag; 201. bending the air blocking part; 202. folding the stretch panel; 2021. an adsorption sheet; 203. a fixing plate; 2031. a bleed passage; 21. a gas collecting block; 211. a movable groove; 212. an auxiliary exhaust duct; 213. a discharge port; 22. an air outlet block; 221. a bonding part; 23. a connecting plate; 231. guiding the arc plate; 232. a top plate; 3. an auxiliary recovery mechanism; 31. a main air outlet pipe; 32. a first communication pipe; 321. a shunt angle; 33. an air outlet head; 331. overturning the hole; 3311. a guide protrusion; 332. rotating the extension shaft; 34. a second communicating pipe; 341. pulling the rope.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
As shown in fig. 1 to 7, a semiconductor component packaging apparatus includes:
a conveyor belt 1;
the dust removal and recovery mechanism 2 comprises air receiving blocks 21 arranged at two ends of the conveyor belt 1 and air outlet blocks 22 movably arranged at two ends of the conveyor belt 1, and the air outlet blocks 22 are driven to release air flow so as to enable the air flow to enter the air receiving blocks 21 through the conveyor belt 1.
Specifically, the number of the air receiving blocks 21 and the air outlet blocks 22 is a plurality, and the air receiving blocks 21 and the air outlet blocks 22 are all arranged at two ends of the conveyor belt 1 in a linear array, the air outlet blocks 22 face the air receiving blocks 21 and the conveyor belt 1 in an air outlet state, the air outlet blocks 22 are fixedly communicated with air conveying units (the air conveying units can be air pumps or large fans), and the air receiving blocks 21 are communicated with filter units (the filter units can be screens or filter papers); before filling the semiconductor element resin, firstly, the semiconductor element is placed on the conveyor belt 1, then the conveyor belt 1 moves the semiconductor element towards the air collecting block 21, at the moment, the air conveying unit sprays air flow along the air outlet block 22, at the moment, the air flow blows to the semiconductor element on the conveyor belt 1 to play a role in removing dust and scraps, and the dust and scraps can be recycled into the filtering unit along with the air flow by the air collecting block 21 so as to remain the dust and scraps to facilitate subsequent cleaning and recycling, so that the dust and scraps can be prevented from being scattered in the air after being blown away by the air flow, the dust-free workshop environment can be kept, the blown air can be collected by the air collecting block 21 and does not participate in subsequent circulation, and the surface of the conveyor belt 1 can be kept in a dust-free state, and dust and scraps can be prevented from being polluted when the next batch of semiconductor elements are placed.
In the above technical solution, before the semiconductor element resin is filled, the semiconductor element resin is placed on the conveyor belt 1, then the air outlet block 22 is driven to spray air flow so as to blow away dust and chips on the semiconductor element, and then the air flow enters the air receiving block 21, so that the dust and chips are prevented from being scattered in the air after being blown away by the air flow, the environment of a dust-free workshop can be maintained, and the blown air can be collected by the air receiving block 21 and does not participate in subsequent circulation, so that the surface of the conveyor belt 1 can be maintained in a dust-free state.
As one embodiment provided by the application, the air outlet block 22 is rotatably connected to the air collecting block 21, and the air outlet block 22 is intermittently turned into the air collecting block 21 to be discharged.
Specifically, the air receiving block 21 is provided with a movable groove 211, the air outlet block 22 is rotatably connected to the air receiving block 21, the air outlet block 22 can be driven to be turned into or turned out of the air receiving block 21, the air outlet block 22 is driven to be turned into a designated position in the air receiving block 21 and is deflated, and the air outlet block 22 is not deflated when turned out of the air receiving block 21; before filling the semiconductor element resin, firstly, the semiconductor element is placed on the conveyor belt 1, then the conveyor belt 1 moves the semiconductor element towards the air receiving block 21, at this time, the air conveying unit inputs air flow into the air outlet block 22, at this time, the air outlet block 22 at one end of the conveyor belt 1 is driven to turn into the air receiving block 21 so that the air outlet block 22 reaches a designated position, at this time, the air outlet block 22 starts to deflate, the air flow blows to the semiconductor element on the conveyor belt 1 to play a role of cleaning dust and chips, then the air outlet block 22 at the other end of the conveyor belt 1 alternately vents to clean the semiconductor element at different angles, and the dust and chips can be recovered by the air receiving block 21 along with the air flow into the filtering unit so as to save dust and chips for convenient subsequent cleaning and recovery, so that the dust and chips can be prevented from being diffused in the air after being blown by the air flow, the dust-free environment can be kept, the blown air can be collected by the air receiving block 21 not participate in subsequent circulation, the surface of the conveyor belt 1 can be kept in a dust-free state, and dust and chips can be prevented from being polluted when placing the next semiconductor element.
As a further embodiment of the present application, the present application further includes a total gas pipe 11, and a gas distributing pipe 20 is fixedly connected between the total gas pipe 11 and the gas outlet block 22, where the gas outlet block 22 is driven to be far from or near to the gas distributing pipe 20.
Specifically, the total gas pipe 11 is fixedly communicated with the gas transmission unit, the gas distribution pipe 20 is fixedly communicated between the total gas pipe 11 and the gas outlet block 22, the gas outlet block 22 can be always fixedly communicated with the total gas pipe 11 when being driven to turn over, a top plate 232 is arranged between two symmetrical gas collecting blocks 21, a connecting plate 23 is arranged between the two gas collecting blocks 21 arranged in a linear array manner, a guiding circular arc plate 231 is arranged between the gas collecting blocks 21 and the conveyor belt 1, the guiding circular arc plate 231, the connecting plate 23 and the top plate 232 hoop the conveyor belt 1 to form independent spaces by hoops, so that the gas outlet block 22 and the gas collecting blocks 21 are positioned in the independent spaces to assist the gas collecting blocks 21 to suck the gas flow carrying dust and metal chips; before filling the semiconductor element resin, firstly placing the semiconductor element on a conveyor belt 1, then moving the semiconductor element towards a gas collecting block 21 by the conveyor belt 1, inputting the air flow into a gas outlet block 22 by a total gas pipe 11 along a gas distributing pipe 20, driving the gas outlet block 22 at one end of the conveyor belt 1 to turn into the gas collecting block 21, enabling the gas outlet block 22 to reach a designated position, beginning to deflate the gas outlet block 22, enabling the air flow to blow to the semiconductor element on the conveyor belt 1 to remove dust and scraps, alternately discharging the gas outlet block 22 at the other end of the conveyor belt 1 to clean the semiconductor element at different angles, recycling the dust and scraps into a filtering unit along with the air flow by the gas collecting block 21, the dust and the fragments are convenient to clean and recover subsequently, the dust and the fragments can be prevented from being scattered in the air after being blown away by the airflow, the environment of a dust-free workshop can be kept, the blown-out air can be collected by the air collecting block 21 and does not participate in subsequent circulation, the surface of the conveyor belt 1 can be kept in a dust-free state, the dust and the fragments are not polluted when the next batch of semiconductor elements are placed, the circular arc plate 231, the connecting plate 23 and the top plate 232 are guided to hoop the conveyor belt 1 to form independent spaces by hoops, and the air outlet block 22 and the air collecting block 21 are positioned in the independent spaces to assist the air collecting block 21 to suck the airflow carrying the dust and the metal fragments.
As the optimal embodiment provided by the application, the air bag 200 is arranged on the air distribution pipe 20, and a bending air blocking part 201 is fixedly communicated between the air distribution pipe 20 and the air outlet block 22, and the bending air blocking part 201 is driven to be blocked by bending so as to drive the air bag 200 to expand and push the air outlet block 22 to turn over.
Specifically, the air bag 200 is arranged on the air distribution pipe 20, the attaching part 221 is arranged on the air outlet block 22, the attaching part 221 is attached to the air bag 200, a bending air blocking part 201 is fixedly communicated between the air distribution pipe 20 and the air outlet block 22, the bending air blocking part 201 can block the air distribution pipe 20 and the air outlet block 22 when bending and open, the air distribution pipe 20 and the air outlet block 22 are communicated when bending and open, the bending air blocking part 201 has certain elasticity, and the air block 22 can be pulled out all the time to attach to the air bag 200; before filling the semiconductor element resin, firstly, the semiconductor element is placed on the conveyor belt 1, then the conveyor belt 1 moves the semiconductor element towards the air receiving block 21, at this time, the total air pipe 11 inputs the air flow into the air distributing pipe 20, at this time, because the air distributing pipe 20 and the air distributing block 22 are pulled out by the bending air blocking part 201 to be attached to the air bag 200, and the air distributing pipe 20 and the air distributing block 22 are blocked by the bending air blocking part 201 in a bending state, the air bag 200 can be inflated by the air flow in the air distributing pipe 20, the inflated air bag 200 pushes the air distributing block 22 to be turned over into the air receiving block 21, so that the air distributing block 22 is turned over to release the bending state of the bending air blocking part 201, at this time, the air bag 200 rapidly sprays the air from the air distributing block 22 to play a role of blasting air spraying, so that the air flow is rapidly blown out to enhance the cleaning capability, the air flow blows the semiconductor element on the conveyor belt 1 to play a role of cleaning dust and chips, the thickness of the air bags 200 at two ends of the conveyor belt 1 is different, so that the air outlet blocks 22 alternately and explosively air to clean the semiconductor elements at different angles, dust and fragments can be recycled by the air collecting blocks 21 along with the air flow and enter the filtering unit so as to be stored in the dust collecting blocks 21 for convenient subsequent cleaning and recycling, the dust and fragments can be prevented from being scattered in the air after being blown away by the air flow, the environment of a dust-free workshop can be kept, the blown-off air can be collected by the air collecting blocks 21 and does not participate in subsequent circulation, the surface of the conveyor belt 1 can be kept in a dust-free state, dust and fragments can be prevented from being polluted when the next batch of semiconductor elements are placed, and the conveyor belt 1 is hooped into independent spaces by the circular arc plates 231, the connecting plates 23 and the top plates 232 in a hooping mode, so that the air outlet blocks 22 and the air collecting blocks 21 are located in the independent spaces to assist the air collecting blocks 21 to suck the air flow carrying dust and metal fragments.
As an embodiment of the present application, the air collecting device further comprises an auxiliary recycling mechanism 3, wherein the auxiliary recycling mechanism 3 comprises a guiding circular arc plate 231 and a main air outlet pipe 31 which are symmetrically arranged on the conveyor belt 1, and the guiding circular arc plate 231 and the air collecting block 21 are fixedly communicated with the main air outlet pipe 31.
Specifically, the guiding circular arc plate 231 can also play a role in sucking air, so that part of air flow can be sucked along the guiding circular arc plate 231 and discharged by the main air outlet pipe 31, and the other part of air flow is sucked and discharged by the air collecting block 21, so that the effect of absorbing the air flow is further enhanced, and dust and fragments are prevented from diffusing along with the air flow; before filling the semiconductor element resin, firstly, the semiconductor element is placed on the conveyor belt 1, then the conveyor belt 1 moves the semiconductor element towards the air receiving block 21, at this time, the total air pipe 11 inputs the air flow into the air distributing pipe 20, at this time, because the air distributing pipe 20 and the air distributing block 22 are pulled out by the bending air blocking part 201 to be attached to the air bag 200, and the air distributing pipe 20 and the air distributing block 22 are blocked by the bending air blocking part 201 in a bending state, the air bag 200 can be inflated by the air flow in the air distributing pipe 20, the inflated air bag 200 pushes the air distributing block 22 to be turned over into the air receiving block 21, so that the air distributing block 22 is turned over to release the bending state of the bending air blocking part 201, at this time, the air bag 200 rapidly sprays the air from the air distributing block 22 to play a role of blasting air spraying, so that the air flow is rapidly blown out to enhance the cleaning capability, the air flow blows the semiconductor element on the conveyor belt 1 to play a role of cleaning dust and chips, the thickness of the air bags 200 at the two ends of the conveyor belt 1 is different, so that the air outlet blocks 22 alternately and explosively air to clean the semiconductor elements at different angles, dust and chips can be recycled by the air collecting blocks 21 and the guide circular arc plates 231 along with the air flow and enter the filter unit to reserve the dust and the chips for convenient subsequent cleaning and recycling, the dust and the chips can be prevented from being scattered in the air after being blown away by the air flow, the environment of a dust-free workshop can be kept, the blown air can be collected by the air collecting blocks 21 and does not participate in subsequent circulation, the surface of the conveyor belt 1 can be kept in a dust-free state, dust and chip contamination can be prevented when the next batch of semiconductor elements are placed, the guide circular arc plates 231, the connecting plates 23 and the top plates 232 hoop the conveyor belt 1 to form independent spaces by hoops, the air outlet blocks 22 and the air collecting blocks 21 are positioned in the independent spaces, to assist the air-receiving block 21 in drawing away the dust and metal debris laden air stream.
As the optimal embodiment provided by the application, the air outlet head 33 is rotationally connected with the main air outlet pipe 31, the air outlet head 33 is driven to turn to two termination positions, and the central axes of the two termination positions are parallel to the central axis of the main air outlet pipe 31.
Specifically, when the air outlet head 33 is at the first end position, the air outlet head 33 faces the air outlet direction of the total air outlet pipe 31 to be the same as the air outlet direction of the total air outlet pipe 31, and at the moment, the air outlet head 33 communicated with the total air outlet pipe 11 blows out tiny high-pressure air flow to drive the guide arc plate 231 to exhaust air, and when the air outlet head 33 is at the second station, the air flow is blown into the air collecting block 21 along the guide arc plate 231 to collect air through the air collecting block 21; before filling the semiconductor element resin, firstly, the semiconductor element is placed on the conveyor belt 1, then the conveyor belt 1 moves the semiconductor element towards the air collecting block 21, at this time, the total air conveying pipe 11 conveys the air flow into the air distributing pipe 20, at this time, because the air distributing pipe 22 is pulled out by the bending air blocking part 201 to be attached to the air bag 200, and the air distributing pipe 20 and the air outlet block 22 are blocked by the bending air blocking part 201 in a bending state, the air bag 200 can be inflated by the air flow in the air distributing pipe 20, meanwhile, the air outlet head 33 is at a first end position, the air outlet head 33 faces the air outlet direction of the total air outlet pipe 31 in the same direction, at this time, the air outlet head 33 communicated with the total air conveying pipe 11 blows out tiny high-pressure air flow to drive the guide arc plate 231 to suck air, and the inflated air bag 200 pushes the air outlet block 22 to be turned into the air collecting block 21, so that the air outlet block 22 is turned over to release the bending air blocking part 201, at this time, the air bag 200 rapidly sprays air from the air outlet block 22 to play a role of blasting air, so as to rapidly blow the air flow to enhance the cleaning capability, so that the air flow blows to the semiconductor elements on the conveyor belt 1 to play a role of cleaning dust and chips, meanwhile, the air outlet head 33 is turned over to be at the second station, the air flow blows into the air collecting block 21 along the guiding circular arc plate 231 to collect air through the air collecting block 21, so that during blasting air blowing, one of the air flow walls of the guiding circular arc plate 231 blowing to the air collecting block 21 needs to be broken first to remove dust, so that the air flow wall at the other end can block and carry the air flow with impurities into the air collecting block 21, the thickness of the air bag 200 at the two ends of the conveyor belt 1 is different, so that the air outlet block 22 alternately blasts to clean the semiconductor elements at different angles, and dust and chips can be recovered into the filtering unit along with the air flow by the air collecting block 21 and the guiding circular arc plate 231, the dust and the fragments are convenient to clean and recover subsequently, the dust and the fragments can be prevented from being scattered in the air after being blown away by the airflow, the environment of a dust-free workshop can be kept, the blown-out air can be collected by the air collecting block 21 and does not participate in subsequent circulation, the surface of the conveyor belt 1 can be kept in a dust-free state, the dust and the fragments are not polluted when the next batch of semiconductor elements are placed, the circular arc plate 231, the connecting plate 23 and the top plate 232 are guided to hoop the conveyor belt 1 to form independent spaces by hoops, and the air outlet block 22 and the air collecting block 21 are positioned in the independent spaces to assist the air collecting block 21 to suck the airflow carrying the dust and the metal fragments.
As a preferred embodiment provided by the application, the folding stretching piece 202 and the fixing plate 203 are arranged on the bending and air blocking part 201, the adsorption piece 2021 is arranged on the folding stretching piece 202, and the adsorption piece 2021 is driven to be adsorbed on the fixing plate 203 so as to block the bending and air blocking part 201.
Specifically, the fixing plate 203 is provided with a gas discharging channel 2031, the gas discharging channel 2031 is fixedly communicated with the bending gas blocking part 201, and after the airbag 200 is inflated to push the gas discharging block 22 to a specified position, the adsorption piece 2021 on the folding stretching piece 202 is separated from the fixing plate 203 to open the bending gas blocking part 201, so that explosive gas discharging is realized, and the bending gas blocking part 201 can be prevented from discharging gas when driven vertically; before filling the semiconductor element resin, firstly, the semiconductor element is placed on the conveyor belt 1, then the conveyor belt 1 moves the semiconductor element towards the air receiving block 21, at this time, the total air pipe 11 inputs the air flow into the air distributing pipe 20, at this time, because the air distributing pipe 22 is pulled out by the bending air blocking part 201 to be attached to the air bag 200, and the air distributing pipe 20 and the air outlet block 22 are blocked by the bending air blocking part 201 in a bending state, the air bag 200 can be inflated by the air flow in the air distributing pipe 20, meanwhile, the air outlet head 33 is at a first end position, the air outlet head 33 faces the air outlet direction of the total air outlet pipe 31 in the same direction, at this time, the air outlet head 33 communicated with the total air conveying pipe 11 blows out tiny high-pressure air flow to drive the guide arc plate 231 to suck air, the inflated air bag 200 pushes the air outlet block 22 into the air receiving block 21, at this time, the air bag 200 is inflated to push the air outlet block 22 to reach a specified position, and then the adsorption piece 2021 on the folding stretching piece 202 is separated from the fixing plate 203 to open the bending air blocking part 201, so as to realize explosive air outlet, the bending air blocking part 201 can be prevented from being deflated when being driven vertically, at the moment, the air bag 200 rapidly ejects air from the air outlet block 22 to play a role of blasting air injection, so as to rapidly blow out the air flow to enhance the cleaning capability, the air flow is blown to the semiconductor elements on the conveyor belt 1 to play a role of cleaning dust and scraps, meanwhile, the air outlet head 33 is turned over to be in a second station, the air flow is blown into the air collecting block 21 along the guiding circular arc plate 231 to collect air through the air collecting block 21, so that during blasting air injection, one of the guiding circular arc plates 231 is firstly broken to blow to the air flow wall of the air collecting block 21 for dust removal, the air flow wall at the other end can play a role of blocking and carrying the air flow with impurities into the air collecting block 21, the thickness of the air bags 200 at two ends of the conveyor belt 1 is different, the air outlet block 22 alternately bursts to allow the semiconductor elements to be cleaned at different angles, dust and chips can be recycled into the filtering unit along with the air flow by the air collecting block 21 and the guiding circular arc plate 231 so as to keep the dust and the chips convenient for subsequent cleaning and recycling, the dust and the chips can be prevented from being scattered in the air after being blown away by the air flow, the environment of a dust-free workshop can be kept, the blown-out air can be collected by the air collecting block 21 and does not participate in subsequent circulation, the surface of the conveyor belt 1 can be kept in a dust-free state, dust and chip contamination can be prevented when the next batch of semiconductor elements are placed, and the guiding circular arc plate 231, the connecting plate 23 and the top plate 232 hoop the conveyor belt 1 to form independent spaces by hoops, so that the air outlet block 22 and the air collecting block 21 are positioned in the independent spaces to assist the air collecting block 21 to absorb the air flow carrying the dust and the metal chips.
As an embodiment of the present application, a first communication pipe 32 is fixedly connected between the guiding circular arc plate 231 and the main air outlet pipe 31, the first communication pipe 32 faces the air collecting block 21, and an auxiliary air exhaust pipe 212 is fixedly connected between the air collecting block 21 and the main air outlet pipe 31.
Specifically, the auxiliary exhaust duct 212 is provided with an exhaust port 213, and the direction of the exhaust port 213 is the same as that of the main exhaust duct 31 to prevent air flow from flowing backward; before filling the semiconductor element resin, firstly, the semiconductor element is placed on the conveyor belt 1, then the conveyor belt 1 moves the semiconductor element towards the air receiving block 21, at this time, the total air pipe 11 inputs the air flow into the air distributing pipe 20, at this time, because the air distributing pipe 22 is pulled out by the bending air blocking part 201 to be attached to the air bag 200, and the air distributing pipe 20 and the air outlet block 22 are blocked by the bending air blocking part 201 in a bending state, the air bag 200 can be inflated by the air flow in the air distributing pipe 20, meanwhile, the air outlet head 33 is at the first end position, the air outlet head 33 faces the air outlet direction of the total air outlet pipe 31 in the same direction, at this time, the air outlet head 33 communicated with the total air pipe 11 blows out tiny high-pressure air flow to drive the first connecting pipe 32 to suck air, the inflated air bag 200 pushes the air outlet block 22 into the air receiving block 21, at this time, the air bag 200 is inflated to push the air outlet block 22 to reach the designated position, and then the adsorption piece 2021 on the folding stretching piece 202 is separated from the fixing plate 203 to open the bending air blocking part 201, so as to realize explosive air outlet, the bending air blocking part 201 can be prevented from being deflated when being driven vertically, at the moment, the air bag 200 rapidly ejects air from the air outlet block 22 to play a role of blasting air injection, so that the air flow is rapidly blown out to enhance the cleaning capability, the air flow is blown to the semiconductor elements on the conveyor belt 1 to play a role of cleaning dust and scraps, meanwhile, the air outlet head 33 is turned over to be in a second station, the air flow is blown into the air collecting block 21 along the first communication pipe 32 to collect air through the air collecting block 21, so that during blasting air blowing, the air flow wall of one of the first communication pipes 32 is firstly broken to blow the air flow wall of the air collecting block 21 for dust removal, the air flow wall of the other end can play a role of blocking and carrying the air flow with impurities into the air collecting block 21, the thickness of the air bags 200 at two ends of the conveyor belt 1 is different, the air outlet block 22 alternately bursts to allow the semiconductor elements to be cleaned at different angles, dust and chips can be recycled into the filtering unit along with the air flow by the air collecting block 21 and the guiding circular arc plate 231 so as to keep the dust and the chips convenient for subsequent cleaning and recycling, the dust and the chips can be prevented from being scattered in the air after being blown away by the air flow, the environment of a dust-free workshop can be kept, the blown-out air can be collected by the air collecting block 21 and does not participate in subsequent circulation, the surface of the conveyor belt 1 can be kept in a dust-free state, dust and chip contamination can be prevented when the next batch of semiconductor elements are placed, and the guiding circular arc plate 231, the connecting plate 23 and the top plate 232 hoop the conveyor belt 1 to form independent spaces by hoops, so that the air outlet block 22 and the air collecting block 21 are positioned in the independent spaces to assist the air collecting block 21 to absorb the air flow carrying the dust and the metal chips.
As a preferred embodiment provided by the application, the air outlet head 33 is provided with a turnover hole 331, the turnover hole 331 is driven to blow to drive the air outlet head 33 to turn over, and the air outlet head 33 further comprises a total air delivery pipe 11 and an air outlet block 22, wherein the air outlet head 33 turns over along with the turning over of the air outlet block 22.
Specifically, the air outlet head 33 is provided with a turnover hole 331, the inner wall of the air outlet head 33 is provided with a guide protrusion 3311, the guide protrusion 3311 ejects air flow along the turnover hole 331, a second communicating pipe 34 is fixedly communicated between the air outlet head 33 and the total air delivery pipe 11, the air outlet head 33 is provided with a rotation extending shaft 332, the rotation extending shaft 332 is rotatably connected to the second communicating pipe 34, a traction rope 341 is fixedly connected between the air bag 200 and the rotation extending shaft 332, the traction rope 341 is positioned in the second communicating pipe 34 and the air distribution pipe 20, a diversion angle 321 is arranged in the total air outlet pipe 31, and the diversion angle 321 is used for guiding the air flow ejected by the air outlet head 33; before filling the semiconductor element with resin, firstly, the semiconductor element is placed on the conveyor belt 1, then the conveyor belt 1 moves the semiconductor element towards the air receiving block 21, at this time, the air flow is input into the air distributing pipe 20 by the main air conveying pipe 11, at this time, the air distributing pipe 20 and the air distributing block 22 are blocked by the bending air blocking part 201 because the air blocking part 201 is pulled out to be attached to the air distributing pipe 200, and the air distributing pipe 20 and the air distributing block 22 are blocked by the bending air blocking part 201 in a bending state, so that the air distributing pipe 20 is inflated by the air flow in the air distributing pipe 200, and meanwhile, the air flow sprayed by the air distributing head 33 is sprayed along the overturning hole 331 through the guide of the guide protrusion 3311 so that the air distributing head 33 is positioned at the first termination position: the rotation direction of the air outlet head 33 is the same as the air outlet direction of the total air outlet pipe 31, at this time, the air outlet head 33 communicated with the total air outlet pipe 11 blows out tiny high-pressure air flow so as to drive the first communication pipe 32 to exhaust air, the inflated air bag 200 pushes the air outlet block 22 to turn into the air collecting block 21, at this time, the air bag 200 is inflated to push the air outlet block 22 to reach a designated position, the adsorption piece 2021 on the folding stretching piece 202 and the fixing plate 203 are separated from the open bending air blocking part 201 so as to realize explosive air outlet, the bending air blocking part 201 can be prevented from being deflated when being driven vertically, at this time, the air bag 200 rapidly jets out air from the air outlet block 22, the effect of blasting air injection is achieved, so that the air flow is blown out rapidly to enhance the cleaning capability, the semiconductor elements on the conveyor belt 1 are enabled to play a role of cleaning dust and chips, and meanwhile, because the inflation of the air bag 200 is inflated, the traction rope 341 is enabled to stretch the part wound on the rotating stretching shaft 332 so that the air outlet head 33 is turned over at the second station: the air current blows into the air receiving block 21 along the first communication pipe 32 to receive air through the air receiving block 21, first, need break one of them first communication pipe 32 blow to the air current wall of air receiving block 21 and remove dust when blowing, make the air current wall of the other end can play the jam and carry the air current that has impurity and get into in the air receiving block 21, the thickness of gasbag 200 at conveyer belt 1 both ends is different, make the alternative blasting formula of giving vent to anger of air block 22 in order to clean semiconductor component at different angles, and dust and piece can be along with the air current by air receiving block 21 and guide circular arc board 231 retrieve and get into the filter unit, in order to keep dust and piece convenient follow-up clearance and recovery, can avoid dust and piece to scatter in the air after being blown away by the air current, can keep the environment of dust-free workshop, and the gas can be collected by air receiving block 21 and not participate in follow-up circulation, also can keep conveyer belt 1 surface in dust-free state, can guarantee not have dust and piece to dye when placing next semiconductor component, and guide circular arc board 231, connecting plate 23 and 232 hoop conveyer belt 1 are in order to make air outputting block 21 and independent space be stained with dust and piece and dust and piece are taken away in the independent space, and dust and piece are taken away in the air receiving block 21.
While certain exemplary embodiments of the present application have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the application. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the application, which is defined by the appended claims.
Claims (6)
1. A semiconductor component packaging apparatus, comprising:
a conveyor belt (1);
the dust removal and recovery mechanism (2) comprises air collecting blocks (21) arranged at two ends of the conveyor belt (1) and air outlet blocks (22) movably arranged at two ends of the conveyor belt (1), wherein the air outlet blocks (22) are driven to release air flow so as to enable the air flow to enter the air collecting blocks (21) through the conveyor belt (1);
the air outlet block (22) is rotationally connected to the air collecting block (21), and the air outlet block (22) is intermittently turned into the air collecting block (21) under driving to discharge air;
the device further comprises a total gas pipe (11), wherein a gas distribution pipe (20) is fixedly communicated between the total gas pipe (11) and the gas outlet block (22), and the gas outlet block (22) is driven to be far away from or close to the gas distribution pipe (20);
an air bag (200) is arranged on the air distribution pipe (20), a bending air blocking part (201) is fixedly communicated between the air distribution pipe (20) and the air outlet block (22), and the bending air blocking part (201) is driven to be bent and blocked so as to drive the air bag (200) to expand and push the air outlet block (22) to turn over;
folding stretching sheets (202) and fixing plates (203) are arranged on the bending air blocking portions (201), adsorption sheets (2021) are arranged on the folding stretching sheets (202), and the adsorption sheets (2021) are driven to be adsorbed on the fixing plates (203) so as to block the bending air blocking portions (201).
2. The semiconductor component packaging device according to claim 1, further comprising an auxiliary recovery mechanism (3), wherein the auxiliary recovery mechanism (3) comprises a guide circular arc plate (231) and a total air outlet pipe (31) which are symmetrically arranged on the conveyor belt (1), and the guide circular arc plate (231) and the air receiving block (21) are fixedly communicated with the total air outlet pipe (31).
3. A semiconductor component packaging apparatus according to claim 2, wherein the total air outlet pipe (31) is rotatably connected with an air outlet head (33), the air outlet head (33) is driven to turn to two termination positions, and the central axes of the two termination positions are parallel to the central axis of the total air outlet pipe (31).
4. A semiconductor component packaging apparatus according to claim 3, wherein the air outlet head (33) is provided with a turnover hole (331), and the turnover hole (331) is driven to be blown up to drive the air outlet head (33) to turn over.
5. A semiconductor component packaging apparatus according to claim 2, wherein a first communication pipe (32) is fixedly connected between the guiding circular arc plate (231) and the total air outlet pipe (31), the first communication pipe (32) faces the air collecting block (21), and an auxiliary air exhaust pipe (212) is fixedly connected between the air collecting block (21) and the total air outlet pipe (31).
6. A semiconductor component packaging apparatus according to claim 4, further comprising a total gas pipe (11) and a gas outlet block (22), the gas outlet head (33) being turned over with the gas outlet block (22) turned over.
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| CN202310308418.8A CN116313916B (en) | 2023-03-28 | 2023-03-28 | Semiconductor component packaging equipment |
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| CN202310308418.8A CN116313916B (en) | 2023-03-28 | 2023-03-28 | Semiconductor component packaging equipment |
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| CN116313916B true CN116313916B (en) | 2023-10-31 |
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| CN116682745B (en) * | 2023-08-04 | 2023-10-10 | 山东隽宇电子科技有限公司 | Semiconductor plastic package device |
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| CN116313916A (en) | 2023-06-23 |
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Effective date of registration: 20240730 Address after: 225600 Gaoyou South economic new area, Yangzhou City, Jiangsu Province Patentee after: Jiangsu Xinyou Investment Development Group Co.,Ltd. Country or region after: China Address before: No. 105, Xingqu Road, Chengnan Economic New Area, Gaoyou City, Yangzhou City, Jiangsu Province 225600 Patentee before: Yangzhou Heyang Semiconductor Co.,Ltd. Country or region before: China |