CN116261918A

CN116261918A - Substrate working device

Info

Publication number: CN116261918A
Application number: CN202080105725.0A
Authority: CN
Inventors: 高间和志
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2020-10-05
Filing date: 2020-10-05
Publication date: 2023-06-13
Also published as: KR20230056763A; DE112020007435T5; JP7387914B2; WO2022074720A1; JPWO2022074720A1

Abstract

The substrate working device (100, 200) is provided with: a head unit (4); and a plurality of imaging units (82, 83) which are provided to the head unit (4) in a state of being arranged at a plurality of different height positions in the vertical direction, and which respectively image the same imaging positions (P2, P3) at which the imaging subject (B) is arranged from the oblique direction. In the plurality of imaging units (82, 83), different depths of field (D1, D2) are set according to the respective tilt angles (thetat, thetau).

Description

Substrate working device

Technical Field

The present invention relates to a substrate working apparatus, and more particularly, to a substrate working apparatus including a head unit.

Background

Conventionally, a substrate working apparatus including a head unit is known. Such a substrate working apparatus is disclosed in, for example, japanese patent application laid-open No. 2019-75475.

The above-mentioned japanese patent application laid-open No. 2019-75475 discloses a component mounting apparatus (substrate working apparatus) provided with a head unit. The component mounting device includes a photographing unit provided to a head unit. The photographing unit includes two cameras arranged in the vertical direction. The imaging unit is configured to take images of the mounting positions of the components mounted on the substrate from two directions (angles) with two cameras. The two cameras are arranged vertically offset from each other so that the mounting positions of the components can be photographed from a plurality of oblique directions with respect to the vertical direction. Here, the upper camera of the two vertically offset cameras has an optical axis in an oblique direction close to the vertical direction. The lower camera of the two cameras offset up and down has an optical axis of an oblique direction approaching the horizontal direction.

In the component mounting apparatus of the above-described japanese patent application laid-open No. 2019-75475, a horizontal position and a vertical height position of a component at a component mounting position are acquired based on images of the component mounting position captured by two cameras from two oblique directions.

Prior art literature

Patent literature

Patent document 1: japanese patent application laid-open No. 2019-75475

Disclosure of Invention

Problems to be solved by the invention

However, in the component mounting device of japanese patent application laid-open No. 2019-75475, since the upper camera has an optical axis in an oblique direction close to the vertical direction and the lower camera has an optical axis in an oblique direction close to the horizontal direction, when the substrate having the upper warpage and the lower warpage is photographed, the distance between the portion of the upper surface of the substrate having the upper warpage and the portion having the lower warpage in the optical axis direction of the second camera is larger than the distance between the portion of the upper surface of the substrate having the upper warpage and the portion having the lower warpage in the optical axis direction of the first camera. Therefore, it is considered that since the distance in the optical axis direction of the second camera is larger than the distance in the optical axis direction of the first camera, even if focusing is performed on both the portion where the upper warp occurs and the portion where the lower warp occurs on the upper surface of the substrate in the upper camera, focusing may not be performed on either the portion where the upper warp occurs or the portion where the lower warp occurs on the upper surface of the substrate in the lower camera. Accordingly, in the component mounting apparatus (substrate working apparatus) of japanese patent application laid-open No. 2019-75475, it is desirable that the focal points of the images photographed from the oblique directions by the plurality of cameras (photographing sections) arranged at a plurality of different height positions in the vertical direction are more reliably aligned.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate working apparatus capable of making the focal points of images photographed from an oblique direction by a plurality of photographing sections arranged at a plurality of different height positions in a vertical direction more reliably uniform.

Means for solving the problems

The substrate working device according to one aspect of the present invention includes: a head unit including a work head for performing work on the substrate; and a plurality of imaging units which are provided to the head unit in a state of being arranged at a plurality of different height positions in the vertical direction and which image the same imaging position at which the imaging subject is arranged from different tilt directions, wherein different depths of field are set according to tilt angles of the tilt directions at which the imaging is performed in the plurality of imaging units. The plurality of imaging units may be configured to take images of the same imaging position where the imaging subject is disposed by using a common camera so as to divide the field of view, or may be configured to take images of the same imaging position where the imaging subject is disposed by using mutually independent cameras.

In the substrate working apparatus according to one aspect of the present invention, as described above, the plurality of imaging units set different depths of field according to the respective tilt angles from the respective height positions toward the imaging target. Thus, even if the plurality of imaging units are arranged at a plurality of different height positions in the vertical direction, the same imaging position at which the imaging object is arranged can be individually set for focusing by setting a different depth of field according to the tilt angle in each of the plurality of imaging units. As a result, the focal points of the images captured from the oblique directions by the plurality of imaging units arranged at the plurality of different height positions in the vertical direction can be made more reliable to coincide.

In the substrate working apparatus according to the above aspect, the plurality of imaging units preferably includes: a first imaging unit having a first inclination angle in an inclination direction close to the vertical direction among the inclination angles; and a second photographing part disposed at a lower side of the first photographing part and having a second inclination angle closer to the inclination direction of the horizontal direction than the first inclination angle, the second photographing part having a second depth of field deeper than the first depth of field of the first photographing part. With this configuration, the second depth of field of the second imaging unit can be sufficiently ensured by making the second depth of field deeper than the first depth of field, and therefore, the focal point of the image captured by the second imaging unit can be more reliably aligned.

In this case, it is preferable that the first imaging unit and the second imaging unit are arranged vertically in the same plane along the vertical direction and image the same imaging position where the imaging object is arranged from the oblique direction, and the second imaging unit is arranged below the first imaging unit in the vertical direction and has a second depth of field deeper than the first depth of field. With this configuration, the installation space in the horizontal direction of the first imaging unit and the second imaging unit can be reduced as compared with a case where the first imaging unit and the second imaging unit are arranged at positions offset from the same plane along the vertical direction. As a result, the image captured by the second imaging unit can be more reliably brought into focus, and the head unit provided with the first imaging unit and the second imaging unit can be suppressed from becoming large.

In the above-described substrate working apparatus having the first imaging unit and the second imaging unit, it is preferable that the first depth of field is set to a constant depth of field by setting the aperture of the first imaging unit to a constant value, and the second depth of field is set to a constant depth of field deeper than the first depth of field by setting the aperture of the second imaging unit to a constant value. With this configuration, the first imaging unit and the second imaging unit do not need to have a structure for adjusting the diaphragms, and thus the head unit can be prevented from being enlarged.

In the above substrate working apparatus having the first imaging unit and the second imaging unit, each of the first imaging unit and the second imaging unit is preferably configured to image at least one of the periphery of the mounting position of the element and the periphery of the suction position of the element, which are objects of imaging, and the first depth of field and the second depth of field are each set in accordance with an assumed amount of deviation of the height position of the upper surface of the substrate caused by warpage of the substrate or an assumed amount of deviation of the height position of the upper surface of the element stored in the storage tape caused by a difference in the type of storage tape storing the element, a length in the horizontal direction of the element, and an inclination angle in a cross section along the arrangement direction of the first imaging unit and the second imaging unit. With this configuration, the first depth of field and the second depth of field having appropriate values can be obtained, and thus the appropriate depth of field can be set for each of the first imaging unit and the second imaging unit. The difference in types of storage tapes includes not only the difference in types of tapes such as paper tapes and embossed tapes, but also a wide range of concepts including a case where the sizes of storage parts for storing components are different even with the same paper tape and a case where the sizes of storage parts for storing components are different even with the same embossed tape.

In the above substrate working apparatus having the first imaging unit and the second imaging unit, the substrate working apparatus preferably further includes: an illumination unit that irradiates light to a subject; and a control unit configured to control the first imaging unit and the second imaging unit to take an image of the subject, the control unit being configured to control: the brightness of the images captured by the first imaging unit and the second imaging unit is made substantially equal to each other by making any one of the sensor gains for the first imaging unit and the second imaging unit, the exposure times for the first imaging unit and the second imaging unit, and the light amounts of the illumination units different from each other. With this configuration, even when the second depth of field is set to be deeper than the first depth of field, focusing can be performed in the second imaging unit, and the brightness of the image captured by the second imaging unit can be ensured. As a result, the image captured by the second imaging unit can be more reliably focused, and the second imaging unit can capture an image having the same brightness as the image captured by the first imaging unit.

In the above substrate working apparatus in which the exposure times of the first imaging unit and the second imaging unit are different, the control unit is preferably configured to perform the exposure of the second imaging unit in parallel with the exposure of the first imaging unit. With this configuration, the time required for exposure at the time of photographing the photographing position can be minimized, and thus the work time of the work head on the substrate can be prevented from being increased.

In the above substrate working apparatus having the first imaging unit and the second imaging unit, the first imaging unit and the second imaging unit preferably further include a first camera and a second camera, respectively. With this configuration, the structure of the optical system such as the lenses of the first imaging unit and the second imaging unit can be simplified as compared with the case of imaging with a common camera, and therefore, the structure of the first imaging unit and the second imaging unit can be suppressed from being complicated.

In the above substrate working apparatus having the first imaging unit and the second imaging unit, the first imaging unit and the second imaging unit preferably further include: a shared camera; and an optical system that divides the field of view of the shared camera. With this configuration, the number of cameras required can be suppressed, and thus the head unit can be suppressed from being enlarged.

In the substrate working apparatus having the first imaging unit and the second imaging unit, the height position of the periphery of the imaging target is preferably acquired based on the first image captured by the first imaging unit and the second image captured by the second imaging unit. With this configuration, the height position of the periphery of the imaging target can be acquired more accurately by acquiring the height position of the periphery of the imaging target based on the first image and the focused second image, and therefore the work of the work head on the substrate can be performed more accurately.

Effects of the invention

According to the present invention, as described above, the focal points of images captured from the oblique directions by the plurality of imaging units arranged at a plurality of different height positions in the vertical direction can be made more reliable to coincide.

Drawings

Fig. 1 is a plan view showing a component mounting apparatus according to a first embodiment.

Fig. 2 is a side view showing a state in which components in a storage tape are suctioned by a mounting head of the component mounting device according to the first embodiment.

Fig. 3 is a side view showing a state in which a component is mounted on a substrate by a mounting head of the component mounting apparatus according to the first embodiment.

Fig. 4 is a schematic view for obtaining a first depth of field of a first imaging section of the component mounting apparatus of the first embodiment.

Fig. 5 is a schematic view for obtaining a second depth of field of a second imaging section of the component mounting apparatus of the first embodiment.

Fig. 6 is a schematic view of a height position for obtaining a shooting position in the component mounting apparatus of the first embodiment.

Fig. 7 is a plan view showing a component mounting apparatus according to a second embodiment.

Fig. 8 is a side view showing a state of light irradiation of an illumination portion of the component mounting device according to the second embodiment.

Fig. 9 is a side view of a head unit of a component mounting apparatus of a modification of the first and second embodiments.

Detailed Description

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

First embodiment

The structure of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to fig. 1 to 6. The component mounting apparatus 100 is an example of a "substrate working apparatus" in the scope of the claims.

As shown in fig. 1, the component mounting apparatus 100 is configured to convey a substrate S by a pair of conveyors 2 and mount a component B on the substrate S at a work position P1. The element B is an example of "subject" in the scope of the claims.

The component mounting apparatus 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, a component recognition imaging unit 7, an imaging unit 8, and a control unit 9.

Here, the conveyance direction in which the substrate S is conveyed by the pair of conveyors 2 is referred to as the X1 direction, the direction opposite to the X1 direction is referred to as the X2 direction, and the direction in which the X1 direction and the X2 direction are combined is referred to as the X direction. The direction orthogonal to the X direction among the horizontal directions is referred to as the Y direction. One of the Y directions is set as the Y1 direction, and the other of the Y directions is set as the Y2 direction. The direction orthogonal to the X direction and the Y direction is referred to as a Z direction (up-down direction), one of the Z directions is referred to as a Z1 direction (up direction), and the other of the Z directions is referred to as a Z2 direction (down direction).

The pair of conveyors 2 is provided on the base 1 and configured to convey the substrate S in the X1 direction. Further, a holding mechanism for holding the substrate S being conveyed in a state stopped at the work position P1 is provided in the pair of conveyors 2. The pair of conveyors 2 is configured to be able to adjust the interval in the Y direction according to the size of the substrate S.

The component supply unit 3 is disposed outside (Y1 direction side and Y2 direction side) the pair of conveyors 2. In addition, a plurality of tape feeders 31 are arranged in the component supply section 3. The component supply unit 3 is configured to supply the component B to a mounting head 42 described later.

The tape feeder 31 holds a reel (not shown) around which a tape holding the plurality of components B at predetermined intervals is wound. The tape feeder 31 is configured to feed the components B from the front end of the tape feeder 31 by feeding the storage tape 32 holding the components B and rotating the reel. Here, the element B includes electronic elements such as an IC, a transistor, a capacitor, and a resistor.

The head unit 4 is disposed on the Z1 direction side of the pair of conveyors 2 and the component supply section 3, and includes a plurality of (5) mounting heads 42 having suction nozzles 41 (see fig. 2) mounted on the lower ends thereof, and a substrate recognition camera 43. The mounting head 42 is an example of a "work head" in the scope of the claims.

The mounting head 42 is configured to perform work on the substrate S. Specifically, the mounting head 42 is configured to suck the component B in the component supply section 3. The mounting head 42 is configured to mount the component B on the substrate S. In this way, the mounting head 42 suctions the component B supplied from the component supply unit 3, and mounts the suctioned component B on the substrate S placed at the work position P1. The mounting head 42 is configured to be capable of moving up and down (movable in the Z direction), and is configured to adsorb and hold the component B supplied from the tape feeder 31 by a negative pressure generated by a negative pressure generator (not shown) at the tip end portion of the suction nozzle 41, and to mount the component B at the mounting position P3 of the substrate S. The mounting position P3 of the component B is an example of the "shooting position" in the claimed range.

The substrate recognition camera 43 is configured to capture a reference mark of the substrate S to recognize the position and orientation of the substrate S. Further, by capturing and recognizing the position of the reference mark, the mounting position P3 of the component B on the substrate S can be accurately obtained.

The support 5 includes a motor 51. The support 5 is configured such that the head unit 4 is moved along the support 5 in the X direction by driving the motor 51. Both end portions of the support portion 5 are supported by a pair of rail portions 6.

A pair of rail portions 6 are fixed to the base 1. The rail portion 6 on the X1 side includes a motor 61. The rail portions 6 are configured such that the motor 61 is driven to move the support portion 5 along the pair of rail portions 6 in the Y direction. The head unit 4 is movable in the X direction along the supporting portion 5, and the supporting portion 5 is movable in the Y direction along the rail portion 6, whereby the head unit 4 is movable in the horizontal direction (XY direction).

The component recognition imaging section 7 is fixed to the upper surface of the base 1. The component recognition imaging unit 7 is disposed outside (Y1 direction side and Y2 direction side) the pair of conveyors 2. The component recognition imaging unit 7 is configured to capture the component B sucked by the suction nozzle 41 of the mounting head 42 from the lower side (Z2 direction side) to recognize the suction state (suction posture) of the component B before the mounting of the component B. Thereby, the control unit 9 can obtain the suction state of the component B sucked by the suction nozzle 41 of the mounting head 42.

(shooting Unit)

As shown in fig. 2 and 3, the photographing unit 8 is provided to the head unit 4. Thus, the imaging unit 8 is configured to move in the XY direction together with the head unit 4 by the head unit 4 moving in the horizontal direction (XY direction). The imaging unit 8 is offset in the horizontal direction (particularly, Y direction) with respect to the mounting head 42 so as not to interfere with the Z-direction movement of the mounting head 42.

The imaging unit 8 is configured to be able to image a position where the mounting head 42 is to be lowered without moving the head unit 4. Specifically, the imaging unit 8 is configured to be able to image the suction position P2 (imaging position) of the component supply section 3 from a plurality of (two) directions. The imaging unit 8 is configured to be able to image the mounting position P3 (imaging position) of the substrate S from a plurality of (two) directions. The suction position P2 of the element B is an example of the "imaging position" in the claimed range.

In this way, the photographing unit 8 is configured to photograph the periphery of the suction position P2 of the element B from a plurality of (two) directions, thereby photographing the first image and the second image. In addition, the photographing unit 8 is configured to photograph the periphery of the mounting position P3 of the element B from a plurality of (two) directions, thereby photographing the first image and the second image.

Specifically, the photographing unit 8 includes an illumination section 81, a first photographing section 82, and a second photographing section 83. Here, a set of the first photographing part 82 and the second photographing part 83 is disposed corresponding to each of the plurality of mounting heads 42.

The illumination unit 81 has a light source such as an LED (Light Emitting Diode: light emitting diode). The illumination unit 81 is configured to irradiate light to the element B disposed at the suction position P2 or the mounting position P3 (imaging position). The illumination unit 81 is configured to emit light when shooting is performed by the first shooting unit 82 and the second shooting unit 83. The illumination unit 81 is provided around the first imaging unit 82 and the second imaging unit 83. The first imaging unit 82 and the second imaging unit 83 are examples of "a plurality of imaging units" in the scope of the claims.

The first photographing section 82 and the second photographing section 83 have a first camera 82a and a second camera 83a, respectively. The first camera 82a has a first imaging element 182a. The second camera 83a has a second imaging element 183a. The first imaging element 182a is configured to convert light incident from a first lens portion 182b described later into an electrical signal. The second imaging element 183a is configured to convert light incident from a second lens portion 183b described later into an electric signal. The first imaging unit 82 and the second imaging unit 83 have a first optical system 82b and a second optical system 83b, respectively. The first optical system 82b includes a first lens portion 182b having a plurality of lenses and a first aperture portion 182c. The second optical system 83b includes a second lens portion 183b having a plurality of lenses and a second aperture portion 183c. The first diaphragm 182c is a hole for restricting light toward the first lens 182 b. The second diaphragm portion 183c is a hole for restricting light toward the second lens portion 183 b.

The first imaging unit 82 and the second imaging unit 83 are provided to the head unit 4 in a state of being arranged at a plurality of different height positions in the Z direction. Each of the first imaging unit 82 and the second imaging unit 83 is configured to take an image of the same suction position P2 (imaging position) or mounting position P3 (imaging position) where the component B is disposed, from different oblique directions intersecting the Z direction.

As shown in fig. 4 and 5, the first imaging unit 82 and the second imaging unit 83 are configured to perform imaging from different inclination angles (θu and θt) with respect to the imaging direction of the reference plane H0. The first imaging unit 82 and the second imaging unit 83 are arranged vertically in the same plane along the Z direction and image the same suction position P2 (imaging position) or mounting position P3 (imaging position) where the element B (imaging target) is arranged from the oblique direction. Specifically, the first imaging unit 82 and the second imaging unit 83 are disposed adjacent to each other in a vertical plane (YZ plane) including the suction position P2 of the component B or the mounting position P3 of the component B with respect to the reference plane H0. The first imaging unit 82 and the second imaging unit 83 are offset from each other in the Z direction. The reference plane H0 is the upper surface of the substrate S extending in the horizontal direction and having no warpage.

The first imaging unit 82 has a first inclination angle θu in an inclination direction close to the vertical direction among inclination angles. The second imaging unit 83 is disposed on the Z2 direction side of the first imaging unit 82, and has a second inclination angle θt closer to the horizontal inclination direction than the first inclination angle θu. Here, the tilt angle means the inclination of each of the optical axis of the first imaging unit 82 and the optical axis of the second imaging unit 83 extending toward the element B with respect to the reference plane H0.

Therefore, each of the first photographing section 82 and the second photographing section 83 is configured to photograph both the periphery of the mounting position P3 (photographing position) of the element B as a photographing object and the periphery of the adsorbing position P2 (photographing position) of the element B. That is, the photographing unit 8 can photograph the suction position P2 of the mounting head 42 sucking the component B and the mounting position P3 of the mounting head 42 mounting the component B from a plurality of directions (angles), respectively.

As shown in fig. 4 and 5, in the first imaging unit 82 and the second imaging unit 83 of the first embodiment, different depths of field are set according to the first inclination angle θu and the first inclination angle θu of the respective inclination directions in which imaging is performed. That is, in the first imaging section 82 and the second imaging section 83, different depths of field are set according to the first inclination angle θu and the first inclination angle θu from the respective height positions toward the respective optical axes of the elements B. Specifically, the first imaging unit 82 has a first depth of field D1. The second photographing section 83 has a second depth of field D2 deeper than the first depth of field D1 of the first photographing section 82. Here, the second imaging unit 83 is disposed below the first imaging unit 82 in the vertical direction (Z2 direction).

The first depth of field D1 is set according to the F value of the first camera 82a. In detail, the first depth of field D1 is set to a constant depth of field by setting the aperture of the first imaging section 82 to a constant value. That is, the first depth of field D1 is set by the first aperture portion 182c, which is a hole having a constant diameter. The second depth of field D2 is set according to the F value of the second camera 83a. In detail, by setting the aperture of the second imaging unit 83 to be constant, the second depth of field D2 is set to be a constant depth of field deeper than the first depth of field D1. That is, the second depth of field D2 is set by the second aperture 183c, which is a hole having a constant diameter. Here, the diameter of the hole of the second diaphragm portion 183c is smaller than the diameter of the straight hole of the first diaphragm portion 182c.

The first depth of field D1 and the second depth of field D2 are set in accordance with the amount of deviation H envisaged in the height position of the upper surface of the substrate S due to warpage of the substrate, the amount of deviation envisaged in the height position of the upper surface of the component B accommodated in the accommodating tape 32 due to the difference in the type of the accommodating tape 32 accommodating the component B, the length in the horizontal direction (Y direction) of the component B, and the inclination angle, respectively, in the cross section along the arrangement direction of the first imaging section 82 and the second imaging section 83. In the following description, the amount of deviation H of the height position of the upper surface of the substrate S will be described. The deviation amount H is a difference between an upper height position H1 of the upper surface of the substrate S when the substrate S is warped upward and a lower height position H2 of the upper surface of the substrate S when the substrate S is warped downward. The deviation H may be a deviation of the height position of the upper surface of the element B stored in the storage tape 32. The deviation H in this case is a difference between the height position of the upper surface of the element B stored in one storage tape 32 as a reference among a plurality of types and the height position of the upper surface of the element B stored in a storage tape 32 different from the storage tape 32.

Here, the first depth of field D1 and the second depth of field D2 are each set according to the larger one of the deviation H of the height position of the upper surface of the substrate S and the deviation H of the height position of the upper surface of the element B accommodated in the accommodating tape 32. The first depth of field D1 and the second depth of field D2 are each set to the maximum length among the lengths in the horizontal direction (Y direction) of the plurality of elements B.

As shown in fig. 4, the first depth of field D1 is set in a cross section along the arrangement direction of the first imaging unit 82 and the second imaging unit 83 according to the amount of deviation H of the height position of the upper surface of the substrate S, the length L of the element B in the horizontal direction (Y direction), and the first tilt angle θu. Specifically, the first depth of field D1 is obtained based on a relation of the first depth of field d1=h×sin (θu) +l×cos (θu).

As shown in fig. 5, the second depth of field D2 is set in a cross section along the arrangement direction of the first imaging section 82 and the second imaging section 83 according to the amount of deviation H of the height position of the upper surface of the substrate S, the length L of the element B in the horizontal direction, and the second tilt angle θt. Specifically, the second depth of field D2 is obtained based on a relation of the second depth of field d2=h×sin (θt) +l×cos (θt).

As an example, in the case of the deviation amount h=1.0 [ mm ], the length l=4.0 [ mm ], θu=60 degrees, and θt=30 degrees, the first depth of field D1 is calculated to be about 2.866[ mm ], and the second depth of field D2 is calculated to be about 3.964[ mm ]. In this case, the second depth of field D2 is about 1.4 times deeper than the first depth of field D1. Thus, the F value of the second camera 83a is set smaller than the F value of the first camera 82a so that the second depth of field D2 becomes a depth of about 1.4 times the first depth of field D1. In this way, the first camera 82a and the second camera 83a are designed.

(control part)

As shown in fig. 1, the control unit 9 includes a CPU (Central Processing Unit: central processing unit) and a storage unit. The storage unit is a storage device having a Memory such as a ROM (Read Only Memory) and a RAM (Random Access Memory) and the like. The memory unit stores a component mounting program for mounting the component B on the substrate S.

As shown in fig. 6, the control unit 9 is configured to acquire a position in the horizontal direction (XY direction) and a height position H3 in the vertical direction (Z direction) of the component B at the suction position P2 of the component B based on the images of the suction position P2 of the component B captured by the first capturing unit 82 and the second capturing unit 83 from a plurality of (two) directions. The control unit 9 is configured to acquire the position in the horizontal direction (XY direction) and the height position H3 in the vertical direction (Z direction) of the mounting position P3 of the component B based on the images of the mounting position P3 of the component B captured by the first imaging unit 82 and the second imaging unit 83 from the plurality of (two) directions.

Specifically, the control unit 9 is configured to obtain the height position H3 with respect to the reference plane H0 by stereo matching. That is, by matching the images of the suction position P2 or the mounting position P3 of the component B captured by the first capturing section 82 and the second capturing section 83 substantially simultaneously, the height position H3 and the horizontal position of the captured position are obtained. That is, the control unit 9 is configured to control: the height position H3 of the periphery of the imaging target is acquired based on the first image captured by the first imaging unit 82 and the second image captured by the second imaging unit 83. The matching uses a general matching method such as SSD (Sum of Squared Difference: sum of square differences), SAD (Sum of Absolute Difference: sum of absolute differences), and the like.

(effects of the first embodiment)

In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, in the first imaging section 82 and the second imaging section 83 (the plurality of imaging sections), different depths of field are set according to the first inclination angle θu and the first inclination angle θu from the respective height positions toward the respective optical axes of the element B. Thus, even if the first imaging unit 82 and the second imaging unit 83 (the plurality of imaging units) are arranged at a plurality of different height positions in the Z direction (vertical direction), the focus setting can be performed individually for the attachment position P2 or the mounting position P3 at which the element B (the object) is arranged, by setting a different depth of field in each of the first imaging unit 82 and the second imaging unit 83 (the plurality of imaging units) according to the tilt angle. As a result, the focus of the image captured from the oblique direction by each of the first imaging unit 82 and the second imaging unit 83 (the plurality of imaging units) arranged at a plurality of different height positions in the vertical direction can be made more reliable to coincide.

In the first embodiment, as described above, the first imaging unit 82 and the second imaging unit 83 are provided, the first imaging unit 82 having the first inclination angle θu in the inclination direction close to the Z direction (vertical direction) among the inclination angles, and the second imaging unit 83 being disposed below the first imaging unit 82 and having the second inclination angle θt in the inclination direction close to the horizontal direction than the first inclination angle θu. The second imaging unit 83 is set with a second depth of field D2 deeper than the first depth of field D1 of the first imaging unit 82. Accordingly, by making the second depth of field D2 deeper than the first depth of field D1, the second depth of field D2 of the second imaging unit 83 can be sufficiently ensured, and therefore, the focal points of the images imaged by the second imaging unit 83 can be made more reliably uniform.

In the first embodiment, as described above, the first imaging unit 82 and the second imaging unit 83 are arranged vertically in the same plane along the Z direction (vertical direction) and image the same suction position P2 (imaging position) or mounting position P3 (imaging position) where the element B (imaging target) is arranged from the oblique direction. The second imaging unit 83 is disposed below the first imaging unit 82 in the Z direction (vertical direction), and a second depth of field D2 deeper than the first depth of field D1 is set. As a result, the installation space in the horizontal direction of the first imaging unit 82 and the second imaging unit 83 can be reduced as compared with a case where the first imaging unit 82 and the second imaging unit 83 are arranged at positions offset from the same plane along the Z direction (vertical direction). As a result, the focal points of the images captured by the second imaging unit 83 can be more reliably made uniform, and the head unit 4 provided with the first imaging unit 82 and the second imaging unit 83 can be suppressed from becoming large.

In the first embodiment, as described above, the first depth of field D1 is set to a constant depth of field by setting the aperture of the first imaging unit 82 to a constant value. By setting the aperture of the second photographing section 83 to be constant, the second depth of field D2 is set to be a constant depth of field deeper than the first depth of field D1. Accordingly, the first imaging unit 82 and the second imaging unit 83 do not need to have a structure for adjusting the aperture, and thus the head unit 4 can be prevented from being enlarged.

In the first embodiment, as described above, each of the first imaging unit 82 and the second imaging unit 83 is configured to take an image of at least one of the periphery of the mounting position P3 of the component B and the periphery of the suction position P2 of the component B, which are the components B (imaging targets). In a cross section along the arrangement direction of the first imaging section 82 and the second imaging section 83, each of the first depth of field D1 and the second depth of field D2 is set according to the amount of deviation H of the height position of the upper surface of the substrate S caused by the warp of the substrate S, the length L of the element B in the horizontal direction, the first tilt angle θu, and the second tilt angle θt. Accordingly, the first depth of field D1 and the second depth of field D2 having appropriate values can be obtained, and thus an appropriate depth of field can be set for each of the first imaging unit 82 and the second imaging unit 83.

In the first embodiment, as described above, the first camera 82a and the second camera 83a are provided in the first imaging unit 82 and the second imaging unit 83, respectively. In this way, the structure of the optical system such as lenses of the first imaging unit 82 and the second imaging unit 83 can be simplified as compared with the case of imaging with a common camera, and therefore, the structure of the first imaging unit 82 and the second imaging unit 83 can be suppressed from being complicated.

In the first embodiment, as described above, the control unit 9 is configured to acquire the height position of the periphery of the element B (object to be imaged) based on the first image captured by the first imaging unit 82 and the second image captured by the second imaging unit 83. Accordingly, the height position of the periphery of the imaging target can be more accurately acquired by the height position of the periphery of the first image and the focused second image acquisition element B (imaging target), and therefore the mounting head 42 can perform the operation on the substrate S with high accuracy.

Second embodiment

The structure of the component mounting apparatus 200 of the second embodiment will be described with reference to fig. 7 and 8. In the second embodiment, unlike the first embodiment, the brightness of the image captured by the first capturing section 82 is matched with the brightness of the image captured by the second capturing section 83 by the control section 209. In the second embodiment, the same configuration as in the first embodiment is not described.

As shown in fig. 7 and 8, the component mounting apparatus 200 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, a component recognition imaging unit 7, an imaging unit 8, and a control unit 209. The component mounting apparatus 200 is an example of a "substrate working apparatus" in the scope of the claims.

The control unit 209 of the second embodiment is configured to perform control as follows: by making the exposure time of each of the first imaging unit 82 and the second imaging unit 83 different, the brightness of the images imaged by each of the first imaging unit 82 and the second imaging unit 83 is made substantially the same as each other. Specifically, the control unit 209 performs the following control: the exposure time of the second imaging unit 83 is set to be longer than the exposure time of the first imaging unit 82 by an amount that the amount of transmitted light decreases due to the depth of field, so that the brightness of the images captured by the first imaging unit 82 and the second imaging unit 83 are substantially the same as each other.

In this case, the control unit 209 may be configured to perform the exposure of the second imaging unit 83 in parallel with the exposure of the first imaging unit 82. That is, for example, when the timing of the start of the exposure of the first imaging unit 82 is made to coincide with the timing of the start of the exposure of the second imaging unit 83, the timing of the end of the exposure of the first imaging unit 82 may be made to coincide with the timing of the end of the exposure of the second imaging unit 83. In addition, as an example, during the exposure of the second imaging unit 83, the exposure of the first imaging unit 82 may be started and the exposure of the first imaging unit 82 may be ended. In addition, as an example, the exposure of the first imaging unit 82 may be started during the exposure of the second imaging unit 83, and the exposure of the first imaging unit 82 may be ended after the exposure of the second imaging unit 83 is ended. Other structures of the second embodiment are the same as those of the first embodiment.

(effects of the second embodiment)

In the second embodiment, as in the first embodiment described above, different depths of field are set in the first imaging unit 82 and the second imaging unit 83 (the plurality of imaging units) according to the first inclination angle θu and the first inclination angle θu from the respective height positions toward the respective optical axes of the elements B. This makes it possible to more reliably match the focal points of the images captured from the oblique directions by the first imaging unit 82 and the second imaging unit 83 (the plurality of imaging units) arranged at a plurality of different height positions in the vertical direction.

In the second embodiment, as described above, the component mounting apparatus 200 is provided with: an illumination unit 81 that irradiates light onto the element B (subject); and a control unit 209 that performs control of imaging the element B (imaging target) by each of the first imaging unit 82 and the second imaging unit 83. The control unit 209 is configured to control: by making the exposure time of each of the first imaging unit 82 and the second imaging unit 83 different, the brightness of the images imaged by each of the first imaging unit 82 and the second imaging unit 83 is made substantially the same as each other. Thus, even when the second depth of field D2 is set deeper than the first depth of field D1, focusing can be performed in the second imaging unit 83, and not only can the brightness of the image imaged by the second imaging unit 83 be ensured. As a result, the focus of the image captured by the second imaging unit 83 can be more reliably matched, and the second imaging unit 83 can capture an image having the same brightness as the image captured by the first imaging unit 82.

In the second embodiment, as described above, the control unit 209 is configured to perform the exposure of the second imaging unit 83 in parallel with the exposure of the first imaging unit 82. This minimizes the time required for exposure when photographing the suction position P2 or the mounting position P3 (photographing position), and thus the working time of the mounting head 42 for the substrate S can be kept from increasing. In addition, other effects of the second embodiment are the same as those of the first embodiment.

Modification example

The first and second embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is not shown by the description of the first and second embodiments described above, but by the scope of the claims, and includes all modifications (variations) within the meaning and scope equivalent to the scope of the claims.

For example, in the first and second embodiments described above, the first imaging unit 82 and the second imaging unit 83 are arranged vertically in the same plane along the vertical direction and the same imaging position where the imaging subject is arranged is imaged from the oblique direction, but the present invention is not limited to this. In the present invention, the first imaging unit and the second imaging unit may not be disposed on the same plane along the vertical direction.

In the second embodiment, the control unit 9 (209) is configured to control: the exposure time for each of the first imaging unit 82 and the second imaging unit 83 is made different, so that the brightness of the images imaged by each of the first imaging unit 82 and the second imaging unit 83 is made substantially the same as each other. In the present invention, the control unit may be configured to control: the respective sensor gains for the first imaging unit and the second imaging unit are made different, so that the brightness of the images imaged by the first imaging unit and the second imaging unit are made substantially the same. In this case, the control unit sets the sensor gain of the second imaging unit to be larger than the sensor gain of the first imaging unit. The control unit may be configured to control: the brightness of the images captured by the first imaging unit and the second imaging unit are made substantially equal to each other by making the amounts of light of the illumination units different. In this case, in the control section, the timing of the first photographing section exposure and the timing of the second photographing section exposure are set separately, and the light amount at the time of the second photographing section exposure is set to be larger than the light amount at the time of the first photographing section exposure.

In the first and second embodiments, the first imaging unit 82 and the second imaging unit 83 have the first camera 82a and the second camera 83a, respectively, but the present invention is not limited to this. In the present invention, as in the modification shown in fig. 9, the first imaging unit 82 and the second imaging unit 83 may have a shared camera 382 and an optical system 383 that divides the field of view of the shared camera. This suppresses the number of cameras required, and thus suppresses the increase in size of the head unit 4.

In the first and second embodiments, the mounting head 42 is shown as an example of the "work head" in the scope of the claims, but the present invention is not limited thereto. In the present invention, the work head may be a dispensing head for applying an adhesive to a substrate.

In the first and second embodiments, the component mounting apparatus is shown as an example of the "substrate working apparatus" in the scope of the claims, but the present invention is not limited thereto. In the present invention, the substrate working apparatus may be a coating apparatus for coating an adhesive, cream solder, or the like on a substrate.

In the second embodiment, the control unit 209 is configured to perform the exposure of the second imaging unit 83 in parallel with the exposure of the first imaging unit 82, but the present invention is not limited to this. In the present invention, the exposure of the first imaging unit and the exposure of the second imaging unit may be performed sequentially.

Description of the reference numerals

4-head unit

42 mounting head (working head)

81 lighting part

82 first photographing part (multiple photographing parts)

82a first camera

83 second photographing part (multiple photographing parts)

83a second camera

100. 200 element mounting device (substrate working device)

382. Shared camera

383. Optical system

B element (shooting object)

D1 First depth of field

D2 Second depth of field

Amount of H deviation

H3 Height position

L length

P2 adsorption position (shooting position)

P3 mounting position (shooting position)

S substrate

Second inclination angle of thetat

θu first inclination angle

Claims

1. A substrate working device is provided with:

a head unit including a work head for performing work on the substrate; a kind of electronic device with high-pressure air-conditioning system

A plurality of photographing sections provided in the head unit in a state of being disposed at a plurality of different height positions in the vertical direction, and photographing the same photographing position at which the photographing object is disposed from different oblique directions,

in the plurality of imaging units, different depths of field are set according to the inclination angles of the inclination directions in which the respective imaging units are to take images.

2. The substrate processing apparatus according to claim 1, wherein,

the plurality of imaging units are provided with:

a first imaging unit having a first inclination angle in an inclination direction close to the vertical direction among the inclination angles; a kind of electronic device with high-pressure air-conditioning system

A second imaging unit disposed below the first imaging unit and having a second tilt angle closer to a horizontal tilt direction than the first tilt angle,

the second photographing part has a second depth of field deeper than the first depth of field of the first photographing part.

3. The substrate processing apparatus according to claim 2, wherein,

the first photographing part and the second photographing part are arranged vertically in the same plane along the vertical direction and photograph the same photographing position where the photographing object is arranged from the oblique direction,

the second imaging unit is disposed below the first imaging unit in the vertical direction and has the second depth of field deeper than the first depth of field.

4. The substrate processing apparatus according to claim 2 or 3, wherein,

by setting the aperture of the first photographing section to be constant, the first depth of field is set to be a constant depth of field,

the second depth of field is set to a constant depth of field deeper than the first depth of field by setting the aperture of the second photographing section to be constant.

5. The substrate processing apparatus according to any one of claims 2 to 4, wherein,

each of the first photographing section and the second photographing section is configured to photograph at least one of a periphery of a mounting position of an element as the photographing object and a periphery of a suction position of the element,

the first depth of field and the second depth of field are each set in a cross section along an arrangement direction of the first imaging section and the second imaging section according to a conceivable amount of deviation of a height position of an upper surface of the substrate caused by warpage of the substrate or a conceivable amount of deviation of a height position of an upper surface of the element housed in the housing tape caused by a difference in a kind of housing tape housing the element, a length in a horizontal direction of the element, and the tilt angle.

6. The substrate processing apparatus according to any one of claims 2 to 5, wherein,

the substrate working device further comprises:

an illumination unit that irradiates light to the subject; a kind of electronic device with high-pressure air-conditioning system

A control unit configured to control the imaging of the subject by each of the first imaging unit and the second imaging unit,

the control unit is configured to control: the brightness of the images captured by the first imaging unit and the second imaging unit is made substantially equal to each other by making any one of the sensor gains for the first imaging unit and the second imaging unit, the exposure times for the first imaging unit and the second imaging unit, and the light amounts of the illumination units different from each other.

7. The substrate processing apparatus according to claim 6, wherein,

the control unit is configured to perform exposure of the second imaging unit in parallel with exposure of the first imaging unit.

8. The substrate working apparatus according to any one of claims 2 to 7, wherein,

the first photographing part and the second photographing part include a first camera and a second camera, respectively.

9. The substrate working apparatus according to any one of claims 2 to 7, wherein,

the first photographing part and the second photographing part include:

a shared camera; a kind of electronic device with high-pressure air-conditioning system

An optical system dividing a field of view of the common camera.

10. The substrate working apparatus according to any one of claims 2 to 9, wherein,

the substrate working device is configured to acquire a height position of the periphery of the imaging target based on the first image captured by the first imaging unit and the second image captured by the second imaging unit.