JP6912993B2 - Component mounting device - Google Patents

Description

The present invention relates to a component mounting device.

Conventionally, component mounting devices are known (see, for example, Patent Document 1).

Patent Document 1 discloses a component mounting device including a suction nozzle for mounting a component on a substrate and a camera module capable of capturing an image of a component mounting position by the suction nozzle from a plurality of directions. This component mounting device is configured to measure a three-dimensional position (height position) of the mounting position by performing stereo measurement based on images captured from a plurality of directions.

Japanese Unexamined Patent Publication No. 2014-216621

In the component mounting device of Patent Document 1, it is considered that when stereo measurement is performed based on images captured from a plurality of directions, images captured from different directions are compared (matched) and analyzed. Be done.

Here, since there are a plurality of patterns having similar shapes around the suction position of the component on the component supply unit in the component mounting device and around the mounting position of the component on the substrate, a narrow range only around the target portion. Matching using the above as a template has the disadvantage that erroneous matching is likely to occur. On the other hand, if matching is performed using a wide range as a template, there is a disadvantage that an error is likely to occur due to the influence of feature points other than the target location. As a result, it is difficult for a conventional component mounting device such as Patent Document 1 to accurately measure a three-dimensional position (height position) around the suction position or the mounting position of a component imaged by an imaging unit. There is a problem that it is.

The present invention has been made to solve the above problems, and one object of the present invention is to accurately acquire the height position around the suction position or the mounting position imaged by the imaging unit. Is to provide a component mounting device capable of.

The component mounting device according to one aspect of the present invention includes a head unit including a mounting head for mounting components on a substrate, and at least one of the periphery of the component suction position and the periphery of the mounting position provided on the head unit. A first template and a second image, which are capable of capturing images from a plurality of directions and include an imaging unit that captures a first image and a second image from different directions , and a part of the first image is extracted. Matching is performed, the matching result is acquired, extracted from the first image, and the matching search range between the second template in a range smaller than the first template and the second image is set based on the acquired matching result. It is configured to match the second template with the second image to acquire the first height position around the imaged suction position or the mounting position. In the present invention, the area around the adsorption position includes the adsorption position and the area around the adsorption position. Further, in the present invention, the mounting position periphery includes the mounting position and the area around the mounting position. Further, in the present invention, the template means an image area to be compared.

In the component mounting device according to one aspect of the present invention, by configuring as described above, an approximate matching search range can be set by matching a relatively large range of the first template and the second image. Further, when matching is performed using the second template having a relatively small range, an approximate matching search range is set, so that erroneous matching can be suppressed. As a result, it is possible to accurately acquire the height position around the suction position or the mounting position imaged by the imaging unit. That is, it is possible to acquire a more accurate height position as compared with the case where the height position is acquired only by the template in a large range. In addition, the height position of the target location can be acquired more stably as compared with the case where the height position is acquired only by the template in a small range.

In the component mounting device according to the above one aspect, preferably, the first template and the second image are matched, the second height position of the imaged position is acquired, and the matching search between the second template and the second image is performed. The range is set based on the acquired second height position, the second template and the second image are matched, and the first height position of the imaged position is acquired. With this configuration, the second height position, which is the approximate height position, can be obtained by matching the first template with the second image, so that the second height, which is the approximate height position, can be obtained. Based on the position, an appropriate matching search range between the second template and the second image can be easily set.

In this case, preferably, the matching search range between the second template and the second image is set within a predetermined range based on the second height position based on the acquired second height position. ing. With this configuration, the second height position is used as a reference by matching the second template with the second image using the matching search range set within a predetermined range based on the second height position. The height position can be acquired more accurately.

In the configuration in which the matching search range between the second template and the second image is set based on the second height position, the second template is preferably configured so that a part of the first template is extracted. There is. With this configuration, the height position of the range including the second template can be acquired as the second height position by matching the first template and the second image, so that the acquired second height position can be obtained. Based on this, the matching search range between the second template and the second image can be set more appropriately.

In the configuration in which the matching search range between the second template and the second image is set based on the second height position, preferably, the height position of the substrate surface is acquired as the second height position, and the substrate surface is set. A range based on the thickness of the part based on the height position is set as a matching search range between the second template and the second image, and the second template and the second image are matched to form the first height position. It is configured to acquire the height position of the mounting position of the component on the board. With this configuration, the matching search range between the second template and the second image can be narrowed down to an appropriate range, so the mounting position of the components on the board is higher than when matching with a wider search range. The position can be acquired more accurately. Further, since the matching search range of the process of acquiring the height position of the component mounting position can be reduced, the process of acquiring the height position of the component mounting position can be speeded up accordingly.

In the component mounting device according to the above one aspect, preferably, the imaging unit is configured to be capable of imaging from a plurality of oblique directions with respect to the vertical direction. With this configuration, the image pickup unit can image the suction position or mounting position of the component with the mounting head placed above the suction position or mounting position of the component. Therefore, the component suction operation by the mounting head Alternatively, the component mounting operation and the imaging operation can be easily performed in parallel. As a result, it is possible to suppress a long time for the component suction operation or the component mounting operation.

In the component mounting apparatus according to the above aspect, preferably, the imaging unit includes a plurality of cameras or includes an optical system that divides the field of view of the single camera and the single camera. With this configuration, the imaging position can be easily imaged from a plurality of directions by the optical system that divides the fields of view of the plurality of cameras or a single camera.

According to the present invention, as described above, it is possible to provide a component mounting device capable of accurately acquiring the height position of the position imaged by the imaging unit.

It is a figure which showed the whole structure of the component mounting apparatus by embodiment of this invention. It is a side view at the time of component suction of the head unit of the component mounting apparatus according to the embodiment of the present invention. It is a side view at the time of component mounting of the head unit of the component mounting apparatus according to the embodiment of the present invention. It is a figure for demonstrating the height position acquisition of the imaged position in the component mounting apparatus by embodiment of this invention. It is a figure which showed the 1st example of the matching in the component mounting apparatus by embodiment of this invention. It is a side view which showed an example of a substrate. It is a figure for demonstrating the acquisition of the height position of a component in the component mounting apparatus by embodiment of this invention. It is a figure which showed the 2nd example of the matching in the component mounting apparatus by embodiment of this invention. It is a side view of the head unit of the component mounting apparatus according to the modification of the embodiment of this invention.

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

(Configuration of component mounting device)
The configuration of the component mounting device 100 according to the embodiment of the present invention will be described with reference to FIG.

As shown in FIG. 1, the component mounting device 100 is a component mounting device that conveys the substrate P in the X direction by a pair of conveyors 2 and mounts the component 31 on the substrate P at the mounting work position M.

The component mounting device 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, a component recognition imaging unit 7, and an imaging unit 8. And a control unit 9. The image pickup unit 8 is an example of the "imaging unit" in the claims.

The pair of conveyors 2 are installed on the base 1 and are configured to convey the substrate P in the X direction. Further, the pair of conveyors 2 are provided with a holding mechanism for holding the substrate P being conveyed in a stopped state at the mounting work position M. Further, the pair of conveyors 2 are configured so that the distance in the Y direction can be adjusted according to the dimensions of the substrate P.

The component supply unit 3 is arranged on the outside (Y1 side and Y2 side) of the pair of conveyors 2. Further, a plurality of tape feeders 3a are arranged in the component supply unit 3. The component supply unit 3 is configured to supply the component 31 to the mounting head 42 described later.

The tape feeder 3a holds a reel (not shown) around which a tape holding a plurality of parts 31 is held at predetermined intervals. The tape feeder 3a is configured to rotate the reel by sending out the tape holding the component 31 to supply the component 31 from the tip of the tape feeder 3a. Here, the component 31 includes electronic components such as ICs, transistors, capacitors and resistors.

The head unit 4 is arranged above the pair of conveyors 2 and the component supply unit 3, and includes a plurality of (five) mounting heads 42 having nozzles 41 (see FIG. 2) attached to the lower ends, and a substrate recognition camera. 43 and is included.

The mounting head 42 is configured to mount the component 31 on the substrate P. Specifically, the mounting head 42 is configured to suck the component 31 supplied by the component supply unit 3 and mount the suctioned component 31 on the substrate P arranged at the mounting work position M. There is. Further, the mounting head 42 is configured to be movable up and down (movable in the Z direction), and is supplied from the tape feeder 3a by the negative pressure generated at the tip of the nozzle 41 by the negative pressure generator (not shown). It is configured to attract and hold the component 31 and mount (mount) the component 31 at a mounting position on the substrate P.

The substrate recognition camera 43 is configured to image the fiducial mark F of the substrate P in order to recognize the position and orientation of the substrate P. Then, by imaging and recognizing the position of the fiducial mark F, it is possible to accurately acquire the mounting position of the component 31 on the substrate P.

The support portion 5 includes a motor 51. The support portion 5 is configured to move the head unit 4 in the X direction along the support portion 5 by driving the motor 51. Both ends of the support portion 5 are supported by a pair of rail portions 6.

The pair of rail portions 6 are fixed on the base 1. The rail portion 6 on the X1 side includes the motor 61. The rail portion 6 is configured to move the support portion 5 along the pair of rail portions 6 in the Y direction orthogonal to the X direction by driving the motor 61. Since the head unit 4 can move in the X direction along the support portion 5 and the support portion 5 can move in the Y direction along the rail portion 6, the head unit 4 can move in the horizontal direction (XY direction). It is movable.

The component recognition imaging unit 7 is fixed on the upper surface of the base 1. The component recognition imaging unit 7 is arranged on the outside (Y1 side and Y2 side) of the pair of conveyors 2. The component recognition imaging unit 7 images the component 31 sucked by the nozzle 41 of the mounting head 42 from the lower side (Z2 side) in order to recognize the suction state (suction posture) of the component 31 prior to mounting the component 31. It is configured to do. As a result, the suction state of the component 31 attracted to the nozzle 41 of the mounting head 42 can be acquired by the control unit 9.

The image pickup unit 8 is provided in the head unit 4. As a result, the image pickup unit 8 is configured to move in the horizontal direction (XY direction) together with the head unit 4 by moving the head unit 4 in the XY direction. Further, as shown in FIG. 2, the image pickup unit 8 is configured so that the component supply position 30 of the component supply unit 3 can be imaged from a plurality of directions. Further, as shown in FIG. 3, the image pickup unit 8 is configured so that the mounting position of the substrate P can be imaged from a plurality of directions. Further, as shown in FIGS. 2 and 3, the image pickup unit 8 includes a plurality of cameras 81 and an illumination 82. The plurality of cameras 81 have scissors angles and are arranged vertically. As a result, the image pickup unit 8 can image the suction position of the component 31 by the mounting head 42 and the mounting position of the component 31 by the mounting head 42 from a plurality of directions (angles), respectively. Further, the image pickup unit 8 is arranged offset with respect to the mounting head 42 so as not to interfere with the vertical movement of the mounting head 42. Further, the image pickup unit 8 is configured to be able to take an image at a position where the mounting head 42 is lowered without moving the head unit 4.

As shown in FIG. 2, the imaging unit 8 is configured to be capable of imaging the component supply position 30 from a plurality of oblique directions with respect to the vertical direction (Z direction). Further, as shown in FIG. 3, the image pickup unit 8 is configured so that the mounting position of the component 31 can be imaged from a plurality of oblique directions with respect to the vertical direction (Z direction). Specifically, as shown in FIG. 4, the imaging unit 8 is configured to image from tilt angles (θL and θH) in which the imaging directions are different from each other with respect to the reference plane H0. Further, the camera 81 of the imaging unit 8 is arranged adjacent to the reference plane H0 in the vertical plane (in the YZ plane) including the suction position of the component 31 or the mounting position of the component 31. Further, the plurality of cameras 81 are arranged so as to be offset vertically.

The imaging unit 8 is configured to image the periphery of the suction position of the component 31 from a plurality of directions to capture the first image and the second image. Further, the imaging unit 8 is configured to image the periphery of the mounting position of the component 31 from a plurality of directions to capture the first image and the second image. That is, the image pickup unit 8 is configured to be capable of taking images from a plurality of oblique directions with respect to the vertical direction (Z direction).

The illumination 82 is configured to emit light when an image is taken by the camera 81. The illumination 82 is provided around the camera 81. The illumination 82 has a light source such as an LED (light emitting diode).

The control unit 9 includes a CPU, and mounts components such as a transfer operation of the substrate P by a pair of conveyors 2, a mounting operation by the head unit 4, an imaging operation by the component recognition imaging unit 7, an imaging unit 8, and a substrate recognition camera 43. It is configured to control the overall operation of the device 100.

Here, in the present embodiment, the control unit 9 determines the horizontal direction (XY direction) of the component 31 at the suction position of the component 31 based on the images of the suction positions of the component 31 imaged from a plurality of directions by the image pickup unit 8. It is configured to acquire the position and the height position in the vertical direction (Z direction). Further, the control unit 9 determines the horizontal (XY direction) position and the vertical direction (Z direction) of the mounting position of the component 31 based on the images of the mounting position of the component 31 imaged by the imaging unit 8 from a plurality of directions. It is configured to get the height position.

Specifically, as shown in FIG. 4, the control unit 9 is configured to acquire the height position H1 with respect to the reference plane H0 by stereo matching. That is, the height position and the horizontal position of the imaged position are acquired by matching the images of the suction position or the mounting position of the component 31 imaged substantially simultaneously by the plurality of cameras 81. For matching, a general matching method such as SSD (Sum of Squared Difference) or SAD (Sum of Absolute Difference) is used.

That is, in the present embodiment, the control unit 9 is configured to acquire the height of the suction position of the component 31 and the height of the mounting position of the component 31 based on the images captured in the plurality of directions of the image pickup unit 8. ing. Specifically, as shown in FIG. 4, the control unit 9 is configured to acquire the height position H1 with respect to the reference plane H0 by stereo matching.

One camera 81 images an object (a predetermined position of the reference plane H0) at an inclination angle θH, and the other camera 81 images an object at an inclination angle θL. Then, the parallax p (pixel) between the two captured images is obtained by stereo-matching the captured image with the tilt angle θH and the captured image with the tilt angle θL. Here, assuming that the camera resolution of the camera 81 is R (μm / pixel), the distance A (μm) can be obtained by the equation (1).
A = p × R / sin (θH−θL) ・ ・ ・ (1)

Then, using the distance A obtained by the formula (1), the distance hp (μm) to the height position H1 with respect to the reference plane H0 is obtained by the formula (2).
hp = A × sin (θL) ・ ・ ・ (2)

As a result, the vertical height position and the horizontal position at the suction position or the mounting position of the component 31 can be accurately obtained. It should be noted that an angle error occurs due to the deviation from the center of the field of view of the camera 81 depending on the height position and the position of the imaging target. The angle error is corrected by a table obtained in advance, calculation, or the like.

In matching, the degree of matching is compared while shifting the templates (first template or second template) extracted from the first image one pixel at a time on the second image. Then, the point having the largest degree of matching is obtained as a matching point. The parallax is obtained from the obtained matching point, and the three-dimensional position of the imaging position is obtained.

Further, in the present embodiment, as shown in FIG. 5, the control unit 9 is configured to match the first template extracted from a part of the first image with the second image and acquire the matching result. Has been done. Further, the control unit 9 is configured to extract from the first image and set a matching search range between the second template and the second image in a range smaller than the first template based on the acquired matching result. There is. Further, the control unit 9 is configured to match the second template with the second image and acquire the first height position around the imaged suction position or the mounting position.

Specifically, the control unit 9 is configured to match the first template with the second image and acquire the second height position of the captured position. Further, the control unit 9 is configured to set the matching search range between the second template and the second image based on the acquired second height position. Further, the control unit 9 is configured to match the second template with the second image and acquire the first height position around the imaged suction position or the mounting position.

That is, the control unit 9 acquires the second height position, which is an approximate height position, using the first template in a relatively large range. Then, the control unit 9 acquires a target first height position by matching the second template in a relatively small range with the second image based on the second height position.

Further, the control unit 9 is configured to set the matching search range between the second template and the second image within a predetermined range based on the second height position based on the acquired second height position. Has been done. For example, the control unit 9 uses the second height position as a reference, takes into consideration the effects of the thickness of the component 31 and the warp of the substrate P, and secondly sets the portion of the second image corresponding to the height position in a predetermined range. Set to the search range by template. The matching search range between the second template and the second image is smaller than the matching search range between the first template and the second image. Further, the second template is configured so that a part of the first template is extracted.

Specifically, as shown in FIG. 5, the control unit 9 matches the first template extracted from the first image with the second image. At this time, the range in which the first template is searched on the second image is set to substantially the entire area of the second image. The control unit 9 acquires the second height position, which is the height position at the feature point of the first template, based on the matching result of the first template and the second image.

The control unit 9 extracts from the first image and matches the second template, which is a part of the first template, with the second image. At this time, the range in which the second template is searched on the second image is set based on the second height position. That is, based on the second height position, the portion of the second image corresponding to the height position where the feature points of the second template can exist is set in the matching search range.

FIG. 6 shows an example of the substrate P. The substrate P contains epoxy glass, a resist, electrodes, and silk. In addition, solder is printed (or applied) on the electrodes. Each of the resist, the electrode, and the silk has a thickness of several μm to several tens of μm (size in the Z direction). That is, when it is desired to acquire the height position of the boundary B1 between the solder and the electrode and the size of the template is increased, the boundaries B2 and B3 between the silk and the resist can be recognized as feature points. In this case, an error will occur with respect to the acquired height position by the thickness of the resist or the electrode. That is, when the boundary B1 is arranged at a position different from the reference position on the image due to the influence of the warp of the substrate P, and a similar pattern (boundary B2 or B3) is in the search range, these other features. The points affect the matching.

Further, the control unit 9 is configured to determine the presence or absence of the component 31 on the substrate P by acquiring the height position of the mounting position. That is, the control unit 9 is configured to determine whether or not the component 31 is correctly mounted by measuring the height position on the substrate P imaged by the image pickup unit 8. In this case, as shown in FIG. 7, when similar components 31 are mounted on the substrate P, the components 31 at different horizontal positions may be projected at different height positions in the imaging direction. That is, when the height position of the substrate P is different due to warpage or the like, different parts 31 may be recognized.

Therefore, in the present embodiment, the control unit 9 is configured to acquire the height position of the substrate surface as the second height position. Further, the control unit 9 is configured to set a range based on the thickness of the component 31 as a matching search range between the second template and the second image with reference to the height position of the substrate surface. Further, the control unit 9 is configured to match the second template with the second image and acquire the height position of the mounting position of the component 31 on the substrate as the first height position.

Specifically, as shown in FIGS. 7 and 8, the control unit 9 matches the first template extracted from the first image with the second image. At this time, the range in which the first template is searched on the second image is set to substantially the entire area of the second image. The control unit 9 acquires the second height position, which is the height position of the substrate P, based on the matching result between the first template and the second image.

The control unit 9 extracts from the first image and matches the second template, which is a part of the first template, with the second image. At this time, the range in which the second template is searched on the second image is set based on the second height position. That is, based on the second height position, the portion of the second image corresponding to the height position where the feature points of the second template can exist is set in the matching search range.

(Effect of embodiment)
In this embodiment, the following effects can be obtained.

In the present embodiment, as described above, the component mounting device 100 is configured to match the first template obtained by extracting a part of the first image with the second image and acquire the matching result. Further, the component mounting device 100 is extracted from the first image, and the matching search range between the second template in a range smaller than the first template and the second image is set based on the acquired matching result, and the second template is set. The template and the second image are matched to acquire the first height position of the imaged position. As a result, an approximate matching search range can be set by matching the first template and the second image in a relatively large range. Further, when matching is performed using the second template having a relatively small range, an approximate matching search range is set, so that erroneous matching can be suppressed. As a result, the height position around the suction position or the mounting position imaged by the image pickup unit 8 can be accurately acquired. That is, it is possible to acquire a more accurate height position as compared with the case where the height position is acquired only by the template in a large range. In addition, the height position of the target location can be acquired more stably as compared with the case where the height position is acquired only by the template in a small range.

Further, in the present embodiment, as described above, the component mounting device 100 matches the first template and the second image, acquires the second height position of the imaged position, and obtains the second template and the second image. The matching search range with the image is set based on the acquired second height position, the second template and the second image are matched, and the first height position of the imaged position is acquired. do. As a result, the second height position, which is the approximate height position, can be obtained by matching the first template with the second image, so that the second height position, which is the approximate height position, can be obtained. , An appropriate matching search range between the second template and the second image can be easily set.

Further, in the present embodiment, as described above, the component mounting device 100 uses the second height position as a reference for the matching search range between the second template and the second image based on the acquired second height position. Is configured to be set within a predetermined range. As a result, by matching the second template and the second image using the matching search range set within a predetermined range based on the second height position, the accuracy is further improved based on the second height position. The height position can be obtained.

Further, in the present embodiment, as described above, the second template is configured so that a part of the first template is extracted. As a result, the height position of the range including the second template can be acquired as the second height position by matching the first template and the second image. Therefore, based on the acquired second height position, the second height position can be acquired. The matching search range between the two templates and the second image can be set more appropriately.

Further, in the present embodiment, as described above, the component mounting device 100 is set as the second height position, the height position of the substrate surface is acquired, and the range based on the thickness of the component is based on the height position of the substrate surface. Is set as a matching search range between the second template and the second image, the second template and the second image are matched, and the height position of the mounting position of the component 31 on the board is set as the first height position. Is configured to get. As a result, the matching search range between the second template and the second image can be narrowed down to an appropriate range, so that the height position of the mounting position of the component 31 on the board can be set as compared with the case of matching with a wide search range. It can be acquired more accurately. Further, since the matching search range of the process of acquiring the height position of the mounting position of the component 31 can be reduced, the process of acquiring the height position of the mounting position of the component 31 can be speeded up accordingly. ..

Further, in the present embodiment, as described above, the imaging unit 8 is configured to be capable of imaging from a plurality of oblique directions with respect to the vertical direction (Z direction). As a result, the image pickup unit 8 can image the suction position or the mounting position of the component 31 with the mounting head 42 arranged above the suction position or the mounting position of the component 31, so that the component suction by the mounting head 42 can be performed. The operation or component mounting operation and the imaging operation can be easily performed in parallel. As a result, it is possible to suppress a long time for the component suction operation or the component mounting operation.

Further, in the present embodiment, as described above, the image pickup unit 8 is provided with a plurality of cameras 81. As a result, the imaging position can be easily imaged from a plurality of directions by the plurality of cameras 81.

(Modification example)
It should be noted that the embodiments disclosed this time are exemplary in all respects and are not considered to be restrictive. The scope of the present invention is shown by the claims rather than the description of the above-described embodiment, and further includes all modifications (modifications) within the meaning and scope equivalent to the claims.

For example, in the above embodiment, an example of a configuration in which the imaging unit includes a plurality of cameras and the imaging position can be imaged from a plurality of directions has been shown, but the present invention is not limited to this. In the present invention, as in the modified example shown in FIG. 9, the image pickup unit 8a may include a camera 81a, an illumination 82, and an optical system 83. In this case, the optical system 83 including the lens and the mirror may divide the field of view of the single camera 81a so that the imaging position can be imaged from a plurality of directions. The image pickup unit 8a is an example of the "imaging unit" in the claims.

Further, the imaging position may be imaged from a plurality of directions by taking an image while moving one camera.

Further, in the above embodiment, an example of the configuration in which the matching process is performed by the control unit is shown, but the present invention is not limited to this. In the present invention, the matching process may be performed by an image processing unit provided separately from the control unit. In this case, the image processing unit may perform processing according to the hardware configuration or may perform processing using software.

Further, in the above embodiment, an example of a configuration in which the height position of the imaged position is acquired by the control unit based on the matching process is shown, but the present invention is not limited to this. In the present invention, the height position of the imaged position may be acquired based on the matching process by the processing unit provided separately from the control unit. In this case, the processing unit may perform processing according to the hardware configuration, or may perform processing using software.

Further, in the above embodiment, the imaging unit has shown an example of a configuration in which both the suction position of the component and the mounting position of the component can be imaged, but the present invention is not limited to this. In the present invention, the imaging unit may be capable of imaging at least one of the suction position of the component and the mounting position of the component.

Further, in the above embodiment, an example of the configuration in which the parts held by the tape are supplied to the parts supply position is shown, but the present invention is not limited to this. In the present invention, the parts placed on the tray or the like may be supplied to the parts supply position.

4 Head unit 8, 8a Imaging unit (imaging unit)
31 Parts 42 Mounting head 81 Camera 81a Camera 83 Optical system 100 Parts mounting device P board

Claims (7)

A head unit that includes a mounting head that mounts components on the board,
An imaging unit provided in the head unit that can image at least one of the periphery of the component suction position and the periphery of the mounting position by the mounting head from a plurality of directions and images the first image and the second image from different directions. And with
The first template obtained by extracting a part of the first image is matched with the second image, a matching result is obtained, and the second template extracted from the first image is smaller than the first template. And the matching search range with the second image is set based on the acquired matching result, the second template and the second image are matched, and the imaged around the suction position or the mounting position. A component mounting device configured to acquire the first height position of the. The first template and the second image are matched, the second height position of the imaged position is acquired, and the matching search range between the second template and the second image is acquired. It is configured to be set based on the position, match the second template with the second image, and acquire the first height position around the suction position or the mounting position that has been imaged. The component mounting device according to claim 1. Based on the acquired second height position, the matching search range between the second template and the second image is set within a predetermined range with reference to the second height position. , The component mounting apparatus according to claim 2. The component mounting device according to claim 2 or 3, wherein the second template is configured so that a part of the first template is extracted. As the second height position, the height position of the substrate surface is acquired, and the range based on the thickness of the component based on the height position of the substrate surface is set as the matching search range between the second template and the second image. The claim is configured to set and match the second template with the second image to obtain the height position of the mounting position of the component on the substrate as the first height position. The component mounting device according to any one of 2 to 4. The component mounting device according to any one of claims 1 to 5, wherein the imaging unit is configured to be capable of imaging from a plurality of oblique directions with respect to the vertical direction. The component mounting according to any one of claims 1 to 6, wherein the imaging unit includes a plurality of cameras, or includes a single camera and an optical system that divides the field of view of the single camera. Device.

Images