CN116261284A - Multilayer circuit board and laminated board manufacturing method thereof - Google Patents
Multilayer circuit board and laminated board manufacturing method thereof Download PDFInfo
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- CN116261284A CN116261284A CN202310358882.8A CN202310358882A CN116261284A CN 116261284 A CN116261284 A CN 116261284A CN 202310358882 A CN202310358882 A CN 202310358882A CN 116261284 A CN116261284 A CN 116261284A
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- steel plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application provides a multilayer circuit board and a laminating method thereof. The method includes placing a plurality of copper foils and a plurality of fusion layers on a second press-fit steel plate; driving the pressing motor to press downwards, and extruding the copper foil by the first pressing steel plate so that overflowed glue in the prepreg passes through the first glue overflow hole; and driving the pressing motor to lift upwards, and separating the first pressing steel plate attached with the glue overflow from the copper foil. When the first pressed steel plate and the second pressed steel plate press-fit copper foil and the fusion layer, redundant glue exists after the prepreg is extruded, namely glue overflows, and the glue overflows from the first pressed steel plate and the second pressed steel plate through the first glue overflow holes, so that the glue overflows from between the first pressed steel plate and the second pressed steel plate, the glue overflows rapidly, the glue overflows are convenient to remove, glue traces are prevented from being formed on the copper foil with the circuit, and the circuit short circuit probability of the multilayer circuit board is reduced.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a multilayer circuit board and a laminating method thereof.
Background
The manufacturing of the multilayer board is to be manufactured by pressing a double-sided inner layer board with PP and copper foil, the PP can be converted into a molten state under the condition of high temperature, the PP can overflow to the periphery after being pressed by stress, and redundant glue can overflow to the board edge.
When manufacturing a plate with a special lamination structure such as a copper-embedded plate and a double-sided aluminum substrate, after lamination extrusion, the glue substance flows onto the plate surface through a copper block gap or a hole of a core plate to form a black glue trace, for example, application numbers are CN202011586813.5 and CN202210593591.2. However, if the glue trace is not cleaned, the risk of short circuit and the like of the circuit can be caused, and the residual glue can be removed only by a ceramic polishing or manual polishing method, so that the cost of the board is too high.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a multilayer circuit board and a laminating method thereof, which are convenient for removing glue overflow.
The aim of the invention is realized by the following technical scheme:
a multilayer wiring board lamination method comprising: adopt multilayer circuit board compression fittings to carry out the pressfitting of multilayer circuit board, multilayer circuit board compression fittings includes: pressing the bearing disc and the plate pressing assembly; the board-making pressing assembly comprises a first pressing steel plate, a second pressing steel plate and a pressing motor, wherein the second pressing steel plate is arranged on the pressing bearing disc, the second pressing steel plate is used for placing a plurality of copper foils and a plurality of fusion layers, a lifting shaft of the pressing motor is connected with the first pressing steel plate so that the first pressing steel plate is far away from or close to the second pressing steel plate, the fusion layers comprise a core plate and a prepreg which are connected with each other, and the first pressing steel plate is provided with a first glue overflow hole;
the multilayer circuit board laminating method comprises the following steps:
placing a plurality of copper foils and a plurality of fusion layers on a second press-fit steel plate;
driving the pressing motor to press downwards, and extruding the copper foil by the first pressing steel plate so that overflowed glue in the prepreg passes through the first glue overflow hole;
and driving the pressing motor to lift upwards, and separating the first pressing steel plate attached with the glue overflow from the copper foil.
In one embodiment, the placing the plurality of copper foils and the plurality of fusion layers on the second pressed steel sheet includes: and sequentially and alternately stacking a plurality of copper foils and a plurality of fusion layers on the second pressed steel plate.
In one embodiment, the placing the plurality of copper foils and the plurality of fusion layers on the second pressed steel sheet further comprises: and stacking a plurality of kraft paper on one surface of the first pressed steel plate, which is away from the copper foil.
In one embodiment, the stacking a plurality of kraft paper on a surface of the first laminated steel sheet facing away from the copper foil further includes: and placing a cover plate on one surface of the kraft paper, which is away from the first pressing steel plate, wherein the cover plate is fixedly connected with a lifting shaft of the pressing motor.
In one embodiment, the driving pressing motor presses down, presses the first pressing steel plate against the copper foil, so that the overflowed glue in the prepreg passes through the first glue overflow hole, and the driving method includes: the driving pressing motor rotates positively, and the cover plate extrudes the first pressing steel plate through a plurality of kraft papers.
In one embodiment, the driving press-fit motor rotates forward, the cover plate presses the first press-fit steel plate through a plurality of kraft paper, and then the driving press-fit motor further comprises: and extruding the fusion layer through the first and second lamination steel plates so as to extrude the glue overflow in the fusion layer from the first glue overflow hole to the position between the first lamination steel plate and kraft paper.
In one embodiment, the driving pressing motor lifts up to separate the first pressing steel plate attached with the glue overflow from the copper foil, and the driving pressing motor includes: driving the pressing motor to rotate reversely so as to lift the cover plate away from kraft paper; and removing the first pressed steel plate and kraft paper positioned on the first pressed steel plate.
In one embodiment, the placing the plurality of copper foils and the plurality of fusion layers on the second pressed steel sheet further comprises: a plurality of kraft paper is stacked on the pressing bearing plate.
In one embodiment, the second pressing steel plate is provided with a second glue overflow hole; the drive pressfitting motor pushes down, extrudes the copper foil with first pressfitting steel sheet to make the overflow glue that overflows in the prepreg pass through first overflow glue hole, include: and extruding the fusion layer through the first and second lamination steel plates so as to extrude the glue overflow in the fusion layer from the second glue overflow hole to the position between the second lamination steel plate and kraft paper.
A multilayer circuit board is prepared by using the multilayer circuit board laminating method according to any embodiment.
Compared with the prior art, the invention has at least the following advantages:
when the first pressed steel plate and the second pressed steel plate press-fit copper foil and the fusion layer, redundant glue exists after the prepreg is extruded, namely glue overflows, and the glue overflows from the first pressed steel plate and the second pressed steel plate through the first glue overflow holes, so that the glue overflows from between the first pressed steel plate and the second pressed steel plate, the glue overflows rapidly, the glue overflows are convenient to remove, glue traces are prevented from being formed on the copper foil with the circuit, and the circuit short circuit probability of the multilayer circuit board is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method of laminating a plurality of circuit board layers according to one embodiment;
FIG. 2 is a graph showing copper residue and warpage of three embodiments of second side copper bumps.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The invention relates to a method for laminating a multilayer circuit board layer. In one embodiment, the multilayer wiring board laminating method includes placing a plurality of copper foils and a plurality of fusion layers on a second laminated steel plate; driving the pressing motor to press downwards, and extruding the copper foil by the first pressing steel plate so that overflowed glue in the prepreg passes through the first glue overflow hole; and driving the pressing motor to lift upwards, and separating the first pressing steel plate attached with the glue overflow from the copper foil. When the first pressed steel plate and the second pressed steel plate press-fit copper foil and the fusion layer, redundant glue exists after the prepreg is extruded, namely glue overflows, and the glue overflows from the first pressed steel plate and the second pressed steel plate through the first glue overflow holes, so that the glue overflows from between the first pressed steel plate and the second pressed steel plate, the glue overflows rapidly, the glue overflows are convenient to remove, glue traces are prevented from being formed on the copper foil with the circuit, and the circuit short circuit probability of the multilayer circuit board is reduced.
Referring to fig. 1, a flow chart of a method for laminating a plurality of circuit board layers according to an embodiment of the invention is shown. The multilayer circuit board laminating method comprises part or all of the following steps.
S100: a plurality of copper foils and a plurality of fusion layers are placed on the second press-fit steel plate.
In this embodiment, the copper foil and the fusion layer are disposed on the second pressing steel plate, and the second pressing steel plate is disposed on the pressing bearing disc, so that the copper foil and the fusion layer are stably disposed on the second pressing steel plate, and the copper foil and the fusion layer are multiple, that is, multiple copper foils and multiple fusion layers are disposed on the second pressing steel plate together, so that the subsequent pressing of the fusion layer and the copper foil is facilitated, and a multilayer circuit board is formed.
S200: and driving the pressing motor to press downwards, and extruding the copper foil by the first pressing steel plate so that overflowed glue in the prepreg passes through the first glue overflow hole.
In this embodiment, the lamination motor is used in cooperation with the first lamination steel plate, specifically, the lamination motor presses the copper foil by pushing the first lamination steel plate, so that the copper foil is laminated with the fusion layer to form a circuit board. The lamination motor is in the in-process of pushing down, namely first pressfitting steel sheet extrusion the copper foil orientation second pressfitting steel sheet motion, unnecessary overflow glue is extruded on the prepreg to the first overflow glue hole on the first pressfitting steel sheet, is convenient for guide the overflow glue in the pressfitting in-process of multilayer circuit board to on the first pressfitting steel sheet to the clearance to the overflow glue of being convenient for. Before the copper foil and the fusion layer are pressed, through holes or gaps corresponding to the fusion layer are formed in the copper foil and the fusion layer, for example, the formed multilayer circuit board is a double-sided aluminum substrate or copper-embedded plate, and the produced glue overflows from the through holes or gaps to the first glue overflow holes.
S300: and driving the pressing motor to lift upwards, and separating the first pressing steel plate attached with the glue overflow from the copper foil.
In this embodiment, the lamination motor is used in cooperation with the first lamination steel plate, specifically, the lamination motor presses the copper foil by pushing the first lamination steel plate, so that the copper foil is laminated with the fusion layer to form a circuit board. The lamination motor is in the in-process of pushing down, namely first pressfitting steel sheet extrusion the copper foil orientation second pressfitting steel sheet motion, unnecessary overflow glue is extruded on the prepreg to the first overflow glue hole on the first pressfitting steel sheet, is convenient for guide the overflow glue in the pressfitting in-process of multilayer circuit board to on the first pressfitting steel sheet to the clearance to the overflow glue of being convenient for. Before the copper foil and the fusion layer are pressed, through holes or gaps corresponding to the fusion layer are formed in the copper foil and the fusion layer, for example, the formed multilayer circuit board is a double-sided aluminum substrate or copper-embedded plate, and the produced glue overflows from the through holes or gaps to the first glue overflow holes. And in the process that the lamination motor lifted, namely first pressfitting steel sheet is kept away from the motion of second pressfitting steel sheet, unnecessary overflow glue is extruded on the prepreg to the first overflow glue hole on the first pressfitting steel sheet, is convenient for with the overflow glue in the pressfitting process of multilayer circuit board attached to on the first pressfitting steel sheet, moreover, in order to be with the overflow glue as far as possible attached to the one side that first pressfitting steel sheet deviates from the second pressfitting steel sheet, thereby be convenient for follow-up getting rid of more overflow glue clearance when the first pressfitting steel sheet.
In this embodiment, when the first and second lamination steel plates laminate the copper foil and the fusion layer, the prepreg is extruded and then has excessive glue, namely glue overflow, and the first glue overflow holes lead out the glue overflow, so that the glue overflow overflows from between the first and second lamination steel plates, thereby enabling the glue overflow to be extruded out quickly, facilitating the removal of the glue overflow, avoiding forming glue traces on the copper foil with lines, and reducing the line short-circuit probability of the multilayer circuit board.
In one embodiment, the placing the plurality of copper foils and the plurality of fusion layers on the second pressed steel sheet includes: and sequentially and alternately stacking a plurality of copper foils and a plurality of fusion layers on the second pressed steel plate. In this embodiment, the copper foil and the fusion layer are disposed on the second pressing steel plate, and the second pressing steel plate is disposed on the pressing bearing disc, so that the copper foil and the fusion layer are stably disposed on the second pressing steel plate, and the copper foil and the fusion layer are multiple, that is, multiple copper foils and multiple fusion layers are disposed on the second pressing steel plate together, so that the subsequent pressing of the fusion layer and the copper foil is facilitated, and a multilayer circuit board is formed. The copper foils and the fusion layers are alternated, specifically, the fusion layers are located between the two copper foils, the two copper foils are respectively contacted with the first lamination steel plate and the second lamination steel plate, and the two copper foils can be conveniently laminated with the fusion layers to form the multilayer circuit board.
In one embodiment, the placing the plurality of copper foils and the plurality of fusion layers on the second pressed steel sheet further comprises: and stacking a plurality of kraft paper on one surface of the first pressed steel plate, which is away from the copper foil. In this embodiment, the first press-fit steel plate is placed on the copper foil, and the first press-fit steel plate presses the plurality of fusion layers through the copper foil, so that the copper foil and the fusion layers are pressed. The first pressfitting steel sheet with the pressfitting of second pressfitting steel sheet is in the drive of pressfitting motor realizes, first pressfitting steel sheet is provided with a plurality of kraft paper on it before the pressfitting, makes the pressfitting motor is right the effort of first pressfitting steel sheet is balanced, is convenient for with the complete pressfitting of copper foil and fusion layer, in order to improve the pressfitting stability of copper foil and fusion layer.
Further, the stacking of the kraft paper on the surface of the first pressed steel plate, which is away from the copper foil, further includes: and placing a cover plate on one surface of the kraft paper, which is away from the first pressing steel plate, wherein the cover plate is fixedly connected with a lifting shaft of the pressing motor. In this embodiment, the kraft paper is located between the cover plate and the first press-fit steel plate, and the kraft paper provides a buffering force for the first press-fit steel plate so as to avoid damage to the first press-fit steel plate. And the cover plate is fixedly connected with the lifting shaft of the pressing motor, and the lifting shaft of the pressing motor is used for driving the cover plate to move, so that the cover plate faces towards or is far away from kraft paper, the cover plate is made to squeeze the first pressing steel plate, and the first pressing steel plate and the second pressing steel plate are convenient to press the copper foil and the fusion layer.
Still further, the driving press-fit motor presses down, presses the first press-fit steel plate against the copper foil, so that the overflowed glue in the prepreg passes through the first glue overflow hole, and the driving press-fit motor comprises: the driving pressing motor rotates positively, and the cover plate extrudes the first pressing steel plate through a plurality of kraft papers. In this embodiment, the lamination motor is used in cooperation with the first lamination steel plate, specifically, the lamination motor presses the copper foil by pushing the first lamination steel plate, so that the copper foil is laminated with the fusion layer to form a circuit board. The lamination motor is in the in-process of pushing down, namely first pressfitting steel sheet extrusion the copper foil orientation second pressfitting steel sheet motion, unnecessary overflow glue is extruded on the prepreg to the first overflow glue hole on the first pressfitting steel sheet, is convenient for guide the overflow glue in the pressfitting in-process of multilayer circuit board to on the first pressfitting steel sheet to the clearance to the overflow glue of being convenient for. Before the copper foil and the fusion layer are pressed, through holes or gaps corresponding to the fusion layer are formed in the copper foil and the fusion layer, for example, the formed multilayer circuit board is a double-sided aluminum substrate or copper-embedded plate, and the produced glue overflows from the through holes or gaps to the first glue overflow holes. Through right the forward drive of pressfitting motor, pressfitting motor's lift axle is through removing the apron, so that the apron orientation kraft paper motion, thereby make the apron passes through kraft paper extrusion first pressfitting steel sheet, and then make first pressfitting steel sheet pair copper foil with fuse the layer pressfitting, be convenient for with the copper foil with fuse the stable pressfitting of layer.
Still further, drive pressfitting motor corotation, apron pass through a plurality of kraft paper extrusion first pressfitting steel sheet, still include afterwards: and extruding the fusion layer through the first and second lamination steel plates so as to extrude the glue overflow in the fusion layer from the first glue overflow hole to the position between the first lamination steel plate and kraft paper. In this embodiment, the lamination motor is used in cooperation with the first lamination steel plate, specifically, the lamination motor presses the copper foil by pushing the first lamination steel plate, so that the copper foil is laminated with the fusion layer to form a circuit board. The lamination motor is in the in-process of pushing down, namely first pressfitting steel sheet extrusion the copper foil orientation second pressfitting steel sheet motion, unnecessary overflow glue is extruded on the prepreg to the first overflow glue hole on the first pressfitting steel sheet, is convenient for guide the overflow glue in the pressfitting in-process of multilayer circuit board to on the first pressfitting steel sheet to the clearance to the overflow glue of being convenient for. Before the copper foil and the fusion layer are pressed, through holes or gaps corresponding to the fusion layer are formed in the copper foil and the fusion layer, for example, the formed multilayer circuit board is a double-sided aluminum substrate or copper-embedded plate, and the produced glue overflows from the through holes or gaps to the first glue overflow holes. Through right the forward drive of pressfitting motor, pressfitting motor's lift axle is through removing the apron, so that the apron orientation kraft paper motion, thereby make the apron passes through kraft paper extrusion first pressfitting steel sheet, and then make first pressfitting steel sheet with two pressfitting steel sheets are common with fuse the layer and carry out the pressfitting, be convenient for will fuse unnecessary colloid that exists in the layer and extrude, thereby be convenient for with unnecessary glue overflow passes through first glue overflow hole extrudes, and then is convenient for with glue overflow passes through first glue overflow hole extrudes to between first pressfitting steel sheet and the kraft paper, so that glue overflow is attached to on the first pressfitting steel sheet, so that to the clearance of glue overflow.
Still further, the driving press-fit motor lifts up to separate the first press-fit steel plate attached with the glue overflow from the copper foil, and the driving press-fit motor comprises: driving the pressing motor to rotate reversely so as to lift the cover plate away from kraft paper; and removing the first pressed steel plate and kraft paper positioned on the first pressed steel plate. In this embodiment, the lamination motor is used in cooperation with the first lamination steel plate, specifically, the lamination motor presses the copper foil by pushing the first lamination steel plate, so that the copper foil is laminated with the fusion layer to form a circuit board. The lamination motor is in the in-process of pushing down, namely first pressfitting steel sheet extrusion the copper foil orientation second pressfitting steel sheet motion, unnecessary overflow glue is extruded on the prepreg to the first overflow glue hole on the first pressfitting steel sheet, is convenient for guide the overflow glue in the pressfitting in-process of multilayer circuit board to on the first pressfitting steel sheet to the clearance to the overflow glue of being convenient for. Before the copper foil and the fusion layer are pressed, through holes or gaps corresponding to the fusion layer are formed in the copper foil and the fusion layer, for example, the formed multilayer circuit board is a double-sided aluminum substrate or copper-embedded plate, and the produced glue overflows from the through holes or gaps to the first glue overflow holes. And in the process that the lamination motor lifted, namely the apron kept away from the motion of second pressfitting steel sheet, through the excessive glue of first glue overflow hole on with the prepreg is extruded for glue overflow gathering is between first pressfitting steel sheet and kraft paper, is convenient for with glue overflow in the pressfitting in-process of multilayer circuit board adhere to on the first pressfitting steel sheet, moreover, with glue overflow as far as possible adhere to the one side that the first pressfitting steel sheet deviates from the second pressfitting steel sheet has improved the clearance to glue overflow effectively.
In one embodiment, the placing the plurality of copper foils and the plurality of fusion layers on the second pressed steel sheet further comprises: a plurality of kraft paper is stacked on the pressing bearing plate. In this embodiment, the second pressing steel plate is placed on kraft paper, and the second pressing steel plate is placed on the pressing bearing disc through kraft paper, so as to provide supporting buffering for the second pressing steel plate. The first pressfitting steel sheet with the pressfitting of second pressfitting steel sheet is in the drive of pressfitting motor is realized, the second pressfitting steel sheet is provided with a plurality of kraft paper under it before the pressfitting, makes the pressfitting motor pair the effort of second pressfitting steel sheet is balanced, is convenient for with the complete pressfitting of copper foil and fusion layer, in order to improve the pressfitting stability of copper foil and fusion layer.
Further, a second glue overflow hole is formed in the second pressed steel plate; the drive pressfitting motor pushes down, extrudes the copper foil with first pressfitting steel sheet to make the overflow glue that overflows in the prepreg pass through first overflow glue hole, include: and extruding the fusion layer through the first and second lamination steel plates so as to extrude the glue overflow in the fusion layer from the second glue overflow hole to the position between the second lamination steel plate and kraft paper. In this embodiment, the lamination motor is used in cooperation with the first lamination steel plate and the second lamination steel plate, specifically, the lamination motor pushes the first lamination steel plate to co-extrude the copper foil with the second lamination steel plate, so that the copper foil is laminated with the fusion layer to form a circuit board. The lamination motor is in the in-process of pushing down, namely first pressfitting steel sheet extrusion the copper foil orientation second pressfitting steel sheet motion, unnecessary overflow glue is extruded on the prepreg to the second overflow glue hole on the second pressfitting steel sheet, is convenient for guide the overflow glue in the pressfitting in-process of multilayer circuit board to between second pressfitting steel sheet and the kraft paper that corresponds to further be convenient for to the clearance of overflow glue.
In the actual lamination process of the copper foil and the fusion layer, the first lamination steel plate is used as a main cleaning steel plate for glue overflow, namely, the first lamination steel plate leads out redundant glue of the prepreg in the lamination process through a first glue overflow hole in the first lamination steel plate, and finally the glue overflow is formed on one surface, deviating from the prepreg, of the first lamination steel plate, so that the cleaning of the glue overflow is facilitated, and the glue overflow is prevented from being attached to the surface of the copper foil. However, for different multilayer circuit boards, the positions of the through holes on the copper foil are different, so that the distances from the overflowed glue to the first overflowed glue holes are different, the overflow rate of part of overflowed glue is slow, and part of overflowed glue is easy to exist on the copper foil.
In order to improve the overflow amount of the overflow glue, the driving pressing motor presses down, presses the first pressing steel plate to the copper foil, so that the overflow glue overflowed from the prepreg passes through the first overflow glue hole, and the method further comprises the following steps:
acquiring a lamination surface image of the copper foil;
acquiring pore coordinates of the copper foil according to the lamination surface image;
acquiring a first glue overflow hole coordinate of the first pressed steel plate according to the hole coordinate;
and replacing two adjacent magnetic core sub-steel plates corresponding to the coordinates of the first glue overflow holes on the first pressing steel plate, wherein glue overflow half holes are respectively formed in the edges of the two adjacent magnetic core sub-steel plates, and the two glue overflow half holes form the first glue overflow holes.
In this embodiment, the copper foil is used as an outer layer board of the multilayer circuit board, and has corresponding pores thereon, for example, the multilayer circuit board is a double-sided aluminum substrate, and the pores on the copper foil are through holes for connecting upper and lower layers of circuits; for another example, the multilayer circuit board is a copper-clad laminate, and the holes on the copper foil are gaps for embedding the copper blocks. The pores on the copper foil are used as glue overflow guide outlets in the prepreg, and the pore coordinates on the copper foil are conveniently and accurately acquired through the acquisition of the lamination surface images of the copper foil, so that the specific position of glue overflow from the copper foil is conveniently determined, and the coordinates of the pores of the copper foil, namely the pore coordinates, are conveniently determined. After the pore coordinates are obtained, the first glue overflow holes are needed to be correspondingly found out on the first pressed steel plate, and the pore coordinates are correspondingly converted into coordinates on the first pressed steel plate so as to determine the coordinates, corresponding to the pores, on the first pressed steel plate, and further determine the coordinates of the first glue overflow holes of the first pressed steel plate. And finally, after determining the coordinates of the first glue overflow holes, structurally modifying the first pressed steel plate, wherein the first pressed steel plate comprises a plurality of magnetic core sub-steel plates formed by splicing, and the side edges of the magnetic core sub-steel plates are provided with glue overflow half holes. Like this, through changing magnetic core sub-steel sheet, will with two adjacent magnetic core steel sheets of the glue overflow half hole that first glue overflow hole coordinate corresponds are selected, be convenient for first glue overflow hole that the assigned position of first pressfitting steel sheet formed with the hole alignment of copper foil, thereby make first glue overflow hole with the hole of copper foil is located same hole center, and then make the glue overflow from the hole of copper foil spill over to the distance in first glue overflow hole reduces, is convenient for spill over more glue overflows, has improved the overflow volume to the glue overflow effectively. In another embodiment, two adjacent magnetic core sub-steel plates are connected through two opposite magnets, namely, the two adjacent magnetic core sub-steel plates are mutually magnetically connected.
Further, the placing of the plurality of copper foils and the plurality of fusion layers on the second pressed steel plate further comprises the following steps:
and carrying out first side copper treatment on the core plate of the fusion layer to obtain the core plate with a plurality of first side copper bulges arranged in a staggered manner at the edge, so that point type gumming grooves are formed between two adjacent first side copper bulges.
In this embodiment, when the first and second press-fit steel plates are pressed, the core board and the prepreg are pressed to move in opposite directions, so that the prepreg is diffused, and the surface of the core board is covered with plastic, so that the adhesive force of the core board in the multilayer circuit board is improved. And the glue in the prepreg is partially redundant, the redundant glue moves towards the edge of the core plate, and in order to accommodate the glue in the part, the core plate of the fusion layer is subjected to first side copper treatment so as to form a plurality of first side copper bulges arranged in a staggered manner at the edge of the core plate, and the plurality of first side copper bulges are not contacted with the edge of the core plate, so that gaps are formed among the plurality of first side copper bulges, and overflow glue in the prepreg is conveniently accommodated in a point type glue flowing groove formed among the plurality of first side copper bulges, and the accommodating effect on the overflow glue is improved. In addition, in the process that the overflow glue flows into the point type overflow glue groove, the point type overflow glue groove formed by the first side copper bulges is provided with a plurality of groove body flow directions, namely, the flow directions of the overflow glue among the first side copper bulges are a plurality of, so that the flow of the overflow glue in the point type overflow glue groove is easily blocked by the first side copper bulges, the mobility of the overflow glue is slowed down, the overflow glue is prevented from flowing out of the core plate at too high speed, and the overflow glue is effectively limited in the point type overflow glue groove. In another embodiment, the first side copper bump has a circular structure, for example, the first side copper bump is a circular PAD, the diameter of the circular PAD is 1.15mm to 1.36mm, and the interval between two adjacent circular PADs is 0.4mm to 0.6mm; for another example, the diameter of a circular PAD is 1.25mm, and the spacing between adjacent circular PADs is 0.5mm.
Further, the first side copper treatment is performed on the core board of the fusion layer to obtain the core board with a plurality of first side copper bulges arranged in a staggered manner at the edge, so that a point type gumming groove is formed between two adjacent first side copper bulges, and then the method further comprises the following steps:
and carrying out second-side copper treatment on the core plate of the fusion layer to obtain the core plate with a plurality of second-side copper bulges arranged in a staggered mode at the edge, wherein the second-side copper bulges are arranged far away from the first-side copper bulges.
In this embodiment, when the first pressing steel plate and the second pressing steel plate are pressed, the core board and the prepreg are pressed to move in opposite directions, so that the core board and the prepreg are attached to each other, that is, the plastic on the prepreg is spread, so that the surface of the core board is covered with the plastic, and the adhesive force of the core board in the multilayer circuit board is improved. And there is some copper sheet on the said core, the situation of easy warpage produced while pressing, lead to the quality of the multi-layer circuit board unqualified easily, in order to reduce the probability of warpage of the said core, carry on the second side copper treatment to the core of the said fusion layer, make the edge of the said core form a plurality of dislocation to set up the second side copper to swell, a plurality of second side copper swell dispel the stress on the edge copper of the said core, thus make the edge stress of the said core reduce, and then make the edge warpage degree of the said core weaken, have reduced the probability of warpage of the multi-layer circuit board effectively.
In another embodiment, the second side copper bump has a "+" shape structure as embodiment one.
In other embodiments, the second side copper bump has a diamond-shaped structure as embodiment two, and the second side copper bump has both "/" and "+" structures as embodiment three. The plate edge conditions corresponding to the three embodiments are shown in fig. 2 in detail. Wherein, the copper residue rate and the warping of the second side copper bump of the first embodiment are obviously better than those of the other two embodiments.
In one embodiment, the present application further provides a multilayer circuit board bonding device, including: pressing the bearing disc and the plate pressing assembly; the board pressing assembly comprises a first pressing steel plate, a second pressing steel plate and a pressing motor, wherein the second pressing steel plate is arranged on the pressing bearing disc, the second pressing steel plate is used for placing a plurality of copper foils and a plurality of fusion layers, a lifting shaft of the pressing motor is connected with the first pressing steel plate, the first pressing steel plate is far away from or close to the second pressing steel plate, the fusion layers comprise a core plate and a prepreg which are connected with each other, a first glue overflow hole is formed in the first pressing steel plate, and the first glue overflow hole is used for overflowing glue in the prepreg. In this embodiment, when the first and second lamination steel plates laminate the copper foil and the fusion layer, the prepreg is extruded and then has excessive glue, namely glue overflow, and the first glue overflow holes lead out the glue overflow, so that the glue overflow overflows from between the first and second lamination steel plates, thereby enabling the glue overflow to be extruded out quickly, facilitating the removal of the glue overflow, avoiding forming glue traces on the copper foil with lines, and reducing the line short-circuit probability of the multilayer circuit board.
In one embodiment, the present application further provides a multilayer circuit board, which is prepared by using the multilayer circuit board lamination board method described in any one of the above embodiments. In this embodiment, the multilayer wiring board laminating method includes: adopt multilayer circuit board compression fittings to carry out the pressfitting of multilayer circuit board, multilayer circuit board compression fittings includes: pressing the bearing disc and the plate pressing assembly; the board-making pressing assembly comprises a first pressing steel plate, a second pressing steel plate and a pressing motor, wherein the second pressing steel plate is arranged on the pressing bearing disc, the second pressing steel plate is used for placing a plurality of copper foils and a plurality of fusion layers, a lifting shaft of the pressing motor is connected with the first pressing steel plate so that the first pressing steel plate is far away from or close to the second pressing steel plate, the fusion layers comprise a core plate and a prepreg which are connected with each other, and the first pressing steel plate is provided with a first glue overflow hole; the multilayer circuit board laminating method comprises the following steps: placing a plurality of copper foils and a plurality of fusion layers on a second press-fit steel plate; driving the pressing motor to press downwards, and extruding the copper foil by the first pressing steel plate so that overflowed glue in the prepreg passes through the first glue overflow hole; and driving the pressing motor to lift upwards, and separating the first pressing steel plate attached with the glue overflow from the copper foil. When the first pressed steel plate and the second pressed steel plate press-fit copper foil and the fusion layer, redundant glue exists after the prepreg is extruded, namely glue overflows, and the glue overflows from the first pressed steel plate and the second pressed steel plate through the first glue overflow holes, so that the glue overflows from between the first pressed steel plate and the second pressed steel plate, the glue overflows rapidly, the glue overflows are convenient to remove, glue traces are prevented from being formed on the copper foil with the circuit, and the circuit short circuit probability of the multilayer circuit board is reduced.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. A method of laminating a multilayer wiring board layer, comprising: adopt multilayer circuit board compression fittings to carry out the pressfitting of multilayer circuit board, multilayer circuit board compression fittings includes:
the bearing disc is pressed in a fit manner,
the plate-making pressing assembly comprises a first pressing steel plate, a second pressing steel plate and a pressing motor, wherein the second pressing steel plate is arranged on the pressing bearing disc, the second pressing steel plate is used for placing a plurality of copper foils and a plurality of fusion layers, a lifting shaft of the pressing motor is connected with the first pressing steel plate so that the first pressing steel plate is far away from or close to the second pressing steel plate, the fusion layers comprise a core plate and a prepreg which are connected with each other, and the first pressing steel plate is provided with a first glue overflow hole;
the multilayer circuit board laminating method comprises the following steps:
placing a plurality of copper foils and a plurality of fusion layers on a second press-fit steel plate;
driving the pressing motor to press downwards, and extruding the copper foil by the first pressing steel plate so that overflowed glue in the prepreg passes through the first glue overflow hole;
and driving the pressing motor to lift upwards, and separating the first pressing steel plate attached with the glue overflow from the copper foil.
2. The method of manufacturing a multilayer wiring board laminate according to claim 1, wherein the placing the plurality of copper foils and the plurality of fusion layers on the second press-fit steel sheet comprises:
and sequentially and alternately stacking a plurality of copper foils and a plurality of fusion layers on the second pressed steel plate.
3. The method of manufacturing a multilayer wiring board laminate according to claim 1, wherein the placing of the plurality of copper foils and the plurality of fusion layers on the second press-fit steel sheet further comprises:
and stacking a plurality of kraft paper on one surface of the first pressed steel plate, which is away from the copper foil.
4. The method of claim 3, wherein stacking a plurality of kraft paper on a side of the first laminated steel sheet facing away from the copper foil, further comprising:
and placing a cover plate on one surface of the kraft paper, which is away from the first pressing steel plate, wherein the cover plate is fixedly connected with a lifting shaft of the pressing motor.
5. The method of claim 4, wherein the driving the pressing motor to press down presses the first pressing steel plate against the copper foil to allow the spilled glue in the prepreg to pass through the first spilled glue hole, comprising:
the driving pressing motor rotates positively, and the cover plate extrudes the first pressing steel plate through a plurality of kraft papers.
6. The method of manufacturing a laminated board of a multilayer wiring board according to claim 5, wherein the driving press-fit motor rotates forward, the cover plate presses the first press-fit steel plate by a plurality of kraft papers, and then further comprising:
and extruding the fusion layer through the first and second lamination steel plates so as to extrude the glue overflow in the fusion layer from the first glue overflow hole to the position between the first lamination steel plate and kraft paper.
7. The method of claim 6, wherein the driving the pressing motor to lift up separates the first pressing steel plate with the glue overflow from the copper foil comprises:
driving the pressing motor to rotate reversely so as to lift the cover plate away from kraft paper;
and removing the first pressed steel plate and kraft paper positioned on the first pressed steel plate.
8. The method of manufacturing a multilayer wiring board laminate according to claim 1, wherein said placing a plurality of copper foils and a plurality of fusion layers on a second press-fit steel sheet, further comprises, before:
a plurality of kraft paper is stacked on the pressing bearing plate.
9. The method of claim 8, wherein the second lamination steel plate is provided with a second glue overflow hole; the drive pressfitting motor pushes down, extrudes the copper foil with first pressfitting steel sheet to make the overflow glue that overflows in the prepreg pass through first overflow glue hole, include:
and extruding the fusion layer through the first and second lamination steel plates so as to extrude the glue overflow in the fusion layer from the second glue overflow hole to the position between the second lamination steel plate and kraft paper.
10. A multilayer wiring board, characterized in that it is produced by using the multilayer wiring board laminating method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310358882.8A CN116261284A (en) | 2023-04-04 | 2023-04-04 | Multilayer circuit board and laminated board manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310358882.8A CN116261284A (en) | 2023-04-04 | 2023-04-04 | Multilayer circuit board and laminated board manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116261284A true CN116261284A (en) | 2023-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310358882.8A Pending CN116261284A (en) | 2023-04-04 | 2023-04-04 | Multilayer circuit board and laminated board manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116261284A (en) |
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2023
- 2023-04-04 CN CN202310358882.8A patent/CN116261284A/en active Pending
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