CN116246988A - Thorn crystal type huge transfer device - Google Patents
Thorn crystal type huge transfer device Download PDFInfo
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- CN116246988A CN116246988A CN202310190492.4A CN202310190492A CN116246988A CN 116246988 A CN116246988 A CN 116246988A CN 202310190492 A CN202310190492 A CN 202310190492A CN 116246988 A CN116246988 A CN 116246988A
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract
The invention relates to the technical field of MiniLED wafer huge transfer, in particular to a thorn crystal type huge transfer device, aiming at solving the technical problems of low productivity and poor product precision in the related technology. When the crystal-spining type huge quantity transfer device is used for spining, the X-direction driving mechanism drives the substrate on the substrate carrier to move along the X direction, so that the substrate and the wafer clamped by the crystal-fixing assembly are accurately aligned, the crystal-fixing assembly is replaced to move along the X direction, the weight is reduced through the conversion, the requirements of high-frequency high-speed high-precision of the crystal-spining operation can be met, and the technical problems of low productivity and poor product precision in the existing crystal-spining operation are solved.
Description
Technical Field
The invention relates to the technical field of MiniLED wafer huge transfer, in particular to a thorn crystal type huge transfer device.
Background
The MLED huge amount die bonding technology is a bottleneck technology of the current display industry, and the huge amount of transfer demands are more and more urgent from OLED to miniLED to the evolution of microLED products (chips).
At present, a spinodal method is generally adopted to realize the huge transfer operation of the chip. During the crystal punching, the double-gantry structure moves to the crystal punching station, so that the crystal grains and the substrate are accurately aligned, the gantry cantilever in the gantry structure needs to move repeatedly along the X direction all the time, however, the weight of the gantry cantilever is large and is close to hundred kilograms, so that the transfer speed is greatly limited, the productivity is low, and the product precision is poor.
Disclosure of Invention
The invention aims to provide a thorn crystal form huge quantity transfer device so as to relieve the technical problems of low productivity and poor product precision in the related technology.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
the invention provides a spinodal massive transfer device, which comprises: the device comprises a feeding assembly, a die bonding assembly, a die punching assembly, a substrate feeding assembly, a substrate moving assembly and an X-axis beam assembly;
the feeding assembly is used for feeding the wafer and comprises a wafer carrier used for loading the wafer;
the wafer fixing assembly is used for clamping the wafer carrier;
the thorn crystal assembly is used for transferring core grains on the wafer to the substrate;
the substrate feeding assembly is used for transporting the substrate;
the substrate moving assembly is arranged at the substrate feeding assembly and comprises a substrate carrier and an X-direction driving mechanism, wherein the substrate carrier is used for adsorbing a substrate transported by the substrate feeding assembly, and the X-direction driving mechanism is in transmission connection with the substrate carrier and is used for driving the substrate carrier to move along the X direction;
the X-axis beam assembly is in transmission connection with the die bonding assembly so as to drive the die bonding assembly to move to the feeding assembly and the substrate carrier, and is also in transmission connection with the die piercing assembly so as to drive the die piercing assembly to move to the substrate carrier.
Further, the substrate feeding assembly comprises a conveying belt and a first driving mechanism;
the two conveying belts are spaced and distributed in parallel and extend along the Y direction;
the first driving mechanism is in transmission connection with the conveying belt so as to drive the conveying belt to move along the Y direction.
Further, the substrate feeding assembly further comprises a first baffle, a second baffle and a second driving mechanism;
the first baffle plate and the second baffle plate extend along the Y direction and are respectively arranged at two sides of the two conveying belts to form a conveying channel in a surrounding manner;
the second driving mechanism is in transmission connection with the second baffle plate so as to drive the second baffle plate to move away from or towards the conveying belt along the X direction.
Further, the substrate moving assembly further comprises a fixed plate and a Z-direction driving mechanism;
the X-direction driving mechanism is arranged on the fixed plate;
the Z-direction driving mechanism is in transmission connection with the fixed plate and is used for driving the fixed plate to move along the Z direction.
Further, the Z-direction driving mechanism comprises an upper inclined block, a lower inclined block and a transverse moving driving assembly;
the fixing plate is fixed on the top surface of the upper inclined block;
the bottom surface of the upper inclined block is a first inclined surface;
the surface of the lower inclined block opposite to the first inclined surface is a second inclined surface, and the second inclined surface is matched with the first inclined surface;
the transverse moving driving assembly is in transmission connection with the lower inclined block and is used for driving the lower inclined block to horizontally move.
Further, the feeding assembly further comprises a supporting plate, a first mounting plate, a third driving mechanism, a material taking mechanism and a fourth driving mechanism;
the first mounting plate is in sliding fit with the support plate;
the third driving mechanism is in transmission connection with the first mounting plate and is used for driving the first mounting plate to horizontally move;
the material taking mechanism is arranged on the first mounting plate and has two states of locking and unlocking;
the fourth driving mechanism is in transmission connection with the material taking mechanism and is configured to drive the material taking mechanism to switch between a locking state and an unlocking state under a feeding working condition so as to correspondingly lock or release the wafer carrier.
Further, the wafer carrier is provided with two latch hooks which are distributed at intervals, and openings of the two latch hooks are arranged in opposite directions;
the material taking mechanism comprises a first connecting rod and two second connecting rods;
one end of the second connecting rod is provided with a first fastening body matched with one of the lock hooks, the other end of the second connecting rod is hinged with one end of the first connecting rod through a first hinge pin, one second connecting rod is also hinged with the first mounting plate through a second hinge pin, and the second hinge pin is positioned between the first hinge pin and the first fastening body;
one end of the other second connecting rod is hinged with the first mounting plate through a third hinge pin, a second fastening body matched with the other lock hook is arranged at the other end of the other second connecting rod, the second fastening body and the first fastening body are positioned at the same side of the first connecting rod, the other second connecting rod is also hinged with the other end of the first connecting rod through a fourth hinge pin, and the fourth hinge pin is positioned between the third hinge pin and the second fastening body;
the fourth driving mechanism comprises a reset component and a rotary driving component;
the resetting component is used for being connected with one of the second connecting rods, so that the second connecting rod has a tendency to rotate towards the lock hook around the hinging axis of the second connecting rod and the first mounting plate;
the two groups of rotary driving assemblies are distributed at intervals along the sliding path of the first mounting plate, are in transmission connection with one of the second connecting rods and are configured to drive the second connecting rods to rotate away from the lock hooks around the hinge axes of the second connecting rods and the first mounting plate under the loading working condition.
Further, the feeding assembly further comprises a fifth driving mechanism;
the fifth driving mechanism is in transmission connection with the supporting plate and is used for driving the supporting plate to move along the Z direction.
Further, the die bonding assembly comprises a die bonding cross beam, a second mounting plate, a sixth driving mechanism, a clamping module and a seventh driving mechanism;
the X-axis beam assembly is in transmission connection with the die-bonding beam and is used for driving the die-bonding beam to move along the X direction;
the second mounting plate is in sliding connection with the die bonding cross beam;
the sixth driving mechanism is in transmission connection with the second mounting plate and is used for driving the second mounting plate to slide along the Y direction;
the clamping module is arranged on the second mounting plate and is in running fit with the second mounting plate;
the seventh driving mechanism is in transmission connection with the clamping module and is used for driving the clamping module to rotate around an axis extending along the Z direction.
Further, the thorn crystal assembly comprises a thorn crystal cross beam, a third mounting plate, a camera module, a thorn crystal module and an eighth driving mechanism;
the X-axis beam assembly is in transmission connection with the spinned crystal beam and is used for driving the spinned crystal beam to move along the X direction;
the third mounting plate is in sliding connection with the spiny cross beam;
the camera module is arranged on the third mounting plate;
the thorn crystal module is connected with the third mounting plate in a sliding way and can slide along the Z direction;
the eighth driving mechanism is in transmission connection with the third mounting plate and is used for driving the third mounting plate to slide along the Y direction.
In summary, the spindly crystal type huge transfer device provided by the invention has the technical effects that:
in the application, the substrate feeding assembly conveys the substrate, and the substrate carrier adsorbs the substrate and can move along the X direction along with the substrate under the drive of the X direction driving mechanism; the loading assembly can load the wafer to the wafer carrier; the die bonding assembly can move to the feeding assembly under the drive of the X-axis beam assembly, clamps the wafer carrier, and then continues to move to the substrate carrier to realize the transfer of the wafer to the die bonding station; the spining assembly can move to the substrate carrier under the drive of the X-axis beam assembly, and core particles on the wafer are transferred to the substrate to finish spining.
Compared with the prior art, the X-direction driving mechanism drives the substrate on the substrate carrier to move along the X-direction when the crystal-spining type huge amount transfer device is spinned, so that the substrate and the wafer clamped by the crystal fixing assembly are accurately aligned, the crystal fixing assembly is replaced to move in the X-direction, the weight is reduced through the conversion, the requirements of high-frequency high-speed high-precision of the spining operation can be met, and the technical problems of low productivity and poor product precision in the existing spining operation are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a spinodal massive transfer device according to an embodiment of the present invention;
FIG. 2 is a top view of a spinodal macro transfer device according to an embodiment of the present invention;
FIG. 3 is a side view of a substrate moving assembly in a spinodal massive transfer device according to an embodiment of the invention;
FIG. 4 is a top view of a substrate moving assembly in a spindly mass transfer device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a feeding assembly of a spindly crystal mass-transfer device according to an embodiment of the present invention;
FIG. 6 is a top view of FIG. 5;
FIG. 7 is a schematic structural diagram of a loading assembly in a spinodal massive transfer device according to an embodiment of the present invention;
FIG. 8 is an enlarged view of FIG. 7 at A;
fig. 9 is an enlarged view at B in fig. 7;
fig. 10 is a schematic structural diagram of a die attach assembly in a spindly mass transfer device according to an embodiment of the present invention.
Icon: 100-feeding assembly; 110-wafer carrier; 120-supporting plates; 130-a first mounting plate; 140-a third drive mechanism; 150-a material taking mechanism; 160-a fifth drive mechanism; 170-a reset assembly; 180-a rotary drive assembly; 190-buffer blocks; 111-latch hooks; 141-a material taking driving motor; 142-a third slide rail; 143-a third slider; 151-a first connecting rod; 152-a second connecting rod; 153-a first fastening body; 154-a first hinge pin; 155-a second hinge pin; 156-a third hinge pin; 157-a second fastening body; 158-fourth hinge pin; 159-push rod; 171-a spring; 172-struts; 181-rotating cylinder; 182-pulling out the block;
200-die bonding assembly; 210-die attach beam; 220-a second mounting plate; 230-clamping module; 240-seventh drive mechanism; 250-a first slide rail; 260-a first slider; 241-belt; 242-rotating an adjusting motor; 243-synchronizing wheel; 244-idler;
300-thorn crystal assembly; 310-spining a crystal beam; 320-a third mounting plate; 330-a camera module; 340-a spining module; 350-a second slide rail; 360-a second slider;
400-substrate feed assembly; 410-a conveyor belt; 420-a first baffle; 430-a second baffle; 440-traversing cylinder; 450-baffle slide rail;
500-a substrate movement assembly; 510-a substrate carrier; 520-X direction driving mechanism; 530-a fixed plate; 540-Z direction driving mechanism; 521-a substrate driving motor; 522-fourth slide rail; 523-fourth slider; 541-tilting blocks; 542-downslope; 543-roller slide rail; 544-fourth mounting plate; 545-a traversing driving motor; 546-lead screw; 547-fifth slide rail; 548-a fifth slider;
600-X axis beam assembly; 610-X axis beam; 620-sixth slide rail; 630-sixth slider; 640-a fifth mounting plate;
700-a substrate; 800-a material box; 900-platform.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
At present, a spinodal method is generally adopted to realize the huge transfer operation of the chip. During the crystal punching, the double-gantry structure moves to the crystal punching station, so that the crystal grains and the substrate are accurately aligned, the gantry cantilever in the gantry structure needs to move repeatedly along the X direction all the time, however, the weight of the gantry cantilever is large and is close to hundred kilograms, so that the transfer speed is greatly limited, the productivity is low, and the product precision is poor.
In view of this, the present invention provides a spiny crystal form huge amount transfer device, referring to fig. 1 and 2, comprising a feeding assembly 100, a die bonding assembly 200, a spiny crystal assembly 300, a substrate feeding assembly 400, a substrate moving assembly 500 and an X-axis beam assembly 600; the loading assembly 100 is used for loading wafers, and includes a wafer carrier 110 for loading wafers; the die attach assembly 200 is used to hold the wafer carrier 110; the spine assembly 300 is used to transfer core particles on a wafer to a substrate 700; the substrate feed assembly 400 is used to transport the substrate 700; the substrate moving assembly 500 is disposed at the substrate feeding assembly 400 and comprises a substrate carrier 510 and an X-direction driving mechanism 520, wherein the substrate carrier 510 is used for adsorbing the substrate 700 transported by the substrate feeding assembly 400, and the X-direction driving mechanism 520 is in transmission connection with the substrate carrier 510 and is used for driving the substrate carrier 510 to move along the X-direction; the X-axis beam assembly 600 is in transmission connection with the die-bonding assembly 200 to drive the die-bonding assembly 200 to move to the position of the material loading assembly 100 and the position of the substrate carrier 510, and is also in transmission connection with the die-piercing assembly 300 to drive the die-piercing assembly 300 to move to the position of the substrate carrier 510.
With continued reference to fig. 1 and 2, the substrate feed assembly 400 transports the substrate 700, and the substrate carrier 510 adsorbs the substrate 700 and can move along the X direction with the substrate 700 driven by the X direction driving mechanism 520; the loading assembly 100 may load a wafer to the wafer carrier 110; the die bonding assembly 200 can move to the position of the feeding assembly 100 under the drive of the X-axis beam assembly 600, clamps the wafer carrier 110, and then continues to move to the position of the substrate carrier 510, so that the wafer is transferred to the die bonding station; the spining assembly 300 is driven by the X-axis beam assembly 600 to move to the substrate carrier 510 and transfer the core particles on the wafer to the substrate 700, completing the spining.
It can be seen that, compared with the prior art, when the spining type huge amount transfer device is used for spining, the X-direction driving mechanism 520 drives the substrate 700 on the substrate carrier 510 to move along the X-direction, so that the substrate 700 and the wafer clamped by the die bonding assembly 200 can be precisely aligned, thereby replacing the movement of the die bonding assembly 200 in the X-direction, and through the conversion, the weight reduction is realized, the requirements of high frequency, high speed and high precision of the spining operation can be met, and the technical problems of low productivity and poor product precision in the conventional spining operation are solved.
The structure and shape of the spinodal mass transfer device according to this embodiment will be described in detail below with reference to fig. 1 to 10:
further, referring to fig. 1 and 2, the substrate feed assembly 400 includes a conveyor belt 410 and a first drive mechanism; the two conveyer belts 410 are spaced and distributed in parallel and extend along the Y direction; the first driving mechanism is in transmission connection with the conveyer belt 410 to drive the conveyer belt 410 to move along the Y direction.
Referring to fig. 1 to 4, the substrate moving assembly 500 further includes a fixed plate 530 and a Z-direction driving mechanism 540; the X-direction driving mechanism 520 is disposed on the fixing plate 530; the Z-direction driving mechanism 540 is in transmission connection with the fixing plate 530, and is used for driving the fixing plate 530 to move along the Z-direction. When the fixing plate 530 moves in the Z direction, the X-direction driving mechanism 520 and the substrate carrier 510 move synchronously therewith, thereby achieving lifting.
Specifically, taking fig. 1 as an example, when the substrate carrier 510 rises along the Z direction, the substrate carrier 510 may contact the substrate 700 through the two conveyor belts 410 and adsorb the substrate 700, and then the substrate 700 may move along the X direction along with the substrate carrier 510 within a predetermined range under the driving of the X direction driving mechanism 520, so as to compensate the movement of the die attach assembly 200 in the X direction. It should be noted that, the adsorption of the substrate 700 by the substrate carrier 510 may be implemented by vacuum adsorption, which is not described herein in detail.
Further, referring to fig. 1 and 2, the substrate feed assembly 400 further includes a first barrier 420, a second barrier 430, and a second driving mechanism; the first baffle 420 and the second baffle 430 extend along the Y direction and are respectively arranged at two sides of the two conveyer belts 410 to form a conveyer passage; the second driving mechanism is in driving connection with the second baffle 430 to drive the second baffle 430 to move away from or towards the conveyor belt 410 along the X direction.
Specifically, with continued reference to fig. 1 and 2, the first barrier 420 and the second barrier 430 on both sides of the two conveyor belts 410 form an enclosure for the transported substrate 700, preventing the substrate 700 from falling off the conveyor belts 410. The second driving mechanism comprises a traversing cylinder 440 and baffle slide rails 450 which are fixed on the platform 900, wherein the driving direction of the traversing cylinder 440 is along the X direction, the two baffle slide rails 450 are horizontally and symmetrically distributed on two sides of the traversing cylinder 440 along the X direction, and each baffle slide rail 450 is in sliding fit with a baffle slide block; the second baffle 430 is at least divided into three sections, and the second baffle 430 in the middle section is fixedly connected with the baffle slider. When the traversing cylinder 440 is started, the baffle slider can be driven to slide along the X direction, so that the second baffle 430 of the corresponding section is driven to slide along the X direction to form avoidance, and the substrate 700 can be ensured to move along the X direction within a preset range along with the substrate carrier 510 under the drive of the X direction driving mechanism 520.
Further, referring to fig. 3 and 4, the substrate moving assembly 500 is disposed at the bottom of the transfer passage and corresponds to the movable second barrier 430. In the substrate moving assembly 500, the X-direction driving mechanism 520 includes a substrate driving motor 521, a fourth slide rail 522, and a fourth slide block 523, where the substrate driving motor 521 is a linear motor and is disposed on the fixed plate 530; the two fourth sliding rails 522 extend along the length direction of the fixed plate 530, i.e. the X direction, and the two fourth sliding rails 522 are spaced apart and distributed in parallel; each fourth sliding rail 522 is provided with a fourth sliding block 523, and the fourth sliding blocks 523 are fixedly connected with the substrate carrier 510. When the substrate driving motor 521 is started, the fourth slider 523 is driven to repeatedly slide along the X direction, and the substrate carrier 510 is then repeatedly moved along the X direction. Here, a plurality of empty substrate 700 sites are provided on the substrate carrier 510 for adsorbing the substrate 700. During the die attach process, the movement of the substrate carrier 510 in the X-axis direction with the substrate 700 replaces the movement of the die attach assembly 200 in the X-axis direction.
The Z-direction drive mechanism 540 includes an upper sloping block 541, a lower sloping block 542, and a traversing drive assembly; the traversing driving assembly comprises a fourth mounting plate 544, a traversing driving motor 545, a screw 546, a fifth sliding rail 547 and a fifth sliding block 548, wherein the fourth mounting plate 544 is fixedly connected to the platform 900; the traversing driving motor 545 adopts a linear motor, is arranged on the fourth mounting plate 544 and is in transmission connection with the lower inclined block 542 through a screw 546; the two fifth sliding rails 547 are arranged at intervals and in parallel, extend along the length direction of the fourth mounting plate 544, namely in the Y direction, each fifth sliding rail 547 is provided with a fifth sliding block 548, and the fifth sliding blocks 548 are fixed at the bottom of the lower inclined block 542; a roller sliding rail 543 is arranged between the lower inclined block 542 and the upper inclined block 541, and plays a role in reducing friction force between the lower inclined block 542 and the upper inclined block 541 when the lower inclined block and the upper inclined block slide relatively; the upper inclined block 541 is fixed to the bottom of the fixed plate 530.
Referring to fig. 3, when the traverse driving motor 545 is started, the lower inclined block 542 is driven to slide along the Y direction by the screw 546, and at this time, the upper inclined block 541 is lifted along the Z direction under the pushing of the lower inclined block 542, so as to drive the substrate carrier 510 to synchronously lift. It should be added that a guiding mechanism is arranged between the fixed plate 530 and the fourth mounting plate 544, the guiding mechanism comprises a limiting sleeve and a limiting block, the limiting sleeve is sleeved on the limiting block, and the limiting sleeve and the limiting block can slide relatively; one of the stop collar and the stop block is fixed to the fixed plate 530, and the other is fixed to the fourth mounting plate 544. When the upper inclined block 541 is lifted, the limiting sleeve and the limiting block slide relatively, so that a guiding function is achieved, and stability of the upper inclined block 541 during lifting is guaranteed.
Further, referring to fig. 5 to 9, the feeding assembly 100 further includes a support plate 120, a first mounting plate 130, a third driving mechanism 140, a material taking mechanism 150, and a fourth driving mechanism; the first mounting plate 130 is slidably engaged with the support plate 120; the third driving mechanism 140 is in transmission connection with the first mounting plate 130, and is used for driving the first mounting plate 130 to move horizontally; the material taking mechanism 150 is arranged on the first mounting plate 130 and has two states of locking and unlocking; the fourth driving mechanism is in transmission connection with the material taking mechanism 150 and is configured to drive the material taking mechanism 150 to switch between a locking state and an unlocking state under a loading working condition so as to correspondingly lock or unlock the wafer carrier 110.
With continued reference to fig. 5 to 9, the support plate 120 is integrally formed of a bottom plate and two coamings, which are symmetrically disposed on the bottom plate along the length direction of the bottom plate; the third driving mechanism 140 includes a material taking driving motor 141, a third sliding rail 142 and a third sliding block 143, where the material taking driving motor 141 may be a linear motor and is disposed on the bottom plate, the third sliding rail 142 is fixed on the bottom plate along the length direction of the bottom plate, and the third sliding block 143 is slidably matched with the third sliding rail 142 and is fixedly connected with the bottom of the first mounting plate 130. When the material taking driving motor 141 is started, the third slider 143 is driven to slide along the X direction, and the first mounting plate 130 moves synchronously along the X direction. The feeding assembly 100 further includes a fifth driving mechanism 160, where the fifth driving mechanism 160 is in transmission connection with the support plate 120 and is used to drive the support plate 120 to move along the Z direction. Here, the fifth driving mechanism 160 may employ an air cylinder, and the support plate 120 is lifted and lowered when the air cylinder is activated.
The wafer carrier 110 is disposed in the material box 800, the material taking mechanism 150 is disposed in the first mounting plate 130, when the material taking driving motor 141 is started, the material taking mechanism 150 can move to the material box 800 along the X direction, and under the driving of the fourth driving mechanism, the wafer carrier 110 is locked, then the wafer carrier 110 with the wafer is driven to move to a preset position along the X direction away from the material box 800 under the driving of the material taking driving motor 141, then the wafer carrier 110 can be lifted to a preset height along the Z direction under the driving of the supporting plate 120, and the material taking mechanism 150 is driven to switch from the locking state to the unlocking state by the fourth driving mechanism, at this time, the wafer carrier 110 can be clamped by the die fixing assembly 200 and moved to the die-punching station.
Further, referring to fig. 7 to 9, the wafer carrier 110 is provided with two latch hooks 111 distributed at intervals, and openings of the two latch hooks 111 are arranged opposite to each other; the reclaiming mechanism 150 comprises a first connecting rod 151 and two second connecting rods 152; one end of one second connecting rod 152 is provided with a first fastening body 153 matched with one lock hook 111, the other end of the second connecting rod 152 is hinged with one end of the first connecting rod 151 through a first hinge pin 154, one second connecting rod 152 is also hinged with the first mounting plate 130 through a second hinge pin 155, and the second hinge pin 155 is positioned between the first hinge pin 154 and the first fastening body 153; one end of the other second connecting rod 152 is hinged with the first mounting plate 130 through a third hinge pin 156, the other end is provided with a second fastening body 157 matched with the other lock hook 111, the second fastening body 157 and the first fastening body 153 are positioned on the same side of the first connecting rod 151, the other second connecting rod 152 is also hinged with the other end of the first connecting rod 151 through a fourth hinge pin 158, and the fourth hinge pin 158 is positioned between the third hinge pin 156 and the second fastening body 157; the fourth drive mechanism includes a reset assembly 170 and a rotary drive assembly 180; the reset assembly 170 is configured to connect with one of the second connecting rods 152, such that the second connecting rod 152 has a tendency to rotate about its hinge axis with the first mounting plate 130 toward the latch hook 111; the two sets of rotation driving assemblies 180 are distributed at intervals along the sliding path of the first mounting plate 130, and are used for being in transmission connection with one of the second connecting rods 152, and are configured such that under the loading working condition, any set of rotation driving assemblies 180 drives the second connecting rod 152 to rotate around the hinge axis of the second connecting rod and the first mounting plate 130 away from the latch hook 111.
With continued reference to fig. 7-9, the rotary drive assembly 180 includes a rotary cylinder 181 and a pulling-out block 182, the rotary cylinder 181 being drivingly connected to the pulling-out block 182 for rotating the pulling-out block 182. The second connecting rod 152 on the left is fixed with a push rod 159, the push rod 159 is positioned between the first fastening body 153 and the second hinge pin 155, and the lower end of the push rod 159 is in interference fit with a bearing; the buffer block 190 is fixed on the first mounting plate 130, and when the second connecting rod 152 is at the initial position, the buffer block 190 props against the second connecting rod 152, so as to play a role in anti-collision buffer on the second connecting rod 152. The return assembly 170 includes a spring 171 and a stay 172, the stay 172 being fixed to the right second connecting rod 152 in a position between the second fastening body 157 and the fourth hinge pin 158; one end of the spring 171 is fixed in a groove in the side of the first mounting plate 130, and the other end is connected to the stay 172. The first fastening body 153 and the second fastening body 157 may each employ a fixed pin, and the fixed pin may hook the latch hook 111.
Specifically, referring to fig. 5 and 6, when the first mounting plate 130 moves to the material taking position, the rotary cylinder 181 disposed near the material box 800 drives the pulling block 182 to rotate, and relative to the first mounting plate 130, the pulling block 182 pushes the bearing to rotate towards the outside, at this time, the upper second connecting rod 152 rotates clockwise about the second hinge pin 155, and drives the upper end of the first connecting rod 151 to swing leftwards and downwards through the first hinge pin 154, so that the lower second connecting rod 152 rotates anticlockwise about the third hinge pin 156 under the driving of the first connecting rod 151, and the two second connecting rods 152 are opened, i.e. in the unlocking state, and the spring 171 is stretched at this time. When the rotary cylinder 181 rotates a certain angle, the material taking driving motor 141 drives the first mounting plate 130 to move a set distance in a direction close to the material box 800, at this time, the rotary cylinder 181 drives the pulling block 182 to reversely rotate to an initial position of the pulling block 182, then under the action of the restoring force of the spring 171, the second connecting rod 152 above rotates anticlockwise around the second hinge pin 155, the second connecting rod 152 below rotates clockwise around the third hinge pin 156, and the first fastening body 153 and the second fastening body 157 respectively hook the corresponding locking hook 111, so as to lock the wafer carrier 110.
When the material taking driving motor 141 drives the first mounting plate 130 to move along the X-axis direction, the fastening body hooks the wafer carrier 110 to move together to the material loading grabbing position. When the die bonding assembly 200 moves to the loading grabbing position to clamp the wafer carrier 110, the rotary cylinder 181 arranged away from the material box 800 drives the corresponding pulling block 182 to rotate, the pulling block 182 props against the bearing to open outwards, and similarly, the two second connecting rods 152 rotate outwards to open, the fastening body is separated from the locking hook 111, and the die bonding assembly 200 can grab away the wafer carrier 110.
Further, referring to fig. 1, 2 and 10, the X-axis beam assembly 600 includes an X-axis beam 610, a sixth slide rail 620, a sixth slider 630 and a fifth mounting plate 640; the two X-axis beams 610 are symmetrically arranged on the platform 900, and the two sixth sliding rails 620 are arranged at intervals along the width direction of the inner side of the X-axis beams 610; the plurality of sixth sliding blocks 630 are all arranged on the X-axis cross beams 610, and the sixth sliding blocks 630 on each X-axis cross beam 610 are distributed along the X direction and correspondingly matched with the sixth sliding rail 620 in a sliding way; the fifth mounting plate 640 is in one-to-one correspondence with the sixth slider 630, and is fixedly connected with the sixth slider 630. In addition, the X-axis beam 610 is further provided with a linear motor, and the linear motor is in transmission connection with the fifth mounting plate 640, so as to drive the fifth mounting plate 640 to slide along the length direction of the X-axis beam 610, i.e., the X-direction. Referring to fig. 1 and 2, the die bonding assembly 200 includes a die bonding beam 210, the die bonding beam 210 is connected between two X-axis beams 610, and two ends of the die bonding beam are respectively and fixedly connected with a fifth mounting plate 640, so that the die bonding assembly 200 can move along the X direction under the driving of a linear motor; the spining assembly 300 comprises a spining beam 310, the spining beam 310 is also connected between two X-axis beams 610, and two ends of the spining beam are respectively and fixedly connected with corresponding fifth mounting plates 640, so that the spining assembly 300 can move along the X direction under the driving of corresponding linear motors.
With continued reference to fig. 1, 2, and 10, die attach assembly 200 further includes a second mounting plate 220, a sixth drive mechanism, a clamping module 230, and a seventh drive mechanism 240; the second mounting plate 220 is slidably connected with the die attach beam 210; the sixth driving mechanism is in transmission connection with the second mounting plate 220, and is used for driving the second mounting plate 220 to slide along the Y direction; the clamping module 230 is disposed on the second mounting plate 220 and is in rotational fit with the second mounting plate 220; the seventh driving mechanism 240 is in driving connection with the clamping module 230, and is used for driving the clamping module 230 to rotate around an axis extending along the Z direction.
Specifically, referring to fig. 1, 2 and 10, the sixth driving mechanism includes a first slide rail 250, a first slider 260 and a die attach linear motor; along the inner width direction of the die-bonding beam 210, two first sliding rails 250 are arranged at intervals, a first sliding block 260 is in sliding fit with the first sliding rails 250, the whole second mounting plate 220 is L-shaped, the vertical part of the second mounting plate is fixedly connected with the first sliding block 260, and the die-bonding linear motor is arranged in the die-bonding beam 210 and is in transmission connection with the second mounting plate 220, so that the second mounting plate 220 can be driven to slide along the length direction of the die-bonding beam 210, namely the Y direction. The clamping module 230 and the seventh driving mechanism 240 are both arranged at the horizontal part of the second mounting plate 220, the seventh driving mechanism 240 comprises a belt 241, a rotation adjusting motor 242, a synchronous wheel 243 and an idle wheel 244, wherein the output end of the rotation adjusting motor 242 is connected with the synchronous wheel 243, the idle wheel 244 is arranged at intervals with the synchronous wheel 243, and the belt 241 is tightly tensioned on the synchronous wheel 243, the idle wheel 244 and the clamping module 230; when the rotation adjusting motor 242 is started, the synchronizing wheel 243, the belt 241, the idler wheel 244 and the clamping module 230 are driven to rotate, so that the angle adjustment is performed in real time, and the core particles can be transferred to the empty substrate 700 in the correct direction and angle.
Further, referring to fig. 1 and 2, the spining assembly 300 further includes a third mounting plate 320, a camera module 330, a spining module 340, and an eighth driving mechanism; the third mounting plate 320 is slidably connected to the spining beam 310; the camera module 330 is disposed on the third mounting board 320; the spining module 340 is slidably connected with the third mounting plate 320 and can slide along the Z direction; the eighth driving mechanism is in transmission connection with the third mounting plate 320, and is used for driving the third mounting plate 320 to slide along the Y direction.
With continued reference to fig. 1 and 2, the eighth drive mechanism includes a second slide rail 350, a second slider 360, and a spiny linear motor; along the inside width direction of the thorn brilliant crossbeam 310, two second slide rails 350 interval sets up, and second slider 360 and second slide rail 350 sliding fit, third mounting panel 320 fixed connection are in second slider 360, and thorn brilliant linear motor sets up in thorn brilliant crossbeam 310, is connected with the transmission of third mounting panel 320 to drive third mounting panel 320 along the length direction of thorn brilliant crossbeam 310, i.e. Y to slide. The sliding path of the die-punching module 340 disposed on the third mounting plate 320 extends along the Z direction, and according to the photographing of the camera module 330, the die-punching module 340 can move along the Z direction to transfer the core particles on the wafer clamped by the die-bonding assembly 200 onto the empty substrate 700.
The working process of the spindly crystal type huge transfer device provided by the embodiment is as follows:
s100: the loading assembly 100 loads the wafer carrier 110 to the material taking position, the substrate feeding assembly 400 loads the empty substrate 700 to the substrate moving assembly 500, the traverse driving motor 545 drives the substrate carrier 510 to ascend and adsorb the empty substrate 700, the traverse cylinder 440 retracts to drive the second baffle 430 to move, and a movement space is reserved for the substrate moving assembly 500.
S200: the die attach assembly 200 is moved to the pick-up position of the loading assembly 100 to pick up the wafer carrier 110 and then to the die attach position by the gantry X-axis Y-axis.
S300: the spining assembly 300 is moved to the spining working position in the X, Y direction by the gantry.
S400：
S410: the wafer clamped by the clamping module 230 in the die bonding assembly 200 moves in the Y direction through the first sliding rail 250, and the X-axis gantry is fixed; the substrate driving motor 521 drives the empty substrate 700 on the substrate carrier 510 to move along the X-direction instead of moving along the X-axis direction in the die bonding assembly 200;
s420: photographing Mark points on the wafer according to the camera module 330 on the thorn crystal assembly 300, and driving the wafer on the clamping module 230 to rotate to a proper position through the rotation adjusting motor 242; the camera module 330 records the position of each core particle on the wafer by scanning and photographing, and the rotary adjusting motor 242 adjusts the position and posture according to each core particle during the wafer punching operation; the die-piercing module 340 moves to the die position in the direction X, Y by a gantry, and the die-piercing module 340 pierces the die up and down along Z.
S500: after the crystal punching is finished, the transverse moving cylinder 440 stretches out to drive the second baffle 430 to move; the traverse driving motor 545 is retracted to drive the substrate carrier 510 to descend, the adsorption of the substrate 700 is stopped, and the transplanted substrate 700 is transported away by the conveyor belt 410.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (10)
1. A spinodal mass transfer device, comprising: the device comprises a feeding assembly (100), a die bonding assembly (200), a die punching assembly (300), a substrate feeding assembly (400), a substrate moving assembly (500) and an X-axis beam assembly (600);
the loading assembly (100) is used for loading wafers and comprises a wafer carrier (110) used for loading the wafers;
the die attach assembly (200) is used for clamping the wafer carrier (110);
the spining assembly (300) is used for transferring core particles on a wafer to a substrate (700);
the substrate feed assembly (400) is for transporting a substrate (700);
the substrate moving assembly (500) is arranged at the substrate feeding assembly (400) and comprises a substrate carrier (510) and an X-direction driving mechanism (520), wherein the substrate carrier (510) is used for adsorbing a substrate transported by the substrate feeding assembly (400), and the X-direction driving mechanism (520) is in transmission connection with the substrate carrier (510) and is used for driving the substrate carrier (510) to move along the X direction;
the X-axis beam assembly (600) is in transmission connection with the die bonding assembly (200) so as to drive the die bonding assembly (200) to move to the feeding assembly (100) and the substrate carrier (510), and is also in transmission connection with the die punching assembly (300) so as to drive the die punching assembly (300) to move to the substrate carrier (510).
2. The spinodal mass transfer device according to claim 1, wherein the substrate feed assembly (400) comprises a conveyor belt (410) and a first drive mechanism;
the two conveyer belts (410) are spaced and distributed in parallel and extend along the Y direction;
the first driving mechanism is in transmission connection with the conveying belt (410) so as to drive the conveying belt (410) to move along the Y direction.
3. The spinodal mass transfer device according to claim 2, wherein the substrate feed assembly (400) further comprises a first baffle (420), a second baffle (430), and a second drive mechanism;
the first baffle (420) and the second baffle (430) extend along the Y direction and are respectively arranged at two sides of the two conveying belts (410) to form a conveying channel in a surrounding manner;
the second driving mechanism is in transmission connection with the second baffle plate (430) so as to drive the second baffle plate (430) to move away from or towards the conveying belt (410) along the X direction.
4. The spinodal macro transfer device according to claim 2, wherein the substrate movement assembly (500) further comprises a fixed plate (530) and a Z-drive mechanism (540);
the X-direction driving mechanism (520) is arranged on the fixed plate (530);
the Z-direction driving mechanism (540) is in transmission connection with the fixed plate (530) and is used for driving the fixed plate (530) to move along the Z direction.
5. The spinodal macro transfer device according to claim 4, wherein the Z drive mechanism (540) comprises an upper ramp block (541), a lower ramp block (542), and a traversing drive assembly;
the fixed plate (530) is fixed on the top surface of the upper inclined block (541);
the bottom surface of the upper inclined block (541) is a first inclined surface;
the surface of the lower inclined block (542) opposite to the first inclined surface is a second inclined surface, and the second inclined surface is matched with the first inclined surface;
the transverse moving driving assembly is in transmission connection with the lower inclined block (542) and is used for driving the lower inclined block (542) to horizontally move.
6. The spinodal mass transfer device according to claim 1, wherein the loading assembly (100) further comprises a support plate (120), a first mounting plate (130), a third drive mechanism (140), a take-off mechanism (150), and a fourth drive mechanism;
the first mounting plate (130) is in sliding fit with the support plate (120);
the third driving mechanism (140) is in transmission connection with the first mounting plate (130) and is used for driving the first mounting plate (130) to horizontally move;
the material taking mechanism (150) is arranged on the first mounting plate (130) and has two states of locking and unlocking;
the fourth driving mechanism is in transmission connection with the material taking mechanism (150) and is configured to drive the material taking mechanism (150) to switch between a locking state and an unlocking state under a loading working condition so as to correspondingly lock or release the wafer carrier (110).
7. The spinodal massive transfer device according to claim 6, wherein the wafer carrier (110) is provided with two latch hooks (111) which are distributed at intervals, and openings of the two latch hooks (111) are arranged in opposite directions;
the material taking mechanism (150) comprises a first connecting rod (151) and two second connecting rods (152);
one end of one second connecting rod (152) is provided with a first fastening body (153) matched with one lock hook (111), the other end of the second connecting rod is hinged with one end of the first connecting rod (151) through a first hinge pin (154), one second connecting rod (152) is also hinged with the first mounting plate (130) through a second hinge pin (155), and the second hinge pin (155) is positioned between the first hinge pin (154) and the first fastening body (153);
one end of the other second connecting rod (152) is hinged with the first mounting plate (130) through a third hinge pin (156), a second fastening body (157) matched with the other locking hook (111) is arranged at the other end of the other second connecting rod, the second fastening body (157) and the first fastening body (153) are positioned on the same side of the first connecting rod (151), the other second connecting rod (152) is also hinged with the other end of the first connecting rod (151) through a fourth hinge pin (158), and the fourth hinge pin (158) is positioned between the third hinge pin (156) and the second fastening body (157);
the fourth drive mechanism comprises a reset assembly (170) and a rotary drive assembly (180);
the reset assembly (170) is used for being connected with one of the second connecting rods (152), so that the second connecting rod (152) has a tendency to rotate towards the lock hook (111) around the hinge axis of the second connecting rod and the first mounting plate (130);
the two groups of rotation driving assemblies (180) are distributed at intervals along the sliding path of the first mounting plate (130) and are in transmission connection with one of the second connecting rods (152) and configured to drive the second connecting rods (152) to rotate around the hinge axis of the second connecting rods and the first mounting plate (130) away from the lock hooks (111) under the loading working condition by any group of rotation driving assemblies (180).
8. The spinodal mass transfer device according to claim 6, wherein the loading assembly (100) further comprises a fifth drive mechanism (160);
the fifth driving mechanism (160) is in transmission connection with the supporting plate (120) and is used for driving the supporting plate (120) to move along the Z direction.
9. The spinodal macro transfer device according to claim 1, wherein the die attach assembly (200) comprises a die attach beam (210), a second mounting plate (220), a sixth drive mechanism, a clamping module (230), and a seventh drive mechanism (240);
the X-axis beam assembly (600) is in transmission connection with the die-bonding beam (210) and is used for driving the die-bonding beam (210) to move along the X direction;
the second mounting plate (220) is in sliding connection with the die-bonding beam (210);
the sixth driving mechanism is in transmission connection with the second mounting plate (220) and is used for driving the second mounting plate (220) to slide along the Y direction;
the clamping module (230) is arranged on the second mounting plate (220) and is in running fit with the second mounting plate (220);
the seventh driving mechanism (240) is in transmission connection with the clamping module (230) and is used for driving the clamping module (230) to rotate around an axis extending along the Z direction.
10. The spinodal macro transfer device according to claim 1, wherein the spinodal assembly (300) comprises a spinodal beam (310), a third mounting plate (320), a camera module (330), a spinodal module (340), and an eighth drive mechanism;
the X-axis beam assembly (600) is in transmission connection with the spinned crystal beam (310) and is used for driving the spinned crystal beam (310) to move along the X direction;
the third mounting plate (320) is in sliding connection with the spining cross beam (310);
the camera module (330) is disposed on the third mounting plate (320);
the thorn crystal module (340) is connected with the third mounting plate (320) in a sliding way and can slide along the Z direction;
the eighth driving mechanism is in transmission connection with the third mounting plate (320) and is used for driving the third mounting plate (320) to slide along the Y direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310190492.4A CN116246988A (en) | 2023-03-02 | 2023-03-02 | Thorn crystal type huge transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310190492.4A CN116246988A (en) | 2023-03-02 | 2023-03-02 | Thorn crystal type huge transfer device |
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| Publication Number | Publication Date |
|---|---|
| CN116246988A true CN116246988A (en) | 2023-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310190492.4A Pending CN116246988A (en) | 2023-03-02 | 2023-03-02 | Thorn crystal type huge transfer device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116730005A (en) * | 2023-07-10 | 2023-09-12 | 芯朋半导体科技(如东)有限公司 | Matrix type huge amount detection mechanism |
| CN116884906A (en) * | 2023-08-08 | 2023-10-13 | 广东工业大学 | Film scribing thorn crystal type Mini-LED huge transfer device and use method thereof |
| CN117198959A (en) * | 2023-11-03 | 2023-12-08 | 迈为技术(珠海)有限公司 | Chip transfer method and device |
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2023
- 2023-03-02 CN CN202310190492.4A patent/CN116246988A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116730005A (en) * | 2023-07-10 | 2023-09-12 | 芯朋半导体科技(如东)有限公司 | Matrix type huge amount detection mechanism |
| CN116730005B (en) * | 2023-07-10 | 2024-01-23 | 芯朋半导体科技(如东)有限公司 | Matrix type huge amount detection mechanism |
| CN116884906A (en) * | 2023-08-08 | 2023-10-13 | 广东工业大学 | Film scribing thorn crystal type Mini-LED huge transfer device and use method thereof |
| CN116884906B (en) * | 2023-08-08 | 2024-03-26 | 广东工业大学 | Film scribing thorn crystal type Mini-LED huge transfer device and use method thereof |
| CN117198959A (en) * | 2023-11-03 | 2023-12-08 | 迈为技术(珠海)有限公司 | Chip transfer method and device |
| CN117198959B (en) * | 2023-11-03 | 2024-02-27 | 迈为技术(珠海)有限公司 | Chip transfer method and device |
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