CN116239963A - Heat conduction adhesive tape and preparation method thereof - Google Patents
Heat conduction adhesive tape and preparation method thereof Download PDFInfo
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- CN116239963A CN116239963A CN202310209513.2A CN202310209513A CN116239963A CN 116239963 A CN116239963 A CN 116239963A CN 202310209513 A CN202310209513 A CN 202310209513A CN 116239963 A CN116239963 A CN 116239963A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Abstract
The invention relates to the technical field of adhesive tapes, in particular to a heat-conducting adhesive tape and a preparation method thereof, wherein the heat-conducting adhesive tape comprises a release film, a glue layer, a PET film, a glue layer and a release film which are connected in sequence; the glue layer comprises: a polymer; terpene phenol resins; petroleum resin; nano heat conducting ceramic filler; nano silicon dioxide; a carbon nanotube; zinc oxide; an epoxy-based crosslinking agent; an isocyanate curing agent; the polymer comprises: acrylic acid; butyl acrylate; isooctyl acrylate; hydroxyethyl acrylate; vinyl acetate; ethyl acetate; the thickness of the PET film is 1.5-3 microns, and the thickness of the glue layer is 1.5-3 microns. The invention has the beneficial effects that: according to the heat conduction adhesive tape and the preparation method thereof, the heat conduction agent combination of the nano heat conduction ceramic filler, the nano silicon dioxide and the carbon nano tube is used, so that the colloid contains a larger amount of heat conduction component filler without reducing the mechanical strength of the colloid.
Description
The present application is a divisional application taking the patent of 2021-10-20 with application number 202111219737.9 and named as an ultrathin heat conduction adhesive tape and a preparation method thereof as a parent application.
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to a heat-conducting adhesive tape and a preparation method thereof.
Background
Technological development and market demands enable electronic devices to develop in the directions of miniaturization, light weight, compact structure and high operation efficiency, so that the heat dissipation effect becomes a key of the miniaturization design of the whole machine. In order to ensure that the electronic device or equipment stably operates, the generated heat needs to be timely led out. Therefore, the heat dissipation material has higher requirements on the quality, the heat conductivity, the strength and the stability. Therefore, the heat-conducting adhesive tape is used on the electronic device to timely conduct out heat so as to ensure the normal operation of the whole electronic device.
The existing heat-conducting adhesive tape for the electronic industry is insufficient in technology, the produced product is high in cost and performance, compared with similar products, the heat-conducting adhesive tape is mainly characterized in that the heat conductivity is too low, and certain indexes of physical properties just meet or cannot meet the general requirements of the electronic industry. The problem of limited filler addition amount can occur when the heat conducting filler is added into the high-molecular polymer, or the heat conducting coefficient is small, so that the heat dissipation requirement is difficult to meet; or it is difficult to make it thin; mainly because of the need to add a large amount of filler in order to improve the thermal conductivity of the adhesive tape, when the thermal conductive adhesive tape is made thin, the large amount of filler can lead to low strength, so that the operation is difficult and the bonding force is poor.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: provides an ultrathin heat conduction adhesive tape with high heat conduction coefficient and good mechanical property and a preparation method thereof.
The invention provides an ultrathin heat conduction adhesive tape, which comprises a release film, a glue layer, a PET film, a glue layer and a release film which are connected in sequence;
the glue layer is composed of the following raw materials in parts by weight: and (2) polymer: 100 parts; terpene phenol resin: 7-9 parts of a lubricant; petroleum resin: 5-8 parts of a lubricant; nano heat-conducting ceramic filler: 3-5 parts; nano silicon dioxide: 8-10 parts of a lubricant; carbon nanotubes: 3-5 parts; zinc oxide: 3-5 parts; epoxy-based crosslinking agent: 1-2 parts; isocyanate curing agent: 0.5-1 part;
the polymer consists of the following raw materials: acrylic acid: 3-5 parts; butyl acrylate: 10-13 parts of a lubricant; isooctyl acrylate: 12-15 parts; hydroxyethyl acrylate: 1-2 parts; vinyl acetate: 6-8 parts of a lubricant; ethyl acetate: 70-75 parts;
the thickness of the PET film is 1.5-3 microns, and the thickness of the glue layer is 1.5-3 microns.
The other technical scheme of the invention is as follows: the preparation method of the ultrathin heat-conducting adhesive tape comprises the following steps:
step 1: the following raw materials in parts by weight: acrylic acid: 3-5 parts; butyl acrylate: 10-13 parts of a lubricant; isooctyl acrylate: 12-15 parts; hydroxyethyl acrylate: 1-2 parts; vinyl acetate: 6-8 parts of a lubricant; stirring and mixing to obtain a mixed product;
step 2: putting the mixed product into ethyl acetate in a reaction furnace: 70-75 parts of a polymer is obtained by stirring, introducing nitrogen and heating to 71-75 ℃;
step 3: the following raw materials in parts by weight: and (2) polymer: 100 parts; terpene phenol resin: 7-9 parts of a lubricant; 5-8 parts of petroleum resin; 3-5 parts of nano heat-conducting ceramic filler; 8-10 parts of nano silicon dioxide; 3-5 parts of carbon nano tubes; 3-5 parts of zinc oxide; epoxy-based crosslinking agent: 1-2 parts; 0.5-1 part of isocyanate curing agent; stirring and mixing to obtain the finished glue;
step 4: coating the finished product glue on one side of the PET film, then attaching the release film, coating the finished product glue on the other side of the PET film, and then attaching the release film to obtain the ultrathin heat conduction adhesive tape.
The invention has the beneficial effects that: in the ultrathin heat-conducting adhesive tape and the preparation method thereof, the heat-conducting agent combination of the nano heat-conducting ceramic filler, the nano silicon dioxide and the carbon nano tube is used, so that the colloid contains a larger amount of heat-conducting component filler without reducing the mechanical strength of the colloid. Zinc oxide is also added into the gelatin water layer to play roles in dispersing and further improving the heat conduction and heat resistance of the adhesive tape. The adhesive tape is an ultrathin adhesive tape with the thickness of about 5-10 microns, various nanoscale heat conducting materials are added, heat can be effectively conducted, and the adhesive tape is suitable for adhering and fixing graphene radiating fins or aluminum sheets in heating parts such as mobile phone batteries, CPU (Central processing Unit) and the like.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present invention in detail, the following description will be made with reference to the embodiments.
The invention provides an ultrathin heat conduction adhesive tape, which comprises a release film, a glue layer, a PET film, a glue layer and a release film which are connected in sequence;
the glue layer is composed of the following raw materials in parts by weight: and (2) polymer: 100 parts; terpene phenol resin: 7-9 parts of a lubricant; petroleum resin: 5-8 parts of a lubricant; nano heat-conducting ceramic filler: 3-5 parts; nano silicon dioxide: 8-10 parts of a lubricant; carbon nanotubes: 3-5 parts; zinc oxide: 3-5 parts; epoxy-based crosslinking agent: 1-2 parts; isocyanate curing agent: 0.5-1 part;
the polymer consists of the following raw materials: acrylic acid: 3-5 parts; butyl acrylate: 10-13 parts of a lubricant; isooctyl acrylate: 12-15 parts; hydroxyethyl acrylate: 1-2 parts; vinyl acetate: 6-8 parts of a lubricant; ethyl acetate: 70-75 parts;
the thickness of the PET film is 1.5-3 microns, and the thickness of the glue layer is 1.5-3 microns.
Furthermore, in the ultrathin heat-conducting adhesive tape, the nano heat-conducting ceramic filler is nano aluminum oxide.
Further, in the ultrathin heat-conducting adhesive tape, the diameter of the carbon nanotube is 1-10 nanometers, and the length is 100-500 nanometers.
Furthermore, in the ultrathin heat-conducting adhesive tape, the epoxy cross-linking agent is glycidyl methacrylate.
Furthermore, in the ultrathin heat-conducting adhesive tape, the glue layer is composed of the following raw materials in parts by weight: and (2) polymer: 100 parts; terpene phenol resin: 8 parts; petroleum resin: 7 parts; nano aluminum oxide: 4 parts of: nano silicon dioxide: 9 parts; carbon nanotubes: 4 parts; zinc oxide: 4 parts; glycidyl methacrylate: 2 parts; isocyanate curing agent: 1 part.
The invention also provides a preparation method of the ultrathin heat conduction adhesive tape, which comprises the following steps:
step 1: the following raw materials in parts by weight: acrylic acid: 3-5 parts; butyl acrylate: 10-13 parts of a lubricant; isooctyl acrylate: 12-15 parts; hydroxyethyl acrylate: 1-2 parts; vinyl acetate: 6-8 parts of a lubricant; stirring and mixing to obtain a mixed product;
step 2: putting the mixed product into ethyl acetate in a reaction furnace: 70-75 parts of a polymer is obtained by stirring, introducing nitrogen and heating to 71-75 ℃;
step 3: the following raw materials in parts by weight: and (2) polymer: 100 parts; terpene phenol resin: 7-9 parts of a lubricant; 5-8 parts of petroleum resin; 3-5 parts of nano heat-conducting ceramic filler; 8-10 parts of nano silicon dioxide; 3-5 parts of carbon nano tubes; 3-5 parts of zinc oxide; epoxy-based crosslinking agent: 1-2 parts; 0.5-1 part of isocyanate curing agent; stirring and mixing to obtain the finished glue;
step 4: coating the finished product glue on one side of the PET film, then attaching the release film, coating the finished product glue on the other side of the PET film, and then attaching the release film to obtain the ultrathin heat conduction adhesive tape.
Further, in the preparation method of the ultrathin heat-conducting adhesive tape, the nano heat-conducting ceramic filler is nano aluminum oxide.
In the preparation method of the ultrathin heat-conducting adhesive tape, the epoxy cross-linking agent is glycidyl methacrylate.
Further, in the preparation method of the ultrathin heat-conducting adhesive tape, the coating thickness of the finished glue on each surface of the PET film is 1.7 micrometers; the thickness of the PET film was 1.5. Mu.m.
The invention has the beneficial effects that: in the existing heat-conducting adhesive, carbon nanotubes are added into a high-molecular polymer, but the cost of the carbon nanotubes is high, and when the addition amount is too large, the heat-conducting adhesiveness is reduced. In addition, there are also nano ceramic heat conductive fillers added to high molecular polymers, but the amount of the nano ceramic heat conductive fillers added is limited in the same way. The phenomenon of 'clustering' which is easy to occur when a large amount of nano materials are added, and the nano materials are not easy to disperse into a uniform heat conduction continuous phase in a polymer. According to the invention, the heat conducting components in the existing heat conducting adhesive are combined, namely, the heat conducting agent combination of the nano heat conducting ceramic filler, the nano silicon dioxide and the carbon nano tube is added into the high-molecular polymer, so that the obtained heat conducting adhesive has good heat conducting effect and high viscosity. The nano silicon dioxide improves the heat conduction performance, simultaneously improves the curing rate, improves the bonding effect and simultaneously increases the sealing performance of the adhesive. The carbon nano tube and the nano aluminum oxide are filled in a network structure formed by terpene phenol resin (high adhesive force, high cohesive force, high heat resistance and aging resistance) and petroleum resin (tackifying) resin with high softening point and nano silicon dioxide, so that the thermal conductivity of the adhesive tape is improved and the bonding effect is improved.
The heat conductive agent combination of the nano heat conductive ceramic filler, the nano silicon dioxide and the carbon nano tube can be uniformly dispersed in the acrylic acid polymerization monomer, so that the colloid contains a larger amount of heat conductive component filler without reducing the mechanical strength of the colloid. The obtained heat conducting adhesive can have a heat conducting coefficient of more than 10W/(m.k) at the thickness of as thin as 10 mu m, and the heat conducting adhesive tape at the thickness can have larger mechanical strength and better mechanical property than the existing heat conducting adhesive tape.
Example 1
The preparation method of the ultrathin heat-conducting adhesive tape comprises the following steps of:
step 1: the following raw materials in parts by weight: acrylic acid: 4 parts; butyl acrylate: 11 parts; isooctyl acrylate: 13 parts; hydroxyethyl acrylate: 2 parts; vinyl acetate: 7 parts; stirring and mixing to obtain a mixed product;
step 2: putting the mixed product into ethyl acetate in a reaction furnace: 72 parts of a polymer is obtained by stirring, introducing nitrogen and heating to 73 ℃;
step 3: the following raw materials in parts by weight: and (2) polymer: 100 parts; terpene phenol resin: 8 parts; petroleum resin: 7 parts; nano aluminum oxide: 4 parts of: nano silicon dioxide: 9 parts; carbon nanotubes: 4 parts; zinc oxide: 4 parts; glycidyl methacrylate: 2 parts; isocyanate curing agent: 1 part; stirring and mixing to obtain the finished glue;
the diameter of the carbon nano tube is 5 nanometers, and the length is 300 nanometers. The isocyanate curing agent is toluene diisocyanate TDI.
Step 4: coating the finished product glue on one side of the PET film, then attaching the release film, coating the finished product glue on the other side of the PET film, and then attaching the release film to obtain the ultrathin heat conduction adhesive tape.
The ultrathin heat conduction adhesive tape comprises the following structures: release film +1.7 microns glue layer +1.5 microns PET film +1.8 microns glue layer + release film.
Example 2
The preparation method of the ultrathin heat-conducting adhesive tape comprises the following steps of:
step 1: the following raw materials in parts by weight: acrylic acid: 3 parts; butyl acrylate: 10 parts; isooctyl acrylate: 12 parts; hydroxyethyl acrylate: 1 part; vinyl acetate: 6 parts; stirring and mixing to obtain a mixed product;
step 2: putting the mixed product into ethyl acetate in a reaction furnace: 70 parts of a polymer is obtained by stirring, introducing nitrogen and heating to 71 ℃;
step 3: the following raw materials in parts by weight: polymer 100: a part(s); terpene phenol resin: 7 parts; petroleum resin: 5 parts; nano aluminum oxide: 3 parts: nano silicon dioxide: 8 parts; carbon nanotubes: 3 parts; zinc oxide: 3 parts; glycidyl methacrylate: 1 part; isocyanate curing agent: 0.5 parts; stirring and mixing to obtain the finished glue;
the diameter of the carbon nano tube is 1 nanometer, and the length is 100 nanometers. The isocyanate curing agent is toluene diisocyanate TDI.
Step 4: coating the finished product glue on one side of the PET film, then attaching the release film, coating the finished product glue on the other side of the PET film, and then attaching the release film to obtain the ultrathin heat conduction adhesive tape.
The ultrathin heat conduction adhesive tape comprises the following structures: release film +1.5 micrometer glue layer +2 micrometer PET film +1.5 micrometer glue layer + release film.
Example 3
The preparation method of the ultrathin heat-conducting adhesive tape comprises the following steps of:
step 1: the following raw materials in parts by weight: acrylic acid: 5 parts; butyl acrylate: 13 parts; isooctyl acrylate: 15 parts; hydroxyethyl acrylate: 2 parts; vinyl acetate: 8 parts; stirring and mixing to obtain a mixed product;
step 2: putting the mixed product into ethyl acetate in a reaction furnace: 75 parts of a polymer is obtained by stirring, introducing nitrogen and heating to 75 ℃;
step 3: the following raw materials in parts by weight: and (2) polymer: 100 parts; terpene phenol resin: 9 parts; petroleum resin: 8 parts; nano aluminum oxide: 5 parts of: nano silicon dioxide: 10 parts; carbon nanotubes: 5 parts; zinc oxide: 5 parts; glycidyl methacrylate: 2 parts; 1 part of isocyanate curing agent; stirring and mixing to obtain the finished glue;
the diameter of the carbon nano tube is 10 nanometers, and the length is 500 nanometers. The isocyanate curing agent is toluene diisocyanate TDI.
Step 4: coating the finished product glue on one side of the PET film, then attaching the release film, coating the finished product glue on the other side of the PET film, and then attaching the release film to obtain the ultrathin heat conduction adhesive tape.
The ultrathin heat conduction adhesive tape comprises the following structures: release film +2.5 microns glue layer +3 microns PET film +2.5 microns glue layer + release film.
Comparative example 1
This comparative example differs from example 1 in that the nano alumina in the glue layer was replaced with an equal amount of carbon nanotubes.
Comparative example 2
This comparative example differs from example 1 in that the nanosilica in the gum layer is replaced with an equal amount of carbon nanotubes.
Comparative example 3
This comparative example differs from example 1 in that the zinc oxide in the glue layer was removed.
The ultra-thin heat conductive tapes prepared in examples 1 to 3 and comparative examples 1 to 3 were subjected to performance test, and the test data obtained are shown in table 1:
TABLE 1
As shown in the table above, the ultrathin heat-conducting adhesive tape prepared in the embodiment 1-3 has good peel strength and initial adhesiveness, high heat conductivity coefficient and good high temperature resistance, and is suitable for being adhered and fixed with graphene radiating fins or aluminum sheets in heating parts such as mobile phone batteries, CPU (Central processing Unit) and the like.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent modifications made by the teachings of the present invention, or direct or indirect application in the relevant art, are intended to be included within the scope of the present invention.
Claims (6)
1. The heat conduction adhesive tape is characterized by comprising a release film, a glue layer, a PET film, a glue layer and a release film which are connected in sequence;
the glue layer is composed of the following raw materials in parts by weight: and (2) polymer: 100 parts; terpene phenol resin: 7-9 parts of a lubricant; petroleum resin: 5-8 parts of a lubricant; nano heat-conducting ceramic filler: 3-5 parts; nano silicon dioxide: 8-10 parts of a lubricant; carbon nanotubes: 3-5 parts; zinc oxide: 3-5 parts; epoxy-based crosslinking agent: 1-2 parts; isocyanate curing agent: 0.5-1 part;
the polymer consists of the following raw materials: acrylic acid: 3-5 parts; butyl acrylate: 10-13 parts of a lubricant; isooctyl acrylate: 12-15 parts; hydroxyethyl acrylate: 1-2 parts; vinyl acetate: 6-8 parts of a lubricant; ethyl acetate: 70-75 parts;
the thickness of the PET film is 1.5-3 microns, and the thickness of the glue layer is 1.5-3 microns;
the nano heat-conducting ceramic filler is nano aluminum oxide.
2. The heat transfer tape of claim 1, wherein the epoxy-based cross-linking agent is glycidyl methacrylate.
3. The heat conducting adhesive tape according to claim 1, wherein the adhesive layer is composed of the following raw materials in parts by weight: and (2) polymer: 100 parts; terpene phenol resin: 8 parts; petroleum resin: 7 parts; nano aluminum oxide: 4 parts of: nano silicon dioxide: 9 parts; carbon nanotubes: 4 parts; zinc oxide: 4 parts; glycidyl methacrylate: 2 parts; isocyanate curing agent: 1 part.
4. The preparation method of the heat conduction adhesive tape is characterized by comprising the following steps of:
step 1: the following raw materials in parts by weight: acrylic acid: 3-5 parts; butyl acrylate: 10-13 parts of a lubricant; isooctyl acrylate: 12-15 parts; hydroxyethyl acrylate: 1-2 parts; vinyl acetate: 6-8 parts of a lubricant; stirring and mixing to obtain a mixed product;
step 2: putting the mixed product into ethyl acetate in a reaction furnace: 70-75 parts of a polymer is obtained by stirring, introducing nitrogen and heating to 71-75 ℃;
step 3: the following raw materials in parts by weight: 100 parts of a polymer; terpene phenol resin: 7-9 parts of a lubricant; 5-8 parts of petroleum resin; 3-5 parts of nano heat-conducting ceramic filler; 8-10 parts of nano silicon dioxide; 3-5 parts of carbon nano tubes; 3-5 parts of zinc oxide; epoxy-based crosslinking agent: 1-2 parts; 0.5-1 part of isocyanate curing agent; stirring and mixing to obtain the finished glue; the nano heat-conducting ceramic filler is nano aluminum oxide;
step 4: coating the finished product glue on one surface of the PET film, then attaching the release film, coating the finished product glue on the other surface of the PET film, and then attaching the release film to obtain the heat-conducting adhesive tape.
5. The method of claim 4, wherein the epoxy cross-linking agent is glycidyl methacrylate.
6. The method of preparing a thermal tape according to claim 4, wherein the coating thickness of the final glue on each side of the PET film is 1.7 microns; the thickness of the PET film was 1.5. Mu.m.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310209513.2A CN116239963A (en) | 2021-10-20 | 2021-10-20 | Heat conduction adhesive tape and preparation method thereof |
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| CN202310209513.2A CN116239963A (en) | 2021-10-20 | 2021-10-20 | Heat conduction adhesive tape and preparation method thereof |
| CN202111219737.9A CN113801603B (en) | 2021-10-20 | 2021-10-20 | Ultrathin heat-conducting adhesive tape and preparation method thereof |
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| JP2007224258A (en) * | 2006-02-24 | 2007-09-06 | Yasuhara Chemical Co Ltd | Acrylic pressure-sensitive adhesive composition |
| CN104087215B (en) * | 2014-07-31 | 2016-10-19 | 东莞宏石功能材料科技有限公司 | A kind of pressure sensitive adhesive being applied to ultrathin double-face glue and preparation method thereof |
| CN104178048B (en) * | 2014-09-01 | 2015-11-18 | 络派模切（北京）有限公司 | A kind of ultrathin heat conduction adhesive tape |
| JP6113889B2 (en) * | 2015-09-18 | 2017-04-12 | 日東電工株式会社 | Adhesive sheet |
| CN111777966A (en) * | 2020-07-24 | 2020-10-16 | 福建友谊胶粘带集团有限公司 | Glass fiber mesh adhesive tape and preparation method thereof |
| CN213388492U (en) * | 2020-09-15 | 2021-06-08 | 广东弘擎电子材料科技有限公司 | Integrated high-elasticity adhesive tape for heat dissipation module |
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| CN113801603A (en) | 2021-12-17 |
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