TW201345963A - Insulated thermal interface material - Google Patents

Abstract

The present invention discloses an insulated thermal interface material for applying between an electronic element and a thermal dissipating element. The insulated thermal interface material at least comprises a base, a first filler and a second filler. The base is a polymer and the first filler is graphene. The first filler and the second filler are dispersed in the base.

Description

Insulated thermal interface material

The invention relates to an insulating thermal interface material, in particular to an insulating thermal interface material which is filled in a high molecular polymer by using a graphene material to provide thermal conductivity and insulation of the high molecular polymer.

In recent years, the rapid development of electronic technology, the high frequency, high speed of electronic components and the intensive and miniaturization of integrated circuits have caused the heat generation per unit volume of electronic components to increase dramatically. Cooling these electronic components has become an urgent problem, which must be an urgent problem. Proposed to maintain the performance of these electronic components. For this reason, there is a need for a heat dissipating member having a high thermal conductivity.

In the past, one possible technique for improving the thermal conductivity of a heat dissipating component was to reduce the thickness of the component as much as possible. However, if the thickness is lowered too much, problems may occur, including a reduction in heat sink strength, durability, and/or electrical insulation properties. One proposed method for solving these problems includes forming a heat dissipating member into a multilayer structure in which excellent heat resistance and electrical insulation such as aromatic polyimine, polyamine, polyamidimide or Polyethylene naphthalate is used as the inner layer, and a thermal interface material (e.g., ruthenium rubber) containing a thermally conductive filler and exhibiting excellent thermal and electrical properties is used as the outer layer. However, in these thermally conductive electrically insulating members having a multilayer structure, the bond between the outer layer and the inner layer tends to be unstable, meaning that the durability of the member tends to be poor, and interlaminar peeling occurs over time.

In response to the above problems, another solution is proposed in which a thermal interface material (e.g., ruthenium rubber) is used as the outer layer, and the above ruthenium rubber is obtained by curing a composition including a ruthenium compound-based adhesion promoter. However, the inner layer formed of an aromatic polyimine or the like has a thermal conductivity which is remarkably lower than that of the tantalum rubber used as the outer layer, thereby lowering the thermal conductivity of the entire composite material.

In addition, although the thermal interface material is filled with a thermal conductive filler to increase its thermal conductivity, cerium oxide, aluminum oxide, indium, tantalum carbide, tantalum nitride, magnesium oxide, magnesium carbonate, zinc oxide, aluminum nitride are commonly used. Thermally conductive fillers in the thermally conductive body of the thermal interface material, however, these thermally conductive fillers individually have the following disadvantages:

(1) Cerium oxide must use a high filling amount due to low thermal conductivity, but high cerium oxide filling amount is difficult to reduce the hardness of the thermally conductive body of the thermal interface material, and the viscosity thereof is too high to be molded. .

(2) Alumina and aluminum are amphoteric compounds which are susceptible to their intrinsic impurities. When the thermally conductive body of the thermal interface material is an epoxy resin, it may have an adverse effect on heat resistance and compression set.

(3) Since zinc oxide has a high specific gravity of 5.7, sedimentation and precipitation tend to occur when dispersed in a thermally conductive body of a thermal interface material, and powdered zinc oxide also has an unpleasant high hygroscopicity.

(4) The niobium carbide also has a high specific gravity, and the ground niobium carbide powder currently sold on the market tends to aggregate or settle when dispersed in a heat-conducting body of the thermal interface material (for example, niobium rubber). Because tantalum carbide aggregates agglomerates, they are difficult to redisperse and process.

(5) Tantalum nitride and aluminum nitride are liable to react with water, so there is a disadvantage that moisture resistance is extremely poor.

(6) Magnesium oxide is also an alternative highly thermally conductive filler, but similarly to aluminum nitride, it is also easy to react with an aqueous phase, and thus has a disadvantage of extremely poor moisture resistance.

(7) Magnesium carbonate is unstable and decomposes into magnesium oxide under high temperature heating.

In view of this, in order to solve the above-mentioned heat conductive filler, the cost of the thermal interface material is often too high (for example, a large amount of heat conductive filler is required), heat aging (such as poor heat resistance), surface bleed (eg, poor moisture resistance), or The use of a thermally conductive body (such as an epoxy resin) of a part of the thermal interface material is limited. The present invention provides a thermal interface material filled with a graphene material, which can effectively transfer the heat energy emitted by the electronic component to the heat dissipating component. It has excellent electrical insulation and can be widely used in electrical and electronic fields, such as heat dissipation components for CPUs and high-power transistor chips.

The invention provides an insulating thermal interface material which can be applied between an electronic component and a heat dissipating component. The insulating thermal interface material comprises at least a substrate, a first filler and a second filler. Wherein the substrate is a high molecular polymer, and the first filler is a graphene material, and the first filler and the second filler are dispersed in the substrate.

In an embodiment of the invention, the first filler is a graphene material having a length or a width to thickness ratio of 50 to 10000, and optionally a graphene material, a nitrogen-containing graphene material, and an oxygen-containing material. Graphene, a nitrogen-containing and oxygen-containing graphene material, a plurality of layers of nitrogen-containing graphene materials superimposed with van der Waals force, a plurality of layers of graphene materials superimposed with van der Waals force, and a plurality of layers stacked with van der Waals force A group of oxygen-containing graphene materials, a plurality of layers of nitrogen-containing and oxygen-containing graphene materials superimposed with van der Waals force, and combinations thereof.

In an embodiment of the invention, the second filler is a thermally conductive inorganic powder, and the powder is selected from the group consisting of free powdered aluminum oxide, magnesium oxide, aluminum nitride, boron nitride, tantalum carbide, tin oxide, tantalum nitride. a group of aluminum oxide whiskers, aluminum nitride whiskers, tantalum carbide whiskers, magnesium oxide whiskers, tantalum nitride whiskers and combinations thereof.

In an embodiment of the invention, the substrate is a ruthenium rubber resin comprising at least one organopolyoxane compound, a curing agent and a adhesion promoter, and the above organic polyoxane compound, the above curing The weight percentage of the agent, the adhesion promoter, the first filler and the second filler is 91% to 99.55%, 0.1% to 5%, 0.1% to 3%, 0.0025% to 0.005%, 0.25%, respectively. 0.5%.

In an embodiment of the invention, the second filler has an average fineness of 20 to 50 μm.

In one embodiment of the invention, the organopolyoxyalkylene compound has a degree of polymerization between 200 and 12,000, and which comprises a compound of the formula:

R ¹ _a SiO _(4-a)/2

Wherein R ¹ is a monovalent hydrocarbon group having 1 to 10 carbon atoms, and optionally a monoalkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or a halogen element; The group consisting of an alkyl group and an alkenyl group, and a is a positive number of 1.9 to 2.05.

In one embodiment of the invention, the curing agent is a hydrazine alkylation reaction curing agent or an organic peroxide.

In an embodiment of the invention, the adhesion promoter comprises at least one ruthenium compound having a plurality of substituent groups, and the substituent groups may be selected from a mono-epoxy group, an alkoxy group, and a group. a group consisting of a radical, a monovinyl group and a hydrogenated sulfhydryl group.

In one embodiment of the invention, wherein the substrate is a curable epoxy resin, which may be selected from a linear epoxy epoxide having a free epoxy group end group, a polymeric epoxide having a skeleton epoxy group, and a group of polymeric epoxides having pendant epoxy groups.

In an embodiment of the present invention, the insulating thermal interface material of the present invention further comprises a particulate thermoplastic polymer material, wherein the substrate, the particulate thermoplastic polymer material, the first filler and the second The weight percentage of the filler is 90% to 97%, 1% to 2%, 0.005% to 0.001%, and 0.1% to 1%, respectively.

In one embodiment of the invention, the particulate thermoplastic polymer material comprises a polymer having a glass transition temperature of at least 60 °C. Preferably, the particulate thermoplastic polymer material has a weight average molecular weight of greater than 7,000 and may be selected from the group consisting of free polymethyl methacrylate and methyl methacrylate/methacrylic acid copolymer. Preferably, the above-mentioned particulate thermoplastic polymer material has an average fineness of 0.25 to 250 μm.

In an embodiment of the present invention, the insulating thermal interface material of the present invention further comprises a curing agent, and the curing agent comprises a dicyandiamide and a derivative thereof or a metal imidazolium compound represented by ML _m , wherein M is a metal, and may be selected from the group consisting of Ag(I), Cu(I), Cu(II), Cd(II), Zn(II), Hg(II), Ni(II) and Co(II). Group, L is a compound of the formula:

Wherein R ¹ , R ² and R ³ are selected from the group consisting of a free hydrogen atom, an alkyl group and an aryl group, and m is a valence of the metal.

In one embodiment of the invention, the insulating thermal interface material of the present invention has a thermal conductivity greater than 3 W/m‧K.

In an embodiment of the present invention, the insulating thermal interface material of the present invention further comprises an additive, and the additive may be selected from a free coupling agent, a lubricant, a flow control agent, a thickener, a promoter, a chain extender, and the like. A group of tougheners, dispersants, co-curing agents, and combinations thereof.

The features of the present invention and its advantages will be further understood from the following description. For reading, please refer to the first to second C drawings.

In view of the problems encountered by the prior art, the present invention aims to provide a thermal interface material filled with a graphene material, which can effectively transfer the thermal energy emitted by the electronic component to the heat dissipating component by proportioning the components. It has excellent electrical insulation.

The invention provides an insulating thermal interface material which can be applied between an electronic component and a heat dissipating component. Preferably, the electronic component can be a power transistor, a MOS transistor, a field effect transistor, a thyristor, a rectifier or a transformer, but the invention is not limited thereto.

The insulating thermal interface material comprises at least a substrate, a first filler and a second filler. Wherein the substrate is a high molecular polymer, and the first filler is a graphene material, and the first filler and the second filler are dispersed in the substrate.

Preferably, the first filler is a graphene material having a length or a width to thickness ratio of 50 to 10,000, and optionally a graphene material, a nitrogen-containing graphene material, an oxygen-containing graphene, and a nitrogen-containing material. An oxygen-containing graphene material, a plurality of layers of nitrogen-containing graphene materials superimposed with van der Waals force, a plurality of layers of graphene materials superimposed with van der Waals force, and a plurality of layers of oxygen-containing graphene materials superimposed with van der Waals force a group of nitrogen-containing and oxygen-containing graphene materials superimposed with van der Waals and a combination thereof.

Preferably, the second filler is a thermally conductive inorganic powder, and the powder is selected from the group consisting of free powdered aluminum oxide, magnesium oxide, aluminum nitride, boron nitride, tantalum carbide, tin oxide, tantalum nitride, and aluminum oxide crystal. A group consisting of aluminum nitride whiskers, tantalum carbide whiskers, magnesium oxide whiskers and tantalum nitride whiskers. However, the second filler is not limited to these powders, and any powder exhibiting thermal conductivity and insulating properties may be employed. The thermally conductive powder may be used singly or in combination of two or more.

In principle, the base material may use a ruthenium rubber resin or an epoxy resin, and other components may also differ in material and ratio depending on the substrate, but the thermal interface material of the present invention contains the first filler. With a second filler. Subsequently, the two different embodiments described above will be further explained as follows.

<First Embodiment>

In the first embodiment, the substrate is a ruthenium rubber-based resin, and it contains at least one organopolysiloxane compound, a curing agent, and an adhesion promoter.

In one embodiment of the invention, the organopolyoxyalkylene compound has a degree of polymerization between 200 and 12,000 and comprises a compound of formula (I):

R ¹ _a SiO _(4-a)/2

(I)

In the formula (I), R ¹ is the same or different, substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms. Preferably, R ¹ has 1 to 8 carbon atoms, and R ¹ is selected from a mono-alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, and a halogen element. A group consisting of a substituted alkyl group and a monoalkenyl group, and a is a positive number of 1.9 to 2.05.

Further, when R ¹ is an alkyl group, it may be a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a decyl group or a fluorenyl group. When R ¹ is a cycloalkyl group, it may be a cyclopentyl group or a cyclohexyl group. When R ¹ is an aryl group, it may be a phenyl group, a tolyl group, a xylyl group or a naphthyl group. When R ¹ is an aralkyl group, it may be a benzyl group, a phenethyl group or a 3-phenylpropyl group. When R ¹ is an alkyl group of a halogen element, it may be, for example, a 3,3,3-trifluoropropyl group or a 3-chloropropyl group. When R ¹ is an alkenyl group, it may be, for example, a vinyl group, an allyl group, a butenyl group, a pentenyl group or a hexenyl group.

Specifically, as a practical example, the organopolyoxyalkylene compound may have a main chain formed of dimethyloxane units alone or a main chain formed of a similar main chain. Among them, a part of the methyl group is substituted with a vinyl group, a phenyl group or a 3,3,3-trifluoropropyl group or the like. Further, the molecular chain terminal may be capped with a triorganosylalkyl group or a light group. Preferably, the triorganosylalkyl group comprises trimethylcarbenyl, dimethylvinylformamidin or trivinylcarbenyl.

Next, in the present embodiment, the curing agent is a hydrazine alkylation reaction curing agent or an organic peroxide. First, in the case where the curing agent is a hydrogenation oximation reaction curing agent, the curing agent is composed of an organohydrogenpolyoxane and a platinum-based catalyst having an average of at least two hydrogen atoms bonded to the ruthenium atom in a single molecule.

Meanwhile, the above organopolyoxyalkylene compound is an organopolyoxyalkylene compound having at least 2, preferably 3 or more alkenyl groups bonded to a ruthenium atom per molecule. At this time, the organic hydrogen polyoxymethane of the curing agent acts as a crosslinking agent to undergo an addition reaction with the alkenyl group contained in the organopolyoxyalkylene compound. Further, the alkenyl group bonded to the ruthenium atom is preferably a vinyl group, and the alkenyl group may be present at the chain end, the side chain or both of the positions of the molecule, but at least one alkenyl group is bonded to the molecule. It is preferred to have a ruthenium atom at the end of the chain.

In this case, the actual example of the organopolyoxyalkylene compound may be a combination of any one or more of the following compounds, but the present invention is not intended to be limited thereto, and it is first described that both molecular chain ends are used. a copolymer of trimethylmethaneoxyl-terminated dimethyl methoxyoxane and methylvinyl fluorene, a polymethylvinyl oxime terminated with trimethylmethaneoxyl at both molecular chain ends Alkane, a copolymer of dimethyl methoxy alkane, methyl vinyl oxa oxane and methyl phenyl decane, both ends of which are terminated with trimethylmethane oxide, both molecular chain ends Dimethyl methoxy alkane terminated with dimethylvinylformyloxy, polymethylvinyl oxirane terminated with dimethylvinylformyloxy at both molecular chain ends, two molecules Copolymers of dimethyl methoxy alkane and methyl vinyl decane, both ends of the chain, are terminated with dimethyl vinyl methoxide. a copolymer of dimethyl methoxyoxane, methyl vinyl siloxane and methyl phenyl siloxane, With both molecular chain terminals trivinyl A Silane-terminated polydimethylsiloxane.

The platinum-based catalyst used in combination with the organohydrogenpolyoxyalkylene is a catalyst for promoting the curing of the composition, which may be chloroplatinic acid, an alcohol solution of chloroplatinic acid, an olefin complex of platinum, an alkenyl group of platinum. A ruthenium complex of a oxoxane complex and platinum. The amount of the platinum-based catalyst used in the composition is not particularly limited, and it is only necessary to achieve an effective catalytic amount.

Then, when the curing agent is an organic peroxide, it may be selected from benzamidine peroxide, dicumyl peroxide, 2,5-dimethyl 2,5-bis(tert-butylperoxy). a group consisting of hexane, di-tert-butyl peroxide and tert-butyl perbenzoate. At this time, although the above organopolyoxyalkylene compound is not particularly limited, it is preferred that each molecule contains at least two alkenyl groups.

In this case, the actual example of the organopolyoxyalkylene compound may be a combination of any one or more of the following compounds, but the present invention is not intended to be limited thereto, and it is first described that both molecular chain ends are used. Dimethylvinylformyloxy-terminated polydimethyloxane, two dimethyl methoxy alkane terminated with methyl phenyl vinyl methoxyalkyloxy group at the end of two molecular chains, two molecular chains a copolymer of dimethyl methoxy alkoxy-terminated dimethyl methoxy oxane and methyl phenyl decane, both ends of which are terminated with dimethylvinylformyloxy Copolymer of dimethyl methoxy oxane and methyl vinyl fluorene oxide, copolymerization of dimethyl methoxy oxane and methyl vinyl decyl alkane terminated with trimethylmethane oxide at both molecular chain ends a polymethyl(3,3,3-trifluoropropyl) decane terminated with dimethylvinylformyloxy at the end of both molecular chains, both of which are terminated with a decyl alcohol group. a copolymer of dimethyl methoxyoxane and methyl vinyl fluorene, both ends of the two molecular chains are terminated with a stanol group a copolymer of dimethyloxane, methylvinyloxirane and methylphenyloxime.

In the present embodiment, the addition of the adhesion promoter enables a strong mutual adhesion between the ruthenium rubber-based resin composite materials, and it is possible to overcome the conventional defects and obtain a thermal interface material exhibiting excellent durability for a long period of time without interlayer peeling. . Further, the adhesion promoter comprises at least one anthracene compound having a plurality of substituent groups, which may be selected from a mono-epoxy group, an alkoxy group, a monomethyl group, a monovinyl group. A group consisting of a group and a hydrogenated thiol group. Preferably, the ruthenium compound having at least two of the above groups in one molecule.

In addition, when the curing agent is a hydrogenation oximation reaction curing agent, the ruthenium compound in the adhesion promoter includes a vinyl group, a hydrogenated sulfhydryl group or both, and an epoxy group, an alkoxy group or Both are better. Whereas when the curing agent is an organic peroxide curing agent, the oxime compound of the adhesion promoter comprises a methyl group, a vinyl group or both, and an epoxy group, an alkoxy group or both good. Specific examples of the ruthenium compound containing a group of the above type include the compounds shown below, but the present invention is not limited to the compounds shown below.

In this embodiment, the weight percentage of the organopolysiloxane compound, the curing agent, the adhesion promoter, the first filler and the second filler in the thermal interface material is 91%-99.55%, 0.1%-5%, respectively. , 0.1% to 3%. The weight percentage of the first filler and the second filler are respectively 0.0025% to 0.005%, 0.25% to 0.5%, and substantially the amount of the first filler and the second filler added is too small to cause heat conduction of the integral thermal interface material. The property is degraded, but if it is added too much, it is difficult to mix uniformly in the substrate, and it also affects the molding processability.

Preferably, the average fineness of the second filler is preferably from 20 to 50 μm. In addition, when the thermal interface material is prepared into a film, the thickness of each of the materials may be set according to the intended configuration and application of the composite of the present invention, although it is not particularly limited, if the outer layer is too thin, the layer is matched with electronic components. The ability of the shape is lowered, and the thermal conductivity tends to deteriorate, and if the outer layer is too thick, the heat conduction performance tends to decrease. Therefore, the thickness thereof is in the range of 30 to 800 μm, preferably 50 to 400 μm.

It is to be noted that, in addition to the above substrate, the first filler, the second filler, the curing agent and the adhesion promoter, the thermal interface material provided by the present invention may further comprise an additive, and the additive may be selected from a free accelerator. A group of chain extenders, tougheners, dispersants, and co-curing agents.

Next, the preparation process of the thermal interface material provided by the present invention will be described as follows. First, a mixing device such as a kneader, a Banbury mixer, a planetary mixer or a Shinagawa mixer is used, and if necessary, with heating to a temperature of about 100 ° C or higher, the organopolyoxane is used. The compound, the first filler and the second filler are kneaded together. In the above kneading step, if necessary, reinforced cerium oxide such as pyrogenic cerium oxide or precipitated cerium oxide, eucalyptus oil or fluorenone humectant, or a flame retardant such as platinum, titanium oxide or benzotriene may be used. The azole is added and mixed, provided that such addition does not affect the thermal conductivity of the outer layer.

The homogeneous mixture obtained by the kneading step was cooled to room temperature, and then filtered through a screening procedure or the like. Subsequently, a predetermined amount of the adhesion promoter and the curing agent are added to the mixture, and a second kneading is performed using a twin roll mill or a Shingawa mixer or the like. In the second kneading step, if necessary, an acetylene compound-based addition reaction retarder such as 1-ethynyl 1-cyclohexanol, a colorant such as an organic pigment or an inorganic pigment, or a heat resistance improver such as Iron oxide or cerium oxide is added and mixed.

The thermal interface material obtained after the second kneading step described above may be used as an outer layer coating agent, although a solvent such as toluene or the like may be added if necessary, and then the resulting mixture may be mixed in a mixing apparatus such as a planetary mixer or a kneader. An outer layer coating agent is formed, which is not limited to a single layered layered structure. If necessary, the inner layer (A) containing a compound such as an aromatic polyimine as described in the prior art may be combined with the thermal interface material (B) to form (B)/(A)/(B)/(A). The five-layered structure of the type /B type may be included in the structure, or a separator such as a glass cloth, a graphite sheet or an aluminum foil may be included in the structure, and the present invention is not intended to be limited thereto.

After the description of the structure, material and composition ratio of the above thermal interface material, further provide two sets of actual component materials, ratios and test results as follows.

Formula one

(a) Organopolyoxydecane compound: Polydimethyloxane having an average degree of polymerization of 8000 terminated with dimethylvinylcarbyloxy at both ends

(b) 0.005% of nitrogen-containing graphene material

(c) 0.5% was kneaded at room temperature for 40 min by a decane-functionalized cerium oxide powder having an average fineness of 40 nm and a 0.5% dispersing aid. After filtering through a screening step of 100 mesh, the above mixture is

(d) 1% of a combination of adhesion promoters consisting of a bismuth compound as shown in formula (II)

(e) 1.9% of bis(2-methylbenzhydryl) peroxide

(f) 0.4% of the coloring agent KE-color-R20 was mixed, and then the resulting mixture was further kneaded using a two-roll mill to obtain a mixture. Subsequently, the mixture thus obtained was coated on one surface of a glass substrate. The coated coating was then treated under conditions including a drying temperature of 80 ° C and a curing temperature of 150 ° C to form a layer of thermal interface material having a thickness of 62.5 μm.

Formula 2

A thermal interface material was prepared in the same manner as in Formulation 1, except that the amount of the dispersant was changed from 0.5% to 1%.

Finally, the thermal conductivity and electrical resistance of the thermal interface material provided by the present invention are measured as shown in Table 1, wherein the value of the thermal conductivity coefficient refers to a value measured by a laser fire method using a heat resistance test device at 25 ° C:

The larger the value of the above thermal conductivity is, the stronger the ability to disperse and transfer heat. It can be seen from Table 1 that the thermal interface material provided by the present invention has a thermal conductivity of not less than 3 W/m‧K, which is far better than that currently sold on the market (about 0.5 to 0.6 W/m‧K). In addition, electronic materials usually need to maintain insulation, so as not to make the electronic components current too large and burn out the components. Therefore, we also measure the resistance value of the thermal interface material, and found that the resistance value is also very large enough to reach the electronic components. Generally required insulation.

Meanwhile, please refer to the first A to C diagrams, and the first A to C diagrams show the structural schematic diagram of the insulating thermal interface material 10 of the first embodiment of the present invention. As shown in the figure, the combination of the first filler 11 and the second filler 12 has a long-chain structure of the body of the silicone rubber 13 and has the storage and release of the elastic energy E1. Therefore, when the first filler 11 is heated and moved, When rotating or vibrating, the body of the rubber-like resin 13 similar to the spring function is compressed or elongated, so that the exchange and transfer of the thermal energy T and the elastic energy F can be performed, and the thermal conductivity of the second filler 12 and the first filler 11 is added. The thermal conductive insulation synergistic effect of the thermal conduction transmission is enhanced to exhibit satisfactory thermal conductivity and insulation. For these reasons, the thermal interface material 10 provided by the present invention can be widely applied to a thermally conductive sheet inserted between a heat-generating electronic or electrical component and a heat dissipating component. In addition, since the above-described thermal interface material 10 exhibits superior thermal insulation properties, it is particularly effective for use in high heat generating devices. Meanwhile, although not shown, since the ruthenium rubber resin 13 further includes an adhesion promoter, if the thermal interface material is combined with the inner layer of a compound such as an aromatic polyimine as mentioned in the prior art, Strongly bonded together, that is, the thermal interface material provided by the present invention has excellent durability.

<Second embodiment>

In a second embodiment, the substrate is a curable epoxy resin which may be selected from linear epoxy epoxides having an epoxy group end group (eg, diglycidyl ether of polyoxyalkylene glycol), a group of polymeric epoxides of a backbone epoxy group (such as a polybutadiene polyepoxide) and a polymeric epoxide having pendant epoxy groups (such as a glycidyl methacrylate polymer or copolymer) group. The epoxy group-containing substance includes a compound having the following formula (V):

In the formula (III), R' is an alkyl group, an alkyl ether or an aryl group, and n is an integer of 2 to 6. Preferably, the curable epoxy resin comprises at least 2 epoxy groups per molecule and has a weight average molecular weight of 150 to 10,000.

These epoxy resins include aromatic glycidyl ethers (prepared by reacting polyhydric phenols with excess epichlorohydrin), alicyclic glycidyl ethers, hydrogenated glycidyl ethers, and mixtures thereof. Such polyhydric phenols include resorcinol, catechol, hydroquinone, and polycyclic phenols such as p-, p-dihydroxydibenzyl, p-, p-dihydroxybiphenyl, p-, p-. Hydroxyphenyl hydrazine, p-, p-dihydroxybenzophenone, 2,2'-dihydroxy-1,1-di-naphthylmethane, and dihydroxydiphenylmethane, dihydroxydiphenyldimethylmethane, Dihydroxydiphenylethylmethylmethane, dimethyldiphenylmethylpropylmethane, dihydroxydiphenylethylphenylmethane, dilightdiphenylpropylphenylmethane, dihydroxydiphenyl 2, butyl phenylmethane, dihydroxydiphenyltolylethane, dilight diphenylmethylphenylmethane, dihydroxydiphenyldicyclohexylmethane and dihydroxydiphenylcyclohexane 2, 2', 2, 3', 2, 4', 3, 3', 3, 4' and 4, 4' isomers. Also useful are polyphenol formaldehyde condensation products and polyglycidyl ethers containing only epoxy groups or hydroxyl groups as reactive groups.

In this embodiment, an epoxy-containing compound having at least one glycidyl ether terminal portion, preferably a saturated or unsaturated ring skeleton, may optionally be added to the above thermal interface material as a reactive diluent. The purpose of adding a reactive diluent is various, for example, to facilitate processing, toughening, and compatibility of materials. For example, the reactive diluent may be diglycidyl ether of cyclohexanedimethanol, diglycidyl ether of resorcinol, p-tert-butylphenyl glycidyl ether, hydroxytolyl glycidyl ether, neopentyl Diglycidyl ether of diol, trimethylolethane triglycidyl ether, triglycidyl ether of trimethylolpropane, triglycidyl p-aminophenol, N, N, diglycidyl aniline, N , N, N', N, tetraglycidyl meta-xylene diamine, vegetable oil polyglycidyl ether, but the invention is not intended to be limited to any of the above examples.

In this embodiment, the insulating thermal interface material of the present invention further comprises a particulate thermoplastic polymer material, wherein the weight percentage of the substrate, the particulate thermoplastic polymer material, the first filler and the second filler are respectively It is 90% to 97%, 1% to 2%, 0.005% to 0.001%, and 0.1% to 1%. Further, the above particulate thermoplastic polymer material preferably comprises a polymer having a glass transition temperature (Tg) of at least 60 ° C, and a weight average molecular weight of more than 7,000, and optionally a free polymethyl methacrylate and a A group consisting of methyl acrylate/methacrylic acid copolymers. Further, the average fineness of the particulate thermoplastic polymer material is preferably from 0.25 to 250 μm.

Furthermore, in this embodiment, the thermal interface material further comprises a curing agent, and the curing agent comprises a dicyandiamide and a derivative thereof or a metal imidazolium compound represented by the formula (IV):

ML _m (IV)

In formula (IV), M is a metal, and optionally free of Ag(I), Cu(I), Cu(II), Cd(II), Zn(II), Hg(II), Ni(II) and Co (II) The group consisting of L, which is a combination of formula (V):

In the formula (V), R ¹ , R ² and R ³ may be selected from the group consisting of a hydrogen atom, an alkyl group and an aryl group, and m is a valence of the metal. Preferably, the metal imidazolium compound is a green imidazolium copper (II). Further, the metal imidazolium compound is contained in the thermal interface material in an amount of preferably from 0.5 to 3% based on the equivalent weight of the curable epoxy resin.

In this embodiment, the thermal interface material further comprises an additive, and the additive may be selected from a free coupling agent, a lubricant, a flow control agent, a thickener, a promoter, a chain extender, a toughener, a dispersant, and a co-curing agent. a group of agents and combinations thereof. Among them, the toughening agent helps to provide the required overlap shear and impact strength, and the thermoplastic material composition is different. The toughening agent is a polymer material capable of reacting with the epoxy resin, and may be a cross-linking agent. United. Preferably, the toughening agent comprises a polymeric compound having a rubber phase and a thermoplastic phase or a compound capable of forming a rubber phase and a thermoplastic phase with the epoxy group-containing material upon curing. Further, the toughening agent may be a shuttle-terminated butadiene-acrylic compound, a shuttle-terminated butadiene-acrylonitrile and a core-shell polymer or a mixture thereof, but the present invention is not intended to limit. Additionally, the flow control agent may preferably include pyrogenic cerium oxide such as treated pyrogenic cerium oxide and untreated pyrogenic cerium oxide.

As for the adhesion promoter, it can be used to enhance the adhesion between the binder and the substrate, and the specific type of the adhesion promoter can be changed depending on the composition of the surface to be bonded. Adhesion promoters which are particularly useful for coating the surface of an ionic lubricant for facilitating the drawing of a metal raw material during processing include, for example, dihydric phenol compounds such as catechol and thiodiglycol.

Further, the coupling agent may be in an amount of 0.001 to 0.05% by weight, and the lubricant may be about 1 to 2%. Wherein, the coupling agent may be selected from the group consisting of a decane coupling agent, a titanate coupling agent or an aluminate coupling agent, and the lubricant may be selected from the group consisting of stearates, stearic acid amines, low molecular weight polymers or paraffins. .

Other additives, such as fillers (such as aluminum powder, carbon black, glass bubbles, talc, clay, calcium carbonate, barium sulfate, titanium dioxide, ceria, citrate, glass beads and mica), flame retardants, antistatic agents , thermally conductive and / or conductive particles and foaming agents (azo dimethyl hydrazine or expandable polymeric microspheres containing hydrocarbon liquids), etc., can be added in the field of application of the thermal interface material, the present invention does not intend to use Limited.

Next, the preparation process of the thermal interface material provided by the present invention will be described as follows. First, one or more epoxy resins are heated and mixed at an elevated temperature of typically about 100-180 ° C to melt the resins. The resin is then cooled to about 90-50 ° C and the remaining epoxy resin, reactive diluent and toughening agent other than the first filler and the second filler are added under high shear mixing. If the composition comprises a first filler and a second filler, it is then added and mixed as granules, typically for up to 1 hour, until the granules are dispersed. Finally the filler is added and mixed to obtain a substantially uniform dispersion. The composition is then cooled to a temperature below the glass transition temperature of the thermoplastic particles, typically from about 50 to 100 ° C, after which a curing agent, adhesion promoter and thermoplastic particles are incorporated into the epoxy composition. At this point, the epoxy composition is generally in a flowable state and can be poured into a suitable storage container for use.

Formula one

First, the molten epoxide is cooled to about 50 ° C, and an additive such as a reactive diluent or a toughening agent is added under high shear mixing. Further, 0.005% of the first filler (nitrogen-containing graphene material) and 0.25% of the second filler (50-200 mm spherical alumina) were added and mixed, and mixed for 1 hour until the particles were dispersed. After the composition is further cooled to a temperature below the glass transition temperature of the thermoplastic particles of about 50 ° C, a curing agent, a adhesion promoter and thermoplastic particles are mixed into the epoxy composition.

Formula 2

The only difference from Formula One is that the ratio of the second filler is changed from 0.005% to 0.5%.

Finally, the thermal conductivity and resistance value of the thermal interface material provided by the present invention are measured as shown in Table 2. The value of the thermal conductivity coefficient refers to a value measured by a laser fire method using a heat resistance test device at 25 ° C:

The larger the value of the above thermal conductivity is, the stronger the ability to disperse and transfer heat. As can be seen from Table 2, the thermal conductivity of the thermal interface material provided by the present invention is much better than that currently available on the market (about 0.03 to 0.2 W/m‧K). In addition, electronic materials usually need to maintain insulation, so as not to make the electronic components current too large and burn out the components. Therefore, we also measure the resistance value of the thermal interface material, and found that the resistance value is also very large enough to reach the electronic components. Generally required insulation.

Meanwhile, please refer to FIGS. 2A to 2C, and FIGS. 2A to 2C are schematic views showing the structure of the insulating thermal interface material 10 of the second embodiment of the present invention. It is worth noting that the first filler 11 and the second filler 12 can flow and at least partially diffuse into the epoxy resin 14 when the curable material is below the curing temperature. Alternatively, the first filler 11 and the second filler 12 are dispersed in the epoxy resin 14 and separated by the epoxy resin 14. Therefore, as shown in the figure, under the combination of the first filler 11 and the second filler 12, the epoxy resin 14 body and the first filler 11 have a similar structure (benzene ring and epoxy group), heat energy. T can transmit phonon, plus good thermal conductivity of the second filler 12 and the first filler 11, resulting in a dual synergistic effect of heat conduction and insulation.

The detailed description of the preferred embodiments of the present invention is intended to be limited to the scope of the invention, and is not intended to limit the scope of the invention. Within the scope of the patent of the present invention.

10. . . Thermal interface material

11. . . First filler

12. . . Second filler

13. . .矽Rubber resin

14. . . Epoxy resin

E. . . electronic

F. . . Elastic energy

T. . . Thermal energy

1A to 1C are views showing the structure of an insulating thermal interface material according to a first embodiment of the present invention;

2A to 2C are views showing the structure of an insulating thermal interface material according to a second embodiment of the present invention.

10. . . Thermal interface material

11. . . First filler

12. . . Second filler

13. . .矽Rubber resin

E. . . electronic

F. . . Elastic energy

T. . . Thermal energy

Claims (17)

An insulating thermal interface material is applicable between an electronic component and a heat dissipating component, and comprises at least: a substrate which is a high molecular polymer; and a first filler and a second filler dispersed in In the substrate, the first filler is a graphene material. The insulating thermal interface material according to claim 1, wherein the first filler is a graphene material having a length or a width to thickness ratio of 50 to 10,000, and the film may be selected from a graphene material and a a nitrogen graphene material, an oxygen-containing graphene, a nitrogen- and oxygen-containing graphene material, a plurality of nitrogen-containing graphene materials superimposed with van der Waals force, a plurality of layers of graphene material superimposed with van der Waals force, A group of oxygen-containing graphene materials superimposed with van der Waals force, a plurality of layers of nitrogen-containing and oxygen-containing graphene materials superposed with van der Waals force, and a combination thereof. The insulating thermal interface material according to claim 1, wherein the second filler is a thermally conductive inorganic powder, and the powder is selected from the group consisting of free powdered aluminum oxide, magnesium oxide, aluminum nitride, boron nitride, and carbonization. A group consisting of tantalum, tin oxide, tantalum nitride, aluminum oxide whiskers, aluminum nitride whiskers, tantalum carbide whiskers, magnesium oxide whiskers, tantalum nitride whiskers, and combinations thereof. The insulating thermal interface material according to claim 1, wherein the substrate is a rubber-based resin comprising at least an organopolysiloxane compound, a curing agent and a adhesion promoter, and the organic The polyoxyalkylene compound, the curing agent, the adhesion promoter, the first filler and the second filler are respectively 90% to 99.55%, 0.1% to 5%, 0.1% to 3%, 0.0025. % to 0.005%, 0.25% to 0.5%. The insulating thermal interface material according to claim 4, wherein the second filler has an average fineness of 20 to 50 μm. The insulating thermal interface material according to claim 4, wherein the organopolyoxyalkylene compound has a polymerization degree of from 200 to 12,000, and the compound thereof comprises a compound represented by the following formula: R ¹ _a In the formula of SiO _(4-a)/2 , R ¹ is a monovalent hydrocarbon group having 1 to 10 carbon atoms, and may be selected from a mono-alkyl group, a cycloalkyl group, an aryl group, and a monovalent hydrocarbon group. An aralkyl group, a group of a halogen-substituted alkyl group and a monoalkenyl group, and a is a positive number of 1.9 to 2.05. The insulating thermal interface material according to claim 4, wherein the curing agent is a hydrazine alkylation reaction curing agent or an organic peroxide. The insulating thermal interface material according to claim 4, wherein the adhesion promoter comprises at least one ruthenium compound having a plurality of substituent groups, and the substituent groups are selected from a free epoxy group. A group consisting of an alkoxy group, a monomethyl group, a monovinyl group and a hydrogenated fluorenyl group. The insulating thermal interface material according to claim 1, wherein the substrate is a curable epoxy resin, and the linear epoxy epoxide having a free epoxy group end group and a skeleton epoxy can be selected. A group consisting of a polymeric epoxide of a group and a polymeric epoxide having pendant epoxy groups. The insulating thermal interface material according to claim 9, further comprising a particulate thermoplastic polymer material, wherein the substrate, the particulate thermoplastic polymer material, the first filler and the second filler The weight percentages are 90% to 97%, 1% to 2%, 0.005% to 0.001%, and 0.1% to 1%, respectively. The insulating thermal interface material of claim 10, wherein the particulate thermoplastic polymer material comprises a polymer having a glass transition temperature of at least 60 °C. The insulating thermal interface material according to claim 10, further comprising a particulate thermoplastic polymer material having a weight average molecular weight of more than 7,000. The insulating thermal interface material according to claim 10, further comprising a particulate thermoplastic polymer material selected from the group consisting of free polymethyl methacrylate and methyl methacrylate/methacrylic acid copolymer. . The insulating thermal interface material according to claim 10, wherein the particulate thermoplastic polymer material has an average fineness of 0.25 to 250 μm. The insulating thermal interface material according to claim 9 further comprising a curing agent, and the curing agent comprises a dicyandiamide and a derivative thereof or a metal imidazolium compound ML _m represented by the following formula M is a metal and can be selected from the group consisting of Ag(I), Cu(I), Cu(II), Cd(II), Zn(II), Hg(II), Ni(II) and Co(II). Group, L is a compound of the formula Wherein R ¹ , R ² and R ³ are selected from the group consisting of a free hydrogen atom, an alkyl group and an aryl group, and m is a valence of the metal. The insulating thermal interface material according to item 1 of the patent application has a thermal conductivity of more than 3 W/m‧K. The insulating thermal interface material as described in claim 1 further comprises an additive which can be selected from a free coupling agent, a lubricant, a flow control agent, a thickener, a promoter, a chain extender, and a toughening agent. A group of agents, dispersants, co-curing agents, and combinations thereof.