CN116230665A - Pin-ribbed radiator and method for assembling same - Google Patents
Pin-ribbed radiator and method for assembling same Download PDFInfo
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- CN116230665A CN116230665A CN202310297361.6A CN202310297361A CN116230665A CN 116230665 A CN116230665 A CN 116230665A CN 202310297361 A CN202310297361 A CN 202310297361A CN 116230665 A CN116230665 A CN 116230665A
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- 238000000034 method Methods 0.000 title claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000004907 flux Effects 0.000 claims description 18
- 230000004044 response Effects 0.000 claims description 17
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention relates to a pin-ribbed radiator and a method for assembling the same, wherein the pin-ribbed radiator is formed by splicing a substrate and a plurality of radiator modules; the base plate is connected to the bottom plate of the part to be radiated; the radiator module comprises a radiating bottom plate and a radiating pin rib group, wherein the radiating pin rib group is vertically connected to the radiating bottom plate, and the radiating bottom plate is connected to the substrate; the heat dissipation pin rib group is a first density pin rib group or a second density pin rib group, and the first density pin rib group comprises at least two first pin ribs; the second density pin rib group comprises at least two second pin ribs, and the length of the second pin ribs is not less than that of the first pin ribs; the number of second pin ribs in each second density pin rib group is greater than the number of first pin ribs in each first density pin rib group. Through above-mentioned technical scheme, can solve the radiator structure singleness among the prior art, influence the problem of radiating effect.
Description
Technical Field
The invention relates to the technical field of server heat dissipation, in particular to a pin-rib type radiator and a method for assembling the same.
Background
With the intensive development of servers, chip sizes have tended to decrease. The reduction in chip size results in an increase in heat flux density per unit area of the chip, with a consequent rise in the risk of high temperatures. In order to avoid the situation that the chip fails due to the high temperature of the chip as much as possible, the radiator is required to be used as a main means for radiating the chip.
In the air-cooled server, the radiator absorbs heat generated by the chip and transfers the heat to the air through convection heat exchange, so the key of enhancing the heat exchange capacity of the radiator is to enhance the convection heat exchange efficiency, and the common means is to increase the heat exchange area of the radiator. However, the limited space size and the weight requirement of the radiator in the hardware design mean that the heat exchange area cannot be infinitely increased, so how to effectively improve the heat exchange efficiency in the limited space is a technical problem to be solved.
The traditional pin rib type radiator is simpler in structural form, the distance and the pin rib diameter are fixed, and the radiating requirement which can be met is obviously limited; if the power consumption of the element is increased, a new radiator is needed; and aiming at the phenomenon that the surface heat flux density of the same element is uneven, the device cannot be flexibly changed, and local hot spots are easy to occur.
Therefore, aiming at the problems that the radiator in the prior art is single in structure and affects the radiating effect, no effective solution exists at present.
Disclosure of Invention
In order to solve at least one of the above technical problems, the present invention provides a pin-ribbed radiator and a method for assembling the same, wherein the pin-ribbed radiator is used for solving the problems of single radiator structure and influence on heat dissipation effect in the prior art.
In order to achieve the above-mentioned purpose, the present invention provides a pin-ribbed radiator, which is formed by splicing a substrate and a plurality of radiator modules; the base plate is connected to the bottom plate of the part to be radiated; the radiator module comprises a radiating bottom plate and a radiating pin rib group, wherein the radiating pin rib group is vertically connected to the radiating bottom plate, and the radiating bottom plate is connected to the substrate; the heat dissipation pin rib group is a first density pin rib group or a second density pin rib group, and the first density pin rib group comprises at least two first pin ribs; the second density pin rib group comprises at least two second pin ribs, and the length of the second pin ribs is not less than that of the first pin ribs; the number of second pin ribs in each second density pin rib group is greater than the number of first pin ribs in each first density pin rib group.
Further, each radiator module is staggered with at least one adjacent radiator module.
Further, each radiator module is aligned with at least two adjacent radiator modules.
Further, a heat conduction silicone grease layer is coated between the heat dissipation negative and the substrate.
Further, a positioning hole is formed in the substrate, a positioning hole column is arranged at the bottom of the heat radiation bottom plate, and the positioning hole column is matched with the positioning hole and used for inserting the radiator module on the substrate.
Further, a first foolproof structure is arranged on the positioning hole column and is used for being matched with a second foolproof structure on the positioning hole to fix and limit the radiator module.
Further, the first pin rib or the second pin rib is inserted into the first surface of the heat dissipation bottom plate, the positioning hole column is inserted into the second surface of the heat dissipation bottom plate, and the second surface and the first surface are parallel to each other.
The invention also provides a method for assembling the pin-ribbed radiator, which comprises the following steps:
determining the power consumption of the component to be cooled;
determining the assembly quantity of the radiator modules according to the area of the bottom plate of the part to be radiated and the area of the radiating fins in the radiator modules;
selecting radiator modules meeting the assembly quantity and having radiating pin rib groups as second density pin rib groups in response to the power consumption of the to-be-radiated component meeting a first preset condition, wherein the first preset condition is that the power consumption of the to-be-radiated component is larger than a power consumption threshold;
in response to the power consumption of the component to be radiated does not meet the first preset condition, selecting the radiator modules with the quantity of radiating pin rib groups meeting the assembly quantity as the radiator modules of the first density pin rib group, or selecting the radiator modules with the quantity of radiating pin rib groups meeting the assembly quantity as the radiator modules of the first density pin rib group and the radiating pin rib groups as the radiator modules of the second density pin rib group;
and assembling all selected radiator modules to form the pin rib type radiator.
Further, in response to the power consumption of the component to be heat-dissipated not meeting the first preset condition, selecting a radiator module with the number of heat dissipation pin rib groups meeting the assembly number as a first density pin rib group, or selecting a radiator module with the number of heat dissipation pin rib groups meeting the assembly number as the first density pin rib group and a radiator module with the heat dissipation pin rib groups as a second density pin rib group, wherein the radiator module specifically comprises:
in response to the power consumption of the part to be radiated does not meet the first preset condition and does not meet the second preset condition, selecting the radiator modules with the quantity of radiating pin rib groups meeting the assembly quantity as a first density pin rib group;
in response to the power consumption of the component to be radiated not meeting the first preset condition and meeting the second preset condition, selecting a radiator module with the radiating pin rib groups meeting the assembled quantity as a first density pin rib group and a radiator module with the radiating pin rib groups as a second density pin rib group;
the second preset condition is that the part to be heat-dissipated has a local high heat flux density area.
Further, in response to the power consumption of the component to be heat-dissipated not meeting the first preset condition and meeting the second preset condition, selecting a heat dissipation module with the heat dissipation pin rib group meeting the assembly number as a first density pin rib group and a heat dissipation module with the heat dissipation pin rib group as a second density pin rib group, the heat dissipation module specifically comprises:
determining the number of radiator modules of which the radiating pin rib groups are second-density pin rib groups according to the area of the local high-heat-flux-density region and the area of the substrate in the radiator modules;
and determining the number of the radiator modules of which the heat dissipation pin rib groups are the first density pin rib groups according to the number of the radiator modules of which the heat dissipation pin rib groups are the second density pin rib groups.
Compared with the prior art, the technical scheme provided by the invention has the following technical effects:
in the invention, the pin rib type radiator is formed by splicing a substrate and a plurality of radiator modules;
the pin rib type radiator is connected to the bottom plate of the part to be radiated through the base plate; the heat radiation pin rib group in the heat radiator module is vertically connected with the heat radiation bottom plate;
the heat dissipation pin rib group can be a first density pin rib group or a second density pin rib group, and the first density pin rib group and the second density pin rib group comprise at least two pin ribs;
wherein the second pin rib length in the second density pin rib set is longer than the first pin rib in the first density pin rib set; meanwhile, compared with the first pin rib number in the first density pin rib group, the second pin rib number in the second density pin rib group is more, namely the density of the second density pin rib group is larger than that of the first density pin rib group;
the novel pin rib radiator formed by the method can adjust pin rib groups with different densities according to different radiating demands, and generate a more personalized radiator structure so as to improve radiating efficiency, increase the multiplexing rate of the radiator and save cost;
namely, the pin rib type radiator can change the radiating area of the radiator by changing the pin rib group on the basis of the same substrate so as to meet different radiating requirements; when the power consumption of the element needing heat dissipation is increased, a pin rib group with larger heat dissipation area can be adopted; or when the heat flux density of the surface of the element to be radiated is not uniform, the high-density pin rib group can be replaced in the high-heat flux density area so as to avoid local hot spots.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a pin fin heat sink according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a heat sink in a staggered arrangement according to an embodiment of the present invention;
FIG. 3 is a schematic view of a heat sink in an aligned arrangement according to an embodiment of the present invention;
FIG. 4 is a schematic view of a substrate according to an embodiment of the invention;
FIG. 5 is a schematic view of a single rib set in accordance with an embodiment of the present invention;
FIG. 6 is a schematic view showing the distribution of locating hole columns on a single rib set according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a fool-proof structure on a positioning hole column according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a fan and CPU in a motherboard region of a server in an actual application scenario of the present invention;
fig. 9 is a schematic structural diagram of a slot of a network card in a rear window area of a server in an actual application scenario of the present invention;
fig. 10 is a schematic structural diagram of a vertical plug network card in a rear window area of a server in an actual application scenario of the present invention.
Description of the specification reference numerals:
1-a base plate, 2-a first density pin rib set (i.e., a low density pin rib set); 3-a second density pin rib set (i.e., a high density pin rib set).
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Embodiment one:
as shown in fig. 1, an embodiment of the present invention provides a pin-ribbed radiator, which is formed by splicing a substrate 1 and a plurality of radiator modules; the base plate 1 is connected to a bottom plate of the component to be cooled; the radiator module comprises a radiating bottom plate and a radiating pin rib group, wherein the radiating pin rib group is vertically connected to the radiating bottom plate, and the radiating bottom plate is connected to the base plate 1; the heat dissipation pin rib group is a first density pin rib group 2 or a second density pin rib group 3, and the first density pin rib group 2 comprises at least two first pin ribs; the second density pin rib group 3 comprises at least two second pin ribs, and the length of the second pin ribs is not less than that of the first pin ribs; the number of second pin ribs in each second density pin rib group 3 is greater than the number of first pin ribs in each first density pin rib group 2.
In a specific embodiment, the pin-ribbed radiator is formed by splicing a substrate 1 and a plurality of radiator modules;
wherein, the pin rib type radiator is connected to the bottom plate of the part to be radiated through the base plate 1; the heat radiation pin rib group in the heat radiator module is vertically connected with the heat radiation bottom plate;
the heat dissipation pin rib group can be a first density pin rib group 2 or a second density pin rib group 3, and the first density pin rib group 2 and the second density pin rib group 3 comprise at least two pin ribs;
wherein the second pin rib length in the second density pin rib set 3 is longer than the first pin rib in the first density pin rib set 2; meanwhile, the number of the second pin ribs in the second density pin rib group 3 is more than the number of the first pin ribs in the first density pin rib group 2, namely, the density of the second density pin rib group 3 is higher than that of the first density pin rib group 2;
the novel pin rib radiator formed by the method can adjust pin rib groups with different densities according to different radiating demands, and generate a more personalized radiator structure so as to improve radiating efficiency, increase the multiplexing rate of the radiator and save cost;
namely, the pin rib type radiator can change the radiating area of the radiator by changing the pin rib group on the basis of the same substrate so as to meet different radiating requirements; when the power consumption of the element needing heat dissipation is increased, a pin rib group with larger heat dissipation area can be adopted; or when the heat flux density of the surface of the element to be radiated is not uniform, the high-density pin rib group 3 can be replaced in the high-heat flux density area so as to avoid local hot spots.
In practical embodiments, as shown in fig. 1, the overall structure of the heat sink includes a substrate 1, a low-density pin rib group 2 (i.e., a first-density pin rib group 2), and/or a high-density pin rib group 3 (i.e., a second-density pin rib group 3).
The base plate 1 is arranged on a base plate with heat dissipation requirement components and is detachably connected with the base plate, and the low-density pin rib group 2 and/or the high-density pin rib group 3 are/is fixed on the base plate 1 through positioning holes.
Preferably, different heights of the different density pin rib sets may be used, for example, the height of the high density pin rib set 3 is not smaller than the height of the low density pin rib set 2.
In a preferred embodiment, each radiator module is staggered with respect to at least one adjacent radiator module.
In a practical embodiment, as shown in fig. 2, a heat sink structure in a staggered arrangement may be formed.
In a preferred embodiment, each radiator module is arranged in alignment with at least two adjacent radiator modules.
As shown in fig. 3, heat sinks arranged in parallel may also be formed.
In a preferred embodiment, a heat conductive silicone grease layer is coated between the heat sink and the substrate 1.
In particular embodiments, a thermally conductive silicone grease may be applied to increase thermal conductivity.
In a preferred embodiment, the base plate 1 is provided with positioning holes, and the bottom of the heat dissipation pin rib group is provided with positioning hole columns which are matched with the positioning holes for plugging the radiator module on the base plate 1.
In a preferred embodiment, the positioning hole column is provided with a first foolproof structure for being matched with a second foolproof structure on the positioning hole to fix and limit the radiator module.
In a practical embodiment, as shown in fig. 4, a positioning hole is formed in the substrate 1.
FIG. 5 is a schematic diagram of a single heat sink module; as shown in fig. 6, the bottom of the individual radiator module is provided with locating hole columns.
Thus, the low-density pin rib set 2 and the high-density pin rib set 3 can be fixed on the base plate 1 through the positioning hole columns and the positioning holes.
As shown in fig. 7, the positioning hole column is preferably further provided with a fixing and fool-proof structure.
In a preferred embodiment, the first pin rib or the second pin rib is inserted into the first surface of the heat dissipation base plate, the positioning hole column is inserted into the second surface of the heat dissipation base plate, and the second surface and the first surface are parallel.
In a practical embodiment, a plurality of heat dissipating units (i.e. heat dissipating modules) can be plugged on the substrate 1, each heat dissipating unit comprises a heat dissipating bottom plate and a positioning hole column; the pin rib is inserted on the radiating bottom plate; the positioning hole column is inserted on the other side of the heat radiation bottom plate opposite to the pin rib and is matched with a hole position (namely a positioning hole) on the base plate 1.
In practice, the more closely the heat dissipation unit bottom sheets inserted on the substrate 1 are in contact with each other, the less the heat dissipation capability is affected.
Further, the heat sink material is preferably aluminum or copper. Namely, when the heat flux density of the partial area of the surface of the heat dissipation element is too high, copper with better heat conduction performance can be used as a heat dissipation material to improve the local heat dissipation capacity and avoid local hot spots.
In addition, the type of the server is not limited, for example, the server is an air-cooled server, and the fan thereof is an axial flow fan.
In summary, the novel air-cooled pin-ribbed radiator provided in the practical embodiment of the present invention specifically includes:
the base plate 1 is arranged on the base plate with the heat dissipation requirement part and is detachably connected with the base plate; the base plate 1 is provided with hole sites (namely positioning holes) which can provide positioning and fixing functions for the heat radiating unit;
a plurality of heat dissipating units (i.e., heat sink modules) that can be plugged onto the substrate 1; each radiating unit comprises a radiating bottom plate and a positioning hole column; the pin rib is inserted on the radiating bottom plate; the positioning hole column is inserted on the other side of the heat radiation bottom plate opposite to the pin rib and matched with the hole phase on the base plate 1;
wherein each pin rib group comprises a plurality of pin ribs; the pin rib groups can be divided into a low-density pin rib group 2 and a high-density pin rib group 3;
the positioning hole columns are matched with the holes on the substrate 1, so that the heat radiation unit can be positioned and fixed; the higher the matching degree of the positioning hole column and the hole position on the substrate 1 is, the smaller the influence of the assembly part on the heat radiation capability is;
the bottom plate of the heat dissipation unit has the same size; the closer the heat radiation unit bottom sheets inserted on the substrate 1 are in contact with each other, the less the heat radiation capability is affected.
Therefore, the pin rib group can be replaced according to the heat dissipation requirement of the components so as to change the structure of the radiator, thereby changing the heat dissipation capacity, increasing the multiplexing rate of the radiator components and realizing the purpose of reducing the cost.
When the power consumption of the heat dissipation part is lower, the low-density pin rib group 2 can be selected for assembly; when the power consumption of the heat dissipation part is higher, the high-density pin rib group 3 can be selected for assembly;
when the whole power consumption of the heat dissipation part is low, but the surface is provided with a local high heat flux density region, the high-density pin rib group 3 can be replaced in the high heat flux density region so as to avoid local hot spots;
i.e. it can be converted into different heat sink structures according to different heat dissipation requirements.
The pin rib type radiator has the following beneficial effects:
compared with the prior art, the radiator has a single structure, and each radiator can only meet rated heat dissipation requirements; when faced with higher power consumption components, new heat sinks need to be developed; the phenomenon of uneven heat flux density on the surface of the heat dissipation part cannot be flexibly dealt with;
the pin rib type radiator capable of being assembled can be assembled into a proper radiator according to actual needs under the condition of using the same substrate so as to meet the heat dissipation requirement, the multiplexing rate of the radiator can be increased, and the cost is reduced;
namely, the radiator can adopt the same parts, and can obtain radiators with various structures through assembly, so as to meet different radiating requirements, increase the multiplexing rate of the radiator and save the cost.
Embodiment two:
the embodiment of the invention also provides a method for assembling the pin-ribbed radiator, which comprises the following steps:
determining the power consumption of a part to be cooled;
determining the assembly quantity of the radiator modules according to the area of the bottom plate of the part to be radiated and the area of the radiating fins in the radiator modules;
responding to the power consumption of the part to be cooled to meet a first preset condition, and selecting radiator modules meeting the requirement that the number of the cooling pin rib groups to be assembled is a second density pin rib group, wherein the first preset condition is that the power consumption of the part to be cooled is larger than a power consumption threshold;
in response to the power consumption of the part to be radiated does not meet a first preset condition, selecting the radiator modules with the quantity of radiation needle rib groups meeting the assembly quantity as the radiator modules of the first density needle rib group, or selecting the radiator modules with the quantity of radiation needle rib groups meeting the assembly quantity as the radiator modules of the first density needle rib group and the radiator modules with the radiation needle rib groups as the radiator modules of the second density needle rib group;
all selected radiator modules are assembled to form the pin-ribbed radiator.
In a practical embodiment, when the power consumption of the heat dissipation component is high, the high-density pin rib group 3 can be selected for assembling to form the assembled pin rib type heat dissipation device. When the power consumption of the heat dissipation part is lower, the low-density pin rib group 2 can be selected for assembling to form the assembled pin rib type heat dissipation device.
When the whole power consumption of the heat dissipation part is not high, but the surface of the heat dissipation part is provided with a local high heat flux density region, the high-density pin rib group 3 can be replaced in the high heat flux density region so as to avoid local hot spots.
That is, it can be changed into different radiator structures according to different heat dissipation requirements, and the same pin rib set can be used on the same radiator, and multiple pin rib sets can also be used.
In a preferred embodiment, in response to the power consumption of the component to be cooled failing to meet the first preset condition, selecting the radiator modules with the number of cooling pin rib groups meeting the assembly number as the first density pin rib group, or selecting the radiator modules with the number of cooling pin rib groups meeting the assembly number as the first density pin rib group and the radiator modules with the cooling pin rib groups as the second density pin rib group, the radiator modules specifically include:
in response to the power consumption of the part to be radiated not meeting the first preset condition and not meeting the second preset condition, selecting the radiator modules with the quantity meeting the assembly quantity and of radiating pin rib groups as the first density pin rib groups;
in response to the power consumption of the part to be radiated not meeting the first preset condition and meeting the second preset condition, selecting a radiator module with the quantity sum meeting the assembly quantity and the radiating pin rib group as a radiator module with the first density pin rib group and a radiator module with the radiating pin rib group as a radiator module with the second density pin rib group;
the second preset condition is that a part to be cooled has a local high heat flux density region.
In a preferred embodiment, in response to the power consumption of the component to be cooled failing to meet the first preset condition and meeting the second preset condition, selecting the radiator module with the total number of cooling pin rib groups meeting the assembled number as the first density pin rib group and the radiator module with the cooling pin rib groups as the second density pin rib group, specifically including:
determining the number of radiator modules with the second density pin rib group as the heat radiation pin rib group according to the area of the local high heat flux density region and the area of the substrate 1 in the radiator modules;
and determining the number of the radiator modules of which the heat dissipation pin rib groups are the first density pin rib groups according to the number of the radiator modules of which the heat dissipation pin rib groups are the second density pin rib groups.
In practical embodiments, when the power consumption of the heat dissipation component is low, the low-density pin rib group 2 can be selected for assembling to form the assembled pin rib type heat dissipation device.
When the whole power consumption of the heat dissipation part is not high, but the surface of the heat dissipation part is provided with a local high heat flux density region, the high-density pin rib group 3 can be replaced in the high heat flux density region so as to avoid local hot spots.
In a practical application scenario, for example, the following are:
example 1:
as shown in fig. 8, in the air-cooled four-way server, a fan is arranged at the front end of the main board; the 4 CPUs are identical in model, and the same radiator substrate can be used, but the requirements for the radiator are different due to different positions on the main board.
The 4 CPUs are arranged according to the front and rear 2 multiplied by 2 and are divided into front-row CPUs and rear-row CPUs.
The 2 types of CPUs (i.e. front-row CPUs) close to the fan are higher in air flow rate and larger in air quantity, and have lower heat dissipation requirements on the radiator; considering the air quantity of a CPU far away from the fan, a radiator assembled by a low-density pin rib group can be adopted;
the 2 CPUs (i.e. rear-row CPUs) far away from the fan have the advantages of reduced air flow rate and reduced air quantity, and have high heat dissipation requirements on the heat radiator, and the heat radiator assembled by the high-density pin rib groups can be adopted.
Example 2:
as shown in fig. 9, an upper, a middle and a lower network card slots are arranged in the rear window area of the server, and the temperature, the flow rate and the air quantity of air passing through each slot are different; generally, the heat dissipation effect of the lower slot is smaller than that of the middle slot, and the heat dissipation effect of the middle slot is smaller than that of the upper slot, so that the card inserting positions of different network cards are limited;
in order to ensure that the same network card is applicable to any slot, the radiator assembled by the high-density pin rib group can be matched at the position of the network card at the lower slot position, and the radiator assembled by the low-density pin rib group can be matched at the position of the network card at the upper slot position.
Example 3:
as shown in fig. 10, a plurality of vertical plug network cards are arranged in a rear window area of the server; meanwhile, the radiator assembled by the high-density pin rib group can be matched at the network card position with high heat dissipation requirement, and the radiator assembled by the low-density pin rib group can be matched at the network card position with low heat dissipation requirement, so that the limitation of different heat dissipation effects at different card inserting positions on the performance of the network card can be reduced.
It should be noted that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (10)
1. The pin rib type radiator is characterized by being formed by splicing a substrate and a plurality of radiator modules; the base plate is connected to the bottom plate of the part to be radiated; the radiator module comprises a radiating bottom plate and a radiating pin rib group, wherein the radiating pin rib group is vertically connected to the radiating bottom plate, and the radiating bottom plate is connected to the substrate; the heat dissipation pin rib group is a first density pin rib group or a second density pin rib group, and the first density pin rib group comprises at least two first pin ribs; the second density pin rib group comprises at least two second pin ribs, and the length of the second pin ribs is not less than that of the first pin ribs; the number of second pin ribs in each second density pin rib group is greater than the number of first pin ribs in each first density pin rib group.
2. The pin-ribbed radiator of claim 1, wherein each radiator module is staggered from at least one adjacent radiator module.
3. The pin-ribbed heat sink of claim 2 wherein each heat sink module is aligned with at least two adjacent heat sink modules.
4. The pin fin heat sink of claim 1 or 2, wherein a thermally conductive silicone grease layer is coated between the heat sink base sheet and the substrate.
5. The pin fin type radiator according to claim 1, wherein a positioning hole is formed in the base plate, a positioning hole column is formed in the bottom of the heat dissipation bottom plate, and the positioning hole column is matched with the positioning hole and used for inserting the radiator module on the base plate.
6. The pin fin type heat sink of claim 5, wherein the positioning hole column is provided with a first foolproof structure for being matched with a second foolproof structure on the positioning hole to fix and limit the heat sink module.
7. The pin fin type heat sink of claim 5, wherein the first pin fin or the second pin fin is inserted into a first surface of the heat sink sheet, the positioning hole posts are inserted into a second surface of the heat sink sheet, and the second surface is parallel to the first surface.
8. A method for assembling a pin fin heat sink as claimed in any one of claims 1 to 7, comprising:
determining the power consumption of the component to be cooled;
determining the assembly quantity of the radiator modules according to the area of the bottom plate of the part to be radiated and the area of the radiating fins in the radiator modules;
selecting radiator modules meeting the assembly quantity and having radiating pin rib groups as second density pin rib groups in response to the power consumption of the to-be-radiated component meeting a first preset condition, wherein the first preset condition is that the power consumption of the to-be-radiated component is larger than a power consumption threshold;
in response to the power consumption of the component to be radiated does not meet the first preset condition, selecting the radiator modules with the quantity of radiating pin rib groups meeting the assembly quantity as the radiator modules of the first density pin rib group, or selecting the radiator modules with the quantity of radiating pin rib groups meeting the assembly quantity as the radiator modules of the first density pin rib group and the radiating pin rib groups as the radiator modules of the second density pin rib group;
and assembling all selected radiator modules to form the pin rib type radiator.
9. The method of claim 8, wherein in response to the power consumption of the component to be cooled failing to meet the first preset condition, selecting a number of radiator modules meeting the number of spliced radiating pin rib sets as a first density pin rib set, or selecting a total number of radiator modules meeting the number of spliced radiating pin rib sets as a first density pin rib set and a total number of radiator modules meeting the number of spliced radiating pin rib sets as a second density pin rib set, specifically comprising:
in response to the power consumption of the part to be radiated does not meet the first preset condition and does not meet the second preset condition, selecting the radiator modules with the quantity of radiating pin rib groups meeting the assembly quantity as a first density pin rib group;
in response to the power consumption of the component to be radiated not meeting the first preset condition and meeting the second preset condition, selecting a radiator module with the radiating pin rib groups meeting the assembled quantity as a first density pin rib group and a radiator module with the radiating pin rib groups as a second density pin rib group;
the second preset condition is that the part to be heat-dissipated has a local high heat flux density area.
10. The method of claim 9, wherein selecting the radiator module with the total number of radiating pin rib groups satisfying the assembled number as the first density pin rib group and the radiator module with the radiating pin rib groups as the second density pin rib group in response to the power consumption of the component to be radiated not satisfying the first preset condition and satisfying the second preset condition, specifically comprises:
determining the number of radiator modules of which the radiating pin rib groups are second-density pin rib groups according to the area of the local high-heat-flux-density region and the area of the substrate in the radiator modules;
and determining the number of the radiator modules of which the heat dissipation pin rib groups are the first density pin rib groups according to the number of the radiator modules of which the heat dissipation pin rib groups are the second density pin rib groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310297361.6A CN116230665A (en) | 2023-03-24 | 2023-03-24 | Pin-ribbed radiator and method for assembling same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310297361.6A CN116230665A (en) | 2023-03-24 | 2023-03-24 | Pin-ribbed radiator and method for assembling same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116230665A true CN116230665A (en) | 2023-06-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310297361.6A Pending CN116230665A (en) | 2023-03-24 | 2023-03-24 | Pin-ribbed radiator and method for assembling same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116230665A (en) |
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2023
- 2023-03-24 CN CN202310297361.6A patent/CN116230665A/en active Pending
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