CN116218463B - Organic silicon pouring sealant for electronic components and electronic components - Google Patents
Organic silicon pouring sealant for electronic components and electronic components Download PDFInfo
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- CN116218463B CN116218463B CN202310498585.3A CN202310498585A CN116218463B CN 116218463 B CN116218463 B CN 116218463B CN 202310498585 A CN202310498585 A CN 202310498585A CN 116218463 B CN116218463 B CN 116218463B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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Abstract
The application discloses an organic silicon pouring sealant for electronic components and the electronic components, and relates to the field of packaging materials. The organic silicon pouring sealant comprises a low-dielectric-constant inorganic filler and a heat-conducting inorganic filler, wherein the dielectric constant of the low-dielectric-constant inorganic filler is less than or equal to 4 at 1MHz, and the dielectric constant of the heat-conducting inorganic filler is more than or equal to 5.5 at 1 MHz. According to the application, through reasonable selection and collocation on the filler of the organic silicon pouring sealant, the low dielectric constant inorganic filler with the dielectric constant less than or equal to 4 at 1MHz and the heat conduction inorganic filler with the dielectric constant less than or equal to 5.5 at 1MHz are used together, so that the cost is effectively controlled, the performance requirement can be met, and the obtained organic silicon pouring sealant has the advantages of low cost, high heat conduction and low dielectric constant.
Description
Technical Field
The application relates to the field of packaging materials, in particular to an organic silicon pouring sealant for electronic components and the electronic components.
Background
Along with the continuous development of the scientific and technical level, the electronic and electrical technology is widely applied in various fields of aerospace, military industry, communication, semiconductors, automobiles and the like, and is mainly embodied in aspects of intellectualization, networking, high efficiency, integration and the like. In the fields referred to above, some electronic devices are used in many cases as base units of field products, for example: inductors, transformers, inverters, on-board OBCs (i.e., on-board chargers), electronic chips, integrated circuits, and the like. These electronic devices often operate with the generation of heat and the transmission of electrical signals. And as the usage of these electronic devices increases, the heating value of the whole electric appliance increases. In addition, some interference between these electronic components may occur, especially when transmitting some electrical signals. As the mounting distance between them is closer, there are many other negative effects, such as: electric field shielding effects, interference of transmission signals, resistance capacitance delay, and other increases in power consumption, etc. These drawbacks are even more serious, especially in some electronic modules with a relatively high degree of integration.
Disclosure of Invention
The application mainly aims to provide an organosilicon pouring sealant for electronic components and the electronic components, and aims to provide the organosilicon pouring sealant with high heat conduction and low dielectric constant, so that the electronic components are helped to reduce heat and signal interference.
In a first aspect, the application provides an organic silicon pouring sealant for electronic components, which comprises a low dielectric constant inorganic filler and a heat conduction inorganic filler, wherein the dielectric constant of the low dielectric constant inorganic filler is less than or equal to 4 at 1MHz, and the dielectric constant of the heat conduction inorganic filler is more than or equal to 5.5 at 1 MHz.
According to the technical scheme, the low-dielectric-constant inorganic filler with the dielectric constant less than or equal to 4 at 1MHz and the heat-conducting inorganic filler with the dielectric constant less than or equal to 5.5 at 1MHz are matched for use through reasonable selection and matching on the filler of the organic silicon pouring sealant, so that the cost is effectively controlled, the performance requirement can be met, and the obtained organic silicon pouring sealant has the advantages of low cost, high heat conduction and low dielectric constant, the heat conductivity is 2-3W/(m.K), the dielectric constant is less than or equal to 3 (100 Hz), and the dielectric strength is more than or equal to 15KV/mm.
In some embodiments, the silicone potting adhesive has a dielectric constant of ∈3 at 100 Hz. Therefore, the organic silicon pouring sealant can be used in electronic components to better reduce signal interference.
In some embodiments, the silicone potting adhesive has a viscosity of 4000-800 mpa-s at 25 ℃. Therefore, the organic silicon pouring sealant has better processability and is easy to package electronic components.
In some embodiments, the low dielectric constant inorganic filler comprises at least one of hexagonal boron nitride, spherical boron nitride, fluorine doped modified silica, silicon carbide. At least one of the substances is selected as the low-dielectric-constant inorganic filler, so that the low-dielectric-constant inorganic filler has the characteristics of low cost and low dielectric constant, and is beneficial to reducing the cost of the organic silicon pouring sealant and improving the dielectric property.
In some embodiments, the thermally conductive inorganic filler comprises at least one of silica, aluminum hydroxide, silica fume, magnesium oxide, aluminum oxide, zinc oxide, white carbon. At least one of the substances is selected as the heat conducting inorganic filler, so that the heat conducting inorganic filler has the characteristics of low cost and good heat conductivity, and is beneficial to guaranteeing the heat conductivity of the organic silicon pouring sealant and reducing the cost.
In some embodiments, the silicone potting adhesive comprises:
the component A comprises, by weight, 20-60 parts of vinyl-terminated polydimethylsiloxane, 10-50 parts of a cross-linking agent, 30-60 parts of a heat conducting inorganic filler, 20-30 parts of a low dielectric constant inorganic filler, 0.01-0.05 part of an inhibitor and 10-40 parts of vinyl MQ resin; the method comprises the steps of,
the component B comprises, by weight, 20-60 parts of vinyl-terminated polydimethylsiloxane, 0.1-1 part of a catalyst, 30-60 parts of a heat conducting inorganic filler, 20-30 parts of a low dielectric constant inorganic filler and 10-40 parts of vinyl MQ resin.
The prepared organic silicon potting adhesive is moderate in viscosity through the proportion regulation and control of the raw materials, is easy to process and pot in the later period, and has low cost, high thermal conductivity and good dielectric property; meanwhile, the heat-conducting inorganic filler and the low-dielectric-constant inorganic filler are added into the component A and the component B of the organic silicon pouring sealant at the same time, so that uniform dispersion of the filler in the sizing material is facilitated, and the production difficulty of the organic silicon pouring sealant is reduced.
In some embodiments, the vinyl-terminated polydimethylsiloxane has a viscosity of 200 to 800 mpa-s at 25 ℃. And (3) selecting vinyl-terminated polydimethylsiloxane with the viscosity within the range of 200-800 mPa.s as a main raw material in the component A and the component B, so that the viscosity and the fluidity of the materials can be regulated and controlled, the processing difficulty and the later potting difficulty can be reduced, and the dispersion uniformity of the filler can be improved.
In some embodiments, the crosslinking agent comprises at least one of a terminal hydrogen-based polymethylsiloxane, a pendant hydrogen-based polymethylsiloxane. At least one of the substances is selected as the cross-linking agent, which is beneficial to regulating and controlling the curing and forming time of the organic silicon pouring sealant.
In some embodiments, the viscosity of the crosslinker is 100 to 500 mpa-s at 25 ℃. The viscosity of the cross-linking agent is optimized, so that the viscosity of the material can be regulated and controlled, and the processability of the organosilicon pouring sealant can be ensured.
In some embodiments, the cross-linking agent has a silicon to hydrogen ratio of 1.2 to 1.5. The cross-linking structure and the cross-linking degree of the siloxane can be regulated and controlled by optimizing the silicon-oxygen ratio of the cross-linking agent, so that the mechanical properties and the like of the cured organosilicon pouring sealant can be ensured.
In some embodiments, the vinyl MQ resin has a viscosity of 300 to 500 mpa-s at 25 ℃. Vinyl MQ resin with the viscosity in the range of 300-500 mPa.s is selected as a reinforcing agent with a cross-linked structure, so that the mechanical property of the cured pouring sealant can be obviously improved.
In some embodiments, the inhibitor comprises at least one of a sulfur-containing compound, a nitrogen-containing compound, a phosphorus-containing compound, an alkynol compound. Any one of the substances is selected as an inhibitor added into the component A, so that the reaction between siloxane and a cross-linking agent can be effectively inhibited, and the problem that the use time limit of the organosilicon pouring sealant is limited due to the fact that the siloxane is cross-linked and solidified in advance is avoided.
In some embodiments, the inhibitor comprises an alkynol compound. The alkynol compound is selected as the inhibitor, so that the inhibition effect on the reaction between siloxane and the cross-linking agent is better.
In some embodiments, the inhibitor comprises at least one of ethynyl cyclohexanol, methylbutynol, 3,7, 11-trimethyldodecyn-3-ol, maleate, fumarate. At least one of the above substances is selected as the inhibitor, and the inhibition effect on the reaction between the siloxane and the crosslinking agent is better.
In some embodiments, the catalyst comprises at least one of a perkin catalyst, chloroplatinic acid. At least one of the substances is selected as the catalyst, and after the catalyst is contacted with the siloxane and the cross-linking agent, the cross-linking reaction of the siloxane and the cross-linking agent can be effectively catalyzed, so that the curing and forming of the organosilicon pouring sealant are realized, and the catalytic effect is good.
In some embodiments, the silicone potting adhesive further comprises a color paste. By adding the color paste, the organic silicon pouring sealant can be endowed with certain color, so that different use requirements can be met, and the market competitiveness of the organic silicon pouring sealant is improved.
In some embodiments, the color paste is added into the component A, and the addition amount of the color paste is 1-2 parts. The color paste is added into the component A, so that the color paste is easier to fully mix with other raw materials.
In some embodiments, the color paste comprises a black paste comprising carbon powder, the carbon powder comprising insulating carbon black. The black paste containing the insulating carbon black is selected, so that the cost is reduced, and the insulativity of the organic silicon pouring sealant can be guaranteed.
In some embodiments, the weight ratio of the component A to the component B is (0.9-1.1): 1. The weight ratio of the A component to the B component is controlled within the range of (0.9-1.1): 1, so that the mixing proportion of the A component and the B component is controlled, and the mixing proportion of each raw material in the A component and the B component is conveniently regulated and controlled, so that the cross-linking reaction of siloxane and the cross-linking agent is controlled to be cured in a certain time.
In some embodiments, the weight ratio of the a-component to the B-component is 1:1. The weight ratio of the component A to the component B is strictly controlled to be 1:1, so that the mixing proportion of the component A and the component B can be regulated and controlled conveniently, and the crosslinking curing time of the organosilicon pouring sealant can be regulated and controlled.
In a second aspect, the present application provides an electronic component, where the electronic component includes the silicone potting adhesive described in the foregoing embodiment. For example, the organic silicon pouring sealant provided by the embodiment of the application can be used for pouring and sealing electronic components, so that the problems of electric field shielding effect, transmission signal interference, resistance-capacitance delay, energy consumption increase and the like of the electronic components can be effectively reduced.
In some embodiments, the electronic component comprises an inductor, a transformer, an inverter, an on-board charger, an electronic chip, or an integrated circuit. The organic silicon pouring sealant provided by the embodiment of the application can be suitable for inductors, transformers, inverters, vehicle-mounted chargers, electronic chips or integrated circuits, has the characteristics of low cost, high heat conduction and low dielectric constant, and can effectively reduce the problems of electric field shielding effect, transmission signal interference, resistance-capacitance delay, energy consumption increase and the like of electronic components.
Detailed Description
The following detailed description specifically discloses embodiments of the silicone potting adhesive for electronic components and the electronic components of the present application. However, unnecessary detailed description may be omitted. For example, detailed descriptions of well-known matters and repeated descriptions of the actual same structure may be omitted. This is to avoid that the following description becomes unnecessarily lengthy, facilitating the understanding of those skilled in the art.
The "range" disclosed herein is defined in terms of lower and upper limits, with the given range being defined by the selection of a lower and an upper limit, the selected lower and upper limits defining the boundaries of the particular range. Ranges that are defined in this way can be inclusive or exclusive of the endpoints, and any combination can be made, i.e., any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60-120 and 80-110 are listed for a particular parameter, it is understood that ranges of 60-110 and 80-120 are also contemplated. Furthermore, if the minimum range values 1 and 2 are listed, and if the maximum range values 3,4 and 5 are listed, the following ranges are all contemplated: 1-3, 1-4, 1-5, 2-3, 2-4 and 2-5. In the present application, unless otherwise indicated, the numerical range "a-b" represents a shorthand representation of any combination of real numbers between a and b, where a and b are both real numbers. For example, the numerical range "0-5" indicates that all real numbers between "0-5" have been listed throughout, and "0-5" is a shorthand representation of only a combination of these values. When a certain parameter is expressed as an integer of 2 or more, it is disclosed that the parameter is, for example, an integer of 2, 3,4, 5, 6, 7, 8, 9, 10, 11, 12 or the like.
All embodiments of the application and alternative embodiments may be combined with each other to form new solutions, unless otherwise specified.
All technical features and optional technical features of the application may be combined with each other to form new technical solutions, unless specified otherwise.
All the steps of the present application may be performed sequentially or randomly, preferably sequentially, unless otherwise specified. For example, the method comprises steps (a) and (b), meaning that the method may comprise steps (a) and (b) performed sequentially, or may comprise steps (b) and (a) performed sequentially. For example, the method may further include step (c), which means that step (c) may be added to the method in any order, for example, the method may include steps (a), (b) and (c), may include steps (a), (c) and (b), may include steps (c), (a) and (b), and the like.
The terms "comprising" and "including" as used herein mean open ended or closed ended, unless otherwise noted. For example, the terms "comprising" and "comprises" may mean that other components not listed may be included or included, or that only listed components may be included or included.
The term "or" is inclusive in this application, unless otherwise specified. For example, the phrase "a or B" means "a, B, or both a and B. More specifically, either of the following conditions satisfies the condition "a or B": a is true (or present) and B is false (or absent); a is false (or absent) and B is true (or present); or both A and B are true (or present).
Along with the continuous development of the scientific and technical level, the electronic and electrical technology is widely applied in various fields of aerospace, military industry, communication, semiconductors, automobiles and the like, and is mainly embodied in aspects of intellectualization, networking, high efficiency, integration and the like. In the fields referred to above, some electronic devices are used in many cases as base units of field products, for example: inductors, transformers, inverters, on-board OBCs (i.e., on-board chargers), electronic chips, integrated circuits, and the like. These electronic devices often operate with the generation of heat and the transmission of electrical signals. And as the usage of these electronic devices increases, the heating value of the whole electric appliance increases. In addition, some interference between these electronic components may occur, especially when transmitting some electrical signals. As the mounting distance between them is closer, there are many other negative effects, such as: electric field shielding effects, interference of transmission signals, resistance capacitance delay, and other increases in power consumption, etc. These drawbacks are even more serious, especially in some electronic modules with a relatively high degree of integration.
The organic silicon pouring sealant is in a liquid state before use, can be used for pouring the electronic device, and is mainly concentrated in several aspects: insulation, buffering, thermal conductivity, dielectric properties, etc. The heat conductivity coefficient of the conventional product is 1-1.5W/(m.K), the dielectric constant is 4-6 (GHz or MHz), but the conventional product is difficult to completely meet the requirements in the technical field of electronic engineering, especially in the condition of low frequency (Hz). If too much filler with high thermal conductivity is added to improve the thermal conductivity, the viscosity is too high, which is unfavorable for filling and sealing; if too much filler of low dielectric constant is used in order to lower the dielectric constant, the cost is increased, and if filler of hollow structure is used, the dielectric constant is lowered, but at the same time, the heat conductive property is greatly affected. Therefore, how to meet the requirement of low dielectric while meeting the requirement of high heat conduction becomes a breakthrough in the technology.
Based on the problems, the inventor conducts intensive research on the components of the organic silicon pouring sealant, and particularly designs the organic silicon pouring sealant aiming at the filler in the organic silicon pouring sealant to obtain the organic silicon pouring sealant with low cost, high heat conduction and low dielectric constant. Specifically, the application provides an organic silicon pouring sealant for electronic components, which comprises a low-dielectric-constant inorganic filler and a heat-conducting inorganic filler, wherein the dielectric constant of the low-dielectric-constant inorganic filler is less than or equal to 4 at 1MHz, and the dielectric constant of the heat-conducting inorganic filler is more than or equal to 5.5 at 1 MHz. In the present application, the "dielectric constant" is also called permittivity or relative permittivity, and represents an important data representing the electrical properties of a dielectric or insulating material, and is often denoted by epsilon. It refers to the ratio of capacitance in the same capacitor with the same substance as dielectric and vacuum, and indicates the relative ability of the dielectric to store electrostatic energy in an electric field (test methods can be referred to ASTM D150).
According to the technical scheme, the low-dielectric-constant inorganic filler with the dielectric constant less than or equal to 4 at 1MHz and the common heat-conducting inorganic filler with the dielectric constant more than or equal to 5.5 at 1MHz are matched for use through reasonable selection and matching on the filler of the organic silicon pouring sealant, so that the cost is effectively controlled, the performance requirement can be met, and the obtained organic silicon pouring sealant has the advantages of low cost, high heat conduction and low dielectric constant, the heat conductivity is 2-3W/(m.K), the dielectric constant is less than or equal to 3 (under 100 Hz), and the dielectric strength is more than or equal to 15KV/mm; in addition, the flame retardant property of the organic silicon pouring sealant provided by the embodiment of the application can reach V0 level, and the organic silicon pouring sealant also has excellent temperature impact resistance, and the temperature impact resistance range can reach-50-150 ℃.
In some embodiments of the application, the silicone potting adhesive has a dielectric constant of 3 or less at 100 Hz. Therefore, the organic silicon pouring sealant can better play a role in reducing signal interference when used in electronic components.
In some embodiments of the present application, the silicone potting adhesive has a viscosity of 4000 to 800mpa·s at 25 ℃, specifically, for example, 4000mpa·s, 4500mpa·s, 5000mpa·s, 5500mpa·s, 6000mpa·s, 6500mpa·s, 7000mpa·s, 7500mpa·s, 8000mpa·s, and the like. Therefore, the organic silicon pouring sealant has better processability and is easier to use for packaging electronic components. The "viscosity" as used herein refers to the resistance of the fluid to flow (reference to GB/T2794).
In some embodiments of the present application, the low dielectric constant inorganic filler comprises at least one of hexagonal boron nitride (dielectric constant 3.8 at 1 MHz), spherical boron nitride (dielectric constant 3.8 at 1 MHz), fluorine doped modified silica (dielectric constant 3.5 at 1 MHz), silicon carbide (dielectric constant 3.6 at 1 MHz), either of the above, or a combination of any two or more thereof. At least one of the substances is selected as the low-dielectric-constant inorganic filler, so that the low-dielectric-constant inorganic filler has the characteristics of low cost, good thermal conductivity and low dielectric constant, compared with the single use of boron nitride ceramic as the filler, the cost of the organic silicon pouring sealant can be reduced, the large-scale mass production and use of the organic silicon pouring sealant are facilitated, and compared with the use of porous materials or materials with larger pore density (such as hollow glass microspheres, microporous magnesia, microporous silica micropowder, graphene powder, microporous ceramic powder and the like) as the filler, the organic silicon pouring sealant can have both dielectric property and thermal conductivity, so that the organic silicon pouring sealant has high thermal conductivity and low dielectric constant, and the dielectric property is improved.
In some embodiments of the present application, the thermally conductive inorganic filler comprises at least one of silica (dielectric constant at 1MHz of 4.6), aluminum hydroxide (dielectric constant at 1MHz of 9.86), fine silica powder (dielectric constant at 1MHz of 5.51), magnesium oxide (dielectric constant at 1MHz of 9.65), aluminum oxide (dielectric constant at 1MHz of 9.34), zinc oxide (dielectric constant at 1MHz of 9.77), white carbon black (dielectric constant at 1MHz of 10.0), either of the above, or a combination of any two or more thereof. At least one of the substances is selected as the heat-conducting inorganic filler, so that the heat-conducting inorganic filler has the characteristics of low cost and good heat conductivity, and is beneficial to guaranteeing the heat conductivity of the organic silicon pouring sealant and reducing the cost.
In some embodiments of the present application, the silicone potting adhesive is a two-component product, including a component a and a component B, wherein the filler may be added to the component a or the component B separately, or may be added to the component a and the component B simultaneously, and when the filler is added to the component a and the component B simultaneously, the specific distribution of the filler in the component a and the component B is not limited, and the low dielectric constant inorganic filler may be added to the component a, the thermally conductive inorganic filler is added to the component B, or both the fillers may be added to the component a and the component B simultaneously. More specifically, in some embodiments of the present application, the filler is added to the component a and the component B simultaneously, wherein the component a comprises, by weight, 20 to 60 parts of vinyl-terminated polydimethylsiloxane, 10 to 50 parts of a cross-linking agent, 30 to 60 parts of a thermally conductive inorganic filler, 20 to 30 parts of a low dielectric constant inorganic filler, 0.01 to 0.05 part of an inhibitor, and 10 to 40 parts of a vinyl MQ resin; the component B comprises, by weight, 20-60 parts of vinyl-terminated polydimethylsiloxane, 0.1-1 part of a catalyst, 30-60 parts of a heat conducting inorganic filler, 20-30 parts of a low dielectric constant inorganic filler and 10-40 parts of vinyl MQ resin.
The prepared organic silicon potting adhesive is moderate in viscosity through the proportion regulation and control of the raw materials, is easy to process and pot in the later period, and has low cost, high thermal conductivity and good dielectric property; meanwhile, the heat-conducting inorganic filler and the low-dielectric-constant inorganic filler are simultaneously added into the A component and the B component of the organic silicon pouring sealant, so that the uniform dispersion of the filler in the sizing material is more facilitated compared with the mode that the filler is independently added into the A component or the B component, and the production difficulty of the organic silicon pouring sealant is reduced. In addition, when the thermally conductive inorganic filler and the low dielectric constant inorganic filler are added to the a-component and the B-component at the same time, the filler substances added to the a-component and the B-component may be the same or different, and for example, when the thermally conductive inorganic filler includes alumina and strong alumina, the following modes may be used: (1) Alumina is added into the A component, and aluminum hydroxide is added into the B component; (2) Alumina is added into the component B, and aluminum hydroxide is added into the component A; (3) Both alumina and aluminum hydroxide are added to both the a and B components simultaneously. The addition of the low dielectric constant inorganic filler is analogically performed, and a detailed description is omitted. In the subsequent embodiment of the application, the composition and the preparation method of the organic silicon pouring sealant are described in detail by taking a third adding mode as an example.
In some embodiments of the present application, the vinyl-terminated polydimethylsiloxane has a viscosity of 200 to 800 mPa-s at 25 ℃, and specifically may be, for example, 200 mPa-s, 300 mPa-s, 400 mPa-s, 500 mPa-s, 600 mPa-s, 700 mPa-s, 800 mPa-s, and the like. And (3) selecting vinyl-terminated polydimethylsiloxane with the viscosity within the range of 200-800 mPa.s as a silane raw material in the component A and the component B, so that the viscosity and the fluidity of the materials can be regulated and controlled, the processing difficulty and the later potting difficulty can be reduced, and the dispersion uniformity of the filler can be improved.
In some embodiments of the application, the cross-linking agent comprises at least one of a terminal hydrogen-based polymethylsiloxane, a pendant hydrogen-based polymethylsiloxane, either of the foregoing, or a combination of both. At least one of the substances is selected as a cross-linking agent, which is beneficial to regulating and controlling the curing and forming time of the organic silicon pouring sealant.
In some embodiments of the present application, the viscosity of the crosslinking agent at 25 ℃ is 100 to 500 mPa-s, and specifically may be, for example, 100 mPa-s, 150 mPa-s, 200 mPa-s, 250 mPa-s, 300 mPa-s, 350 mPa-s, 400 mPa-s, 450 mPa-s, 500 mPa-s, and the like. The viscosity of the cross-linking agent is optimized, so that the viscosity of the material can be regulated and controlled, the processability of the organic silicon pouring sealant can be guaranteed, and the electronic components can be packaged easily.
In some embodiments of the present application, the silicon to hydrogen ratio of the crosslinking agent is 1.2 to 1.5, and the "silicon to hydrogen ratio" as used herein refers to the atomic ratio of silicon element and hydrogen element in the crosslinking agent, and in some embodiments, may be, for example, 1.2, 1.3, 1.4, 1.5, etc. The cross-linking structure and the cross-linking degree of the siloxane can be regulated and controlled by optimizing the silicon-oxygen ratio of the cross-linking agent, so that the mechanical property of the cured organosilicon pouring sealant can be ensured.
In some embodiments, the vinyl MQ resin has a viscosity of 300-500 mPa-s at 25 ℃, specifically, for example, 300 mPa-s, 350 mPa-s, 400 mPa-s, 450 mPa-s, 500 mPa-s, and the like. The vinyl MQ resin with the viscosity in the range of 300-500 mPa.s is selected as a reinforcing agent with a cross-linked structure, so that the mechanical property of the cured pouring sealant can be remarkably improved, and meanwhile, the sufficient mixing of the vinyl MQ resin and other raw materials is facilitated, and the processing efficiency of the organosilicon pouring sealant is improved.
In some embodiments of the application, the inhibitor comprises at least one of a sulfur-containing compound (e.g., a silicone sulfoxide), a nitrogen-containing compound (e.g., an aminosilicone), a phosphorus-containing compound (e.g., triphenylphosphine), an alkynol compound, either any of the foregoing, or a combination of any two or more thereof. Any one of the substances is selected as an inhibitor added into the component A, so that the reaction between siloxane and a cross-linking agent can be effectively inhibited, and the problem that the use time limit of the organosilicon pouring sealant is limited due to the fact that the siloxane is cross-linked and solidified in advance is avoided.
Further, in some embodiments of the application, the inhibitor comprises an alkynol compound. The alkynol compound is selected as the inhibitor, so that the inhibition effect on the reaction between the siloxane and the cross-linking agent is better.
Still further, in some embodiments of the present application, the inhibitor comprises at least one of ethynyl cyclohexanol, methylbutyn alcohol, 3,7, 11-trimethyldodecyn-3-ol, maleate, fumarate, either any of the above, or a combination of any two or more thereof. At least one of the alkynol compounds is selected as an inhibitor, so that the inhibition effect on the reaction between siloxane and the cross-linking agent is better.
In some embodiments of the application, the catalyst comprises at least one of a perkin catalyst and chloroplatinic acid, either or a combination of both. At least one of the substances is selected as a catalyst, and after the catalyst is contacted with siloxane and a cross-linking agent, the cross-linking reaction of the siloxane and the cross-linking agent can be effectively catalyzed, so that the curing and forming of the organosilicon pouring sealant are realized, and the catalytic effect is good.
In some embodiments of the application, the silicone potting adhesive further comprises a color paste. Through the addition of color paste, the organic silicon pouring sealant can be endowed with certain color, so that different use requirements can be met, and the market competitiveness of the organic silicon pouring sealant is improved.
When the organic silicon pouring sealant is further added with color paste, the color paste can be added into the A component or the B component independently or can be added into the A component and the B component simultaneously. Specifically, in some embodiments of the present application, color paste is added to the component a, and the addition amount of the color paste is 1 to 2 parts by weight. The color paste is added into the component A, so that the color paste is easier to fully mix with other raw materials.
Further, in some embodiments of the present application, the color paste comprises a black paste comprising carbon powder, the carbon powder comprising insulating carbon black. The black paste containing the insulating carbon black is selected, so that the cost is reduced, and the insulativity of the organic silicon pouring sealant can be guaranteed.
When the organosilicon pouring sealant is used, the electronic product can be encapsulated only by fully and uniformly mixing the component A and the component B, and the electronic product can also be subjected to vacuum defoaming treatment after being mixed so as to improve the apparent performance and the like of the organosilicon pouring sealant after being cured. In some embodiments of the present application, the weight ratio of the A component to the B component is (0.9-1.1): 1, and specifically, for example, may be 0.9:1, 1:1, 1.1:1, and so on. The weight ratio of the component A to the component B is controlled within the range of (0.9-1.1): 1, so that the mixing ratio of the component A to the component B is favorably controlled, and meanwhile, the mixing ratio of each raw material in the component A to the component B is conveniently regulated and controlled, so that the cross-linking reaction of siloxane and a cross-linking agent is better controlled to be cured within a certain time.
In some embodiments of the application, the weight ratio of the A-component to the B-component is 1:1. The weight ratio of the component A to the component B is strictly controlled to be 1:1, so that the mixing proportion of the component A and the component B can be conveniently regulated and controlled, and the crosslinking curing time of the organosilicon pouring sealant can be regulated and controlled.
In some embodiments of the present application, there is also provided a method for preparing the silicone pouring sealant in the above embodiments, including the following steps:
adding a cross-linking agent, a heat-conducting inorganic filler, a low-dielectric-constant inorganic filler, vinyl MQ resin and color paste into vinyl-terminated polydimethylsiloxane under the stirring action of 300-350 rpm, regulating the stirring rotation speed to 1500-2000 rpm after the addition is finished, mixing and stirring for 20-30 min, adding an inhibitor and mixing and stirring for 10-15 min after the material is cooled to below 50 ℃, and then defoaming for 10-15 min under the vacuum degree of 0.05-0.1 MPa to obtain a component A;
and under the stirring action of 300-350 rpm, adding a heat-conducting inorganic filler, a low-dielectric-constant inorganic filler and vinyl MQ resin into the vinyl-terminated polydimethylsiloxane, regulating the stirring rotation speed to 1500-2000 rpm after the addition is finished, mixing and stirring for 20-30 min, adding a catalyst after the material is cooled to below 50 ℃, mixing and stirring for 10-15 min, defoaming for 10-15 min under the vacuum degree of 0.05-0.1 MPa, stopping stirring, and obtaining the component B, thus obtaining the organosilicon pouring sealant.
In a second aspect, the present application provides an electronic component, where the electronic component includes the silicone potting adhesive in the foregoing embodiment, and for example, the silicone potting adhesive provided in the foregoing embodiment of the present application is used to pot the electronic component, so as to effectively reduce problems that may occur in the electronic component, such as an electric field shielding effect, a transmission signal interference, a resistance-capacitance delay, and an increase in energy consumption.
In some embodiments of the application, the electronic components include inductors, transformers, inverters, on-board chargers, electronic chips, or integrated circuits. The organic silicon pouring sealant provided by the embodiment of the application can be suitable for inductors, transformers, inverters, vehicle-mounted chargers, electronic chips or integrated circuits, has the characteristics of low cost, high heat conduction and low dielectric constant, and can effectively reduce the problems of electric field shielding effect, transmission signal interference, resistance-capacitance delay, energy consumption increase and the like of electronic components.
Hereinafter, embodiments of the present application are described. The following examples are illustrative only and are not to be construed as limiting the application. The examples are not to be construed as limiting the specific techniques or conditions described in the literature in this field or as per the specifications of the product. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
Table 1 composition of a silicone potting adhesive a component in each of examples and comparative examples
Table 2 composition of the silicone potting adhesive B component in each of examples and comparative examples
The dielectric constants of the respective fillers referred to in tables 1 and 2 at 1MHz were as follows: 3.8 parts of hexagonal boron nitride, 3.8 parts of spherical boron nitride, 3.5 parts of fluorine doped modified silicon dioxide, 3.6 parts of silicon carbide, 4.6 parts of silicon dioxide, 9.86 parts of aluminum hydroxide, 5.51 parts of silicon micropowder, 9.65 parts of magnesium oxide, 9.34 parts of aluminum oxide, 9.77 parts of zinc oxide and 10.0 parts of white carbon black.
Example 1
The organic silicon pouring sealant comprises an A component and a B component, wherein the mass ratio of the A component to the B component is 1:1, the composition of the A component is shown by referring to a table 1, and the composition of the B component is shown by referring to a table 2, wherein: the viscosity of the vinyl-terminated polydimethylsiloxane (25 ℃) was 200 mPas; the viscosity of the crosslinking agent (25 ℃) was 300 mPas and the ratio of the silicon to the hydrogen of the crosslinking agent was 1.4; the viscosity of the vinyl MQ resin (25 ℃) was 300 mPas.
Example 2
The organic silicon pouring sealant comprises an A component and a B component, wherein the mass ratio of the A component to the B component is 1:1, the composition of the A component is shown by referring to a table 1, and the composition of the B component is shown by referring to a table 2, wherein: the viscosity of the vinyl-terminated polydimethylsiloxane (25 ℃) was 300 mPas; the viscosity of the crosslinking agent (25 ℃) was 300 mPas and the ratio of the silicon to the hydrogen of the crosslinking agent was 1.3; the viscosity of the vinyl MQ resin (25 ℃) was 450 mPas.
Example 3
The organic silicon pouring sealant comprises an A component and a B component, wherein the mass ratio of the A component to the B component is 1:1, the composition of the A component is shown by referring to a table 1, and the composition of the B component is shown by referring to a table 2, wherein: the viscosity (25 ℃) of the vinyl-terminated polydimethylsiloxane was 400 mPas; the viscosity of the crosslinking agent (25 ℃) was 100 mPas and the ratio of the silicon to the hydrogen of the crosslinking agent was 1.2; the viscosity of the vinyl MQ resin (25 ℃) was 350 mPas.
Example 4
The organic silicon pouring sealant comprises an A component and a B component, wherein the mass ratio of the A component to the B component is 1:1, the composition of the A component is shown by referring to a table 1, and the composition of the B component is shown by referring to a table 2, wherein: the viscosity (25 ℃) of the vinyl-terminated polydimethylsiloxane was 500 mPas; the viscosity of the cross-linking agent (25 ℃) was 200 mPas and the ratio of the silicon to the hydrogen of the cross-linking agent was 1.2; the viscosity (25 ℃) of the vinyl MQ resin was 400 mPas.
Example 5
The organic silicon pouring sealant comprises an A component and a B component, wherein the mass ratio of the A component to the B component is 1:1, the composition of the A component is shown by referring to a table 1, and the composition of the B component is shown by referring to a table 2, wherein: the viscosity of the vinyl-terminated polydimethylsiloxane (25 ℃) was 600 mPas; the viscosity of the crosslinking agent (25 ℃) was 300 mPas and the ratio of the silicon to the hydrogen of the crosslinking agent was 1.3; the viscosity of the vinyl MQ resin (25 ℃) was 300 mPas.
Example 6
The organic silicon pouring sealant comprises an A component and a B component, wherein the mass ratio of the A component to the B component is 1:1, the composition of the A component is shown by referring to a table 1, and the composition of the B component is shown by referring to a table 2, wherein: the viscosity of the vinyl-terminated polydimethylsiloxane (25 ℃) was 700 mPas; the viscosity of the crosslinking agent (25 ℃) was 400 mPas and the ratio of the silicon to the hydrogen of the crosslinking agent was 1.4; the viscosity (25 ℃) of the vinyl MQ resin was 400 mPas.
Example 7
The organic silicon pouring sealant comprises an A component and a B component, wherein the mass ratio of the A component to the B component is 1:1, the composition of the A component is shown by referring to a table 1, and the composition of the B component is shown by referring to a table 2, wherein: the viscosity of the vinyl-terminated polydimethylsiloxane (25 ℃) was 800 mPas; the viscosity of the crosslinking agent (25 ℃) was 500 mPas and the ratio of the silicon to the hydrogen of the crosslinking agent was 1.5; the viscosity (25 ℃) of the vinyl MQ resin was 500 mPas.
Example 8
The organic silicon pouring sealant comprises an A component and a B component, wherein the mass ratio of the A component to the B component is 1:1, the composition of the A component is shown by referring to a table 1, and the composition of the B component is shown by referring to a table 2, wherein: the viscosity of the vinyl-terminated polydimethylsiloxane (25 ℃) was 200 mPas; the viscosity of the crosslinking agent (25 ℃) was 300 mPas and the ratio of the silicon to the hydrogen of the crosslinking agent was 1.4; the viscosity of the vinyl MQ resin (25 ℃) was 300 mPas.
Comparative example 1
The composition of the silicone potting adhesive was substantially the same as in example 1 except that the composition of the a component was as shown in table 1 and the composition of the B component was as shown in table 2.
Comparative example 2
The composition of the silicone potting adhesive was substantially the same as in example 1 except that the composition of the a component was as shown in table 1 and the composition of the B component was as shown in table 2.
Comparative example 3
The silicone heat-conducting pouring sealant disclosed in patent CN111423842 a.
Performance testing
Performance tests were performed on the silicone potting adhesives provided in the above examples and comparative examples, wherein the silicone potting adhesives of examples 1 to 8 and comparative examples 1 to 2 were prepared as follows:
(1) Pouring vinyl-terminated polydimethylsiloxane into a dispersing machine, sequentially adding a cross-linking agent, a heat-conducting filler, a low-dielectric-constant inorganic filler, vinyl MQ resin and color paste into the dispersing machine under the stirring action of 300rpm, adjusting the stirring rotation speed to 1500rpm after the addition is finished, mixing and stirring for 30min, adding an inhibitor and stirring for 10min after the temperature of the materials is reduced to below 50 ℃, defoaming for 15min under the vacuum degree of 0.05MPa, and stopping stirring to obtain a component A;
(2) Pouring vinyl-terminated polydimethylsiloxane into a dispersing machine, sequentially adding a heat conducting filler, a low-dielectric-constant inorganic filler and vinyl MQ resin into the dispersing machine under the stirring action of 300rpm, regulating the stirring rotation speed to 1500rpm after the addition is finished, mixing and stirring for 30min, adding a catalyst after the temperature of the materials is reduced to below 50 ℃, mixing and stirring for 10min, defoaming for 15min under the vacuum degree of 0.05MPa, and stopping stirring to obtain a component B; and (3) packaging the component A and the component B respectively and independently to obtain the organic silicon pouring sealant.
The performance test methods and results of the silicone potting adhesives provided in each example and comparative example are shown in tables 3 to 5.
Table 3 results of performance test of the silicone potting adhesive prepared in each of examples and comparative example 1
| Reference standard | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | Example 7 | Example 8 | Comparative example 1 | |
| Viscosity (mPa. S) | GB/T 2794 | 4900 | 5200 | 5300 | 5500 | 6100 | 6000 | 5700 | 5000 | 20000 |
| Cost estimation (Yuan/kg) | / | 60-80 | 60-80 | 60-80 | 60-80 | 60-80 | 60-80 | 60-80 | 60-80 | 300-350 |
Table 4 results of performance test of the silicone potting adhesive prepared in each of examples and comparative example 2
| Reference standard | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | Example 7 | Example 8 | Comparative example 2 | |
| Dielectric constant(100Hz) | ASTM D150 | 2.88 | 2.94 | 2.90 | 2.77 | 2.81 | 2.88 | 2.91 | 2.85 | 5.55 |
Table 5 results of performance test of the silicone potting adhesive prepared in each of examples and comparative example 3
| Reference standard | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 | Example 7 | Example 8 | Comparative example 3 | |
| Thermal conductivity (W/(m.times.K)) | ISO22007-2 | 2.54 | 2.61 | 2.65 | 2.03 | 2.08 | 2.11 | 2.15 | 2.41 | 0.42-0.65 |
| Dielectric constant (100 Hz) | ASTM D150 | 2.88 | 2.94 | 2.90 | 2.77 | 2.81 | 2.88 | 2.91 | 2.85 | 2.3-2.95 |
As can be seen from tables 3 to 5:
in comparative example 1, only a filler having a low dielectric constant was used, and the viscosity of the product was too high and the cost was too high to be practically used. In comparative example 2, only conventional heat-conducting inorganic filler is used, and the dielectric constant of the system is relatively large, so that the working state of the corresponding electronic product can be influenced, and the low dielectric requirement in practical application can not be met. In comparative example 3, the common heat conducting inorganic filler and the porous material after surface treatment are used together as the filler of the organic silicon pouring sealant, and the dielectric constant of the organic silicon pouring sealant is reduced, but the heat conducting performance is greatly reduced, so that the practical application is difficult to meet.
The organic silicon pouring sealant prepared by the embodiment of the application can meet the basic performance of the organic silicon pouring sealant applied to the pouring of electronic components, and more obviously, the organic silicon pouring sealant can improve the heat conduction performance, reduce the product cost and obviously reduce the dielectric constant, thereby reducing the problems of electric field shielding effect, interference of transmission signals, resistance-capacitance delay, increase of other energy consumption and the like when related electronic components work; and the test condition is that the low temperature is minus 50 ℃, the time is 30min, the high temperature is 150 ℃, the time is 30min, the temperature conversion time is 5min, the cycle time is 1000 times, and the temperature impact resistance range can reach minus 50-150 ℃.
Compared with the comparative example, the embodiment of the organic silicon pouring sealant provided by the application has the advantages that the low dielectric constant inorganic filler (at least one of hexagonal boron nitride, spherical boron nitride, fluorine doped modified silicon dioxide and silicon carbide) and the heat conduction inorganic filler (at least one of silicon dioxide, aluminum hydroxide, silicon micropowder, magnesium oxide, aluminum oxide, zinc oxide and white carbon black) are reasonably matched and the dosage is adjusted, so that the obtained heat conduction pouring sealant not only meets the heat conduction performance requirement, but also meets the requirement of low dielectric constant and controllable cost, and has better application prospect.
The foregoing is merely a preferred embodiment of the present application and is not intended to limit the scope of the present application, but various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the present application.
Claims (16)
1. An organosilicon pouring sealant for electronic components, characterized in that the organosilicon pouring sealant comprises:
the component A comprises, by weight, 20-60 parts of vinyl-terminated polydimethylsiloxane, 10-50 parts of a cross-linking agent, 30-60 parts of a heat conducting inorganic filler, 20-30 parts of a low dielectric constant inorganic filler, 0.01-0.05 part of an inhibitor and 10-40 parts of vinyl MQ resin; the method comprises the steps of,
the component B comprises, by weight, 20-60 parts of vinyl-terminated polydimethylsiloxane, 0.1-1 part of a catalyst, 30-60 parts of a heat conducting inorganic filler, 20-30 parts of a low dielectric constant inorganic filler and 10-40 parts of vinyl MQ resin;
wherein the low dielectric constant inorganic filler comprises at least one of hexagonal boron nitride, spherical boron nitride, fluorine doped modified silicon dioxide and silicon carbide;
the heat conducting inorganic filler comprises at least one of silicon dioxide, aluminum hydroxide, silicon micropowder, magnesium oxide, aluminum oxide, zinc oxide and white carbon black.
2. The silicone potting adhesive for electronic components of claim 1, wherein the dielectric constant of the silicone potting adhesive at 100Hz is not more than 3; and/or the number of the groups of groups,
the viscosity of the organic silicon pouring sealant is 4000-800 Pa.s at 25 ℃.
3. The silicone potting adhesive for electronic components of claim 1, wherein the vinyl-terminated polydimethylsiloxane has a viscosity of 200 to 800 mpa-s at 25 ℃.
4. The silicone potting adhesive for electronic components of claim 1, wherein the crosslinking agent comprises at least one of a terminal hydrogen-based polymethylsiloxane, a pendant hydrogen-based polymethylsiloxane.
5. The silicone potting adhesive for electronic components according to claim 4, wherein the viscosity of the crosslinking agent at 25 ℃ is 100 to 500 mpa-s; and/or the silicon-hydrogen ratio of the cross-linking agent is 1.2-1.5.
6. The silicone potting adhesive for electronic components according to claim 1, wherein the viscosity of the vinyl MQ resin at 25 ℃ is 300 to 500 mpa-s.
7. The silicone potting adhesive for electronic components according to claim 1, wherein the inhibitor comprises at least one of a sulfur-containing compound, a nitrogen-containing compound, a phosphorus-containing compound, and an alkynol compound.
8. The silicone potting adhesive for electronic components of claim 1 wherein the inhibitor comprises an alkynol compound.
9. The silicone potting adhesive for electronic components according to claim 8, wherein the inhibitor comprises at least one of ethynyl cyclohexanol, methylbutyn alcohol, 3,7, 11-trimethyldodecyn-3-ol, maleate, fumarate.
10. The silicone potting adhesive for electronic components of claim 1 wherein the catalyst comprises at least one of a perkin catalyst, chloroplatinic acid.
11. The silicone potting adhesive for electronic components of claim 1, wherein the silicone potting adhesive further comprises a color paste.
12. The organic silicon pouring sealant for electronic components according to claim 11, wherein the color paste is added into the component A, and the addition amount of the color paste is 1-2 parts; and/or the number of the groups of groups,
the color paste comprises black paste containing carbon powder, wherein the carbon powder comprises insulating carbon black.
13. The silicone potting adhesive for electronic components of claim 1, wherein the weight ratio of the component A to the component B is (0.9 to 1.1): 1.
14. The silicone potting adhesive for electronic components of claim 13, wherein the weight ratio of the a component to the B component is 1:1.
15. An electronic component comprising the silicone potting adhesive according to any one of claims 1 to 14.
16. The electronic component of claim 15, wherein the electronic component comprises an inductor, a transformer, an inverter, an on-board charger, an electronic chip, or an integrated circuit.
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