CN111423842A - Low-dielectric-constant organic silicon pouring sealant and preparation method thereof - Google Patents
Low-dielectric-constant organic silicon pouring sealant and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention provides an organosilicon pouring sealant with a low dielectric constant, which belongs to the technical field of organosilicon pouring sealants and comprises a component A and a component B, wherein the component A comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 1-10 parts of diluent, 0-20 parts of heat-conducting filler, 10-60 parts of low dielectric material and 0.1-2.0 parts of catalyst; the component B comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 5-30 parts of cross-linking agent, 0-20 parts of heat-conducting filler, 10-60 parts of low dielectric material and 0.1-1.0 part of inhibitor; performing organic treatment on the low dielectric material, stirring the mixture in a reaction kettle, cooling, stirring again, cooling again to obtain a finished product A and a finished product B, wherein the mass ratio of the finished product A to the finished product B is 1:1, mixing uniformly, and then using. The phase change pouring sealant can solve the problem that a porous material containing air is unstable in an organic silicon system, is stable in storage, has a dielectric constant lower than 3.0(1MHz), and is moderate in heat conduction and viscosity.
Description
Technical Field
The invention relates to the technical field of pouring sealant, and particularly belongs to organic silicon pouring sealant and a preparation method thereof.
Background
With the rapid development of the microelectronic industry, more and more electronic products are developed toward miniaturization, integration and functionalization, wherein the integration level of circuits is higher and higher, and the types and the number of electronic devices contained in a unit volume are also higher and higher. The distance between different electronic devices is further reduced, and meanwhile, adverse effects such as signal interference between wires, resistance and capacitance delay, energy consumption increase and the like are brought. Currently, in academia, the most effective method for solving the problem is to use a low dielectric constant material to prepare the copper-clad plate, so as to reduce the negative effects. For example, chinese patent CN208615414U invented a low dielectric constant double-sided flexible copper clad laminate, which reduces the dielectric constant of the copper clad laminate substrate to reduce the problem of interference and distortion in the signal transmission process.
The pouring sealant is usually liquid, and can fully wrap electronic devices when in use, thereby playing the roles of water resistance, moisture resistance, dust prevention, heat conduction, confidentiality, corrosion resistance, temperature resistance and shock resistance, and being widely applied in the electronic field. In some electronic modules with higher integration level, the encapsulation adhesive can encapsulate the electronic modules to assist heat dissipation. However, the dielectric constant of a general heat-conducting potting adhesive is relatively large, generally between 3.0 and 5.0(1MHz), and the problems of signal interference, resistance and capacitance delay and energy consumption increase of electronic devices still exist at this time. Therefore, on the premise of certain heat conduction, the dielectric constant of the pouring sealant is reduced, and the problems can be effectively solved.
In the field of low dielectric materials, there are 2 methods for reducing the dielectric constant of the material. One is to develop a low dielectric material, which is difficult to develop and high in cost and is not suitable for the field of pouring sealant. The other is to introduce air into the material system to reduce the dielectric constant of the material, because the dielectric constant of air is the lowest, close to vacuum, and equal to about 1. However, after the material containing air is introduced into the silicone potting adhesive, the stability of the potting adhesive itself is greatly affected due to compatibility and other problems.
Disclosure of Invention
Aiming at the defects and shortcomings in the background art, the invention provides the low-dielectric-constant organic silicon pouring sealant which can solve the problem that a porous material containing air is unstable in an organic silicon system, and the organic silicon pouring sealant is stable in storage, has a dielectric constant lower than 3.0(1MHz), and is moderate in heat conduction and viscosity.
The second purpose of the invention is to provide a preparation method of the low dielectric constant organic silicon pouring sealant, which can keep the activity of each substance, so that the prepared organic silicon pouring sealant has the characteristics of stable storage, low dielectric constant, moderate heat conduction and viscosity.
In order to realize the purpose, the invention adopts the following technical scheme to realize the purpose:
an organosilicon pouring sealant with low dielectric constant comprises a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 1-10 parts of diluent, 0-20 parts of heat-conducting filler, 10-60 parts of low dielectric material and 0.1-2.0 parts of catalyst;
the component B comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 5-30 parts of cross-linking agent, 0-20 parts of heat-conducting filler, 10-60 parts of low dielectric material and 0.1-1.0 part of inhibitor;
the vinyl silicone oil is one or a mixture of two-terminal vinyl silicone oil, single-terminal vinyl silicone oil and side chain vinyl silicone oil, and the viscosity is 50-1000mPa & s;
the diluent is dimethyl silicone oil, and the viscosity is 20-200mPa & s;
the heat-conducting filler is one or a mixture of more of silicon dioxide, aluminum hydroxide, silicon micropowder, magnesium oxide, aluminum oxide, zinc oxide and white carbon black;
the cross-linking agent is one or a mixture of a plurality of substances of terminal hydrogen-containing silicone oil, side hydrogen-containing silicone oil or terminal hydrogen-containing silicone oil, and the viscosity is 50-500mPa & s;
the low dielectric material is one or a mixture of several of hollow glass microspheres, microporous magnesium oxide, microporous silicon micropowder, graphene powder and microporous ceramic powder, and is subjected to surface chemical modification;
the catalyst is a platinum catalyst;
the inhibitor is one or a mixture of several of methylbutynol, ethynl cyclohexanol and polyvinyl compound.
Further measures taken are: the viscosity of the vinyl silicone oil is 550 mPa.
Further measures taken are: the viscosity of the dimethyl silicone oil is 50-100 mPa.
Further measures taken are: the particle sizes of the aluminum hydroxide and the silicon micro powder are 10-20 mu m, the aluminum oxide is spherical aluminum oxide, and the white carbon black is surface hydrophobic white carbon black.
A preparation method of low-dielectric-constant organic silicon pouring sealant comprises the following steps:
1) putting all parts of low dielectric materials into the same modifying machine, performing organic treatment on the surfaces of the low dielectric materials by using a treating agent, then performing heat preservation for 10min, discharging, collecting, and dividing the low dielectric materials into corresponding parts of components A and B for later use;
2) adding the vinyl silicone oil, the diluent and the heat-conducting filler in the component A in corresponding parts into a first reaction kettle, stirring for 40min, suspending, adding the low-dielectric material in corresponding parts of the component A treated in the step 1) when the temperature is reduced to below 60 ℃, stirring for 30min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 45 ℃, adding the catalyst in the corresponding part of the component A, stirring for 10min, and stopping stirring to obtain a finished product A;
4) adding the double-end vinyl silicone oil, the cross-linking agent and the heat-conducting filler in the component B in corresponding parts into a second reaction kettle, stirring for 40min, suspending, adding the low-dielectric material in the corresponding parts of the component B processed in the step 1) when the temperature is reduced to below 60 ℃, continuing stirring for 30min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 45 ℃, adding the inhibitor of the component B in a corresponding part, stirring for 10min, and stopping stirring to obtain a finished product B;
6) when in use, the mass ratio of the finished product A to the finished product B is 1:1, mixing uniformly, and then using.
Further measures taken are: in the step 1), the modifier of the low dielectric material is a silane coupling agent which comprises one or a mixture of stearic acid, stearate, long-chain alkyl silicone oil, KH-550, KH-560, KH-570, A-151, A-171 and A-172.
Further measures taken are: in the modification process of the step 1), the rotating speed of the modification machine is 500-2000r/min, the modification temperature is 50-80 ℃, and the modifier is sprayed into the modification machine within 3min through an atomizing spray head.
Further measures taken are: in the step 2) and the step 4), after the substances are added into the corresponding reaction kettle, stirring is carried out for 40min at a stirring speed of 400-1500 r/min; and the temperature of the materials in the reaction kettle is controlled below 80 ℃.
Through the technical scheme, compared with the prior art, the invention has the following beneficial effects:
1. through reasonable component collocation and proportion design and a strict preparation method, the prepared pouring sealant has certain heat conductivity, and simultaneously has lower dielectric constant which is lower than 3.0(1MHz), thereby effectively reducing signal interference of electronic devices, reducing delay of resistance and capacitance, reducing energy consumption loss and saving energy.
2. The invention improves the compatibility of the low dielectric material and an organic silicon system by carrying out surface chemical treatment on the low dielectric material, effectively improves the storage stability of the pouring sealant under the condition of reducing the dielectric constant of the pouring sealant, and meets the requirement of modern products on the stability.
3. The invention also has good flowing property and low viscosity, and can fill the gap by the self gravity to carry out heat conduction encapsulation, thereby better playing the encapsulation protection role of the electronic device.
Detailed Description
In order to clearly understand the technical solutions adopted by the present invention, the following description is made on the preferred embodiments of the present invention, and it should be understood that the embodiments described herein are only used for illustrating and explaining the present invention, and are not used to limit the present invention.
Example 1: an organosilicon pouring sealant with low dielectric constant comprises a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 10 parts of single-end vinyl silicone oil and 25 parts of side chain vinyl silicone oil; 4.5 parts of dimethyl silicone oil; 60 parts of microporous silicon micro powder; 0.5 part of platinum catalyst.
The component B comprises the following substances in parts by weight: 10 parts of single-end vinyl silicone oil and 20 parts of side chain vinyl silicone oil; 9.8 parts of lateral hydrogen-containing silicone oil; 60 parts of microporous silicon micro powder; 0.2 part of methylbutinol.
And is prepared by the following steps:
1) putting 120 parts of microporous silicon micro powder into a modifying machine, spraying a mixture of 1.2 parts of stearic acid and isopropanol in a ratio of 1:1 within 3min by an atomizing spray head when the rotating speed of the modifying machine is 800r/min and the temperature of a modified material is 70 ℃, then preserving heat at 70 ℃ for 10min, discharging and collecting, and dividing into two groups, wherein each group contains 60 parts of microporous silicon micro powder for later use;
2) adding 10 parts of single-end vinyl silicone oil with the viscosity of 350 mPas, 25 parts of side chain vinyl silicone oil with the viscosity of 350 mPas and 4.5 parts of dimethyl silicone oil into a first reaction kettle, stirring at the rotating speed of 1000r/min for 40min, pausing, adding 60 parts of microporous silicon micro powder treated in the step 1) when the temperature is reduced to below 60 ℃, then stirring for 60min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 45 ℃, adding 0.5 part of platinum catalyst, stirring for 10min, and stopping stirring to obtain a finished product A1;
4) adding 10 parts of single-end vinyl silicone oil with the viscosity of 350 mPas, 20 parts of side chain vinyl silicone oil with the viscosity of 350 mPas and 9.8 parts of hydrogen-containing silicone oil at the side of 100 mPas into a second reaction kettle, stirring at the rotating speed of 1000r/min for 40min, suspending, adding 60 parts of microporous silicon micro powder treated in the step 1) when the temperature is reduced to be below 60 ℃, continuing stirring for 60min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 45 ℃, 0.2 part of inhibitor methylbutinol is added, the mixture is stirred for 10min, and then the stirring is stopped, so that a finished product B1 is obtained;
when in use, the mass ratio of the prepared finished product A1 to the finished product B1 is 1:1, mixing uniformly, and then using.
Example 2: an organosilicon pouring sealant with low dielectric constant comprises a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 40 parts of double-end vinyl silicone oil; 9.2 parts of dimethyl silicone oil; 10 parts of silicon dioxide; 40 parts of microporous ceramic powder; 0.8 part of platinum catalyst.
The component B comprises the following substances in parts by weight: 34.6 parts of double-end vinyl silicone oil; 15 parts of lateral hydrogen-containing silicone oil; 10 parts of silicon dioxide; 40 parts of microporous ceramic powder; 0.4 part of ethynl cyclohexanol.
And is prepared by the following steps:
1) putting 80 parts of microporous ceramic powder into a modifying machine, spraying 0.92 part of a mixture of stearic acid and isopropanol in a ratio of 1:1 within 3min by an atomizing spray head when the rotating speed of the modifying machine is 1000r/min and the temperature of a modified material is 75 ℃, then preserving heat at 75 ℃ for 10min, discharging, collecting, and dividing into two groups, wherein 40 parts of microporous silicon micro powder in each group are reserved;
2) adding 40 parts of double-end vinyl silicone oil with the viscosity of 500 mPas, 9.2 parts of dimethyl silicone oil and 10 parts of silicon dioxide powder into a first reaction kettle, stirring at the rotating speed of 800r/min for 40min, suspending, adding 40 parts of microporous ceramic powder treated in the step 1) when the temperature is reduced to be below 60 ℃, then stirring for 60min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 45 ℃, adding 0.8 part of platinum catalyst, stirring for 10min, and stopping stirring to obtain a finished product A2;
4) adding 34.6 parts of double-end vinyl silicone oil with the viscosity of 500mPa & s, 9.8 parts of hydrogen-containing silicone oil on the 100mPa & s side and 10 parts of silicon dioxide powder into a second reaction kettle, stirring at the rotating speed of 800r/min for 40min, suspending, adding 40 parts of microporous ceramic powder treated in the step 1) when the temperature is reduced to below 60 ℃, continuing stirring for 60min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 45 ℃, 0.4 part of inhibitor methylbutinol is added, the mixture is stirred for 10min, and then the stirring is stopped, so that a finished product B2 is obtained;
when in use, the mass ratio of the prepared finished product A2 to the finished product B2 is 1:1, mixing uniformly, and then using.
Example 3: an organosilicon pouring sealant with low dielectric constant comprises a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 30 parts of double-end vinyl silicone oil; 20 parts of single-end vinyl silicone oil; 8.8 parts of dimethyl silicone oil; 10 parts of aluminum oxide; 30 parts of hollow glass microspheres; 1.2 parts of platinum catalyst.
The component B comprises the following substances in parts by weight: 30 parts of double-end vinyl silicone oil; 10 parts of single-end vinyl silicone oil; 19.5 parts of hydrogen-containing silicone oil on the end side; 10 parts of aluminum oxide; 30 parts of hollow glass microspheres; 0.5 part of ethyne cyclohexanol.
And is prepared by the following steps:
1) putting 60 parts of hollow glass microspheres into a modifying machine, spraying 0.5 part of KH-560, A-171 and H within 3min by an atomizing spray head when the rotating speed of the modifying machine is 800r/min and the temperature of the modified material is 75 DEG C2A mixed modifier of O, wherein the mixing mass ratio of KH-560, A-171 and H2O is 5: 5: 1, then preserving heat at 80 ℃ for 10min, discharging and collecting, and dividing into two groups, wherein each group contains 30 parts of hollow glass microspheres for later use;
2) adding 30 parts of double-end vinyl silicone oil with the viscosity of 1000 mPas, 20 parts of single-end vinyl silicone oil with the viscosity of 1000 mPas, 8.8 parts of dimethyl silicone oil and 10 parts of alumina into a first reaction kettle, stirring at the rotating speed of 600r/min for 40min, suspending, adding 30 parts of hollow glass microspheres processed in the step 1) when the temperature is reduced to below 60 ℃, then stirring for 60min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 45 ℃, adding 1.2 parts of platinum catalyst, stirring for 10min, and stopping stirring to obtain a finished product A3;
4) adding 40 parts of double-ended vinyl silicone oil with the viscosity of 1000 mPas, 10 parts of single-ended vinyl silicone oil with the viscosity of 1000 mPas, 19.5 parts of hydrogen-containing silicone oil on the end side of 100 mPas and 10 parts of aluminum oxide into a second reaction kettle, stirring at the rotating speed of 600r/min for 40min, suspending, adding 30 parts of hollow glass microspheres processed in the step 1) when the temperature is reduced to be below 60 ℃, continuing stirring for 60min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 45 ℃, 0.5 part of inhibitor ethynl cyclohexanol is added, and the mixture is stirred for 10min and then is stopped to obtain a finished product B3;
when in use, the mass ratio of the prepared finished product A3 to the finished product B3 is 1:1, mixing uniformly, and then using.
Example 4: an organosilicon pouring sealant with low dielectric constant comprises a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 35 parts of double-end vinyl silicone oil; 4.5 parts of dimethyl silicone oil; 40 parts of aluminum hydroxide; 20 parts of porous ceramic powder; 0.5 part of platinum catalyst.
The component B comprises the following substances in parts by weight: 30 parts of double-end vinyl silicone oil; 9.8 parts of hydrogen-containing silicone oil on the end side; 40 parts of aluminum hydroxide; 20 parts of porous ceramic powder; 0.2 part of ethyne cyclohexanol.
And is prepared by the following steps:
1) 40 parts of porous ceramic powder is put into a modifying machine, 0.3 part of KH-560 and H are sprayed in by an atomizing spray head within 3min when the rotating speed of the modifying machine is 800r/min and the temperature of the modified material is 75 DEG C2Mixed modifier of O, wherein the mixed mass of KH-560 and H2OThe ratio is 10: 1, then preserving heat at 80 ℃ for 10min, discharging and collecting, and dividing into two groups, wherein each group contains 20 parts of porous ceramic powder for later use;
2) adding 35 parts of double-end vinyl silicone oil with the viscosity of 550 mPas, 4.5 parts of dimethyl silicone oil and 40 parts of aluminum hydroxide into a first reaction kettle, stirring for 40min, stopping stirring, cooling, adding 20 parts of porous ceramic powder treated in the step 1) when the temperature is reduced to be below 60 ℃, stirring at the rotation speed of 1000r/min for 60min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 45 ℃, adding 0.5 part of platinum catalyst, stirring for 10min, and stopping stirring to obtain a finished product A4;
4) 30 parts of double-ended vinyl silicone oil with the viscosity of 550 mPas, 9.8 parts of hydrogen-containing silicone oil on the end side of 100 mPas and 40 parts of aluminum hydroxide are added into a second reaction kettle, stirring is carried out at the rotating speed of 1000r/min for 60min, then the stirring is stopped, and the temperature is reduced. When the temperature is reduced to below 60 ℃, adding 20 parts of the porous ceramic powder treated in the step 1), stirring at the rotating speed of 1000r/min for 60min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 45 ℃, 0.2 part of inhibitor ethynl cyclohexanol is added, and the mixture is stirred for 10min and then is stopped to obtain a finished product B4;
when in use, the mass ratio of the prepared finished product A4 to the finished product B4 is 1:1, mixing uniformly, and then using.
The performance parameters of the samples prepared in example 1, example 2, example 3 and example 4 were measured, and the measurement results are shown in table 1 below:
table 1: EXAMPLES tables for measuring Property parameters of samples
| Basic Properties | Example 1 sample | Example 2 sample | Example 3 sample | Example 4 sample |
| Viscosity (mPa. s) | 3300 | 3100 | 3800 | 2900 |
| Density (g/cm)3) | 1.3 | 1.36 | 1.45 | 1.56 |
| Heat conduction W (m.k) | 0.5 | 0.53 | 0.42 | 0.65 |
| Dielectric constant (1MHz) | 2.3 | 2.6 | 2.75 | 2.95 |
The data results in table 1 show that the dielectric constant of the potting adhesive is obviously reduced, so that the signal interference of electronic devices and the delay of resistance and capacitance are reduced, and the effects of reducing energy consumption and distortion are achieved. The measured heat conductivity coefficient difference is caused by different addition amounts of heat-conducting powder or low-dielectric-constant powder in the sample, and the addition of the low-dielectric-constant material can introduce a part of air into a glue system, so that the heat conductivity coefficient is slightly reduced, but the whole product meets the requirement.
Therefore, the pouring sealant has good heat transfer and absorption effects, moderate viscosity and low dielectric constant, can effectively reduce interference distortion in the signal transfer process, and is suitable for popularization and application.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. An organosilicon pouring sealant with low dielectric constant is characterized by comprising a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 1-10 parts of diluent, 0-20 parts of heat-conducting filler, 10-60 parts of low dielectric material and 0.1-2.0 parts of catalyst;
the component B comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 5-30 parts of cross-linking agent, 0-20 parts of heat-conducting filler, 10-60 parts of low dielectric material and 0.1-1.0 part of inhibitor;
the vinyl silicone oil is one or a mixture of two-terminal vinyl silicone oil, single-terminal vinyl silicone oil and side chain vinyl silicone oil, and the viscosity is 50-1000mPa & s;
the diluent is dimethyl silicone oil, and the viscosity is 20-200mPa & s;
the heat-conducting filler is one or a mixture of more of silicon dioxide, aluminum hydroxide, silicon micropowder, magnesium oxide, aluminum oxide, zinc oxide and white carbon black;
the cross-linking agent is one or a mixture of a plurality of substances of terminal hydrogen-containing silicone oil, side hydrogen-containing silicone oil or terminal hydrogen-containing silicone oil, and the viscosity is 50-500mPa & s;
the low dielectric material is one or a mixture of several of hollow glass microspheres, microporous magnesium oxide, microporous silicon micropowder, graphene powder and microporous ceramic powder, and is subjected to surface chemical modification;
the catalyst is a platinum catalyst;
the inhibitor is one or a mixture of several of methylbutynol, ethynl cyclohexanol and polyvinyl compound.
2. The low dielectric constant silicone pouring sealant as claimed in claim 1, wherein: the viscosity of the vinyl silicone oil is 550 mPas.
3. The low dielectric constant silicone pouring sealant as claimed in claim 1, wherein: the viscosity of the dimethyl silicone oil is 50-100 mPa.
4. The low dielectric constant silicone pouring sealant as claimed in claim 1, wherein: the particle sizes of the aluminum hydroxide and the silicon micro powder are 10-20 mu m, the aluminum oxide is spherical aluminum oxide, and the white carbon black is surface hydrophobic white carbon black.
5. The method for preparing the low dielectric constant organosilicon pouring sealant according to any one of claims 1 to 4, characterized in that: the method comprises the following steps:
1) putting all parts of low dielectric materials into the same modifying machine, performing organic treatment on the surfaces of the low dielectric materials by using a treating agent, then performing heat preservation for 10min, discharging, collecting, and dividing the low dielectric materials into corresponding parts of components A and B for later use;
2) adding the vinyl silicone oil, the diluent and the heat-conducting filler in the component A in corresponding parts into a first reaction kettle, stirring for 40min, suspending, adding the low-dielectric material in corresponding parts of the component A treated in the step 1) when the temperature is reduced to below 60 ℃, stirring for 30min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 45 ℃, adding the catalyst in the corresponding part of the component A, stirring for 10min, and stopping stirring to obtain a finished product A;
4) adding the double-end vinyl silicone oil, the cross-linking agent and the heat-conducting filler in the component B in corresponding parts into a second reaction kettle, stirring for 40min, suspending, adding the low-dielectric material in the corresponding parts of the component B processed in the step 1) when the temperature is reduced to below 60 ℃, continuing stirring for 30min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 45 ℃, adding the inhibitor of the component B in a corresponding part, stirring for 10min, and stopping stirring to obtain a finished product B;
6) when in use, the mass ratio of the finished product A to the finished product B is 1:1, mixing uniformly, and then using.
6. The preparation method of the low-dielectric-constant organic silicon pouring sealant as claimed in claim 5, wherein the preparation method comprises the following steps: in the step 1), the modifier of the low dielectric material is a silane coupling agent which comprises one or a mixture of stearic acid, stearate, long-chain alkyl silicone oil, KH-550, KH-560, KH-570, A-151, A-171 and A-172.
7. The preparation method of the low-dielectric-constant organic silicon pouring sealant as claimed in claim 5, wherein the preparation method comprises the following steps: in the modification process of the step 1), the rotating speed of the modification machine is 500-2000r/min, the modification temperature is 50-80 ℃, and the modifier is sprayed into the modification machine within 3min through an atomizing spray head.
8. The preparation method of the low-dielectric-constant organic silicon pouring sealant as claimed in claim 5, wherein the preparation method comprises the following steps: in the step 2) and the step 4), after the substances are added into the corresponding reaction kettle, stirring is carried out for 40min at a stirring speed of 400-1500 r/min; and the temperature of the materials in the reaction kettle is controlled below 80 ℃.
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| CN111944477A (en) * | 2020-08-21 | 2020-11-17 | 中电保力（北京）科技有限公司 | Heat-conducting type bi-component pouring sealant and preparation method thereof |
| CN112143232A (en) * | 2020-09-09 | 2020-12-29 | 深圳市鸿富诚屏蔽材料有限公司 | High-strength ultralow-dielectric-property foaming heat-conducting silica gel gasket and preparation method thereof |
| CN113105741A (en) * | 2021-03-30 | 2021-07-13 | 广州回天新材料有限公司 | Single-component addition type pre-cured heat-conducting silicone gel and preparation method thereof |
| CN113444487A (en) * | 2020-09-14 | 2021-09-28 | 浙江大学山东工业技术研究院 | Bi-component addition type heat-conducting silica gel for heat dissipation of LED lighting chip |
| CN115537176A (en) * | 2022-10-14 | 2022-12-30 | 长春艾德斯新材料有限公司 | Hot-vulcanized organic silicon OCR optical cement, preparation method and application |
| CN116218463A (en) * | 2023-05-06 | 2023-06-06 | 宁德时代新能源科技股份有限公司 | Organic silicon pouring sealant for electronic components and electronic components |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111944477A (en) * | 2020-08-21 | 2020-11-17 | 中电保力（北京）科技有限公司 | Heat-conducting type bi-component pouring sealant and preparation method thereof |
| CN112143232A (en) * | 2020-09-09 | 2020-12-29 | 深圳市鸿富诚屏蔽材料有限公司 | High-strength ultralow-dielectric-property foaming heat-conducting silica gel gasket and preparation method thereof |
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| CN113105741A (en) * | 2021-03-30 | 2021-07-13 | 广州回天新材料有限公司 | Single-component addition type pre-cured heat-conducting silicone gel and preparation method thereof |
| CN115537176A (en) * | 2022-10-14 | 2022-12-30 | 长春艾德斯新材料有限公司 | Hot-vulcanized organic silicon OCR optical cement, preparation method and application |
| CN116218463A (en) * | 2023-05-06 | 2023-06-06 | 宁德时代新能源科技股份有限公司 | Organic silicon pouring sealant for electronic components and electronic components |
| CN116218463B (en) * | 2023-05-06 | 2023-09-29 | 宁德时代新能源科技股份有限公司 | Organic silicon pouring sealant for electronic components and electronic components |
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