CN105838321A - Organic silicon electronic pouring sealant - Google Patents
Organic silicon electronic pouring sealant Download PDFInfo
- Publication number
- CN105838321A CN105838321A CN201610334514.XA CN201610334514A CN105838321A CN 105838321 A CN105838321 A CN 105838321A CN 201610334514 A CN201610334514 A CN 201610334514A CN 105838321 A CN105838321 A CN 105838321A
- Authority
- CN
- China
- Prior art keywords
- organic silicon
- vinyl
- pouring sealant
- silicon electronic
- coupling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses organic silicon electronic pouring sealant. The organic silicon electronic pouring sealant is formed by mixing silica micropowder, a coupling agent, vinyl-terminated silicone oil, a platinum catalyst, alkynyl cyclohexanol, and hydrogen containing silicone oil components. The organic silicon electronic pouring sealant improves the compatibility of the interface between silicone rubber and a filler by adding high-purity silica micropowder and modifying the silica micropowder through the coupling agent, reduces interface defects and possible gaps, and reduces the heat resistance of a system. Meanwhile, the ratio of all the components is reasonably allocated, the pouring sealant has proper viscosity, the thermal conductivity is 0.63W/m.K, the relative dielectric constant is 3.96, and the volume resistivity is 2.86*10<14> Omega.cm, so that the pouring sealant has good comprehensive performances.
Description
Technical field
The present invention relates to field of fine chemical, be specifically related to a kind of organic silicon electronic potting adhesive.
Background technology
Addition-type silicon rubber is typically with the polydimethylsiloxane containing vinyl for base glue, and containing hydrogen silicone oil is cross-linking agent,
Under platinum group catalyst effect, the elastomer with tridimensional network formed by hydrosilylation.Owing to it has excellent
Different high-low temperature resistant, weather-proof, electrical insulation capability, do not release low molecule by-product in sulfidation, and shrinkage factor is minimum, can the degree of depth
Sulfuration, cross-linked structure is easy to control, and product both can vulcanize at normal temperatures, can add the features such as heat cure again it is considered to be electric
The preferred material of assembly embedding.But the heat conductivility of silicone rubber is very poor, thermal conductivity only has 0. 2 W/m about K, easily leads
Send a telegraph heat produced by subset cannot distribute in time, so that the reliability of electronic devices and components and life-span decline.Cause
This, use addition-type silicon rubber as electronic encapsulation material, need to add substantial amounts of heat filling as a rule, for obtaining
Heat conductivity that must be higher, often need to carry out surface modification to heat filling, with reduce filler surface can and surface polarity, improve grain
The degree of scatter of son, increases loading, so that it is guaranteed that silicone rubber is obtaining preferable heat conductivility.
Summary of the invention
Present invention aim at, it is provided that the organic silicon electronic potting adhesive that a kind of heat-conducting effect is good, skill of the present invention
Art scheme is:
A kind of organic silicon electronic potting adhesive, it is characterised in that mixed according to percentage by weight by following components
It is prepared from:
Silicon powder 10-20 part
Coupling agent 0.5-2 part
Vinyl-terminated silicone fluid 50-70 part
Platinum catalyst 1-3 part
Alkynyl Hexalin 1-5 part
Containing hydrogen silicone oil 15-25 part.
Further, described silicon powder is that purity reaches 99.5%, and particle diameter is at 2-4um.
Further, described coupling agent is γ-methacryloxypropyl trimethoxy silane.
Further, described vinyl-terminated silicone fluid is to be 500mpa.s by viscosity, the end of vinyl molar fraction 1.72%
Vinyl silicone oil and viscosity are 1200mpa.s, and the vinyl-terminated silicone fluid of vinyl molar fraction 0.6% according to percentage by weight is
1:1 mixes composition.
The present invention provides the benefit that relative to prior art: the organic silicon electronic potting adhesive of the present invention, by adding height
The silicon powder of purity, and use coupling agent that silicon powder is modified, improve the interface compatibility of silicone rubber and filler, reduce
Boundary defect and space that may be present, reduce the thermal resistance of system.The ratio of each component of rational allocation in component simultaneously, fills
Sealing has suitable viscosity, and thermal conductivity is 0. 63 W/m K, and relative dielectric constant is 3. 96, and specific insulation is 2.
86 ×1014Ω cm, has preferable combination property.
Detailed description of the invention
Below with reference to embodiment, the design of the present invention and the technique effect of generation are clearly and completely described, with
It is completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is the part enforcement of the present invention
Example rather than all embodiment, based on embodiments of the invention, those skilled in the art is not before paying creative work
Put other embodiments obtained, belong to the scope of protection of the invention.
Embodiment 1: a kind of organic silicon electronic potting adhesive, it is characterised in that by following components according to weight percent
Form than being mixed with:
Silicon powder 15 parts
Coupling agent 1 part
Vinyl-terminated silicone fluid 62 parts
Platinum catalyst 2 parts
Alkynyl Hexalin 3 parts
Containing hydrogen silicone oil 17 parts.
Embodiment 2: a kind of organic silicon electronic potting adhesive, it is characterised in that by following components according to weight percent
Form than being mixed with:
Silicon powder 18 parts
γ-methacryloxypropyl trimethoxy silane 1 part
Vinyl-terminated silicone fluid 54 parts
Platinum catalyst 2 parts
Alkynyl Hexalin 4 parts
Containing hydrogen silicone oil 21 parts.
The most above-mentioned silicon powder is that purity reaches 99.5%, and particle diameter is at 2-4um.Above-mentioned vinyl-terminated silicone fluid is by 27
Part viscosity is 500mpa.s, and the vinyl-terminated silicone fluid of vinyl molar fraction 1.72% and 27 parts of viscosity are 1200mpa.s, ethylene
The vinyl-terminated silicone fluid mixing composition of base molar fraction 0.6%.
Above the better embodiment of the present invention is illustrated, but the invention is not limited to described enforcement
Example, those of ordinary skill in the art also can make all equivalent modifications on the premise of spirit of the present invention or replace
Changing, modification or the replacement of these equivalents are all contained in the application claim limited range.
Claims (4)
1. an organic silicon electronic potting adhesive, it is characterised in that mixed according to percentage by weight by following components
It is prepared from:
Silicon powder 10-20 part
Coupling agent 0.5-2 part
Vinyl-terminated silicone fluid 50-70 part
Platinum catalyst 1-3 part
Alkynyl Hexalin 1-5 part
Containing hydrogen silicone oil 15-25 part.
Organic silicon electronic potting adhesive the most according to claim 1, it is characterised in that described silicon powder is that purity reaches
99.5%, particle diameter is at 2-4um.
Organic silicon electronic potting adhesive the most according to claim 1, it is characterised in that described coupling agent is γ-methyl
Acryloxypropyl trimethoxy silane.
Organic silicon electronic potting adhesive the most according to claim 1, it is characterised in that described vinyl-terminated silicone fluid is by gluing
Degree is 500mpa.s, and the vinyl-terminated silicone fluid of vinyl molar fraction 1.72% and viscosity are 1200mpa.s, vinyl mole point
The vinyl-terminated silicone fluid of several 0.6% is 1:1 mixing composition according to percentage by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610334514.XA CN105838321A (en) | 2016-05-19 | 2016-05-19 | Organic silicon electronic pouring sealant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610334514.XA CN105838321A (en) | 2016-05-19 | 2016-05-19 | Organic silicon electronic pouring sealant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105838321A true CN105838321A (en) | 2016-08-10 |
Family
ID=56592835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610334514.XA Withdrawn CN105838321A (en) | 2016-05-19 | 2016-05-19 | Organic silicon electronic pouring sealant |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105838321A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106317904A (en) * | 2016-09-09 | 2017-01-11 | 成都九十度工业产品设计有限公司 | Sealing pad for engines |
| CN107915999A (en) * | 2016-10-11 | 2018-04-17 | 华成新材料（惠州）有限公司 | A kind of addition thermal conductive fire retardant insulating silicon rubber and preparation method thereof |
| CN110041879A (en) * | 2019-04-10 | 2019-07-23 | 深圳市华星光电技术有限公司 | A kind of static-free glue and preparation method thereof and liquid crystal display device |
| CN116218463A (en) * | 2023-05-06 | 2023-06-06 | 宁德时代新能源科技股份有限公司 | Organic silicon pouring sealant for electronic components and electronic components |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1441018A1 (en) * | 2003-01-10 | 2004-07-28 | Kloe S.A. | Adhesive composition, process for its preparation and uses thereof. |
| CN104804704A (en) * | 2014-01-25 | 2015-07-29 | 东莞市长安东阳光铝业研发有限公司 | Preparation method and applications of additive vulcanized silicon rubber used for encapsulation |
-
2016
- 2016-05-19 CN CN201610334514.XA patent/CN105838321A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1441018A1 (en) * | 2003-01-10 | 2004-07-28 | Kloe S.A. | Adhesive composition, process for its preparation and uses thereof. |
| CN104804704A (en) * | 2014-01-25 | 2015-07-29 | 东莞市长安东阳光铝业研发有限公司 | Preparation method and applications of additive vulcanized silicon rubber used for encapsulation |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106317904A (en) * | 2016-09-09 | 2017-01-11 | 成都九十度工业产品设计有限公司 | Sealing pad for engines |
| CN107915999A (en) * | 2016-10-11 | 2018-04-17 | 华成新材料（惠州）有限公司 | A kind of addition thermal conductive fire retardant insulating silicon rubber and preparation method thereof |
| CN110041879A (en) * | 2019-04-10 | 2019-07-23 | 深圳市华星光电技术有限公司 | A kind of static-free glue and preparation method thereof and liquid crystal display device |
| CN116218463A (en) * | 2023-05-06 | 2023-06-06 | 宁德时代新能源科技股份有限公司 | Organic silicon pouring sealant for electronic components and electronic components |
| CN116218463B (en) * | 2023-05-06 | 2023-09-29 | 宁德时代新能源科技股份有限公司 | Organic silicon pouring sealant for electronic components and electronic components |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160810 |
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| WW01 | Invention patent application withdrawn after publication |