CN116218148A - Thermosetting resin composition suitable for packaging third-generation semiconductor and preparation method thereof - Google Patents

Thermosetting resin composition suitable for packaging third-generation semiconductor and preparation method thereof Download PDF

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CN116218148A
CN116218148A CN202211645840.4A CN202211645840A CN116218148A CN 116218148 A CN116218148 A CN 116218148A CN 202211645840 A CN202211645840 A CN 202211645840A CN 116218148 A CN116218148 A CN 116218148A
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commercially available
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packaging
speed mixer
mixing
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闵玉勤
卢绪奎
王善学
李刚
曹延生
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Jiangsu Sinopec New Materials Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

The invention discloses a thermosetting resin composition suitable for packaging a third-generation semiconductor and a preparation method thereof. The thermosetting resin composition prepared by the technical scheme disclosed by the invention has higher glass transition temperature which reaches more than 210 ℃, has lower expansion coefficient, obviously reduces the flexural modulus on the premise of keeping higher flexural strength, shows excellent heat resistance and low stress characteristics, correspondingly reduces the water absorption, obviously improves the shearing bonding force, has the heat conduction performance which reaches more than 2.5W/m.K, shows excellent comprehensive performance, and can be applied to third-generation semiconductor packaging with high requirements on heat conduction, heat resistance and warping.

Description

Thermosetting resin composition suitable for packaging third-generation semiconductor and preparation method thereof
Technical Field
The invention belongs to the technical field of electronic packaging materials, and particularly relates to an epoxy composition suitable for packaging a third-generation semiconductor.
Background
In recent years, the third-generation semiconductor materials represented by silicon carbide, gallium nitride and the like have wider forbidden band width, higher breakdown electric field, higher thermal conductivity, higher electron saturation drift speed and higher radiation resistance, so that the third-generation semiconductor materials are increasingly applied to the fields of semiconductor illumination, new-generation mobile communication, new energy, high-speed rail transit, new energy automobiles and the like, and have wide application prospect and market potential. In semiconductor device packaging, an Epoxy Molding Compound (EMC) is one of main electronic packaging materials, and plays a role in protecting a chip from external dust, moisture, ions, radiation and mechanical impact while playing a role in protecting an electronic circuit. Because high temperature, high frequency and high power are the main application scene and application characteristics of the third generation semiconductor device, the traditional plastic packaging material can not meet the use requirement of the new generation semiconductor power device because the glass transition temperature is far lower than the junction temperature of the third generation semiconductor and the heat conductivity coefficient is lower. There is therefore a need to develop packaging materials with higher glass transition temperatures, higher thermal conductivity and high voltage capabilities for third generation semiconductor packages to complete the packaging of new generation semiconductor devices.
Disclosure of Invention
The present invention addresses the above-described deficiencies of the prior art by providing a thermosetting resin composition suitable for use in the packaging of third-generation semiconductors.
The invention also aims to provide a preparation method of the thermosetting resin composition suitable for the third-generation semiconductor packaging.
In order to solve the technical problems, the invention adopts the following technical scheme: a thermosetting resin composition suitable for packaging a third-generation semiconductor comprises the following components in parts by weight:
Figure BDA0004008232740000011
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Figure BDA0004008232740000021
wherein:
the epoxy resin is selected from one or a mixture of a plurality of o-resol type epoxy resins, dicyclopentadiene type epoxy resins, multifunctional epoxy resins, biphenyl type epoxy resins and polycyclic aromatic hydrocarbon type epoxy resins;
the cyanate resin is selected from one or a mixture of bisphenol A cyanate, phenol formaldehyde cyanate and dicyclopentadiene cyanate.
The alkyl modified phenolic resin is selected from modified phenolic resins of alkylphenol partially substituted phenol, preferably modified phenolic resins of nonylphenol or cardanol partially substituted phenol, and the modified ratio is that nonylphenol or cardanol accounts for 5-30% of the total phenol mass fraction.
The curing accelerator is one or a mixture of several of acetylacetone salt, zinc octoate, TPP and its derivative, imidazole and its derivative, etc.
The inorganic heat conductive filler is one or a mixture of more than two of obtuse crystalline silica, spherical alumina, spherical magnesia and hexagonal boron nitride, and two or more different heat conductive particles can be used in combination from the viewpoint of balance of heat conductivity, insulation and operability.
The coupling agent is a silane coupling agent commonly used in the art, is mainly used as a surface modifier of inorganic filler, changes the physical and chemical properties of the surface of the inorganic filler through chemical reaction or chemical adsorption, improves the dispersibility of the inorganic filler in resin, increases the compatibility of the inorganic filler and an interface, further improves the mechanical property, the chemical property and the electrical property of EMC, and is preferably one or more of 3-aminopropyl triethoxysilane (KH-550), 3-glycidoxypropyl trimethoxysilane (KH-560) and 3-mercaptopropyl trimethoxysilane (KH 590), and is not particularly limited.
The stress modifier is end-epoxy phenoxy resin, and the epoxy value is 0.08-0.1mol/100g.
The release agent is selected from natural wax or synthetic wax commonly used in the art, including, but not limited to, one or a mixture of a plurality of montan ester wax, carnauba wax and oxidized polyethylene wax, and is not particularly limited.
The ion scavenger is selected from ion scavengers commonly used in the art, and is not particularly limited, and the ion scavenger used in the composition of the present invention is specifically a hydrotalcite compound.
The flame retardant is selected from halogen-free and phosphorus-free inorganic flame retardants, and is specifically one or a mixture of more of aluminum hydroxide, magnesium hydroxide, zinc borate and the like.
The colorant is mainly used for distinguishing/identifying different types of devices and covering the design of the packaging unit and preventing light transmission, can contain one or more pigments according to actual needs, and is not particularly limited according to actual needs, and the colorant used in the composition of the invention is specifically carbon black.
The preparation method of the composition adopts industrial general equipment and process flow, is not particularly limited, and adopts the process flow of high mixing, extrusion, cooling, crushing and ingot casting, and is specifically as follows:
1) Accurately weighing inorganic heat conducting filler, flame retardant, colorant and ion scavenger according to the sequence, adding the inorganic heat conducting filler, the flame retardant, the colorant and the ion scavenger into a high-speed mixer for mixing, wherein the mixing time is preferably 10-15 minutes;
2) Precisely weighing the coupling agent, spraying the coupling agent into a high-speed mixer in a mist form under stirring conditions in a high-pressure mode, and continuously stirring for 5-10 minutes to realize surface modification treatment of the inorganic powder material;
3) Precisely weighing epoxy resin, phenolic resin, cyanate resin, stress modifier and release agent, pre-crushing, sequentially adding into a high-speed mixer, and stirring and mixing for 5-10 minutes;
4) Accurately weighing the curing accelerator, adding the curing accelerator into a high-speed mixer, and continuously stirring for 5-10 minutes;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained at 15-30 ℃;
5) Carrying out magnetic separation on the mixed materials, and then carrying out melt mixing extrusion processing on the mixed materials through a double-screw extruder, wherein the material temperature of the materials is controlled to be 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, crushing and mixing;
7) Finally, the mixed powder after magnetic separation is subjected to magnetic separation to remove magnetic metal substances, and then ingot molding is carried out on cake molding equipment according to technical specification requirements, and the cake is packaged and stored in a refrigeration house below 5 ℃.
The theoretical basis of the invention is as follows:
1) The cyanate/epoxy resin system has higher glass transition temperature and lower dielectric constant, but has the problems of poor toughness and poor wet heat resistance, and the inventor finds that the introduction of the phenolic resin modified by long-chain alkyl into the system can promote the curing of the cyanate/epoxy resin system to be more complete, so that the system has excellent dielectric property and wet heat resistance, and improves the toughness of the system;
2) For the application field with higher heat resistance requirement, the toughness and the heat resistance are difficult to be compatible with the common toughening method, and the epoxy resin/cyanate ester/phenolic resin system is toughened, reinforced and modified by the epoxy resin with the ultrahigh molecular weight phenoxy resin, so that the aim of combining mechanical performance and heat resistance is fulfilled.
Based on the technical theory, the technical purpose of the invention is achieved.
Compared with the prior art, the invention has the following remarkable technical advantages and beneficial effects: has higher heat resistance, tg reaching more than 210 ℃, improved bending strength, reduced bending modulus, good toughness, the heat conduction performance reaches more than 2.5W/m.K, and the device package meeting the requirement of higher junction temperature of the third-generation semiconductor can be realized.
Detailed Description
The following is a specific embodiment of the present invention, and the examples are described for further describing the present invention, and the present invention is not limited to the example invention.
Example 1
1) 150Kg of commercially available obtuse-angle-shaped crystalline silica having a particle diameter D50 of 27 μm, 200Kg of commercially available spherical alumina having a particle diameter D50 of 23 μm, 200Kg of commercially available hexagonal boron nitride having a particle diameter D50 of 1.8 μm, 5Kg of commercially available aluminum hydroxide, 5Kg of commercially available zinc borate, 2Kg of commercially available colorant carbon black (Mitsubishi chemical, MA-100, japan), 2Kg of commercially available ion scavenger (Kyoho chemical, DHT-4A) were weighed in this order and mixed in a high-speed mixer at 15Hz speed for 10 minutes;
2) Accurately weighing 1Kg of commercially available coupling agent KH550 and 2Kg of KH560, sequentially spraying into a high-speed mixer under the stirring condition of 5Hz in a mist form under the pressure of 4Mpa, and continuously stirring for 5 minutes to realize the surface modification treatment of the inorganic powder material;
3) 10Kg of a commercially available o-resol type epoxy resin (Shandong Shengquan group, SQCN 700-1), 25Kg of a dicyclopentadiene type epoxy resin (Japanese DIC, HP-7200) and 15Kg of a polycyclic aromatic hydrocarbon type epoxy resin (Japanese chemical, NC-3000), 25Kg of bisphenol A type cyanate ester (CAS: 1156-51-0), 25Kg of dicyclopentadiene type cyanate ester (CAS: 119505-06-5), 10Kg of cardanol modified phenolic aldehyde with a self-made modification ratio of 5%, 9Kg of end-ring oxidized phenoxy resin with a self-made epoxy value of 0.08mol/100g, and 1.4Kg of commercially available release agent carnauba wax, wherein the materials are respectively pre-crushed to a particle size of less than 30 meshes, then sequentially added into a high-speed mixer, and stirred and mixed for 5 minutes at a stirring speed of 15 Hz;
4) Accurately weighing 1.3Kg of Triphenylphosphine (TPP) which is a commercial curing accelerator, and 0.2Kg of zinc acetylacetonate, sequentially adding into a high-speed mixer, and continuously stirring for 10 minutes at a stirring speed of 5 Hz;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained within the range of 15-30 ℃;
5) Carrying out melting, mixing and extrusion processing on the mixed materials by a double-screw extruder, and controlling the material temperature of the materials to be in the range of 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, and then crushing the material to a granularity smaller than 60 meshes;
7) After magnetic separation to remove magnetic metal, ingot forming and packaging are carried out on cake forming equipment according to the technical specification of customers, and the cake is stored in a refrigeration house below 5 ℃.
The main performance of the prepared Epoxy Molding Compound (EMC) product was tested according to the standard test method in the art (GB/T40564-2021: epoxy molding compound test method for electronic packaging), and the test results are shown in Table 1.
Example 2
1) 100Kg of commercially available obtuse-angle-shaped crystalline silica having a particle diameter D50 of 22 μm, 100Kg of commercially available spherical alumina having a particle diameter D50 of 25 μm, 200Kg of commercially available spherical magnesium hydroxide having a particle diameter D50 of 5 μm, 7.5Kg of commercially available magnesium hydroxide, 7.5Kg of commercially available zinc borate, 2.5Kg of commercially available colorant carbon black, 2.5Kg of commercially available ion scavenger (DHT-4A) were precisely weighed in this order, and mixed in a high-speed mixer at a speed of 10Hz for 15 minutes;
2) Accurately weighing 3Kg of commercially available coupling agent KH550 and 1.5Kg KH590, sequentially spraying into a high-speed mixer under the stirring condition of 5Hz in a mist form under the pressure of 4Mpa, and continuously stirring for 10 minutes to realize the surface modification treatment of the inorganic powder material;
3) 15Kg of a commercially available dicyclopentadiene type epoxy resin (DIC, HP-7200, japan), 25Kg of a multifunctional epoxy resin (Mitsubishi chemical, E1032H60, japan), 10Kg of a biphenyl type epoxy resin (Mitsubishi chemical, YX-4000, japan), 15Kg of a commercially available phenol novolac type cyanate ester (CAS: 87397-54-4), 7.5Kg of cardanol modified phenolic aldehyde with a self-made modification ratio of 15%, 7Kg of end-ring oxidized phenoxy resin with a self-made epoxy value of 0.10mol/100g, 0.5Kg of commercially available mold release agent montanate wax (Corean, E wax) and 0.5Kg of oxidized polyethylene wax (Corean, PED-153), respectively pre-crushing the materials to a granularity of less than 30 meshes, sequentially adding the materials into a high-speed mixer, and stirring and mixing the materials for 12 minutes at a stirring speed of 7 Hz;
4) Accurately weighing 0.4kg of zinc octoate which is a commercial curing accelerator and 0.8kg of 2-phenyl-4-methylimidazole (2P 4 MZ), sequentially adding into a high-speed mixer, and continuously stirring for 5 minutes at a stirring speed of 10 Hz;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained within the range of 15-30 ℃;
5) Carrying out melting, mixing and extrusion processing on the mixed materials by a double-screw extruder, and controlling the material temperature of the materials to be in the range of 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, and then crushing the material to a granularity smaller than 60 meshes;
7) After magnetic separation to remove magnetic metal, ingot forming and packaging are carried out on cake forming equipment according to the technical specification of customers, and the cake is stored in a refrigeration house below 5 ℃.
The main performance of the prepared Epoxy Molding Compound (EMC) product was tested according to the standard test method in the art (GB/T40564-2021: epoxy molding compound test method for electronic packaging), and the test results are shown in Table 1.
Example 3
1) 150Kg of commercially available obtuse-angle-shaped crystalline silica having a particle diameter D50 of 25 μm, 250Kg of commercially available spherical alumina having a particle diameter D50 of 22 μm, 200Kg of commercially available hexagonal boron nitride having a particle diameter D50 of 2.6 μm, 2.5Kg of commercially available aluminum hydroxide, 5Kg of commercially available magnesium hydroxide, 3Kg of commercially available colorant carbon black, 1.5Kg of commercially available ion scavenger (DHT-4A) were precisely weighed in this order, and mixed in a high-speed mixer at a speed of 7Hz for 12 minutes;
2) Accurately weighing 3Kg of commercially available coupling agent KH560 and 3Kg of KH590, sequentially spraying into a high-speed mixer under the stirring condition of 10Hz in a mist form under the pressure of 4Mpa, and continuously stirring for 7 minutes to realize the surface modification treatment of the inorganic powder material;
3) 15Kg of a commercially available o-resol type epoxy resin (Shandong Santa Clay, SQCN 700-1), 15Kg of a multifunctional epoxy resin (Mitsubishi chemical in Japan, E1032H 60), 20Kg of a polycyclic aromatic hydrocarbon type epoxy resin (Japanese chemical, NC-3000), 25Kg of dicyclopentadiene type cyanate ester (CAS: 119505-06-5), 5Kg of cardanol modified phenolic aldehyde with a self-made modification ratio of 30%, 5Kg of end-ring oxidized phenoxy resin with a self-made epoxy value of 0.12mol/100g, 0.5Kg of commercially available release agent carnauba wax and 0.25Kg of oxidized polyethylene wax, respectively pre-crushing the materials until the granularity is less than 30 meshes, sequentially adding the materials into a high-speed mixer, and stirring and mixing the materials for 10 minutes at a stirring speed of 10 Hz;
4) Accurately weighing 0.4kg of zinc acetylacetonate which is a commercial curing accelerator and 0.7kg of 2-methylimidazole (2 MI), sequentially adding into a high-speed mixer, and continuously stirring for 7 minutes at a stirring speed of 8 Hz;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained within the range of 15-30 ℃;
5) Carrying out melting, mixing and extrusion processing on the mixed materials by a double-screw extruder, and controlling the material temperature of the materials to be in the range of 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, and then crushing the material to a granularity smaller than 60 meshes;
7) After magnetic separation to remove magnetic metal, ingot forming and packaging are carried out on cake forming equipment according to the technical specification of customers, and the cake is stored in a refrigeration house below 5 ℃.
The main performance of the prepared Epoxy Molding Compound (EMC) product was tested according to the standard test method in the art (GB/T40564-2021: epoxy molding compound test method for electronic packaging), and the test results are shown in Table 1.
Example 4
1) 150Kg of commercially available obtuse-angle-shaped crystalline silica having a particle diameter D50 of 27 μm, 300Kg of commercially available spherical magnesia having a particle diameter D50 of 12 μm, 7.5Kg of commercially available aluminum hydroxide, 5Kg of commercially available zinc borate, 2.5Kg of commercially available colorant carbon black (Mitsubishi chemical, japan, MA-100), 3Kg of commercially available ion scavenger (Japan synergetic chemical, DHT-4A) were precisely weighed in order, and sequentially added to a high-speed mixer to be mixed at a speed of 15Hz for 10 minutes;
2) Accurately weighing 2.5Kg of commercially available coupling agents KH550 and 2.5Kg KH560,2.5Kg KH590, sequentially spraying the coupling agents into a high-speed mixer under the stirring condition of 5Hz in a mist form under the pressure of 4Mpa, and continuously stirring for 5 minutes to realize the surface modification treatment of the inorganic powder material;
3) 15Kg of a commercially available o-resol type epoxy resin (Shandong Santa Clay, SQCN 700-1), 25Kg of a biphenyl type epoxy resin (Mitsubishi chemical, YX-4000) and 10Kg of a polycyclic aromatic hydrocarbon type epoxy resin (Japanese chemical, NC-3000), 10Kg of a commercially available bisphenol A type cyanate ester (CAS: 1156-51-0), 10Kg of commercially available phenol novolac cyanate ester (CAS: 87397-54-4), 9Kg of nonylphenol modified phenolic aldehyde with a self-made modification ratio of 5%, 8Kg of end-ring oxidized phenoxy resin with a self-made epoxy value of 0.10mol/100g, 0.5Kg of commercially available release agent carnauba wax and 0.75Kg of commercially available montanate wax, respectively, pre-crushing the materials to a particle size of less than 30 meshes, sequentially adding the materials into a high-speed mixer, and stirring and mixing the materials for 5 minutes at a stirring speed of 15 Hz;
4) Accurately weighing 0.8kg of Triphenylphosphine (TPP) which is a commercial curing accelerator, and continuously stirring for 10 minutes at a stirring speed of 5Hz after 0.5kg of 2-phenyl-4-methylimidazole (2P 4 MZ) are sequentially added into a high-speed mixer;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained within the range of 15-30 ℃;
5) Carrying out melting, mixing and extrusion processing on the mixed materials by a double-screw extruder, and controlling the material temperature of the materials to be in the range of 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, and then crushing the material to a granularity smaller than 60 meshes;
7) After magnetic separation to remove magnetic metal, ingot forming and packaging are carried out on cake forming equipment according to the technical specification of customers, and the cake is stored in a refrigeration house below 5 ℃.
The main performance of the prepared Epoxy Molding Compound (EMC) product was tested according to the standard test method in the art (GB/T40564-2021: epoxy molding compound test method for electronic packaging), and the test results are shown in Table 1.
Example 5
1) 100Kg of commercially available obtuse-angle-shaped crystalline silica having a particle diameter D50 of 22 μm, 250Kg of commercially available spherical alumina having a particle diameter D50 of 25 μm, 150Kg of commercially available hexagonal boron nitride having a particle diameter D50 of 3 μm, 5Kg of commercially available flame retardant aluminum hydroxide, 2.25Kg of commercially available colorant carbon black, 5Kg of commercially available ion scavenger (DHT-4A) were precisely weighed in this order, and sequentially added to a high-speed mixer to be mixed at a speed of 10Hz for 15 minutes;
2) Accurately weighing 2Kg of commercially available coupling agent KH560 and 2Kg KH590, sequentially spraying into a high-speed mixer under the stirring condition of 5Hz in a mist form under the pressure of 4Mpa, and continuously stirring for 10 minutes to realize the surface modification treatment of the inorganic powder material;
3) 25Kg of a commercially available dicyclopentadiene type epoxy resin (DIC, HP-7200) and 25Kg of a biphenyl type epoxy resin (Mitsubishi chemical, YX-4000) were precisely weighed, 25Kg of a commercially available phenol novolac type cyanate ester (CAS: 87397-54-4) and 10Kg of dicyclopentadiene type cyanate ester (CAS: 119505-06-5), 8Kg of nonylphenol modified phenolic aldehyde with a self-made modification ratio of 15%, 10Kg of end-ring oxidized phenoxy resin with a self-made epoxy value of 0.08mol/100g, and 2Kg of oxidized polyethylene wax (PED-153), wherein the epoxy resin and the epoxy resin are respectively pre-crushed to a particle size of less than 30 meshes, then sequentially added into a high-speed mixer, and stirred and mixed for 12 minutes at a stirring speed of 7 Hz;
4) Accurately weighing 0.75Kg of triphenylphosphine which is a commercial curing accelerator and 0.25Kg of zinc octoate, sequentially adding into a high-speed mixer, and continuously stirring for 5 minutes at a stirring speed of 10 Hz;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained within the range of 15-30 ℃;
5) Carrying out melting, mixing and extrusion processing on the mixed materials by a double-screw extruder, and controlling the material temperature of the materials to be in the range of 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, and then crushing the material to a granularity smaller than 60 meshes;
7) After magnetic separation to remove magnetic metal, ingot forming and packaging are carried out on cake forming equipment according to the technical specification of customers, and the cake is stored in a refrigeration house below 5 ℃.
The main performance of the prepared Epoxy Molding Compound (EMC) product was tested according to the standard test method in the art (GB/T40564-2021: epoxy molding compound test method for electronic packaging), and the test results are shown in Table 1.
Example 6
1) 150Kg of commercially available obtuse-angle-shaped crystalline silica having a particle diameter D50 of 25 μm, 450Kg of commercially available spherical alumina having a particle diameter D50 of 22 μm, 150Kg of commercially available hexagonal boron nitride having a particle diameter D50 of 2.6 μm, 6Kg of commercially available magnesium hydroxide, 6Kg of zinc borate, 1.8Kg of commercially available colorant carbon black, 4Kg of commercially available ion scavenger (DHT-4A) were precisely weighed in order, and sequentially added to a high-speed mixer to be mixed at a speed of 7Hz for 12 minutes;
2) Accurately weighing 3Kg of commercially available coupling agent KH550 and 2Kg KH590, sequentially spraying into a high-speed mixer under the stirring condition of 10Hz in a mist form under the pressure of 4Mpa, and continuously stirring for 7 minutes to realize the surface modification treatment of the inorganic powder material;
3) 20Kg of a commercially available o-resol type epoxy resin (Shandong Santa Clay, SQCN 700-1), 15Kg of a multifunctional epoxy resin (Mitsubishi chemical in Japan, E1032H 60), 15Kg of a biphenyl type epoxy resin (Mitsubishi chemical in Japan, YX-4000), 20Kg of a commercially available bisphenol A type cyanate ester (CAS: 1156-51-0), 20Kg of commercially available phenol novolac cyanate ester (CAS: 87397-54-4), 6Kg of nonylphenol modified phenolic aldehyde with self-made modification ratio of 30%, 6Kg of end-ring oxidized phenoxy resin with self-made epoxy value of 0.12mol/100g, and 1.8Kg of commercial release agent montanate wax, wherein the materials are respectively pre-crushed to particle size of less than 30 meshes, then sequentially added into a high-speed mixer, and stirred and mixed for 10 minutes at a stirring speed of 10 Hz;
4) Accurately weighing 0.5kg of zinc acetylacetonate which is a commercial curing accelerator and 0.9kg of 2-methylimidazole (2 MI), sequentially adding into a high-speed mixer, and continuously stirring for 7 minutes at a stirring speed of 8 Hz;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained within the range of 15-30 ℃;
5) Carrying out melting, mixing and extrusion processing on the mixed materials by a double-screw extruder, and controlling the material temperature of the materials to be in the range of 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, and then crushing the material to a granularity smaller than 60 meshes;
7) After magnetic separation to remove magnetic metal, ingot forming and packaging are carried out on cake forming equipment according to the technical specification of customers, and the cake is stored in a refrigeration house below 5 ℃.
The main performance of the prepared Epoxy Molding Compound (EMC) product was tested according to the standard test method in the art (GB/T40564-2021: epoxy molding compound test method for electronic packaging), and the test results are shown in Table 1.
Comparative example 1
1) 150Kg of commercially available obtuse-angle-shaped crystalline silica having a particle diameter D50 of 27 μm, 200Kg of commercially available spherical alumina having a particle diameter D50 of 23 μm, 200Kg of commercially available hexagonal boron nitride having a particle diameter D50 of 1.8, 5Kg of commercially available aluminum hydroxide, 5Kg of commercially available zinc borate, 2Kg of commercially available colorant carbon black (Mitsubishi chemical, japan, MA-100), 2Kg of commercially available ion scavenger (Japan, co., ltd., DHT-4A) were weighed in this order, and mixed in a high-speed mixer at 15Hz for 10 minutes;
2) Accurately weighing 1Kg of commercially available coupling agent KH550 and 2Kg of KH560, sequentially spraying into a high-speed mixer under the stirring condition of 5Hz in a mist form under the pressure of 4Mpa, and continuously stirring for 5 minutes to realize the surface modification treatment of the inorganic powder material;
3) Precisely weighing 10Kg of commercially available o-resol type epoxy resin (Shandong holy spring group, SQCN 700-1), 25Kg of dicyclopentadiene type epoxy resin (Japanese DIC, HP-7200) and 15Kg of polycyclic aromatic hydrocarbon type epoxy resin (Japanese chemical, NC-3000), 13Kg of commercially available phenol type phenolic resin (Shandong holy spring, PF-8011), 6.5Kg of phenol aralkyl type phenolic resin (Japanese Ming Hei Cheng, MEH-7851), 13Kg of multifunctional phenolic resin (Japanese Ming Hei Cheng, MEH-7500), 9Kg of self-made end-ring oxidized phenoxy resin, 1.4Kg of commercially available release agent carnauba wax, respectively, pre-crushing the materials to a granularity of less than 30 meshes, sequentially adding the materials into a high-speed mixer, and stirring and mixing the materials for 5 minutes at a stirring speed of 15 Hz;
4) 1kg of Triphenylphosphine (TPP) which is a commercial curing accelerator is accurately weighed and added into a high-speed mixer, and then stirred continuously for 10 minutes at a stirring speed of 5 Hz;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained within the range of 15-30 ℃;
5) Carrying out melting, mixing and extrusion processing on the mixed materials by a double-screw extruder, and controlling the material temperature of the materials to be in the range of 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, and then crushing the material to a granularity smaller than 60 meshes;
7) After magnetic separation to remove magnetic metal, ingot forming and packaging are carried out on cake forming equipment according to the technical specification of customers, and the cake is stored in a refrigeration house below 5 ℃.
The main performance of the prepared Epoxy Molding Compound (EMC) product was tested according to the standard test method in the art (GB/T40564-2021: epoxy molding compound test method for electronic packaging), and the test results are shown in Table 1.
Comparative example 2
1) 150Kg of commercially available obtuse-angle-shaped crystalline silica having a particle diameter D50 of 27 μm, 200Kg of commercially available spherical alumina having a particle diameter D50 of 23 μm, 200Kg of commercially available hexagonal boron nitride having a particle diameter D50 of 1.8, 5Kg of commercially available aluminum hydroxide, 5Kg of commercially available zinc borate, 2Kg of commercially available colorant carbon black (Mitsubishi chemical, japan, MA-100), 2Kg of commercially available ion scavenger (Japan, co., ltd., DHT-4A) were weighed in this order, and mixed in a high-speed mixer at 15Hz for 10 minutes;
2) Accurately weighing 1Kg of commercially available coupling agent KH550 and 2KgKH560, sequentially spraying into a high-speed mixer under the stirring condition of 5Hz in a mist form under the pressure of 4Mpa, and continuously stirring for 5 minutes to realize the surface modification treatment of the inorganic powder material;
3) 10Kg of a commercially available o-resol type epoxy resin (Shandong Shengquan group, SQCN 700-1), 25Kg of a dicyclopentadiene type epoxy resin (Japanese DIC, HP-7200) and 15Kg of a polycyclic aromatic hydrocarbon type epoxy resin (Japanese chemical, NC-3000), 25Kg of bisphenol A type cyanate ester (CAS: 1156-51-0), 25Kg of dicyclopentadiene type cyanate ester (CAS: 119505-06-5), 9Kg of commercially available linear phenol phenolic resin (Shandong holy spring, PF-8011), 10Kg of commercially available stress modifier liquid end carboxyl nitrile rubber (CTBN 1300 x 8), 1.4Kg of commercially available release agent carnauba wax, respectively, pre-crushing the materials to a granularity of less than 30 meshes, sequentially adding the materials into a high-speed mixer, and stirring and mixing the materials for 5 minutes at a stirring speed of 15 Hz;
4) Accurately weighing 1.3Kg of Triphenylphosphine (TPP) which is a commercial curing accelerator and 0.2Kg of zinc acetylacetonate, sequentially adding into a high-speed mixer, and continuously stirring for 10 minutes at a stirring speed of 5 Hz;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained within the range of 15-30 ℃;
5) Carrying out melting, mixing and extrusion processing on the mixed materials by a double-screw extruder, and controlling the material temperature of the materials to be in the range of 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, and then crushing the material to a granularity smaller than 60 meshes;
7) After magnetic separation to remove magnetic metal, ingot forming and packaging are carried out on cake forming equipment according to the technical specification of customers, and the cake is stored in a refrigeration house below 5 ℃.
The main performance of the prepared Epoxy Molding Compound (EMC) product was tested according to the standard test method in the art (GB/T40564-2021: epoxy molding compound test method for electronic packaging), and the test results are shown in Table 1.
Comparative example 3
1) 150Kg of commercially available obtuse-angle-shaped crystalline silica having a particle diameter D50 of 27 μm, 200Kg of commercially available spherical alumina having a particle diameter D50 of 23 μm, 200Kg of commercially available hexagonal boron nitride having a particle diameter D50 of 1.8, 5Kg of commercially available aluminum hydroxide, 5Kg of commercially available zinc borate, 2Kg of commercially available colorant carbon black (Mitsubishi chemical, japan, MA-100), 2Kg of commercially available ion scavenger (Japan, co., ltd., DHT-4A) were weighed in this order, and mixed in a high-speed mixer at 15Hz for 10 minutes;
2) Accurately weighing 1Kg of commercially available coupling agent KH550 and 2KgKH560, sequentially spraying into a high-speed mixer under the stirring condition of 5Hz in a mist form under the pressure of 4Mpa, and continuously stirring for 5 minutes to realize the surface modification treatment of the inorganic powder material;
3) 10Kg of a commercially available o-resol type epoxy resin (Shandong Shengquan group, SQCN 700-1), 25Kg of a dicyclopentadiene type epoxy resin (Japanese DIC, HP-7200) and 15Kg of a polycyclic aromatic hydrocarbon type epoxy resin (Japanese chemical, NC-3000), 25Kg of bisphenol A type cyanate ester (CAS: 1156-51-0), 25Kg of dicyclopentadiene type cyanate ester (CAS: 119505-06-5), 9Kg of commercially available phenol novolac resin (Shandong holy spring, PF-8011), 10Kg of commercially available stress modifier epoxidized polybutadiene (Japanese cellophane, PB 3600), 1.4Kg of commercially available release agent carnauba wax, respectively, pre-crushed to a particle size of less than 30 mesh, sequentially added into a high-speed mixer, and stirred and mixed for 5 minutes at a stirring speed of 15 Hz;
4) Accurately weighing 1.3Kg of Triphenylphosphine (TPP) which is a commercial curing accelerator and 0.2Kg of zinc acetylacetonate, sequentially adding into a high-speed mixer, and continuously stirring for 10 minutes at a stirring speed of 5 Hz;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained within the range of 15-30 ℃;
5) Carrying out melting, mixing and extrusion processing on the mixed materials by a double-screw extruder, and controlling the material temperature of the materials to be in the range of 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, and then crushing the material to a granularity smaller than 60 meshes;
7) After magnetic separation to remove magnetic metal, ingot forming and packaging are carried out on cake forming equipment according to the technical specification of customers, and the cake is stored in a refrigeration house below 5 ℃.
The main performance of the prepared Epoxy Molding Compound (EMC) product was tested according to the standard test method in the art (GB/T40564-2021: epoxy molding compound test method for electronic packaging), and the test results are shown in Table 1.
TABLE 1
Performance index Unit (B) Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Comparative example 1 Comparative example 2 Comparative example 3
Gelation time s 33 27 34 28 37 31 36 33 35
Spiral flow length cm 112 98 101 106 115 93 107 118 102
Hardness at heat Shore-D 91 90 93 92 91 93 89 87 88
Tg ℃ 236 219 227 223 214 231 135 178 183
CTE1 ppm/℃ 8.9 9.2 8.1 9 8.5 8.2 9.4 10.2 9.8
CTE2 ppm/℃ 37.4 38.5 33.7 36.5 34.2 33.6 38.7 41.3 39.9
Flexural Strength MPa 148.6 146.3 153.8 147.7 149.6 151.4 134.9 126.2 121.7
Flexural modulus GPa 21.3 21.5 22.4 21.4 21.2 21.7 22.8 27.8 28.5
Coefficient of thermal conductivity W/m·K 2.65 2.58 2.79 2.61 2.63 2.75 2.14 1.97 2.01
Water absorption rate (PCT, 24 h) ％ 0.23 0.25 0.21 0.24 0.22 0.2 0.27 0.33 0.31
Flame retardancy UL-94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0
Copper adhesion after post-cure N/mm 2 756 824 743 816 797 732 872 713 744
Cl- ppm 5.3 4.8 6.2 5.7 5.6 6.3 5.4 6.2 6.6
Na+ ppm 2.7 3.1 3.4 3.2 3.8 4.5 3.3 4.7 4.3
Dielectric constant (1 GHz) -- 3.68 3.82 3.75 3.81 3.71 3.69 4.26 3.95 4.08
Dielectric loss (1 GHz) -- 0.006 0.008 0.007 0.007 0.006 0.007 0.011 0.008 0.009
As can be seen from the data of the examples and the comparative examples in table 1, the use of cyanate as the curing agent of the epoxy resin can greatly improve the heat resistance of the system, reduce the dielectric constant and dielectric loss of the system, and improve the electrical performance of the system; in addition, the phenolic resin modified by long-chain alkyl is used, so that the curing performance of the cyanate/epoxy resin is promoted, and certain toughness is provided for the system; compared with the traditional modification toughening method, the epoxy resin/cyanate/phenolic resin system can be effectively toughened and enhanced modified by selecting the epoxy resin with ultrahigh molecular weight, so that the aim of combining mechanical properties and heat resistance is fulfilled, and the stress is reduced, and meanwhile, the heat performance of the system is not reduced.
The above embodiments are provided to illustrate the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the present invention and implement the same according to the present invention, not to limit the scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims (4)

1. The thermosetting resin composition for packaging the third-generation semiconductor is characterized by comprising the following components in parts by weight:
100 parts of epoxy resin
30-100 parts of cyanate resin
10-20 parts of alkyl modified phenolic resin
2-3 parts of curing accelerator
800-1500 parts of inorganic heat conducting filler
6-15 parts of coupling agent
10-20 parts of stress modifier
1.5 to 4 parts of release agent
3-10 parts of ion scavenger
10-30 parts of flame retardant
4-6 parts of coloring agent
Wherein:
the epoxy resin is selected from one or a mixture of a plurality of o-resol type epoxy resins, dicyclopentadiene type epoxy resins, multifunctional epoxy resins, biphenyl type epoxy resins and polycyclic aromatic hydrocarbon type epoxy resins;
the cyanate resin is selected from one or a mixture of bisphenol A cyanate, phenol formaldehyde cyanate and dicyclopentadiene cyanate.
2. The thermosetting resin composition for packaging a third-generation semiconductor according to claim 1, wherein the alkyl-modified phenolic resin is selected from the group consisting of alkylphenol-partially substituted phenol-modified phenolic resins, preferably nonylphenol-or cardanol-partially substituted phenol-modified phenolic resins, and the modified ratio of nonylphenol or cardanol is 5-30% by mass of the total phenols.
3. The thermosetting resin composition for packaging a third-generation semiconductor according to claim 1, wherein the stress modifier is an epoxy-terminated phenoxy resin having an epoxy value of 0.08 to 0.1mol/100g.
4. The thermosetting resin composition for packaging a third-generation semiconductor according to claim 1, wherein the composition is prepared by a process comprising:
1) Accurately weighing inorganic heat conducting filler, flame retardant, colorant and ion scavenger according to the sequence, adding the inorganic heat conducting filler, the flame retardant, the colorant and the ion scavenger into a high-speed mixer for mixing, wherein the mixing time is preferably 10-15 minutes;
2) Precisely weighing the coupling agent, spraying the coupling agent into a high-speed mixer in a mist form under stirring conditions in a high-pressure mode, and continuously stirring for 5-10 minutes to realize surface modification treatment of the inorganic powder material;
3) Precisely weighing epoxy resin, phenolic resin, cyanate resin, stress modifier and release agent, pre-crushing, sequentially adding into a high-speed mixer, and stirring and mixing for 5-10 minutes;
4) Accurately weighing the curing accelerator, adding the curing accelerator into a high-speed mixer, and continuously stirring for 5-10 minutes;
cooling water is adopted to cool the mixing tank body of the high-speed mixer in the high-speed mixing process, so that the temperature of the materials is ensured to be maintained at 15-30 ℃;
5) Carrying out magnetic separation on the mixed materials, and then carrying out melt mixing extrusion processing on the mixed materials through a double-screw extruder, wherein the material temperature of the materials is controlled to be 90-120 ℃;
6) Cooling the extruded material by a water-cooled steel belt, crushing and mixing;
7) Finally, the mixed powder after magnetic separation is subjected to magnetic separation to remove magnetic metal substances, and then ingot molding is carried out on cake molding equipment according to technical specification requirements, and the cake is packaged and stored in a refrigeration house below 5 ℃.
CN202211645840.4A 2022-12-20 2022-12-20 Thermosetting resin composition suitable for packaging third-generation semiconductor and preparation method thereof Pending CN116218148A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117866432A (en) * 2024-01-10 2024-04-12 常州融信复合材料有限公司 High Wen Qingsuan-resistant ester resin and prepreg prepared from same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117866432A (en) * 2024-01-10 2024-04-12 常州融信复合材料有限公司 High Wen Qingsuan-resistant ester resin and prepreg prepared from same

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