CN116207034A - Tooling fixture and IGBT module pin inserting method applying tooling fixture - Google Patents
Tooling fixture and IGBT module pin inserting method applying tooling fixture Download PDFInfo
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- CN116207034A CN116207034A CN202310482897.5A CN202310482897A CN116207034A CN 116207034 A CN116207034 A CN 116207034A CN 202310482897 A CN202310482897 A CN 202310482897A CN 116207034 A CN116207034 A CN 116207034A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 claims description 35
- 238000003466 welding Methods 0.000 claims description 26
- 238000005520 cutting process Methods 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
Abstract
The invention provides a fixture and an IGBT module pin inserting method applying the fixture, which relate to the technical field of automatic pins and are used for designing the fixture.
Description
Technical Field
The invention relates to the technical field of automatic pins, in particular to a fixture capable of improving the perpendicularity and consistency of pins and an IGBT module pin inserting method using the fixture.
Background
The manufacturing process of the IGBT module may include: and connecting the grid electrode, the collector electrode and the emitter electrode of the IGBT chip to the corresponding positions of the DBC plate (Directed Bonding Copper and the copper-clad ceramic substrate) through a bonding process and a welding process, realizing the function of the IGBT chip, inserting a contact pin into a fixture, and welding with an electrode at the corresponding position of the DBC plate to weld the contact pin at the electrode at the corresponding position of the DBC plate so as to prepare the IGBT module. The contact pin of the IGBT module can be connected with the power PCB and the drive PCB, and is further matched with various components for on-machine application. But at present at the in-process of welding contact pin, insert frock clamp's circular downthehole with square contact pin usually, because there is not the location around the circular hole, the contact pin will shake the rotation when the welding, the straightness that hangs down of contact pin after the welding and the uniformity of the needle body direction of contact pin are poor, lead to the contact pin of IGBT module crooked, and the needle body direction of each contact pin is different for the contact pin of IGBT module is difficult to be connected with power PCB board and drive PCB board, causes IGBT module installation difficulty.
Based on this, a technology capable of improving the perpendicularity of the pins and the uniformity of the pin body direction is demanded.
Disclosure of Invention
The invention aims to provide a fixture and an IGBT module pin inserting method using the fixture, which can improve the perpendicularity of pins after welding and the consistency of the pin body direction and are beneficial to the installation of IGBT modules.
In order to achieve the above object, the present invention provides the following solutions:
a tooling fixture, comprising a plurality of tooling holes, wherein the tooling holes are through holes; the shape of the tooling hole and the shape of the needle body of the contact pin to be inserted into the tooling hole are square, and the side length of the tooling hole is smaller than the side length of the bevel edge of the needle body.
The IGBT module pin inserting method applying the tool clamp comprises the following steps of:
continuously inserting the contact pin into the tooling holes of the tooling fixture until all the tooling holes of the tooling fixture are inserted into the contact pin; the shape of the needle body of the contact pin is square, and the side length of the bevel edge of the needle body is larger than that of the tooling hole; the contact pins are in one-to-one correspondence with the tooling holes;
spot-welding paste at the position of the contact pin to be welded of the DBC plate, and attaching the DBC plate to a fixture clamp, in which all fixture holes are inserted into the contact pin, so as to weld; the soldering paste corresponds to the tooling holes one by one;
and after the welding is finished, taking out the fixture to obtain the DBC plate welded with the contact pins.
In some embodiments, before the pins are continuously inserted into the tooling holes of the tooling fixture, the IGBT module pin inserting method further includes:
cutting the connecting material belt of the integrated contact pin to obtain the contact pin; the integrated contact pin comprises a plurality of contact pins, and adjacent contact pins are connected through the connecting material belt.
In some embodiments, the method for preparing the integrated pin includes:
the material to be processed is put into a stamping die for stamping, and an integrated contact pin is obtained; the stamping die comprises a plurality of pin holes and connecting material belt holes which are positioned between adjacent pin holes and connected with the pin holes; the pin hole is matched with the pin, and the connecting belt hole is matched with the connecting belt.
In some embodiments, before the pins are continuously inserted into the tooling holes of the tooling fixture, the IGBT module pin inserting method further includes: detecting the contact pin and judging whether the perpendicularity of the contact pin meets the requirement; if yes, inserting the contact pin into the tooling hole of the tooling clamp; if not, discarding the pin, and taking a new pin.
In some embodiments, the method for manufacturing the tool fixture comprises the following steps: cutting a plurality of tooling holes on a plate to be processed by utilizing linear cutting to obtain a tooling fixture; the positions of the tooling holes are in one-to-one correspondence with the positions of pins to be welded of the DBC plate.
In some embodiments, the material of the pins is the same as the material at the locations of the DBC board where the pins are to be soldered.
In some embodiments, after obtaining the DBC board with the pins soldered thereto, the IGBT module pin method further includes: the DBC board welded with the pins is installed into the shell, and the pins are inserted into shell holes of the shell.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the invention is used for providing a fixture and an IGBT module pin inserting method applying the fixture, the fixture is designed, the fixture comprises a plurality of fixture holes, the shape of the fixture holes is the same as the shape of a pin body of a pin to be inserted into the fixture holes, and the side length of the fixture holes is smaller than the side length of a bevel edge of the pin body, so that the shaking rotation of the pin can be effectively reduced in the subsequent welding process through the limitation of the shape and the size, the perpendicularity of the pin after welding and the consistency of the direction of the pin body are improved, and the installation of an IGBT module is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a front view of a single pin provided by the present invention;
FIG. 2 is a bottom view of a single pin provided by the present invention;
FIG. 3 is a schematic view of the bevel edge of the pin body of a single pin provided by the present invention;
FIG. 4 is a schematic structural view of a tooling fixture with circular holes provided by the invention;
FIG. 5 is a schematic structural view of a tooling fixture with square holes provided by the invention;
FIG. 6 is a schematic diagram illustrating the assembly of the pin and the tool fixture according to the present invention;
fig. 7 is a flowchart of a method of inserting pins of an IGBT module according to the present invention;
FIG. 8 is a schematic diagram of a structure of a conjoined pin provided by the present invention;
FIG. 9 is a schematic diagram of the structure of a DBC board of solder paste on a spot provided by the present invention;
FIG. 10 is a schematic diagram of a DBC board welded with pins according to the present invention;
fig. 11 is a schematic structural view of a housing according to the present invention.
Symbol description:
1-a needle body; 2-a needle stand; 3-a fixture; 4-a tooling hole; 5-inserting pins; 6-connecting material belts; 7-DBC plate; 8-soldering paste; 9-a housing; 10-a housing aperture; 11-welding surface; 12-mounting surface.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention aims to provide a fixture and an IGBT module pin inserting method using the fixture, which can improve the perpendicularity of pins after welding and the consistency of the pin body direction and are beneficial to the installation of IGBT modules.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Example 1:
the pin of the current common IGBT module is a square pin, fig. 1 is a front view of the pin, fig. 2 is a bottom view of the pin, fig. 3 is a schematic view of a bevel edge of a pin body of the pin, the pin includes a pin body 1 and a needle seat 2 which are connected, and the pin body 1 is square. If the tool fixture using the circular hole as shown in fig. 4 is manufactured based on the bevel edge of the needle body 1 of the square needle, after the square needle is inserted into the circular hole, the contact pin will shake and rotate during welding due to no positioning around the circular hole, so that the perpendicularity of the contact pin after welding and the consistency of the directions of the needle bodies of the contact pins are poor.
In order to solve the problem, this embodiment is used to provide a fixture for inserting pins, as shown in fig. 5 and 6, which is a fixture 3 with square holes, where the fixture 3 includes a plurality of fixture holes 4, the fixture holes 4 are through holes, the shape of the fixture holes 4 is the same as the shape of the pin body 1 of the pins 5 to be inserted into the fixture holes 4, the shape of the fixture holes 4 and the shape of the pin body 1 are both square, and the side length of the fixture holes 4 is smaller than the side length of the bevel edge of the pin body 1, after the pins 5 are inserted into the fixture holes 4, the pins 5 can be limited by means of the limitation of shape and size, so that shaking rotation of the pins 5 is effectively reduced in the subsequent welding process, the verticality of the pins 5 after welding is improved, the consistency of the pin body direction of the pins 5 is improved, and the installation of an IGBT module is facilitated.
The tool clamp 3 adopting the square hole in the embodiment can be manufactured by adopting a linear cutting method. As an example, the side length of the tooling hole 4 may be 0.74mm, and at this time, the side length of the needle body 1 of the contact pin 5 may be 0.64mm, and the side length of the bevel edge of the needle body 1 may be 0.85±0.01mm, and of course, other dimensions may be adopted, which only needs to ensure that the side length of the tooling hole 4 is smaller than the side length of the bevel edge of the needle body 1.
When the pin is inserted, the pin shown in fig. 1 is inserted into the tooling hole 4 in fig. 5, and the side length of the tooling hole 4 is smaller than the bevel edge length of the pin body 1 of the pin 5, so that the rotation of the pin 5 is limited, and the assembly effect of the pin 5 and the tooling fixture 3 is shown in fig. 6.
Example 2:
the present embodiment is configured to provide an IGBT module pin inserting method applying the tool fixture 3 described in embodiment 1, as shown in fig. 7, where the IGBT module pin inserting method includes:
s1: continuously inserting pins into tooling holes of the tooling fixture described in embodiment 1 until all of the tooling holes of the tooling fixture have been inserted into the pins; the shape of the needle body of the contact pin is square, and the side length of the bevel edge of the needle body is larger than that of the tooling hole; the contact pins are in one-to-one correspondence with the tooling holes;
when inserting single contact pin 5 into frock hole 4 of frock clamp 3, because contact pin 5 is single, can't snatch this contact pin 5 through automatic contact pin machine, and then can't insert single contact pin 5 into frock hole 4 of frock clamp 3 one by one through automatic contact pin machine, contact pin inefficiency. To solve this problem, this embodiment designs a conjoined pin, as shown in fig. 8, the conjoined pin includes a plurality of pins 5, adjacent pins 5 are connected by a conjoined strip 6, the pins 5 in the conjoined pin still adopt a single pin shown in fig. 1, only the conjoined strip 6 between adjacent pins 5 is used to connect the pin bodies 1 of adjacent pins 5, as a bridge for interconnecting the pins 5 and the pins 5, the conjoined strip 6 in this embodiment may be rectangular, the rectangle is smoother, and is easy to cut, and the conjoined pins are convenient to cut when the pins 5 are inserted into the tooling holes 4 of the tooling fixture 3.
When inserting the needle to the tooling hole 4 of the tooling fixture 3, the integrated contact pin is led into the automatic contact pin machine as a winding belt, the automatic contact pin machine cuts the integrated contact pin (namely, cuts the integrated material belt 6 of the integrated contact pin by the automatic contact pin machine) to form a single contact pin 5, the contact pin 5 is placed into the tooling hole 4 of the tooling fixture 3, and the automatic contact pin machine continuously cuts and inserts until all the tooling holes 4 of the tooling fixture 3 are inserted with the contact pin 5. When the embodiment is used for inserting the pins, the integrated pins are adopted, so that the integrated pins can be used as materials to be supplied to the automatic pin inserting machine, the automatic pin inserting machine can be utilized to automatically complete the pin inserting process, and the pin inserting efficiency is remarkably improved. Specifically, the automatic pin inserting machine cuts the connecting material belt 6 of the integrated pin, the pin 5 is naturally separated after the cutting, a single pin 5 can be obtained, and the automatic pin inserting machine inserts the single pin 5 obtained after the separation into the tooling hole 4 of the tooling fixture 3. As shown in fig. 6, which is an assembly schematic diagram of the pin 5 and the tooling hole 4, the pin 5 completely penetrates the tooling hole 4.
The automatic pin inserting machine of the embodiment can adopt the existing pin inserting machine and has the functions of cutting and pin inserting.
The integrated contact pin introduced by the embodiment has the advantages of high contact pin efficiency, low production cost and good quality. Specifically, the preparation method commonly used in preparing the single pin 5 shown in fig. 1 is: cutting the plate to be processed to obtain a needle body 1 and a needle seat 2, connecting the needle body 1 and the needle seat 2 to form a single contact pin 5, wherein the preparation method needs to cut the plate to be processed for a plurality of times, so that the waste of materials is caused, and the needle body 1 and the needle seat 2 need to be prepared respectively and then connected, and the preparation process is complex. The method for preparing the integrated pin in this embodiment may include: and (3) putting the material to be processed into a stamping die for stamping to obtain the integrated contact pin, wherein the stamping die comprises a plurality of contact pin holes and an integrated material strip hole which is positioned between adjacent contact pin holes and connected with the contact pin holes, the contact pin holes are matched with the contact pins, and the integrated material strip hole is matched with the integrated material strip. It can be seen that in order to prepare and obtain the integral contact pin, in this embodiment, the material to be processed is put into a stamping die to perform integral stamping, and after stamping forming, the integral contact pin can be obtained, so that a cutting step is not required, more contact pins are made of fewer materials, and the material cost is reduced. Meanwhile, the integrated contact pin is integrally formed through stamping, the needle body 1 and the needle seat 2 do not need to be respectively prepared, the needle body 1 and the needle seat 2 are connected, and the preparation process is simpler. Meanwhile, the preparation method of the integrated contact pin can also ensure that the contact pin 5 and the connecting belt 6 are made of the same material, the thermal expansion coefficients are the same, the material deformation during contact pin processing is reduced, and the contact pin with better quality can be obtained.
In this embodiment, the manufacturing method of the tooling fixture 3 is as follows: the wire cutting is utilized to cut a plurality of tooling holes 4 on a plate to be processed, the tooling holes 4 are through holes, the tooling fixture 3 is obtained, the positions of the tooling holes 4 are in one-to-one correspondence with the positions of pins to be welded of the DBC plate 7, the positions of the pins to be welded of the DBC plate 7 are a plurality of position points required to be welded with the pins 5, the positions of the tooling holes 4 of the tooling fixture 3 are determined in advance according to the positions of the pins to be welded of the DBC plate 7 according to the design requirement of an IGBT module, the wire cutting is utilized to cut a plurality of tooling holes 4, the shape of the tooling holes 4 is identical with the shape of the needle body 1 of the pins 5, the shape of the tooling holes 4 is square, and the side length of the tooling holes 4 is smaller than the bevel side length of the needle body 1 of the pins 5.
S2: spot-welding paste at the position of the contact pin to be welded of the DBC plate, and attaching the DBC plate to a fixture clamp, in which all fixture holes are inserted into the contact pin, so as to weld; the soldering paste corresponds to the tooling holes one by one;
as shown in fig. 9, which is a schematic diagram of the DBC board 7 with the solder paste 8 on the spot, the process of the solder paste 8 on the spot can be completed by a solder paste machine, the position of the solder paste 8 on the required spot is precisely set by the program of the solder paste machine, and the solder paste machine is started to work so as to uniformly spot the solder paste 8 on the positions of the pins to be soldered of the DBC board 7, so that the positions of the solder paste 8 are in one-to-one correspondence with the tooling holes 4. The solder paste 8 of the present embodiment may be solder paste.
And attaching the DBC plate 7 with the fixture 3 with all fixture holes 4 inserted with the pins 5, and putting the fixture into a welding furnace for welding. At this time, the bottom surface of the hub 2 of the pin 5 (the end surface away from the pin body 1, i.e., the welding surface 11 in fig. 8) is bonded to the DBC board 7, and after the welding is completed, the hub 2 of the pin 5 is welded to the DBC board 7.
S3: and after the welding is finished, taking out the fixture to obtain the DBC plate welded with the contact pins.
After the bonding, the DBC board 7 with the bonding pins 5 is removed from the tool jig 3, and the DBC board 7 with the bonding pins 5 is obtained as shown in fig. 10.
After obtaining the DBC board 7 with the pins 5 soldered thereto, the IGBT module pin method of the embodiment further includes: the DBC board 7 with the pins 5 soldered thereto is mounted in the housing 9 such that the pins 5 are inserted into the housing holes 10 of the housing 9, and the mounting surfaces 12 of the pins 5 are connected to external devices (such as a power PCB board) through the housing holes 10. As shown in fig. 11, which is in the shape of a housing 9, the DBC board 7 and the pins 5 are placed in the housing 9 to encapsulate the IGBT module, and the ends (i.e. the mounting surfaces 12) of the pin bodies 1 of the pins 5 are passed through the housing holes 10 of the housing 9 to be connected with other devices. In this embodiment, the inner diameter of the housing hole 10 is 1.2mm, and when the side length of the needle body 1 of the contact pin 5 is 0.64mm, the cutting allowance of the connecting material belt 6 can be controlled within 0.1mm on one side, so that the contact pin 5 can smoothly pass through the housing hole 10 after welding is completed.
When a single pin 5 is manually inserted into the tooling hole 4 of the tooling fixture 3, whether the quality of the single pin 5 is acceptable or not cannot be observed by naked eyes, and the quality of the pin 5 inserted into the tooling hole 4 is unacceptable. Before inserting the pin 5 into the tooling hole 4 of the tooling fixture 3, the automatic pin inserting machine detects the pin 5 and judges whether the perpendicularity of the pin 5 meets the requirement; if yes, the automatic pin inserting machine inserts the pin 5 into the tooling hole 4 of the tooling fixture 3; if not, discarding the pin 5 by the automatic pin machine, cutting the connecting strip 6 of the integrated pin to obtain the next new pin 5, so that the pin 5 can be inserted into the tooling hole 4 by the automatic pin machine by designing the integrated pin, further, the pin 5 can be photographed by a visual recognition system in the automatic pin machine, a picture obtained by photographing is recognized, whether the perpendicularity of the pin 5 meets the requirement is determined, only the pin 5 with the perpendicularity meeting the requirement is inserted into the tooling hole 4, the quality of the single pin 5 inserted into the tooling hole 4 is improved, and the recognition process can be realized by adopting the existing mature technology and is not repeated. Meanwhile, before the contact pin 5 is inserted into the tooling hole 4, the visual recognition system in the automatic contact pin machine can be used for photographing the tooling fixture 3, the center of the tooling hole 4, which is not inserted with the contact pin 5, in the obtained photograph is recognized, so that the tooling hole 4 is subjected to centering self-inspection, the contact pin 5 can be successfully inserted into the tooling hole 4, and the recognition process can adopt the existing mature technology and is not repeated here.
Preferably, the material of the pin 5 is the same as the material of the DBC board 7 at the position where the pin is to be soldered, and the thermal expansion coefficient between the same materials is the smallest, so that the soldering strength between the materials is further ensured during soldering. Since the front surface of the DBC (the surface where the contact pin 5 is required to be welded) is usually made of copper, and the thermal expansion coefficient between the same materials is considered to be the smallest, the integrated contact pin in this embodiment may be a copper contact pin, and when the integrated contact pin is prepared, the copper contact pin can be prepared only by setting the material to be processed to be a copper material.
The embodiment designs the integrated pin, the automatic insertion and visual recognition system of the automatic pin machine is used for matching with the shape and the size of the tooling hole 4, the automatic pin machine can automatically cut off the connecting material belt to obtain a single pin 5, and as the automatic pin machine is provided with the visual recognition system, the perpendicularity recognition can be carried out on each pin 5 obtained, only the pin 5 with the perpendicularity meeting the requirement is inserted into the tooling hole 4, the quality of the single pin 5 inserted into the tooling hole 4 is improved, then the tooling hole 4 is identified for position calibration, the automatic pin machine automatically inserts the pin 5 into the tooling hole 4 after the calibration is successful, thus, the labor time is saved, the pin efficiency is improved, meanwhile, the pin 5 is limited by the shape and the size of the tooling hole 4, the shaking rotation of the pin is effectively reduced, the consistency of the perpendicularity and the pin body direction is improved after the welding, the pin quality is improved, and the IGBT module is favorably installed.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to assist in understanding the methods of the present invention and the core ideas thereof; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.
Claims (8)
1. The tool clamp is characterized by comprising a plurality of tool holes, wherein the tool holes are through holes; the shape of the tooling hole and the shape of the needle body of the contact pin to be inserted into the tooling hole are square, and the side length of the tooling hole is smaller than the side length of the bevel edge of the needle body.
2. An IGBT module pin method using the tool clamp of claim 1, the IGBT module pin method comprising:
continuously inserting a pin into a tooling hole of the tooling fixture of claim 1 until all of the tooling holes of the tooling fixture have been inserted into the pin; the shape of the needle body of the contact pin is square, and the side length of the bevel edge of the needle body is larger than that of the tooling hole; the contact pins are in one-to-one correspondence with the tooling holes;
spot-welding paste at the position of the contact pin to be welded of the DBC plate, and attaching the DBC plate to a fixture clamp, in which all fixture holes are inserted into the contact pin, so as to weld; the soldering paste corresponds to the tooling holes one by one;
and after the welding is finished, taking out the fixture to obtain the DBC plate welded with the contact pins.
3. The IGBT module pin method according to claim 2, characterized in that the IGBT module pin method further comprises, before continuously inserting the pins into the tooling holes of the tooling fixture of claim 1:
cutting the connecting material belt of the integrated contact pin to obtain the contact pin; the integrated contact pin comprises a plurality of contact pins, and adjacent contact pins are connected through the connecting material belt.
4. The IGBT module pin method of claim 3 wherein the method of making the integral pin comprises:
the material to be processed is put into a stamping die for stamping, and an integrated contact pin is obtained; the stamping die comprises a plurality of pin holes and connecting material belt holes which are positioned between adjacent pin holes and connected with the pin holes; the pin hole is matched with the pin, and the connecting belt hole is matched with the connecting belt.
5. The IGBT module pin method according to claim 2, characterized in that the IGBT module pin method further comprises, before continuously inserting the pins into the tooling holes of the tooling fixture of claim 1: detecting the contact pin and judging whether the perpendicularity of the contact pin meets the requirement; if yes, inserting the contact pin into a tooling hole of the tooling fixture of claim 1; if not, discarding the pin, and taking a new pin.
6. The IGBT module pin method of claim 2 wherein the tooling fixture is prepared by: cutting a plurality of tooling holes on a plate to be processed by utilizing linear cutting to obtain a tooling fixture; the positions of the tooling holes are in one-to-one correspondence with the positions of pins to be welded of the DBC plate.
7. The IGBT module pin method according to claim 2, characterized in that the material of the pins is the same as the material at the positions of the DBC board where pins are to be soldered.
8. The IGBT module pin method according to claim 2, characterized in that after obtaining the DBC board with the pins soldered thereto, the IGBT module pin method further comprises: the DBC board welded with the pins is installed into the shell, and the pins are inserted into shell holes of the shell.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310482897.5A CN116207034A (en) | 2023-05-04 | 2023-05-04 | Tooling fixture and IGBT module pin inserting method applying tooling fixture |
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| CN202310482897.5A CN116207034A (en) | 2023-05-04 | 2023-05-04 | Tooling fixture and IGBT module pin inserting method applying tooling fixture |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050105391A (en) * | 2004-04-30 | 2005-11-04 | 주식회사 명성기기 | Fixing jig for pcb |
| CN101692140A (en) * | 2009-09-11 | 2010-04-07 | 温州市瓯海娄桥佳宏眼镜配件厂 | Earpiece linking pin forging technology |
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| CN115939905A (en) * | 2022-11-23 | 2023-04-07 | 智汇轩田智能系统(杭州)有限公司 | High-speed pin machine of robot |
| CN218946587U (en) * | 2022-12-07 | 2023-05-02 | 浙江轩田智能科技有限公司 | Frock is fixed with PIN needle to IGBT welding |
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| CN101692140A (en) * | 2009-09-11 | 2010-04-07 | 温州市瓯海娄桥佳宏眼镜配件厂 | Earpiece linking pin forging technology |
| CN103855591A (en) * | 2013-08-23 | 2014-06-11 | 苏州瑞可达连接系统有限公司 | Multi-pin type pin material connecting band and pin insertion method |
| CN204304106U (en) * | 2014-12-29 | 2015-04-29 | 北京荣瑞世纪科技有限公司 | A kind of compression joint type assembly and connection device |
| CN204771342U (en) * | 2015-07-23 | 2015-11-18 | 江苏宏微科技股份有限公司 | DBC board and terminal welded welding jig |
| CN110202346A (en) * | 2019-07-01 | 2019-09-06 | 大族激光科技产业集团股份有限公司 | A kind of contact pin system |
| CN212182747U (en) * | 2020-06-29 | 2020-12-18 | 东莞市巨曜电子有限公司 | A tool for manual four directions needle of benefit |
| CN215545636U (en) * | 2021-06-19 | 2022-01-18 | 上海林众电子科技有限公司 | Novel welding forming jig for electrode terminals of power modules |
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| CN217942126U (en) * | 2022-08-19 | 2022-12-02 | 北京经纬恒润科技股份有限公司 | Welding jig of Pin needle |
| CN115475879A (en) * | 2022-09-14 | 2022-12-16 | 乐清市红星辰电子有限公司 | Continuous stamping die of one shot forming contact pin and material area |
| CN115939905A (en) * | 2022-11-23 | 2023-04-07 | 智汇轩田智能系统(杭州)有限公司 | High-speed pin machine of robot |
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