CN116207013B - Distribution control method and device for furnace tube machine, electronic equipment and storage medium - Google Patents
Distribution control method and device for furnace tube machine, electronic equipment and storage medium Download PDFInfo
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- CN116207013B CN116207013B CN202310226989.7A CN202310226989A CN116207013B CN 116207013 B CN116207013 B CN 116207013B CN 202310226989 A CN202310226989 A CN 202310226989A CN 116207013 B CN116207013 B CN 116207013B
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- 238000009826 distribution Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000003860 storage Methods 0.000 title claims abstract description 17
- 235000012431 wafers Nutrition 0.000 claims abstract description 345
- 230000001174 ascending effect Effects 0.000 claims description 8
- 238000012163 sequencing technique Methods 0.000 claims description 7
- 238000004590 computer program Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 12
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- 239000004065 semiconductor Substances 0.000 description 6
- 238000007599 discharging Methods 0.000 description 5
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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Abstract
The application provides a distribution control method and device of a furnace tube machine, electronic equipment and a storage medium, wherein the distribution control method comprises the following steps: obtaining a plurality of batches of wafers to be distributed; grouping based on order information of wafers to be distributed of a plurality of batches, and determining a plurality of groups of wafers to be distributed; when a plurality of groups of wafers to be distributed enter a plurality of station entering machines of the furnace tube machine, determining a first group of wafers to be distributed based on the priority of each group of wafers to be distributed, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority; after the distribution of the wafers to be distributed in the first group is completed, determining that the wafers to be distributed in the second group are distributed based on the second priority in the priorities of the wafers to be distributed in the plurality of groups until the distribution of the wafers to be distributed in each group is completed. The problems caused by the fact that the wafers to be distributed in a plurality of groups are simultaneously discharged and distributed are avoided, and the distribution control efficiency of the furnace tube machine is improved.
Description
Technical Field
The application relates to the technical field of semiconductor production, in particular to a distribution control method and device of a furnace tube machine, electronic equipment and a storage medium.
Background
In semiconductor manufacturing, each product may use different types of semiconductor processing equipment with different functions during the manufacturing process due to the extremely complex manufacturing process and procedure. The engineer sets a different production recipe (EQP RECIPE) on each semiconductor processing tool based on the product, the production recipe providing the process steps used when the wafer is processed into the semiconductor processing tool and all parameters used for each process step, the same semiconductor processing tool can produce different products by setting different production recipes.
Currently, the existing technology is distribution by centralized computation, and the method has the following problems: the method is characterized in that product flow data of a production system are subjected to centralized calculation, and the wafers to be distributed in a plurality of groups are simultaneously discharged and distributed, so that the wafers to be distributed in the plurality of groups are piled up at an inbound machine of a furnace tube machine, and further the utilization rate of the furnace tube machine is low, and the production efficiency of a production line is low.
Disclosure of Invention
Accordingly, an object of the present application is to provide a method, an apparatus, an electronic device, and a storage medium for controlling allocation of a furnace platen, by grouping a plurality of batches of wafers to be allocated, setting priorities among the groups of wafers to be allocated, and preferentially allocating the wafers to be allocated of the group corresponding to the highest priority, so as to avoid many problems caused by simultaneous allocation of the wafers to be allocated of the groups, and improve efficiency and utilization rate of allocation control of the furnace platen.
The embodiment of the application provides a distribution control method of a furnace tube machine, which comprises the following steps:
Obtaining a plurality of batches of wafers to be distributed; wherein each batch of wafers to be distributed comprises a plurality of wafers to be distributed;
Grouping based on order information of a plurality of batches of wafers to be distributed, and determining a plurality of groups of wafers to be distributed; wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed;
When a plurality of wafers to be distributed enter a plurality of station entering machines of a furnace tube machine, determining a first group of wafers to be distributed based on the priority of each group of wafers to be distributed, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority;
And after the distribution of the wafers to be distributed of the first group is completed, determining the wafers to be distributed of the second group to distribute based on the second priority among the priorities of the wafers to be distributed of the plurality of groups until the distribution of the wafers to be distributed of each group is completed.
In one possible embodiment, the priority of the group of wafers to be allocated is determined by:
acquiring the corresponding remaining delivery time length of each group of wafers to be distributed;
Ascending time sequencing is carried out on each of the remaining delivery time lengths, and the longest remaining delivery time length and the shortest remaining delivery time length are determined according to the sequenced remaining delivery time lengths;
And setting the priority of the group of wafers to be distributed corresponding to the longest residual delivery time as the lowest priority, and setting the priority of the group of wafers to be distributed corresponding to the shortest residual delivery time as the highest priority.
In one possible implementation, the determining the priority of the group of wafers to be allocated further includes:
detecting whether order information corresponding to the group of wafers to be distributed is an urgent order;
if yes, the priority corresponding to the group of wafers to be distributed is increased.
In one possible embodiment, the priority order of the plurality of wafers to be distributed in the same group of wafers to be distributed is consistent.
In one possible implementation manner, after determining the first group of wafers to be allocated based on the priority of each of the groups of wafers to be allocated, the allocation control method further includes:
and processing the first group of wafers to be distributed, outputting the processed first group of wafers to be distributed from the outbound machine of the furnace tube machine, and storing the wafers in a wafer carrier box.
In one possible implementation manner, after determining the first group of wafers to be allocated based on the priority of each of the groups of wafers to be allocated, the allocation control method further includes:
detecting whether the number of the wafers to be distributed entering the first group of the station entering machine table meets the preset entering number or not;
if not, obtaining a reference wafer consistent with the processing requirement of the first group of wafers to be distributed, and distributing the first group of wafers to be distributed and the reference wafer together.
The embodiment of the application also provides a distribution control device of the furnace tube machine, which comprises:
The acquisition module is used for acquiring a plurality of batches of wafers to be distributed; wherein each batch of wafers to be distributed comprises a plurality of wafers to be distributed;
The grouping module is used for grouping based on order information of a plurality of batches of wafers to be dispatched, and determining a plurality of groups of wafers to be distributed; wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed;
The first distribution module is used for determining a first group of wafers to be distributed based on the priority of each group of wafers to be distributed when the plurality of groups of wafers to be distributed enter a plurality of station entering machines of the furnace tube machine, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority;
and the second distribution module is used for determining the second group of wafers to be distributed based on the second priority among the priorities of the plurality of groups of wafers to be distributed after the distribution of the first group of wafers to be distributed is completed, and distributing the second group of wafers to be distributed until the distribution of each group of wafers to be distributed is completed.
In one possible implementation, the grouping module determines the priority of the group of wafers to be allocated by:
acquiring the corresponding remaining delivery time length of each group of wafers to be distributed;
Ascending time sequencing is carried out on each of the remaining delivery time lengths, and the longest remaining delivery time length and the short remaining delivery time length are determined according to the sequenced remaining delivery time lengths;
And setting the priority of the group of wafers to be distributed corresponding to the longest residual delivery time as the lowest priority, and setting the priority of the group of wafers to be distributed corresponding to the shortest residual delivery time as the highest priority.
The embodiment of the application also provides electronic equipment, which comprises: the system comprises a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, when the electronic equipment runs, the processor and the memory are communicated through the bus, and the machine-readable instructions are executed by the processor to execute the steps of the allocation control method of the furnace tube machine.
The embodiment of the application also provides a computer readable storage medium, and the computer readable storage medium stores a computer program which executes the steps of the distribution control method of the furnace tube machine when being run by a processor.
The embodiment of the application provides a distribution control method, a device, electronic equipment and a storage medium for a furnace tube machine, wherein the distribution control method comprises the following steps: obtaining a plurality of batches of wafers to be distributed; wherein each batch of wafers to be distributed comprises a plurality of wafers to be distributed; grouping based on order information of a plurality of batches of wafers to be distributed, and determining a plurality of groups of wafers to be distributed; wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed; when a plurality of wafers to be distributed enter a plurality of station entering machines of a furnace tube machine, determining a first group of wafers to be distributed based on the priority of each group of wafers to be distributed, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority; and after the distribution of the wafers to be distributed of the first group is completed, determining the wafers to be distributed of the second group to distribute based on the second priority among the priorities of the wafers to be distributed of the plurality of groups until the distribution of the wafers to be distributed of each group is completed. By grouping the wafers to be distributed of a plurality of batches, setting the priorities among the groups of the wafers to be distributed, and preferentially distributing the groups of the wafers to be distributed corresponding to the highest priorities, the problems caused by the fact that the wafers to be distributed of the groups are simultaneously distributed in a discharging mode are avoided, and the efficiency of distribution control of the furnace tube machine is improved.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for controlling allocation of furnace platen according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a distribution control device of a furnace platen according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a device for controlling distribution of a furnace platen according to an embodiment of the present application;
Fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application, and it should be understood that the drawings in the present application are for the purpose of illustration and description only and are not intended to limit the scope of the present application. In addition, it should be understood that the schematic drawings are not drawn to scale. A flowchart, as used in this disclosure, illustrates operations implemented according to some embodiments of the present application. It should be appreciated that the operations of the flow diagrams may be implemented out of order and that steps without logical context may be performed in reverse order or concurrently. Moreover, one or more other operations may be added to or removed from the flow diagrams by those skilled in the art under the direction of the present disclosure.
In addition, the described embodiments are only some, but not all, embodiments of the application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by a person skilled in the art based on embodiments of the application without making any inventive effort, fall within the scope of the application.
In order to enable those skilled in the art to make and use the present disclosure, the following embodiments are provided in connection with a specific application scenario "furnace platen allocation control", and it will be apparent to those skilled in the art that the general principles defined herein may be applied to other embodiments and application scenarios without departing from the spirit and scope of the present disclosure.
The method, the device, the electronic equipment or the computer readable storage medium can be applied to any scene requiring the allocation control of the furnace tube machine, the embodiment of the application does not limit the specific application scene, and any scheme using the allocation control method, the device, the electronic equipment and the storage medium of the furnace tube machine provided by the embodiment of the application is within the protection scope of the application.
It has been found that the existing prior art is a centralized computing allocation, and this method has the following problems: the simultaneous discharging and distributing of the wafers to be distributed in a plurality of groups can lead to the stacking of the wafers to be distributed in a plurality of groups to the station entering machine of the furnace machine, thereby leading to the low distributing efficiency of the furnace machine.
Based on this, the embodiment of the application provides a distribution control method for a furnace platform, which sets priorities among groups of wafers to be distributed by grouping the wafers to be distributed of a plurality of batches, and preferentially distributes the wafers to be distributed of the group corresponding to the highest priority, so that a plurality of problems caused by simultaneous discharging distribution of the wafers to be distributed of the groups are avoided, and the distribution control efficiency of the furnace platform is improved.
Referring to fig. 1, fig. 1 is a flowchart of a method for controlling allocation of a furnace platen according to an embodiment of the application. As shown in fig. 1, the allocation control method provided by the embodiment of the present application includes:
S101: obtaining a plurality of batches of wafers to be distributed; wherein each batch of wafers to be distributed comprises a plurality of wafers to be distributed.
In this step, a plurality of batches of wafers to be dispensed are obtained.
Here, the wafers to be distributed in each lot includes a plurality of wafers to be distributed, for example, a lot may include at most 25 wafers to be distributed.
Here, the wafer to be distributed is a wafer which is not entered into the furnace platen for processing and is in a preparation stage.
S102: grouping based on order information of a plurality of batches of wafers to be distributed, and determining a plurality of groups of wafers to be distributed; wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed.
In the step, grouping is carried out according to order information of the wafers to be distributed of a plurality of batches, and a plurality of groups of wafers to be distributed are determined.
Wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed.
Here, the wafers to be distributed of a plurality of batches having the same order information may be divided into a group, or may be grouped according to other information of the wafers to be distributed, and this portion is not limited.
The priority orders of the wafers to be distributed in the same group of wafers to be distributed are consistent.
S103: when a plurality of wafers to be distributed enter a plurality of station entering machines of a furnace tube machine, determining a first group of wafers to be distributed based on the priority of each group of wafers to be distributed, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority.
In the step, when a plurality of groups of wafers to be distributed enter a plurality of station entering machines of a furnace tube machine, a first group of wafers to be distributed is determined according to the priority of each group of wafers to be distributed, and the first group of wafers to be distributed is distributed.
Here, the priority of the first group of wafers to be allocated is the highest priority.
In one possible embodiment, the priority of the group of wafers to be allocated is determined by:
A: and acquiring the corresponding remaining delivery time length of each group of wafers to be distributed.
Here, the remaining delivery time length corresponding to each group of wafers to be distributed is acquired.
B: and carrying out ascending time sequencing on each of the remaining delivery time lengths, and determining the longest remaining delivery time length and the shortest remaining delivery time length according to the sequenced remaining delivery time lengths.
Here, each of the remaining delivery time lengths is ascending time ordered, and the longest remaining delivery time length and the shortest remaining delivery time length are determined according to the ordered remaining delivery time lengths.
C: and setting the priority of the group of wafers to be distributed corresponding to the longest residual delivery time as the lowest priority, and setting the priority of the group of wafers to be distributed corresponding to the shortest residual delivery time as the highest priority.
Here, the priority of the group of wafers to be allocated corresponding to the longest remaining delivery time period is set as the lowest priority, and the priority of the group of wafers to be allocated corresponding to the shortest remaining delivery time period is set as the highest priority.
In a specific embodiment, the remaining delivery time length corresponding to each group of wafers to be distributed is obtained, ascending time sequencing is performed on each remaining delivery time length, the longest remaining delivery time length and the shortest remaining delivery time length are determined according to the sequenced remaining delivery time lengths, the priority of the group of wafers to be distributed corresponding to the longest remaining delivery time length is set as the lowest priority, and the priority of the group of wafers to be distributed corresponding to the shortest remaining delivery time length is set as the highest priority. Therefore, the wafers to be distributed in all groups are not required to be distributed simultaneously, and the priority of distribution is determined to be more flexible in distribution.
In one possible implementation, the determining the priority of the group of wafers to be allocated further includes:
a: and detecting whether order information corresponding to the wafers to be distributed in the group is an urgent order.
Here, it is detected whether order information corresponding to the wafers to be allocated of the group is an urgent order.
B: if yes, the priority corresponding to the group of wafers to be distributed is increased.
If an urgent order exists, the priority of the group of wafers to be distributed corresponding to the urgent order is updated so that the group of wafers to be distributed can be distributed as soon as possible.
Here, the priority of the group of wafers to be allocated may also be determined based on order importance (non-profit strategic orders), customer importance (strategic customers), profit margin, or other factors.
In one possible implementation manner, after determining the first group of wafers to be allocated based on the priority of each of the groups of wafers to be allocated, the allocation control method further includes:
and processing the first group of wafers to be distributed, outputting the processed first group of wafers to be distributed from the outbound machine of the furnace tube machine, and storing the wafers in a wafer carrier box.
The wafers to be distributed in the first group are processed, and after the processing is finished, the wafers to be distributed in the first group are output from the outbound machine of the furnace tube machine and are stored in the wafer carrier box.
In one possible implementation manner, after determining the first group of wafers to be allocated based on the priority of each of the groups of wafers to be allocated, the allocation control method further includes:
Detecting whether the number of the wafers to be distributed entering the first group of the station entering machine table meets the preset entering number or not; if not, obtaining a reference wafer consistent with the processing requirement of the first group of wafers to be distributed, and distributing the first group of wafers to be distributed and the reference wafer together.
Here, whether the number of the first group of wafers to be distributed entering the station entering machine table meets the preset entering number is detected, if not, a reference wafer which is consistent with the processing requirement of the first group of wafers to be distributed is obtained, and the first group of wafers to be distributed and the reference wafer are distributed together.
Here, when the number of wafers to be dispensed does not satisfy the preset entry number, the reference wafer (non-product wafer) is required to be quantity-filled.
S104: and after the distribution of the wafers to be distributed of the first group is completed, determining the wafers to be distributed of the second group to distribute based on the second priority among the priorities of the wafers to be distributed of the plurality of groups until the distribution of the wafers to be distributed of each group is completed.
In the step, after the distribution of the wafers to be distributed in the first group is completed, the wafers to be distributed in the second group are determined to be distributed according to the second priority in the priorities of the wafers to be distributed in the plurality of groups until the distribution of the wafers to be distributed in each group is completed.
In the chip manufacturing process, the processing amount of a common machine is 25 wafers (one Lot), but the furnace machine can process at most more than 150 wafers at a time (6 lots are not fully filled with other dummy lots to ensure that the conditions of external temperature and the like of each Wafer are consistent), and the processing time of one machine is far longer than that of other machines. Accounting for MES is also done on a Lot by Lot basis, with accounting being done 25 pieces at a time (one Lot). However, if the furnace is accessed according to a single Lot of the MES system, the time is very long, and the use times of a plurality of Dummy sheets are very wasted, so that the processing logic of the MES should bind a plurality of lots to be processed for one Batch. Therefore, when a plurality of Lots (batches of wafers to be distributed) of the same Batch (groups of wafers to be distributed) are adopted to be conveyed to the furnace tube machine, the whole Batch feeding is required to be ensured, the Batch feeding is either carried out or not carried out, any Lot has abnormal conditions, and the Lot conveying of all the Batch should be stopped immediately. The priorities of a plurality of Lots in the Lot queue of the furnace tube machine are consistent, the priorities between the Batch and the Batch are pre-existing, then the machine entering sequence is controlled, and the Batch are required to be managed in a grouping way. The GroupID (identification information) of different Batch is different and the priority is different.
In a specific embodiment, a plurality of batches of wafers to be distributed are obtained, grouping is carried out according to order information of the batches of wafers to be distributed, and a plurality of groups of wafers to be distributed are determined; when a plurality of groups of wafers to be distributed enter a plurality of station entering machines of the furnace tube machine, determining a first group of wafers to be distributed according to the priority of each group of wafers to be distributed, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority; and processing the first group of wafers to be distributed, outputting the processed first group of wafers to be distributed from an outbound machine of the furnace tube machine, and storing the wafers in a wafer carrier box. After the distribution of the wafers to be distributed in the first group is completed, determining the wafers to be distributed in the second group to distribute according to the second priority in the priorities of the wafers to be distributed in the plurality of groups until the distribution of the wafers to be distributed in each group is completed.
The embodiment of the application provides a distribution control method of a furnace tube machine, which comprises the following steps: obtaining a plurality of batches of wafers to be distributed; wherein each batch of wafers to be distributed comprises a plurality of wafers to be distributed; grouping based on order information of a plurality of batches of wafers to be distributed, and determining a plurality of groups of wafers to be distributed; wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed; when a plurality of wafers to be distributed enter a plurality of station entering machines of a furnace tube machine, determining a first group of wafers to be distributed based on the priority of each group of wafers to be distributed, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority; and after the distribution of the wafers to be distributed of the first group is completed, determining the wafers to be distributed of the second group to distribute based on the second priority among the priorities of the wafers to be distributed of the plurality of groups until the distribution of the wafers to be distributed of each group is completed. By grouping the wafers to be distributed of a plurality of batches, setting the priorities among the groups of the wafers to be distributed, and preferentially distributing the groups of the wafers to be distributed corresponding to the highest priorities, the problems caused by the fact that the wafers to be distributed of the groups are simultaneously distributed in a discharging mode are avoided, and the efficiency of distribution control of the furnace tube machine is improved.
Referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of a distribution control device for a furnace platen according to an embodiment of the present application; FIG. 3 is a schematic diagram of a distribution control apparatus for a furnace platen according to an embodiment of the present application. As shown in fig. 2, the distribution control apparatus 200 includes:
an obtaining module 210, configured to obtain a plurality of batches of wafers to be distributed; wherein each batch of wafers to be distributed comprises a plurality of wafers to be distributed;
the grouping module 220 is configured to group the wafers to be allocated based on order information of the batches of wafers to be allocated, and determine a plurality of groups of wafers to be allocated; wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed;
the first allocation module 230 is configured to determine, when a plurality of wafers to be allocated in the group enter a plurality of inbound stations of the furnace station, a first group of wafers to be allocated based on priorities of the wafers to be allocated in the group, and allocate the first group of wafers to be allocated; the priority of the first group of wafers to be distributed is the highest priority;
And the second allocation module 240 is configured to determine, after the allocation of the first group of wafers to be allocated, to allocate the second group of wafers to be allocated based on a second priority among the priorities of the plurality of groups of wafers to be allocated until the allocation of each group of wafers to be allocated is completed.
Further, the grouping module 220 determines the priority of the group of wafers to be allocated by:
acquiring the corresponding remaining delivery time length of each group of wafers to be distributed;
Ascending time sequencing is carried out on each of the remaining delivery time lengths, and the longest remaining delivery time length and the shortest remaining delivery time length are determined according to the sequenced remaining delivery time lengths;
And setting the priority of the group of wafers to be distributed corresponding to the longest residual delivery time as the most first priority, and setting the priority of the group of wafers to be distributed corresponding to the shortest residual delivery time as the most highest priority.
Further, the grouping module 220 determines the priority of the group of wafers to be allocated by the following steps, and further includes:
detecting whether order information corresponding to the group of wafers to be distributed is an urgent order;
if yes, the priority corresponding to the group of wafers to be distributed is increased.
Further, the priority orders of the plurality of wafers to be distributed in the same group of wafers to be distributed are consistent.
Further, as shown in fig. 3, the dispensing control device 200 further includes a processing module 250, where the processing module 250 is configured to:
and processing the first group of wafers to be distributed, outputting the processed first group of wafers to be distributed from the outbound machine of the furnace tube machine, and storing the wafers in a wafer carrier box.
Further, as shown in fig. 3, the dispensing control device 200 further includes a filling module 260, and the filling module 260 is configured to:
detecting whether the number of the wafers to be distributed entering the first group of the station entering machine table meets the preset entering number or not;
if not, obtaining a reference wafer consistent with the processing requirement of the first group of wafers to be distributed, and distributing the first group of wafers to be distributed and the reference wafer together.
The embodiment of the application provides a distribution control device of a furnace tube machine, which comprises: the acquisition module is used for acquiring a plurality of batches of wafers to be distributed; wherein each batch of wafers to be distributed comprises a plurality of wafers to be distributed; the grouping module is used for grouping based on order information of a plurality of batches of wafers to be dispatched, and determining a plurality of groups of wafers to be distributed; wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed; the first distribution module is used for determining a first group of wafers to be distributed based on the priority of each group of wafers to be distributed when the plurality of groups of wafers to be distributed enter a plurality of station entering machines of the furnace tube machine, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority; and the second distribution module is used for determining the second group of wafers to be distributed based on the second priority among the priorities of the plurality of groups of wafers to be distributed after the distribution of the first group of wafers to be distributed is completed, and distributing the second group of wafers to be distributed until the distribution of each group of wafers to be distributed is completed. By grouping the wafers to be distributed of a plurality of batches, setting the priorities among the groups of the wafers to be distributed, and preferentially distributing the groups of the wafers to be distributed corresponding to the highest priorities, the problems caused by the fact that the wafers to be distributed of the groups are simultaneously distributed in a discharging mode are avoided, and the efficiency of distribution control of the furnace tube machine is improved.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the application. As shown in fig. 4, the electronic device 400 includes a processor 410, a memory 420, and a bus 430.
The memory 420 stores machine-readable instructions executable by the processor 410, when the electronic device 400 is running, the processor 410 communicates with the memory 420 through the bus 430, and when the machine-readable instructions are executed by the processor 410, the steps of the method for controlling the allocation of the furnace platen in the method embodiment shown in fig. 1 may be executed, and the specific implementation manner may refer to the method embodiment and will not be described herein.
The embodiment of the present application further provides a computer readable storage medium, where a computer program is stored on the computer readable storage medium, and when the computer program is executed by a processor, the steps of the method for controlling allocation of a furnace tube machine in the method embodiment shown in fig. 1 may be executed, and a specific implementation manner may refer to the method embodiment and will not be described herein.
It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.
In the several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a non-volatile computer readable storage medium executable by a processor. Based on this understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
Finally, it should be noted that: the above examples are only specific embodiments of the present application, and are not intended to limit the scope of the present application, but it should be understood by those skilled in the art that the present application is not limited thereto, and that the present application is described in detail with reference to the foregoing examples: any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or perform equivalent substitution of some of the technical features, while remaining within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (7)
1. The distribution control method of the furnace tube machine table is characterized by comprising the following steps:
Obtaining a plurality of batches of wafers to be distributed; wherein each batch of wafers to be distributed comprises a plurality of wafers to be distributed;
Grouping based on order information of a plurality of batches of wafers to be distributed, and determining a plurality of groups of wafers to be distributed; wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed;
When a plurality of wafers to be distributed enter a plurality of station entering machines of a furnace tube machine, determining a first group of wafers to be distributed based on the priority of each group of wafers to be distributed, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority;
After the first group of wafers to be distributed is distributed, determining a second group of wafers to be distributed to distribute based on a second priority among the priorities of a plurality of groups of wafers to be distributed until the distribution of each group of wafers to be distributed is completed;
after determining the first group of wafers to be distributed based on the priorities of the groups of wafers to be distributed, the distribution control method further comprises the following steps:
processing the first group of wafers to be distributed, outputting the processed first group of wafers to be distributed from a station outlet of the furnace tube machine, and storing the wafers in a wafer carrier box;
The priority of the group of wafers to be allocated is determined by:
acquiring the corresponding remaining delivery time length of each group of wafers to be distributed;
Ascending time sequencing is carried out on each of the remaining delivery time lengths, and the longest remaining delivery time length and the shortest remaining delivery time length are determined according to the sequenced remaining delivery time lengths;
And setting the priority of the group of wafers to be distributed corresponding to the longest residual delivery time as the lowest priority, and setting the priority of the group of wafers to be distributed corresponding to the shortest residual delivery time as the highest priority.
2. The allocation control method according to claim 1, wherein the priority of the group of wafers to be allocated is determined by the steps of:
detecting whether order information corresponding to the group of wafers to be distributed is an urgent order;
if yes, the priority corresponding to the group of wafers to be distributed is increased.
3. The distribution control method according to claim 1, wherein the priority order of the plurality of wafers to be distributed in the same group of wafers to be distributed is identical.
4. The allocation control method according to claim 1, wherein after the first group of wafers to be allocated is determined based on the priority of each of the groups of wafers to be allocated, the allocation control method further comprises:
detecting whether the number of the wafers to be distributed entering the first group of the station entering machine table meets the preset entering number or not;
if not, obtaining a reference wafer consistent with the processing requirement of the first group of wafers to be distributed, and distributing the first group of wafers to be distributed and the reference wafer together.
5. An allocation control device of a furnace tube machine, which is characterized by comprising:
The acquisition module is used for acquiring a plurality of batches of wafers to be distributed; wherein each batch of wafers to be distributed comprises a plurality of wafers to be distributed;
The grouping module is used for grouping based on order information of a plurality of batches of wafers to be dispatched, and determining a plurality of groups of wafers to be distributed; wherein the group of wafers to be distributed comprises at least two batches of wafers to be distributed;
The first distribution module is used for determining a first group of wafers to be distributed based on the priority of each group of wafers to be distributed when the plurality of groups of wafers to be distributed enter a plurality of station entering machines of the furnace tube machine, and distributing the first group of wafers to be distributed; the priority of the first group of wafers to be distributed is the highest priority;
The second distribution module is used for determining the distribution of the wafers to be distributed in the second group based on the second priority among the priorities of the wafers to be distributed in the plurality of groups after the distribution of the wafers to be distributed in the first group is completed, and the distribution of the wafers to be distributed in each group is completed;
The distribution control device also comprises a processing module, wherein the processing module is used for:
processing the first group of wafers to be distributed, outputting the processed first group of wafers to be distributed from a station outlet of the furnace tube machine, and storing the wafers in a wafer carrier box;
The grouping module determines the priority of the group of wafers to be distributed by:
acquiring the corresponding remaining delivery time length of each group of wafers to be distributed;
Ascending time sequencing is carried out on each of the remaining delivery time lengths, and the longest remaining delivery time length and the shortest remaining delivery time length are determined according to the sequenced remaining delivery time lengths;
And setting the priority of the group of wafers to be distributed corresponding to the longest residual delivery time as the lowest priority, and setting the priority of the group of wafers to be distributed corresponding to the shortest residual delivery time as the highest priority.
6. An electronic device, comprising: the method for controlling the distribution of the furnace tube machine according to any one of claims 1 to 4 comprises a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, the processor and the memory are communicated through the bus when the electronic equipment is running, and the machine-readable instructions are executed by the processor.
7. A computer-readable storage medium, wherein a computer program is stored on the computer-readable storage medium, and the computer program when executed by a processor performs the steps of the allocation control method of the furnace platen according to any one of claims 1 to 4.
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| CN202310226989.7A CN116207013B (en) | 2023-03-10 | 2023-03-10 | Distribution control method and device for furnace tube machine, electronic equipment and storage medium |
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| CN116207013A (en) | 2023-06-02 |
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