CN116206996B - Silicon wafer sheet resistance measuring device and measuring method - Google Patents
Silicon wafer sheet resistance measuring device and measuring method Download PDFInfo
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- CN116206996B CN116206996B CN202310493882.9A CN202310493882A CN116206996B CN 116206996 B CN116206996 B CN 116206996B CN 202310493882 A CN202310493882 A CN 202310493882A CN 116206996 B CN116206996 B CN 116206996B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention relates to the technical field of silicon wafer processing automation equipment, in particular to a silicon wafer sheet resistance measuring device and a measuring method, wherein the silicon wafer sheet resistance measuring device comprises a storage mechanism, a sheet resistance measuring mechanism and a transfer mechanism, the storage mechanism is used for storing a flower basket loaded with silicon wafers, and the silicon wafers are placed in the flower basket at intervals in multiple layers; the sheet resistance measuring mechanism is positioned above the storage mechanism and comprises a measuring platform for placing a silicon wafer and a sheet resistance measurer; the transfer mechanism is positioned at one side of the storage mechanism and comprises a grabbing component, a horizontal stroke component and a vertical stroke component, wherein the grabbing component is used for grabbing a silicon wafer from the flower basket and placing the silicon wafer on the measurement platform, grabbing the silicon wafer from the measurement platform after measurement is completed and placing the silicon wafer back into the flower basket, the grabbing component horizontally moves under the driving of the horizontal stroke component, and the grabbing component vertically moves under the driving of the vertical stroke component; the invention has compact integral structure, small occupied area and high measurement efficiency, and is beneficial to improving the fluency and working efficiency of the integral silicon wafer processing procedure.
Description
Technical Field
The invention relates to the technical field of automatic silicon wafer processing equipment, in particular to a silicon wafer sheet resistance measuring device and a silicon wafer sheet resistance measuring method.
Background
Solar cells are a vast semiconductor diode that converts energy based on semiconductor materials. Currently, silicon solar cells dominate in the photovoltaic industry. Silicon crystals are commonly used as a substrate for solar cells, and cylindrical single crystal silicon rods are cut into pieces, so that the quality of the silicon wafers determines the performance of the solar cells to a large extent.
Industrial silicon is prepared from quartz sand by a carbon reduction method, and metal impurities such as iron, aluminum, calcium, magnesium and the like are removed by a purification process, and then high-purity polysilicon is obtained by reduction deposition; the purity of the polysilicon does not reach the purity of the silicon wafer required by the solar cell, so that further purification is needed to obtain monocrystalline silicon. Currently, a single crystal silicon manufactured by the Czochralski method is mostly used, and a polycrystalline silicon is melted by heating in a quartz crucible, a dopant is added, and a small piece of seed crystal is used to pull a cylindrical single crystal silicon from the molten silicon. The resistivity of single crystal silicon will vary due to the different doping concentrations.
The silicon wafer has quite wide resistivity range, and can obtain higher open-circuit voltage and photoelectric conversion efficiency for the solar cell, and the open-circuit voltage of the solar cell manufactured by the high-resistivity silicon wafer is lower, so that the filling factor is reduced, and the conversion efficiency is very low. Therefore, the resistivity value of the silicon wafer needs to be precisely controlled in the silicon wafer production process, and the silicon wafer needs to be detected by a sheet resistance measuring device in the production process so as to ensure that the resistivity of the silicon wafer is controlled within a certain range.
The conventional silicon wafer sheet resistance measuring device is generally arranged in a sheet loading and unloading process area in the whole silicon wafer production process, the circulation beat of a basket for containing silicon wafers is easy to influence, the conventional sheet resistance measuring device is only suitable for the occasion that the basket is horizontally placed, after the wafer is taken and detected in the detection process, the basket cannot be put back to the original basket when the wafer is taken, the sheet resistance measuring process time is longer, the process smoothness and the working efficiency of the whole silicon wafer production process are further influenced, and meanwhile, the conventional sheet resistance measuring device also has the problem of large occupied area. The above problems exist with an automatic sheet resistance measuring device as disclosed in chinese patent publication No. CN 107591342B.
Disclosure of Invention
The invention aims at the problems and provides the silicon wafer sheet resistance measuring device which can be arranged in a basket carrying process area of a silicon wafer production process, can take and return the original basket into the wafer, and has compact structure and small occupied area.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
the silicon wafer sheet resistance measuring device comprises a storage mechanism, a sheet resistance measuring mechanism and a transfer mechanism, wherein the storage mechanism is used for storing a flower basket loaded with silicon wafers, and the silicon wafers are placed in the flower basket at intervals in multiple layers; the sheet resistance measuring mechanism is positioned above the storage mechanism and comprises a measuring platform for placing a silicon wafer and a sheet resistance measurer for measuring the sheet resistance of the silicon wafer; the transfer mechanism is positioned at one side of the storage mechanism and comprises a grabbing component, a horizontal stroke component and a vertical stroke component; the grabbing component is driven by the horizontal stroke component and the vertical stroke component, is used for grabbing silicon chips from the flower basket during measurement and placing the silicon chips on the measurement platform, and grabbing the silicon chips from the measurement platform after measurement is completed and placing the silicon chips back into the flower basket; when the grabbing component is positioned at the height of the flower basket, the horizontal stroke component drives the grabbing component to horizontally move between one side of the flower basket and the interior of the flower basket; when the grabbing component is positioned at the height of the measuring platform, the horizontal stroke component drives the grabbing component to horizontally move between one side of the measuring platform and the upper side of the measuring platform; when the grabbing component is positioned on one side of the flower basket and the measuring platform, the vertical travel component drives the grabbing component to vertically move on one side of the flower basket and the measuring platform; when the grabbing component is positioned above the measuring platform, the vertical stroke component drives the grabbing component to vertically move between the upper part of the measuring platform and the measuring platform; when the grabbing component is located in the flower basket, the vertical stroke component drives the grabbing component to vertically move in a gap between silicon wafer layers.
Specifically, measuring platform includes the mounting panel, places board and lift cylinder, the vertical setting of mounting panel, place the board towards the basket level setting and the side is fixed in on the wall of mounting panel, the sheet resistance caliber is located to place the board top and with place the board parallel, and the probe orientation is placed the board, the lift cylinder body is fixed in on the wall of mounting panel, and the output shaft is connected with the top surface of sheet resistance caliber downwards.
Further, the device also comprises a regulating mechanism arranged on the measuring platform, wherein the regulating mechanism comprises regulating plates symmetrically arranged on two opposite sides of the placing plate, and the two regulating plates are driven to move by regulating cylinders respectively.
Further, the measuring platform further comprises a pressing plate cylinder and a flower basket pressing plate which is arranged below the placing plate in parallel, the pressing plate cylinder is arranged on the bottom surface of the placing plate, and the output shaft is downwards connected with the top of the flower basket pressing plate.
Specifically, deposit the mechanism and include basket of flowers and deposit the platform, deposit the platform including the bottom plate that the level set up and set up in the limiting frame that is used for restricting the basket of flowers position of bottom plate upper surface.
Further, the limiting frame is matched with the bottom of the flower basket in shape, and is formed by surrounding four baffle plates in vertical arrangement, and each baffle plate comprises two baffle plate blocks arranged at intervals.
Further, still include limiting plate and spacing cylinder, the limiting plate sets up between two baffle blocks of a baffle, spacing cylinder sets up on the bottom plate, drives the limiting plate and moves to spacing frame inside along the bottom plate surface.
Specifically, snatch the subassembly and include the installation arm and be used for adsorbing the sucking disc of silicon chip, horizontal stroke subassembly includes assorted horizontal guide rail and horizontal slider, vertical stroke subassembly includes assorted vertical guide rail and vertical slider, the sucking disc passes through the installation arm and is connected with horizontal slider, horizontal guide rail installs on vertical slider.
Specifically, the sucking disc includes the suction plate, be provided with connecting hole and suction hole on the suction plate, the connecting hole with the suction hole communicates through the runner of suction plate inside, the connecting hole is connected with the vacuum generator who sets up on the horizontal stroke subassembly, the suction hole produces the suction and adsorbs the silicon chip.
Based on the silicon wafer sheet resistance measuring device, the invention provides a silicon wafer sheet resistance measuring method, which comprises the following steps:
s1, preparing a silicon wafer to be tested: the flower basket is vertically arranged in the storage mechanism, and silicon wafers are arranged at intervals in multiple layers;
s2, first measurement:
the grabbing component grabs silicon chips from a first layer of the flower basket and places the silicon chips on the measuring platform under the driving of the horizontal stroke component and the vertical stroke component;
the sheet resistance measurer measures the sheet resistance of the silicon chip placed on the measuring platform;
after the measurement is finished, the grabbing component grabs the silicon wafer from the measurement platform under the drive of the horizontal stroke component and the vertical stroke component and places the silicon wafer back to the first layer of the flower basket;
s3, second measurement: the grabbing component grabs the silicon wafer from the second layer of the flower basket under the drive of the horizontal stroke component and the vertical stroke component and places the silicon wafer on the measuring platform;
the sheet resistance measurer measures the sheet resistance of the silicon chip placed on the measuring platform;
after the measurement is finished, the grabbing component grabs the silicon wafer from the measurement platform under the drive of the horizontal stroke component and the vertical stroke component and places the silicon wafer back to the second layer of the flower basket;
s4, the same is done until the sheet resistance measurement of all the silicon wafers in the flower basket is completed;
s5, removing the measured flower basket from the storage mechanism, placing a new flower basket carrying the silicon wafers to be measured into the storage mechanism, preparing the measurement of the silicon wafers to be measured in the new flower basket, and repeating the steps S2-S4 until the sheet resistance measurement of all the silicon wafers to be measured is completed.
From the above description, it can be seen that the present invention has the following advantages:
1. in the silicon wafer sheet resistance measuring device, the flower basket of the silicon wafer storage mechanism is vertically arranged, the sheet resistance measuring mechanism is positioned above the flower basket, the transfer mechanism is positioned at one side of the flower basket, and the whole structure is compact and the occupied area is small;
2. according to the silicon wafer sheet resistance measuring device, the transfer mechanism can realize in-situ suction and replacement of the silicon wafer, the measuring efficiency is high, the circulation beat of the basket in the whole silicon wafer processing procedure is not influenced, and the smoothness and the working efficiency of the whole procedure are improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of a sheet resistance measuring mechanism according to the present invention;
FIG. 3 is a schematic view of a part of the sheet resistance measuring mechanism of the present invention;
FIG. 4 is a schematic view of the storage mechanism of the present invention;
FIG. 5 is a schematic view of the structure of the bottom surface of the suction cup of the present invention;
reference numerals:
1. a storage mechanism:
11. flower basket, 111, upper top plate, 112, lower bottom plate, 113 and support rod;
12. the storage platform, 121, a bottom plate, 122, a limiting frame, 123 baffle plates, 1231 baffle plates, 124, a limiting plate and 125, and a limiting cylinder;
13. a silicon wafer;
2. a sheet resistance measuring mechanism;
21. measuring platform, 211, mounting plate, 212, placing plate, 213, lifting cylinder, 214, supporting plate, 215 and flower basket pressing plate;
22. a sheet resistance measurer 221. A probe;
23. a regulating mechanism, 231, a regulating plate and 232, a regulating cylinder;
3. and a transfer mechanism:
31. the device comprises a grabbing component, a 311, a mounting arm, a 3111 triangular supporting plate, a 312, a sucker, 3121, a sucker plate, 3122, a connecting hole and 3123, and a sucker hole;
32. a horizontal travel assembly, 321 horizontal guide rails, 322 horizontal sliders;
33. a vertical travel assembly, 331 vertical guide rail;
34. and a vacuum generator.
Detailed Description
Embodiments of the present invention will be described in detail with reference to fig. 1 to 5, but do not limit the claims of the present invention.
As shown in fig. 1, a silicon wafer sheet resistance measuring device comprises a storage mechanism 1, a sheet resistance measuring mechanism 2 and a transfer mechanism 3, wherein:
(1) As shown in fig. 1 and 4, the storage mechanism 1 is used for storing a basket 11 loaded with silicon wafers, and the silicon wafers 13 are placed in the basket 11 at intervals of multiple layers; the storage mechanism comprises a flower basket 11 and a storage platform 12, the storage platform 12 comprises a bottom plate 121 which is horizontally arranged and a limiting frame 122 which is arranged on the upper surface of the bottom plate and used for limiting the position of the flower basket, the shape of the limiting frame 122 is matched with that of the bottom of the flower basket 11, four sides of each of four baffle plates 123 which are vertically arranged are surrounded, and each baffle plate 123 comprises baffle plate blocks 1231 which are arranged at two intervals. The flower basket 11 is a flower basket structure commonly used in industry and comprises an upper top plate 111, a lower bottom plate 112 and a plurality of supporting rods 113 for connecting the upper top plate 111 and the lower bottom plate 112, wherein a plurality of slots are formed in the supporting rods 113 at equal intervals, a space for storing silicon wafers is enclosed by the upper top plate, the lower bottom plate and the plurality of supporting rods, and each silicon wafer 13 is fixedly placed in the flower basket through the slots, namely a plurality of silicon wafers are placed in the flower basket at intervals in a multi-layer manner;
(2) As shown in fig. 1 to 3, the sheet resistance measuring mechanism 2 is located above the storage mechanism and comprises a measuring platform 21 for placing a silicon wafer and a sheet resistance measurer 22 for measuring the sheet resistance of the silicon wafer; specifically, the measurement platform 21 includes a mounting plate 211, a placing plate 212 and a lifting cylinder 213, the mounting plate 211 is vertically arranged, the placing plate 212 is horizontally arranged towards the flower basket, the side edge of the placing plate is fixed on the wall surface of the mounting plate, the sheet resistance measurer 22 is positioned above the placing plate 212 and parallel to the placing plate 212, the probe 221 is directed towards the placing plate, the cylinder body of the lifting cylinder 213 is fixed on the wall surface of the mounting plate 211, and the output shaft is downwards connected with the top surface of the sheet resistance measurer 22; the sheet resistance measurer 22 can adopt a DF-100__ De-meter NAPSON sheet resistance tester, and can also adopt sheet resistance testers of other types conforming to the installation structure of the invention;
(3) As shown in fig. 1, the transfer mechanism 3 is located at one side of the storage mechanism, and includes a grabbing component 31, a horizontal stroke component 32 and a vertical stroke component 33, where the grabbing component 31 is used to grab a silicon wafer 13 from a basket 11 and place the silicon wafer 13 on a measurement platform 21, and after measurement is completed, grab the silicon wafer 13 from the measurement platform 21 and place the silicon wafer back into the basket 11, the grabbing component 31 moves in the horizontal direction under the driving of the horizontal stroke component 32, and the grabbing component 31 moves in the vertical direction under the driving of the vertical stroke component 33, and specifically includes:
when the grabbing component 31 is positioned at the height of the basket 11, the horizontal stroke component 32 drives the grabbing component 31 to horizontally move between one side of the basket 11 and the interior of the basket 11;
when the grabbing component 31 is located at the height of the measuring platform 21, the horizontal stroke component 32 drives the grabbing component 31 to horizontally move between one side of the measuring platform 21 and above the measuring platform 21;
when the grabbing component 31 is located on one side of the flower basket 11 and the measuring platform 21, the vertical stroke component 33 drives the grabbing component 31 to vertically move on one side of the flower basket 11 and the measuring platform 21;
when the grabbing component 31 is located above the measuring platform 21, the vertical stroke component 33 drives the grabbing component 31 to vertically move between the upper side of the measuring platform 21 and the measuring platform 21;
when the grabbing component 31 is positioned in the basket 11, the vertical stroke component 33 drives the grabbing component 31 to vertically move in a gap between layers of the silicon wafer 13;
the grabbing component 31 comprises a mounting arm 311 and a sucker 312 for absorbing silicon wafers, the horizontal stroke component 32 comprises a horizontal guide rail 321 and a horizontal sliding block 322 which are matched, the vertical stroke component 33 comprises a vertical guide rail 331 and a vertical sliding block which are matched, the sucker 312 is connected with the horizontal sliding block 322 through the mounting arm 311, the horizontal guide rail 321 is arranged on the vertical sliding block, the sucker 312 comprises a suction plate 3121, a connecting hole 3122 and a suction hole 3123 are formed in the suction plate, the connecting hole 3122 and the suction hole 3123 are communicated through a runner inside the suction plate 3121, the connecting hole 3122 is connected with a vacuum generator 34 arranged on the horizontal stroke component 32, and the suction hole 3123 generates suction to absorb the silicon wafers. In this embodiment, the driving mechanism of the horizontal smoothing block and the driving mechanism of the vertical sliding block are not shown in the drawings, and those skilled in the art can understand and adopt conventional driving sources such as a motor, a cylinder, etc. to drive the horizontal sliding block and the vertical sliding block, so that the horizontal sliding block moves along the horizontal guide rail, and the vertical sliding block moves along the vertical guide rail, which is not repeated herein.
The working principle of the embodiment is as follows:
firstly, placing a flower basket into a limiting frame of a storage mechanism, moving a sucker of a grabbing assembly in the horizontal direction along a horizontal guide rail under the drive of a horizontal sliding block, and moving the horizontal guide rail in the vertical direction along a vertical guide rail under the drive of a vertical sliding block, so that the sucker can extend above a silicon wafer of a first layer in the flower basket to suck the silicon wafer;
after the suction is finished, the suction cup is moved out of the flower basket and moves to the upper part of the placing plate by utilizing the movement of the horizontal sliding block and the vertical sliding block, at the moment, the vacuum generator is controlled, so that the suction cup loses suction, the silicon wafer falls on the placing plate under the action of gravity, and the suction cup is moved from the upper part of the placing plate;
starting a lifting cylinder, driving a sheet resistance measurer to move downwards by the lifting cylinder, enabling a probe to contact the upper surface of the silicon wafer, further measuring the sheet resistance of the silicon wafer, lifting the lifting cylinder after the measurement is completed, and removing the sheet resistance measurer from the surface of the silicon wafer;
after the silicon wafer is sucked, the suction cup is also used for reinserting the silicon wafer into a slot of a first layer of a flower basket for sucking the silicon wafer, putting down the silicon wafer and then removing the suction cup from the first layer by utilizing the movement of the horizontal sliding block and the vertical sliding block;
the sucker is repositioned, and the second layer entering the flower basket sucks the silicon wafers, and the process is circulated in this way, so that the sheet resistance measurement of all the silicon wafers is completed.
In actual operation, the lowest layer or the uppermost layer of the basket can be used as the first layer to absorb silicon wafers layer by layer, and when the basket is not fully loaded, the silicon wafers can be absorbed layer by layer from a certain layer.
In order to further improve the technical effect of the scheme, the scheme is further improved, and specifically comprises the following steps:
(1) Considering that in the measurement platform 21, the lifting cylinder 213 frequently drives the sheet resistance measurer 22 to press on the placing plate 212, the placing plate 212 needs to have stable bearing capacity, and only the side edge of the placing plate 212 is connected and fixed with the mounting plate 211, so that the design of the supporting structure is increased on the basis of the original scheme, so as to improve the mounting stability of the placing plate, and the specifically adopted technical scheme is as follows: two support plates 214 are symmetrically arranged below the placing plate, the support plates 214 are right-angled triangles, and two right-angle sides are respectively fixed on the wall surface of the mounting plate 211 and the bottom surface of the placing plate 212, and the bearing capacity and the mounting stability of the placing plate 212 are improved through the support plates 214.
(2) When the flower basket is put into the limit frame 122 of the storage mechanism, the size of the limit frame 122 is slightly larger than that of the flower basket 11 based on matching suitability and convenience of placement, but because the grabbing component 31 needs to frequently pick and place the silicon wafers 13 from the flower basket 11, the grabbing component inevitably easily causes slight displacement problem of the flower basket in the limit frame 122, so that the limit mechanism is additionally arranged on the storage platform 12 to ensure that the flower basket cannot shift in the working process, and the limit mechanism is specifically designed as follows: including limiting plate 124 and spacing cylinder 125, the limiting plate sets up between two baffle blocks 1231 of arbitrary one baffle 123, and spacing cylinder 124 sets up on bottom plate 121, drives limiting plate 125 along bottom plate 121 surface to spacing frame 122 inside removal, and then realizes further spacing location of basket of flowers 13 in spacing frame 122 region. In specific application, more than one limiting mechanism (for example, two opposite baffle plates are both additionally provided with limiting mechanisms) can be additionally arranged according to the limiting requirement, so that the stability of the flower basket position is improved.
(3) In order to further guarantee the stability of basket position in the measurement process, parallel arrangement basket clamp plate 215 between measuring platform 21 and basket 11 top, drive basket clamp plate through the clamp plate cylinder and move down and press on the roof on the basket, realize the top location of basket, the clamp plate cylinder sets up on placing the board 212 bottom surface, and the output shaft is connected with basket clamp plate 215 top downwards.
(4) In the detection of the invention, the sheet resistance of the silicon wafer 13 is detected by the sheet resistance measurer 22, and as the silicon wafer is grabbed and put down by the sucker 312 of the grabbing component 31, the silicon wafer 13 is likely to generate displacement or inaccurate placement position in the process of being placed on the placement plate 212, and therefore, the leveling mechanism 23 is additionally arranged on the measurement platform, the leveling mechanism 23 comprises leveling plates 231 symmetrically arranged on two opposite sides of the placement plate, and the two leveling plates 231 are respectively driven to move by the leveling cylinders 232. When the silicon wafer 13 is placed on the placing plate 212, the regulating cylinder 232 drives the regulating plate 231 to move, so that the silicon wafer 13 is limited in the fixed area of the placing plate 212.
(5) In order to further avoid the silicon chip to shift on placing the board 212, set up the absorption hole on placing the board 212 upper surface, the absorption hole is connected with the air supply (such as vacuum generator) through placing the runner of board inside, when the silicon chip 13 is placed on placing the board 212 surface, can adsorb the silicon chip 13 through the absorption, and when the silicon chip 13 is moved to placing the board 122 top by sucking disc 312, the absorption hole of placing the board 212 also can reverse the blowing, sweep the lower surface of silicon chip 13, in order to improve the cleanliness factor of silicon chip 13 surface, simultaneously when placing the board 212 empty, also can control the absorption Kong Fanxiang of placing the board 212 to blow, be used for sweeping and placing the board 212 upper surface itself. In specific application, the area of the placing plate 212 is larger than the area of the silicon wafer, the silicon wafer 13 is placed in the fixing area of the placing plate 212, the adsorption holes are formed in the fixing area, the fixing area is matched with the detection area of the sheet resistance measurer 22, or the fixing area can be designed into a sinking structure, namely, the upper surface of the fixing area is slightly lower than the upper surfaces of other positions of the placing plate, so that the silicon wafer 13 can be limited in the fixing area, and even if the placing plate 212 has no adsorption function, the silicon wafer can be prevented from being displaced during detection.
(6) In order to facilitate connection of the suction cup 312 and the horizontal stroke assembly 32, the mounting arm 311 of the grabbing assembly 31 is set to be an L-shaped connecting plate, one side of the L-shaped connecting plate is parallel to the horizontal guide rail 321, the other side of the L-shaped connecting plate is orthogonally connected with the suction cup 312, and a triangular support plate 3111 can be additionally arranged at a corner of the L-shaped structure to strengthen the structural strength of the L-shaped connecting plate.
(7) The vacuum generator 34 can be controlled to enable the suction Kong Fanxiang of the suction disc 312 to blow, so that the foreign matter on the surface of the silicon wafer 13 can be purged, and the cleanliness of the silicon wafer during detection can be improved.
When the invention is practically applied, the mounting plate of the sheet resistance measuring mechanism and the vertical guide rail of the transfer mechanism can be mounted on the frame of the silicon wafer processing assembly line, and the sheet resistance measuring mechanism and the vertical guide rail are preferably arranged in the basket carrying process area, so that the occupied area of equipment can be saved, the circulation beat of the basket can not be influenced, and the smoothness and the working efficiency of the whole process can be improved. The measuring result of the sheet resistance measurer can be fed back to the position of a detecting person in real time through a control system, the silicon wafer is subjected to real-time manual screening, a silicon wafer disqualification placing basket can be additionally arranged on the basis of the real-time detecting result, the disqualification silicon wafer is placed into the silicon wafer disqualification placing basket in real time through controlling the path of the grabbing component, and the automatic screening and collection of qualified products and unqualified products are realized.
The invention discloses a silicon wafer sheet resistance measuring device, and provides a silicon wafer sheet resistance measuring method of the silicon wafer sheet resistance measuring device, which comprises the following steps:
s1, preparing a silicon wafer to be tested: vertically placing a basket loaded with silicon wafers to be tested in a storage mechanism, wherein the silicon wafers are placed at intervals in multiple layers;
s2, first measurement:
the grabbing component grabs silicon chips from a first layer of the flower basket and places the silicon chips on the measuring platform under the driving of the horizontal stroke component and the vertical stroke component;
the sheet resistance measurer measures the sheet resistance of the silicon chip placed on the measuring platform;
after the measurement is finished, the grabbing component grabs the silicon wafer from the measurement platform under the drive of the horizontal stroke component and the vertical stroke component and places the silicon wafer back to the first layer of the flower basket;
s3, second measurement: the grabbing component grabs the silicon wafer from the second layer of the flower basket under the drive of the horizontal stroke component and the vertical stroke component and places the silicon wafer on the measuring platform;
the sheet resistance measurer measures the sheet resistance of the silicon chip placed on the measuring platform;
after the measurement is finished, the grabbing component grabs the silicon wafer from the measurement platform under the drive of the horizontal stroke component and the vertical stroke component and places the silicon wafer back to the second layer of the flower basket;
s4, the same is done until the sheet resistance measurement of all the silicon wafers in the flower basket is completed;
s5, removing the measured flower basket from the storage mechanism, placing a new flower basket carrying the silicon wafers to be measured into the storage mechanism, preparing the measurement of the silicon wafers to be measured in the new flower basket, and repeating the steps S2-S4 until the sheet resistance measurement of all the silicon wafers to be measured is completed.
In summary, the invention has the following advantages:
1. in the silicon wafer sheet resistance measuring device, the flower basket of the silicon wafer storage mechanism is vertically arranged, the sheet resistance measuring mechanism is positioned above the flower basket, the transfer mechanism is positioned at one side of the flower basket, and the whole structure is compact and the occupied area is small;
2. according to the silicon wafer sheet resistance measuring device, the transfer mechanism can realize in-situ suction and replacement of the silicon wafer, the sheet resistance measuring process is compact in rhythm, the circulation beat of the basket in the whole silicon wafer processing process is not influenced, and the smoothness and the working efficiency of the whole process are improved.
It is to be understood that the foregoing detailed description of the invention is merely illustrative of the invention and is not limited to the embodiments of the invention. It will be understood by those of ordinary skill in the art that the present invention may be modified or substituted for elements thereof to achieve the same technical effects; as long as the use requirement is met, the invention is within the protection scope of the invention.
Claims (3)
1. The device for measuring the sheet resistance of the silicon wafer comprises a storage mechanism (1), a sheet resistance measuring mechanism (2) and a transfer mechanism (3), and is characterized in that,
the storage mechanism (1) is used for storing flower baskets (11) loaded with silicon wafers (13) to be tested, and the silicon wafers (13) are placed in the flower baskets (11) at intervals in multiple layers;
the sheet resistance measuring mechanism (2) is positioned above the storage mechanism (1) and comprises a measuring platform (21) for placing a silicon wafer (13) and a sheet resistance measurer (22) for measuring the sheet resistance of the silicon wafer;
the transfer mechanism (3) is positioned at one side of the storage mechanism (1) and comprises a grabbing component (31), a horizontal stroke component (32) and a vertical stroke component (33), wherein the grabbing component (31) is driven by the horizontal stroke component (32) and the vertical stroke component (33) and is used for grabbing a silicon wafer (13) from a flower basket (11) during measurement and placing the silicon wafer (13) on a measurement platform (21) and grabbing the silicon wafer (13) from the measurement platform (21) after measurement is completed and placing the silicon wafer back into the flower basket (11);
when the grabbing component (31) is positioned at the height of the flower basket (11), the horizontal stroke component (32) drives the grabbing component (31) to horizontally move between one side of the flower basket (11) and the inside of the flower basket (11); when the grabbing component (31) is positioned at the height of the measuring platform (21), the horizontal stroke component (32) drives the grabbing component (31) to horizontally move between one side of the measuring platform (21) and the upper side of the measuring platform (21);
when the grabbing component (31) is positioned on one side of the flower basket (11) and the measuring platform (21), the vertical stroke component (33) drives the grabbing component (31) to vertically move on one side of the flower basket (11) and the measuring platform (21); when the grabbing component (31) is located above the measuring platform (21), the vertical stroke component (33) drives the grabbing component (31) to vertically move between the upper side of the measuring platform (21) and the measuring platform (21); when the grabbing component (31) is positioned in the flower basket (11), the vertical stroke component (33) drives the grabbing component (31) to vertically move in a gap between layers of the silicon wafer (13);
the measuring platform (21) comprises a mounting plate (211), a placing plate (212) and a lifting cylinder (213), wherein the mounting plate (211) is vertically arranged, the placing plate (212) is horizontally arranged towards the flower basket (11) and the side edge of the placing plate is fixed on the wall surface of the mounting plate (211), the sheet resistance measurer (22) is positioned above the placing plate (212) and parallel to the placing plate (212), the probe (221) faces the placing plate (212), the cylinder body of the lifting cylinder (213) is fixed on the wall surface of the mounting plate (211), and the output shaft is downwards connected with the top surface of the sheet resistance measurer (22); the device further comprises a regulating mechanism (23) arranged on the measuring platform (21), the regulating mechanism (23) comprises regulating plates (231) symmetrically arranged on two opposite side edges of the placing plate (212), and the two regulating plates (231) are respectively driven to move by a regulating cylinder (232); the measuring platform (21) further comprises a pressing plate cylinder and a flower basket pressing plate (215) which is arranged below the placing plate (212) in parallel, the pressing plate cylinder is arranged on the bottom surface of the placing plate (212), and an output shaft is downwards connected with the top of the flower basket pressing plate (215); the upper surface of the placing plate (212) is provided with an adsorption hole, the adsorption hole is connected with an air source through a runner in the placing plate, and the adsorption hole can adsorb or blow air;
the storage mechanism (1) comprises a flower basket (11) and a storage platform (12), wherein the storage platform (12) comprises a bottom plate (121) which is horizontally arranged and a limiting frame (122) which is arranged on the upper surface of the bottom plate (121) and used for limiting the position of the flower basket (11); the shape of the limiting frame (122) is matched with the bottom of the flower basket (11), the limiting frame is formed by surrounding four sides of four baffle plates (123) which are vertically arranged, and each baffle plate (123) comprises two baffle plates (1231) which are arranged at intervals; the device further comprises a limiting plate (124) and a limiting cylinder (125), wherein the limiting plate (124) is arranged between two baffle blocks (1231) of one baffle (123), the limiting cylinder (125) is arranged on the bottom plate (121), and the limiting plate (124) is driven to move towards the inside of the limiting frame (122) along the surface of the bottom plate (121);
the grabbing component (31) comprises a mounting arm (311) and a sucker (312) for adsorbing a silicon wafer, the horizontal stroke component (32) comprises a horizontal guide rail (321) and a horizontal sliding block (322) which are matched, the vertical stroke component (33) comprises a vertical guide rail (331) and a vertical sliding block which are matched, the sucker (312) is connected with the horizontal sliding block (322) through the mounting arm (311), and the horizontal guide rail (321) is mounted on the vertical sliding block.
2. The wafer sheet resistance measurement device according to claim 1, wherein the suction cup (312) comprises a suction plate (3121), a connection hole (3122) and a suction hole (3123) are arranged on the suction plate (3121), the connection hole (3122) and the suction hole (3123) are communicated through a runner inside the suction plate (3121), the connection hole (3122) is connected with a vacuum generator (34) arranged on a horizontal stroke assembly (32), and the suction hole (3123) generates suction force to adsorb the wafer.
3. A method for measuring sheet resistance of a silicon wafer, which is applied to the device for measuring sheet resistance of a silicon wafer according to claim 1 or 2, and comprises the following steps:
s1, preparing a silicon wafer to be tested: the flower basket (11) loaded with the silicon wafers (13) to be tested is vertically placed in the storage mechanism (1), and the silicon wafers (13) are placed at intervals in multiple layers;
s2, first measurement:
the grabbing component (31) grabs silicon chips (13) from a first layer of the flower basket (11) and is placed on the measuring platform (21) under the driving of the horizontal stroke component (32) and the vertical stroke component (33);
the sheet resistance measurer (22) performs sheet resistance measurement on the silicon wafer (13) placed on the measurement platform (21);
after the measurement is finished, the grabbing component (31) grabs the silicon wafer (13) from the measurement platform (21) under the drive of the horizontal stroke component (32) and the vertical stroke component (33) and places the silicon wafer back to the first layer of the flower basket (11);
s3, second measurement: the grabbing component (31) grabs the silicon wafer (13) from the second layer of the flower basket (11) and is placed on the measuring platform under the drive of the horizontal stroke component (32) and the vertical stroke component (33);
the sheet resistance measurer (22) performs sheet resistance measurement on the silicon wafer (13) placed on the measurement platform (21);
after the measurement is finished, the grabbing component (31) grabs the silicon wafer (13) from the measurement platform (21) under the drive of the horizontal stroke component (32) and the vertical stroke component (33) and places the silicon wafer back to the second layer of the flower basket (11);
s4, the same is done until the sheet resistance measurement of all the silicon wafers (13) in the flower basket (11) is completed;
s5, removing the measured flower basket (11) from the storage mechanism (1), placing a new flower basket carrying the silicon wafers to be measured into the storage mechanism (1), preparing the measurement of the silicon wafers to be measured (13) in the new flower basket, and repeating the steps S2-S4 until the sheet resistance measurement of all the silicon wafers to be measured (13) is completed.
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| CN202310493882.9A CN116206996B (en) | 2023-05-05 | 2023-05-05 | Silicon wafer sheet resistance measuring device and measuring method |
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| JP3878441B2 (en) * | 2001-07-18 | 2007-02-07 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| CN107591342B (en) * | 2017-10-23 | 2020-03-20 | 常州亿晶光电科技有限公司 | Automatic square resistance measuring equipment |
| CN210805703U (en) * | 2019-10-28 | 2020-06-19 | 厦门玖田自动化设备有限公司 | Solar cell resistance testing device |
| CN214391171U (en) * | 2020-12-31 | 2021-10-15 | 苏州虎奇翼自动化设备有限公司 | Resistor resistance value testing and sorting tool |
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