CN116206975A - Automatic sleeve forming equipment for electronic element - Google Patents
Automatic sleeve forming equipment for electronic element Download PDFInfo
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- CN116206975A CN116206975A CN202211591090.7A CN202211591090A CN116206975A CN 116206975 A CN116206975 A CN 116206975A CN 202211591090 A CN202211591090 A CN 202211591090A CN 116206975 A CN116206975 A CN 116206975A
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- 230000007246 mechanism Effects 0.000 claims abstract description 118
- 238000012546 transfer Methods 0.000 claims abstract description 37
- 238000005452 bending Methods 0.000 claims abstract description 35
- 238000000465 moulding Methods 0.000 claims abstract description 34
- 238000007599 discharging Methods 0.000 claims abstract description 30
- 238000007493 shaping process Methods 0.000 claims description 87
- 238000003825 pressing Methods 0.000 claims description 61
- 238000012937 correction Methods 0.000 claims description 42
- 210000000078 claw Anatomy 0.000 claims description 39
- 238000005520 cutting process Methods 0.000 claims description 32
- 238000005096 rolling process Methods 0.000 claims description 32
- 230000009471 action Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims 3
- 238000007906 compression Methods 0.000 claims 3
- 230000001105 regulatory effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000009740 moulding (composite fabrication) Methods 0.000 description 133
- 230000006872 improvement Effects 0.000 description 23
- 238000013461 design Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 7
- 230000004048 modification Effects 0.000 description 4
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- 238000000429 assembly Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 206010066054 Dysmorphism Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
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Abstract
The invention relates to the technical field of nonstandard automation, in particular to automatic sleeve forming equipment for electronic components, which comprises a frame, a feeding mechanism, a heat-shrinkable sleeve mechanism, a transferring mechanism, a forming sleeve mechanism and a discharging mechanism, wherein the feeding mechanism is arranged on one side of the frame and is used for feeding the electronic components; the heat-shrinkable sleeve mechanism is used for receiving the electronic components fed by the feeding mechanism and sleeving the electronic components; the transfer mechanism is used for grabbing and transferring the electronic element of the finished sleeve on the heat-shrinkable sleeve mechanism; the molding sleeve is used for receiving the electronic component transferred by the transfer mechanism, bending pins of the electronic component, and performing sleeve on the pins formed by the bending pins; the blanking mechanism is used for grabbing and blanking the electronic components of the sleeve after the bent pins are formed from the forming sleeve mechanism. The utility model discloses whole degree of automation is high, uses manpower sparingly, and structural accuracy is high, and production efficiency is high.
Description
Technical Field
The invention relates to the technical field of nonstandard automation, in particular to automatic sleeve forming equipment for electronic elements.
Background
Automation technology is widely used in industry, agriculture, military, scientific research, transportation, commerce, medical, services, and households. By adopting the automation technology, people can be liberated from heavy physical labor, partial mental labor and severe and dangerous working environments, the organ functions of the people can be expanded, the labor productivity is greatly improved, and the ability of the people to know and reform the world is enhanced. Large-scale complete equipment, also known as automation equipment, in an automation system. Refers to a process in which a machine or device automatically operates or controls in accordance with a prescribed program or instruction without human intervention.
In the production process of the electronic element diode, a sleeve is required to be sleeved outside, pins are bent and formed to a specified shape, the existing process is mostly completed through manual operation, pin bending is completed through a jig, the manual operation efficiency in the sleeve process is low, the precision is difficult to master, the production efficiency is low, and the labor cost is high.
Disclosure of Invention
In order to solve the problems, the invention provides an automatic sleeve forming device for electronic components, which is used for automatically feeding the diode of the electronic component, sleeving the diode on the diode after sleeving the diode by heat shrinkage fastening, transferring the diode to a forming sleeve mechanism by a transferring mechanism, bending and forming pins of the diode by the forming sleeve mechanism, sleeving the formed pins, and blanking after sleeving the formed pins, so that the automatic sleeve forming device for the electronic component, the bending and forming device for the electronic component and the pin sleeve are completed.
The technical scheme adopted by the invention is as follows: the automatic sleeve forming equipment for the electronic components comprises a frame, a feeding mechanism, a heat shrinkage sleeve mechanism, a transferring mechanism, a forming sleeve mechanism and a discharging mechanism, wherein the feeding mechanism is arranged on one side of the frame and is used for feeding the electronic components; the heat-shrinkable sleeve mechanism is used for receiving the electronic components fed by the feeding mechanism and sleeving the electronic components; the transfer mechanism is used for grabbing and transferring the electronic element of the finished sleeve on the heat-shrinkable sleeve mechanism; the molding sleeve is used for receiving the electronic component transferred by the transfer mechanism, bending pins of the electronic component, and performing sleeve on the pins formed by the bending pins; the blanking mechanism is used for grabbing and blanking the electronic components of the sleeve after the bent pins are formed from the forming sleeve mechanism.
The feeding mechanism comprises a feeding component for feeding the carrier tape of the electronic component, a cutting component for cutting the electronic component from the carrier tape, a positioning and feeding component for positioning and feeding the cut electronic component, and a feeding grabbing component for taking materials on the positioning and feeding component;
The electronic component pin straightening device is characterized in that correction assemblies for straightening pins of the electronic component are arranged on two sides of the positioning and feeding assembly, the positioning and feeding assembly comprises a jacking positioning module and a positioning and pushing module connected to the jacking positioning module, the positioning and pushing module is used for driving the jacking positioning module to move, and the jacking positioning module is used for positioning pins of the electronic component.
The heat-shrinkable sleeve mechanism comprises a first rotating disc device, a material pressing device, a sleeve device, a tube pressing device and a heat-shrinkable device, wherein a plurality of groups of fixing components are arranged on the first rotating disc device in a surrounding mode, and the fixing components are used for fixing electronic elements and driving the fixing components and the electronic elements to rotate and convey; the pressing device is used for pressing the electronic element fixed by the fixing component in place; the sleeve device is used for sleeving a sleeve on the electronic component fixed by the fixing component; the tube pressing device is used for pressing a sleeve sleeved by the electronic element into place; the heat shrinkage device is used for heat shrinkage of the sleeve on the electronic component.
The sleeve device comprises a sleeve discharging assembly, a correction guide assembly, a guide driving assembly, a sleeve cutting assembly and a sleeve positioning assembly, wherein the sleeve discharging assembly is used for sleeve discharging; the correction guide assembly is used for correcting and guiding the sleeve discharged by the sleeve discharging assembly; the guiding driving assembly comprises a driving roller, a driven roller and a driving module for driving the driving roller, wherein the driving module is used for driving the driving roller to rotate, and a gap for a sleeve to pass through is formed between the driving roller and the driven roller; the sleeve cutting assembly comprises a guide pipe connected to the lower side of the gap and a cutting module positioned on the lower side of the guide pipe, the guide pipe is used for receiving the sleeve led in by the guide driving assembly, and the cutting module is used for cutting the sleeve; the sleeve positioning assembly comprises a lifting module and a clamping module connected with the lifting module, wherein the clamping module is used for clamping the cut sleeve and sleeved on an electronic element fixed by the fixing assembly under the action of the lifting module.
The correction guide assembly comprises a correction seat and a guide seat, wherein the correction seat is arranged above the guide seat and used for being conveyed to the guide seat after being corrected by the sleeve;
the technical scheme is further improved in that the correction seat is provided with a correction groove, the groove wall surface of the correction groove is symmetrically provided with a V-shaped groove, and one side of the V-shaped groove is provided with a feeding sensor;
the improvement of the scheme is that the guide seat is provided with a slot, the slot is provided with a guide block, the guide block is provided with a guide groove, the guide groove is provided with an expansion port towards the correction groove, and the correction groove is a flat pull groove.
The technical scheme is further improved that a driving gear is arranged on one side of the driving roller, a driven gear is arranged on one side of the driven roller, the driving gear is used for meshing with the driven gear, the driving module is used for driving the driving gear and the driving roller to synchronously drive, and the driven roller follows the driving roller to rotationally drive when the driven gear is meshed with the driving gear;
the driven roller is connected with a sliding block, the sliding block is connected with a moving cylinder, and the moving cylinder is used for driving the sliding block to drive the driven roller to move towards the position of the driving roller and enabling the driven gear to be meshed with the driving gear;
The technical scheme is further improved that the guide pipe comprises a feeding head and a discharging head, wherein concave cambered surfaces are symmetrically arranged on two sides of the feeding head, the concave cambered surfaces correspond to a driving roller and a driven roller respectively, and the discharging head is used for connecting a cutting-off module;
the cutting module comprises a cutter support, a cutter cylinder arranged at one end of the cutter support, a movable block connected with the cutter cylinder and movable in the cutter support, and a sleeve cutter connected with the movable block, wherein a cutter edge of the sleeve cutter is abutted against the lower surface of the cutter support, and the discharge head is fixed at one end of the cutter support and corresponds to the cutter edge of the sleeve cutter at the discharge port.
A further improvement of the scheme is that the transfer mechanism comprises a linear cylinder, a first transfer assembly and a second transfer assembly which are connected with the linear cylinder, and a rotary positioning assembly for positioning the electronic element;
the technical scheme is further improved that the first transfer assembly comprises a first lifting air cylinder, a first rotary air cylinder connected with the first lifting air cylinder and a first air claw connected with the first rotary air cylinder, the linear air cylinder is used for driving the first transfer assembly to drive the electronic element to transfer, and the first rotary air cylinder is used for driving the electronic element clamped by the first air claw to be overturned and put into the rotary positioning assembly;
The technical scheme is further improved that the second transfer assembly comprises a second lifting cylinder and a second air claw connected with the second lifting cylinder, and the second air claw is used for grabbing and putting the electronic element on the rotary positioning assembly into the forming sleeve mechanism;
the rotary positioning assembly comprises a second rotary cylinder and a third air claw connected with the second rotary cylinder, wherein the third air claw is used for clamping an electronic component, and the second rotary cylinder is used for driving the third air claw to rotate and can drive the electronic component to rotate.
The further improvement of the scheme is that the forming sleeve mechanism comprises a second turntable device, a correction device, a forming device, a shaping device, a pin tubing device, a ring clamping device and a blanking mechanism; the correcting device is used for centering and correcting the electronic element clamped by the clamping assembly; the molding device is used for bending and molding pins of the electronic element clamped by the clamping assembly; the shaping device bends and shapes the bent pins; the pin tubing device is used for sleeving the shaped pins into the sleeves; the ring clamp device is used for clamping the sleeve on the pin and sleeving the sleeve in place; the blanking mechanism is used for grabbing and blanking the formed electronic element and the sleeve from the clamping assembly.
The forming device comprises a forming support frame, a forming lifting assembly, a forming clamping assembly, a first rolling forming assembly and a second rolling forming assembly, wherein the forming lifting assembly comprises a forming lifting module arranged on the forming support frame and a forming lifting bracket arranged on the driving end of the forming lifting module; the forming clamping assembly comprises a positioning module which is arranged on the forming lifting bracket, is positioned at two sides of the forming clamping assembly and is used for positioning pins of the electronic element, and clamping claws which are connected with the forming clamping assembly and are used for clamping and fixing two ends of the electronic element, wherein the positioning module is used for positioning one side of the pins of the electronic element; the first roll forming assembly is arranged on the forming lifting bracket and is positioned at one side of the forming clamping assembly, and is provided with a first press roll which is used for roll forming the clamping claw and one pin positioned by the positioning module; the second roll forming assembly is arranged on one side of the forming lifting bracket, which is far away from the first roll forming assembly, and is provided with a second press roll which is used for roll forming the clamping claw and the other pin positioned by the positioning module;
The forming lifting bracket comprises a base plate connected with a forming lifting module and a T-shaped plate which is adjustably arranged on the base plate, wherein the forming clamping assembly and the first rolling forming assembly are both arranged on the base plate, and the second rolling forming assembly is arranged on one side of the T-shaped plate;
the technical scheme is further improved that the T-shaped plate is provided with a main shaft hole for connecting a substrate and an adjusting pull groove, the adjusting pull groove is arc-shaped, and the T-shaped plate is arranged on the substrate in an adjustable manner by taking the main shaft hole as the center through the adjusting pull groove;
the technical scheme is further improved that the positioning module is a positioning plate arranged on two sides of the forming clamping assembly, the positioning plate extends towards the forming clamping assembly to form a positioning block, the positioning block is provided with a positioning shaft pin, and the positioning shaft pin is provided with a positioning needle;
the clamping claw is an L-shaped clamping claw, the L-shaped clamping claw comprises a clamping surface and a positioning surface, the clamping surface is used for clamping and fixing the end face of the electronic element, the positioning needle is used for positioning a pin on one side of the electronic element, and the positioning surface is used for positioning the pin on the other side of the electronic element;
The technical scheme is further improved that the first roll forming assembly is provided with a first roll driving cylinder and a first roll pressing block connected with the first roll driving cylinder, the first roll pressing block is installed on the first roll pressing block, a first roll pressing groove is formed in the outer diameter of the first roll pressing block, the first roll pressing block is provided with a first adjusting shaft, and the first roll pressing block is adjustably installed on the first roll pressing block through the first adjusting shaft;
the technical scheme is further improved that the second rolling forming assembly is provided with a second rolling driving cylinder and a second rolling block connected with the second rolling driving cylinder, the second rolling block is installed on the second rolling block, and the second rolling driving cylinder is obliquely installed on the forming lifting bracket;
the improvement of the scheme is that the outer diameter of the second press roller is provided with a second roller groove, the second press roller is provided with a second adjusting shaft, and the second press roller is adjustably arranged on a second roller pressing block through the second adjusting shaft.
The further improvement to above-mentioned scheme does, the setting device symmetry is equipped with two sets of, and is used for two pins of electronic component respectively to design, setting device includes the design support, installs at the design propelling movement cylinder of design support, connects in the design sliding plate of design propelling movement cylinder and installs the design module at the design sliding plate, the design module includes first shaping cylinder, connects in the design connecting rod of first shaping cylinder, connects in the design piece of design connecting rod, the design groove has been seted up to the design piece, one side of design groove is equipped with the shaping groove, shaping groove one side is equipped with the bending connecting rod, the bending connecting rod is connected with the second design cylinder, the shaping groove is used for electronic component's pin design, the second design cylinder is used for driving the bending connecting rod to bend the pin shaping on the shaping groove.
The beneficial effects of the invention are as follows:
compared with the existing electronic component production, the automatic feeding device is used for automatically feeding the electronic component diode, and is used for automatically sleeving the body of the diode, sleeving the diode on the diode after sleeving the diode through heat shrinkage fastening, transferring the diode to the forming sleeve mechanism through the transferring mechanism, bending and forming pins of the diode by the forming sleeve mechanism, sleeving the formed pins, and blanking after sleeving, so that the automatic sleeving, bending and forming of the electronic component and pin sleeving of the electronic component are finished, the overall automation degree is high, the labor is saved, the structural precision is high, and the production efficiency is high. The feeding mechanism is arranged on one side of the frame and is used for feeding electronic components; the heat-shrinkable sleeve mechanism is used for receiving the electronic components fed by the feeding mechanism and sleeving the electronic components; the transfer mechanism is used for grabbing and transferring the electronic element of the finished sleeve on the heat-shrinkable sleeve mechanism; the molding sleeve is used for receiving the electronic component transferred by the transfer mechanism, bending pins of the electronic component, and performing sleeve on the pins formed by the bending pins; the blanking mechanism is used for grabbing and blanking the electronic components of the sleeve after the bent pins are formed from the forming sleeve mechanism.
The heat shrinkage bush mechanism comprises a first rotating disc device, a material pressing device, a bush device, a pipe pressing device and a heat shrinkage device, wherein a plurality of groups of fixing components are arranged on the first rotating disc device in a surrounding mode, and the fixing components are used for fixing electronic components and driving the fixing components and the electronic components to rotate and convey; the pressing device is used for pressing the electronic element fixed by the fixing component in place; the sleeve device is used for sleeving a sleeve on the electronic component fixed by the fixing component; the tube pressing device is used for pressing a sleeve sleeved by the electronic element into place; the heat shrinkage device is used for heat shrinkage of the sleeve on the electronic element; the full-automatic sleeve is adopted, the sleeve discharging assembly is used for discharging the sleeve, after discharging, the sleeve is guided to the sleeve cutting assembly through correction and guide driving, the sleeve is positioned and clamped by the sleeve positioning assembly to a specified length under the action of the lifting assembly before cutting, and then the sleeve is cut off; the sleeve can be automatically sleeved on the electronic element after being corrected and guided, so that the automatic sleeve of the electronic element is realized, the automatic sleeve is realized, the labor is saved, and the degree of automation is high.
The forming sleeve mechanism comprises a second turntable device, a correction device, a forming device, a shaping device, a pin tubing device, a ring clamp device and a blanking mechanism; the correcting device is used for centering and correcting the electronic element clamped by the clamping assembly; the molding device is used for bending and molding pins of the electronic element clamped by the clamping assembly; the shaping device bends and shapes the bent pins; the pin tubing device is used for sleeving the shaped pins into the sleeves; the ring clamp device is used for clamping the sleeve on the pin and sleeving the sleeve in place; the blanking mechanism is used for grabbing and blanking the formed and sleeved electronic element from the clamping assembly; diode both ends and pin are fixed and the location through shaping clamping assembly in the shaping in-process, carry out the roll forming through the roll forming subassembly of two sets of diode both ends after the location, and the shaping fixed subassembly is pressed from both sides electronic component tightly fixedly at this in-process, has guaranteed the fashioned stability of structure, has solved current high to electronic component pin shaping degree of difficulty, especially dysmorphism pin shaping, realizes automatic pin shaping, and shaping is effectual, and structural accuracy is high. The whole molding process is that the molding fixed assembly rotates to the lower part of the molding clamping assembly under the action of the turntable, the molding lifting bracket is driven to descend under the action of the molding lifting module, the positioning module positions pins at two ends of the electronic element when descending to the designated position, the molding clamping assembly drives the clamping claw to simultaneously position the two ends and the pins of the electronic element, the positioning module and the clamping claw cooperate to position two sides of the pins, the pins at the two ends are subjected to roll forming under the action of the two groups of roll forming assemblies after positioning, and full-automatic pin forming is realized.
Drawings
FIG. 1 is a schematic perspective view of an automatic sleeve forming apparatus for electronic components according to the present invention;
FIG. 2 is a schematic perspective view of the automatic sleeve forming apparatus of FIG. 1 from another perspective;
FIG. 3 is a schematic perspective view of a heat shrink tubing mechanism of the automatic electronic component tube forming apparatus of FIG. 1;
FIG. 4 is a schematic perspective view of a feeding mechanism of the automatic sleeve forming apparatus for electronic components of FIG. 1;
FIG. 5 is a schematic perspective view of a sleeve device of the heat shrink sleeve mechanism of FIG. 3;
FIG. 6 is a schematic perspective view of a portion of the sleeve device of FIG. 5;
FIG. 7 is a schematic view of a portion of the sleeve apparatus of FIG. 5;
FIG. 8 is a schematic view of a cutting module of the sleeve device of FIG. 5;
FIG. 9 is a schematic perspective view of a molding bushing mechanism of the automatic bushing molding apparatus of electronic components of FIG. 1;
FIG. 10 is a schematic perspective view of a transfer mechanism of the automatic sleeve forming apparatus of FIG. 1;
FIG. 11 is a schematic perspective view of a molding apparatus of the molding sleeve mechanism of FIG. 9;
FIG. 12 is a schematic view of a portion of the forming apparatus of the forming sleeve mechanism of FIG. 9;
FIG. 13 is a schematic view of a portion of the first roll forming assembly of the forming sleeve mechanism of FIG. 9;
FIG. 14 is a schematic view of a portion of a second roll forming assembly of the forming sleeve mechanism of FIG. 9;
FIG. 15 is a schematic perspective view of a sizing device of the forming sleeve mechanism of FIG. 9;
fig. 16 is a schematic view of the setting device of the forming sleeve mechanism of fig. 9.
Reference numerals illustrate: the device comprises a frame 10, a feeding mechanism 20, a feeding assembly 201, a blanking assembly 202, a positioning and feeding assembly 203, a jacking positioning module 2031, a positioning and pushing module 2032, a feeding grabbing assembly 204, a heat shrinkage bush mechanism 30, a transferring mechanism 40, a forming bush mechanism 50 and a blanking mechanism 60;
the device comprises a first rotating disc device 1, a material pressing device 2, a sleeve device 3, a sleeve discharging assembly 31, a correction guide assembly 32, a correction seat 321, a correction groove 3211, a V-shaped groove 3212, a guide seat 322, a guide driving assembly 33, a driving roller 331, a driven roller 332, a sliding block 3321, a moving cylinder 3322, a driving module 333, a driving gear 334, a driven gear 335, a sleeve cutting assembly 34, a guide tube 341, a feeding head 3411, a discharging head 3412, an inward concave arc surface 3413, a cutting module 342, a cutter bracket 3421, a cutter cylinder 3422, a movable block 3423, a sleeve cutter 3424, a sleeve positioning assembly 35, a lifting module 351, a clamping module 352, a tube pressing device 4 and a heat shrinkage device 5;
a linear cylinder 401, a first transfer assembly 402, a first lift cylinder 4021, a first rotary cylinder 4022, a first air jaw 4023, a second transfer assembly 403, a second lift cylinder 4031, a second air jaw 4032, a rotary positioning assembly 404, a second rotary cylinder 4041, and a third air jaw 4042;
The second turntable device 501, the correction device 502, the forming device 6, the forming support frame 61, the forming lifting assembly 62, the forming clamping assembly 63, the first roll forming assembly 64, the second roll forming assembly 65, the forming device 7, the pin mounting device 8, the ring clamping device 503, the forming support frame 61, the forming lifting assembly 62, the forming lifting module 621, the forming lifting support 622, the T-shaped plate 6221, the positioning module 623, the positioning plate 6231, the positioning block 6232, the positioning shaft pin 6233, the positioning needle 6234, the clamping claw 624, the clamping surface 6241, the positioning surface 6242, the forming clamping assembly 63, the first roll forming assembly 64, the first roll 641, the first roll driving cylinder 642, the first roll pressing block 643, the first roll groove 644, the first adjusting shaft 645, the second roll forming assembly 65, the second roll 651, the second roll driving cylinder 652, the second roll pressing block 653, the second roll groove 654, the second adjusting shaft 655;
the shaping bracket 71, the shaping pushing cylinder 72, the shaping sliding plate 73, the shaping module 74, the first shaping cylinder 741, the shaping connecting rod 742, the shaping block 743, the shaping groove 744, the shaping groove 745, the bending connecting rod 746 and the second shaping cylinder 747.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
As shown in fig. 1 to 16, in one embodiment of the present invention, an automatic electronic component sheathing apparatus includes a frame 10, a feeding mechanism 20, a heat shrinkage sheathing mechanism 30, a transfer mechanism 40, and a sheathing mechanism 50, the feeding mechanism 20 being installed at one side of the frame 10 and being used for feeding electronic components; the heat shrinkage bush mechanism 30 is used for receiving the electronic components fed by the feeding mechanism 20 and is used for sleeving the electronic components; the transfer mechanism 40 is used for grabbing and transferring the electronic components of the finished sleeve on the heat-shrinkable sleeve mechanism 30; the molding sleeve is used for receiving the electronic component transferred by the transfer mechanism 40, bending pins of the electronic component, and performing sleeve on the pins formed by bending pins; the blanking mechanism 60 is used for grabbing and blanking the electronic components of the sleeve and the molded pins from the molded sleeve mechanism 50.
Referring to fig. 4, a further improvement of the above embodiment is that the feeding mechanism 20 includes a feeding assembly 201 for feeding the carrier tape of electronic components, a blanking assembly 202 for blanking the electronic components from the carrier tape, a positioning and feeding assembly 203 for positioning and feeding the cut electronic components, and a feeding and grabbing assembly 204 for taking the materials from the positioning and feeding assembly 203; the electronic components in a carrier tape mode are automatically fed through the feeding assembly 201, the electronic components are separated from the carrier tape through the cutting device at a designated position, the electronic components are positioned and fed to the designated position through the positioning and feeding assembly 203 after the electronic components are separated, and the electronic components are grabbed and fed through the feeding grabbing assembly 204.
In a further improvement of the above embodiment, correction assemblies 205 for straightening pins of the electronic component are disposed on two sides of the positioning and feeding assembly 203, the positioning and feeding assembly 203 includes a jacking positioning module 2031 and a positioning and pushing module 2032 connected to the jacking positioning module 2031, the positioning and pushing module 2032 is used for driving the jacking positioning module 2031 to move, and the jacking positioning module 2031 is used for positioning pins of the electronic component.
As shown in fig. 3, a further improvement of the above embodiment is that the heat shrinkage bush mechanism 30 includes a first rotating disc device 1, a material pressing device 2, a bush device 3, a pipe pressing device 4 and a heat shrinkage device 5, wherein a plurality of groups of fixing components are circumferentially arranged on the first rotating disc device 1, and the fixing components are used for fixing electronic components and driving the fixing components and the electronic components to rotate and convey; the pressing device 2 is used for pressing the electronic component fixed by the fixing component into place; the sleeve device 3 is used for sleeving a sleeve on the electronic component fixed by the fixing component; the pipe pressing device 4 is used for pressing a sleeve sleeved by the electronic component into place; the heat shrinkage device 5 is used for heat shrinkage of the sleeve on the electronic component; the full-automatic sleeve structure is adopted, electronic components are sequentially fed, pressed, sleeved, pressed, heat-shrinkable tubes and finally fed and discharged, the turntable mode is adopted for sequential work, the full-automatic electronic component sleeve is realized, the problems that the efficiency of the existing manual sleeve is low, the dimensional accuracy is inconsistent and the like are solved, the full-automatic feeding, the sleeves and the shrinking tubes are adopted, manual operation is not needed in the middle, full automation is realized, the degree of automation is high, and the working efficiency is high.
Referring to fig. 5-8, a further improvement of the above embodiment is that the sleeve device 3 includes a sleeve discharging assembly 31, a correction guiding assembly 32, a guiding driving assembly 33, a sleeve cutting assembly 34, and a sleeve positioning assembly 35, wherein the sleeve discharging assembly 31 is used for sleeve discharging; the correction guiding component 32 is used for correcting and guiding the sleeve discharged by the sleeve discharging component 31; the guiding driving assembly 33 comprises a driving roller 331, a driven roller 332 and a driving module 333 for driving the driving roller 331, wherein the driving module 333 is used for driving the driving roller 331 to rotate, and a gap for passing through a sleeve is arranged between the driving roller 331 and the driven roller 332; the sleeve cutting assembly 34 comprises a guide tube 341 connected to the lower side of the gap, and a cutting module 342 positioned at the lower side of the guide tube 341, wherein the guide tube 341 is used for receiving the sleeve led in by the guide driving assembly 33, and the cutting module 342 is used for cutting the sleeve; the sleeve positioning assembly 35 comprises a lifting module 351 and a clamping module 352 connected with the lifting module 351, wherein the clamping module 352 is used for clamping the cut sleeve and sleeved on an electronic element fixed by the fixing assembly under the action of the lifting module 351; the full-automatic sleeve is adopted, the sleeve discharging assembly 31 is used for discharging the sleeve, after discharging, the sleeve is guided by correction and guide, the sleeve is guided to the sleeve cutting assembly 34 by guide driving, the sleeve is positioned and clamped by the sleeve positioning assembly 35 to a specified length under the action of the lifting assembly before cutting, and then the sleeve is cut, in the cutting process, the clamping module 352 sleeves the sleeve on the electronic element while the lifting module 351 is stretched, so that the sleeve action is synchronously completed, the time is saved, and the working efficiency is high; the sleeve can be automatically sleeved on the electronic element after being corrected and guided, so that the automatic sleeve of the electronic element is realized, the automatic sleeve is realized, the labor is saved, and the degree of automation is high.
In a further modification of the above embodiment, the alignment guide assembly 32 includes an alignment seat 321 and an introduction seat 322, wherein the alignment seat 321 is located above the introduction seat 322 and is used for guiding the cannula after alignment to the introduction seat 322.
In a further improvement of the embodiment, a correction seat 321 is provided with a correction groove 3211, a V-shaped groove 3212 is symmetrically formed on the wall surface of the correction groove 3211, and a feeding sensor is arranged on one side of the V-shaped groove 3212; the flat sleeve is flattened and corrected through the matching of the double symmetrical V-shaped grooves 3212, and meanwhile, a feeding sensor is arranged for sensing sleeve feeding.
In a further improvement of the above embodiment, the guide seat 322 is provided with a slot, the slot is inserted with a guide block, the guide block is provided with a guide groove, the guide groove is provided with an expansion opening towards the correction groove 3211, and the correction groove 3211 is a flat pull groove.
A further improvement of the above embodiment is that a driving gear 334 is arranged on one side of the driving roller 331, a driven gear 335 is arranged on one side of the driven roller 332, the driving gear 334 is used for meshing with the driven gear 335, the driving module 333 is used for driving the driving gear 334 and the driving roller 331 to synchronously drive, and the driven roller 332 follows the driving roller 331 to rotate and drive when the driven gear 335 is meshed with the driving gear 334; the driving gear 334 and the driven gear 335 are arranged to form a double rolling guide roller in cooperation, so that the sleeve can be guided downwards to drive.
A further improvement of the above embodiment is that the driven roller 332 is connected with a sliding block 3321, the sliding block 3321 is connected with a moving air cylinder 3322, and the moving air cylinder 3322 is used for driving the sliding block 3321 to drive the driven roller 332 to move towards the position of the driving roller 331 and enabling the driven gear 335 to be meshed with the driving gear 334; the moving cylinder 3322 is arranged to drive the sliding block 3321 to drive the driven gear 335 and the driven roller 332 to move, when the two gears are meshed, the two rollers are synchronously driven to drive the sleeve to convey, and the moving cylinder 33224322 can stop feeding after being driven to separate.
In a further improvement of the above embodiment, the guide tube 341 includes a feeding head 3411 and a discharging head 3412, wherein concave cambered surfaces 3413 are symmetrically provided on both sides of the feeding head 3411, the concave cambered surfaces 3413 respectively correspond to the driving roller 331 and the driven roller 332, and the discharging head 3412 is used for connecting the cutting module 342; the two ends of the guide tube 341 are respectively used for feeding and discharging the sleeve, the concave cambered surface 3413 is convenient to match with two rollers to convey the sleeve, and the discharging head 3412 is connected with the cutting-off module 342 so as to cut the sleeve discharged to the specified size
In a further improvement of the above embodiment, the cutting module 342 includes a cutter support 3421, a cutter cylinder 3422 mounted at one end of the cutter support 3421, a movable block 3423 connected to the cutter cylinder 3422 and movable to the cutter support 3421, and a sleeve cutter 3424 connected to the movable block 3423, wherein a knife edge of the sleeve cutter 3424 abuts against the lower surface of the cutter support 3421, and the discharge head 3412 is fixed at one end of the cutter support 3421 and corresponds to the knife edge of the sleeve cutter 3424 at a discharge port; the cutter cylinder 3422 drives the movable block 3423 to drive the sleeve cutter 3424 for cutting off the sleeve.
Referring to fig. 10, a further modification of the above embodiment is that the transfer mechanism 40 includes a linear cylinder 401, first and second transfer units 402 and 403 connected to the linear cylinder 401, and a rotational positioning unit 404 for positioning electronic components; in the feeding process, the first transfer assembly 402 and the second transfer assembly 403 are driven to work alternately through the linear cylinder 401, so that automatic feeding is realized.
In a further improvement of the above embodiment, the first transferring assembly 402 includes a first lifting cylinder 4021, a first rotating cylinder 4022 connected to the first lifting cylinder 4021, and a first air claw 4023 connected to the first rotating cylinder 4022, where the linear cylinder 401 is used to drive the first transferring assembly 402 to transfer electronic components, and the first rotating cylinder 4022 is used to drive the electronic components clamped by the first air claw 4023 to be turned over and put into the rotating positioning assembly 404; the second transfer assembly 403 includes a second lifting cylinder 4031, and a second air jaw 4032 connected to the second lifting cylinder 4031, wherein the second air jaw 4032 is used for grabbing and placing the electronic component on the rotary positioning assembly 404 into the molding sleeve mechanism 50; the rotary positioning assembly 404 includes a second rotary cylinder 4041, and a third air claw 4042 connected to the second rotary cylinder 4041, where the third air claw 4042 is used to clamp an electronic component, and the second rotary cylinder 4041 is used to drive the third air claw 4042 to rotate and can drive the electronic component to rotate.
Referring to fig. 9, a further improvement of the above embodiment is that the molding sleeve mechanism 50 includes a second turntable device 501, a correction device 502, a molding device 6, a shaping device 7, a pin loading device 8, a ring clamping device 503, and a blanking mechanism 60; the correction device 502 is used for centering and correcting the electronic component clamped by the clamping assembly; the molding device 6 is used for bending and molding pins of the electronic component clamped by the clamping assembly; the shaping device 7 bends and shapes the bent pins; the pin tubing device 8 is used for sleeving the shaped pins with sleeves; the ring clamp device 503 is used for clamping the sleeve on the pin and sleeving the sleeve in place; the blanking mechanism 60 is used for grabbing and blanking the formed and sleeved electronic components from the clamping assembly; the full automation is adopted, the feeding device feeds the electronic element to the clamping element, the clamping assembly on the turntable clamps the electronic element and rotates under the action of the turntable device to transmit, the correction device 502 corrects the position of the electronic element in the middle firstly, the pin is bent and formed to a specified shape through the forming device 6 after correction, the pin is bent and formed for the second time through the forming device 7, the sleeve is sleeved on the pin through the pin tubing device 8 after positioning, the sleeve is clamped through the ring clamping device 503, and finally the electronic element is discharged. The whole process is completed by full automation without manual operation, so that the problems of high difficulty in the conventional manual bending and forming process, high difficulty in the sleeve and the like are solved, comprehensive automation is realized, the structural precision is high, the manpower is saved, and the production efficiency is high.
Referring to fig. 11 to 14, a further modification of the above embodiment is that the forming apparatus 6 includes a forming support frame 61, a forming lifting assembly 62, a forming clamping assembly 63, a first roll forming assembly 64, and a second roll forming assembly 65, the forming lifting assembly 62 includes a forming lifting module 621 mounted on the forming support frame 61, and a forming lifting bracket 622 mounted on a driving end of the forming lifting module 621; the molding clamping assembly 63 comprises a positioning module 623 installed on the molding lifting support 622 and positioned at two sides of the molding clamping assembly 63 and used for positioning pins of the electronic component, and a clamping claw 624 connected to the molding clamping assembly 63 and used for clamping and fixing two ends of the electronic component, wherein the positioning module 623 is used for positioning one side of the pins of the electronic component; the first roll forming assembly 64 is installed on the forming lifting bracket 622 and located at one side of the forming clamping assembly 63, the first roll forming assembly 64 is provided with a first press roll 641, and the first press roll 641 is used for roll forming one pin positioned by the clamping claw 624 and the positioning module 623; the second roll forming assembly 65 is mounted on the side of the forming lifting support 622 away from the first roll forming assembly 64, and the second roll forming assembly 65 is provided with a second press roll 651, and the second press roll 651 is used for roll forming the clamping jaw 624 and the other pin positioned by the positioning module 623. Diode both ends and pin are fixed and the location through shaping clamp assembly 63 in the shaping in-process, the location back carries out the roll forming through the roll forming subassembly of two sets of diode both ends, drive shaping lifting support 622 decline under the effect of this in-process shaping lifting module 621, the pin at electronic component both ends is fixed a position to positioning module 623 when descending to the assigned position, shaping clamp assembly 63 drive gripper jaw 624 is with the both ends and the pin simultaneous localization of electronic component, and then positioning module 623 and gripper jaw 624 cooperate to fix a position the both sides of pin, carry out the roll forming to the pin at both ends under the effect of two sets of roll forming subassemblies after the location, full automatization's pin shaping has been realized.
Further improvements to the above embodiments include a base plate connected to the forming lift module 621, and a T-shaped plate 6221 adjustably mounted to the base plate, the forming clamp assembly 63 and the first roll forming assembly 64 being mounted to the base plate, the second roll forming assembly 65 being mounted to one side of the T-shaped plate 6221; the forming lift module 621, which is designed by a sliding table cylinder, can be used to drive the forming lift bracket 622 to rise and fall, in addition, the forming lift bracket 622 has a base plate for structural installation, and the T-shaped plate 6221 is used for installation of the second roll forming assembly 65.
In a further improvement of the above embodiment, a T-shaped plate 6221 is provided with a spindle hole for connecting a substrate and an adjusting slot, the adjusting slot is arc-shaped, and the T-shaped plate 6221 is adjustably mounted on the substrate by taking the spindle hole as a center through the adjusting slot; the device is adjustably arranged on the substrate by adjusting the pull groove; the main shaft hole is formed to enable the T-shaped plate 6221 to be rotationally adjusted, so that the angle of a pin to be formed can be adjusted.
A further improvement of the above embodiment is that the positioning module 623 is a positioning plate 6231 installed at two sides of the forming clamping assembly 63, the positioning plate 6231 extends towards the forming clamping assembly 63 to form a positioning block 6232, the positioning block 6232 is installed with a positioning shaft pin 6233, and the positioning shaft pin 6233 is provided with a positioning needle 6234; the clamping claw 624 is an L-shaped clamping claw, the L-shaped clamping claw comprises a clamping surface 6241 and a positioning surface 6242, the clamping surface 6241 is used for clamping and fixing the end face of the electronic element, the positioning needle 6234 is used for positioning a pin on one side of the electronic element, and the positioning surface 6242 is used for positioning the pin on the other side of the electronic element; in the embodiment, the pin is positioned by the clamping surface 6241 and the positioning surface 6242 of the L-shaped clamping jaw, and the other side of the pin is positioned under the action of the matched positioning needle 6234, so that two-side positioning is formed, and the pin is more stable and higher in precision during rolling, bending and forming.
In a further improvement of the above embodiment, the first roll forming assembly 64 is provided with a first roll driving cylinder 642 and a first roll pressing block 643 connected to the first roll driving cylinder 642, the first roll pressing block 641 is mounted on the first roll pressing block 643, a first roll pressing groove 644 is formed in the outer diameter of the first roll pressing block 641, a first adjusting shaft 645 is arranged on the first roll pressing block 641, and the first roll pressing block 641 is adjustably mounted on the first roll pressing block 643 through the first adjusting shaft 645; in this embodiment, the first roller pressing block 643 is driven by the first roller driving cylinder 642 to drive the first roller 641 to roll and form the pins, and the first roller pressing block 644 is provided with a first roller pressing groove for matching rolling, so that rolling is stable, and in addition, the first roller pressing block 645 is provided with a first adjusting shaft 645 for adapting adjustment, so that the utility is better.
In a further improvement of the above embodiment, the second roll forming assembly 65 is provided with a second roll driving cylinder 652 and a second roll pressing block 653 connected to the second roll driving cylinder 652, the second press roll 651 is installed on the second roll pressing block 653, and the second roll driving cylinder 652 is obliquely installed on the forming lifting bracket 622; a second rolling groove 654 is formed in the outer diameter of the second pressing roller 651, a second adjusting shaft 655 is arranged on the second pressing roller 651, and the second pressing roller 651 is adjustably mounted on a second pressing roller block 653 through the second adjusting shaft 655; in this embodiment, the driving structure installed obliquely is adopted, and the adjustment can be performed according to the molding directions of different angles, and in the rolling process, the second rolling block 653 is driven by the second rolling driving cylinder 652 to drive the second rolling roller 651 for pin rolling molding.
Referring to fig. 15 to 16, a further improvement of the above embodiment is that the shaping device 7 is symmetrically provided with two groups of two pins for shaping the electronic component, the shaping device 7 includes a shaping support 71, a shaping pushing cylinder 72 installed on the shaping support 71, a shaping sliding plate 73 connected to the shaping pushing cylinder 72, and a shaping module 74 installed on the shaping sliding plate 73, the shaping module 74 includes a first shaping cylinder 741, a shaping connecting rod 742 connected to the first shaping cylinder 741, a shaping block 743 connected to the shaping connecting rod 742, the shaping block 743 is provided with a shaping slot 744, one side of the shaping slot 744 is provided with a shaping slot 745, one side of the shaping slot 745 is provided with a bending connecting rod 746, the bending connecting rod 746 is connected with a second shaping cylinder 747, the shaping slot 744 is used for shaping the pins of the electronic component, and the second shaping cylinder 747 is used for driving the bending connecting rod 746 to bend the pins on the shaping slot 745.
The invention is used for automatically feeding the diode of the electronic element, and sleeving the body sleeve on the diode after sleeving the diode and fastening the diode by heat shrinkage, then transferring the diode to the forming sleeve mechanism 50 by the transferring mechanism 40, wherein the forming sleeve mechanism 50 is used for bending and forming pins of the diode, sleeving the formed pins, and blanking after sleeving, so that the automatic sleeve, bending and forming and pin sleeve of the electronic element are completed. Specifically, a frame 10, a feeding mechanism 20, a heat shrinkage bush mechanism 30, a transfer mechanism 40, a molding bush mechanism 50 and a blanking mechanism 60 are provided, wherein the feeding mechanism 20 is arranged on one side of the frame 10 and is used for feeding electronic components; the heat shrinkage bush mechanism 30 is used for receiving the electronic components fed by the feeding mechanism 20 and is used for sleeving the electronic components; the transfer mechanism 40 is used for grabbing and transferring the electronic components of the finished sleeve on the heat-shrinkable sleeve mechanism 30; the molding sleeve is used for receiving the electronic component transferred by the transfer mechanism 40, bending pins of the electronic component, and performing sleeve on the pins formed by bending pins; the blanking mechanism 60 is used for grabbing and blanking the electronic components of the sleeve and the molded pins from the molded sleeve mechanism 50.
The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. An automatic sleeve forming device for electronic components, which is characterized in that: comprising
The machine frame is provided with a machine frame,
the feeding mechanism is arranged on one side of the rack and used for feeding the electronic components;
the heat-shrinkable sleeve mechanism is used for receiving the electronic components fed by the feeding mechanism and sleeving the electronic components;
the transfer mechanism is used for grabbing the electronic component of the finished sleeve on the heat-shrinkable sleeve mechanism and transferring the electronic component;
the molding sleeve mechanism is used for receiving the electronic component transferred by the transfer mechanism, bending pins of the electronic component, and sleeving the pins formed by the bending pins;
and the blanking mechanism is used for grabbing and blanking the bent pins and the electronic components of the sleeve from the formed sleeve mechanism.
2. The electronic component automatic sleeve forming apparatus according to claim 1, wherein: the feeding mechanism comprises a feeding component for feeding the carrier tape of the electronic component, a cutting component for cutting the electronic component from the carrier tape, a positioning and feeding component for positioning and feeding the cut electronic component, and a feeding grabbing component for taking materials on the positioning and feeding component;
the positioning and feeding assembly comprises a jacking positioning module and a positioning and pushing module connected to the jacking positioning module, wherein the positioning and pushing module is used for driving the jacking positioning module to move, and the jacking positioning module is used for positioning pins of the electronic element.
3. The electronic component automatic sleeve forming apparatus according to claim 1, wherein: the heat shrinkage bush mechanism comprises a first rotating disc device, a pressing device, a bush device, a pipe pressing device and a heat shrinkage device, wherein a plurality of groups of fixing components are arranged on the first rotating disc device in a surrounding mode, and the fixing components are used for fixing electronic elements and driving the fixing components and the electronic elements to rotate and convey; the pressing device is used for pressing the electronic element fixed by the fixing component in place; the sleeve device is used for sleeving a sleeve on the electronic component fixed by the fixing component; the tube pressing device is used for pressing a sleeve sleeved by the electronic element into place; the heat shrinkage device is used for heat shrinkage of the sleeve on the electronic component.
4. An electronic component automatic sleeve forming apparatus according to claim 3, wherein: the sleeve device comprises a sleeve discharging assembly, a correction guiding assembly, a guiding driving assembly, a sleeve cutting assembly and a sleeve positioning assembly, wherein the sleeve discharging assembly is used for discharging the sleeve; the correction guide assembly is used for correcting and guiding the sleeve discharged by the sleeve discharging assembly; the guiding driving assembly comprises a driving roller, a driven roller and a driving module for driving the driving roller, wherein the driving module is used for driving the driving roller to rotate, and a gap for a sleeve to pass through is formed between the driving roller and the driven roller; the sleeve cutting assembly comprises a guide pipe connected to the lower side of the gap and a cutting module positioned on the lower side of the guide pipe, the guide pipe is used for receiving the sleeve led in by the guide driving assembly, and the cutting module is used for cutting the sleeve; the sleeve positioning assembly comprises a lifting module and a clamping module connected with the lifting module, wherein the clamping module is used for clamping the cut sleeve and sleeved on an electronic element fixed by the fixing assembly under the action of the lifting module.
5. The electronic component automatic sleeve forming apparatus according to claim 4, wherein: the correction guide assembly comprises a correction seat and a guide seat, wherein the correction seat is arranged above the guide seat and used for conveying the corrected sleeve into the guide seat;
The correction seat is provided with a correction groove, the wall surface of the correction groove is symmetrically provided with a V-shaped groove, and one side of the V-shaped groove is provided with a feeding sensor;
the guide seat is provided with a slot, the slot is provided with a guide block in a inserted mode, the guide block is provided with a guide groove, the guide groove is provided with an expansion opening towards the correction groove, and the correction groove is a flat pull groove.
6. The electronic component automatic sleeve forming apparatus according to claim 5, wherein: one side of the driving roller is provided with a driving gear, one side of the driven roller is provided with a driven gear, the driving gear is used for meshing with the driven gear, the driving module is used for driving the driving gear and the driving roller to synchronously drive, and when the driven gear is meshed with the driving gear, the driven roller follows the driving roller to rotationally drive;
the driven roller is connected with a sliding block, the sliding block is connected with a moving cylinder, and the moving cylinder is used for driving the sliding block to drive the driven roller to move towards the position of the driving roller and enabling the driven gear to be meshed with the driving gear;
the guide pipe comprises a feeding head and a discharging head, concave cambered surfaces are symmetrically arranged on two sides of the feeding head, the concave cambered surfaces correspond to the driving roller and the driven roller respectively, and the discharging head is used for connecting the cutting-off module;
The cutting-off module comprises a cutter support, a cutter cylinder arranged at one end of the cutter support, a movable block connected with the cutter cylinder and movable in the cutter support, and a sleeve cutter connected with the movable block, wherein a cutter edge of the sleeve cutter is abutted to the lower surface of the cutter support, and the discharge head is fixed at one end of the cutter support and corresponds to the cutter edge of the sleeve cutter at the discharge hole.
7. The electronic component automatic sleeve forming apparatus according to claim 1, wherein: the transfer mechanism comprises a linear cylinder, a first transfer assembly and a second transfer assembly which are connected with the linear cylinder, and a rotary positioning assembly for positioning the electronic element;
the first transfer assembly comprises a first lifting cylinder, a first rotary cylinder connected with the first lifting cylinder and a first air claw connected with the first rotary cylinder, the linear cylinder is used for driving the first transfer assembly to drive the electronic element to transfer, and the first rotary cylinder is used for driving the electronic element clamped by the first air claw to be overturned and put into the rotary positioning assembly;
the second transfer assembly comprises a second lifting cylinder and a second air claw connected with the second lifting cylinder, and the second air claw is used for grabbing and putting the electronic element on the rotary positioning assembly into the forming sleeve mechanism;
The rotary positioning assembly comprises a second rotary cylinder and a third air claw connected with the second rotary cylinder, wherein the third air claw is used for clamping an electronic element, and the second rotary cylinder is used for driving the third air claw to rotate and can drive the electronic element to rotate.
8. The electronic component automatic sleeve forming apparatus according to claim 1, wherein: the forming sleeve mechanism comprises a second turntable device, a correction device, a forming device, a shaping device, a pin tubing device, a ring clamp device and a blanking mechanism; the correcting device is used for centering and correcting the electronic element clamped by the clamping assembly; the molding device is used for bending and molding pins of the electronic element clamped by the clamping assembly; the shaping device bends and shapes the bent pins; the pin tubing device is used for sleeving the shaped pins into the sleeves; the ring clamp device is used for clamping the sleeve on the pin and sleeving the sleeve in place; the blanking mechanism is used for grabbing and blanking the formed electronic element and the sleeve from the clamping assembly.
9. The electronic component automatic sleeve forming apparatus according to claim 8, wherein: the forming device comprises a forming support frame, a forming lifting assembly, a forming clamping assembly, a first rolling forming assembly and a second rolling forming assembly, wherein the forming lifting assembly comprises a forming lifting module arranged on the forming support frame and a forming lifting bracket arranged on the driving end of the forming lifting module; the forming clamping assembly comprises a positioning module which is arranged on the forming lifting bracket, is positioned at two sides of the forming clamping assembly and is used for positioning pins of the electronic element, and clamping claws which are connected with the forming clamping assembly and are used for clamping and fixing two ends of the electronic element, wherein the positioning module is used for positioning one side of the pins of the electronic element; the first roll forming assembly is arranged on the forming lifting bracket and is positioned at one side of the forming clamping assembly, and is provided with a first press roll which is used for roll forming the clamping claw and one pin positioned by the positioning module; the second roll forming assembly is arranged on one side of the forming lifting bracket, which is far away from the first roll forming assembly, and is provided with a second press roll which is used for roll forming the clamping claw and the other pin positioned by the positioning module;
The forming lifting support comprises a base plate connected to the forming lifting module and a T-shaped plate adjustably mounted on the base plate, the forming clamping assembly and the first rolling forming assembly are both mounted on the base plate, and the second rolling forming assembly is mounted on one side of the T-shaped plate;
the T-shaped plate is provided with a main shaft hole for connecting the substrate and an adjusting pull groove, the adjusting pull groove is arc-shaped, and the T-shaped plate is adjustably arranged on the substrate by taking the main shaft hole as a center through the adjusting pull groove;
the positioning module is a positioning plate arranged on two sides of the forming clamping assembly, the positioning plate extends towards the forming clamping assembly to form a positioning block, the positioning block is provided with a positioning shaft pin, and the positioning shaft pin is provided with a positioning needle;
the clamping claw is an L-shaped clamping claw, the L-shaped clamping claw comprises a clamping surface and a positioning surface, the clamping surface is used for clamping and fixing the end face of the electronic element, the positioning needle is used for positioning pins on one side of the electronic element, and the positioning surface is used for positioning pins on the other side of the electronic element;
the first rolling forming assembly is provided with a first rolling driving cylinder and a first rolling block connected with the first rolling driving cylinder, the first pressing roll is arranged on the first rolling block, a first rolling groove is formed in the outer diameter of the first pressing roll, the first pressing roll is provided with a first adjusting shaft, and the first pressing roll is adjustably arranged on the first rolling block through the first adjusting shaft;
The second roll forming assembly is provided with a second roll driving cylinder and a second roll pressing block connected with the second roll driving cylinder, the second press roll is arranged on the second roll pressing block, and the second roll driving cylinder is obliquely arranged on the forming lifting bracket;
the external diameter of second compression roller has seted up the second roll groove, the second compression roller is equipped with the second regulating spindle, the second compression roller is adjustable through the second regulating spindle to be installed at the second roller briquetting.
10. The electronic component automatic sleeve forming apparatus according to claim 8, wherein: the shaping device symmetrically is provided with two groups of pins for the electronic component respectively, the shaping device comprises a shaping support, a shaping pushing cylinder arranged on the shaping support, a shaping sliding plate connected with the shaping pushing cylinder and a shaping module arranged on the shaping sliding plate, the shaping module comprises a first shaping cylinder, a shaping connecting rod connected with the first shaping cylinder and a shaping block connected with the shaping connecting rod, the shaping block is provided with a shaping groove, one side of the shaping groove is provided with a bending connecting rod, the bending connecting rod is connected with a second shaping cylinder, the shaping groove is used for shaping pins of the electronic component, and the second shaping cylinder is used for driving the bending connecting rod to bend the pins to form on the shaping groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211591090.7A CN116206975A (en) | 2022-12-12 | 2022-12-12 | Automatic sleeve forming equipment for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211591090.7A CN116206975A (en) | 2022-12-12 | 2022-12-12 | Automatic sleeve forming equipment for electronic element |
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| CN116206975A true CN116206975A (en) | 2023-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211591090.7A Pending CN116206975A (en) | 2022-12-12 | 2022-12-12 | Automatic sleeve forming equipment for electronic element |
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| CN (1) | CN116206975A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153722A (en) * | 2023-08-31 | 2023-12-01 | 黄山市弘泰电子有限公司 | Full-automatic anti-offset diode ring sleeving machine |
-
2022
- 2022-12-12 CN CN202211591090.7A patent/CN116206975A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117153722A (en) * | 2023-08-31 | 2023-12-01 | 黄山市弘泰电子有限公司 | Full-automatic anti-offset diode ring sleeving machine |
| CN117153722B (en) * | 2023-08-31 | 2024-01-30 | 黄山市弘泰电子有限公司 | Full-automatic anti-offset diode ring sleeving machine |
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