CN1162043C - 含预定张力的膜的转换器的制造方法 - Google Patents

含预定张力的膜的转换器的制造方法 Download PDF

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Publication number
CN1162043C
CN1162043C CNB998084190A CN99808419A CN1162043C CN 1162043 C CN1162043 C CN 1162043C CN B998084190 A CNB998084190 A CN B998084190A CN 99808419 A CN99808419 A CN 99808419A CN 1162043 C CN1162043 C CN 1162043C
Authority
CN
China
Prior art keywords
diaphragm
membrane
tension
stress
glass transition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB998084190A
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English (en)
Chinese (zh)
Other versions
CN1308832A (zh
Inventor
马西尔斯・穆伦伯恩
马西尔斯·穆伦伯恩
・罗姆巴奇
皮尔敏·罗姆巴奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Microtronic AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microtronic AS filed Critical Microtronic AS
Publication of CN1308832A publication Critical patent/CN1308832A/zh
Application granted granted Critical
Publication of CN1162043C publication Critical patent/CN1162043C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49005Acoustic transducer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49007Indicating transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
CNB998084190A 1998-06-11 1999-06-10 含预定张力的膜的转换器的制造方法 Expired - Lifetime CN1162043C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DKPA199800791 1998-06-11
DK199800791A DK79198A (da) 1998-06-11 1998-06-11 Fremgangsmåde til fremstilling af en transducer med en membran med en forudbestemt opspændingskraft

Publications (2)

Publication Number Publication Date
CN1308832A CN1308832A (zh) 2001-08-15
CN1162043C true CN1162043C (zh) 2004-08-11

Family

ID=8097602

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998084190A Expired - Lifetime CN1162043C (zh) 1998-06-11 1999-06-10 含预定张力的膜的转换器的制造方法

Country Status (9)

Country Link
US (1) US6622368B1 (https=)
EP (1) EP1093703B1 (https=)
JP (1) JP4233218B2 (https=)
CN (1) CN1162043C (https=)
AU (1) AU4133999A (https=)
CA (1) CA2334640C (https=)
DE (1) DE69926757T2 (https=)
DK (2) DK79198A (https=)
WO (1) WO1999065277A1 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK79198A (da) * 1998-06-11 1999-12-12 Microtronic As Fremgangsmåde til fremstilling af en transducer med en membran med en forudbestemt opspændingskraft
US6760454B1 (en) * 2000-08-04 2004-07-06 Trw Inc. Passive voice-activated microphone and transceiver system
US6741709B2 (en) * 2000-12-20 2004-05-25 Shure Incorporated Condenser microphone assembly
US6800912B2 (en) * 2001-05-18 2004-10-05 Corporation For National Research Initiatives Integrated electromechanical switch and tunable capacitor and method of making the same
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
KR101059364B1 (ko) * 2003-11-20 2011-08-24 파나소닉 주식회사 일렉트릿 및 일렉트릿 컨덴서
JP4264103B2 (ja) 2004-03-03 2009-05-13 パナソニック株式会社 エレクトレットコンデンサーマイクロホン
EP1722595A4 (en) * 2004-03-05 2010-07-28 Panasonic Corp ELECTRET condenser
JP2006319595A (ja) * 2005-05-12 2006-11-24 Audio Technica Corp リボンマイクロホンの製造方法
JP2007116650A (ja) * 2005-09-26 2007-05-10 Yamaha Corp ダイヤフラム及びダイヤフラムの製造方法並びにコンデンサマイクロホン
EP1771036A3 (en) * 2005-09-26 2013-05-22 Yamaha Corporation Capacitor microphone and diaphragm therefor
JP4535046B2 (ja) 2006-08-22 2010-09-01 ヤマハ株式会社 静電容量センサ及びその製造方法
DE102005056759A1 (de) * 2005-11-29 2007-05-31 Robert Bosch Gmbh Mikromechanische Struktur zum Empfang und/oder zur Erzeugung von akustischen Signalen, Verfahren zur Herstellung einer mikromechanischen Struktur und Verwendung einer mikromechanischen Struktur
JP4787648B2 (ja) 2006-03-29 2011-10-05 パナソニック株式会社 コンデンサマイクロホンの製造方法およびコンデンサマイクロホン
JP4660426B2 (ja) * 2006-05-31 2011-03-30 三洋電機株式会社 センサ装置およびダイアフラム構造体
US8121315B2 (en) * 2007-03-21 2012-02-21 Goer Tek Inc. Condenser microphone chip
FR2922305B1 (fr) * 2007-10-12 2010-02-26 Senseor Procede de fabrication collective de capteurs de temperature et de pression sans calibrage a base de dispositifs a ondes acoustiques
IT1395550B1 (it) 2008-12-23 2012-09-28 St Microelectronics Rousset Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione
WO2010079574A1 (ja) * 2009-01-09 2010-07-15 パナソニック株式会社 Memsデバイス
JP5321111B2 (ja) * 2009-02-13 2013-10-23 船井電機株式会社 マイクロホンユニット
EP2679024B1 (en) * 2011-02-25 2020-01-08 Nokia Technologies Oy A transducer apparatus with a tension actuator
TWI430424B (zh) * 2011-03-18 2014-03-11 Pixart Imaging Inc 微機電系統聲壓感測元件及其製作方法
JP5875244B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
DE102013108464B4 (de) * 2013-08-06 2020-06-25 Tdk Corporation Verfahren zur Herstellung eines mikroelektromechanischen Wandlers
JP2020022038A (ja) * 2018-07-31 2020-02-06 Tdk株式会社 Memsマイクロフォン
WO2020112615A1 (en) * 2018-12-01 2020-06-04 Knowles Electronics, Llc Composite diaphragms having balanced stress

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019183B1 (https=) * 1970-03-10 1975-07-04
JPS5121334B2 (https=) * 1971-08-27 1976-07-01
JPS5650408B2 (https=) * 1973-07-05 1981-11-28
US3978731A (en) * 1974-02-25 1976-09-07 United Technologies Corporation Surface acoustic wave transducer
US4429192A (en) * 1981-11-20 1984-01-31 Bell Telephone Laboratories, Incorporated Electret transducer with variable electret foil thickness
US4524247A (en) * 1983-07-07 1985-06-18 At&T Bell Laboratories Integrated electroacoustic transducer with built-in bias
US4764690A (en) * 1986-06-18 1988-08-16 Lectret S.A. Electret transducing
US4872945A (en) * 1986-06-25 1989-10-10 Motorola Inc. Post seal etching of transducer diaphragm
NL8702589A (nl) * 1987-10-30 1989-05-16 Microtel Bv Elektro-akoestische transducent van de als elektreet aangeduide soort, en een werkwijze voor het vervaardigen van een dergelijke transducent.
US5177579A (en) * 1989-04-07 1993-01-05 Ic Sensors, Inc. Semiconductor transducer or actuator utilizing corrugated supports
US5170283A (en) * 1991-07-24 1992-12-08 Northrop Corporation Silicon spatial light modulator
JP3379106B2 (ja) * 1992-04-23 2003-02-17 セイコーエプソン株式会社 液体噴射ヘッド
FR2697675B1 (fr) * 1992-11-05 1995-01-06 Suisse Electronique Microtech Procédé de fabrication de transducteurs capacitifs intégrés.
US6030851A (en) * 1995-06-07 2000-02-29 Grandmont; Paul E. Method for overpressure protected pressure sensor
US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process
EP0981823A1 (en) * 1996-04-18 2000-03-01 California Institute Of Technology Thin film electret microphone
US6556417B2 (en) * 1998-03-10 2003-04-29 Mcintosh Robert B. Method to construct variable-area capacitive transducers
DK79198A (da) * 1998-06-11 1999-12-12 Microtronic As Fremgangsmåde til fremstilling af en transducer med en membran med en forudbestemt opspændingskraft
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system

Also Published As

Publication number Publication date
CN1308832A (zh) 2001-08-15
CA2334640A1 (en) 1999-12-16
DK1093703T3 (da) 2005-11-28
JP4233218B2 (ja) 2009-03-04
DE69926757T2 (de) 2006-06-14
US6622368B1 (en) 2003-09-23
EP1093703A1 (en) 2001-04-25
WO1999065277A1 (en) 1999-12-16
CA2334640C (en) 2008-12-30
DE69926757D1 (de) 2005-09-22
EP1093703B1 (en) 2005-08-17
JP2002518913A (ja) 2002-06-25
AU4133999A (en) 1999-12-30
DK79198A (da) 1999-12-12

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: EPCOS PRIVATE PRIVATE INVESTMENT LIMITED

Free format text: FORMER NAME: MICROTRONIC A/S

CP03 Change of name, title or address

Address after: Singapore Singapore

Patentee after: Sonion AS

Address before: Roskilde

Patentee before: Microtronic A/S

TR01 Transfer of patent right

Effective date of registration: 20170329

Address after: Tokyo, Japan, Japan

Patentee after: TDK Corp.

Address before: Singapore Singapore

Patentee before: Sonion AS

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20040811

CX01 Expiry of patent term