CN116202628A - Optical temperature sensor chip packaging method, optical temperature sensor chip and temperature measuring equipment - Google Patents
Optical temperature sensor chip packaging method, optical temperature sensor chip and temperature measuring equipment Download PDFInfo
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- CN116202628A CN116202628A CN202310071741.8A CN202310071741A CN116202628A CN 116202628 A CN116202628 A CN 116202628A CN 202310071741 A CN202310071741 A CN 202310071741A CN 116202628 A CN116202628 A CN 116202628A
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 26
- 230000001681 protective effect Effects 0.000 claims abstract description 60
- 239000012790 adhesive layer Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000013067 intermediate product Substances 0.000 claims abstract description 30
- 239000004033 plastic Substances 0.000 claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 11
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- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0879—Optical elements not provided otherwise, e.g. optical manifolds, holograms, cubic beamsplitters, non-dispersive prisms or particular coatings
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The application discloses an optical temperature sensor chip packaging method, an optical temperature sensor chip and temperature measuring equipment, wherein the method comprises the steps of manufacturing an optical lens unit, wherein the optical lens unit comprises an optical lens and a protective adhesive layer which are mutually attached; adopting plastic packaging material to perform plastic packaging molding on the substrate, the infrared temperature measuring bare chip and the optical lens unit to obtain a first optical temperature sensor chip intermediate product; grinding the surface of one side, far away from the substrate, of the first optical temperature sensor chip intermediate product to obtain a second optical temperature sensor chip intermediate product, wherein the second optical temperature sensor chip intermediate product comprises a bare residual protective adhesive layer; removing the residual protective adhesive layer by adopting a preset solvent to expose the optical lens, so as to obtain an optical temperature sensor chip; according to the optical temperature sensor chip optical window protection method, the protection adhesive layer is arranged on the surface of the optical lens in advance and is removed at the end of packaging, so that the optical window of the optical temperature sensor chip is protected, the pollution of the filling material to the optical window is effectively avoided, and the yield of the optical temperature sensor is improved.
Description
Technical Field
The application relates to the technical field of chip packaging, in particular to an optical temperature sensor chip packaging method, an optical temperature sensor chip and temperature measuring equipment.
Background
The optical temperature sensor chip is finally formed by a plastic package mode after the assembly of each element is completed. In the field of infrared thermometry, an optical temperature sensor chip typically includes an infrared thermometry die and an optical lens disposed on an upper surface thereof. In the actual packaging process, due to the inclination of the surface of the infrared temperature measuring bare chip caused by the assembly process of the infrared temperature measuring bare chip, the inclination of the surface of the optical lens caused by uneven adhesive layers in the bonding process of the infrared temperature measuring bare chip and the optical lens, and the inclination increase of the surface of the optical lens caused by the compression in the plastic packaging process, the factors are overlapped to cause that the surface of the optical lens generally has a certain inclination.
When the optical temperature sensor chip is packaged, the optical window, namely the optical lens, needs to be shielded and protected, and the packaged optical lens is embedded in the filling layer. In the conventional process, the mold top cover used for filling is usually provided with a fitting structure which is attached to the optical lens. However, because of the presence of the inclination (tilt > 20 μm) of the optical lens which is unavoidable as described above, the mating structure of the optical lens and the mold upper cover cannot be completely fitted, and a larger or smaller void exists. When injection molding is performed, the filling material is inevitably permeated into the gap and covers the upper surface of the optical lens, and the quality of the optical temperature sensor chip is affected due to pollution to the optical lens. It is verified that the contamination of the package with the filling material or the coverage of the optical lens is a major cause of the increase of the yield.
Therefore, there is a need to find an optical temperature sensor chip packaging method that can effectively overcome the above-mentioned drawbacks.
Disclosure of Invention
The invention aims to provide an optical temperature sensor chip packaging method, an optical temperature sensor chip and temperature measuring equipment.
In order to achieve the purpose of the application, the application provides the following technical scheme:
in a first aspect, there is provided a method of packaging an optical temperature sensor chip, the method comprising:
manufacturing an optical lens unit, wherein the optical lens unit comprises an optical lens and a protective adhesive layer which are mutually attached;
adopting a plastic package material to perform plastic package molding on a substrate, an infrared temperature measuring bare chip and the optical lens unit to obtain a first optical temperature sensor chip intermediate product, wherein the protective adhesive layer is arranged on one side of the optical lens, which is far away from the substrate;
grinding the surface of one side of the first optical temperature sensor chip intermediate product far away from the substrate to obtain a second optical temperature sensor chip intermediate product, wherein the second optical temperature sensor chip intermediate product comprises a bare residual protective adhesive layer;
and removing the residual protective adhesive layer by adopting a preset solvent to expose the optical lens, thereby obtaining the optical temperature sensor chip.
In a preferred embodiment, the manufacturing of the optical lens unit includes:
preparing a wafer-level lens array, and coating high-temperature-resistant water-washing glue on one side surface of the wafer-level lens array to form the protective glue layer;
and after the protective adhesive layer is cured, cutting the wafer-level lens array coated with the protective adhesive layer to obtain at least two wafer-level optical lens units.
In a preferred embodiment, the preset solvent is one or a mixture of two of water and an organic solvent, and the step of removing the residual protective adhesive layer by using the preset solvent to expose the optical lens includes:
and dissolving the residual protective adhesive layer by adopting one or a mixture of two of water and an organic solvent with the angle of 60-100 degrees so as to expose the optical lens.
In a preferred embodiment, the method for obtaining the intermediate product of the first optical temperature sensor chip by plastic packaging the substrate, the infrared temperature measuring bare chip and the optical lens unit with a plastic packaging material includes:
attaching the infrared temperature measuring bare chip to the surface of the substrate;
attaching the integrated circuit die to the surface of the substrate, wherein the infrared temperature measuring die and the integrated circuit die are electrically connected through the substrate;
attaching an adhesion layer to a side surface opposite to the side surface of the optical lens, which is attached with the protective adhesive layer, and connecting the optical lens unit with the optical area of the infrared temperature measuring bare chip through the adhesion layer;
and filling the periphery of one side of the substrate provided with the infrared temperature measuring bare chip, the optical lens unit and the integrated circuit bare chip with plastic packaging material to form a filling layer so as to obtain the intermediate product of the first optical temperature sensor chip.
In a preferred embodiment, in the first optical temperature sensor chip intermediate product, a distance between a side surface of the protective adhesive layer, which is far away from the infrared temperature measurement bare chip, and a side surface of the filling layer, which is far away from the infrared temperature measurement bare chip, is L1, and L1 > 0.
In a preferred embodiment, the optical lens is a convex lens, a concave lens, or a planar lens or a micro-nano lens, and the maximum thickness L2 of the remaining protective glue layer is greater than the difference between the maximum thickness L3 of the optical lens and the minimum thickness L4 of the optical lens.
In a preferred embodiment, the molding compound includes one or a mixture of two of epoxy resin and high thermal conductive resin.
In a preferred embodiment, a plurality of the optical temperature sensor chips are arranged in an array, and after the residual protective adhesive layer is removed by using a preset solvent to expose the optical lens, the method further includes:
drying and stress releasing the optical temperature sensor chip through a drying process;
printing or silk-screen printing is carried out on a plurality of optical temperature sensor chips which are arranged in an array mode, and cutting is carried out to obtain the single optical temperature sensor chip.
In a second aspect, there is provided an optical temperature sensor chip obtained by the optical temperature sensor chip packaging method according to any one of the first aspects.
In a third aspect, there is provided a temperature measuring device comprising an optical temperature sensor chip obtained by encapsulation according to any one of the encapsulation methods of the first aspect or according to the second aspect.
Compared with the prior art, the application has the following beneficial effects:
the application provides an optical temperature sensor chip packaging method, an optical temperature sensor chip and temperature measuring equipment, wherein the method comprises the steps of manufacturing an optical lens unit, wherein the optical lens unit comprises an optical lens and a protective adhesive layer which are mutually attached; adopting plastic packaging material to perform plastic packaging molding on the substrate, the infrared temperature measuring bare chip and the optical lens unit to obtain a first optical temperature sensor chip intermediate product, wherein the protective adhesive layer is arranged on one side of the optical lens away from the substrate; grinding the surface of one side of the first optical temperature sensor chip intermediate product far away from the substrate to obtain a second optical temperature sensor chip intermediate product, wherein the second optical temperature sensor chip intermediate product comprises a bare residual protective adhesive layer; removing the residual protective adhesive layer by adopting a preset solvent to expose the optical lens, so as to obtain an optical temperature sensor chip; according to the optical temperature sensor chip, the protective adhesive layer is arranged on the surface of the optical lens in advance and is removed at the end of packaging to achieve the purpose of protecting the optical window of the optical temperature sensor chip, so that the pollution of a filling material to the optical window is effectively avoided, the yield of the optical temperature sensor is improved, the protective adhesive layer can effectively avoid the influence of high-temperature filling on softening deformation and the like of the optical temperature sensor chip, and finally, the optical temperature sensor chip can be removed only by washing without any influence on the optical window or the optical temperature sensor chip, and the process is simple and easy to implement.
Drawings
FIG. 1 is a flow chart of an optical temperature sensor chip packaging method in the present embodiment;
fig. 2 is a structural view of an optical temperature sensor chip in the present embodiment;
FIG. 3 is a flow chart of the manufacturing process of the optical lens unit in the present embodiment;
fig. 4 is a schematic diagram of a process flow of packaging an optical temperature sensor chip in the present embodiment.
Reference numerals:
100-optical temperature sensor chip, 10-optical lens unit, 11-optical lens, 12-protective adhesive layer, 20-wafer level lens array, 30-substrate, 40-infrared temperature measuring bare chip, 200-first optical temperature sensor chip intermediate product, 50-integrated circuit bare chip, 60-filling layer, 70-adhesion layer, 300-second optical temperature sensor chip intermediate product, 80-residual protective adhesive layer, 90-bonding wire.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or an implicit indication of the number of technical features being indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
Examples
As shown in fig. 1 and 2, the present embodiment provides a method for packaging an optical temperature sensor chip, which is a packaging method adopting the quateum principle, and the optical temperature sensor chip 100 is obtained by packaging. The method comprises the following steps:
s1, manufacturing an optical lens unit 10, wherein the optical lens unit 10 comprises an optical lens (lens) 11 and a protective adhesive layer 12 which are mutually adhered. Specifically, step S1 includes:
s11, preparing a wafer-level lens array 20, and coating high-temperature-resistant washing glue on one side surface of the wafer-level lens array 20 to form a protective glue layer 12.
The high temperature resistant water washing glue is a glue water mixture product which can be dissolved in hot water or a hot organic solvent after being solidified, and has the characteristic of high temperature resistance after being solidified, such as high temperature resistant hydrolysis glue 98316 of Gule Pont sold in the market, and the like. The high temperature water washing resistant glue product is not limited in the embodiment, and all the glue with the performance are included in the technical scheme of the embodiment.
And, before step S1, the lens array needs to be processed into a wafer-level lens array to meet the preferred optical requirements. The processing of the wafer level lens is a conventional technical means in the art, and will not be described herein.
And S12, after the protective adhesive layer 12 is cured, cutting the wafer-level lens array coated with the protective adhesive layer 12 to obtain at least two wafer-level optical lens units 10.
Specifically, the protective adhesive layer is cured under heating.
The optical lens 11 may be a planar lens, and controls only the optical transmittance in a specific wavelength band; but also convex, concave or micro-nano lenses. The optical lens 11 plays a role in controlling the optical transmittance in a specific wavelength band and also plays a role in controlling the field angle (FOV). Preferably, the optical lens is made of silicon, germanium, vulcanized glass and the like.
The optical lens 11 in this embodiment has optical characteristics and satisfies 50% or more of the integral of the total cumulative transmittance in the 3-9 μm band. Preferably, the optical lens 11 can control the FOV of mid-far infrared light waves with a wavelength of 2-14 μm. The control may be to expand or contract the FOV.
S2, molding the substrate (substrate) 30, the infrared temperature measuring bare chip (IR) 40 and the optical lens unit 10 by using a molding compound to obtain the first optical temperature sensor chip intermediate product 200. The protective adhesive layer 12 is disposed on a side of the optical lens 11 away from the substrate 30.
The substrate 30 (printed circuit board) and the infrared temperature measuring die 40 are commonly used devices, and the embodiment is not limited thereto.
Specifically, step S2 includes:
s21, mounting an infrared temperature measuring bare chip 40 on the surface of a substrate 30;
s22, mounting the integrated circuit bare chip 50 on the surface of the substrate 30, and electrically connecting the infrared temperature measuring bare chip 50 and the integrated circuit bare chip 50 through the substrate 30;
s23, attaching an adhesive layer 70 on one side surface opposite to the side surface of the optical lens 11, to which the protective adhesive layer 12 is attached, and connecting the optical lens unit 10 with the optical area of the infrared temperature measuring bare chip 40 through the adhesive layer 70;
and S24, filling the periphery of the side of the substrate provided with the infrared temperature measuring bare chip 40, the optical lens unit 10 and the integrated circuit bare chip 50 by using plastic packaging material to form a filling layer 60 so as to obtain a first optical temperature sensor chip intermediate product 200.
The sequence of steps S22 and S23 is not limited.
In the above step S21 and S24, the mounting process of the infrared temperature measurement die 40 or the integrated circuit die 50 is referred to as surface mounting technology (SMT chip).
And, the infrared thermometry die 40 includes an optical area for receiving an external optical signal, which is located at a side surface away from the substrate 30, i.e., at a side surface away from the protective adhesive layer 12. The optical lens 11 is connected to the optical area of the infrared thermometry die 40 to adjust the optical parameters of the optical signal.
And, the adhesive layer 70 in step S22 may be an optical film or an optical adhesive formed by curing. Preferably, the adhesive layer 70 satisfies that the integral of the total integrated transmittance is 50% or more in the 3-9 μm band.
And, the molding compound in this embodiment includes one or a mixture of two of epoxy resin and high heat conductive resin.
It should be noted that the integrated circuit die 50 is mainly used for implementing digital-to-analog conversion of signals and communication with the MCU. In the present embodiment, the integrated circuit die 50 is mounted on the substrate 30 and electrically connected to the substrate 30 by bonding wires 90. Because the materials used for the infrared temperature measurement die 40 and the integrated circuit die 50 are different, and the conventional silicon-based digital circuit is difficult to integrate together, because the process is different, the wafer size cannot be the same, and wafer-wafer bonding cannot be performed, so in this embodiment, the integrated circuit die 50 and the infrared temperature measurement die 40 are arranged on the substrate 30 at intervals, and the connection between the infrared temperature measurement die 40 and the integrated circuit die 50 is realized by wiring the substrate 30, so that the circuit interference is reduced, the layout compactness is improved, and meanwhile, the process requirements and the cost are also reduced.
Preferably, the protective glue layer 12 is completely embedded in the filler layer 60. That is, in the first optical temperature sensor chip intermediate product 200 obtained in the step S2, the distance between the surface of the protective adhesive layer 12 away from the infrared temperature measurement die 40 and the surface of the filling layer 60 away from the infrared temperature measurement die 40 is L1, and L1 > 0.
And S3, grinding the surface of one side, far away from the substrate 30, of the first optical temperature sensor chip intermediate product 200 to obtain a second optical temperature sensor chip intermediate product 300, wherein the second optical temperature sensor chip intermediate product 300 comprises the exposed residual protective adhesive layer 80.
When this step is performed, the removed portions are ground to be equal in thickness everywhere. Part of the filling layer 60 and part of the protective glue layer 12 are removed by grinding, without affecting the rest of the components.
Preferably, to ensure that the polishing process does not damage the optical lens, the maximum thickness L2 of the remaining protective glue layer 80 is greater than the difference between the maximum thickness L3 of the optical lens 11 and the minimum thickness L3 of the optical lens.
Illustratively, when the optical lens 11 is a convex lens, the surface of the remaining protective adhesive layer 80 that is attached to the optical lens 11 is a concave surface, and the exposed surface is a flat surface. The maximum thickness L2 of the remaining protective glue layer 80 is the thickness of its edge. The convex lens comprises a substrate with a cube structure and a convex part extending from the substrate. The maximum thickness L3 of the optical lens is the distance from the middle apex of the convex portion to the bottom of the substrate. Therefore, when the maximum thickness L2 of the remaining protective adhesive layer is greater than the difference between the maximum thickness L3 of the optical lens and the minimum thickness L3 of the optical lens, the damage of the optical lens 11 caused by grinding to the optical lens 11 can be effectively avoided, and the influence on the optical parameters thereof is avoided.
Of course, the present embodiment is not limited to the above-mentioned dimensions, and the thickness of the protective adhesive layer 12 in the optical lens unit 10 is exemplified as 100 μm, and the maximum thickness of the protective adhesive layer 80 remaining after grinding is 70 μm.
Therefore, the upper surface of the optical lens 11 is protected by the protective adhesive layer 12 in this embodiment, so as to avoid the pollution of the filling material on the surface of the optical lens 11 during filling and avoid the damage to the optical lens 11 during grinding.
S4, removing the residual protective adhesive layer 80 by adopting a preset solvent to expose the optical lens 11, and obtaining the optical temperature sensor chip 100. Wherein the preset solvent is one or a mixture of two of water and an organic solvent, and the organic solvent is preferably alcohol, ketone, ether and the like, and more preferably ethanol.
It should be noted that the performances of the selected preset detergent and the high-temperature resistant water-washing glue are matched, namely, the detergent can fully dissolve the residual protective glue layer according to the similar compatibility principle.
And, in order to shorten the process of this step S4 and to enhance the cleaning effect to rapidly and thoroughly remove the remaining protective adhesive layer 80, it is generally necessary to perform washing under 60 to 100 °.
Of course, after the washing is completed, the method further includes drying and stress releasing the optical temperature sensor chip 100 through a drying process.
It should be noted that, the optical temperature sensor chips 100 are generally arranged in an array, and after the drying is completed, a plurality of optical temperature sensor chips 100 arranged in an array are printed or silk-screened, and cut to obtain individual optical temperature sensor chips 100.
The embodiment further provides a temperature measuring device, which includes a device body, an optical temperature sensor chip 100 disposed in the device body and facing the outside, wherein the optical temperature sensor chip 100 receives infrared rays radiated by an object to be measured and performs temperature measurement. The shape and structure of the device body are not limited in this embodiment, and the specific position of the optical temperature sensor chip 100 in the device body is not limited, and the optical temperature sensor chip may be embedded or externally arranged.
In summary, the embodiment provides an optical temperature sensor packaging method, an optical temperature sensor and a temperature measuring device, wherein the optical temperature sensor packaging method is characterized in that a protective adhesive layer is arranged on the surface of an optical lens in advance and is removed at the end of packaging to protect an optical window of the optical temperature sensor, so that pollution of a filling material to the optical window is effectively avoided, the yield of the optical temperature sensor is improved, the protective adhesive layer can effectively avoid the influence of high-temperature filling on softening deformation and the like of the optical temperature sensor, and finally, the optical temperature sensor packaging method only needs to be removed by washing without any influence on the optical window or the optical temperature sensor, and the process is simple and easy to implement.
All the above-mentioned optional technical schemes can be combined arbitrarily to form optional embodiments of the application, and any plurality of embodiments can be combined, so that the requirements for coping with different application scenes are obtained, and are all within the protection scope of the application, and are not described in detail herein.
It should be noted that the foregoing description is only a preferred embodiment of the present application, and is not intended to limit the present application, but any modifications, equivalents, improvements, etc. within the spirit and principles of the present application are intended to be included in the scope of the present application.
Claims (10)
1. An optical temperature sensor chip packaging method, characterized in that the method comprises:
manufacturing an optical lens unit, wherein the optical lens unit comprises an optical lens and a protective adhesive layer which are mutually attached;
adopting a plastic package material to perform plastic package molding on a substrate, an infrared temperature measuring bare chip and the optical lens unit to obtain a first optical temperature sensor chip intermediate product, wherein the protective adhesive layer is arranged on one side of the optical lens, which is far away from the substrate;
grinding the surface of one side of the first optical temperature sensor chip intermediate product far away from the substrate to obtain a second optical temperature sensor chip intermediate product, wherein the second optical temperature sensor chip intermediate product comprises a bare residual protective adhesive layer;
and removing the residual protective adhesive layer by adopting a preset solvent to expose the optical lens, thereby obtaining the optical temperature sensor chip.
2. The method of claim 1, wherein the fabricating an optical lens unit comprises:
preparing a wafer-level lens array, and coating high-temperature-resistant water-washing glue on one side surface of the wafer-level lens array to form the protective glue layer;
and after the protective adhesive layer is cured, cutting the wafer-level lens array coated with the protective adhesive layer to obtain at least two wafer-level optical lens units.
3. The method of claim 1, wherein the predetermined solvent is one or a mixture of two of water and an organic solvent, and the removing the remaining protective gel layer with the predetermined solvent to expose the optical lens comprises:
and dissolving the residual protective adhesive layer by adopting one or a mixture of two of water and an organic solvent with the angle of 60-100 degrees so as to expose the optical lens.
4. The method of claim 1, wherein the molding the substrate, the infrared thermometry die, and the optical lens unit with the molding compound to obtain the first optical temperature sensor chip intermediate product comprises:
attaching the infrared temperature measuring bare chip to the surface of the substrate;
attaching the integrated circuit die to the surface of the substrate, wherein the infrared temperature measuring die and the integrated circuit die are electrically connected through the substrate;
attaching an adhesion layer to a side surface opposite to the side surface of the optical lens, which is attached with the protective adhesive layer, and connecting the optical lens unit with the optical area of the infrared temperature measuring bare chip through the adhesion layer;
and filling the periphery of one side of the substrate provided with the infrared temperature measuring bare chip, the optical lens unit and the integrated circuit bare chip with plastic packaging material to form a filling layer so as to obtain the intermediate product of the first optical temperature sensor chip.
5. The method of claim 4, wherein in the first optical temperature sensor chip intermediate product, a distance between a side surface of the protective glue layer away from the infrared thermometry die and a side surface of the filler layer away from the infrared thermometry die is L1, L1 > 0.
6. The method of claim 1, wherein the optical lens is a convex lens, a concave lens, a planar lens, or a micro-nano lens, and the maximum thickness L2 of the remaining protective glue layer is greater than the difference between the maximum thickness L3 of the optical lens and the minimum thickness L3 of the optical lens.
7. The method of claim 1, wherein the molding compound comprises one or a mixture of two of an epoxy resin and a high thermal conductivity resin.
8. The method of claim 1, wherein the optical temperature sensor chips are arranged in an array, and wherein after removing the remaining protective gel layer with a predetermined solvent to expose the optical lens, the method further comprises:
drying and stress releasing the optical temperature sensor chip through a drying process;
printing or silk-screen printing is carried out on a plurality of optical temperature sensor chips which are arranged in an array mode, and cutting is carried out to obtain the single optical temperature sensor chip.
9. An optical temperature sensor chip obtained by the optical temperature sensor chip packaging method according to any one of claims 1 to 8.
10. Temperature measuring device, characterized in that it comprises an optical temperature sensor chip obtained by encapsulation according to any one of claims 1-8 or obtained by encapsulation according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310071741.8A CN116202628A (en) | 2023-01-19 | 2023-01-19 | Optical temperature sensor chip packaging method, optical temperature sensor chip and temperature measuring equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310071741.8A CN116202628A (en) | 2023-01-19 | 2023-01-19 | Optical temperature sensor chip packaging method, optical temperature sensor chip and temperature measuring equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116202628A true CN116202628A (en) | 2023-06-02 |
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| CN202310071741.8A Pending CN116202628A (en) | 2023-01-19 | 2023-01-19 | Optical temperature sensor chip packaging method, optical temperature sensor chip and temperature measuring equipment |
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| Country | Link |
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| CN (1) | CN116202628A (en) |
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- 2023-01-19 CN CN202310071741.8A patent/CN116202628A/en active Pending
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