CN116184166A - Testing device and testing method for flexible circuit board - Google Patents
Testing device and testing method for flexible circuit board Download PDFInfo
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- CN116184166A CN116184166A CN202310127825.9A CN202310127825A CN116184166A CN 116184166 A CN116184166 A CN 116184166A CN 202310127825 A CN202310127825 A CN 202310127825A CN 116184166 A CN116184166 A CN 116184166A
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- 238000005452 bending Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims description 7
- 238000001125 extrusion Methods 0.000 claims description 4
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- 101100162020 Mesorhizobium japonicum (strain LMG 29417 / CECT 9101 / MAFF 303099) adc3 gene Proteins 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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Abstract
The application discloses a testing arrangement and test method of flexible circuit board belongs to circuit test technical field, and a testing arrangement of flexible circuit board includes: the device comprises a control module, a test module and a bending device; the control module is respectively connected with the test module and the bending device through signals; the test module tests the circuit board to be tested under the control of the control module; the testing module comprises an output electrode chuck and an input electrode chuck which are used for clamping a circuit board to be tested; the bending device comprises a plurality of upper slide bars and lower slide bars, and the upper slide bars and the lower slide bars are arranged between the output electrode clamping head and the input electrode clamping head; the application provides a testing device and a testing method capable of providing various bending tests for a flexible circuit board.
Description
Technical Field
The application relates to the technical field of circuit testing, in particular to a testing device and a testing method of a flexible circuit board.
Background
The flexible circuit board used by the optical device is internally provided with a plurality of FPC circuits, and can be bent to different degrees when in use, thereby providing great convenience for product design. However, the application fields of the flexible circuit board by each company and each customer are inconsistent, so the bending situations of the flexible circuit board are different, some users need to bend the flexible circuit board once, some customers need to bend the flexible circuit board multiple times, and how to measure the performance of the FPC circuit after bending the flexible circuit board is always very important in the field.
At present, bending tests for flexible circuit boards generally uniformly bend the flexible circuit boards at the same positions and at the same angles. Therefore, the flexible circuit board produced in the factory has good performance during in-factory testing; however, after the customer receives the flexible circuit board and applies the circuit board to the actual product, the performance of the flexible circuit board is poor. If the testing device of the flexible circuit board is set individually according to the requirement of the user, the required testing device and testing equipment are increased continuously due to the change of the requirement of the user, so that the testing cost is increased.
As can be seen, there is currently a lack of a testing apparatus and testing method in the market that can provide multiple bending tests for flexible circuit boards and avoid the increase of testing costs.
Disclosure of Invention
The content of the present application is intended to introduce concepts in a simplified form that are further described below in the detailed description. The section of this application is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
As a first aspect of the present application, in order to solve the technical problems mentioned in the above background section, some embodiments of the present application provide a testing apparatus for a flexible circuit board, including: the device comprises a control module, a test module and a bending device; the control module is respectively connected with the test module and the bending device through signals; the test module tests the circuit board to be tested under the control of the control module;
the testing module comprises an output electrode chuck and an input electrode chuck which are used for clamping a circuit board to be tested;
the bending device comprises a plurality of upper slide bars and lower slide bars, wherein the upper slide bars and the lower slide bars are arranged between the output electrode chuck and the input electrode chuck and are respectively positioned at the upper side and the lower side of a connecting line of the output electrode chuck and the input electrode chuck, so that the upper slide bars and the lower slide bars are positioned at the upper side and the lower side of a circuit board to be tested;
the upper slide bar and the lower slide bar are respectively provided with a first driving device, and the first driving devices are controlled by the control module to drive the upper slide bar and the lower slide bar to slide along a first direction parallel to the connecting direction of the output electrode chuck and the input electrode chuck or slide along a second direction perpendicular to the first direction, so that the circuit board to be tested is bent under the staggered extrusion of the upper slide bar and the lower slide bar.
According to the technical scheme, when the circuit board to be tested is required to be tested, the upper slide bar and the lower slide bar are controlled to be positioned at different positions of the circuit board to be tested through the control module, and the circuit board to be tested is pressed, so that the effect of bending the circuit board to be tested is achieved; when the bending angle and the bending number of the circuit board to be tested need to be adjusted, the circuit board to be tested is extruded after the upper slide bar and the lower slide bar reach the preset positions, and then the bending condition generated by the extrusion of the upper slide bar and the lower slide bar of the circuit board to be tested is the expected bending condition, so that the completed measurement work meets the expected requirement under the test condition; meanwhile, for the test cost, no new test equipment is required to be additionally arranged no matter how the test requirement is changed, so that one test equipment can meet the bending test of all conditions, and the test cost is reduced to the greatest extent.
The length of the circuit boards to be tested is often not uniform and the degree of tension of the circuit boards to be tested is also an important consideration during the testing process.
Further, the test module comprises a movable slide bar, the movable slide bar is fixedly connected with the output electrode chuck, a second driving device is arranged on the movable slide bar and is in signal connection with the control module, and the control module controls the second driving device to drive the movable slide bar to move back and forth along the first direction.
The movable slide bar is arranged, so that the flexible circuit board to be tested can adapt to circuit boards to be tested with different lengths, the tensioning degree of the circuit board to be tested is controlled by means of the movable slide bar when the circuit board to be tested is bent, the flexible circuit board with different lengths can be adapted, the situation that new testing equipment is additionally added to the flexible circuit board because of different models is avoided, the tensioning degree of the flexible circuit board can be controlled, and more personalized testing environment is provided.
Further, the test module comprises a test assembly, a test circuit is arranged in the test assembly, and the input electrode clamp and the output electrode clamp respectively form an input end and an output end of the test assembly.
The input end and the output end of the test assembly are formed through the input electrode clamp and the output electrode clamp, so that when the circuit board to be tested is clamped, the connection between the input end and the output end of the test assembly and the circuit board to be tested is completed, the test efficiency can be improved, and the influence of extra circuit connection work on the test efficiency is avoided.
Further, the test circuit comprises a test chip, a pull-up resistor and a test power supply; the test chip is provided with a plurality of ADC interfaces and GPIO interfaces with the same number as the ADC interfaces; the GPIO interface is connected with the output electrode chuck, the ADC interface is connected with the input electrode chuck, a pull-up resistor is connected between the ADC interface and the input electrode chuck, and the pull-up resistor is connected to a test power supply.
By arranging the pull-up resistor and a test power supply communicated with the pull-up resistor, the test circuit can judge the short circuit, the open circuit and the virtual break of each circuit on the circuit board to be tested; three tests can be completed at one time after the circuit board to be tested is mounted on the test module.
Furthermore, the number of the ADC interfaces and the GPIO interfaces is larger than the number of FPC lines to be tested on the circuit board to be tested.
The number of the ADC interfaces and the GPIO interfaces is more, all circuits of the circuit board to be tested can be tested, and when the circuit boards to be tested of different types are tested, enough ADC interfaces and GPIO interfaces can be suitable for flexible circuit boards of different types, so that the number of FPC circuits on the flexible circuit board is prevented from being larger than that of the ADC interfaces, and the circuits cannot be tested.
Furthermore, when the circuit board to be tested is mounted on the test module, the GPIO outputs a high level first, and if the signal received by the ADC interface is also a high level, the circuit board to be tested is not short-circuited.
The GPIO outputs a voltage signal of 1 and can test whether the circuit board to be tested has a short circuit or not.
Furthermore, when the GPIO outputs a voltage signal of 0V, if the signal received by the ADC interface is also 0V, the circuit board to be tested is indicated to have no short circuit, the whole test process is simple, and a complex circuit structure or evaluation flow is not needed.
The GPIO outputs a voltage signal of 0, so that whether the circuit board to be tested has an open circuit or not can be tested, the whole test process is simple, and a complex circuit structure or an evaluation flow is not needed.
As a second aspect of the present application, in order to solve the technical problems mentioned in the background section above, some embodiments of the present application provide a method for testing a flexible circuit board, including the following steps:
step 1: mounting a circuit board to be tested on a test module;
step 2: the control module controls the first driving device and the second driving device to drive the upper slide bar, the lower slide bar and the movable slide bar to move so as to bend the circuit board to be tested to a proper angle;
step 3: the GPIO port outputs a high-level voltage signal, detects the voltage signal received by the ADC port, and if the signal received by the ADC port is high level, executes the step 4; otherwise, the flexible circuit board has a short circuit problem, and the test is ended;
step 4: the GPIO port outputs a signal with the voltage of 0, and if the voltage signal received by the ADC port is 0, the performance of the circuit board to be tested is qualified under the bending condition; otherwise, executing the step 5;
step 5: judging the voltage signal received by the ADC port, if the voltage signal received by the ADC port is the output voltage of the test power supply, the circuit board to be tested is broken, and the circuit board to be tested is a defective product; if the voltage signal received by the ADC port is larger than zero and smaller than the output voltage of the test power supply, taking the voltage value as the performance parameter of the test circuit board under the bending condition; repeating the steps 2 to 5 to obtain the performance of the circuit board to be tested under different bending conditions.
According to the testing method of the flexible circuit board, after the circuit board to be tested is mounted on the testing module, the performance parameters of the circuit board to be tested can be obtained at one time without carrying out other additional mounting steps, and whether the circuit board to be tested is a bad product or not is judged.
Further, in step 1, the positive electrode and the negative electrode of the circuit board to be tested are respectively mounted on the input electrode chuck and the output electrode chuck, so that each ADC interface and each GPIO interface of the test circuit are communicated with the head and tail ends of one circuit of the circuit board to be tested.
Each circuit of the circuit board to be tested is respectively communicated with the ADC interface and the GPIO interface, so that each circuit of the circuit board to be tested can be tested, the detection effect is improved, the whole condition of the circuit board to be tested can be analyzed, the production condition of the circuit board to be tested can be traced according to the performance parameters of products, and the problem of the circuit board to be tested in the production process can be found timely.
Further, the step 2 specifically includes the following steps:
step 21: the control module controls the first driving device to drive the upper slide bar and the lower slide bar to move to the position to be bent on the circuit board to be tested;
step 22: the control module controls the first driving device to drive the upper slide bar and the lower slide bar to move oppositely so as to bend the circuit board to be tested; simultaneously, the second driving device is synchronously controlled to control the movement of the movable slide rod so as to control the tensioning of the circuit board to be tested.
Through step 2, can be according to the demand with the circuit board that awaits measuring buckle as required to the number of times of buckling and the degree of buckling all can be controlled, and under the cooperation of movable slide bar, the degree of tensioning after buckling of circuit board can also be controlled.
In summary, the present application provides a testing apparatus and a testing method capable of providing a plurality of bending tests for a flexible circuit board.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the application and to provide a further understanding of the application with regard to the other features, objects and advantages of the application. The drawings of the illustrative embodiments of the present application and their descriptions are for the purpose of illustrating the present application and are not to be construed as unduly limiting the present application.
In addition, the same or similar reference numerals denote the same or similar elements throughout the drawings. It should be understood that the figures are schematic and that elements and components are not necessarily drawn to scale.
In the drawings:
fig. 1 is a schematic structural diagram of a testing device for a flexible circuit board.
Fig. 2 is a circuit diagram of a test circuit.
Fig. 3 is a circuit diagram showing the normal test result in the FPC loop test of the flexible circuit board.
In the FPC loop test of the flexible circuit board of fig. 4, the test result is a circuit diagram of the circuit breaking.
In the FPC loop test of the flexible circuit board of fig. 5, the test result is a circuit diagram of a broken circuit.
Fig. 6 is a flow chart of a method of testing a flexible circuit board.
Reference numerals:
1. an upper slide bar; 2. a lower slide bar; 3. an input electrode chuck; 4. an output electrode chuck; 5. a movable slide bar; 6. a circuit board to be tested.
Detailed Description
Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. It should be understood that the drawings and embodiments of the present disclosure are for illustration purposes only and are not intended to limit the scope of the present disclosure.
It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings. Embodiments of the present disclosure and features of embodiments may be combined with each other without conflict.
The present disclosure will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Referring to fig. 1: the testing device of the flexible circuit board comprises a control module, a testing module and a bending device; the control module is respectively connected with the test module and the bending device in a signal mode, and the test module tests the circuit board to be tested under the control of the control module.
The testing module comprises an output electrode chuck 4 and an input electrode chuck 3 for clamping a circuit board 6 to be tested, the bending device comprises a plurality of upper slide bars 1 and lower slide bars 2, the upper slide bars 1 and the lower slide bars 2 are arranged between the output electrode chuck 4 and the input electrode chuck 3, and the upper slide bars 1 and the lower slide bars 2 are respectively positioned on the upper side and the lower side of a connecting line of the output electrode chuck 4 and the input electrode chuck 3, so that the upper slide bars 1 and the lower slide bars 2 are positioned on the upper side and the lower side of the circuit board 6 to be tested.
The upper slide bar 1 and the lower slide bar 2 are respectively provided with a first driving device, and the first driving devices are controlled by the control module to drive the upper slide bar 1 and the lower slide bar 2 to slide along a first direction of the connection direction of the output electrode chuck 4 and the input electrode chuck 3 or slide along a second direction perpendicular to the first direction, so that the circuit board 6 to be tested is bent under the staggered extrusion of the upper slide bar 1 and the lower slide bar 2.
According to the technical scheme, when the circuit board 6 to be tested is required to be tested, the upper slide bar 1 and the lower slide bar 2 are controlled to be arranged at different positions of the circuit board 6 to be tested through the control module, and the circuit board 6 to be tested is pressed, so that the effect of bending the circuit board 6 to be tested is achieved. In practical use, the circuit board 6 to be tested can be bent to different degrees by controlling the positions of the upper slide bar 1 and the lower slide bar 2.
Further, when the circuit board to be tested is extruded, the upper slide bar moves downwards, and the upper slide bar moves upwards.
Therefore, it is possible to provide the circuit board with bending in two directions when the circuit board to be tested is pressed, and in order to make the circuit board to be tested exhibit an S-shaped bending condition, the upper slide bar and the lower slide bar are alternately arranged when the circuit board to be tested is pressed, as shown with reference to fig. 1.
The length of the flexible circuit board of different models is inconsistent, so in order to adapt to the flexible circuit board of different length, in order to provide different tensioning degree for the flexible circuit board when buckling test simultaneously, this application still provides following technical scheme:
the test module further comprises a test assembly and a movable slide bar 5, wherein a test circuit is arranged in the test assembly and is mainly used for testing the performance of the flexible circuit board, and the input electrode clamping head 3 and the output electrode clamping head 4 respectively form an input end and an output end of the test assembly. The movable slide bar 5 is fixedly connected with the output electrode chuck 4, a second driving device is arranged on the movable slide bar 5 and is in signal connection with the control module, and the control module controls the second driving device to drive the movable slide bar 5 to move along the first direction, so that the effect of loosening and tensioning the circuit board 6 to be tested is achieved.
The application can play the effect of tensioning to the circuit board 6 to be tested through setting up movable slide bar 5 to in practice, to the circuit board of different length, can adopt this mode to adjust the distance between input electrode chuck 3 and the output electrode chuck 4, make the flexible circuit board of different length all can be according to required elasticity degree, connect between input electrode chuck 3 and output motor chuck 4.
Furthermore, the first driving device and the second driving device are both in the prior art, and a driving motor or a cylinder can be used as a power source.
Further, the test circuit comprises a test chip, a pull-up resistor and a test power supply; the test chip is provided with a plurality of ADC interfaces and GPIO interfaces with the same number as the ADC interfaces; the GPIO interface is connected with the output electrode chuck, the ADC interface is connected with the input electrode chuck, a pull-up resistor is connected between the ADC interface and the input electrode chuck, and the pull-up resistor is connected to a test power supply. The ADC interface and the GPIO interface are larger than the number of FPC lines to be tested on the circuit board to be tested, and the voltage of the test power supply is the output voltage of the test power supply.
When the circuit board to be tested is mounted on the test module, the GPIO outputs a high level first, and if the signal received by the ADC interface is also a high level, the circuit board to be tested is not short-circuited.
When the GPIO outputs a voltage signal of 0V, if the signal received by the ADC interface is also 0V, the circuit board to be tested is not short-circuited;
if the signal received by the ADC interface is the output Voltage (VCC) of the test power supply, the circuit of the circuit board to be tested is indicated to be short-circuited;
if the signal received by the ADC interface is larger than zero and smaller than the output Voltage (VCC) of the test power supply, the circuit of the circuit board to be tested is indicated to be broken, and the circuit is used as the performance parameter of the loop according to the tested voltage.
Referring to fig. 2, the test chip is an MCU, the pull-up resistors are R1, R2, R3, R4, R5, the test power supply is VCC, and the MCU has 5 ADC interfaces, respectively ADC1, ADC2, ADC3, ADC4, and ADC15, and 5 GPIO interfaces, respectively GPIO1, GPIO2, GPIO3, GPIO4, and GPIO5. One end of the pull-up resistor R1, R2, R3, R4 and R5 is connected with the test power supply in parallel, and the other end is connected with 5 ADC interfaces respectively.
Thus, through the test circuit provided in fig. 2, after the flexible circuit board is mounted between the input electrode chuck and the output electrode chuck, the 5 FPC circuits of the flexible circuit board are just connected to the GPIO interface and the ADC interface respectively, so that the five FPC circuits can be tested correspondingly.
Referring to fig. 5, the application further provides a testing method of the flexible circuit board, and the testing device of the flexible circuit board is used. The testing method of the flexible circuit board comprises the following steps:
step 1: and mounting the circuit board to be tested on the test module.
In step 1, the positive electrode and the negative electrode of the circuit board to be tested are respectively arranged on the input electrode clamping head and the output electrode clamping head, so that each ADC interface and each GPIO interface of the test circuit are communicated with the head and the tail ends of one circuit of the circuit board to be tested.
Step 2: the control module controls the first driving device and the second driving device to drive the upper slide bar, the lower slide bar and the movable slide bar to move so as to bend the circuit board to be tested to a proper angle.
The step 2 specifically comprises the following steps:
step 21: the control module controls the first driving device to drive the upper slide bar and the lower slide bar to move to the position to be bent on the circuit board to be tested.
In step 21, the position to be bent is selected according to the required bending test conditions, and the position to be bent is adjusted each time when steps 2 to 5 are repeatedly executed.
Step 22: the control module controls the first driving device to drive the upper slide bar and the lower slide bar to move oppositely so as to bend the circuit board to be tested; simultaneously, the second driving device is synchronously controlled to control the movement of the movable slide rod so as to control the tensioning of the circuit board to be tested.
Step 3: setting a GPIO port to output a high level, detecting a voltage signal received by an ADC port, and executing step 4 if the signal received by the ADC port is the high level; otherwise, the flexible circuit board has a short circuit problem, and the test is ended.
Step 4: setting the output voltage of the GPIO port to be 0, and if the voltage signal received by the ADC port is 0, the performance of the circuit board to be tested is qualified under the bending condition; otherwise, judging the performance parameters of the test circuit board under the bending condition according to the voltage received by the ADC port, and if the voltage signal received by the ADC port is the output voltage of the test power supply, disconnecting the circuit board to be tested; and if the voltage signal received by the ADC port is larger than zero and smaller than the output voltage of the test power supply, taking the voltage value as the performance parameter of the test circuit board under the bending condition.
For example, the number of the cells to be processed,
when the GOIO port outputs 0V, the voltage received by the corresponding ADC interface is 0V, and the line is normal, referring to fig. 3.
When the GOIO port outputs 0V, the voltage received by the corresponding ADC interface is the output Voltage (VCC) of the test power supply, and the line is broken, referring to fig. 4.
When the GOIO port outputs 0V, the voltage received by the corresponding ADC interface is smaller than the output Voltage (VCC) of the test power supply and is greater than zero, and the line is broken, refer to fig. 5.
Step 5: repeating the steps 2-5 to obtain the performance of the circuit board to be tested under different bending conditions, wherein the output voltage of the test power supply is the voltage of the test power supply.
The foregoing description is only of the preferred embodiments of the present disclosure and description of the principles of the technology being employed. It will be appreciated by those skilled in the art that the scope of the invention in the embodiments of the present disclosure is not limited to the specific combination of the above technical features, but encompasses other technical features formed by any combination of the above technical features or their equivalents without departing from the spirit of the invention. Such as the above-described features, are mutually substituted with (but not limited to) the features having similar functions disclosed in the embodiments of the present disclosure.
Claims (10)
1. A testing apparatus for a flexible circuit board, comprising: the device comprises a control module, a test module and a bending device; the control module is respectively connected with the test module and the bending device through signals; the test module tests the circuit board to be tested under the control of the control module;
the testing module comprises an output electrode chuck and an input electrode chuck which are used for clamping a circuit board to be tested;
the bending device comprises a plurality of upper slide bars and lower slide bars, and the upper slide bars and the lower slide bars are arranged between the output electrode clamping head and the input electrode clamping head;
the upper slide bar and the lower slide bar are respectively provided with a first driving device, and the first driving devices are controlled by the control module to drive the upper slide bar and the lower slide bar to slide along a first direction parallel to the connecting direction of the output electrode chuck and the input electrode chuck or slide along a second direction perpendicular to the first direction, so that the circuit board to be tested is bent under the staggered extrusion of the upper slide bar and the lower slide bar.
2. The flexible circuit board testing device of claim 1, wherein: the test module comprises a movable slide bar, the movable slide bar is fixedly connected with the output electrode chuck, a second driving device is arranged on the movable slide bar and is in signal connection with the control module, and the control module controls the second driving device to drive the movable slide bar to move back and forth along the first direction.
3. The flexible circuit board testing device of claim 2, wherein: the test module comprises a test assembly, a test circuit is arranged in the test assembly, and an input electrode chuck and an output electrode chuck respectively form an input end and an output end of the test assembly.
4. A testing device for flexible circuit boards according to claim 3, wherein: the test circuit comprises a test chip, a pull-up resistor and a test power supply; the test chip is provided with a plurality of ADC interfaces and GPIO interfaces with the same number as the ADC interfaces; the GPIO interface is connected with the output electrode chuck, the ADC interface is connected with the input electrode chuck, a pull-up resistor is connected between the ADC interface and the input electrode chuck, and the pull-up resistor is connected to a test power supply.
5. The flexible circuit board testing device of claim 4 wherein: the ADC interface and the GPIO interface are larger than the number of FPC lines to be tested on the circuit board to be tested.
6. The flexible circuit board testing device of claim 4 wherein: when the circuit board to be tested is mounted on the test module, the GPIO outputs a high level first, and if the signal received by the ADC interface is also a high level, the circuit board to be tested is not short-circuited.
7. The flexible circuit board testing device of claim 4 wherein: when the GPIO outputs a voltage signal of 0V, if the signal received by the ADC interface is also 0V, the circuit board to be tested is not short-circuited.
8. A testing method of a flexible circuit board is characterized in that: the method comprises the following steps:
step 1: mounting a circuit board to be tested on a test module;
step 2: the control module controls the first driving device and the second driving device to drive the upper slide bar, the lower slide bar and the movable slide bar to move so as to bend the circuit board to be tested to a proper angle;
step 3: setting a GPIO port to output a high level, detecting a voltage signal received by an ADC port, and executing step 4 if the signal received by the ADC port is the high level; otherwise, the flexible circuit board has a short circuit problem, and the test is ended;
step 4: setting the output voltage of the GPIO port to be 0, and if the voltage signal received by the ADC port is 0, the performance of the circuit board to be tested is qualified under the bending condition; otherwise, judging the performance parameters of the test circuit board under the bending condition according to the voltage received by the ADC port, and if the voltage signal received by the ADC port is the output voltage of the test power supply, disconnecting the circuit board to be tested; if the voltage signal received by the ADC port is larger than zero and smaller than the output voltage of the test power supply, taking the voltage value as the performance parameter of the test circuit board under the bending condition;
step 5, repeating the steps 2 to 4 to obtain the performance of the circuit board to be tested under different bending conditions; the output voltage of the test power supply is the voltage of the test power supply.
9. The method for testing a flexible circuit board according to claim 8, wherein: in step 1, the positive electrode and the negative electrode of the circuit board to be tested are respectively arranged on the input electrode clamping head and the output electrode clamping head, so that each ADC interface and each GPIO interface of the test circuit are communicated with the head and the tail ends of one circuit of the circuit board to be tested.
10. The method for testing a flexible circuit board according to claim 8, wherein: the step 2 specifically comprises the following steps:
step 21: the control module controls the first driving device to drive the upper slide bar and the lower slide bar to move to the position to be bent on the circuit board to be tested;
step 22: the control module controls the first driving device to drive the upper slide bar and the lower slide bar to move oppositely so as to bend the circuit board to be tested; simultaneously, the second driving device is synchronously controlled to control the movement of the movable slide rod so as to control the tensioning of the circuit board to be tested.
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| CN202310127825.9A CN116184166B (en) | 2023-02-17 | 2023-02-17 | Testing device and testing method for flexible circuit board |
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