CN116180033B - Online detection system and method for coating film - Google Patents

Online detection system and method for coating film Download PDF

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Publication number
CN116180033B
CN116180033B CN202310083132.4A CN202310083132A CN116180033B CN 116180033 B CN116180033 B CN 116180033B CN 202310083132 A CN202310083132 A CN 202310083132A CN 116180033 B CN116180033 B CN 116180033B
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China
Prior art keywords
detection
adhesive tape
substrate
coating
coating layer
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CN202310083132.4A
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CN116180033A (en
Inventor
陆建嘉
屈仁杰
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Xiamen Hithium Energy Storage Technology Co Ltd
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Xiamen Hithium Energy Storage Technology Co Ltd
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Priority to CN202310083132.4A priority Critical patent/CN116180033B/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52Means for observation of the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating Apparatus (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The application discloses an online detection system and method for plating a plating film on two sides of a substrate to form a plating film layer and detect the plating film layer on one side of the substrate, wherein a detection area is divided on the substrate, and the system comprises: the rubberizing device is used for rubberizing one side of the detection area of the substrate by an adhesive tape; the coating device is arranged at the downstream of the rubberizing device and is used for coating and forming a coating layer on two sides of the substrate; the photoresist removing device is arranged at the downstream of the coating device and is used for removing the adhesive tape at one side of the detection area and the coating layer on the adhesive tape; the detection device is arranged at the downstream of the photoresist removing device and is used for detecting the coating layer at the other side of the detection area.

Description

Online detection system and method for coating film
Technical Field
The application relates to the technical field of coating detection, in particular to an online detection system and method for coating.
Background
The coating refers to a process of coating a metal (or medium) coating layer (or layers) on the surface of a substrate, and common coating methods include vacuum coating (one of physical coating) and chemical coating. In the process of producing the coating, the phenomena of uneven coating thickness, uneven transmittance and the like can be encountered, and the product quality is seriously affected.
Especially in the continuous rapid production process, the quality problem can not be detected in time, so that the production control is delayed and the production process matching degree of the subsequent working procedure connected with the production control can be possibly influenced, and therefore, the quality of the on-line monitoring coating layer is important for production control and product quality improvement.
Disclosure of Invention
In view of the foregoing drawbacks or shortcomings in the prior art, it is desirable to provide a system and method for online detection of a coating film, which can realize online detection of a coating film process.
In a first aspect, the present application provides an online detection system for plating a plating film on two sides of a substrate to form a plating film layer and detecting the plating film layer on a single side of the substrate, where a detection area is divided on the substrate, the system includes:
The rubberizing device is used for rubberizing one side of the detection area of the substrate by an adhesive tape;
The coating device is arranged at the downstream of the rubberizing device and is used for coating and forming a coating layer on two sides of the substrate;
The photoresist removing device is arranged at the downstream of the coating device and is used for removing the adhesive tape at one side of the detection area and the coating layer on the adhesive tape;
The detection device is arranged at the downstream of the photoresist removing device and is used for detecting the coating layer at the other side of the detection area.
Optionally, the substrate includes oppositely disposed first and second sides; the coating layer comprises a first coating layer arranged on the first side and a second coating layer arranged on the second side;
The detection zone comprises a first detection zone arranged on the first side and/or a second detection zone arranged on the second side; the first detection zone and the second detection zone are not overlapped on the substrate;
the detection device is used for detecting the second coating layer on the first detection area or detecting the first coating layer on the second detection area.
Optionally, the rubberizing device comprises a first rubberizing device for rubberizing the first side, and the rubberizing device comprises a first rubberizing device for removing the adhesive tape and a first coating layer on the adhesive tape to form a first detection area; and/or
The rubberizing device comprises a second rubberizing device for attaching the adhesive tape to the second side, and the rubberizing device comprises a second rubberizing device for removing the adhesive tape and a second coating layer on the adhesive tape to form a second detection area.
Optionally, the rubberizing device is used for attaching a first adhesive tape to the substrate;
the adhesive removing device is used for attaching a second adhesive tape at the position of the first adhesive tape so that the second adhesive tape is attached to the first adhesive tape, and the first adhesive tape and the single-layer coating film on the first adhesive tape are driven to be peeled from the substrate by the second adhesive tape;
The second tape has a viscosity greater than the viscosity of the first tape.
Optionally, the rubberizing device comprises: a rubberizing mechanism and a first rolling mechanism, wherein,
The rubberizing mechanism comprises a first unreeling wheel and a first reeling wheel which are arranged along the substrate conveying direction, release films are tensioned on the first unreeling wheel and the first reeling wheel, and a first adhesive tape is arranged on the release films;
The first rolling mechanism comprises a first roller shaft arranged on one side, far away from the substrate, of the first adhesive tape, and the first roller shaft is arranged between the first unreeling wheel and the first reeling wheel and used for moving along the direction close to the substrate and pressing and bonding the first adhesive tape on the substrate.
Optionally, the glue removing device includes: a photoresist removing mechanism and a second rolling mechanism, wherein,
The photoresist removing mechanism comprises a second unreeling wheel and a second reeling wheel which are arranged along the substrate conveying direction, and the second adhesive tape is tensioned on the second unreeling wheel and the second reeling wheel;
The second rolling mechanism comprises a second roll shaft arranged on one side, far away from the substrate, of the second adhesive tape, the second roll shaft is arranged between the second unreeling wheel and the second reeling wheel, and is used for moving along the direction close to the substrate, pressing and attaching the second adhesive tape to the first adhesive tape, and moving along the direction far away from the substrate, so that the second adhesive tape drives the first adhesive tape and a single-layer coating film on the first adhesive tape to be peeled off from the substrate under the action of the tensioning force of the photoresist removing mechanism.
Optionally, the tape has a length in the substrate conveying direction; the system further comprises:
The marking device is arranged between the rubberizing device and the coating device and is used for respectively spraying reflective coatings on the front end and the rear end of the adhesive tape along the substrate conveying direction;
A first recognition device, which is arranged at the downstream of the film plating device and is used for sending a first control signal when a first reflective coating layer at the front end of the adhesive tape along the conveying direction of the substrate is detected and sending a second control signal when a second reflective coating layer at the rear end of the adhesive tape along the conveying direction of the substrate is detected, so that the adhesive tape removing device can execute the adhesive tape removing operation based on the first control signal and stop executing the adhesive tape removing operation based on the second control signal;
And the second identification device is arranged between the photoresist removing device and the detection device and is used for identifying the mark and controlling the detection device based on the identification result.
Optionally, the detection comprises one or more of single-sided film sheet resistance detection, single-sided film thickness detection, single-sided film reflectivity detection, single-sided film transmittance detection and single-sided film uniformity detection;
the detection device comprises one or more of a sheet resistance detection mechanism, a film thickness detection mechanism, a reflectivity detection mechanism, a transmissivity detection mechanism and a uniformity detection mechanism.
Optionally, the method further comprises:
The control device is connected with the rubberizing device, the coating chamber, the photoresist removing device and the detecting device and is used for sending control signals and receiving feedback signals, and the feedback signals comprise detection results of the detecting device; further comprises:
the warning device is connected with the control device and used for warning based on the detection result;
And the marking device is connected with the control device and is used for marking the detection result on the substrate.
In a second aspect, the present application provides an online detection method of a plating film, applied to an online detection system of a plating film as described in any one of the above, the method comprising:
adhering an adhesive tape on one side of a detection area of the substrate through an adhesive tape adhering device;
plating both sides of the substrate by a plating device to form a plating layer;
removing the adhesive tape and the coating layer on the adhesive tape by a photoresist removing device;
and detecting the coating layer at the other side of the detection area through a detection device.
The technical scheme provided by the embodiment of the application can comprise the following beneficial effects:
The online detection system of the coating provided by the embodiment of the application is used for carrying out single-sided coating detection on the substrate which is subjected to double-sided coating through the coating device, the coating device is used for coating the coating on the position corresponding to the detection area, the adhesive tape and the coating layer on the adhesive tape are removed after coating, the coating layer on the other side of the detection area can be reserved, the single-layer coating detection on the double-sided coating substrate can be realized by detecting the position of the detection area during detection, the online detection can be realized without detecting the substrate, the property parameters of each coating layer in the double-sided coating substrate are obtained, and the like. Particularly, the coating process in the coating chamber can be controlled and adjusted, and the coating precision and the coating effect are improved.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of an online detection system for plating films according to an embodiment of the present application;
FIG. 2 is a schematic view of a substrate according to an embodiment of the present application;
FIG. 3 is a schematic diagram illustrating an arrangement of a detection zone according to an embodiment of the present application;
FIGS. 4-5 are schematic structural diagrams of another on-line inspection system for plating films according to embodiments of the present application;
FIGS. 6-7 are schematic diagrams illustrating the position of a detection zone according to embodiments of the present application;
fig. 8-9 are schematic structural diagrams of a rubberizing device/a photoresist removing device according to an embodiment of the application;
fig. 10 is a schematic structural diagram of a release film according to an embodiment of the present application;
FIG. 11 is a schematic diagram of a single-sided sheet resistance detection structure according to an embodiment of the present application;
fig. 12 is a schematic structural diagram of a detection device according to an embodiment of the present application;
FIG. 13 is a schematic connection diagram of an online detection system for plating films according to an embodiment of the present application;
fig. 14 is a flowchart of an online detection method of a plating film according to an embodiment of the present application.
In the figure:
10. a substrate; 20. a rubberizing device; 30. a photoresist removing device; 40. a detection device; 50. a film plating device;
1. a first rubberizing device; 2. a second rubberizing device; 3. a first photoresist remover; 4. a second photoresist removing device; 5. an identification device; 6. a first identification means; 7. a second identification means; 8. a control device; 9. a sheet resistance detection mechanism; 11. a film thickness detection mechanism; 12. a reflectivity detection mechanism; 13. a transmittance detection means; 14. a uniformity detecting mechanism; 15. a conveying device; 16. a warning device; 17. a marking device;
102. A first coating layer; 103. a second coating layer; 104. a first detection zone; 105. a second detection zone;
21. A rubberizing mechanism; 22. a first rolling mechanism;
201. A first unreeling wheel; 202. the first winding wheel; 203. a first adhesive tape; 204. a first press roller; 205. a first mating roll; 206. a release film;
31. a photoresist removing mechanism; 32. a second rolling mechanism;
301. A second unreeling wheel; 302. the second winding wheel; 303. a second adhesive tape; 304. a second press roller; 305. a second mating roll;
41. a light emitting unit; 42. a light splitting unit; 43. a first light detection unit; 44. a first light detection unit;
401. A first photodetector; 402. a second photodetector; 403. a capacitor plate; 404. a capacitance signal controller; 405. a half-mirror; 406. a total reflection mirror;
501. a wind-up roll; 502. an unreeling roller; 503. and a conveying roller.
Detailed Description
The application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be noted that, for convenience of description, only the portions related to the application are shown in the drawings.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.
Referring to fig. 1 in detail, the present application provides an on-line detection system for plating coating layers on two sides of a substrate 10 and detecting the coating layers on one side of the substrate 10, wherein a detection area is defined on the substrate 10, and the system comprises:
The rubberizing device 20 is used for carrying out adhesive tape adhesion on one side of the substrate 10 which is not coated with the film;
A coating device 50, wherein the coating device 50 is arranged at the downstream of the rubberizing device 20 and is used for coating and forming coating layers on two sides of the substrate 10;
A glue removing device 30, wherein the glue removing device 30 is arranged at the downstream of the film plating device 50 and is used for removing the adhesive tape at one side of the detection area and the film plating layer thereon;
and the detection device 40 is arranged at the downstream of the photoresist removing device 30 and is used for detecting the coating layer at the other side of the detection area.
The on-line detection system for coating films provided in the embodiment of the application is used for single-sided coating detection of a substrate 10 subjected to double-sided coating by a coating device 50, coating the coating film on the position corresponding to a detection area by the coating device, removing the adhesive tape and the coating film layer on the adhesive tape after coating the coating film, and retaining the coating film layer on the other side of the detection area. In particular, the coating process in the coating device 50 can be controlled and adjusted, and the coating precision and the coating effect can be improved.
It should be understood that the plating method is not limited in the embodiment of the present application, for example, the plating device 50 adopts a vacuum plating method, and the working principle of the working portion may be any one of resistance evaporation, induction evaporation, electron beam evaporation, magnetron sputtering or other vacuum plating methods. For example, a magnetron sputtering mechanism is arranged in the vacuum chamber, and the working process of magnetron sputtering is that electrons collide with sputtering gas argon in the process of accelerating and flying to a substrate coating layer under the action of an electric field, so that a large amount of argon ions and electrons are ionized, and the electrons fly to the substrate coating layer and continuously collide with argon atoms in the process to generate more argon atoms and electrons; the argon ions are accelerated to bombard the target under the action of an electric field, a large number of target atoms are sputtered, and neutral target atoms (or molecules) are deposited on the surface of the substrate coating layer to form a film.
For the setting mode of the magnetron sputtering mechanism, a plurality of double-sided coating modes in the prior art can be adopted, for example, the double-sided coating is realized by adopting a mode of overturning the magnetron sputtering mechanism, and automatic equipment is adopted for overturning and conveying double-sided coating equipment, so that excessive manual operation is not needed, the coating efficiency is greatly improved, the productivity of the equipment is improved, and the production efficiency is improved.
In the present embodiment, the substrate 10, which is defined as being uncoated, includes only the substrate 10, and the "substrate 10" having a double-sided coating film is obtained after passing through the coating apparatus 50. The substrate 10 includes, but is not limited to, metal foil (e.g., stainless steel), ultra-thin glass substrates, polymer substrates (e.g., PE, PET, PP, PS, PEN, PI, etc., in particular), silicon wafer substrates, and the like. The coating layer includes, but is not limited to, any one of an organic material, a metal material, and a compound thereof. The metal includes, but is not limited to Al, zr, V, mn, nb, zn, cr, ga, fe, cd, in, ti, co, ni, mo, sn, pb, cu, po, ag, ru, os, pd, pt, au, etc., and the metal compound includes, but is not limited to, tiO2, al2O3, ceO2, and may also be AlN, tiN, niN, crN, zrNTa N, or one or more of these.
Wherein, as shown in fig. 2, the substrate 10 includes a first side and a second side disposed opposite to each other; the coating layer comprises a first coating layer 102 arranged on the first side and a second coating layer 103 arranged on the second side.
In the embodiment of the present application, the materials of the first plating layer 102 and the second plating layer 103 are not limited, in some embodiments, the materials of the first plating layer 102 and the second plating layer 103 may be the same or different, the thicknesses of the first plating layer 102 and the second plating layer 103 may be the same or different, etc., and the online detection system of plating films in the present application may detect the same double-sided plating layer or detect different double-sided plating layers, and the structure and properties of the plating layers are not limited.
As shown in fig. 3, the detection area includes a first detection area 104 and/or a second detection area 105, where the first detection area 104 is disposed on the first side, and after the treatment of the system, the substrate 10 has only the second coating layer 103 on the other side of the first detection area 104 at a position corresponding to the first detection area 104; the second detection area 105 is disposed on the second side, and the substrate 10 has only the first plating film layer 102 on the other side of the second detection area 105 at a position corresponding to the second detection area 105; the detection device 40 detects the second coating layer 103 on the first detection region 104 or detects the first coating layer 102 on the second detection region 105.
In the on-line detection system for the coating provided by the embodiment of the application, the detection areas are respectively arranged on the two sides of the substrate 10, and the detection is performed on the first detection area 104 or the second detection area 105, so that the single-sided coating detection is performed on each coating layer of the double-sided coating. The setting position of the detection area is not limited in different embodiments, and is set according to the position of the coating layer to be detected in different embodiments, which is not limited in the application. It is to be understood that in some embodiments, only the first coating layer 102 may be detected, only the second coating layer 103 may be detected, and the technical solution of the present application may also detect the first coating layer 102 and the second coating layer 103 simultaneously.
Specifically, as shown in fig. 4-5, the rubberizing device 20 includes a first rubberizing device 1 for taping the first side, and the gumming device 30 includes a first gumming device 3 for removing the adhesive tape and the first coating layer 102 on the adhesive tape to form a first detection area 104; and/or the rubberizing device 20 comprises a second rubberizing device 2 for taping the second side, the gumming device 30 comprises a second gumming device 4 for removing the tape and a second coating layer 103 on the tape to form a second detection zone 105.
According to the online detection system for the coated film provided by the embodiment of the application, the rubberizing devices 20 and the gumming devices 30 are respectively arranged on the two sides of the substrate 10, so that a detection area is formed on each side of the substrate 10 in a manner of adhering and removing the adhesive tape, and the detection of the single-sided coated film on the substrate 10 with double-sided coated film is realized. It should be noted that, in the embodiment of the present application, when the first coating layer 102 needs to be detected, the second detection area 105 needs to be formed, that is, the second coating layer 103 is removed by the second rubberizing device 2 and the second gumming device 4 disposed on opposite sides of the first coating layer 102, and only the first coating layer 102 is remained; similarly, when the second coating layer 103 needs to be detected, the first detection area 104 needs to be formed, that is, the first coating layer 102 needs to be removed by the first rubberizing device 1 and the first gumming device 3 disposed on the opposite side of the second coating layer 103, and only the second coating layer 103 remains.
In order to prevent each side of the plating film from affecting each other during the single-sided plating film detection, in the embodiment of the present application, the first detection region 104 and the second detection region 105 are not overlapped on the substrate 10, as shown in fig. 3; the tape application position of the first taping device 1 on the first side does not overlap with the tape application position of the second taping device 2 on the second side.
According to the online detection system for the coating film provided by the embodiment of the application, the positions of the adhesive tapes attached to the two sides of the substrate 10 are not overlapped, so that the first detection area 104 and the second detection area 105 which are not overlapped on the substrate 10 are formed, the condition that the coating film is not present on the two sides of the substrate 10 corresponding to the same position is prevented, and the detection precision is improved. It should be understood that the arrangement of the first detection area 104 and the second detection area 105 is not limited in the embodiment of the present application, and the first detection area 104 and the second detection area 105 may be located on the same line of the substrate 10 along the transmission direction, as shown in fig. 6. Or the first detection region 104 and the second detection region 105 may be positioned on the same line of the substrate 10 in the width direction, as shown in fig. 7. Of course, in other embodiments, other positions may be used without overlapping, which is not a limitation of the present application.
It should be noted that, in the embodiment of the present application, the removing manner of the adhesive tape attached to the substrate 10 is not limited, and in some embodiments, the adhesive tape may be peeled from the substrate 10 by adsorption, friction, or adhesion. An exemplary manner of removing the adhesive tape is provided in the embodiments of the present application, and the removal of the adhesive tape from the substrate 10 is achieved by using an adhesive tape adhesion manner.
In the embodiment of the present application, the rubberizing device 20 is used for attaching a first adhesive tape 203 to the substrate 10; the de-adhesive device 30 is used for attaching a second adhesive tape 303 at the position of the first adhesive tape 203 so that the second adhesive tape 303 is attached to the first adhesive tape 203, and the second adhesive tape 303 drives the first adhesive tape 203 and the single-layer coating film thereon to be peeled off from the substrate 10; the second tape 303 has a viscosity greater than that of the first tape 203.
In the on-line detection system for the coating film provided by the embodiment of the application, the second adhesive tape 303 is adhered to the first adhesive tape 203, and the first adhesive tape 203 can be peeled from the substrate 10 due to the weak adhesion of the first adhesive tape 203 and the strong adhesion of the second adhesive tape 303, so that a detection area is formed. In the embodiment of the present application, the specific viscosity values of the first adhesive tape 203 and the second adhesive tape 303 are not limited, and the second adhesive tape 303 may drive the first adhesive tape 203 to be peeled from the substrate 10, and in different embodiments, the specific viscosity values are selected according to needs.
In this embodiment, the first adhesive tape 203 includes a tape body and an adhesive layer disposed on one side of the tape body, where the other side surface of the tape body has a certain roughness.
In the on-line detection system for the coating film provided by the embodiment of the application, the belt body of the first adhesive tape 203 has a certain roughness on the surface of the other side far away from the added layer, so that the coating film is conveniently removed by the photoresist removing device 30. It can be understood that, in the embodiment of the present application, when the first tape 203 is attached to the substrate 10 and then enters the coating device 50, during the process of coating the substrate 10 in the coating device 50, the surface of the first tape 203 and other positions of the substrate 10 are coated simultaneously, and the coating layer formed on the surface of the first tape 203 with a certain roughness has a certain roughness at the same time, so as to facilitate the removal of the first tape 203 and the coating layer thereon.
It should be understood that the rubberizing device 20 according to the embodiment of the application can adopt various rubberizing modes in the prior art, and the application is not limited thereto. The application is exemplified by a rubberizing device 20 and a gumming device 30 which are simple in structure and convenient to operate.
As shown in fig. 8-9, the rubberizing device 20 comprises: the device comprises a rubberizing mechanism 21 and a first rolling mechanism 22, wherein the rubberizing mechanism 21 comprises a first unreeling wheel 201 and a first reeling wheel 202 which are arranged along the conveying direction of the substrate 10, release films 206 are tensioned on the first unreeling wheel 201 and the first reeling wheel 202, and a first adhesive tape 203 is arranged on the release films 206, as shown in fig. 10; the first rolling mechanism 22 includes a first roller shaft disposed on a side of the first adhesive tape 203 away from the substrate 10, and the first roller shaft is disposed between the first unreeling wheel 201 and the first reeling wheel 202, and is used for moving along a direction approaching to the substrate 10 and laminating and attaching the first adhesive tape 203 to the substrate 10.
In the embodiment of the present application, the first adhesive tape 203 is discontinuously disposed on the release film 206, and the first adhesive tape 203 has a certain length and is disposed on the release film 206 at intervals. In the embodiment of the application, the release film 206 is initially wound on the first unreeling wheel 201, the release film 206 is extracted from the first unreeling wheel 201 and is retracted on the first reeling wheel 202, and the first unreeling wheel 201 and the first reeling wheel 202 synchronously rotate in the same direction. The release film 206 is in a loose state on the first unreeling wheel 201 and the first reeling wheel 202, the first roller shaft is arranged on one side of the first adhesive tape 203 away from the substrate 10, and the first roller shaft can reciprocate along the direction approaching to and separating from the substrate 10. When the adhesive tape is required to be attached, the first roller moves along the direction close to the substrate 10 and contacts with the release film 206, and is tensioned on the first unreeling wheel 201, the first roller and the first reeling wheel 202; when the first roller contacts with the substrate 10, the first adhesive tape 203 on the release film 206 is pressed on the substrate 10. When the first roller is pressed for a certain period of time, the first adhesive tape 203 is completely separated from the release film 206, and the first adhesive tape 203 is completely pressed and adhered on the substrate 10.
It will be appreciated that, depending on the conveyor 15, the first roller press mechanism 22 may also be provided with a first mating roller 205 that mates with the first pressing roller 204, where the first pressing roller 204 and the first mating roller 205 mate with each other during taping to attach the first tape 203 to the substrate 10 for ease of lamination. In various embodiments, as desired.
In an embodiment of the present application, the release film 206 may have a certain viscosity to fix the first coating 102, and in other embodiments, the first adhesive tape 203 may be attached to the substrate 10 by using a double-sided adhesive layer, where one side of the adhesive layer is attached to the release film 206, and the other side of the adhesive layer is attached to the release film. The first tape 203 of the double-sided adhesive layer may be a mesh adhesive in order to increase the roughness of the side facing away from the substrate 10. Of course, the double sides can also adopt the mode of grid glue, and the application is not limited to the mode.
As shown in fig. 8 to 9, the glue removing apparatus 30 includes: a photoresist removing mechanism 31 and a second rolling mechanism 32, wherein the photoresist removing mechanism 31 comprises a second unreeling wheel 301 and a second reeling wheel 302 which are arranged along the conveying direction of the substrate 10, and the second adhesive tape 303 is tensioned on the second unreeling wheel 301 and the second reeling wheel 302; the second rolling mechanism 32 includes a second roller shaft disposed on a side of the second adhesive tape 303 away from the substrate 10, the second roller shaft being disposed between the second unreeling wheel 301 and the second reeling wheel 302, for moving in a direction approaching to the substrate 10 and pressing and attaching the second adhesive tape 303 to the first adhesive tape 203, and for moving in a direction away from the substrate 10, so that the second adhesive tape 303 drives the first adhesive tape 203 and the single-layer coating film thereon to be peeled off from the substrate 10 under the action of the tension force of the photoresist removing mechanism 31.
In the embodiment of the present application, the second adhesive tape 303 is initially wound on the second unreeling wheel 301, the second adhesive tape 303 is drawn from the second unreeling wheel 301 and is retracted on the second reeling wheel 302, and the second unreeling wheel 301 and the second reeling wheel 302 synchronously rotate in the same direction. The second adhesive tape 303 is in a relaxed state on the second unreeling wheel 301 and the second reeling wheel 302, the second roller is arranged on one side of the second adhesive tape 303 away from the substrate 10, and the second roller can reciprocate along the direction approaching to and separating from the substrate 10. When the photoresist is required to be removed, the second roller moves along the direction close to the substrate 10 and contacts with the second adhesive tape 303, and is tensioned on the second unreeling wheel 301, the second roller and the second reeling wheel 302; the second tape 303 is laminated on the first tape 203 on the substrate 10. When the second roller is pressed for a certain time, the second adhesive tape 303 is continuously contacted with the first adhesive tape 203, and along with the driving of the second winding wheel 302, the second adhesive tape 303 drives the first adhesive tape 203 to move towards the direction of the second winding wheel 302, and the first adhesive tape 203 and the single-layer coating film thereon are peeled off from the substrate 10.
It will be appreciated that, depending on the conveyor 15, the second roller press mechanism 32 may further be provided with a second mating roller 305 that mates with the second pressing roller 304, and the second pressing roller 304 and the second mating roller 305 mate with each other in the process of taping, so as to attach the second adhesive tape 303 to the substrate 10 (the first adhesive tape 203). In various embodiments, as desired.
In some embodiments of the present application, as shown with continued reference to fig. 4-5, the system further comprises:
An identification device 5, wherein the identification device 5 is arranged between the rubberizing device 20 and the coating device 50 and is used for identifying the substrate 10;
A first recognition device 6, the first recognition device 6 is arranged at the downstream of the coating device 50 and is used for recognizing the mark and controlling the photoresist removing device 30 based on the recognition result.
According to the online detection system for the coated film provided by the embodiment of the application, the marks are arranged on the substrate 10 which is not coated with the film, the positions of the adhesive tapes are identified through the marks, the control precision is improved in a mode of arranging the marks on the substrate 10, the photoresist removing process of the photoresist removing device 30 is controlled, the photoresist removing device 30 is prevented from influencing the coated film of the non-detection area on the substrate 10, and the damage to the film surface and the like are prevented from influencing the double-sided coated film effect of the substrate 10.
Optionally, the tape has a certain length in the conveying direction along the substrate 10;
The marking device 5 is used for respectively spraying reflective coatings on the front end and the rear end of the adhesive tape along the conveying direction of the substrate 10;
The first recognition device 6 is used for sending a first control signal when detecting a first reflective coating layer at the front end of the adhesive tape along the conveying direction of the substrate 10 and sending a second control signal when detecting a second reflective coating layer at the rear end of the adhesive tape along the conveying direction of the substrate 10;
The de-taping device 30 is configured to perform the de-taping operation based on the first control signal and to stop performing the de-taping operation based on the second control signal.
In the on-line detection system for the film coating provided by the embodiment of the application, the positions of the adhesive tapes corresponding to the substrate 10 are sprayed with the reflective coating through the identification device 5, and the positions of the adhesive tapes corresponding to the identification are identified through the first identification device 6, so that the positions are used as control signals to control the photoresist removing operation of the photoresist removing device 30. It will be appreciated that in some embodiments only one indication, for example the indication of the leading end of the tape along the direction of conveyance of the substrate 10, may be used as a control signal for controlling the activation of the glue removal device 30. The control signal for controlling the stopping of the glue removing device 30 may be implemented by timing, for example, the control start time is 5s, and is set according to needs in different embodiments, which is not limited in this aspect of the application.
It should be further noted that the manner in which the substrate 10 is identified is not limited in the embodiments of the present application, and the reflective coating is illustratively described in the embodiments of the present application. When the identification of the reflective coating is performed, an infrared identification mode may be adopted, the reflective coating may be identified by transmitting an infrared beam to the reflective coating and by using the infrared beam identification mechanisms on the first identification device 6 and the second identification device 7, or other identification modes may be adopted, which is not limited in this aspect of the application.
In the embodiment of the present application, the spraying position of the reflective coating may be sprayed on the adhesive tape and the substrate 10 outside the adhesive tape, which is not limited in the present application. The first identification means 6 is arranged before the glue removal means 30, so that the light-reflecting coating has no influence on the identification of the first identification means 6. For the second identification means 7 provided downstream of the glue removal means 30 in the present application, only the light-reflecting coating on the substrate 10 of the substrate 10 can be identified. Of course, for the control method of the detecting device 40, a calculation method may be also employed, for example, by calculating the time to reach each detection position based on the conveyance speed of the substrate 10 after obtaining the second control signal.
In some embodiments of the application, the system further comprises:
A second recognition means 7, said second recognition means 7 being arranged between said glue removal means 30 and detection means 40 for recognizing said identification and controlling said detection means 40 based on the result of said recognition.
In the on-line detection system for the coating film provided by the embodiment of the application, the second identification device 7 is applied to the position between the photoresist removing device 30 and the detection device 40, and the second identification device 7 is used for identifying the mark on the substrate 10 and used as a control signal of the detection device 40, so that the control precision and the coating film detection precision can be improved. In the embodiment of the application, the identified position is not limited, so that the identified position can be accurately identified to the detection area by the detection device 40.
Specifically, the second identifying device 7 is configured to send out a third control signal when detecting the first reflective coating layer at the front end of the adhesive tape along the conveying direction of the substrate 10; the detecting means 40 is configured to perform single-sided plating film detection based on the third control signal.
In the embodiment of the application, the detection comprises one or more of single-sided film sheet resistance detection, single-sided film thickness detection, single-sided film reflectivity detection, single-sided film transmittance detection and single-sided film uniformity detection; the detecting device 40 includes one or more of a sheet resistance detecting mechanism 9, a film thickness detecting mechanism 11, a reflectivity detecting mechanism 12, a transmittance detecting mechanism 13, and a uniformity detecting mechanism 14.
The on-line detection system for coating provided in the embodiment of the application can be applied to judging the quality of the coating process of the continuous substrate 10, the quality of the coating layer and evaluating the quality of the coating layer by detecting the property parameter of each coating layer in the double-sided coating substrate 10 by detecting the detection device 40. In particular, the coating process in the coating device 50 can be controlled and adjusted, and the coating precision and the coating effect can be improved.
In the embodiment of the present application, the structure and the detection manner of each detection mechanism in the detection device 40 are not limited. Because the film property detection needs to be carried out on different film plating surfaces, according to the difference of detection principles of different detection mechanisms, an independent detection mechanism can be arranged for each film plating surface, and the same detection mechanism can also be adopted for detecting different film plating surfaces. The detection means may detect the detection by an optical detection means or a non-optical detection means during detection, and the present application is not limited thereto.
In some embodiments of the present application, the relevant data of the coating layer is integrated, so that other relevant data are obtained through a certain data processing, and the analysis processing of the variable values is performed according to the relevant data, so that each item of data of the coating layer in the present application is calculated, the working efficiency is increased, and the occupied area of the detection device is simplified. For example, the thickness of the coating layer has a correlation with transmittance, reflectivity, sheet resistance and uniformity, one group of data is obtained through detection by the correlation among the data, and other data are obtained through calculation.
Based on the correlation between the characteristics of the coating layer, in other embodiments, each detection device 40 may use different detection modes, and perform simultaneous detection through multiple detection modes, so as to verify each other between different data, and improve the detection accuracy. The embodiment of the application is not limited to the single-sided coating detection mode, and different detection mechanisms can use part of the structure in specific application, and the detection modes for different coating layer properties will be described in detail below.
For single-sided film thickness detection, two main current detection methods exist: optical detection (visual, reflective, transmissive) and physical detection (magnetic, eddy current, energy dispersive X-ray spectroscopy, etc.), wherein the current optical detection methods mainly utilize changes in optical characteristics (reflectivity and transmittance) between the coating layer and the substrate 10, and by such changes, optical characteristics can be found in theory for any film thickness. Changes in light of the optical characteristic are changed to changes in the optical signal.
For single-mask layer reflectivity detection and single-sided mask layer transmittance detection, wherein the percentage of the total radiation energy reflected by the coating layer is called reflectivity, the reflectivity of different coating layers is also different, and the reflectivity is mainly dependent on the nature (surface condition) of the coating layer, the wavelength and the incidence angle of the incident inductive wave; transmission is the phenomenon of emergence of incident light after refraction through a coating, and to represent the extent to which a transparent body transmits light, the light transmission properties of the coating are generally characterized by the ratio of the transmitted light flux to the incident light flux, known as light transmittance.
For single mask layer sheet resistance detection, sheet resistance refers to the resistance of a unit square planar conductor. Since the sheet resistance of a unit square conductor is related to its thickness and resistivity, the thickness of the coating layer can be calculated by measuring the sheet resistance given the resistivity of the coating layer. In some embodiments, the detection of the orientation resistance may be obtained by estimating the thickness of the film. In other embodiments, the resistor may be detected by physical detection.
In the embodiment of the present application, as shown in fig. 11, a physical detection manner of single-sided film sheet resistance detection is provided, where the sheet resistance detection mechanism 9 includes at least one pair of capacitor plates 403 disposed on a detection channel, a transmission channel is formed between any pair of capacitor plates 403, and the substrate 10 passes through the transmission channel. The sheet resistance detection mechanism 9 further includes a capacitance signal controller 404 electrically connected to the capacitance plates 403, and detects a difference Δc between capacitance values of the two capacitance plates 403 when the detection area passes between the capacitance plates 403 by charging the capacitance plates 403, and then determines a sheet resistance of a single coating layer on the detection area according to the difference Δc.
For single mask uniformity detection, the film uniformity refers to a property that the film thickness of the coating film varies with the position of the substrate 10. The uniformity of the film thickness of the coating film is directly related to the yield of the product and the quality of the substrate 10. In the embodiment of the application, a plurality of detection areas are arranged on the film coating layer, the thickness value of the film layer is obtained through the plurality of detection areas, the average film thickness value of the plurality of detection areas is calculated, and the uniformity of the film thickness is evaluated.
In an embodiment of the present application, as shown in fig. 12, a detection apparatus 40 is provided, which employs a set of optical devices to perform multiple property detection for different coating layers (each coating layer). The detection device 40 includes a light emitting unit 41, a light splitting unit 42, and a plurality of light detection units, and can detect the first detection area 104 and the second detection area 105 at the same time, that is, realize single-sided coating detection on two coating layers of double-sided coating at the same time.
The light emitting unit 41 is configured to emit light (e.g., parallel light) toward the substrate 10; the light splitting unit 42 is configured to receive the light emitted from the light emitting unit 41, and split the light into multiple beams (e.g., parallel light) by the light splitting unit 42, where each beam corresponds to one detection area, and the detection areas include at least one first detection area 104 and at least one second detection area 105. The plurality of light detection units are respectively arranged at positions corresponding to the detection areas and are used for detecting the light passing through the detection areas. It is understood that one light detection unit may be disposed on each of the first light detection region and the second light detection region, for detecting properties of different coating layers.
In an embodiment of the present application, the beam splitting unit 42 may use a plurality of half mirrors 405 and a total reflection mirror 406. The half mirror 405 and the total reflection mirror 406 are in the same horizontal plane, the total reflection mirror 406 is located on the reflection light path of the half mirror 405, the included angle between the incident light path of the half mirror 405 and the reflection light path of the half mirror 405 is 90 degrees, the reflection light path of the half mirror 405 is the incident light path of the total reflection mirror 406, the included angle between the incident light path of the total reflection mirror 406 and the reflection light path of the total reflection mirror 406 is 90 degrees, and the transmission light path of the half mirror 405 is parallel to the reflection light path of the total reflection mirror 406.
The light detection unit comprises one or more of a photoelectric displacement sensor and a photoelectric detector. The photoelectric displacement sensor receives the optical signals after passing through the detection area, the photoelectric displacement sensor amplifies the optical signals through the signal amplifying device and transmits the optical signals to the optical signal processor, and the optical signal processor converts the optical signals into electric signals, and then the embedded MCU calculates the thickness of the coating layer, so that the thickness of the coating layer of the single-sided coating layer can be realized. After the photoelectric detector receives light, the photocurrent is amplified in the amplifying circuit and converted into a voltage signal, then the voltage signal can be subjected to analog-to-digital conversion through the on-board ADC, and the detection result of the detection transmittance and the reflectivity is obtained through calculation by the embedded MCU, so that the photoelectric detector can be reproduced undoubtedly by a person skilled in the art in combination with the content of the application and the prior art.
Illustratively, in the embodiment of the present application, the plurality of light detection units includes a first light detection unit 4443 and a second light detection unit, wherein each of the light detection units includes a first photodetector 401 and a second photodetector 402, the first photodetector 401 is disposed on a reflected light path of the light beam, the second photodetector 402 is disposed on a transmitted light path of the light beam, the reflectivity of the coating layer can be obtained by the first photodetector 401, and the transmittance of the coating layer can be obtained by the second photo-electric device. In the embodiment of the present application, the first photodetector 401 and the second photodetector 402 are disposed on different sides of the substrate 10, and the type of reflectivity or transmittance obtained by each photodetector is different for a single-sided coating layer on the detection area. In the application, the reflectivity and the transmissivity obtained by the photoelectric detector are used for calculating the characteristic data of the coating layer such as the thickness, the sheet resistance, the uniformity and the like of the coating layer.
The system further comprises:
and a conveying device 15, wherein the conveying device 15 is used for conveying the substrate 10 to the coating device 50 and conveying the substrate 10 from the coating device 50 to a plurality of preset positions.
The specific conveying manner of the conveying device 15 is not limited in the embodiment of the present application, and in different embodiments, different conveying manners may be used according to the substrate 10. For example, the substrate 10 is a flexible substrate 10, the substrate 10 is stored in a rolled manner, and the conveying device 15 includes an unreeling roller 502 disposed upstream of the rubberizing device 20 and a reeling roller 501 disposed downstream of the substrate 10 detecting mechanism. The substrate 10 is transported and wound up on the winding roller 501 by tensioning the substrate 10 between the winding roller 501 and the unwinding roller 502. A plurality of tension rollers or the like may be provided between the wind-up roller 501 and the unwind roller 502, which is not limited in the present application.
For example, the substrate 10 is a rigid substrate 10, and the conveying device 15 includes a plurality of conveying rollers 503 arranged along a conveying direction of the substrate 10; the conveying device 15 is provided with a detection channel corresponding to the detection device 40; the detection device 40 is used for performing single-sided coating detection on the detection area when the detection area passes through the detection channel. In different embodiments, the conveying device 15 may be arranged in a segmented manner, and the speed of each segment may be the same or different, and may be selected according to requirements. In addition, the detection channel in the present application may be provided at a gap position between the conveying rollers 503 and the conveying rollers 503, and the gap size may be adjusted as needed to facilitate detection by the detection device 40.
As shown in fig. 13, the system further includes:
And the control device 8 is connected with the rubberizing device 20, the coating device 50, the rubberizing device 30 and the detecting device 40, and is used for sending control signals and receiving feedback signals, wherein the feedback signals comprise detection results of the detecting device 40.
In the embodiment of the application, the control device 8 is used as a control center of an online detection system for coating films, and the control and detection precision of the system are improved by controlling the starting and closing of other devices in the system, sending control signals to the other devices and receiving feedback signals. For example, the application of the adhesive tape at the preset position of the substrate is realized based on the detection need to send the application control signal to the application device 20. For another example, the photoresist removing time of the photoresist removing device 30 is calculated according to the speed of the conveying device 15, and a photoresist removing control signal is sent to the photoresist removing device 30, so as to realize accurate photoresist removing.
Optionally, the method further comprises:
A warning device 16, wherein the warning device 16 is connected with the control device 8 and is used for warning based on the detection result;
And a marking device 17, wherein the marking device 17 is connected with the control device 8 and is used for marking detection results on the substrate 10.
According to the online detection system for the coating provided by the embodiment of the application, the position of the unqualified substrate 10 can be marked or a warning can be sent to a worker to remind according to the detection result of the detection device 40, and particularly, the unqualified substrate 10 can be marked on a coated product through the marking device 17. It is to be understood that, in the embodiment of the present application, the marking device 17 may be used to mark the acceptable substrate 10 or the unacceptable substrate 10, for example, the marking device 17 is a three-color marking device 17, which may mark the unacceptable substrate 10 with red color, mark the acceptable substrate 10 with green color, and mark the acceptable substrate with blue color. In different embodiments, different labeling schemes may be employed, and the application is not limited in this regard.
Based on the same inventive concept, as shown in fig. 14, the application further provides an online detection method of a plating film, which is applied to the online detection system of any one of the plating films, and the method comprises the following steps:
S02, adhering an adhesive tape on one side of a detection area of the substrate through an adhesive tape adhering device;
s04, plating both sides of the substrate through a plating device to form a plating layer;
S06, removing the adhesive tape and the coating layer on the adhesive tape through a photoresist removing device;
S08, detecting the coating layer on the other side of the detection area through a detection device.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular implementations only and is not intended to be limiting of the invention. Terms such as "disposed" or the like as used herein may refer to either one element being directly attached to another element or one element being attached to another element through an intermediate member. Features described herein in one embodiment may be applied to another embodiment alone or in combination with other features unless the features are not applicable or otherwise indicated in the other embodiment.
The present invention has been described in terms of the above embodiments, but it should be understood that the above embodiments are for purposes of illustration and description only and are not intended to limit the invention to the embodiments described. Those skilled in the art will appreciate that many variations and modifications are possible in light of the teachings of the invention, which variations and modifications are within the scope of the invention as claimed.

Claims (10)

1. An on-line detection system for plating a coating layer on both sides of a substrate and detecting the coating layer on one side of the substrate, wherein a detection area is defined on the substrate, the system comprising:
The rubberizing device is used for rubberizing one side of the detection area of the substrate by an adhesive tape;
The coating device is arranged at the downstream of the rubberizing device and is used for coating and forming a coating layer on two sides of the substrate;
The photoresist removing device is arranged at the downstream of the coating device and is used for removing the adhesive tape at one side of the detection area and the coating layer on the adhesive tape;
The detection device is arranged at the downstream of the photoresist removing device and is used for detecting the coating layer at the other side of the detection area.
2. The system of claim 1, wherein the substrate comprises oppositely disposed first and second sides; the coating layer comprises a first coating layer arranged on the first side and a second coating layer arranged on the second side;
The detection zone comprises a first detection zone arranged on the first side and/or a second detection zone arranged on the second side; the first detection zone and the second detection zone are not overlapped on the substrate;
the detection device is used for detecting the second coating layer on the first detection area or detecting the first coating layer on the second detection area.
3. The system of claim 2, wherein the taping device comprises a first taping device for taping the first side, the de-taping device comprising a first de-taping device for removing tape and a first coating layer on the tape to form a first detection zone; and/or
The rubberizing device comprises a second rubberizing device for attaching the adhesive tape to the second side, and the rubberizing device comprises a second rubberizing device for removing the adhesive tape and a second coating layer on the adhesive tape to form a second detection area.
4. The system of claim 1, wherein the taping device is configured to apply a first tape to the substrate;
the adhesive removing device is used for attaching a second adhesive tape at the position of the first adhesive tape so that the second adhesive tape is attached to the first adhesive tape, and the first adhesive tape and the single-layer coating film on the first adhesive tape are driven to be peeled from the substrate by the second adhesive tape;
The second tape has a viscosity greater than the viscosity of the first tape.
5. The system of claim 4, wherein the rubberizing device comprises: a rubberizing mechanism and a first rolling mechanism, wherein,
The rubberizing mechanism comprises a first unreeling wheel and a first reeling wheel which are arranged along the substrate conveying direction, release films are tensioned on the first unreeling wheel and the first reeling wheel, and a first adhesive tape is arranged on the release films;
The first rolling mechanism comprises a first roller shaft arranged on one side, far away from the substrate, of the first adhesive tape, and the first roller shaft is arranged between the first unreeling wheel and the first reeling wheel and used for moving along the direction close to the substrate and pressing and bonding the first adhesive tape on the substrate.
6. The system of claim 5, wherein the glue removal device comprises: a photoresist removing mechanism and a second rolling mechanism, wherein,
The photoresist removing mechanism comprises a second unreeling wheel and a second reeling wheel which are arranged along the substrate conveying direction, and the second adhesive tape is tensioned on the second unreeling wheel and the second reeling wheel;
The second rolling mechanism comprises a second roll shaft arranged on one side, far away from the substrate, of the second adhesive tape, the second roll shaft is arranged between the second unreeling wheel and the second reeling wheel, and is used for moving along the direction close to the substrate, pressing and attaching the second adhesive tape to the first adhesive tape, and moving along the direction far away from the substrate, so that the second adhesive tape drives the first adhesive tape and a single-layer coating film on the first adhesive tape to be peeled off from the substrate under the action of the tensioning force of the photoresist removing mechanism.
7. The system of claim 1, wherein the tape has a length in a direction along the substrate transport; the system further comprises:
The marking device is arranged between the rubberizing device and the coating device and is used for respectively spraying reflective coatings on the front end and the rear end of the adhesive tape along the substrate conveying direction;
A first recognition device, which is arranged at the downstream of the film plating device and is used for sending a first control signal when a first reflective coating layer at the front end of the adhesive tape along the conveying direction of the substrate is detected and sending a second control signal when a second reflective coating layer at the rear end of the adhesive tape along the conveying direction of the substrate is detected, so that the adhesive tape removing device can execute the adhesive tape removing operation based on the first control signal and stop executing the adhesive tape removing operation based on the second control signal;
And the second identification device is arranged between the photoresist removing device and the detection device and is used for identifying the mark and controlling the detection device based on the identification result.
8. The system of claim 1, wherein the detecting comprises one or more of single-sided film sheet resistance detection, single-sided film thickness detection, single-sided film reflectivity detection, single-sided film transmittance detection, single-sided film uniformity detection;
the detection device comprises one or more of a sheet resistance detection mechanism, a film thickness detection mechanism, a reflectivity detection mechanism, a transmissivity detection mechanism and a uniformity detection mechanism.
9. The system of claim 1, further comprising:
the control device is connected with the rubberizing device, the coating chamber, the photoresist removing device and the detecting device and is used for sending control signals and receiving feedback signals, and the feedback signals comprise detection results of the detecting device;
the warning device is connected with the control device and used for warning based on the detection result;
And the marking device is connected with the control device and is used for marking the detection result on the substrate.
10. An on-line detection method of a plating film, characterized by being applied to the on-line detection system of a plating film according to any one of claims 1 to 9, the method comprising:
adhering an adhesive tape on one side of a detection area of the substrate through an adhesive tape adhering device;
plating both sides of the substrate by a plating device to form a plating layer;
removing the adhesive tape and the coating layer on the adhesive tape by a photoresist removing device;
and detecting the coating layer at the other side of the detection area through a detection device.
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