CN116174966A - Laser dust-free marking device and method for lithium niobate material - Google Patents

Laser dust-free marking device and method for lithium niobate material Download PDF

Info

Publication number
CN116174966A
CN116174966A CN202310241704.7A CN202310241704A CN116174966A CN 116174966 A CN116174966 A CN 116174966A CN 202310241704 A CN202310241704 A CN 202310241704A CN 116174966 A CN116174966 A CN 116174966A
Authority
CN
China
Prior art keywords
laser
light
marking
lithium niobate
light spot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310241704.7A
Other languages
Chinese (zh)
Inventor
赵裕兴
姬夫强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Delphi Laser Co Ltd
Original Assignee
Suzhou Delphi Laser Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Delphi Laser Co Ltd filed Critical Suzhou Delphi Laser Co Ltd
Priority to CN202310241704.7A priority Critical patent/CN116174966A/en
Publication of CN116174966A publication Critical patent/CN116174966A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to a laser dust-free marking device and a marking method for lithium niobate materials, wherein a nanosecond ultraviolet laser, a light spot shaping module, a power real-time feedback adjusting module, a scanning galvanometer and a focusing lens are sequentially arranged along a light path, the light spot shaping module comprises a beam expander, a light homogenizing component and a light spot selecting module which are arranged according to the light path transmission direction, the power real-time feedback adjusting module comprises a slide and a spectroscope which are arranged according to the light path transmission direction, a motor is in driving connection with the slide and can drive the slide to rotate, a power meter is arranged on a reflecting light path of the spectroscope, a reflecting unit is arranged on a transmitting light path of the spectroscope, the reflecting light path of the reflecting unit is connected with the scanning galvanometer, and the output end of the focusing lens is right for lithium niobate materials on a processing platform. A laser with proper wavelength, peak power and pulse width is adopted, a light spot shaping module provides multi-light spot selection and uniform energy density distribution, and proper marking point diameter and depth are obtained; the power real-time feedback adjustment module controls the energy stability of marking laser in real time.

Description

Laser dust-free marking device and method for lithium niobate material
Technical Field
The invention relates to a laser dust-free marking device and a marking method for a lithium niobate material.
Background
The laser marking processing technology uses laser to irradiate the surface of the processed object with concentrated high energy, thereby completing the marking task, the non-direct contact processing can not damage the surface of the processed workpiece, has no cutting force, and the quality of the marked patterns, symbols, characters and the like is very high. The laser mark can be kept without fading, and has the characteristics of high processing speed, high marking precision, good flexibility and the like.
Lithium niobate is a colorless solid insoluble in water, can transmit waves with the wavelength of 350-5200 nanometers, is an excellent material for manufacturing optical waveguides, and is widely applied to laser frequency multiplication, nonlinear optics, a Pockels cell, an optical parametric oscillator, a Q-switch laser, other acousto-optic effect devices, gigahertz frequency optical switches and the like. In recent years, with the rapid development of the semiconductor industry, the application of a special material, namely lithium niobate, is increasing, and the wafer marking requirement for the lithium niobate material is also increasing.
Wafer marking is an essential element in semiconductor manufacturing, and is mainly to mark each wafer with a respective code to ensure traceability in subsequent manufacturing processes. The wafer marking is two kinds, namely hard marking (hard mark) and soft marking (soft mark), wherein the soft mark has higher requirements on the controllability of equipment, the detail requirements on the process are more careful, the roundness, diameter, depth and tolerance of the point, the specific specification of dust detection and the error between pulses is less than 0.5 percent, and very strict requirements are provided.
Soft mark is mainly to burn and partially vaporize the surface material to create a series of shallow small spots on the wafer surface (the diameter and depth of the spots will vary from process to process) and will not generate dust and significant resolidified residues around the periphery. Dust exceeding can directly pollute the environment of downstream machines and dust-free workshops, and residues around small points can bring hidden danger to subsequent working procedures.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a laser dust-free marking device and a marking method for a lithium niobate material.
The aim of the invention is achieved by the following technical scheme:
the laser dust-free marking device for the lithium niobate material is characterized in that: the power real-time feedback regulation module comprises a slide and a spectroscope which are arranged according to the transmission direction of the optical path, a motor is connected with the slide in a driving way, the slide can be driven to rotate, a power meter is arranged on a reflection optical path of the spectroscope, a reflection unit is arranged on a transmission optical path of the spectroscope, the reflection optical path of the reflection unit is connected with the scanning galvanometer, and the output end of the focusing mirror is right opposite to a lithium niobate material on a processing platform.
Further, the laser dust-free marking device for the lithium niobate material is characterized in that the nanosecond ultraviolet laser is a nanosecond ultraviolet laser with 15-40K power, 20ns pulse width and 30-100K frequency range adjustable.
Further, the lithium niobate material laser dust-free marking device is characterized in that the nanosecond ultraviolet laser is a nanosecond ultraviolet laser with 15W power, 17ns pulse and adjustable frequency ranging from 30K to 100K.
Further, the laser dust-free marking device for the lithium niobate material is characterized in that a coaxial blowing unit for accelerating the air flow of a marking area is arranged above the processing platform, and a dust collecting unit for adsorbing dust particles is arranged beside the processing platform.
Further, the laser dust-free marking device for the lithium niobate material comprises a first reflecting mirror and a second reflecting mirror which are arranged along the light path transmission direction.
Further, the laser dust-free marking device for the lithium niobate material comprises a linear motor and a tungsten steel sheet with the thickness of 0.3mm, wherein the linear motor is in driving connection with the tungsten steel sheet and is used for driving the tungsten steel sheet to move, and round holes with the diameters of 500mm, 1000mm and 1500mm are formed in the tungsten steel sheet, so that the spot sizes with different diameters can be selected.
Further, the lithium niobate material laser dust-free marking device is characterized in that the light homogenizing component is a beam homogenizer for converting the collimated Gaussian beam into the collimated flat-top beam.
According to the laser dust-free marking method for the lithium niobate material, the nanosecond ultraviolet laser outputs Gaussian beams, the Gaussian beams are incident to the light spot shaping module, the light spot shaping module shapes the Gaussian beams into flat-top beams, and the light spot shaping module adapts to processing of different spot diameters through switching of different focused light spot sizes, and the beam expander adjusts the light spot energy density;
the laser power fluctuation is monitored in real time, if the laser power fluctuation is transmitted to a motor, the motor drives a slide to rotate, and the laser power is regulated in real time; most of the light beams penetrate through the spectroscope and are guided into the scanning galvanometer through the reflecting unit, the light beams are focused into light spots required by processing under the action of the focusing mirror, and marking operation is carried out on the lithium niobate material.
Furthermore, in the laser dust-free marking method for the lithium niobate material, the light spot selection module selects proper light spots, and the energy distribution of the light spots is changed by adjusting the matching of the beam expander and the light homogenizing component, so as to obtain focused light spots meeting the processing requirements;
when the dot diameter of 20-50 micrometers is processed, laser single pulse is adopted for directly dotting, if the processing depth is required to be increased, the dot is performed for multiple times at the same position; if the spot diameter is adjusted in a smaller range, the Z axial movement is adopted to carry out processing in a defocusing mode, the adjustment of energy density and the roundness of the light spots are paid attention to in the process, and if the roundness of the marking spot diameter is reduced, the matching adjustment of the beam expander and the light spot selection module is needed;
when the dot diameter of 50-100 micrometers is processed, the processing is performed by adopting a mode of scanning concentric circles by laser, the distance between the concentric circles is determined according to the size of a focusing light spot, and the distance can be set to be 1/2 of the size of the focusing light spot.
Furthermore, according to the laser dust-free marking method for the lithium niobate material, the light spot shaping module provides multi-light spot selection and uniform energy density distribution so as to obtain proper marking point diameter and depth; the power real-time feedback regulation module controls the energy stability of marking laser in real time; the dot diameter is adjustable from 20 to 100 micrometers by combining a pulse dotting mode and a scanning scribing mode, pulse single-point marking is adopted for the dot diameter of 20 to 50 micrometers, and a concentric circle scanning mode of a vibrating mirror is adopted for the dot diameter of 50 to 100 micrometers; the first pulse with nonuniform delay filtering energy is added before the scanning galvanometer works, so that stable laser energy is obtained, and further uniform dot diameter and marking effect are obtained; selecting a scanning field lens with a reasonable working distance, wherein the working distance of the field lens is 175mm; the coaxial blowing unit accelerates the air flow of the marking area, the dust collecting unit timely sucks dust particles, the cleaning of the marking area is ensured, and dust-free marking is realized.
Compared with the prior art, the invention has remarkable advantages and beneficial effects, and is specifically embodied in the following aspects:
(1) the laser power stability and the energy uniform distribution are ensured through the light spot shaping module and the power real-time feedback adjusting module, the light spot shaping module provides multi-light spot selection and uniform energy density distribution, a plurality of light spots are provided, the energy density is ensured to be more uniform, the size of marking point diameter is controllable, and proper marking point diameter and depth are obtained; the power real-time feedback regulation module controls the energy stability of marking laser in real time;
(2) based on the characteristics of the lithium niobate material, a nanosecond ultraviolet laser with proper wavelength, peak power and pulse width is adopted;
(3) the method is characterized in that a pulse dotting mode and a scanning scribing mode are combined, pulse single-point marking is adopted for dot diameters of 20-50 microns, and a vibrating mirror scanning concentric circle mode is adopted for dot diameters of 50-100 microns;
(4) the uniformity of laser spot energy distribution, the control of pulse quantity, the control of scanning times and scanning speed ensure the uniformity and stability of marking point diameter and depth;
(5) the first pulse with nonuniform delay filtering energy is added before the scanning galvanometer works, so that stable laser energy is obtained, and further uniform dot diameter and marking effect are obtained; the coaxial blowing unit and the dust collecting unit ensure the cleanliness of the marking area.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1: the optical path structure of the invention is schematically shown.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present invention, directional terms, order terms, etc. are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
As shown in fig. 1, a laser dust-free marking device for lithium niobate materials is provided with a nanosecond ultraviolet laser 10, a light spot shaping module 20, a power real-time feedback adjustment module 30, a scanning galvanometer 50 and a focusing lens 60 in sequence along a light path, wherein the light spot shaping module 20 comprises a beam expander 21, a light homogenizing component 22 and a light spot selecting module 23 which are arranged according to the transmission direction of the light path, and the beam expander 21 is an electric beam expander; the power real-time feedback regulation module 30 comprises a slide 31 and a spectroscope 32 which are arranged according to the light path transmission direction, a motor is in driving connection with the slide 31 and can drive the slide 31 to rotate, a power meter 33 is arranged on a reflection light path of the spectroscope 32, a reflection unit is arranged on a transmission light path of the spectroscope 32, the reflection unit comprises a first reflection mirror 41 and a second reflection mirror 42 which are arranged according to the light path transmission direction, the reflection light path of the reflection unit is connected with a scanning vibrating mirror 50, and the output end of a focusing mirror 60 is right opposite to a lithium niobate material 80 on a processing platform 90; a coaxial blowing unit 71 for accelerating the air flow in the marking area is arranged above the processing platform 80, and a dust collecting unit 72 for adsorbing dust particles is arranged beside the processing platform.
Based on the characteristics of the lithium niobate material, selecting a marking laser with proper wavelength; the lithium niobate material has extremely high process requirement on marking energy, can use a smaller laser energy range and is very sensitive to the response of laser peak power and pulse width.
The flare shaping module 20 and the power real-time feedback adjustment module 30 are used for guaranteeing laser power stability and energy uniform distribution.
In order to adapt to the characteristics of lithium niobate materials and realize a dust-free marking process, a power real-time feedback adjusting module 30 is arranged in a light path to timely compensate the energy of a laser, so that adverse effects caused by instability are avoided.
The uniformity of laser spot energy distribution, the control of pulse quantity, the control of scanning times and scanning speed ensure the uniformity and stability of marking point diameter and depth.
The light path is provided with the light spot shaping module 20, so that a plurality of light spots are provided for the whole marking process, the energy density is ensured to be more uniform, and the marking spot diameter size is controllable.
The coaxial blowing unit 71 and the dust collecting unit 72 are arranged at the marking position, so that dust particles are reduced, and the effect of dust-free marking is realized.
The nanosecond ultraviolet laser 10 adopts a nanosecond ultraviolet laser with 15W-40K power, pulse width less than 20ns and adjustable frequency ranging from 30K to 100K, preferably a nanosecond ultraviolet laser with 15W power, 17ns pulse width and adjustable frequency ranging from 30K to 100K. The spot selection module 23 comprises a linear motor and a tungsten steel sheet with the thickness of 0.3mm, wherein the linear motor is in driving connection with the tungsten steel sheet and is used for driving the tungsten steel sheet to move, and round holes with the diameters of 500mm, 1000mm and 1500mm are formed in the tungsten steel sheet, so that spot sizes with different diameters can be selected. The light homogenizing component 22 is a beam homogenizer for converting a collimated gaussian beam into a collimated flat top beam.
The gas at the gas inlet end of the coaxial blowing unit 71 is strictly filtered to ensure the cleanliness of the blown gas, and the blown gas can be compressed air or nitrogen. The dust collecting unit 72 is used for sucking away dust particles, so as to ensure a dust-free marking effect. The air inlet speed of the coaxial air blowing unit 71 and the air displacement of the dust collecting unit 72 are mutually matched, so that a micro negative pressure environment is formed in a processing and marking area, and the aim of dust removal is better achieved.
Considering that the processing area is in a micro-negative pressure environment, the processing platform 90 is provided with a corresponding fixing structure to ensure that the lithium niobate material (wafer) 80 is stably placed, and the marking processing operation is completed.
The nanosecond ultraviolet laser 10 outputs Gaussian beams, the Gaussian beams are incident to the light spot shaping module 20, the light spot shaping module 20 shapes the Gaussian beams into flat-top beams, and the light spot shaping module is suitable for processing of different spot diameters through switching of different focused light spot sizes, and the beam expander 21 adjusts the light spot energy density; incident to the power real-time feedback adjustment module 30, the spectroscope 32 of the power real-time feedback adjustment module 30 reflects a small part of the light beam to the power meter 33, monitors laser power fluctuation in real time, and if the laser power fluctuation transmits a control signal to the motor, the motor drives the slide 31 to rotate, and adjusts the laser power in real time; most of the light beam passes through the beam splitter 32 and is guided to the scanning galvanometer 50 via the reflecting unit, and the light beam is focused into a light spot required for processing by the focusing mirror (field lens) 60, and a marking operation is performed on the lithium niobate material 90.
The light spot selection module 23 selects proper light spots, the energy distribution of the light spots is changed by adjusting the matching of the beam expander 21 and the light homogenizing component 22, the focusing light spots meeting the processing requirements are obtained, and 3 groups of focusing light spots can be arranged; when the dot diameter of 20-50 micrometers is processed, laser single pulse is adopted for directly dotting, if the processing depth is required to be increased, the dot is performed for multiple times at the same position; if the spot diameter is adjusted in a smaller range, the Z axial movement is adopted to carry out processing in a defocusing mode, the adjustment of energy density and the roundness of the light spots are paid attention to in the process, and if the roundness of the marking spot diameter is reduced, the matching adjustment of the beam expander 21 and the light spot selection module 23 is needed; when the dot diameter of 50-100 micrometers is processed, the processing is performed by adopting a mode of scanning concentric circles by laser, the distance between the concentric circles is determined according to the size of a focusing light spot, and the distance can be set to be 1/2 of the size of the focusing light spot.
The spot shaping module 20 provides multiple spot selections and uniform energy density distribution to obtain the proper marking spot diameter and depth; the power real-time feedback adjustment module 30 controls the energy stability of the marking laser in real time; the dot diameter is adjustable from 20 to 100 micrometers by combining a pulse dotting mode and a scanning scribing mode, pulse single-point marking is adopted for the dot diameter of 20 to 50 micrometers, and a concentric circle scanning mode of a vibrating mirror is adopted for the dot diameter of 50 to 100 micrometers; the first pulse with nonuniform delay filtering energy is added before the scanning galvanometer works, so that stable laser energy is obtained, and further uniform dot diameter and marking effect are obtained; selecting a scanning field lens with a reasonable working distance, wherein the working distance of the field lens is 175mm; the working distance is too large, and the energy distribution uniformity of the laser focusing light spot is poor in a defocusing state; the working distance is too small, and the difficulty of the coaxial blowing unit 71 and the dust collecting unit 72 is increased; the coaxial blowing unit 71 accelerates the air flow of the marking area, the dust collecting unit 72 sucks dust particles away in time, the cleaning of the marking area is ensured, and dust-free marking is realized.
Gaussian beams are shaped into flat-top beams through the light spot shaping module, then a proper light spot is selected through the light spot selecting module to realize dust-free marking of lithium niobate materials, and a marking coaxial blowing and dust collecting mechanism is configured to realize a thousand-level dust-free environment for obtaining a better dust-free marking effect.
Because the lithium niobate material is sensitive to laser energy, in order to obtain stable marking effect, a power real-time feedback adjusting module is designed to ensure the stability of marking energy; the energy instability of the laser just after light emission is considered, and the uniformity of the dot diameter is ensured by increasing laser delay control.
Two marking modes are realized: one is to control the light spot by focusing the light spot and defocusing amount, and mark by using a single pulse 1 or more times of light emitting mode; one is to perform marking by scanning concentric circles with a focused spot.
In summary, according to the laser dust-free marking device and the marking method for the lithium niobate material, a nanosecond ultraviolet laser with proper wavelength, peak power and pulse width is selected based on the characteristics of the lithium niobate material; the spot shaping module and the power real-time feedback regulation module ensure stable laser power and uniform energy distribution, and the spot shaping module provides multi-spot selection and uniform energy density distribution so as to obtain proper marking point diameter and depth; the power real-time feedback regulation module controls the energy stability of marking laser in real time; the method is characterized in that a pulse dotting mode and a scanning scribing mode are combined, pulse single-point marking is adopted for dot diameters of 20-50 microns, and a vibrating mirror scanning concentric circle mode is adopted for dot diameters of 50-100 microns; the first pulse with nonuniform delay filtering energy is added before the scanning galvanometer works, so that stable laser energy is obtained, and further uniform dot diameter and marking effect are obtained; the coaxial blowing unit and the dust collecting unit ensure the cleanliness of the marking area.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily appreciate variations or alternatives within the scope of the present invention.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Claims (10)

1. Laser dust-free marking device for lithium niobate materials, which is characterized in that: the laser device comprises a nanosecond ultraviolet laser (10), a light spot shaping module (20), a power real-time feedback adjusting module (30), a scanning galvanometer (50) and a focusing mirror (60) which are sequentially arranged along a light path, wherein the light spot shaping module (20) comprises a beam expanding mirror (21), a light homogenizing component (22) and a light spot selecting module (23) which are arranged according to the light path transmission direction, the power real-time feedback adjusting module (30) comprises a slide (31) and a spectroscope (32) which are arranged according to the light path transmission direction, a motor is in driving connection with the slide (31) and can drive the slide (31) to rotate, a power meter (33) is arranged on a reflecting light path of the spectroscope (32), a reflecting unit is arranged on a transmitting light path of the spectroscope (32), the reflecting light path of the reflecting unit is connected with the scanning galvanometer (50), and the output end of the focusing mirror (60) is right opposite to a lithium niobate material (80) on a processing platform (90).
2. The laser dust-free marking device for lithium niobate materials according to claim 1, wherein: the nanosecond ultraviolet laser (10) is a nanosecond ultraviolet laser with power of 15W-40K, pulse width less than 20ns and adjustable frequency in the range of 30K-100K.
3. The laser dust-free marking device for lithium niobate materials according to claim 2, wherein: the nanosecond ultraviolet laser (10) is a nanosecond ultraviolet laser with 15W power, 17ns pulse width and adjustable frequency ranging from 30K to 100K.
4. The laser dust-free marking device for lithium niobate materials according to claim 1, wherein: the light spot selection module (23) comprises a linear motor and a tungsten steel sheet with the thickness of 0.3mm, the linear motor is in driving connection with the tungsten steel sheet and used for driving the tungsten steel sheet to move, and round holes with the diameters of 500mm, 1000mm and 1500mm are formed in the tungsten steel sheet, so that the light spot sizes with different diameters can be selected.
5. The laser dust-free marking device for lithium niobate materials according to claim 1, wherein: the light homogenizing component (22) is a beam homogenizer and is used for converting a collimated Gaussian beam into a collimated flat-top beam.
6. The laser dust-free marking device for lithium niobate materials according to claim 1, wherein: a coaxial blowing unit (71) for accelerating the air flow of the marking area is arranged above the processing platform (80), and a dust collecting unit (72) for adsorbing dust particles is arranged beside the processing platform.
7. The laser dust-free marking device for lithium niobate materials according to claim 1, wherein: the reflecting unit comprises a first reflecting mirror (41) and a second reflecting mirror (42) which are arranged along the transmission direction of the optical path.
8. The method for realizing laser dust-free marking of the lithium niobate material by using the device of claim 1, which is characterized in that: the nanosecond ultraviolet laser (10) outputs Gaussian beams, the Gaussian beams are incident to the light spot shaping module (20), the light spot shaping module (20) shapes the Gaussian beams into flat-top beams, and the light spot shaping module is suitable for processing of different spot diameters through switching of different focused light spot sizes, and the beam expander (21) adjusts the light spot energy density;
the laser power fluctuation is monitored in real time, if the laser power fluctuation transmits a control signal to a motor, the motor drives a slide (31) to rotate, and the laser power is regulated in real time; most of the light beams penetrate through the spectroscope (32) and are guided into the scanning galvanometer (50) through the reflecting unit, the light beams are focused into light spots required by processing under the action of the focusing mirror (60), and marking operation is carried out on the lithium niobate material (90).
9. The laser dust-free marking method for the lithium niobate material according to claim 8, wherein: the light spot selection module (23) selects proper light spots, and the energy distribution of the light spots is changed by adjusting the matching of the beam expander (21) and the light homogenizing component (22) so as to obtain focused light spots meeting the processing requirements;
when the dot diameter of 20-50 micrometers is processed, laser single pulse is adopted for directly dotting, if the processing depth is required to be increased, the dot is performed for multiple times at the same position; if the spot diameter is adjusted in a smaller range, the Z axial movement is adopted to carry out processing in a defocusing mode, the adjustment of energy density and the roundness of the light spots are paid attention to in the process, and if the roundness of the marking spot diameter is reduced, the matching adjustment of the beam expander (21) and the light spot selection module (23) is needed;
when the dot diameter of 50-100 micrometers is processed, the processing is performed by adopting a mode of scanning concentric circles by laser, the distance between the concentric circles is determined according to the size of a focusing light spot, and the distance can be set to be 1/2 of the size of the focusing light spot.
10. The laser dust-free marking method for lithium niobate materials according to claim 8 or 9, wherein: the spot shaping module (20) provides multi-spot selection and uniform energy density distribution to obtain proper marking spot diameter and depth; the power real-time feedback regulation module (30) controls the energy stability of marking laser in real time; the method is characterized in that a pulse dotting mode and a scanning scribing mode are combined, the dot diameter is adjustable from 20-100 micrometers, pulse single-point marking is adopted for the dot diameter of 20-50 micrometers, and a galvanometer scanning concentric circle mode is adopted for the dot diameter of 50-100 micrometers; the first pulse with nonuniform delay filtering energy is added before the scanning galvanometer works, so that stable laser energy is obtained, and further uniform dot diameter and marking effect are obtained; selecting a scanning field lens with a reasonable working distance, wherein the working distance of the field lens is 175mm; the coaxial blowing unit (71) accelerates the air flow of the marking area, the dust collecting unit (72) sucks dust particles in time, the cleaning of the marking area is ensured, and dust-free marking is realized.
CN202310241704.7A 2023-03-14 2023-03-14 Laser dust-free marking device and method for lithium niobate material Pending CN116174966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310241704.7A CN116174966A (en) 2023-03-14 2023-03-14 Laser dust-free marking device and method for lithium niobate material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310241704.7A CN116174966A (en) 2023-03-14 2023-03-14 Laser dust-free marking device and method for lithium niobate material

Publications (1)

Publication Number Publication Date
CN116174966A true CN116174966A (en) 2023-05-30

Family

ID=86440403

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310241704.7A Pending CN116174966A (en) 2023-03-14 2023-03-14 Laser dust-free marking device and method for lithium niobate material

Country Status (1)

Country Link
CN (1) CN116174966A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116833575A (en) * 2023-07-13 2023-10-03 鸿星科技(集团)股份有限公司 Method for stamping characters on SMD quartz crystal oscillator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116833575A (en) * 2023-07-13 2023-10-03 鸿星科技(集团)股份有限公司 Method for stamping characters on SMD quartz crystal oscillator
CN116833575B (en) * 2023-07-13 2024-01-23 鸿星科技(集团)股份有限公司 Method for stamping characters on SMD quartz crystal oscillator

Similar Documents

Publication Publication Date Title
KR100681390B1 (en) A semiconductor wafer dicing and scribing system and appratus with a high speed laser beam focus positioning system to arbitrary 3D positions and laser beam diffraction system
TWI604908B (en) Method for laser processing of silicon by filamentation of burst ultrafast laser pulses and product made by such method
US7459655B2 (en) Laser beam processing machine
US12011785B2 (en) Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same
US20050070075A1 (en) Laser beam processing method and laser beam machine
CN110722272A (en) Ultrafast laser micro-nano cutting drilling equipment and method
CN116174966A (en) Laser dust-free marking device and method for lithium niobate material
JP2016516584A (en) Linking beam angle and workpiece movement for taper control
Nasrollahi et al. Laser drilling with a top-hat beam of micro-scale high aspect ratio holes in silicon nitride
JP2000233291A (en) Device and method for laser beam working
CN107116308B (en) Waveguide micro/nano processing system and processing method
CN112192019A (en) Laser processing drilling system
JP2006521930A (en) Positioning method, apparatus and product
CN219703865U (en) Laser dust-free marking device for lithium niobate material
CN113953273A (en) Scanning method and device for object to be scanned, storage medium and electronic device
CN111299859A (en) Ultrafast laser non-taper cutting system and cutting method
CN111618452A (en) Ultrafast laser cutting method and device for transparent material
TWI595955B (en) A laser machining method
CN213105126U (en) Cutting device
CN216633041U (en) Golden finger laser cutting system
KR20130125438A (en) Laser machine using ultra - short pulse laser by single photon absorption
CN214024057U (en) Processing device for transparent material
CN213410786U (en) Processing device for ultrafast laser transparent material
CN114054972A (en) Dynamic focusing laser cutting method and device
CN110818241A (en) Glass cutting method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination