CN116171121A - 清洗用海绵辊 - Google Patents

清洗用海绵辊 Download PDF

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Publication number
CN116171121A
CN116171121A CN202180058170.3A CN202180058170A CN116171121A CN 116171121 A CN116171121 A CN 116171121A CN 202180058170 A CN202180058170 A CN 202180058170A CN 116171121 A CN116171121 A CN 116171121A
Authority
CN
China
Prior art keywords
sponge
core
cleaning
water
sintered body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180058170.3A
Other languages
English (en)
Chinese (zh)
Inventor
大久保绘里
真野稔正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aion Co Ltd
Original Assignee
Aion Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aion Co Ltd filed Critical Aion Co Ltd
Publication of CN116171121A publication Critical patent/CN116171121A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/02—Brushes with driven brush bodies or carriers power-driven carriers
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B13/00—Brushes with driven brush bodies or carriers
    • A46B13/001—Cylindrical or annular brush bodies
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B9/00—Arrangements of the bristles in the brush body
    • A46B9/005—Arrangements of the bristles in the brush body where the brushing material is not made of bristles, e.g. sponge, rubber or paper
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L13/00—Implements for cleaning floors, carpets, furniture, walls, or wall coverings
    • A47L13/10—Scrubbing; Scouring; Cleaning; Polishing
    • A47L13/16—Cloths; Pads; Sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/11—Making porous workpieces or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B11/00—Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water
    • A46B11/06—Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water connected to supply pipe or to other external supply means
    • A46B11/063—Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water connected to supply pipe or to other external supply means by means of a supply pipe

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning Implements For Floors, Carpets, Furniture, Walls, And The Like (AREA)
CN202180058170.3A 2020-08-07 2021-08-04 清洗用海绵辊 Pending CN116171121A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020134743A JP7595907B2 (ja) 2020-08-07 2020-08-07 洗浄用スポンジローラ
JP2020-134743 2020-08-07
PCT/JP2021/029016 WO2022030562A1 (ja) 2020-08-07 2021-08-04 洗浄用スポンジローラ

Publications (1)

Publication Number Publication Date
CN116171121A true CN116171121A (zh) 2023-05-26

Family

ID=80117547

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180058170.3A Pending CN116171121A (zh) 2020-08-07 2021-08-04 清洗用海绵辊

Country Status (5)

Country Link
US (1) US20230276931A1 (enExample)
JP (1) JP7595907B2 (enExample)
KR (1) KR20230048117A (enExample)
CN (1) CN116171121A (enExample)
WO (1) WO2022030562A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117444820A (zh) * 2023-11-23 2024-01-26 江西和美陶瓷有限公司 一种哑光抛釉瓷砖抛光装置及其方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW447027B (en) * 1997-04-18 2001-07-21 Cabot Microelectronics Corp Polishing pad for a semiconductor substrate
JP2006272134A (ja) * 2005-03-29 2006-10-12 Dainippon Screen Mfg Co Ltd 基板処理装置
CN1863645A (zh) * 2003-08-08 2006-11-15 安格斯公司 用于制作浇注在可旋转基体上的整体式多孔垫的方法和材料
JP2011066386A (ja) * 2009-08-20 2011-03-31 Aion Kk 洗浄用スポンジ体及び洗浄方法
JP2014045093A (ja) * 2012-08-27 2014-03-13 Sharp Corp 基板搬送装置および基板処理装置
JP2015196124A (ja) * 2014-03-31 2015-11-09 株式会社荏原製作所 ロールスポンジホルダー、ロールスポンジの製造方法、基板洗浄装置及び基板処理装置
JP2019147244A (ja) * 2018-02-27 2019-09-05 国立大学法人埼玉大学 バフ材及び研磨方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5032497B1 (enExample) 1970-04-22 1975-10-21
JPS6027101B2 (ja) 1981-08-18 1985-06-27 松下電器産業株式会社 回転ヘッドアセンブリ−
JPS59197439A (ja) * 1983-04-26 1984-11-09 Asahi Chem Ind Co Ltd 親水性多孔質焼結体
JPH0751640A (ja) * 1993-08-11 1995-02-28 Inax Corp タイルパネルの表面清掃方法
US6070284A (en) 1998-02-04 2000-06-06 Silikinetic Technology, Inc. Wafer cleaning method and system
JP3854085B2 (ja) 2001-03-16 2006-12-06 株式会社荏原製作所 基板処理装置
JP4053060B2 (ja) 2003-12-26 2008-02-27 アイオン株式会社 洗浄用スポンジローラー用の中芯
US8092730B2 (en) 2005-12-06 2012-01-10 Entegris, Inc. Molded rotatable base for a porous pad
WO2009147747A1 (ja) 2008-06-06 2009-12-10 アイオン株式会社 洗浄用スポンジローラー用の中芯
TWD161994S (zh) 2011-06-08 2014-08-01 伊利諾工具工程公司 海綿刷的刷心之部分（一）

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW447027B (en) * 1997-04-18 2001-07-21 Cabot Microelectronics Corp Polishing pad for a semiconductor substrate
CN1863645A (zh) * 2003-08-08 2006-11-15 安格斯公司 用于制作浇注在可旋转基体上的整体式多孔垫的方法和材料
JP2006272134A (ja) * 2005-03-29 2006-10-12 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2011066386A (ja) * 2009-08-20 2011-03-31 Aion Kk 洗浄用スポンジ体及び洗浄方法
JP2014045093A (ja) * 2012-08-27 2014-03-13 Sharp Corp 基板搬送装置および基板処理装置
JP2015196124A (ja) * 2014-03-31 2015-11-09 株式会社荏原製作所 ロールスポンジホルダー、ロールスポンジの製造方法、基板洗浄装置及び基板処理装置
JP2019147244A (ja) * 2018-02-27 2019-09-05 国立大学法人埼玉大学 バフ材及び研磨方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117444820A (zh) * 2023-11-23 2024-01-26 江西和美陶瓷有限公司 一种哑光抛釉瓷砖抛光装置及其方法

Also Published As

Publication number Publication date
JP7595907B2 (ja) 2024-12-09
JP2022030618A (ja) 2022-02-18
WO2022030562A1 (ja) 2022-02-10
KR20230048117A (ko) 2023-04-10
TW202208107A (zh) 2022-03-01
US20230276931A1 (en) 2023-09-07

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