CN116169087A

CN116169087A - Wafer lifting device and cleaning equipment

Info

Publication number: CN116169087A
Application number: CN202310101720.6A
Authority: CN
Inventors: 高少飞; 马宏帅; 赵宏宇; 王锐廷; 张金斌; 南建辉
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2023-01-18
Filing date: 2023-01-18
Publication date: 2023-05-26

Abstract

The application discloses wafer elevating gear and cleaning equipment, wafer elevating gear includes: the first supporting component is used for supporting the end face of the wafer at least at two points so as to enable the wafer to stand sideways; the second supporting component is used for supporting the wafer after ascending, and the second supporting component avoids the first supporting component when ascending to support the wafer; the lifting mechanism is respectively connected with the first supporting component and the second supporting component and is used for driving the first supporting component to drive the wafer to rise from the first preset position to the second preset position; and the second support assembly is used for driving the wafer to rise from the second preset position to the third preset position after the wafer rises to the second preset position, so that the wafer is separated from the first support assembly. The supporting device can completely dry the wafer, and the number of the contact points of the wafer and the supporting device has no influence on whether the wafer is dried or not.

Description

Wafer lifting device and cleaning equipment

Technical Field

The application relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer lifting device and cleaning equipment.

Background

The tank cleaner is used for cleaning and drying the wafer, the wafer is always positioned on the wafer lifting device in the whole process, the contact part (contact point) of the wafer and the wafer lifting device is difficult to dry completely, and the more the contact points are, the higher the risk that the wafer is not dried completely is.

Disclosure of Invention

In view of the above technical problems, the present application provides a wafer lifting device and a cleaning apparatus, which can solve the problem that the contact point of the wafer is difficult to be completely dried when the wafer is dried by the wafer lifting device in the related art.

To solve the above technical problem, in a first aspect, an embodiment of the present application provides a wafer lifting device, including:

the first supporting component is used for supporting the end face of the wafer at least at two points so as to enable the wafer to stand sideways;

the second supporting component is used for supporting the wafer after ascending, and the second supporting component avoids the first supporting component when ascending to support the wafer;

the lifting mechanism comprises a driving assembly, a connecting rod assembly and a sliding assembly respectively connected with the driving assembly and the connecting rod assembly, wherein the sliding assembly is also respectively connected with the first supporting assembly and the second supporting assembly, the driving assembly drives the sliding assembly to move, and the sliding assembly is matched with the connecting rod assembly to drive the first supporting assembly to drive the wafer to rise from a first preset position to a second preset position; and driving the second supporting component to drive the wafer to rise from the second preset position to a third preset position after the wafer rises to the second preset position, so that the wafer is separated from the first supporting component.

Optionally, the sliding component cooperates with the connecting rod component to drive the first supporting component to drive the wafer to rise from the first preset position to the second preset position, and further drive the second supporting component to rise synchronously with the first supporting component.

Optionally, the sliding assembly includes:

the fixing plate comprises a first side surface and a second side surface which are oppositely arranged, and a third side surface which is connected with the first side surface and the second side surface, wherein the first side surface is provided with a first guide structure, and the second side surface is also provided with a second guide structure;

the first sliding block is connected with the first guide structure in a vertically sliding manner, is also connected with the first supporting component and is used for driving the first supporting component to do lifting motion;

the second sliding block is arranged above the first sliding block, is connected with the first guide structure in a vertically sliding manner, is also connected with the second supporting component and is used for driving the second supporting component to do lifting motion;

the connecting rod assembly includes:

one end of the first connecting rod is hinged with the first sliding block;

one end of the second connecting rod is hinged with the second sliding block, the other end of the second connecting rod is hinged with the other end of the first connecting rod through a hinge piece, and the hinge piece is slidably matched with the second guiding structure;

The driving assembly drives the second sliding block to slide up and down along the first guiding structure; the hinge piece moves along the second guide structure under the drive of the second slider, and the first slider slides up and down along the first guide structure under the drive of the hinge piece.

Optionally, the second guiding structure includes a vertical guiding portion and an arc guiding portion connected to a top end of the vertical guiding portion, and when the second slider is stacked on the top surface of the first slider, the hinge piece is matched with the vertical guiding portion;

the hinge piece is driven by the second sliding block to move linearly along the vertical guide part and move in an arc manner along the arc-shaped guide part, wherein the hinge piece is located at the first preset position corresponding to the wafer at the bottom end of the vertical guide part, the hinge piece is located at the second preset position corresponding to the wafer at the top end of the vertical guide part, and the hinge piece is located at the third preset position corresponding to the wafer at the end, far away from the vertical guide part, of the arc-shaped guide part.

Optionally, a first blocking structure is arranged at one end of the arc-shaped guide part far away from the vertical guide part, and is used for preventing the hinge piece from sliding off the arc-shaped guide part; and/or the number of the groups of groups,

And a second blocking structure is arranged on the first side surface close to the top end of the first guiding structure and used for blocking the second sliding block from continuously moving upwards when the wafer rises to the third preset position.

Optionally, the second side surface is provided with an adapter plate, and the adapter plate includes a front side surface facing the second slider and a rear side surface opposite to the front side surface;

the rear side comprises a vertical surface and an arc surface connected with the top edge of the vertical surface, the vertical surface forms the vertical guide part, and the arc surface forms the arc guide part.

Optionally, the arc-shaped guiding part is arc-shaped, and the radius of the arc-shaped guiding part is equal to the distance between two hinged positions on the first connecting rod.

Optionally, the driving assembly includes:

the first sliding block is sleeved on the outer side of the lead screw in a vertically sliding manner, and the second sliding block is in threaded connection with the lead screw;

and the driving part is used for driving the screw rod to rotate forwards or reversely.

Optionally, the lifting mechanism further includes:

the first connecting assembly comprises a first load piece connected with the first sliding block and two first connecting rods arranged at intervals, one end of each first connecting rod is connected with the first load piece, and the other end of each first connecting rod is connected with the first supporting assembly;

The second connecting assembly comprises a second load piece connected with the second sliding block and a second connecting rod arranged between the two first connecting rods, one end of the second connecting rod is connected with the second load piece, and the other end of the second connecting rod is connected with the second supporting assembly.

Optionally, the second supporting component includes a supporting plate, and a single row of limiting teeth arranged on the top surface of the supporting plate, and a tooth slot is formed between two adjacent limiting teeth and is used for carrying out single-point supporting on the wafer;

the wafer lifting device further comprises two third guide structures which are oppositely arranged, wherein the third guide structures are arranged above the first support assembly and are used for guiding the two opposite end faces of the wafer in the process that the second support assembly drives the wafer to rise from the second preset position to the third preset position.

In a second aspect, embodiments of the present application further provide a cleaning apparatus, including a cleaning tank for containing a cleaning solution, and a wafer lifting device as described in the foregoing embodiments;

the wafer lifting device is arranged in the cleaning tank, and when the wafer is lifted to the second preset position, the wafer is positioned above the liquid level of the cleaning liquid.

Optionally, the cleaning tank includes:

the groove body is used for containing the cleaning liquid;

the cover body is covered on the groove body;

and the drying device is arranged on the inner side surface of the cover body and is used for drying the wafer when the first supporting component drives the wafer to rise from the first preset position to the second preset position and the second supporting component drives the wafer to rise from the second preset position to the third preset position.

Optionally, the cover body includes a first side plate, a second side plate and a third side plate which are sequentially connected, and a top cover which is covered on the first side plate, the second side plate and the third side plate, and one surface of the cover body opposite to the second side plate is open;

the lifting mechanism is arranged at one side of the opening;

the two third guide structures are respectively arranged on the inner side surface of the first side plate and the inner side surface of the third side plate, each third guide structure comprises a plurality of raised strips extending along the vertical direction, guide grooves are formed between two adjacent raised strips, and the guide grooves on the first side plate and the guide grooves on the third side plate are in one-to-one correspondence.

Optionally, the convex strip comprises at least two sections of sub convex strips which are arranged at intervals along the vertical direction.

Optionally, the drying device includes:

the spraying unit is used for spraying volatile organic solvents to the wafer in the process that the first supporting component drives the wafer to move from the first preset position to the second preset position, and blowing inert gases to the wafer in the process that the second supporting component drives the wafer to move from the second preset position to the third preset position; wherein the second preset position is located above the liquid level of the cleaning liquid.

Optionally, the lifting mechanism drives the second support assembly to rise above the liquid level of the cleaning solution synchronously when driving the first support assembly to drive the wafer to rise from the first preset position to the second preset position.

As described above, the driving assembly drives the sliding assembly to move, the sliding assembly cooperates with the connecting rod assembly to drive the first supporting assembly to drive the wafer to rise from the first preset position to the second preset position, so that the wafer is separated from the cleaning liquid, and the wafer is supported on the first supporting assembly before rising to the second preset position. After the preliminary drying, the first contact point of the wafer may not be completely dried, and other portions may be dried. Then the driving component drives the sliding component to continue to move, the sliding component is matched with the connecting rod component to drive the second supporting component to drive the wafer to rise to a third preset position from a second preset position, so that the wafer is separated from the first supporting component, the wafer is supported on the second supporting component, the first contact point is exposed, the first contact point can be further dried, and the second supporting component is supported on a second contact point of the wafer and is dried in advance. In the wafer lifting device of the embodiment, in the drying process, the lifting mechanism is used for controlling the first supporting component to drive the wafer to lift up so as to finish the drying of the part except the first contact point, and then controlling the second supporting component to drive the wafer to lift up continuously so as to separate from the support of the first supporting component, and the support of the wafer lifting device to the wafer is switched from the first contact point to the second contact point so as to finish the drying of the first contact point. Therefore, the wafer lifting device of the embodiment can completely dry the wafer, and the number of the contact points of the wafer and the wafer lifting device has no influence on whether the wafer is dried or not.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application. In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.

FIG. 1 is a schematic view of a related art cleaning apparatus;

fig. 2 is a schematic structural diagram of a wafer lifting device in a first supporting state according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of the wafer lift apparatus of FIG. 2 in a second support state;

FIG. 4 is a schematic structural view of a first support assembly according to an embodiment of the present disclosure;

FIG. 5 is a side view of the corresponding structure of FIG. 2;

FIG. 6 is a side view of the wafer lift apparatus of FIG. 3;

fig. 7 is an assembly schematic diagram of an interposer according to an embodiment of the present application;

FIG. 8 is a schematic view of a partial cross-sectional structure of the wafer lift apparatus of FIG. 6;

FIG. 9 is a partial schematic view of the wafer lift apparatus of FIG. 2 in a first support state;

FIG. 10 is a partial schematic view of the wafer lift apparatus of FIG. 3 in a second support state;

FIG. 11 is a schematic view of a cleaning apparatus according to an embodiment of the present application in a drying station;

FIG. 12 is a schematic view of a cleaning apparatus according to an embodiment of the present disclosure in a cleaning station;

FIG. 13 is a schematic view of a structure of a tank body according to an embodiment of the present disclosure;

fig. 14 is a schematic structural view of a first view of a cover according to an embodiment of the present disclosure;

fig. 15 is a schematic structural diagram of a second view angle of the cover according to the embodiment of the present application.

The realization, functional characteristics and advantages of the present application will be further described with reference to the embodiments, referring to the attached drawings. Specific embodiments thereof have been shown by way of example in the drawings and will herein be described in more detail. These drawings and the written description are not intended to limit the scope of the inventive concepts in any way, but to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the accompanying claims.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the element defined by the phrase "comprising one … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element, and furthermore, elements having the same name in different embodiments of the present application may have the same meaning or may have different meanings, a particular meaning of which is to be determined by its interpretation in this particular embodiment or by further combining the context of this particular embodiment.

It should be noted that, in the present application, the terms "at least one", "a plurality" may be one, two, three or more than three cases where schemes do not conflict.

It will be further understood that the terms "comprises," "comprising," "includes," and/or "including" specify the presence of stated features, steps, operations, elements, components, items, categories, and/or groups, but do not preclude the presence, presence or addition of one or more other features, steps, operations, elements, components, items, categories, and/or groups. The terms "or," "and/or," "including at least one of," and the like, as used herein, may be construed as inclusive, or meaning any one or any combination. For example, "including at least one of: A. b, C "means" any one of the following: a, A is as follows; b, a step of preparing a composite material; c, performing operation; a and B; a and C; b and C; a and B and C ", again as examples," A, B or C "or" A, B and/or C "means" any of the following: a, A is as follows; b, a step of preparing a composite material; c, performing operation; a and B; a and C; b and C; a and B and C). An exception to this definition will occur only when a combination of elements, functions, steps or operations are in some way inherently mutually exclusive.

It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope herein. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, depending on the context, unless the context indicates otherwise.

It should be appreciated that the terms "top," "bottom," "upper," "lower," "vertical," "horizontal," and the like are used for convenience in describing and simplifying the present application based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the apparatus in question must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present application.

For convenience of description, in the following embodiments, orthogonal spaces formed in horizontal and vertical directions are taken as examples, and this precondition should not be construed as limiting the present application.

Referring to fig. 1, fig. 1 is a schematic structural view of a related art cleaning apparatus, which includes a cleaning tank 10a and a wafer lifting device 20a, wherein the wafer lifting device 20a includes a support assembly 21a and a lifting mechanism 22a for controlling the lifting of the support assembly 21 a. The wafer is placed on the support assembly 21a in a standing manner, and the lifting mechanism 22a can control the support assembly 21a to sink into the cleaning solution to clean the wafer, and then control the support assembly 21a to rise above the liquid level of the cleaning solution so as to dry the wafer. In the figure, there are 3 contact points between the wafer and the supporting component 21a, and the number of contact points can be more than 6 according to different requirements of supporting stability. The contact points are difficult to dry completely and the more contact points, the higher the risk that the wafer will not dry completely. Based on the above, the application provides a wafer lifting device and cleaning equipment.

Referring to fig. 2 to fig. 4, fig. 2 is a schematic structural view of a wafer lifting device in a first supporting state, fig. 3 is a schematic structural view of the wafer lifting device in a second supporting state, and fig. 4 is a schematic structural view of a first supporting component according to an embodiment of the present disclosure. The wafer lifting device comprises a first support assembly 10, a second support assembly 20 and a lifting mechanism 30.

The first support assembly 10 is used for supporting the end surface of the wafer at least at two points so as to enable the wafer to stand aside. Theoretically, two supporting points (such as limiting grooves) can be used for supporting the wafer laterally. In order to improve the stability of supporting the wafer, the wafer may be supported at three or more points. Referring to fig. 4, the first support assembly 10 may include four parallel support members 11 (one of which is blocked), and a smooth saw-tooth structure is disposed on a top surface of each support member 11 along a length direction of the support member 11 to form a limit slot, so that the wafer can be supported at four points. As an example, a double-row saw tooth structure may be further provided on the top surface of one or more of the supporting pieces 11 to increase the number of supporting points. The specific structural form of the first support assembly 10 is not particularly limited in the embodiments of the present application.

The second support assembly 20 is used to support the wafer after being raised, and the second support assembly 20 is retracted from the first support assembly 10 when being raised to support the wafer. It is understood that the second support assembly 20 does not support the wafer when not lifted, and the second support assembly 20 can avoid the first support assembly 10 when supporting the wafer after lifting, i.e. the contact point between the second support assembly 20 and the wafer (hereinafter referred to as the second contact point) is different from the contact point between the first support assembly 10 and the wafer (hereinafter referred to as the first contact point). For example, the second support assembly 20 may support the wafer from a gap between two adjacent support members 11 of the first support assembly 10, and the second support assembly 20 may support the wafer from the outside of the first support assembly 10 at two or more points, so that the wafer may be supported from the first support assembly 10. That is, in this embodiment, the specific structural form of the second support member 20 is not limited in this embodiment.

The lifting mechanism 30 comprises a driving assembly 36, a connecting rod assembly 30A and a sliding assembly 30B which is respectively connected with the driving assembly 36 and the connecting rod assembly 30A, wherein the sliding assembly 30B is also respectively connected with the first supporting assembly 10 and the second supporting assembly 20, the driving assembly 36 drives the sliding assembly 30B to move, and the sliding assembly 30B is matched with the connecting rod assembly 30A to drive the first supporting assembly 10 to drive a wafer to rise from a first preset position to a second preset position; and after the wafer rises to the second preset position, driving the second supporting component 20 to drive the wafer to rise from the second preset position to the third preset position so as to separate the wafer from the first supporting component 10. That is, in the present embodiment, the driving component 36 is used as a driving source, the sliding component 30B is connected to the first supporting component 10 and the second supporting component 20, respectively, the link component 30A is used as a linkage mechanism, and when the driving component 36 drives the sliding component 30B to move, the sliding component 30B controls the movement of the first supporting component 10 and the second supporting component 20, respectively, through the linkage mechanism.

The operation principle of the wafer lift apparatus of the present embodiment is described with reference to the application scenario of the cleaning apparatus shown in fig. 1 and the states of the wafer lift apparatus of fig. 2 and 3. When the wafer is at the first preset position, the wafer may be in a cleaning stage, the whole wafer is immersed in the cleaning solution, and after the cleaning is completed, the driving component 36 drives the sliding component 30B to move, and the sliding component 30B cooperates with the connecting rod component 30A to drive the first supporting component 10 to drive the wafer to rise from the first preset position to the second preset position, so that the wafer is separated from the cleaning solution and is dried at the same time. As shown in fig. 2, the wafer is supported on the first support assembly 10 before being raised to the second predetermined position. It should be noted that, in the process that the wafer rises from the first preset position to the second preset position, the cleaning solution in the cleaning tank can be discharged at the same time, so that the wafer can be separated from the cleaning solution more quickly, and the height of the second preset position is reduced. After the preliminary drying, the first contact point of the wafer may not be completely dried, and other portions may be dried. Then, the driving assembly 36 drives the sliding assembly 30B to move continuously, the sliding assembly 30B cooperates with the connecting rod assembly 30A to drive the second supporting assembly 20 to drive the wafer to rise from the second preset position to the third preset position, so that the wafer is separated from the first supporting assembly 10, as shown in fig. 3, and is supported on the second supporting assembly 20, so that the first contact point is exposed, and further drying can be performed on the first contact point, while the second supporting assembly 20 is supported on the second contact point of the wafer, and drying is completed in advance.

In the wafer lifting device of the present embodiment, during the drying process, the lifting mechanism 30 is used to control the first support assembly 10 to drive the wafer to lift up to finish the drying of the portion outside the first contact point, and then control the second support assembly 20 to drive the wafer to lift up continuously and separate from the support of the first support assembly 10, and the support of the wafer lifting device to the wafer is switched from the first contact point to the second contact point, so as to finish the drying of the first contact point. Therefore, the wafer lifting device of the embodiment can completely dry the wafer, and the number of the contact points of the wafer and the wafer lifting device has no influence on whether the wafer is dried or not.

Preferably, the sliding assembly 30B cooperates with the link assembly 30A to drive the first support assembly 10 to lift the wafer from the first preset position to the second preset position, and further drive the second support assembly 20 to lift synchronously with the first support assembly 10. For example, the second support assembly 20 and the first support assembly 10 are driven to rise above the liquid level of the cleaning liquid synchronously, so that the second support assembly 20 can be dried at the first time, and the second contact point of the wafer is prevented from being rewetted due to the fact that the second support assembly 20 is not completely dried.

In one embodiment, the present application provides an embodiment of a lifting mechanism, please refer to fig. 2, 3 and 5, and fig. 5 is a side view of the corresponding structure in fig. 2. In the present lifting mechanism 30, the sliding assembly 30B may include a fixed plate 31, a first slider 32, and a second slider 33, and the link assembly 30A may include a first link 34 and a second link 35.

The fixing plate 31 includes a first side 311 and a second side 312 disposed opposite to each other, and a third side 313 connecting the first side 311 and the second side 312, the first side 311 being provided with a first guide structure 314; the first slider 32 and the second slider 33 are connected to the first guide structure 314 so as to be slidable up and down, and the second slider 33 is disposed above the first slider 32. The first slider 32 is connected with the first support assembly 10 for driving the first support assembly 10 to perform lifting movement, and the second slider 33 is connected with the second support assembly 20 for driving the second support assembly 20 to perform lifting movement. The second side 312 is also provided with a second guiding structure 37.

One end of the first link 34 is hinged with the first slider 32, one end of the second link 35 is hinged with the second slider 33, the other end is hinged with the other end of the first link 34 through a hinge 351, and the hinge 351 is slidably engaged with the second guide structure 37.

The driving assembly 36 drives the second slider 33 to slide up and down along the first guiding structure 314; the hinge 351 moves along the second guide structure 37 under the driving of the second slider 33, and the first slider 32 slides up and down along the first guide structure 314 under the driving of the hinge 351

In this embodiment, the driving component 36 directly drives the second slider 33 to slide up and down along the first guiding structure 314, so as to control the lifting movement of the second supporting component 20 connected with the second slider 33; the second slider 33 drives the first support assembly 10 to move up and down through a linkage mechanism consisting of the first connecting rod 34, the second connecting rod 35, the hinge member 351 and the second guide structure 37 during movement. The lifting movement of the two components of the first support component 10 and the second support component 20 can be controlled by a driving source and a linkage mechanism. Compared with a structure in which the first support assembly 10 and the second support assembly 20 are driven to move up and down by two driving sources, the present embodiment not only saves cost, but also has a simpler control system.

In one embodiment, the second guide structure 37 may include a vertical guide 3721 and an arc-shaped guide 3722 connected to a top end of the vertical guide 3721, and the hinge 351 is engaged with the vertical guide 3721 when the second slider 33 is stacked on the top surface of the first slider 32. The hinge member 351 moves linearly along the vertical guide portion 3721 and moves in an arc along the arc-shaped guide portion 3722 under the driving of the second sliding block 33, wherein the bottom end of the hinge member 351 located at the vertical guide portion 3721 corresponds to the wafer being located at the first preset position, the top end of the hinge member 351 located at the vertical guide portion 3721 corresponds to the wafer being located at the second preset position, and the end of the hinge member 351 located at the arc-shaped guide portion 3722 away from the vertical guide portion 3721 corresponds to the wafer being located at the third preset position. Preferably, rolling friction is provided between the hinge 351 and the second guide structure 37, i.e. the hinge 351 may roll along the second guide structure 37, for example, a roller may be sleeved outside the hinge 351. It will be appreciated that the second slider 33, when moving up and down, may drive the first slider 32 to move correspondingly through the transmission of the first link 34, the hinge 351 and the second link 35.

The operating principle of the lifting mechanism of the embodiment is as follows: when the second slider 33 is stacked on the top surface of the first slider 32, three hinge points on the first link 34 and the second link 35 form a stable triangle, and the hinge 351, the first link 34, the second link 35, the first slider 32 and the second slider 33 do not move relatively, and the integral member formed by the five structural members can move up and down under the constraint of the vertical guide 3721 and the first guide structure 314, see fig. 2. When the integral member rises to the top of the vertical guide 3721 and enters the arc guide 3722, that is, the first support assembly 10 and the second support assembly 20 rise synchronously, and the first support assembly 10 lifts the wafer to the second preset position, as the second slider 33 continues to rise straight, the hinge 351 drives the first slider 32 to rise along the arc guide 3722, but the rising speed is smaller than that of the second slider 33, so that the second slider 33 can drive the second support assembly 20 to rise quickly and lift the wafer from the first support assembly 10, and referring to fig. 3 and 6, fig. 6 is a side view of the wafer lifting device of fig. 3.

As a preferred embodiment, the arcuate guide 3722 is arcuate and the radius of the arcuate guide 3722 is equal to the distance between the two hinge positions on the first link 34.

In this embodiment, the driving component 36 drives the second slider 33 to slide up and down along the first guiding structure 314; the hinge 351 moves linearly along the vertical guide 3721 of the second guide structure 37 and moves circularly along the arc-shaped guide 3722 under the driving of the second slider 33. When the integral member formed by the five structural members rises to the top end of the vertical guiding portion 3721 and enters the arc guiding portion 3722, that is, the first supporting assembly 10 and the second supporting assembly 20 rise synchronously, and the first supporting assembly 10 lifts the wafer to the second preset position, when the radius of the arc guiding portion 3722 is equal to the distance between the two hinged positions on the first connecting rod 34 and the second sliding block 33 continues to rise, the hinged member 351 moves circularly around the hinged point on the first sliding block 32 as the center of a circle, so that the first sliding block 32 remains stationary and does not drive the first supporting assembly 10 to rise continuously. The second supporting component 20 is driven by the second sliding block 33 to further lift the wafer to a third preset position, so that the wafer is separated from the first supporting component 10. In this embodiment, the first support assembly 10 stops lifting when the hinge 351 starts to enter the arc guide 3722, and the second support assembly 20 can lift the wafer from the first support assembly 10 in the shortest time, so that the efficiency is higher.

Preferably, referring to fig. 2 and 5, a first blocking structure 3723 may be provided at an end of the arc-shaped guide 3722 remote from the vertical guide 3721 for preventing the hinge 351 from sliding off the arc-shaped guide 3722. In other embodiments, referring to fig. 2, 3 and 6, a second blocking structure 315 may be disposed on the first side 311 of the fixing plate 31 near the top end of the first guiding structure 314, so as to block the second slider 33 from moving upwards when the wafer rises to the third predetermined position. It will be appreciated that the first blocking structure 3723 and the second blocking structure 315 may be provided at the same time, or only one of them may be provided.

It should be noted that, in the foregoing embodiment of the present application, the second guiding structure 372 may be a groove structure disposed on the second side 312, for example, the groove structure may include a vertical portion and an arc portion, and may be capable of guiding the hinge 351 in a corresponding linear motion and an arc motion, and the specific structural form of the second guiding structure 372 is not limited in particular to the embodiment of the present application.

As an example of a second guiding structure, please continue to refer to fig. 5, 6 and 7, fig. 7 is an assembly schematic diagram of an adapter plate provided in the embodiment of the present application, the second side 312 of the fixing plate 31 is provided with the adapter plate 37, the adapter plate 37 includes a front side 371 facing the second slider 33, and a rear side 372 opposite to the front side 371, the rear side 372 includes a vertical surface and an arc surface connected to a top edge of the vertical surface, the vertical surface forms a vertical guiding portion 3721, and the arc surface forms an arc guiding portion 3722. Compared with the second guide structure 372 directly arranged on the second side 312 of the fixing plate 31, the second guide structure 372 is arranged on the adapter plate 37 in this embodiment, so that the processing difficulty of the fixing plate 31 can be reduced, and meanwhile, when the second guide structure 372 is worn, the adapter plate 37 can be replaced. It will be appreciated that the hinge 351 can move circumferentially along the arcuate guide 3722 by providing the arcuate surface as a standard circular arc.

In one embodiment, referring to fig. 3, 6 and 8, fig. 8 is a schematic partial cross-sectional view of the wafer lift apparatus of fig. 6, and the driving assembly 36 includes a screw 361 and a driving portion 362. The screw 361 is connected to the first side 311 of the fixed plate 31 by a screw nut, the first slider 32 is vertically slidably sleeved on the outside of the screw 361, the second slider 33 is screwed to the screw 361, and the driving part 362 drives the screw 361 to rotate forward or backward, so that the second slider 33 can be controlled to move up and down. The driving part 362 may be a separate driving motor, and directly outputs a rotational force to the screw 361. As an example, the driving part 362 may include a servo motor 3621, a driving wheel 3622, a driving belt 3633, and a driven wheel 3634, the driving wheel 3622 is connected to an output shaft of the servo motor 3621 and is connected to the driven wheel 3634 through the driving belt 3633, the driven wheel 3634 is connected to the screw 361, and the servo motor 3621 controls rotation of the screw 361 through belt transmission.

In one embodiment, referring still to fig. 2 and 3, the lift mechanism 30 may further include a first connection assembly 38 and a second connection assembly 39. The first connecting assembly 38 includes a first load member 381 and two first connecting rods 382 disposed at intervals, the first load member 381 is connected to the first slider 32, one end of the first connecting rod 382 is connected to the first load member 381, and the other end is connected to the first supporting assembly 10. The second connection assembly 39 includes a second load part 391 and a second connection rod 392, the second load part 391 is connected to the second slider 33, the second connection rod 392 is disposed between the two first connection rods 382, and one end of the second connection rod 392 is connected to the second load part 391 and the other end is connected to the second support assembly 20. In this embodiment, the first support assembly 10 supports the wafer from the outside of the second support assembly 20, so that the second support assembly 20 can avoid the first support assembly 10 after ascending.

In an embodiment, referring to fig. 9 and 10, fig. 9 is a schematic partial structure of a wafer lift apparatus in a first supporting state according to an embodiment of the present application, and fig. 10 is a schematic partial structure of the wafer lift apparatus in a second supporting state according to fig. 9. In the wafer lifting device, the second supporting component 20 comprises a supporting plate 21 and a single-row of limiting teeth 22 arranged on the top surface of the supporting plate 21, and tooth grooves are formed between two adjacent limiting teeth 22 and are used for carrying out single-point supporting on a wafer. The wafer lifting device further comprises two third guiding structures (not shown in the figure) which are oppositely arranged, wherein the third guiding structures are arranged above the first supporting component 10 and are used for guiding from two opposite end surfaces of the wafer in the process that the second supporting component 20 drives the wafer to rise from the second preset position to the third preset position. For example, the third guide structure may be two guide plates disposed opposite to each other, and the guide plates may be provided with grooves extending longitudinally. The two guide plates support two opposite end faces of the wafer on one hand and play a role in guiding during the lifting process of the wafer on the other hand.

It should be noted that, when the wafer rises to the second preset position and enters the third guiding structure, the surface is substantially dried except the contact point, so that the third guiding structure does not affect the drying of the wafer. In the wafer lifting device of the present embodiment, the second support assembly 20 has only one contact point with the wafer, so that the number of contact points between the wafer and the wafer lifting device can be reduced, and the risk of incomplete drying is reduced.

Referring to fig. 11, fig. 11 is a schematic structural diagram of a cleaning apparatus at a drying station according to an embodiment of the present application, where the cleaning apparatus includes a cleaning tank 50 and a wafer lifting device according to each embodiment, the cleaning tank 50 is used for containing cleaning solution, the wafer lifting device is disposed in the cleaning tank 50 and can clean the wafer, and when the wafer rises to a second preset position, the wafer is located above a liquid level of the cleaning solution. As an example, the cleaning tank 50 may be provided with a drain hole through which the cleaning liquid in the cleaning tank is discharged when the wafer is lifted to the second preset position so that the liquid level of the cleaning liquid may be lowered below the second preset position.

When the cleaning device of the present embodiment cleans a wafer, referring to fig. 12, fig. 12 is a schematic structural diagram of a cleaning station of the cleaning device provided in the present embodiment, the wafer is at a first preset position during cleaning, the wafer is supported on the first support assembly 10, the wafer can be dried simultaneously during the process of lifting up to a second preset position after cleaning, and the wafer is lifted up to a third preset position from the second preset position, as shown in fig. 11, the second support assembly 20 drives the wafer to lift up, the position of the contact point on the wafer is changed from the first contact point to the second contact point, and the wafer can be further dried after the first contact point is exposed.

Preferably, the lifting mechanism 30 drives the second support assembly 20 to rise above the liquid level of the cleaning solution synchronously when driving the first support assembly 10 to drive the wafer to rise from the first preset position to the second preset position. The second support assembly 20 may be dried in advance to reduce the risk of the second contact point of the wafer being wetted while the wafer is supported by the second support assembly 20.

In an embodiment, referring to fig. 13-14, fig. 13 is a schematic structural diagram of a slot body provided in the embodiment of the present application, fig. 14 is a schematic structural diagram of a first view of a cover provided in the embodiment of the present application, and fig. 15 is a schematic structural diagram of a second view of the cover provided in the embodiment of the present application, where the second support assembly 20 includes only a single row of limiting teeth 22, and the second support assembly 20 has only one contact point with a wafer. The cleaning tank 50 includes a tank body 51, a cover 52, and a drying device. The tank body 51 is used for containing cleaning solution, the cover 52 is covered on the tank body 51, and the drying device is arranged on the inner side surface of the cover 52 and is used for drying the wafer when the first supporting component 10 drives the wafer to rise from the first preset position to the second preset position and the second supporting component 20 drives the wafer to rise from the second preset position to the third preset position.

As an example, the cover 52 may include a first side plate 521, a second side plate 522, and a third side plate 523 connected in sequence, and a top cover 524 covering the first side plate 521, the second side plate 522, and the third side plate 523, a surface of the cover 52 opposite to the second side plate 522 is an opening 525, and the elevating mechanism 30 is disposed at one side of the opening 525. The two third guide structures 40 are respectively disposed on the inner side surface of the first side plate 521 and the inner side surface of the third side plate 523, the third guide structure 40 includes a plurality of protruding strips 41 extending along the vertical direction, guide grooves are formed between two adjacent protruding strips 41, and the guide grooves on the first side plate 521 and the guide grooves on the third side plate 523 are in one-to-one correspondence. Preferably, the raised strip 41 includes at least two sections of sub raised strips 411 arranged at intervals along the vertical direction, so that the overlong guide slot can be avoided, and the unsmooth air circulation in the guide slot can be prevented from being affected with damp.

In one embodiment, referring to fig. 15, the drying apparatus may include a spraying unit 60, where the spraying unit 60 is disposed on an inner side surface of the cover 52, and is used for spraying volatile organic solvent (such as IPA) onto the wafer when the first support assembly 10 drives the wafer to move from the first preset position to the second preset position, and is used for blowing inert gas (such as nitrogen) onto the wafer when the second support assembly 20 drives the wafer to move from the second preset position to the third preset position; wherein the second preset position is located above the liquid level of the cleaning liquid. For example, the spraying unit 60 may be provided at an inner side surface of at least one of the first side plate 521, the third side plate 523, and the top cover 524. The spraying unit 60 may be a spraying pipe, and a plurality of uniformly distributed spraying holes are formed in the pipe wall, so that volatile organic solvents or inert gases can be sprayed out of the spraying holes to dry the wafer.

The process of cleaning and drying the wafer by the cleaning device in this embodiment is as follows: referring to fig. 12, a wafer is supported on the first support assembly 10, at least four first contact points are provided between the wafer and the first support assembly 10, and IPA solution can be sprayed to the wafer simultaneously during the process of lifting the wafer from the first preset position to the second preset position after the wafer cleaning is completed, so that the surface of the wafer is dehydrated by the marangoni effect. In the process of raising the wafer from the second preset position to the third preset position, as shown in fig. 11, nitrogen gas may be blown to the wafer, and the wafer is supported on the second support component 20 in the process, and only one second contact point is formed between the wafer and the second support component 20, so that the risk of incomplete drying of the wafer can be greatly reduced. Therefore, the cleaning apparatus of the present embodiment can dry the wafer completely.

The foregoing has described in detail a wafer lifting device and cleaning apparatus provided herein, and specific examples have been provided herein to illustrate the principles and embodiments of the present application. In this application, the descriptions of the embodiments are focused on, and the details or descriptions of one embodiment may be referred to as related descriptions of other embodiments.

The technical features of the technical solutions of the present application may be arbitrarily combined, and for brevity of description, all possible combinations of the technical features in the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the present application.

The foregoing description is only of the preferred embodiments of the present application, and is not intended to limit the scope of the claims, and all equivalent structures or equivalent processes using the descriptions and drawings of the present application, or direct or indirect application in other related technical fields are included in the scope of the claims of the present application.

Claims

1. A wafer lift apparatus, comprising:

2. The wafer lift apparatus of claim 1, wherein the slide assembly is configured to cooperate with the link assembly to drive the second support assembly to move synchronously with the first support assembly when the first support assembly is driven to move the wafer from the first predetermined position to the second predetermined position.

3. The wafer lift apparatus of claim 2, wherein the slide assembly comprises:

The connecting rod assembly includes:

one end of the first connecting rod is hinged with the first sliding block;

4. The wafer lift apparatus of claim 3, wherein the second guide structure comprises a vertical guide portion and an arc-shaped guide portion connected to a top end of the vertical guide portion, the hinge being engaged with the vertical guide portion when the second slider is stacked on a top surface of the first slider;

5. The wafer lift apparatus of claim 4, wherein an end of the arcuate guide portion remote from the vertical guide portion is provided with a first blocking structure for preventing the hinge from slipping off the arcuate guide portion; and/or the number of the groups of groups,

6. The wafer lift apparatus of claim 4, wherein the second side is provided with an adapter plate, the adapter plate including a front side facing the second slider and a rear side opposite the front side;

7. The wafer lift apparatus of claim 4, wherein the arcuate guide is arcuate and has a radius equal to a distance between two hinge locations on the first link.

8. The wafer lift apparatus of claim 4, wherein the drive assembly comprises:

9. The wafer lift apparatus of claim 4, wherein the lift mechanism further comprises:

10. The wafer lift apparatus of any one of claims 1 to 9, wherein the second support assembly includes a support plate, and a single row of spacing teeth disposed on a top surface of the support plate, and a tooth slot is formed between two adjacent spacing teeth for single-point supporting the wafer;

11. A cleaning apparatus comprising a cleaning tank for holding a cleaning liquid, and the wafer lifting device according to any one of claims 1 to 10;

12. The cleaning apparatus of claim 11, wherein the cleaning tank comprises:

the groove body is used for containing the cleaning liquid;

the cover body is covered on the groove body;

13. The cleaning apparatus of claim 12, wherein the cover comprises a first side plate, a second side plate, and a third side plate connected in sequence, and a top cover covering the first side plate, the second side plate, and the third side plate, and a side of the cover opposite to the second side plate is open;

the lifting mechanism is arranged at one side of the opening;

14. The cleaning apparatus defined in claim 13, wherein the ribs comprise at least two sections of sub-ribs spaced apart in the vertical direction.

15. The cleaning apparatus of claim 12, wherein the drying device comprises:

16. The cleaning apparatus defined in any one of claims 11-15, wherein the lifting mechanism is configured to simultaneously drive the second support assembly to rise above the surface of the cleaning liquid when the first support assembly is driven to raise the wafer from the first predetermined position to the second predetermined position.