CN116169074A - Manufacturing method and manufacturing equipment of electronic component - Google Patents
Manufacturing method and manufacturing equipment of electronic component Download PDFInfo
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- CN116169074A CN116169074A CN202310163924.2A CN202310163924A CN116169074A CN 116169074 A CN116169074 A CN 116169074A CN 202310163924 A CN202310163924 A CN 202310163924A CN 116169074 A CN116169074 A CN 116169074A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims description 18
- 239000000084 colloidal system Substances 0.000 claims description 17
- 238000001746 injection moulding Methods 0.000 claims description 16
- 230000033001 locomotion Effects 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims 4
- 238000009434 installation Methods 0.000 claims 3
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 4
- 238000005457 optimization Methods 0.000 description 8
- 238000013459 approach Methods 0.000 description 7
- 240000007643 Phytolacca americana Species 0.000 description 3
- 235000009074 Phytolacca americana Nutrition 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to a method and apparatus for manufacturing an electronic component. The manufacturing method and the manufacturing equipment of the electronic component comprise a plurality of bearing structures, supporting seats, a shell, pins and a plurality of supporting frames, wherein the bearing structures are distributed on two sides of the supporting seats, the supporting seats are provided with the shell, the two sides of the shell are provided with sockets for inserting pins, and the bearing structures are rotationally connected with the frames; the bearing structure comprises a bearing column; according to the manufacturing method and the manufacturing equipment of the electronic component, the arranged driving structure is matched with the first reciprocating structure when conveying and adjusting the direction of the pins, the pins with the adjusted positions are pushed to move towards the shell and are inserted into the small openings formed in the shell, the arrangement of the driving part is reduced, the production efficiency is improved by reducing the operation steps, the arranged driving structure can be matched with the second reciprocating structure, and automatic feeding is realized during packaging operation.
Description
Technical Field
The invention belongs to the technical field of manufacturing of electronic components, and particularly relates to a manufacturing method and manufacturing equipment of electronic components.
Background
The packaging refers to the connection of other devices by connecting circuit pins on a silicon chip to external joints through wires, and the packaging mode refers to a shell for mounting a semiconductor integrated circuit chip, because the chip must be isolated from the outside to prevent the corrosion of impurities in the air to the chip circuit from causing the electric performance to be reduced, and the packaged chip is more convenient to mount and transport.
The industry mainly utilizes dedicated equipment to encapsulate, improves efficiency when reducing the cost of labor, and when current encapsulation equipment used, can not be in the pin transportation, insert the pin into the shell of waiting to encapsulate, need multiple equipment cooperation to use, and efficiency is lower, and the use cost of equipment is great.
Disclosure of Invention
The invention aims to solve the problems and provide a manufacturing method and manufacturing equipment of an electronic component with simple structure and reasonable design.
The invention realizes the above purpose through the following technical scheme:
a manufacturing method of an electronic component comprises the following steps:
step S1: placing the shell on a conveyor belt in the manufacturing equipment, and conveying the shell below the packaging structure by the conveyor belt;
step S2: the packaging structure is used for placing the electronic components to be packaged into the shell;
step S3: the driving structure drives the bearing block carrying the pins to rotate to the position of the same horizontal plane as the supporting seat;
step S4: the driving structure drives the first reciprocating structure to move, the first reciprocating structure pushes the bearing block to insert pins into pin sockets formed in the shell, and the driving structure stops moving after the pins are inserted into the sockets;
step S5: the packaging structure injects packaging colloid into the shell;
step S6: after the packaging colloid is solidified, the driving structure continues to act, the first reciprocating structure is driven to restore to the original position, and the bearing block restores to the original position under the pulling of the reset spring;
step S7: the conveying belt rotates to remove the packaged electronic components and the shell, the next shell to be packaged is conveyed to the lower part of the packaging structure, and meanwhile, the driving structure drives the next bearing block with pins to rotate to the position of the same horizontal plane as the supporting seat, so that preparation is made for packaging again;
step S8: repeating the steps S4 to S7 until the encapsulation of all the electronic components and the shell is finished.
The manufacturing equipment used in the manufacturing method of the electronic component comprises a plurality of bearing structures, supporting seats, a shell, pins and a plurality of supporting frame bodies, wherein the bearing structures are distributed on two sides of the supporting seats, the supporting seats are provided with the shell, two sides of the shell are provided with sockets for inserting the pins, and the bearing structures are rotationally connected with the frame bodies; the bearing structure comprises a bearing column, the side face of the bearing column is connected with a plurality of telescopic rods, one ends of the telescopic rods are connected with bearing blocks, grooves for placing pins are formed in the bearing blocks, reset springs are sleeved on the telescopic rods, and two ends of the reset springs are connected with the bearing structure and the bearing blocks respectively; the bearing structure is provided with a driving structure and a first reciprocating structure, the driving structure drives the bearing column to rotate and simultaneously drives the first reciprocating structure to reciprocate, and when the first reciprocating structure reciprocates, the first reciprocating structure drives the bearing block to insert pins into the socket of the shell, and then drives the bearing block to reset to an initial position.
As a further optimization scheme of the invention, the driving structure comprises a driving shaft penetrating through the bearing column, a first gear sleeved on the driving shaft, a second gear matched with the first gear and a limiting shaft used for limiting the second gear, the limiting shaft is rotationally connected with the supporting frame body, one end of the bearing column is connected with a grooved pulley, the second gear is coaxially connected with a first toggle rod used for driving the grooved pulley to rotate, a through hole for the driving shaft to pass through is formed in the middle of the grooved pulley, and the end of the driving shaft is in transmission connection with the first motor.
As a further optimization scheme of the invention, the first reciprocating structure comprises a first U-shaped block, a first limiting rod fixed at the opening of the first U-shaped block, and a plurality of first push rods fixed at one ends of the first U-shaped block far away from the first limiting rod, wherein a second toggle rod is connected to the driving shaft, one ends of the second toggle rods are connected with first long rods, second through grooves are formed in the first limiting rod in a penetrating mode, the first long rods are located in the first through grooves, a plurality of first mounting rods used for limiting the moving direction of the first U-shaped block are fixed on the first U-shaped block, T-shaped blocks are fixedly connected to the bearing block, when the driving shaft drives the second toggle rod to do circular motion, the second toggle rod drives the first limiting rod, the first U-shaped block and the first push rods to do reciprocating motion along the horizontal direction of the height of the first mounting rods, when the first push rods do reciprocating motion, the corresponding T-shaped block and the bearing block are pushed to move in the same direction and the same distance, pins on the bearing block are inserted into the first push rods to the initial positions of the bearing blocks, and then the first push rods are reset to the initial positions.
As a further optimization scheme of the invention, a second reciprocating structure is arranged on the first reciprocating structure, a material conveying structure is arranged on one side, far away from the supporting seat, of the bearing structure, a plurality of pins are inserted into the material conveying structure, and the material conveying structure is used for conveying pins to the bearing block; the second reciprocating structure comprises a second U-shaped block, a plurality of second mounting rods, a second push rod and a second limiting rod; the second limiting rod is connected with the opening part of the second U-shaped block, the second push rod is fixedly connected with one end of the second U-shaped block, which is close to the material conveying structure, a third poking rod which is reversely arranged with the second poking rod is connected to the driving shaft, one end of the third poking rod is connected with a second long rod, a second through groove is formed in the second limiting rod in a penetrating mode, the second long rod is located in the second through groove, the second U-shaped block is in sliding connection with the supporting frame body through a second mounting rod, the first mounting rod is in sliding connection with the second U-shaped block, when the driving shaft drives the third poking rod to move circularly, the third poking rod drives the second limiting rod, the second U-shaped block and the second push rod to reciprocate along the moving direction limited by the second mounting rod, and when the second push rod reciprocates, the corresponding T-shaped block and the bearing block move in the same direction and at the same distance, pins on the material conveying structure are inserted into grooves on the bearing block, and then the second push rod resets to the initial position.
As a further optimization scheme of the invention, the material conveying structure comprises a belt body for conveying pins, an inserting groove, a first cavity, a second cavity, a connecting channel, a first piston arranged in the first cavity and a second piston arranged in the second cavity, wherein the first cavity and the second cavity are mutually communicated through the connecting channel, pins are inserted in the inserting groove, a piston rod is connected onto the first piston, one end of the piston rod penetrates through the belt body to extend outwards, and when the piston rod pushes the first piston to slide towards the connecting channel, the second piston pushes the pins out of the inserting groove.
As a further optimization scheme of the invention, the rear side of the bearing column is connected with a limiting disc, the limiting disc is coaxially arranged with the driving shaft, and the limiting disc is rotatably connected with the supporting frame body.
As a further optimization scheme of the invention, a packaging structure is arranged above the shell, the packaging structure comprises a second motor connected with the support frame, an output shaft of the second motor is connected with a mounting plate, a plurality of electric push rods are fixed on the lower end face of the mounting plate, the output ends of the electric push rods are respectively connected with an injection molding head for filling packaging colloid or sucking discs for grabbing electronic components, the electric push rods corresponding to the sucking discs drive the sucking discs to suck the electronic components and place the electronic components into the shell, and the injection molding head is driven by the corresponding electric push rods to move towards the shell where the electronic components are placed and inject the packaging colloid into the shell.
As a further optimization scheme of the invention, the bearing block is provided with a clamping part for clamping pins and a sealing part for covering the upper part of the shell, and the sealing part is provided with a semicircular groove matched with the injection molding head.
As a further optimization scheme of the invention, the supporting seat is a conveying belt, and supporting tables for supporting the shell are arranged on the surface of the conveying belt at equal intervals.
The invention has the beneficial effects that: the driving structure is matched with the first reciprocating structure while conveying and adjusting the direction of the pins, pushes the pins with the adjusted positions to move towards the shell, and is inserted into small openings formed in the shell, so that the driving piece is reduced; meanwhile, the driving structure can be matched with the second reciprocating structure, automatic feeding is achieved during packaging operation, labor cost input is reduced, feeding time is shortened, and input of feeding equipment is reduced.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a partial structure of the present invention;
FIG. 3 is a mating view of the carrier block and housing of the present invention;
FIG. 4 is a schematic diagram of a driving structure according to the present invention;
FIG. 5 is a schematic view of a first reciprocating structure in the present invention;
FIG. 6 is a mating view of a feed structure and carrier block of the present invention;
FIG. 7 is a mating view of a first reciprocating structure and a second reciprocating structure in the present invention;
FIG. 8 is a schematic structural view of a second reciprocating structure of the present invention;
fig. 9 is a schematic structural view of a feeding structure according to the present invention.
In the figure: 1. a load bearing structure; 11. a load-bearing column; 111. a limiting disc; 12. a telescopic rod; 13. a bearing block; 131. a groove; 14. a return spring; 15. a T-shaped block; 16. a sheave; 2. a driving structure; 21. a drive shaft; 22. a first gear; 23. a second gear; 24. a limiting shaft; 25. a first toggle rod; 26. the second toggle rod; 27. a third toggle rod; 3. a support base; 4. a housing; 41. an electronic component; 5. a package structure; 51. a mounting plate; 52. a second motor; 53. an electric push rod; 54. an injection molding head; 55. a suction cup; 6. a first reciprocating structure; 61. a first U-shaped block; 611. a first mounting bar; 612. a first push rod; 62. a first stop lever; 7. pins; 8. a second reciprocating structure; 81. a second U-shaped block; 811. a second mounting bar; 812. a second push rod; 82. a second limit rod; 9. a material conveying structure; 91. a first cavity; 92. a second cavity; 93. a connection channel; 94. a plug-in groove; 95. a first piston; 96. a second piston; 97. a piston rod; 98. a belt body.
Detailed Description
The following detailed description of the present application is provided in conjunction with the accompanying drawings, and it is to be understood that the following detailed description is merely illustrative of the application and is not to be construed as limiting the scope of the application, since numerous insubstantial modifications and adaptations of the application will be to those skilled in the art in light of the foregoing disclosure.
As shown in fig. 1 to 9, a method for manufacturing an electronic component includes the steps of:
step S1: placing the housing 4 on a conveyor belt in the manufacturing apparatus, the conveyor belt conveying the housing 4 under the encapsulation structure 5;
step S2: the package structure 5 places the electronic component 41 to be packaged inside the case 4;
step S3: the driving structure 2 drives the bearing block 13 carrying the pins 7 to rotate to the position of the same horizontal plane as the supporting seat 3;
step S4: the driving structure 2 drives the first reciprocating structure 6 to move, the first reciprocating structure 6 pushes the bearing block 13 to insert the pins 7 into sockets formed in the shell 4, and the driving structure 2 stops moving after the pins are inserted into the sockets;
step S5: the packaging structure 5 injects packaging colloid into the shell 4;
step S6: after the encapsulation colloid is solidified, the driving structure 2 continues to act, the first reciprocating structure 6 is driven to restore to the original position, and the bearing block 13 is reset under the pulling of the reset spring 14;
step S7: the conveyer belt rotates to remove the packaged electronic components 41 and the shell 4, and conveys the next shell 4 to be packaged to the lower part of the packaging structure 5, and meanwhile, the driving structure 2 drives the next bearing block 13 with pins to rotate to the position with the same horizontal plane as the supporting seat 3, so as to prepare for packaging again;
step S8: the above steps S4 to S7 are repeated until the encapsulation of all the electronic components 41 and the case 4 is completed.
The driving structure 2 is matched with the first reciprocating structure 6 when conveying and adjusting the direction of the pins 7, pushes the pins 7 with the positions adjusted to the shell 4 and is inserted into small openings formed in the shell 4, so that the setting of driving parts is reduced, and meanwhile, the production efficiency is improved.
The manufacturing equipment used in the manufacturing method comprises a plurality of bearing structures 1, supporting seats 3, a shell 4, pins 7 and a plurality of supporting frame bodies, wherein the bearing structures 1 are distributed on two sides of the supporting seats 3, the supporting seats 3 are provided with the shell 4, two sides of the shell 4 are provided with sockets for inserting the pins 7, and the bearing structures 1 are rotationally connected with the supporting frame bodies; the bearing structure 1 comprises a bearing column 11, a plurality of telescopic rods 12 are connected to the side face of the bearing column 11, bearing blocks 13 are connected to one ends of the telescopic rods 12, grooves 131 for placing pins 7 are formed in the bearing blocks 13, return springs 14 are sleeved on the telescopic rods 12, and two ends of the return springs 14 are connected with the bearing structure 1 and the bearing blocks 13 respectively; the bearing structure 1 is provided with a driving structure 2 and a first reciprocating structure 6, the driving structure 2 drives the bearing column 11 to rotate and simultaneously drives the first reciprocating structure 6 to reciprocate, when the first reciprocating structure 6 reciprocates, the lead pins 7 are inserted into the sockets of the shell 4 by the driving bearing blocks 13, and then the driving bearing blocks 13 are reset to the initial positions.
It should be noted that, the number of sockets for the socket pins 7 formed on the housing 4 is equal to the number of grooves 131 formed on the carrier block 13; when the packaging process is performed, firstly, the shell 4 is required to be placed on the supporting seat 3, then the electronic component 41 required to be packaged is placed in the shell 4, the electronic component 41 is matched with the inner wall of the bottom of the shell 4, then the driving structure 2 drives the bearing structure 1 to rotate and drives the first reciprocating structure 6 to act, and after the bearing structure 1 rotates to rotate the bearing block 13 carrying the pins 7 to a packaging position, the operation is temporarily stopped (the packaging position refers to the position of the bearing block 13 opposite to the shell 4 on the supporting seat 3);
when the first reciprocating structure 6 acts, the first reciprocating structure gradually approaches to the bearing block 13 regulated by the bearing structure 1, and pushes the bearing block 13 to approach to the shell 4 until the pins 7 on the bearing block 13 are inserted into the sockets formed on the shell 4, at the moment, the driving structure 2 stops acting, and the packaging colloid is injected into the shell 4;
after the encapsulation colloid is solidified, the driving structure 2 acts again, the driving structure 2 drives the first reciprocating structure 6 to reset firstly, in the process, the reset spring 14 pulls the bearing block 13 to cling to the first reciprocating structure 6, and when the first reciprocating structure 6 is separated from the corresponding bearing block 13, the driving structure 2 drives the bearing structure 1 to rotate again, so that the position of the bearing block 13 is adjusted;
the driving structure 2 drives the bearing structure 1 to rotate, meanwhile, the driving structure 2 drives the first reciprocating structure 6 to move, the use of a driving device is reduced, and before the first reciprocating structure 6 contacts the bearing block 13, the bearing structure 1 can stop moving, the influence of the bearing structure 1 on the movement of the first reciprocating structure 6 is avoided, and the accuracy of the feeding angle of the first reciprocating structure 6 is ensured.
Preferably, the driving structure 2 comprises a driving shaft 21 penetrating through the bearing column 11, a first gear 22 sleeved on the driving shaft 21, a second gear 23 matched with the first gear 22, and a limiting shaft 24 for limiting the second gear 23, wherein the limiting shaft 24 is rotationally connected with the supporting frame body, one end of the bearing column 11 is connected with the grooved pulley 16, the second gear 23 is coaxially connected with a first toggle rod 25 for driving the grooved pulley 16 to rotate, a through hole for the driving shaft 21 to pass through is formed in the middle of the grooved pulley 16, and the end part of the driving shaft 21 is in transmission connection with the first motor.
It should be noted that, the type of the first motor may be selected according to the actual use situation, and the output shaft of the first motor may be connected to any end of the driving shaft 21, the number of the bearing blocks 13 is the same as the number of grooves of the grooved wheels 16, and when the bearing structure 1 is in a static state, one bearing block 13 is located at the above-mentioned packaging position; during feeding, the first motor drives the first gear 22 to rotate through the driving shaft 21, the first gear 22 drives the second gear 23 to rotate, the second gear 23 drives the first poking rod 25 to rotate, the first poking rod 25 rotates for a circle to poke the grooved pulley 16 to act once, after the first poking rod 25 pokes the grooved pulley 16 to act, the first reciprocating structure 6 is driven to complete one-time reciprocating motion in the period of time when the first poking rod 25 pokes the grooved pulley 16 again, the transmission characteristic between the first poking rod 25 and the grooved pulley 16 is utilized, the fact that the first reciprocating structure 6 is in contact with the bearing block 13 is guaranteed, the bearing block 13 can be in a packaging position, and automatic feeding is achieved when position adjustment of the bearing block 13 is completed.
Preferably, the first reciprocating structure 6 includes a first U-shaped block 61, a first stop lever 62 fixed at an opening of the first U-shaped block 61, and a plurality of first push rods 612 fixed at one ends of the first U-shaped block 61 far away from the first stop lever 62, the driving shaft 21 is connected with a second toggle rod 26, one ends of the second toggle rods 26 are connected with a first long rod, a second through slot is formed in the first stop lever 62 in a penetrating manner, the first long rod is located in the first through slot, a plurality of first mounting rods 611 for limiting the moving direction of the first U-shaped block 61 are fixed on the first U-shaped block 61, a T-shaped block 15 is fixedly connected on the bearing block 13, when the driving shaft 21 drives the second toggle rod 26 to move circularly, the second toggle rod 26, the first U-shaped block 61 and the first push rods 612 reciprocate along the horizontal direction of the height of the first mounting rods 611, when the first push rods 612 reciprocate, the corresponding T-shaped block 15 and the bearing block 13 are pushed to move in the same direction and at the same distance, and then the pin 13 is inserted into the first push rod 4 to the initial position of the bearing housing 4.
It should be noted that, the length of the first through groove is greater than or equal to the rotation diameter of the second toggle rod 26, the first U-shaped block 61 is connected with the support frame body through the first mounting rod 611, and the support frame body is horizontally provided with a first limit chute for limiting the sliding track at the end of the first mounting rod 611; when the first motor drives the driving shaft 21 to rotate, one end of the second toggle rod 26 connected to the driving shaft 21 can slide in the first through groove formed in the first limit rod 62 and drive the first limit rod 62 to reciprocate, the first limit rod 62 drives the first U-shaped block 61 to reciprocate, meanwhile, the first mounting rod 611 slides reciprocally along the first limit sliding groove, the circular motion is converted into the reciprocating motion through the cooperation between the second toggle rod 26 and the first limit rod 62, the first U-shaped block 61 is driven to act by utilizing the rotation of the first motor, the bearing block 13 is pushed to the shell 4, the setting of a driving piece is reduced, and the use cost of the device is reduced.
Preferably, the first reciprocating structure 6 is provided with a second reciprocating structure 8, one side of the bearing structure 1 far away from the supporting seat 3 is provided with a material conveying structure 9, the material conveying structure 9 is inserted with a plurality of pins 7, and the material conveying structure 9 is used for conveying the pins 7 to the bearing block 13; the second reciprocating structure 8 comprises a second U-shaped block 81, a plurality of second mounting rods 811, a second push rod 812 and a second limiting rod 82; the second limiting rod 82 is connected with the opening part of the second U-shaped block 81, the second push rod 812 is fixedly connected with one end, close to the material conveying structure 9, of the second U-shaped block 81, a third poking rod 27 which is reversely arranged with the second poking rod 26 is connected to the driving shaft 21, one end of the third poking rod 27 is connected with a second long rod, a second through groove is formed in the second limiting rod 82 in a penetrating mode, the second long rod is located in the second through groove, the second U-shaped block 81 is slidably connected with the supporting frame body through a second mounting rod 811, the first mounting rod 611 is slidably connected with the second U-shaped block 81, when the driving shaft 21 drives the third poking rod 27 to circularly move, the third poking rod 27 drives the second limiting rod 82, the second U-shaped block 81 and the second push rod 812 to reciprocate along the moving direction limited by the second mounting rod 811, and when the second push rod 812 reciprocates, the corresponding T-shaped block 15 and the bearing block 13 are pushed to move in the same direction and the pin 7 on the material conveying structure 9 is inserted into the groove 131 on the bearing block 13, and then the second push rod 812 is reset to the initial position.
It should be noted that, in this solution, the second U-shaped block 81 is provided with a second limiting chute for limiting the sliding of the first mounting rod 611, and the ends of the second push rod 812 and the first push rod 612 are located at the same horizontal plane, when the load bearing structure 1 is in a static state, one load bearing block 13 is located at a loading position (the load bearing block 13 of the loading position is closest to the load bearing structure 9 and is located at the same horizontal plane with the load bearing structure 9), when the first motor rotates, the driving shaft 21 can drive the third toggle rod 27 to rotate, and the third toggle rod 27 and the second limiting rod 82 are utilized to convert the circular motion into the reciprocating motion, so as to drive the second U-shaped block 81 to reciprocate, so as to push the load bearing block 13 located at the loading position to approach the load bearing structure 9 until the pins 7 on the load bearing structure 9 are inserted into the grooves 131 on the load bearing blocks 13, and the kinetic energy of the first motor is utilized again, thereby reducing the use cost of the driving device.
Preferably, the material conveying structure 9 comprises a belt body 98 for conveying the pins 7, an inserting groove 94, a first cavity 91 communicated with the inserting groove 94, a second cavity 92, a connecting channel 93, a first piston 95 arranged in the first cavity 91 and a second piston 96 arranged in the second cavity 92, wherein the first cavity 91 and the second cavity 92 are communicated with each other through the connecting channel 93, the pins 7 are inserted into the inserting groove 94, a piston rod 97 is connected to the first piston 95, one end of the piston rod 97 extends outwards through the belt body 98, and when the piston rod 97 pushes the first piston 95 to slide towards the connecting channel 93, the second piston 96 pushes the pins 7 out of the inserting groove 94.
It should be noted that, the belt body 98 is used for conveying the pins 7, the notch of the insertion slot 94 formed on the belt body 98 is obliquely arranged, when the pins 7 are inserted into the insertion slot 94 to be fixed, the end parts of the pins 7 are contacted with the second piston 96, and at this time, the first piston 95 is located at one end of the second cavity 92 far away from the connecting channel 93;
in the process of the reciprocation of the second U-shaped block 81, when the second U-shaped block 81 moves towards the belt body 98, the second push rod 812 can be driven to approach the bearing block 13 at the feeding position, and the bearing block 13 is pushed to approach the belt body 98 by the T-shaped block 15, after the bearing block 13 contacts with the piston rod 97, the first piston 95 is pushed to slide in the first cavity 91, the gas in the first cavity 91 is pushed into the second cavity 92 along the connecting channel 93, the second piston 96 is pushed by the gas to slide towards the notch of the inserting groove 94 and the pins 7 are pushed outwards, so that one ends of the pins 7 are inserted into the grooves 131 formed in the bearing block 13, the pins 7 can be tightly inserted onto the bearing block 13 while the pins 7 are not fixed, and when the bearing block 13 is pulled to reset by the reset spring 14, the pins 7 are not easy to drop from the bearing block 13.
Preferably, the rear side of the bearing post 11 is connected with a limiting disc 111, the limiting disc 111 is coaxially arranged with the driving shaft 21, and the limiting disc 111 is rotatably connected with the supporting frame body.
Preferably, the packaging structure 5 is arranged above the shell 4, the packaging structure 5 comprises a second motor 52 connected with a support frame, an output shaft of the second motor 52 is connected with a mounting plate 51, a plurality of electric push rods 53 are fixed on the lower end face of the mounting plate 51, the output ends of the electric push rods 53 are respectively connected with an injection molding head 54 for filling packaging colloid or sucking discs 55 for grabbing the electronic components 41, the electric push rods 53 corresponding to the sucking discs 55 drive the sucking discs 55 to suck the electronic components 41 and place the electronic components 41 into the shell 4, and the injection molding head 54 moves towards the shell 4 where the electronic components 41 are placed under the driving of the corresponding electric push rods 53 and injects the packaging colloid into the shell 4.
It should be noted that, the input end of the injection molding head 54 is connected to a container for containing colloid from outside through a pipe; when the packaging is prepared, the mounting plate 51 is driven to rotate through the second motor 52, the position of the suction disc 55 is adjusted, the suction disc 55 is driven to act through the electric push rod 53, the shell 4 is placed on the supporting seat 3, the electronic component 41 is placed in the shell 4, the mounting plate 51 is driven to rotate through the second motor 52, the position of the injection molding head 54 is adjusted, the injection molding head 54 corresponds to the semicircular groove, the injection molding head 54 is pushed to be inserted into the semicircular groove through the corresponding electric push rod 53, packaging colloid is injected into the shell 4 through the injection molding head 54 during packaging, the electronic component 41 is sealed in the shell 4, the angle of the suction disc 55 is changed through rotation of the mounting plate 51, and the suction disc 55 is convenient for taking the shell 4 and the electronic component 41 in different directions.
Preferably, the bearing block 13 is provided with a clamping part for clamping the pins 7 and a sealing part for covering the upper part of the shell 4, and the sealing part is provided with a semicircular groove matched with the injection molding head 54.
It should be noted that, when the carrier block 13 contacts with the housing 4, the sealing portion seals the upper end opening area of the housing 4, and when the package is performed, the sealing portion is convenient for molding the sealing gel, and at this time, the injection molding head 54 in the above-mentioned package structure 5 can add the sealing gel into the housing 4 through the semicircular groove formed in the sealing portion.
Preferably, the supporting seat 3 is a conveyor belt, and the surface of the conveyor belt is provided with supporting tables at equal intervals for supporting the housing 4.
It should be noted that, when the carrier belt is used as the supporting seat 3 and the housing 4 is kept supported, after the packaging process of the electronic component 41 is completed, the next housing 4 can be directly transported by the carrier belt and moved to the packaging position, so that the efficiency of the device is improved and the labor cost is reduced.
Working principle: when the device is used, the first motor drives the driving shaft 21 to rotate, the driving shaft 21 drives the second gear 23 to rotate through the first gear 22, the second gear 23 drives the grooved pulley 16 to intermittently move through the first toggle rod 25, so that the bearing column 11 intermittently drives the bearing block 13 to rotate, the pins 7 are conveyed, and the angle of the pins 7 is adjusted;
meanwhile, the driving shaft 21 drives the first U-shaped block 61 to reciprocate through the second toggle rod 26, the third toggle rod 27 drives the second U-shaped block 81 to reciprocate, the first U-shaped block 61 pushes the corresponding bearing block 13 to move towards the supporting seat 3 through the first push rod 612, the pins 7 are conveyed towards the shell 4, and the second U-shaped block 81 pushes the corresponding bearing block 13 to approach the conveying structure 9 through the second push rod 812;
when the bearing block 13 with the pins 7 is in contact with the shell 4, the pins 7 are inserted into small openings formed in the shell 4, and at the moment, the first motor is turned off;
when the pin 7 is conveyed, the bearing block 13 moving towards the conveying structure 9 gradually approaches the belt body 98, after the bearing block 13 contacts with the piston rod 97, the piston rod 97 pushes the first piston 95 to move towards the connecting channel 93 in the first cavity 91, gas in the first cavity 91 enters the second cavity 92 along the connecting channel 93 under the pushing of the first piston 95, and pushes the second piston 96 in the second cavity 92 towards the pin 7 until the end part of the pin 7 reaches the inclined position of the inserting groove 94, and at the moment, the first piston 95 reaches the end of the first cavity 91 connected with the connecting channel 93;
before the bearing block 13 contacts with the shell 4, the packaging structure 5 places the electronic component 41 into the shell 4, and after the pins 7 are inserted into the shell 4, the packaging structure 5 injects packaging colloid into the shell 4 through a semicircular groove formed in the bearing block 13;
after packaging is completed, the first motor is started again, the first motor drives the driving shaft 21 to rotate, the driving shaft 21 drives the first poking rod 25, the second poking rod 26 and the third poking rod 27 to continue to rotate, and the second poking rod 26 drives the first U-shaped block 61 to reset;
meanwhile, the third toggle rod 27 drives the second U-shaped block 81 to reset, at this time, the bearing blocks 13 corresponding to the first reciprocating structure 6 and the second reciprocating structure 8 gradually restore to the original positions under the pulling of the reset spring 14, when the first toggle rod 25 rotates to the notch of the grooved pulley 16 again, the bearing column 11 drives the bearing blocks 13 to rotate, the pins 7 are conveyed, the angle of the pins 7 is adjusted, and the operation is continued until the packaging of all electronic components 41 and the shell 4 is finished.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.
Claims (10)
1. A manufacturing method of an electronic component comprises the following steps:
step S1: placing the shell (4) on a conveyor belt in the manufacturing equipment, and conveying the shell (4) to the lower part of the packaging structure (5) by the conveyor belt;
step S2: the packaging structure (5) is used for placing the electronic component (41) to be packaged into the shell (4);
step S3: the driving structure (2) drives the bearing block (13) carrying the pins (7) to rotate to the position of the same horizontal plane with the supporting seat (3);
step S4: the driving structure (2) drives the first reciprocating structure (6) to move, the first reciprocating structure (6) pushes the bearing block (13) to insert the pins (7) into the sockets formed in the shell (4), and the driving structure (2) stops moving after the pins are inserted into the sockets;
step S5: the packaging structure (5) injects packaging colloid into the shell (4);
step S6: after the encapsulation colloid is solidified, the driving structure (2) continues to act, the first reciprocating structure (6) is driven to restore to the original position, and the bearing block (13) is reset under the pulling of the reset spring (14);
step S7: the conveying belt rotates to remove the packaged electronic components (41) and the shell (4), the next shell (4) to be packaged is conveyed to the lower part of the packaging structure (5), and meanwhile, the driving structure (2) drives the next bearing block (13) carrying pins (7) to rotate to the position of the same horizontal plane as the supporting seat (3) so as to prepare for packaging again;
step S8: repeating the steps S4 to S7 until the encapsulation of all the electronic components (41) and the shell (4) is finished.
2. A manufacturing apparatus for use in the method of manufacturing an electronic component according to claim 1, comprising a number of carrying structures (1), a supporting base (3), a housing (4), pins (7) and a number of supporting frames, characterized in that: the bearing structures (1) are distributed on two sides of the supporting seat (3), the supporting seat (3) is provided with a shell (4), two sides of the shell (4) are provided with sockets for inserting pins (7), and the bearing structures (1) are rotationally connected with the frame body;
the bearing structure (1) comprises a bearing column (11), a plurality of telescopic rods (12) are connected to the side face of the bearing column (11), one ends of the telescopic rods (12) are connected with bearing blocks (13), grooves (131) for placing pins (7) are formed in the bearing blocks (13), return springs (14) are sleeved on the telescopic rods (12), and two ends of each return spring (14) are connected with the bearing structure (1) and the corresponding bearing block (13) respectively;
the bearing structure (1) is provided with a driving structure (2) and a first reciprocating structure (6), the driving structure (2) drives the bearing column (11) to rotate and simultaneously drives the first reciprocating structure (6) to reciprocate, when the first reciprocating structure (6) reciprocates, the first driving bearing block (13) inserts the pins (7) into the sockets of the shell (4), and then the driving bearing block (13) resets to the initial position.
3. An apparatus for manufacturing an electronic component according to claim 2, characterized in that: the driving structure (2) comprises a driving shaft (21) penetrating through the bearing column (11), a first gear (22) sleeved on the driving shaft (21), a second gear (23) matched with the first gear (22), and a limiting shaft (24) used for limiting the second gear (23), wherein the limiting shaft (24) is rotationally connected with a supporting frame body, one end of the bearing column (11) is connected with a grooved pulley (16), the second gear (23) is coaxially connected with a first toggle rod (25) used for driving the grooved pulley (16) to rotate, a through hole for the driving shaft (21) to penetrate through is formed in the middle of the grooved pulley (16), and the end part of the driving shaft (21) is in transmission connection with a first motor.
4. A manufacturing apparatus of an electronic component according to claim 3, characterized in that: the first reciprocating structure (6) comprises a first U-shaped block (61), a first limiting rod (62) fixed at the opening of the first U-shaped block (61) and a plurality of first push rods (612) fixed at one end of the first U-shaped block (61) away from the first limiting rod (62), a second stirring rod (26) is connected to the driving shaft (21), a first long rod is connected to one end of the second stirring rod (26), a second through groove is formed in the first limiting rod (62) in a penetrating mode, the first long rod is located in the first through groove, a plurality of first mounting rods (611) used for limiting the moving direction of the first U-shaped block (61) are fixed on the first U-shaped block (61), a T-shaped block (15) is fixedly connected to the bearing block (13), when the driving shaft (21) drives the second stirring rod (26) to move circularly, the second stirring rod (26) drives the first limiting rod (62), the first U-shaped block (61) and the first push rods (612) to move horizontally along the first push rods (612) in the same direction as the first push rods (612), and the first push rods (612) are pushed horizontally along the first mounting rods (612) to the first reciprocating block (13) in the same direction as the first reciprocating block (13), and the first reciprocating block (612) can move horizontally along the first push rods (612) in the first reciprocating block (13) in the first reciprocating direction.
5. The manufacturing apparatus of electronic components according to claim 4, wherein: the first reciprocating structure (6) is provided with a second reciprocating structure (8), one side, far away from the supporting seat (3), of the bearing structure (1) is provided with a material conveying structure (9), a plurality of pins (7) are inserted on the material conveying structure (9), and the material conveying structure (9) is used for conveying the pins (7) to the bearing block (13); the second reciprocating structure (8) comprises a second U-shaped block (81), a plurality of second mounting rods (811), a second push rod (812) and a second limiting rod (82); the utility model discloses a material conveying device, including first U-shaped piece (81), second gag lever post (82), second U-shaped piece (81) and support frame body sliding connection, second push rod (812) and second U-shaped piece (81) are close to the one end fixed connection of defeated material structure (9), be connected with on drive shaft (21) with second toggle lever (26) reverse third toggle lever (27) that set up, third toggle lever (27) one end is connected with the second stock, the second through-channel has been seted up in the run-through on second gag lever post (82), the second stock is located the second through-channel, second U-shaped piece (81) are through second installation pole (811) and support frame body sliding connection, first installation pole (611) and second U-shaped piece (81) sliding connection, when drive shaft (21) drive third toggle lever (27) circular motion, third toggle lever (27) drive second gag lever post (82), second U-shaped piece (81) and second push rod (812) are along the direction of movement of second installation pole (811) restriction, and second push rod (812) are reciprocal motion to the corresponding push rod (13) and are carried on the carrier block (13) and are carried on the corresponding position (13) and are carried forward in the reciprocal motion (13) and carry out the reciprocal motion of the first push rod (13) and carry out the position (13.
6. An apparatus for manufacturing an electronic component according to claim 5, wherein: the conveying structure (9) comprises a belt body (98) for conveying pins (7), a plug-in groove (94), a first cavity (91) communicated with the plug-in groove (94), a second cavity (92), a connecting channel (93), a first piston (95) arranged in the first cavity (91) and a second piston (96) arranged in the second cavity (92), the first cavity (91) and the second cavity (92) are communicated with each other through the connecting channel (93), the pins (7) are plugged in the plug-in groove (94), a piston rod (97) is connected to the first piston (95), one end of the piston rod (97) penetrates through the belt body (98) to extend outwards, and when the piston rod (97) pushes the first piston (95) to slide towards the connecting channel (93), the second piston (96) pushes the pins (7) out of the plug-in groove (94).
7. The manufacturing apparatus of electronic components according to claim 6, wherein: the rear side of the bearing column (11) is connected with a limiting disc (111), the limiting disc (111) and the driving shaft (21) are coaxially arranged, and the limiting disc (111) is rotationally connected with the supporting frame body.
8. The manufacturing apparatus of electronic components according to claim 7, wherein: the top of casing (4) is equipped with packaging structure (5), packaging structure (5) include with support frame body coupling's second motor (52), the output shaft of second motor (52) has mounting panel (51), the lower terminal surface of mounting panel (51) is fixed with a plurality of electric putter (53), and the output of a plurality of electric putter (53) is connected with injection molding head (54) or sucking disc (55) that snatchs electronic components (41) that are used for filling encapsulation colloid respectively, electric putter (53) that sucking disc (55) correspond drive sucking disc (55) hold electronic components (41) and place electronic components (41) in casing (4), injection molding head (54) remove and pour into encapsulation colloid into casing (4) to casing (4) department of placing electronic components (41) under the drive of corresponding electric putter (53).
9. The manufacturing apparatus of electronic components according to claim 8, wherein: the bearing block (13) is provided with a clamping part for clamping the pins (7) and a sealing part for covering the upper part of the shell (4), and the sealing part is provided with a semicircular groove matched with the injection molding head (54).
10. An apparatus for manufacturing an electronic component according to claim 9, wherein: the supporting seat (3) is a conveying belt, and supporting tables used for supporting the shell (4) are arranged on the surface of the conveying belt at equal intervals.
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| CN115518798A (en) * | 2022-11-08 | 2022-12-27 | 青岛邦钲电气集团有限公司 | Be used for new energy automobile with support body processing equipment |
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| GB771691A (en) * | 1954-06-01 | 1957-04-03 | Osborn Mfg Co | An improved brushing mechanism |
| JPH0835823A (en) * | 1994-07-25 | 1996-02-06 | Nec Kyushu Ltd | Ic lead shape inspection instrument |
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| CN116169074B (en) | 2024-01-23 |
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