CN116160754A - Method for applying thermosetting resin adhesive to manufacturing bimetal vibration reduction plate - Google Patents
Method for applying thermosetting resin adhesive to manufacturing bimetal vibration reduction plate Download PDFInfo
- Publication number
- CN116160754A CN116160754A CN202310152169.8A CN202310152169A CN116160754A CN 116160754 A CN116160754 A CN 116160754A CN 202310152169 A CN202310152169 A CN 202310152169A CN 116160754 A CN116160754 A CN 116160754A
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- Prior art keywords
- plate
- metal
- composite plate
- bimetal
- resin adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a method for applying thermosetting resin adhesive to manufacturing a bimetal vibration reduction plate, which comprises the following steps: (1) glue preparation: resin solution P425 and resin solution PCA118 at a mass ratio of 100:10.5 to 11.5, and diluting the mixture by a diluting solvent to obtain a mixed resin solution; (2) coating: preparing a metal substrate and a metal composite plate, and respectively coating a layer of the mixed resin solution prepared in the step (1) on the upper surface of the metal substrate and the lower surface of the metal composite plate; (3) heat curing: heating the coated metal substrate and metal composite plate, and respectively forming cured resin adhesive layers on the metal substrate and the metal composite plate after medium-temperature baking and curing; (4) superimposed rolling: and overlapping the resin adhesive layers after heat curing on the metal substrate and the metal composite plate face to face, continuously rolling and laminating, and slowly cooling at normal temperature after rolling to obtain the bimetal composite plate roll.
Description
Technical Field
The invention relates to the technical field of composite materials, in particular to a method for applying thermosetting resin adhesive to manufacturing a bimetal vibration reduction plate.
Background
The vibration-damping composite board is a three-layer laminated composite material in which two layers of metal are bonded together by a layer of high molecular adhesive with the thickness of 30-80 mu m, the thickness of the double-layer metal is usually more than 0.3mm, and the double-layer metal is commonly used in the vibration-damping and noise-reducing fields of automobile engine oil bottom shells, household appliances and the like. In order to improve the vibration reduction effect of the vibration reduction composite board, people begin to try to apply thermosetting resin adhesive to manufacture a bimetal vibration reduction board, so as to achieve the aim of improving the vibration reduction effect, the patent application number is 201910397892.6, the invention patent with publication number of CN 110205074A discloses a thermosetting resin adhesive, an application method thereof and a product prepared by the application method, wherein the mass ratio of resin solution P425 to resin solution PCA118 is 100:10.5-11.5, then diluting with a diluting solvent to prepare a thermosetting resin glue solution, and utilizing the thermosetting resin glue solution of the patent to prepare the bimetal composite plate, however, through actual use, the bimetal composite plate prepared by the patent has no vibration reduction effect, cannot effectively play a role in vibration reduction and noise reduction, and cannot be used as a functional structural material.
Disclosure of Invention
In view of the above technical problems, the present invention provides a method for applying a thermosetting resin adhesive to manufacture a bimetal vibration reduction plate.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
a method for applying a thermosetting resin paste to manufacture a bimetal damper plate, comprising the steps of:
(1) And (3) glue preparation: resin solution P425 and resin solution PCA118 at a mass ratio of 100:10.5 to 11.5, and diluting the mixture by a diluting solvent, and controlling the viscosity of the mixture to be 200 to 500 seconds to obtain a mixed resin solution;
(2) Coating: preparing a metal substrate and a metal composite plate, and respectively coating a layer of the mixed resin solution prepared in the step (1) on the upper surface of the metal substrate and the lower surface of the metal composite plate;
(3) And (3) heating and curing: heating the coated metal substrate and metal composite plate, and respectively forming cured resin adhesive layers on the metal substrate and the metal composite plate after medium-temperature baking and curing;
(4) And (3) superposition rolling: and overlapping the resin adhesive layers after heat curing on the metal substrate and the metal composite plate face to face, continuously rolling and laminating, and slowly cooling at normal temperature after rolling to obtain the bimetal composite plate roll.
Wherein the diluting solvent in the step (1) is toluene or butanone.
In the step (2), the metal substrate and the metal composite plate are cleaned and oilless.
Wherein in the step (3), the curing temperature of the medium-temperature baking curing is controlled to be 120-180 ℃.
In the step (4), after the resin adhesive layers of the metal substrate and the metal composite plate are overlapped face to face, when continuous rolling lamination is carried out, the total thickness of the adhesive layers after lamination is controlled to be 60-80 mu m.
Wherein, in the step (4), when continuous rolling lamination is carried out, the pressure of nodes at two ends of the pressing roller is 0.45MPa to 0.6MPa.
Wherein the thickness of the metal substrate is 0.3-2.5 mm, and the thickness of the metal composite plate is 0.3-1.5 mm.
Wherein the metal substrate and the metal composite plate are made of galvanized steel plates or cold-rolled steel plates or stainless steel plates or aluminum plates.
The beneficial effects of the invention are as follows:
(1) The invention reduces the curing temperature from 210 ℃ to 265 ℃ to 120 ℃ to 180 ℃ disclosed by the invention, and reasonably controls the viscosity of the resin solution and the thickness of the cured resin, so that the bimetal vibration damping composite plate prepared by using the resin obtains unexpected vibration damping and noise reduction effects, and the damping coefficient meets the damping coefficient requirement in GB/T36009-2018 vibration damping composite steel plate, and the damping coefficient indexes all reach more than 0.2.
The invention reduces the curing temperature from 210 ℃ to 265 ℃ to 120 ℃ to 180 ℃ disclosed by the invention, and reasonably controls the viscosity of the resin solution and the thickness of the cured resin, so that the bimetal vibration reduction composite prepared by using the resin greatly improves the peeling strength, and the conventional knowledge of high curing temperature, long curing time and high peeling strength is overcome. The peeling strength reaches more than 175N/25mm, and the subsequent stamping and cutting processes are ensured not to be layered and cracked.
Detailed Description
The present invention will be further described in detail with reference to the following embodiments, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the description is only illustrative and is not intended to limit the scope of the invention. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present invention.
A method for applying a thermosetting resin paste to manufacture a bimetal damper plate, comprising the steps of:
(1) And (3) glue preparation: resin solution P425 and resin solution PCA118 at a mass ratio of 100:10.5 to 11.5, and diluting the mixture by a diluting solvent, and controlling the viscosity of the mixture to be 200 to 500 seconds to obtain a mixed resin solution;
(2) Coating: preparing a metal substrate and a metal composite plate, and respectively coating a layer of the mixed resin solution prepared in the step (1) on the upper surface of the metal substrate and the lower surface of the metal composite plate;
(3) And (3) heating and curing: heating the coated metal substrate and metal composite plate, and respectively forming cured resin adhesive layers on the metal substrate and the metal composite plate after medium-temperature baking and curing;
(4) And (3) superposition rolling: and overlapping the resin adhesive layers after heat curing on the metal substrate and the metal composite plate face to face, continuously rolling and laminating, and slowly cooling at normal temperature after rolling to obtain the bimetal composite plate roll.
Wherein the diluting solvent in the step (1) is toluene or butanone.
In the step (2), the metal substrate and the metal composite plate are cleaned and oilless.
Wherein in the step (3), the curing temperature of the medium-temperature baking curing is controlled to be 120-180 ℃.
In the step (4), after the resin adhesive layers of the metal substrate and the metal composite plate are overlapped face to face, when continuous rolling lamination is carried out, the total thickness of the adhesive layers after lamination is controlled to be 60-80 mu m.
Wherein, in the step (4), when continuous rolling lamination is carried out, the pressure of nodes at two ends of the pressing roller is 0.45MPa to 0.6MPa.
Wherein the thickness of the metal substrate is 0.3-2.5 mm, and the thickness of the metal composite plate is 0.3-1.5 mm.
Wherein the metal substrate and the metal composite plate are made of galvanized steel plates or cold-rolled steel plates or stainless steel plates or aluminum plates.
According to the process, 8 groups of examples are prepared, the test process and related indexes are shown in table 1, a thermosetting resin adhesive and parameters in an application method thereof are disclosed by using patent application number 201910397892.6 and publication number CN 110205074A for preparing the bimetal composite plate, and the tested peel strength and damping coefficient indexes are compared with those of the patent, and the comparison result is shown in table 2.
As can be seen from the examples, the bimetal vibration reduction plate with the peeling strength index of 175N/25mm and the damping coefficient of about 0.3 can be obtained by controlling the temperature within the range of 120-180 ℃ and the total thickness of the dry film of 60-80 mu m.
Analysis is carried out through table 2 contrast index, the peel strength test result of example 10 in the patent of application number 201910397892.6 is 109N/25mm, this patent adopts the technical scheme in the patent of application number 201910397892.6, adopt the curing temperature to solidify, the test result is close with the peel strength of the patent of application number 201910397892.6, simultaneously also test damping coefficient, the peel strength and damping coefficient index through the test are compared with this patent, under the condition of reducing the curing temperature, the peel strength that this patent technical scheme obtained is higher than the index of patent publication of application number 201910397892.6, and the damping coefficient that this patent technical scheme obtained reaches among GB/T36009-2018 damping clad steel plate damping not less than 0.2 requirement.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (8)
1. A method for applying a thermosetting resin paste to manufacture a bimetal damper plate, comprising the steps of:
(1) And (3) glue preparation: resin solution P425 and resin solution PCA118 at a mass ratio of 100:10.5 to 11.5, and diluting the mixture by a diluting solvent, and controlling the viscosity of the mixture to be 200 to 500 seconds to obtain a mixed resin solution;
(2) Coating: preparing a metal substrate and a metal composite plate, and respectively coating a layer of the mixed resin solution prepared in the step (1) on the upper surface of the metal substrate and the lower surface of the metal composite plate;
(3) And (3) heating and curing: heating the coated metal substrate and metal composite plate, and respectively forming cured resin adhesive layers on the metal substrate and the metal composite plate after medium-temperature baking and curing;
(4) And (3) superposition rolling: and overlapping the resin adhesive layers after heat curing on the metal substrate and the metal composite plate face to face, continuously rolling and laminating, and slowly cooling at normal temperature after rolling to obtain the bimetal composite plate roll.
2. The method for manufacturing a bimetal vibration damping plate by using the thermosetting resin adhesive according to claim 1, wherein the diluting solvent in the step (1) is toluene or butanone.
3. The method for manufacturing a bimetal vibration damping plate by using the thermosetting resin adhesive according to claim 1, wherein in the step (2), the metal base plate and the metal clad plate are cleaned and oilless.
4. The method for manufacturing a bimetal vibration damping plate by using the thermosetting resin adhesive according to claim 1, wherein in the step (3), the curing temperature of the medium temperature baking curing is controlled to be 120-180 ℃.
5. The method for manufacturing a bi-metal vibration-damping plate by using the thermosetting resin adhesive according to claim 1, wherein in the step (4), after the resin adhesive layers of the metal substrate and the metal composite plate are overlapped face to face, the total thickness of the adhesive layers after lamination is controlled to be 60-80 μm when continuous rolling lamination is performed.
6. The method for manufacturing a bimetal vibration damping plate by using the thermosetting resin adhesive according to claim 1 or 5, wherein in the step (4), the joint pressure of the two ends of the pressing roller is 0.45MPa to 0.6MPa when continuous rolling bonding is performed.
7. The method for manufacturing a bimetal vibration damping plate by using the thermosetting resin adhesive according to claim 1, wherein the thickness of the metal substrate is 0.3 mm-2.5 mm, and the thickness of the metal composite plate is 0.3-1.5 mm.
8. The method for manufacturing a bimetal vibration damping plate by using the thermosetting resin glue according to claim 1 or 7, wherein the material of the metal base plate and the metal composite plate is a galvanized steel plate or a cold-rolled steel plate or a stainless steel plate or an aluminum plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310152169.8A CN116160754A (en) | 2023-02-22 | 2023-02-22 | Method for applying thermosetting resin adhesive to manufacturing bimetal vibration reduction plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202310152169.8A CN116160754A (en) | 2023-02-22 | 2023-02-22 | Method for applying thermosetting resin adhesive to manufacturing bimetal vibration reduction plate |
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Publication Number | Publication Date |
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CN116160754A true CN116160754A (en) | 2023-05-26 |
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Family Applications (1)
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CN202310152169.8A Pending CN116160754A (en) | 2023-02-22 | 2023-02-22 | Method for applying thermosetting resin adhesive to manufacturing bimetal vibration reduction plate |
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CN (1) | CN116160754A (en) |
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2023
- 2023-02-22 CN CN202310152169.8A patent/CN116160754A/en active Pending
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