CN116160364B

CN116160364B - Polishing liquid supply device

Info

Publication number: CN116160364B
Application number: CN202310430555.9A
Authority: CN
Inventors: 孙婷婷
Original assignee: Changxin Memory Technologies Inc
Current assignee: Changxin Memory Technologies Inc
Priority date: 2023-04-21
Filing date: 2023-04-21
Publication date: 2023-09-22
Anticipated expiration: 2043-04-21
Also published as: CN116160364A

Abstract

The present disclosure relates to a polishing liquid supply device, which is applied to chemical mechanical polishing equipment, wherein the polishing liquid supply device comprises a controller, a movement mechanism, a polishing liquid supply arm and a nozzle, and the movement mechanism is arranged on the chemical mechanical polishing equipment; one end of the grinding fluid supply arm is movably arranged on the movement mechanism; the nozzle is arranged at the other end of the grinding fluid supply arm and is positioned above the grinding pad of the chemical mechanical grinding equipment, the nozzle comprises a communicating pipe part and a fan-shaped outlet part communicated with the communicating pipe part, wherein the opening of the fan-shaped outlet part is adjustable, and the grinding fluid is dispersed onto the grinding pad through the grinding fluid supply arm and the nozzle; the controller is connected with the motion mechanism, the grinding fluid supply arm and the nozzle and is used for controlling at least one of the motion mechanism, the grinding fluid supply arm and the nozzle to change the track of the grinding fluid dispersed on the grinding pad, so that the technical problems of accumulation and uneven dispersion of the grinding fluid on the grinding pad are avoided.

Description

Polishing liquid supply device

Technical Field

The disclosure relates to the technical field of semiconductor manufacturing, in particular to a grinding fluid supply device.

Background

Wet etching is a common etching processing mode and is widely applied to the manufacturing fields of memories, semiconductor logic devices and the like. Wet etching using chemical mechanical polishing (Chemical Mechanical Polishing, CMP) techniques is one of the common wet etching processes. The CMP technology realizes the efficient removal of redundant materials on the surface of the wafer and global nanoscale planarization through the synergistic interaction of chemical corrosion and mechanical grinding.

In the current chemical mechanical polishing technology, a spraying coverage area of a spraying grinding liquid nozzle is small, and the spraying coverage area is not flexible enough, so that the grinding liquid is not saturated on a grinding pad, and the grinding liquid is not uniformly dispersed, thereby causing poor process.

Disclosure of Invention

In view of the above-mentioned shortcomings in the prior art, the present disclosure provides a polishing liquid supply apparatus for a chemical mechanical polishing apparatus, which can at least disperse and spray a polishing liquid of the chemical mechanical polishing apparatus, increase a coverage area of the polishing liquid on a polishing pad, and avoid the technical problems of accumulation and uneven dispersion of the polishing liquid on the polishing pad.

To solve the above technical problems and other problems, according to some embodiments, an aspect of the present disclosure provides a slurry supply apparatus for use in a chemical mechanical polishing apparatus, the slurry supply apparatus including a controller, a motion mechanism, a slurry supply arm, and a nozzle, the motion mechanism being mounted on the chemical mechanical polishing apparatus; one end of the grinding fluid supply arm is movably arranged on the movement mechanism; the nozzle is arranged at the other end of the grinding fluid supply arm and is positioned above the grinding pad of the chemical mechanical grinding equipment, the nozzle comprises a communicating pipe part and a fan-shaped outlet part communicated with the communicating pipe part, wherein the opening of the fan-shaped outlet part is adjustable, and the grinding fluid is dispersed onto the grinding pad through the grinding fluid supply arm and the nozzle; the controller is connected with the motion mechanism, the grinding fluid supply arm and the nozzle and is used for controlling at least one of the motion mechanism, the grinding fluid supply arm and the nozzle to act so as to change the track of the grinding fluid dispersed on the grinding pad; the grinding fluid supply arm is an arc-shaped arm, the grinding fluid supply arm is provided with a plurality of holes which are arranged in an array, and the cleaning agent is sprayed to the cleaning nozzle through the holes on the grinding fluid supply arm.

According to the grinding fluid supply device in the embodiment, one end of the grinding fluid supply arm is movably arranged on the motion mechanism, and the controller is arranged to control at least one of the motion mechanism, the grinding fluid supply arm and the nozzle, so that the grinding fluid supply arm can perform at least one of horizontal motion, vertical motion and rotary motion along with the motion mechanism, and the inclination angle of the grinding fluid supply arm relative to the grinding pad, and the horizontal distance and the vertical distance between the grinding fluid supply arm and the grinding pad can be adjusted; through setting up the nozzle of installing in the lapping liquid supply arm other end including communicating pipe portion and the fan-shaped outlet portion of this communicating pipe portion of intercommunication, the aperture of fan-shaped outlet portion is adjustable for the controller can intelligent control fan-shaped outlet portion increase the aperture, increases the coverage area of dispersion lapping liquid on the lapping pad, avoids producing lapping liquid and piles up and disperse inhomogeneous technical problem on the lapping pad, improves lapping liquid uniformity and saturation of distribution on the lapping pad, thereby has improved chemical mechanical lapping equipment's performance, reliability, and makes semiconductor device's yield.

In some embodiments, the slurry supply arm is configured to at least one of move horizontally, vertically, and rotationally along with the motion mechanism.

In some embodiments, the fan-shaped outlet portion includes a plurality of baffles converging from one end to the other end, the plurality of baffles converging to the communicating tube portion, wherein a "W" shaped structure is formed between the plurality of baffles, and an opening width of the "W" shaped structure is adjustable.

In some embodiments, the fan-shaped outlet portion includes a shaft and a plurality of baffles, the shaft being connected to the communication pipe portion; the baffles are arranged on the shaft rod along the circumferential direction of the shaft rod, a V-shaped structure is formed among the baffles, and the opening width of the V-shaped structure is adjustable.

In some embodiments, the fan-shaped outlet portion includes a fan-shaped plate and a plurality of deflectors, the fan-shaped plate being connected to the communicating pipe portion; the plurality of guide plates are arranged on the sector plate to divide the sector plate into a plurality of guide grooves, wherein the size of the sector plate is adjustable to adjust the opening of the plurality of guide grooves.

In some embodiments, the polishing liquid supply apparatus further comprises an opening adjusting component, a first sensor, and/or a second sensor; the first sensor is in communication connection with the controller and is used for generating a sensing signal containing the rotating speed value of the polishing pad; the second sensor is in communication connection with the controller and is used for generating a sensing signal containing a distance value between the fan-shaped outlet part and the grinding pad; the opening adjusting component is in communication connection with the controller and is used for responding to the acquired sensing signals of the first sensor and/or the second sensor by the controller to generate target control signals and adjust the opening of the fan-shaped outlet.

In some embodiments, the controller is further configured to: acquiring a preset comparison table, wherein the preset comparison table comprises size values corresponding to different rotating speed values and/or distance values; inquiring a preset comparison table according to the induction signals, and acquiring target size values corresponding to the rotating speed values and/or the distance values contained in the induction signals in the preset comparison table; a target control signal including a target size value is generated, the target control signal being used to control the opening adjustment assembly to adjust the size of the fan-shaped outlet portion to the target size value.

In some embodiments, the sensing signal includes an initial sensing signal and a detected sensing signal; the first sensor comprises an infrared emitter and an infrared receiver, wherein the infrared emitter is arranged on the chemical mechanical polishing equipment and is used for emitting infrared signals; the infrared receiver is arranged on the grinding pad, connected with the controller and used for generating an initial induction signal when the infrared receiver is positioned at the detection position for the first time and generating a detection induction signal when the infrared receiver is rotated to the detection position for the second time along with the grinding pad; the controller is further configured to: and calculating the rotating speed value of the polishing pad according to the generating time of the detection sensing signal, the generating time of the initial sensing signal and the distance information between the initial position and the detection position.

In some embodiments, the opening adjusting assembly comprises a middle nest portion, a main rib and an auxiliary rib, wherein the middle nest portion and an outlet end of the communicating pipe portion are coaxially arranged and used for moving along the extending direction of the shaft; the fan-shaped outlet part surrounds the middle nest part; the main umbrella rib is arranged corresponding to the side wall of the flow passage of the fan-shaped outlet part, is arranged on the bottom surface of the fan-shaped outlet part, and has the extending direction consistent with the extending direction of the top surface of the side wall of the flow passage, and the proximal end of the main umbrella rib is close to the outlet end of the communicating pipe part; one end of the auxiliary rib is connected with the middle part of the main rib, and the other end of the auxiliary rib is connected with the middle nest part and is used for moving along with the middle nest part and driving the main rib to move, and the height of the side wall of the runner and the distance between the side walls of the adjacent runners are adjusted so as to change the opening of the fan-shaped outlet part.

In some embodiments, the opening adjusting assembly further comprises a moving part, and the moving part is connected with the controller and used for responding to the target control signal and moving along the extending direction of the shaft to drive the middle nest part to move along the extending direction of the shaft.

In some embodiments, the target control signals include a turn-up control signal and a turn-down control signal; the moving part comprises a servo motor, and the servo motor is connected with the controller and is used for responding to the turn-up control signal, moving along the extending direction of the shaft and in the direction close to the outlet end of the communicating pipe part, and driving the middle nest part to move along the extending direction of the shaft and in the direction close to the outlet end of the communicating pipe part so as to increase the opening of the fan-shaped outlet part; or the servo motor is used for responding to the reduction control signal, moving along the extending direction of the shaft and in the direction away from the outlet end of the communicating pipe part, and driving the middle nest part to move along the extending direction of the shaft and in the direction away from the outlet end of the communicating pipe part so as to reduce the opening of the fan-shaped outlet part.

In some embodiments, the control signals include a turn-up control signal and a turn-down control signal; the moving part comprises a cam, the cam is connected with the controller, and the rotating surface of the cam is intersected with the grinding pad; the cam is used for responding to the enlargement control signal, so that the protruding part of the cam rotates along the direction close to the outlet end of the communicating pipe part, and the middle nest part is driven to move along the extending direction of the shaft and the direction close to the outlet end of the communicating pipe part, so that the opening degree of the fan-shaped outlet part is increased; or the cam is used for responding to the reduction control signal, so that the protruding part of the cam rotates along the direction away from the outlet end of the communicating pipe part, and the middle nest part is driven to move along the extending direction of the shaft and the direction away from the outlet end of the communicating pipe part, so that the opening of the fan-shaped outlet part is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic structural view of an apparatus for supplying an abrasive liquid according to a first embodiment of the present disclosure;

FIG. 2 is a schematic view showing a structure of the polishing liquid supply apparatus shown in FIG. 1 after increasing the size of a fan-shaped outlet portion;

FIG. 3 is a schematic view showing a cross-sectional structure of a fan-shaped outlet portion in the direction AA' of the slurry supply apparatus shown in FIG. 2;

fig. 4 is a schematic structural view of an apparatus for supplying an abrasive liquid according to a second embodiment of the present disclosure;

FIG. 5 is a schematic view showing a cross-sectional structure of a fan-shaped outlet portion in the BB' direction in the polishing liquid supply apparatus shown in FIG. 4;

fig. 6 is a schematic structural view of an apparatus for supplying polishing liquid according to a third embodiment of the present disclosure;

FIG. 7 is a schematic view showing a sectional structure of a fan-shaped outlet portion in the direction CC' in the polishing liquid supply apparatus shown in FIG. 6;

FIG. 8 is a schematic view of the flow guide groove in FIG. 7;

fig. 9 is a schematic diagram illustrating a control principle of an apparatus for supplying an abrasive liquid according to a first embodiment of the present disclosure;

fig. 10 is a schematic diagram illustrating a control principle of an apparatus for supplying an abrasive liquid according to a second embodiment of the present disclosure;

fig. 11 is a schematic structural view of an apparatus for supplying polishing liquid according to a fourth embodiment of the present disclosure;

fig. 12 is a schematic partial structure of an opening adjusting assembly in an apparatus for supplying polishing liquid according to an embodiment of the present disclosure;

Fig. 13 is a schematic diagram illustrating a control principle of a polishing liquid supply apparatus according to a third embodiment of the present disclosure;

fig. 14 is a schematic control diagram of a polishing liquid supply device according to a fourth embodiment of the present disclosure.

Reference numerals illustrate:

100. a polishing liquid supply device; 10. a movement mechanism; 11. a horizontal movement assembly; 12. a lifting assembly; 13. a rotation shaft; 20. a polishing liquid supply arm; 30. a nozzle; 31. a communicating pipe section; 32. a fan-shaped outlet portion; 200. a "W" shaped structure; 300. a "V" shaped structure; 40. a controller; 101. a chemical mechanical polishing device; 21. a hole; 321m/321n, baffles; 322. a shaft lever; 3201. a sector plate; 323. a deflector; 324. a diversion trench; 3241. a flow channel side wall; 50. an opening degree adjusting component; 61. a first inductor; 62. a second inductor; 102. grinding fluid; 103. a polishing pad; 104. a grinding head; 611. an infrared emitter; 612. an infrared receiver; 51. a middle nest portion; 52. a main rib; 53. auxiliary umbrella ribs; 54. a servo motor; 55. a cam.

Description of the embodiments

In order that the disclosure may be understood, a more complete description of the disclosure will be rendered by reference to the appended drawings. Preferred embodiments of the present disclosure are shown in the drawings. This disclosure may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Where the terms "comprising," "having," and "including" are used herein, another component may also be added unless explicitly defined as such, e.g., "consisting of … …," etc. Unless mentioned to the contrary, singular terms may include plural and are not to be construed as being one in number.

It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concepts of the disclosure by way of illustration, and only the components related to the disclosure are shown in the illustration, rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex. For example, in the drawings of the embodiments of the present disclosure, the size ratio of the polishing head to the nozzle is larger, so as to enlarge the schematic structure of the nozzle, and in actual products, the size of the polishing head is much larger than the size of the nozzle.

In integrated circuit fabrication, a chemical mechanical polishing (Chemical Mechanical Polishing, CMP) process is typically performed by removing a thin film from the wafer surface through a series of complex mechanical and chemical actions, thereby achieving wafer planarization. The main working principle of chemical mechanical polishing is that a polished wafer moves relatively to a polishing pad under a certain pressure and in the presence of polishing liquid, and the surface of the polished wafer meets the requirements of high planarization, low surface roughness and low defects by means of the high organic combination between the mechanical polishing effect of a nano abrasive and the chemical effects of various chemical reagents. At present, the shape, the size and the flow of a nozzle in a CMP liquid spraying device are fixed in the CMP manufacturing process, the spraying surface of the CMP liquid spraying device is fixed, the spraying area is smaller, the polishing grinding liquid is driven to flow by means of rotation of a grinding pad so as to increase the coverage of the grinding liquid, the grinding liquid is not saturated on the grinding pad, and the grinding liquid is not dispersed uniformly, so that poor process is caused.

Based on the above-mentioned problems, the following embodiments of the present disclosure provide a polishing liquid supply device, which can at least disperse and spray polishing liquid of a chemical mechanical polishing device, increase a coverage area of the polishing liquid on a polishing pad, avoid the technical problems of accumulation and uneven dispersion of the polishing liquid on the polishing pad, and improve yield of semiconductor products.

A schematic partial structure of the chemical mechanical polishing apparatus is given only by way of example in the drawings of the embodiments of the present disclosure, and the drawings are intended to schematically illustrate the implementation principle of the embodiments of the present disclosure. According to the implementation principle of the present disclosure, the equivalent/equivalent deformation structure is made without paying creative labor, and all the equivalent/equivalent deformation structures are considered to be within the protection scope of the present disclosure.

In some embodiments, referring to fig. 1-3, the disclosure provides a polishing liquid supply apparatus 100, applied to a chemical mechanical polishing device 101, where the polishing liquid supply apparatus 100 includes a controller (not shown in fig. 1-3), a motion mechanism 10, a polishing liquid supply arm 20, and a nozzle 30, and the motion mechanism 10 is mounted on the chemical mechanical polishing device 101; one end 20a of the polishing liquid supply arm 20 is movably mounted on the movement mechanism 10; the nozzle 30 is mounted on the other end 20b of the polishing liquid supply arm 20 and is positioned above the polishing pad 103 of the chemical mechanical polishing apparatus 101, the nozzle 30 comprises a communicating pipe part 31 and a fan-shaped outlet part 32 communicated with the communicating pipe part 31, wherein the opening degree of the fan-shaped outlet part 32 is adjustable, and the polishing liquid 102 is dispersed on the polishing pad 103 through the polishing liquid supply arm 20 and the nozzle 30; the controller is connected to the movement mechanism 10, the polishing liquid supply arm 20, and the nozzle 30, and is configured to control at least one of the movement mechanism 10, the polishing liquid supply arm 20, and the nozzle 30 to change the trajectory of the polishing liquid 102 dispersed on the polishing pad 103.

With continued reference to fig. 1 and 2, the fan-shaped outlet portion 32 is configured to have a fan shape, so that the nozzles 30 disperse the polishing liquid 102 in a linear distribution, and avoid direct spraying through a pipeline, such as a circular pipeline, and a water line flowing down vertically, so that the spraying contact area is smaller, and further the polishing liquid 102 is uniformly dispersed only depending on the rotation of the polishing pad 103 and the flow field. The nozzle modified to the uniform dispersion fan-shaped outlet end in the embodiment of the disclosure increases the coverage area of the polishing liquid 102 on the polishing pad 103 by dispersing water flow, and then the wafer (W) under the polishing head 104 is polished on the polishing pad 103 under the action of the polishing head 104. The nozzle 30 of the embodiment of the disclosure avoids the technical problems of uneven accumulation and dispersion of the polishing liquid 102 on the polishing pad 103, and improves the uniformity and saturation of the distribution of the polishing liquid 102 on the polishing pad 103, thereby improving the performance and reliability of the chemical mechanical polishing apparatus and the yield of the manufactured semiconductor apparatus.

With continued reference to fig. 1 and 2, by providing one end 20a of the polishing liquid supply arm 20 movably mounted on the motion mechanism 10, and providing a controller to control at least one of the motion mechanism 10, the polishing liquid supply arm 20 and the nozzle 30, the polishing liquid supply arm 20 can perform at least one of horizontal motion, vertical motion and rotational motion along with the motion mechanism 10, so as to adjust the inclination angle of the polishing liquid supply arm 20 relative to the polishing pad 103, and the horizontal distance and vertical distance between the polishing liquid supply arm 20 and the polishing pad 103; through setting up the nozzle 30 of installing in grinding fluid supply arm 20 other end 20b and including communicating pipe portion 31 and the fan-shaped outlet portion 32 of communicating pipe portion 31, the aperture of fan-shaped outlet portion 32 is adjustable for the controller can intelligent control fan-shaped outlet portion 32 increases the aperture, increases the coverage area of dispersion to grinding fluid on the grinding pad 103, avoids producing grinding fluid and piles up and the uneven technical problem of dispersion on the grinding pad 103, improves grinding fluid 102 and distributes uniformity and saturation on the grinding pad 103, thereby improves the performance and the reliability of chemical mechanical polishing equipment 101. The polishing liquid supply apparatus 100 can also control the fan-shaped outlet portion 32 to reduce the opening degree through the controller intelligently during the process of executing the chemical mechanical polishing process, and control the movement mechanism 10 or the polishing liquid supply arm 20 to perform at least one of horizontal movement, vertical movement and rotational movement, so as to control the fan-shaped outlet portion 32 to spray the polishing liquid 102 on the target area on the polishing pad 103 pertinently, so as to realize intelligent locking of the spraying area according to the polishing requirement, realize precise and quantitative spraying of the polishing liquid 102, improve the intelligence of the chemical mechanical polishing process, reduce the waste of the polishing liquid 102, and improve the application range of the chemical mechanical polishing process and the yield of the manufactured semiconductor device.

With continued reference to fig. 1, the motion mechanism 10 may include a horizontal moving assembly 11, a lifting assembly 12, and a rotating shaft 13, where the horizontal moving assembly 11 is installed on the cmp apparatus 101 to drive the slurry supply arm 20 to perform horizontal motion; the lifting assembly 12 is installed on the horizontal moving assembly 11 to drive the grinding fluid supply arm 20 to vertically move; the rotating shaft 13 is mounted on the lifting assembly 12; a circular hole (not shown) may be formed in an end surface of one end 20a of the polishing liquid supply arm 20, and the polishing liquid supply arm 20 is coupled to the rotation shaft 13 through the circular hole, so that the polishing liquid supply arm 20 is movably mounted to the rotation shaft 13. The controller 40 can control at least one of the motion mechanism 10, the polishing liquid supply arm 20 and the nozzle 30 to make the polishing liquid supply arm 20 perform at least one of horizontal motion, vertical motion and rotational motion along with the motion mechanism 10, so as to adjust the inclination angle of the polishing liquid supply arm 20 relative to the polishing pad 103, and the horizontal distance and vertical distance between the polishing liquid supply arm 20 and the polishing pad 103; in order to intelligently control the fan-shaped outlet portion 32 to reduce the opening degree through the controller during the chemical mechanical polishing process, and control the motion mechanism 10 or the polishing liquid supply arm 20 to perform at least one of horizontal motion, vertical motion and rotation motion, so as to control the fan-shaped outlet portion 32 to spray the polishing liquid 102 on the target area on the polishing pad 103 in a targeted manner, and then polish the wafer (W) under the polishing head 104 on the polishing pad 103 under the action of the polishing head 104.

In some embodiments, referring to fig. 1-2, the slurry supply arm 20 is an arc arm, and the slurry supply arm 20 has a plurality of holes 21 arranged in an array, and the cleaning agent sprays the cleaning nozzle 30 through the holes 21 on the slurry supply arm 20. For example, the cleaning agent may be deionized water or distilled water, etc. After the polishing liquid 102 is sprayed by the polishing liquid supply device 100, distilled water can be sprayed through the holes 21 on the polishing liquid supply arm 20 to clean the polishing liquid supply arm 20 and the nozzle 30, so that the residual polishing liquid 102 is prevented from corroding the polishing liquid supply arm 20 or the nozzle 30, and the service life of the polishing liquid supply arm is reduced. In addition, in this embodiment, the direction in which the cleaning agent is sprayed out through the holes 21 on the polishing liquid supply arm 20 can be changed by changing the shape of the holes 21, and the spraying directions of the plurality of holes 21 can be set to be different, so that the sprayed cleaning agent can cover the polishing liquid supply arm 20 and the nozzle 30 entirely, and the cleaning efficiency and quality can be improved.

In some embodiments, please continue to refer to fig. 1 and 3, the fan-shaped outlet portion 32 includes a plurality of baffles 321m, the plurality of baffles 321m converge from one end 321a to the other end 321b, and the plurality of baffles 321m converge to the communicating pipe portion 31, wherein the plurality of baffles 321m form a "W" shaped structure 200, and an opening width d1 of the "W" shaped structure 200 is adjustable. The opening width d1 of the "W" shaped structure 200 may be increased by increasing the opening of the fan-shaped outlet portion 32; the opening width d1 of the "W" -shaped structure 200 may also be reduced by decreasing the opening of the fan-shaped outlet portion 32.

In other embodiments, referring to fig. 4-5, the fan-shaped outlet portion 32 includes a shaft 322 and a plurality of baffles 321n, and the shaft 322 is connected to the communicating tube portion 31; the plurality of baffles 321n are mounted on the shaft 322 along the circumferential direction of the shaft 322, the plurality of baffles 321n are in a V-shaped structure 300, and the opening width d2 of the V-shaped structure 300 is adjustable. In some embodiments, the diameter of the shaft 322 may be set to gradually increase in the direction in which the flow passage of the communicating pipe portion 31 extends away from the communicating pipe portion 31. In some embodiments, the slurry supply device 100 may adjust the size of the opening width d2 of the V-shaped structure 300 by adjusting the angle between the shaft 322 and the communicating pipe 31. For example, the polishing liquid supply apparatus 100 may increase the value of the opening width d2 of the "V" -shaped structure 300 by decreasing the angle between the shaft 322 and the communicating pipe portion 31; conversely, the polishing liquid supply apparatus 100 can decrease the value of the opening width d2 of the "V" -shaped structure 300 by increasing the angle between the shaft 322 and the communicating pipe portion 31. It should be noted that, whether the "W" shaped structure 200 or the "V" shaped structure 300, the plurality of baffles 321m or the plurality of baffles 321n may be provided with arc-shaped connection surfaces at the connection positions, that is, the flow channel surfaces formed at the bending positions of the "W" shaped structure 200 or the "V" shaped structure 300 are smooth, so that the slurry is prevented from being retained at the corners, and the subsequent polishing process is prevented from being affected.

In other embodiments, referring to fig. 6-8, the fan-shaped outlet portion 32 includes a fan-shaped plate 3201 and a plurality of guide plates 323, and the fan-shaped plate is connected to the communicating pipe portion 31; the plurality of guide plates 323 are disposed on the sector plate to divide the sector plate into the plurality of guide grooves 324, wherein a size of the sector plate 3201 is adjustable to adjust an opening degree of the plurality of guide grooves 324. For example, the slurry supply apparatus 100 may increase the size of the sector plate 3201 by increasing the extent of the sector plate 3201, thereby increasing the opening of the plurality of flow guide grooves 324; conversely, the slurry supply apparatus 100 may reduce the size of the sector plate 3201 by reducing the extent of the sector plate 3201, thereby reducing the opening of the plurality of flow guide grooves 324. By using the plurality of flow guide grooves 324 to precisely guide the polishing liquid to different positions of the polishing pad 103, the polishing liquid 102 can be prevented from splashing outside the nozzle 30, resulting in contamination of the polishing liquid.

In some embodiments, referring to fig. 6-8, the outlet ends of the plurality of diversion trenches 324 are in a fan-shaped distribution, and correspond to a plurality of different positions on a straight line where a diameter of the polishing pad 103 is located at intervals, the outlet ends of the plurality of diversion trenches 324 may be arranged one-to-one with the plurality of positions, and the flow rates of the different diversion trenches 324 are the same, so that the plurality of diversion trenches 324 are utilized to evenly divert the polishing liquid to the different positions distributed in the radial direction of the polishing pad 103, thereby realizing precise quantitative spraying of the polishing liquid.

In some embodiments, referring to fig. 6-8, a polishing liquid may be provided, which includes an Abrasive (abraive), a surfactant, a PH buffer glue, an oxidizing agent, a preservative, and the like, so as to uniformly guide the polishing liquid to different positions of the polishing pad 103 radially distributed by using a plurality of guide grooves 324, improve the uniformity of the distribution of the polishing liquid on the polishing pad 103, and prevent the polishing liquid from splashing outside the nozzle 30, thereby causing contamination of the polishing liquid.

In some embodiments, referring to fig. 6-8, the height h of the flow channel sidewall 3241 of different flow channels 324 can be set to be equal, so that the flow rate of the flow channel 324 can be adjusted by adjusting the width w of the flow channel sidewall 3241, and the complexity of flow control of different flow channels 324 can be simplified. The height h of the flow channel sidewall 3241 may be set to be less than or equal to the width w, and may be set to be 0.3 w.ltoreq.h.ltoreq.w, for example, the height h of the flow channel sidewall 3241 may be 0.3w, 0.4w, 0.5w, 0.6w, 0.7w, 0.8w, 0.9w or w, etc. to increase the coverage length of the polishing liquid sprayed by the single flow guide groove 324 in the radial direction of the polishing pad 103 as much as possible. By setting different width values w of different diversion trenches 324, the distribution density of the diversion trenches 324 is set so as to meet different requirements of specific application scenes on the dispersion track and/or dispersion direction of the grinding fluid.

In some embodiments, referring to fig. 9-12, the polishing liquid supply apparatus 100 further includes an opening adjusting component 50, a first sensor 61, and/or a second sensor 62; the first sensor 61 is communicatively connected to the controller 40, and is configured to generate a sensing signal including a rotational speed value of the polishing pad 103; the second sensor 62 is communicatively connected to the controller 40 for generating a sensing signal comprising a distance value between the fan-shaped outlet portion 32 and the polishing pad 103; the opening adjustment assembly 50 is communicatively connected to the controller 40 for generating a target control signal for adjusting the opening of the fan-shaped outlet portion 32 in response to the controller 40 based on the acquired sensing signals of the first sensor 61 and/or the second sensor 62.

In some embodiments, please continue with reference to fig. 9-12, the sensing signals include an initial sensing signal and a detected sensing signal; the first sensor 61 includes an infrared emitter 611 and an infrared receiver 612, where the infrared emitter 611 may be disposed on a fixing portion of the cmp apparatus 101, for example, on a supporting frame for supporting the polishing liquid supply apparatus 100, so as to emit an infrared signal, thereby avoiding inaccurate measurement of the rotation speed value of the polishing pad 103 caused by movement of the infrared emitter 611. The infrared receiver 612 is disposed on the polishing pad 103 and connected to the controller 40, and is configured to generate an initial sensing signal when the infrared receiver 612 is first located at the detection position, and generate a detection sensing signal when the polishing pad 103 is rotated to the detection position for a second time; the controller 40 is further configured to: the rotation speed value of the polishing pad 103 is calculated based on the time of generation of the detection sensing signal, the time of generation of the initial sensing signal, and the distance information between the initial position and the detection position.

In some embodiments, referring to FIGS. 9-12, a detection position may be positioned adjacent to the fixed mounting position of the infrared emitter 611, and the infrared receiver 612 may detect the infrared signal emitted by the infrared emitter 611 only when rotated to the detection position following the polishing pad 103. Therefore, the controller 40 can calculate the rotation speed value V of the polishing pad 103 according to the formula v=d/(t 1-t 2) based on the generation time t1 of the detection sensing signal, the generation time t2 of the initial sensing signal, and the distance information D between the initial position and the detection position.

In some embodiments, please continue to refer to fig. 9-12, the second sensor 62 may also be configured as a height sensor, and the height sensor is disposed at the outlet end of the fan-shaped outlet portion 32, for detecting and generating a sensing signal of the distance value between the fan-shaped outlet portion 32 and the polishing pad 103, so as to accurately obtain the distance value between the outlet end of the fan-shaped outlet portion 32 and the polishing pad 103.

In some embodiments, referring to fig. 9-12, the controller 40 is further configured to: acquiring a preset comparison table, wherein the preset comparison table comprises size values corresponding to different rotating speed values and/or distance values; inquiring a preset comparison table according to the induction signals, and acquiring target size values corresponding to the rotating speed values and/or the distance values contained in the induction signals in the preset comparison table; a target control signal containing a target size value is generated, the target control signal being used to control the opening adjustment assembly 50 to adjust the size of the fan-shaped outlet portion 32 to the target size value.

In some embodiments, referring to fig. 1 and fig. 9-12, when the rotation speed of the polishing pad 103 is high, the controller 40 may generate a target control signal including a target size value by referring to a preset reference table, so as to control the opening adjustment assembly 150 to adjust the sizes of the plurality of diversion trenches 324 to reduce to the corresponding target size values based on the target control signal, thereby reducing the sizes and/or the flow rates of the plurality of diversion trenches 324; conversely, when the rotation speed of the polishing pad 103 is slower, the controller 40 can control the opening adjusting assembly 150 to adjust the size of the plurality of diversion trenches 324 to increase to the corresponding target size value, thereby increasing the size and/or flow rate of the plurality of diversion trenches 324.

In some embodiments, please continue to refer to fig. 11-12, the opening adjusting assembly 50 includes a middle nest portion 51, a main rib 52 and a sub rib 53, wherein the middle nest portion 51 is coaxially disposed with the outlet end 31a of the communicating pipe portion 31 for moving along the extending direction (such as oz direction) of the shaft; the fan-shaped outlet portion 32 surrounds the middle nest portion 51; the main rib 52 is arranged corresponding to the flow passage side wall of the fan-shaped outlet part 32, is arranged on the bottom surface of the fan-shaped outlet part 32, and has the extending direction consistent with the extending direction of the top surface of the flow passage side wall, and the proximal end 52a of the main rib 52 is close to the outlet end 31a of the communicating pipe part 31; one end of the auxiliary rib 53 is connected with the middle part of the main rib 52, and the other end is connected with the middle nest portion 51, and is used for moving along with the middle nest portion 51 and driving the main rib 52 to move, and the height of the side wall of the runner and the distance between the side walls of the adjacent runners are adjusted so as to change the opening of the fan-shaped outlet portion 32.

In some embodiments, referring to fig. 10-12, the opening adjusting assembly 50 further includes a moving portion (not shown) connected to the controller 40 for moving along an extending direction (e.g. oz direction) of an axis of the communicating pipe portion 31 in response to a target control signal, so as to drive the middle nest portion 51 to move along the oz direction.

In some embodiments, referring to fig. 10-13, the target control signal includes a turn-up control signal and a turn-down control signal; the moving part includes a servo motor 54, and the servo motor 54 is connected to the controller 40, and is configured to move in a direction along an extending direction (for example, oz direction) of an axis of the communicating pipe part 31 and a direction close to the outlet end 31a of the communicating pipe part 31 in response to the tuning control signal, and drive the middle nest part 51 to move in the oz direction and a direction close to the outlet end 31a of the communicating pipe part 31, so as to increase an opening degree of the fan-shaped outlet part 32; or the servo motor 54 is used for responding to the reduction control signal, moving along the oz direction and away from the outlet end 31a of the communicating pipe part 31, and driving the middle nest part 51 to move along the oz direction and away from the outlet end 31a of the communicating pipe part 31, so as to reduce the opening degree of the fan-shaped outlet part 32.

In some embodiments, referring to fig. 10-12 and 14, the control signals include a turn-up control signal and a turn-down control signal; the moving part comprises a cam 55, the cam 55 is connected with the controller 40, and the rotating surface of the cam 55 is intersected with the grinding pad 103; the cam 55 is configured to rotate the protruding portion thereof in a direction approaching the outlet end of the communicating pipe portion 31 in response to the turn-up control signal, and drive the middle nest portion 51 to move in a direction along the extending direction (for example, oz direction) of the axis of the communicating pipe portion 31 and approaching the outlet end 31a of the communicating pipe portion 31, so as to increase the opening degree of the fan-shaped outlet portion 32; or the cam 55 is used for responding to the turn-down control signal, so that the protruding part of the cam rotates along the direction away from the outlet end 31a of the communicating pipe part 31, and the middle nest part 51 is driven to move along the oz direction and away from the outlet end 31a of the communicating pipe part 31, so that the opening degree of the fan-shaped outlet part 32 is reduced.

As an example, referring to fig. 11-12, the present disclosure provides a method for controlling a polishing liquid supply apparatus, the polishing liquid supply apparatus including a motion mechanism 10, a polishing liquid supply arm 20, and a nozzle 30, the motion mechanism 10 being mounted on a chemical mechanical polishing device 101; one end 20a of the polishing liquid supply arm 20 is movably mounted on the movement mechanism 10; the nozzle 30 is mounted on the other end 20b of the polishing liquid supply arm 20 and is positioned above the polishing pad 103 of the chemical mechanical polishing apparatus 101, the nozzle 30 comprises a communicating pipe part 31 and a fan-shaped outlet part 32 communicated with the communicating pipe part 31, wherein the opening degree of the fan-shaped outlet part 32 is adjustable, and the polishing liquid 102 is dispersed on the polishing pad 103 through the polishing liquid supply arm 20 and the nozzle 30; the controller is connected to the movement mechanism 10, the polishing liquid supply arm 20 and the nozzle 30, and is used for controlling at least one of the movement mechanism 10, the polishing liquid supply arm 20 and the nozzle 30 to operate, and the polishing liquid supply device control method comprises the following steps:

step S20: acquiring an induction signal, wherein the induction signal comprises a rotating speed value of the polishing pad 103 and/or a distance value between the outlet end of the fan-shaped outlet part 32 and the polishing pad 103;

step S40: generating a target control signal according to the induction signal;

step S60: the size of the fan-shaped outlet portion 32 is adjusted by controlling at least one of the movement mechanism 10, the slurry supply arm 20, and the nozzle 30 according to the target control signal, so as to change the track of the slurry dispersed on the polishing pad.

As an example, please continue to refer to fig. 11-12, by obtaining a sensing signal including a rotation speed value of the polishing pad 103 and/or a distance value between the outlet end of the fan-shaped outlet portion 32 and the polishing pad 103, generating a target control signal according to the sensing signal; by arranging one end 20a of the grinding fluid supply arm 20 movably mounted on the movement mechanism 10 and arranging a controller, at least one of the movement mechanism 10, the grinding fluid supply arm 20 and the nozzle 30 can be controlled, so that the grinding fluid supply arm 20 can perform at least one of horizontal movement, vertical movement and rotary movement along with the movement mechanism 10, and the inclination angle of the grinding fluid supply arm 20 relative to the grinding pad 103, and the horizontal distance and the vertical distance between the grinding fluid supply arm 20 and the grinding pad 103 can be adjusted; through setting up the nozzle 30 of installing in grinding fluid supply arm 20 other end 20b and including communicating pipe portion 31 and the fan-shaped outlet portion 32 of communicating pipe portion 31, the aperture of fan-shaped outlet portion 32 is adjustable for the controller can intelligent control fan-shaped outlet portion 32 increases the aperture, increases the coverage area of dispersion to grinding fluid on the grinding pad 103, avoids producing grinding fluid and piles up and the uneven technical problem of dispersion on the grinding pad 103, improves grinding fluid 102 and distributes uniformity and saturation on the grinding pad 103, thereby improves the performance and the reliability of chemical mechanical polishing equipment 101. The polishing liquid supply apparatus 100 can also control the fan-shaped outlet portion 32 to reduce the opening degree through the controller intelligently during the process of executing the chemical mechanical polishing process, and control the movement mechanism 10 or the polishing liquid supply arm 20 to perform at least one of horizontal movement, vertical movement and rotational movement, so as to control the fan-shaped outlet portion 32 to spray the polishing liquid 102 on the target area on the polishing pad 103 pertinently, so as to realize intelligent locking of the spraying area according to the polishing requirement, realize precise and quantitative spraying of the polishing liquid 102, improve the intelligence of the chemical mechanical polishing process, reduce the waste of the polishing liquid 102, and improve the application range of the chemical mechanical polishing process and the yield of the manufactured semiconductor device.

As an example, generating the target control signal from the sensing signal in step S40 may include:

step S42: acquiring a preset comparison table, wherein the preset comparison table comprises size values corresponding to different rotating speed values and/or distance values;

step S44: inquiring a preset comparison table according to the induction signals, and acquiring target size values corresponding to the rotating speed values and/or the distance values contained in the induction signals in the preset comparison table;

step S46: a target control signal including a target size value is generated, the target control signal being used to control the opening adjustment assembly to adjust the size of the fan-shaped outlet portion to the target size value.

As an example, please continue to refer to fig. 1 and 10-12, a preset reference table may be designed according to actual requirements of a specific application scenario, so as to pre-store the preset reference table in the controller 40, so that the controller 40 can query the preset reference table according to the sensing signal, generate a target control signal including a target size value, and thereby control the opening adjustment component 150 to adjust the sizes of the plurality of diversion trenches 324 to the target size value based on the target control signal, so as to complete intelligent adjustment of the sizes and flow rates of the plurality of diversion trenches 324.

In some embodiments, referring to fig. 9-12, the sensing signals include an initial sensing signal and a detected sensing signal; the first sensor 61 includes an infrared emitter 611 and an infrared receiver 612, where the infrared emitter 611 may be disposed on a fixing portion of the cmp apparatus 101, for example, on a supporting frame for supporting the polishing liquid supply apparatus 100, so as to emit an infrared signal, thereby avoiding inaccurate measurement of the rotation speed value of the polishing pad 103 caused by movement of the infrared emitter 611. The infrared receiver 612 is disposed on the polishing pad 103 and connected to the controller 40, and is configured to generate an initial sensing signal when the infrared receiver 612 is first located at the detection position, and generate a detection sensing signal when the polishing pad 103 is rotated to the detection position for a second time; step S44 may include:

step S442: and calculating the rotating speed value of the polishing pad according to the generating time of the detection sensing signal, the generating time of the initial sensing signal and the distance information between the initial position and the detection position.

In some embodiments, referring to fig. 9-12, the second sensor 62 may also be configured as a height sensor, and the height sensor is disposed at the outlet end of the fan-shaped outlet portion 32, for detecting and generating a sensing signal of the distance value between the fan-shaped outlet portion 32 and the polishing pad 103, so as to accurately obtain the distance value between the outlet end of the fan-shaped outlet portion 32 and the polishing pad 103.

In some embodiments, referring to fig. 1 and fig. 9-12, when the rotation speed of the polishing pad 103 is high, the controller 40 may generate a target control signal including a target size value by referring to a preset reference table, so as to control the opening adjustment assembly 150 to adjust the sizes of the plurality of diversion trenches 324 to reduce to the corresponding target size values based on the target control signal, thereby reducing the sizes and the flow rates of the plurality of diversion trenches 324; conversely, when the rotation speed of the polishing pad 103 is slower, the controller 40 can control the opening adjusting assembly 150 to adjust the size of the plurality of diversion trenches 324 to increase to the corresponding target size value, thereby increasing the size and flow rate of the plurality of diversion trenches 324.

In some embodiments, referring to fig. 11-12, the opening adjusting assembly 50 includes a middle nest portion 51, a main rib 52 and a sub rib 53, wherein the middle nest portion 51 is coaxially disposed with the outlet end 31a of the communicating pipe portion 31 for moving along the extending direction (such as oz direction) of the shaft; the fan-shaped outlet portion 32 surrounds the middle nest portion 51; the main rib 52 is arranged corresponding to the flow passage side wall of the fan-shaped outlet part 32, is arranged on the bottom surface of the fan-shaped outlet part 32, and has the extending direction consistent with the extending direction of the top surface of the flow passage side wall, and the proximal end 52a of the main rib 52 is close to the outlet end 31a of the communicating pipe part 31; one end of the auxiliary rib 53 is connected with the middle part of the main rib 52, and the other end is connected with the middle nest portion 51, and is used for moving along with the middle nest portion 51 and driving the main rib 52 to move, and the height of the side wall of the runner and the distance between the side walls of the adjacent runners are adjusted so as to change the opening of the fan-shaped outlet portion 32.

Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in embodiments provided by the present disclosure may include non-volatile and/or volatile memory.

In some embodiments, a computer device is provided, comprising a memory having a computer program stored therein and a processor, which when executing the computer program, performs the steps of the method of any one of the above-described slurry supply apparatus control methods. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The communication interface of the computer device is used for carrying out wired or wireless communication with an external terminal, and the wireless mode can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer program, when executed by the processor, implements a method of controlling a slurry supply apparatus. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, can also be keys, a track ball or a touch pad arranged on the shell of the computer equipment, and can also be an external keyboard, a touch pad or a mouse and the like.

In some embodiments, a computer readable storage medium is provided, on which a computer program is stored which, when executed by a processor, implements the steps of the method of any one of the above-described slurry supply apparatus control methods.

In some embodiments, a computer program product is provided comprising a computer program which, when executed by a processor, implements the steps of the method of any one of the above-described slurry supply control methods.

It should be noted that, the user information (including, but not limited to, user equipment information, user personal information, etc.) and the data (including, but not limited to, data for analysis, stored data, presented data, etc.) related to the present disclosure are information and data authorized by the user or sufficiently authorized by each party.

Note that the above embodiments are for illustrative purposes only and are not meant to limit the present disclosure.

In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described by differences from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

Those skilled in the art will appreciate that implementing all or part of the above described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed, may comprise the steps of the embodiments of the methods described above. Any reference to memory, database, or other medium used in embodiments provided by the present disclosure may include at least one of non-volatile and volatile memory, among others. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, high density embedded nonvolatile Memory, resistive random access Memory (ReRAM), magnetic random access Memory (Magneto-resistive Random Access Memory, MRAM), ferroelectric Memory (Ferroelectric Random Access Memory, FRAM), phase change Memory (Phase Change Memory, PCM), graphene Memory, and the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory, and the like. By way of illustration, and not limitation, RAM can be in the form of a variety of forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), and the like. The databases referred to in the various embodiments provided by the present disclosure may include at least one of a relational database and a non-relational database. The non-relational database may include, but is not limited to, a blockchain-based distributed database, and the like. The processors involved in the embodiments provided by the present disclosure may be general-purpose processors, central processing units, graphics processors, digital signal processors, programmable logic, quantum computing-based data processing logic, etc., without limitation thereto. The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples represent only a few embodiments of the present disclosure, which are described in more detail and detail, but are not to be construed as limiting the scope of the disclosure. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure.

Claims

1. A polishing liquid supply device, characterized by being applied to a chemical mechanical polishing apparatus, comprising:

the motion mechanism is arranged on the chemical mechanical polishing equipment;

one end of the grinding fluid supply arm is movably arranged on the movement mechanism;

a nozzle installed at the other end of the polishing liquid supply arm and above a polishing pad of the chemical mechanical polishing apparatus, the nozzle including a communication pipe portion and a fan-shaped outlet portion communicating with the communication pipe portion, wherein an opening of the fan-shaped outlet portion is adjustable, and the polishing liquid is dispersed onto the polishing pad through the polishing liquid supply arm and the nozzle;

the controller is connected with the motion mechanism, the grinding fluid supply arm and the nozzle and is used for controlling at least one of the motion mechanism, the grinding fluid supply arm and the nozzle to act so as to change the track of the grinding fluid dispersed on the grinding pad;

The grinding liquid supply arm is an arc-shaped arm, the grinding liquid supply arm is provided with a plurality of holes which are arranged in an array, and the cleaning agent sprays and cleans the nozzle through the holes on the grinding liquid supply arm.

2. The slurry supply device according to claim 1, wherein the slurry supply arm is configured to at least one of move horizontally, vertically, and rotationally following the movement mechanism.

3. The polishing liquid supply apparatus according to claim 1, wherein the fan-shaped outlet portion includes:

the plurality of baffles, a plurality of baffles are converged from one end to the other end, a plurality of baffles are converged to communicating pipe portion, wherein, be "W" column structure between a plurality of baffles, the opening width of "W" column structure is adjustable.

4. The polishing liquid supply apparatus according to claim 1, wherein the fan-shaped outlet portion includes:

a shaft rod connected to the communication pipe portion;

the baffles are arranged on the shaft rod along the circumferential direction of the shaft rod, a V-shaped structure is arranged among the baffles, and the opening width of the V-shaped structure is adjustable.

5. The polishing liquid supply apparatus according to claim 1, wherein the fan-shaped outlet portion includes:

a sector plate connected to the communication pipe portion;

the fan-shaped plate is divided into a plurality of diversion trenches by the plurality of diversion plates, wherein the size of the fan-shaped plate is adjustable so as to adjust the opening of the diversion trenches.

6. The polishing liquid supply apparatus according to any one of claims 1 to 5, further comprising an opening adjusting assembly, a first sensor, and/or a second sensor;

the first sensor is in communication connection with the controller and is used for generating a sensing signal containing the rotating speed value of the grinding pad;

the second sensor is in communication connection with the controller and is used for generating a sensing signal containing a distance value between the fan-shaped outlet part and the grinding pad;

the opening adjusting component is in communication connection with the controller and is used for responding to the control signal generated by the controller based on the acquired sensing signals of the first sensor and/or the second sensor and adjusting the opening of the fan-shaped outlet.

7. The slurry supply of claim 6, wherein the controller is further configured to:

Acquiring a preset comparison table, wherein the preset comparison table comprises different rotating speed values and/or size values corresponding to the distance values;

inquiring the preset comparison table according to the induction signal, and acquiring a target size value corresponding to a rotating speed value and/or a distance value contained in the induction signal in the preset comparison table;

generating a target control signal containing the target size value, wherein the target control signal is used for controlling the opening adjusting assembly to adjust the size of the fan-shaped outlet part to the target size value.

8. The polishing liquid supply apparatus according to claim 7, wherein the sensing signal includes an initial sensing signal and a detection sensing signal; the first inductor includes:

the infrared transmitter is arranged on the chemical mechanical polishing equipment and used for transmitting infrared signals;

the infrared receiver is arranged on the grinding pad, connected with the controller and used for generating an initial induction signal when the infrared receiver is positioned at the detection position for the first time and generating the detection induction signal when the infrared receiver is rotated to the detection position for the second time along with the grinding pad;

the controller is further configured to:

and calculating the rotating speed value of the polishing pad according to the generating time of the detection sensing signal, the generating time of the initial sensing signal and the distance information between the initial position and the detection position.

9. The polishing liquid supply apparatus according to claim 7, wherein the opening degree adjusting unit comprises:

the middle nest part is coaxially arranged with the outlet end of the communicating pipe part and is used for moving along the extending direction of the shaft; the fan-shaped outlet part surrounds the middle nest part;

the main umbrella rib is arranged corresponding to the flow passage side wall of the fan-shaped outlet part, is arranged on the bottom surface of the fan-shaped outlet part, and has the extending direction consistent with the extending direction of the top surface of the flow passage side wall, and the proximal end of the main umbrella rib is close to the outlet end of the communicating pipe part;

one end of the auxiliary rib is connected with the middle part of the main rib, and the other end of the auxiliary rib is connected with the middle nest part and is used for following the middle nest part to move and drive the main rib to move, and the height of the side wall of the runner and the distance between the side walls of the adjacent runners are adjusted so as to change the opening of the fan-shaped outlet part.

10. The polishing liquid supply apparatus according to claim 9, wherein the opening degree adjusting unit further comprises:

and the moving part is connected with the controller and is used for responding to the target control signal and moving along the extending direction of the shaft so as to drive the middle nest part to move along the extending direction of the shaft.

11. The polishing liquid supply apparatus according to claim 10, wherein the target control signal includes a turn-up control signal and a turn-down control signal; the moving part includes:

the servo motor is connected with the controller and used for responding to the enlargement control signal, moving along the extending direction of the shaft and in the direction close to the outlet end of the communicating pipe part, and driving the middle nest part to move along the extending direction of the shaft and in the direction close to the outlet end of the communicating pipe part so as to increase the opening of the fan-shaped outlet part; or (b)

And the device is used for responding to the reduction control signal, moving along the extending direction of the shaft and in the direction away from the outlet end of the communicating pipe part, and driving the middle nest part to move along the extending direction of the shaft and in the direction away from the outlet end of the communicating pipe part so as to reduce the opening of the fan-shaped outlet part.

12. The polishing liquid supply apparatus according to claim 10, wherein the control signal includes a turn-up control signal and a turn-down control signal; the moving part includes:

a cam connected to the controller, the rotation surface of the cam intersecting the polishing pad;

the cam is used for responding to the enlargement control signal, so that the protruding part of the cam rotates along the direction close to the outlet end of the communicating pipe part, and the middle nest part is driven to move along the extending direction of the shaft and the direction close to the outlet end of the communicating pipe part, so that the opening degree of the fan-shaped outlet part is increased; or (b)

And the device is used for responding to the reduction control signal, so that the protruding part of the device rotates along the direction away from the outlet end of the communicating pipe part, and drives the middle nest part to move along the extending direction of the shaft and the direction away from the outlet end of the communicating pipe part, thereby reducing the opening of the fan-shaped outlet part.