CN116156733A - Printed wiring board, power calculating board and electronic equipment - Google Patents
Printed wiring board, power calculating board and electronic equipment Download PDFInfo
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- CN116156733A CN116156733A CN202111385603.4A CN202111385603A CN116156733A CN 116156733 A CN116156733 A CN 116156733A CN 202111385603 A CN202111385603 A CN 202111385603A CN 116156733 A CN116156733 A CN 116156733A
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- liquid
- circuit layer
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- cooling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present disclosure relates to a printed wiring board, a power board, and an electronic device, the printed wiring board including: a liquid-cooled heat sink, wherein the liquid-cooled heat sink has a first surface and a second surface; wherein the second surface is opposite to the first surface; a first circuit layer located on the first surface, wherein the first circuit layer comprises: a printed circuit; a second circuit layer located on the second surface, wherein the second circuit layer comprises: and (3) a printed circuit. The circuit wiring area is increased. The heat exchange is performed in a liquid cooling mode with higher heat dissipation efficiency, so that the heat dissipation efficiency of electronic components on the circuit layer is improved, and the heat dissipation requirement of the high-power integrated circuit chip is further met.
Description
Technical Field
The disclosure relates to the technical field of circuit boards, and in particular relates to a printed circuit board, a power board and electronic equipment.
Background
Integrated circuit chips, such as application specific integrated circuit (ASIC, application Specific Integrated Circuit) chips, that operate at high speeds in super computing devices, generate a significant amount of heat during operation, and when heat is accumulated to some extent, the integrated circuit chip temperature increases, causing the integrated circuit chip to have a reduced operating capacity and burn out. Therefore, for the integrated circuit chip generating heat, a heat dissipation device is generally arranged to dissipate heat of the integrated circuit chip, so as to reduce the temperature of the integrated circuit chip in operation.
Disclosure of Invention
The present disclosure provides a metal-based wiring board, a circuit board, and an electronic device.
According to a first aspect of embodiments of the present disclosure, there is provided a printed wiring board comprising:
a liquid-cooled heat sink, wherein the liquid-cooled heat sink has a first surface and a second surface; wherein the second surface is opposite to the first surface;
a first circuit layer located on the first surface, wherein the first circuit layer comprises: a printed circuit;
a second circuit layer located on the second surface, wherein the second circuit layer comprises: and (3) a printed circuit.
In one embodiment, the liquid-cooled heat sink comprises:
a thermally conductive bracket; wherein, the heat conduction bracket is internally provided with a liquid cooling channel;
the liquid cooling channel is internally provided with cooling liquid.
In one embodiment, the thermally conductive holder comprises:
a metal substrate, the liquid cooling channel comprising: at least one through hole is formed in the metal substrate.
In one embodiment, the metal substrate is an aluminum substrate.
In one embodiment, the liquid cooling channel comprises: the cooling device is provided with a liquid inlet for the cooling liquid to flow in and a liquid outlet for the cooling liquid to flow out;
The liquid inlet is used for being communicated with the heat exchange device;
the liquid outlet is used for being communicated with the heat exchange device.
In one embodiment, a plurality of the liquid cooling channels are arranged in parallel and isolated from each other.
In one embodiment of the present invention, in one embodiment,
a first insulating layer is arranged between the first circuit layer and the liquid cooling radiator;
and a second insulating layer is arranged between the second circuit layer and the liquid cooling radiator.
According to a second aspect of embodiments of the present disclosure, there is provided a computing pad comprising: the printed wiring board of the first aspect;
an electronic component, the electronic component comprising at least: a chip; the electronic component is arranged on the first circuit layer and/or the first circuit layer of the printed circuit board.
In one embodiment, the chip comprises: an application specific integrated chip ASIC.
In one embodiment, the chip is electroplated with a metallic thermally conductive layer;
the metal heat conduction layer is electrically connected with the first circuit layer or the second circuit layer through the soldering tin layer.
According to a third aspect of embodiments of the present disclosure, there is provided an electronic device comprising: the power board of the second aspect.
The embodiment of the disclosure provides a printed circuit board, a liquid cooling radiator, wherein the liquid cooling radiator is provided with a first surface and a second surface; wherein the second surface is opposite to the first surface; a first circuit layer located on the first surface, wherein the first circuit layer comprises: a printed circuit; a second circuit layer located on the second surface, wherein the second circuit layer comprises: and (3) a printed circuit. Therefore, by arranging the circuit layers on the two surfaces of the liquid cooling radiator, on one hand, the two circuit layers are arranged on the two surfaces of the liquid cooling radiator, and compared with a single circuit layer, the circuit wiring area is increased. On the other hand, because the first circuit layer and the second circuit layer are attached to the surface of the liquid cooling radiator, the heat conduction area is large, and the heat generated by the circuit layers can be directly conducted to the liquid cooling radiator, so that the liquid cooling radiator has high heat conduction efficiency. On the other hand, the heat exchange is performed in a liquid cooling mode with higher heat dissipation efficiency, so that the heat dissipation efficiency of electronic components on the circuit layer is improved, and the heat dissipation requirement of the high-power integrated circuit chip is further met.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic view showing a heat dissipation structure of a printed circuit board according to the related art;
FIG. 2 is a schematic diagram of a first printed circuit board structure shown according to an exemplary embodiment;
FIG. 3 is a schematic diagram of a second printed circuit board structure shown according to an exemplary embodiment;
FIG. 4 is a schematic diagram of a third printed circuit board structure shown according to an exemplary embodiment;
FIG. 5 is a schematic diagram of a liquid-cooled heat sink, according to an exemplary embodiment;
FIG. 6 is a schematic cross-sectional view of a liquid-cooled heat sink, according to an example embodiment;
FIG. 7 is a schematic diagram of a fourth printed circuit board structure shown according to an exemplary embodiment;
FIG. 8 is an enlarged partial schematic view of a printed circuit board shown according to an exemplary embodiment;
FIG. 9 is a schematic diagram of a computing plate structure shown according to an example embodiment;
FIG. 10 is a schematic diagram of an electronic device shown in accordance with an exemplary embodiment;
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus consistent with some aspects of the disclosure as detailed in the accompanying claims.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and are not to be construed as limiting the present invention.
In the description of the invention, "a plurality" means two or more, and "a number" means one or more.
As shown in fig. 1, an integrated circuit chip (110) for high-speed operation in a super computing device is soldered to a circuit layer (131) of a PCB (130) through a solder layer (120). The integrated circuit chip (110) comprises a crystal grain (Die) (111) for performing operation and generating heat and a metal heat conduction layer (111), wherein Die (111) refers to a body of an unpackaged integrated circuit manufactured by semiconductor materials. The metal heat conductive layer (111) may include: wires electrically connected to the outside of Die (111), heat conductors for conducting heat generated by Die (111), and the like. The metal heat conductive layer (111) may be copper. The PCB (130) board includes: a substrate (132), and a circuit layer (131) disposed on the substrate (132), wherein the circuit layer (131) may include, but is not limited to, an etched copper-clad layer.
For the heat dissipation of the integrated circuit chip (110) shown in fig. 1, a heat dissipation device (140) such as a metal heat sink may be disposed above the Die (111), and heat generated by the Die (111) is conducted to the heat dissipation device (140) by heat conduction to form heat exchange, so as to reduce the temperature of the integrated circuit chip (110).
In order to ensure good direct contact between Die (111) and heat sink (140), a heat transfer medium (150), such as heat dissipating silicone, is typically disposed between Die (111) and heat sink (140).
Along with the fact that the operation capability of the integrated circuit chip (110) is not enhanced, heat generated by the integrated circuit chip (110) is higher and higher, and heat resistance of a heat conduction medium (150) between the Die (111) and the heat radiating device (140) cannot meet heat conduction, namely, the heat radiating requirement of the integrated circuit chip (110) cannot be met, and further the working performance of the integrated circuit chip is affected.
Therefore, how to improve the heat dissipation efficiency of the integrated circuit chip and meet the heat dissipation requirement of the high-power integrated circuit chip is a problem to be solved.
In an embodiment of the present invention, as shown in fig. 2, a printed circuit board 200 is provided: comprising the following steps:
a liquid-cooled heat sink 210, wherein the liquid-cooled heat sink 210 has a first surface 211 and a second surface 212; wherein the second surface 212 is opposite to the first surface 211;
A first circuit layer 220 located on the first surface 211, wherein the first circuit layer 220 includes: a printed circuit;
a second circuit layer 230 located on the second surface 212, wherein the second circuit layer 230 comprises: and (3) a printed circuit.
The liquid-cooled radiator 210 may be made of a material having a high heat conduction capability, such as a metal material or a composite material. The printed circuits of the first circuit layer 220 and the printed circuits of the second circuit layer 230 may include, but are not limited to: etched copper-clad layers, and the like. The printed circuit may be used to connect electronic components. The electronic components may include, but are not limited to: power devices that generate heat, integrated circuit chips that perform a large number of calculations, such as high power computing chips like ASICs that are used in super computing devices, and the like.
The liquid-cooled radiator 210 may exchange heat with a cooling liquid. A liquid cooling channel through which a cooling liquid flows may be provided in the liquid cooling radiator 210 or the outer surface of the liquid cooling radiator 210, but not limited thereto. The liquid cooling channel provided on the surface of the liquid cooling radiator 210 may be a metal pipe or the like that is in close contact with the surface of the liquid cooling radiator 210 by welding or the like.
The cooling liquid flowing through the liquid cooling channel can have a lower temperature, and the cooling liquid exchanges heat with the liquid cooling radiator 210 with a higher temperature, so that the temperature of the liquid cooling radiator 210 is reduced, and the effect of radiating heat for electronic components is achieved. The cooling fluid includes, but is not limited to: water removal, ethanol, electronic fluorination and/or mineral oil.
In one embodiment, as shown in fig. 3, a first insulating layer 240 is disposed between the first circuit layer 220 and the liquid-cooled heat sink 210; a second insulating layer 250 is disposed between the second circuit layer 230 and the liquid-cooled heat sink 210.
The material used for the liquid-cooled heat sink 210 may cause abnormal operation of the printed circuit, for example, the printed circuit may be shorted, and/or impedance mismatched due to the high conductivity of the material used for the liquid-cooled heat sink 210. The conductivity threshold for the printed circuit short and/or impedance mismatch may be preset, and when the conductivity of the material used for the liquid-cooled heat sink 210 exceeds the conductivity threshold, it may be determined that the liquid-cooled heat sink 210 has short circuited the printed circuit, and/or has impedance mismatch, and so on.
In order to reduce the influence of the liquid-cooled radiator 210 on the printed circuit, a first insulating layer 240 may be disposed between the first circuit layer 220 and the liquid-cooled radiator 210, and a second insulating layer 250 may be disposed between the second circuit layer 230 and the liquid-cooled radiator 210, so as to perform an insulating function between the first circuit layer 220 and the liquid-cooled radiator 210, and between the second circuit layer 230 and the liquid-cooled radiator 210, reduce the influence of the liquid-cooled radiator 210 on the normal operation of the printed circuit, and improve the working stability of the printed circuit.
By way of example, the first insulating layer 240 and the second insulating layer 250 may be made of a highly thermally conductive, highly insulating material. For example, the first insulating layer 240 and the second insulating layer 250 may be polymers filled with ceramic powder. The first insulating layer 240 and the second insulating layer 250 may serve as insulation on the one hand, and on the other hand, heat generated at the first circuit layer 220 and the second circuit layer 230 may be conducted to the liquid-cooled radiator 210 through the first insulating layer 240 and the second insulating layer 250.
As shown in fig. 4, an electronic component 300 such as an integrated circuit chip (IC) is soldered to the first circuit layer 220 and the second circuit layer 230 through a solder layer 270, and the integrated circuit chip includes a Die (Die) 301 for performing an operation and generating heat and a metal heat conductive layer 302, and the metal heat conductive layer 302 may include: wires for electrically connecting Die301 to the outside, heat conductors for conducting heat generated by Die301, and the like. The metal heat conductive layer 302 of the integrated circuit chip is connected to the first circuit layer 220 and the second circuit layer 230 by the solder layer 270.
Electronic components such as integrated circuit chips generate a large amount of heat during operation. Heat may be conducted by the electronic component to the first circuit layer 220 and/or the second circuit layer 230, such as through the metal conductive layer 302 in the integrated circuit chip to the first circuit layer 220 and/or the second circuit layer 230. Meanwhile, for electronic components with higher power, the current on the internal wires of the electronic components and the printed circuit wires connected with the electronic components is higher, and the heat generated by the current on the internal wires and the printed circuit is also higher, and the heat is also accumulated to the first circuit layer 220 and/or the second circuit layer 230. Since the first circuit layer 220 and the second circuit layer 230 cover the surface of the liquid-cooled radiator 210 and have a large contact area, heat collected in the first circuit layer 220 and the second circuit layer 230 can be directly transferred to the liquid-cooled radiator 210.
The heat generated in the first circuit layer 220 and/or the second circuit layer 230 is transferred to the liquid-cooled radiator 210 by heat conduction, and the liquid-cooled radiator 210 exchanges heat with the coolant to the outside, thereby cooling the first circuit layer 220 and/or the second circuit layer 230.
In this way, by providing the circuit layers on the two surfaces of the liquid-cooled radiator 210, on the one hand, providing the two circuit layers on the two surfaces of the liquid-cooled radiator 210 increases the circuit wiring area relative to a single circuit layer. On the other hand, the first circuit layer 220 and the second circuit layer 230 are attached to the surface of the liquid-cooled radiator 210, so that the heat conduction area is large, and the heat generated by the circuit layers can be directly conducted to the liquid-cooled radiator 210, so that the liquid-cooled radiator has high heat conduction efficiency. On the other hand, the heat exchange is performed in a liquid cooling mode with higher heat dissipation efficiency, so that the heat dissipation efficiency of electronic components on the circuit layer is improved, and the heat dissipation requirement of the high-power integrated circuit chip is further met.
In one embodiment, if the coolant has better insulation properties, such as electronic fluorination, the liquid-cooled heat sink 210 may also be completely immersed in the coolant. Therefore, the surface of the whole liquid cooling radiator 210 can directly participate in the heat exchange of the cooling liquid, and the heat dissipation effect is further improved.
In one embodiment, the liquid-cooled heat sink 210 comprises:
a thermally conductive bracket; wherein, the heat conduction bracket is internally provided with a liquid cooling channel;
the liquid cooling channel is internally provided with cooling liquid.
Here, the liquid-cooled radiator 210 may be a heat-conductive bracket provided with a liquid-cooled channel through which the cooling liquid flows.
Illustratively, the thermally conductive holder may be a honeycomb structure with the honeycomb as the liquid cooling channels and the outermost side of the honeycomb structure as the first surface 211 and the second surface 212 of the liquid cooling radiator 210. The shape of the honeycomb may include hexagonal, quadrilateral, any irregular shape, etc. The thermally conductive holder may include one or more honeycomb channels.
The honeycomb structure can be built by different metal partition plates, or can be formed by processing single materials through drilling and the like.
By cooling the liquid flowing through the liquid cooling channels in the heat conducting bracket, on the one hand, the complexity of the structure and manufacturing process caused by the arrangement of the liquid cooling channels outside the liquid cooling radiator 210 can be reduced. On the other hand, the liquid cooling channel is disposed inside the liquid cooling radiator 210, so that the heat exchange path can be shortened, and the heat exchange efficiency can be improved.
In one embodiment, the thermally conductive holder comprises:
A metal substrate, the liquid cooling channel comprising: at least one through hole is formed in the metal substrate.
As shown in fig. 5 and fig. 6, which is a cross-sectional view of fig. 5 in the direction A-A, a liquid cooling channel 213 is provided on a liquid cooling heat sink 210, i.e., a metal substrate, and a PCB using metal as a substrate, i.e., a metal-based PCB, may be used as a printed wiring board. One or more through holes may be provided on the metal substrate as the liquid cooling channels 213.
A first insulating layer 240 is provided between the first circuit layer 220 and the metal substrate; the second circuit layer 230 has a second insulating layer 250 between the metal substrate. The heat of the first circuit layer 220 and the second circuit layer 230 can be conducted to the metal substrate, and the metal substrate exchanges heat with the cooling liquid flowing in the through holes, thereby playing a role in heat dissipation.
Through set up the through-hole as liquid cooling passageway 213 on the metal substrate, do not add additional liquid cooling passageway 213 in addition, on the one hand, simplified the structure of liquid cooling passageway 213, on the other hand liquid cooling passageway 213 sets up in the metal substrate inside, can shorten the heat exchange route, improves the efficiency of heat exchange.
In one embodiment, the metal substrate is an aluminum substrate.
The aluminum substrate has the characteristics of light weight and excellent thermal conductivity. The use of the aluminum substrate can reduce the weight of the printed circuit board 200 on the one hand, and can improve the heat conduction efficiency from the first circuit layer 220 and the second circuit layer 230 to the metal substrate on the other hand, thereby improving the heat dissipation effect.
In one embodiment, the liquid cooling channel 213 includes: the cooling device is provided with a liquid inlet for the cooling liquid to flow in and a liquid outlet for the cooling liquid to flow out;
the liquid inlet is used for being communicated with the heat exchange device;
the liquid outlet is used for being communicated with the heat exchange device.
The cooling liquid can flow into the liquid cooling radiator 210 from the liquid inlet from the outside, and after heat exchange with the liquid cooling radiator 210 is completed, the cooling liquid flows out from the liquid outlet and flows into the heat exchange device.
The heat exchange device is used for performing heat exchange between the cooling liquid and the external environment, reducing the temperature of the cooling liquid flowing out of the liquid-cooled radiator 210, and flowing the cooled cooling liquid into the liquid-cooled radiator 210 from the liquid inlet of the liquid-cooled radiator 210 again.
The heat exchange device may include a first conduit connected to the liquid inlet and a second conduit connected to the liquid outlet. The cooling liquid flows out of the heat exchange device, flows into the liquid cooling channel 213 of the liquid cooling radiator 210 from the liquid inlet after flowing through the heat of the first pipeline, absorbs the heat on the liquid cooling radiator 210 in the liquid cooling channel 213, flows out of the liquid outlet to the second pipeline, and flows back to the heat exchange device, and the heat exchange device exchanges heat between the cooling liquid and the external environment. One first pipe may be connected to a plurality of liquid inlets at the same time, or one first pipe may be connected to one liquid inlet. A second pipeline can be connected with a plurality of liquid outlets at the same time, and also can be connected with a liquid outlet. The heat exchange device may include a heat radiation fin and a heat radiation fan to radiate heat from the coolant flowing through the heat exchange device.
In one embodiment, a plurality of the liquid cooling channels are arranged in parallel and isolated from each other.
The liquid cooling channels can be arranged according to the distribution of the electronic components. The liquid cooling channels may be arranged according to the actual heat distribution. For example, the liquid cooling channels may be uniformly disposed in the metal substrate, so that the metal substrate may uniformly dissipate heat. The liquid cooling channels can be arranged at the positions corresponding to the high-power electronic components in a concentrated mode, and therefore the heat dissipation effect of the heat collection area can be enhanced.
Here, each liquid cooling channel 213 may be provided with a liquid inlet and a liquid outlet, respectively, and the cooling liquid in the plurality of liquid cooling channels 213 may be concentrated in one common heat exchange device to exchange heat with the external environment, or each liquid cooling channel 213 may be connected to one heat exchange device alone, or one heat exchange device may be connected to a predetermined number of liquid cooling channels, for example, one heat exchange device is connected to 3 liquid cooling channels 213.
In one embodiment, the spacing between the liquid cooling channels 213 may be set based on the heat generated by the first circuit layer 220 and/or the second circuit layer 230.
The liquid cooling channels 213 may be provided based on the heat distribution of the circuit layer, for example, in a region where heat is generated, the space between the liquid cooling channels 213 is reduced, so that a larger number of liquid cooling channels 213 may be provided in the same area, thereby improving heat exchange capability. In the region where the amount of generated heat is small, the space between the liquid cooling passages 213 is enlarged.
By adjusting the distance between the liquid cooling channels 213, different areas of the metal substrate have different heat dissipation capacities, and the temperature difference between different areas of the metal substrate is reduced. And the deformation of the metal substrate caused by the temperature difference of different areas is reduced.
As shown in fig. 7, and an enlarged view of a region B in fig. 7, the printed circuit board 200 includes: the liquid-cooled radiator 210, a first circuit layer 220 and a second circuit layer 230 provided on the upper and lower surfaces of the liquid-cooled radiator 210, a first insulating layer 240 between the first circuit layer 220 and the liquid-cooled radiator 210, and a first insulating layer 250 between the second circuit layer 230 and the liquid-cooled radiator 210. The liquid-cooled radiator 210 is provided therein with a plurality of liquid-cooled channels 213. The first circuit layer 220 and the second circuit layer 230 are provided with an electronic component 300 such as an integrated circuit generating heat.
In operation, electronic components 300 such as integrated circuits generate heat that is conducted to liquid-cooled heat sink 210 through first circuit layer 220 and first insulating layer 240; and/or the like 300, to the liquid-cooled heat sink 210 via the second circuit layer 230 and the second insulating layer 250. The heat transferred to the liquid-cooled radiator 210 exchanges heat with the cooling liquid flowing through the liquid-cooled channel 213, thereby reducing the temperature of the liquid-cooled radiator 210 and further playing a role in radiating heat to the printed circuit board.
In an embodiment of the present invention, as shown in fig. 9, there is provided a power board including:
the printed wiring board 200 shown in fig. 2;
an electronic component 300, comprising at least: a chip; the electronic component is arranged on the first circuit layer and/or the first circuit layer of the printed circuit board.
Here, the computing pad is used to provide computing capabilities of a computer, including, but not limited to, integer computing capabilities, floating point computing capabilities, artificial Intelligence (AI) computing capabilities, and the like. The computing pad may be used in a computer, server, etc. to provide the necessary machine computing power.
The first circuit layer on the printed circuit board and/or the first circuit layer is used for connecting different electronic components, so that a complete circuit is realized, and a calculation function is further realized.
Here, the electronic component 300 may include active electronic components such as a chip, passive electronic components such as a resistor and a capacitor, and the like.
Here, the chip may include: unpackaged die may also refer to an Integrated Circuit (IC) containing die that has completed its package.
In one embodiment, the chip comprises: an application specific integrated chip ASIC.
An ASIC refers to an integrated circuit designed, manufactured based on user requirements and/or the needs of a particular electronic system. An ASIC may be used to perform certain computing functions. The ASIC may be connected to the first circuit layer or the second circuit layer by soldering or the like, and during operation the ASIC may generate heat which is spread onto the printed wiring board by conduction or the like.
As shown in fig. 2, a printed circuit board 200 is provided: comprising the following steps:
a liquid-cooled heat sink 210, wherein the liquid-cooled heat sink 210 has a first surface 211 and a second surface 212; wherein the second surface 212 is opposite to the first surface 211;
a first circuit layer 220 located on the first surface 211, wherein the first circuit layer 220 includes: a printed circuit;
a second circuit layer 230 located on the second surface 212, wherein the second circuit layer 230 comprises: and (3) a printed circuit.
The liquid-cooled radiator 210 may be made of a material having a high heat conduction capability, such as a metal material or a composite material. The printed circuits of the first circuit layer 220 and the printed circuits of the second circuit layer 230 may include, but are not limited to: etched copper-clad layers, and the like. The printed circuit may be used to connect electronic components. The electronic components may include, but are not limited to: power devices that generate heat, integrated circuit chips that perform a large number of calculations, such as high power computing chips like ASICs that are used in super computing devices, and the like.
The liquid-cooled radiator 210 may exchange heat with a cooling liquid. A liquid cooling channel through which a cooling liquid flows may be provided in the liquid cooling radiator 210 or the outer surface of the liquid cooling radiator 210, but not limited thereto. The liquid cooling channel provided on the surface of the liquid cooling radiator 210 may be a metal pipe or the like that is in close contact with the surface of the liquid cooling radiator 210 by welding or the like.
The cooling liquid flowing through the liquid cooling channel can have a lower temperature, and the cooling liquid exchanges heat with the liquid cooling radiator 210 with a higher temperature, so that the temperature of the liquid cooling radiator 210 is reduced, and the effect of radiating heat for electronic components is achieved. The cooling fluid includes, but is not limited to: water removal, ethanol, electronic fluorination and/or mineral oil.
In one embodiment, as shown in fig. 3, a first insulating layer 240 is disposed between the first circuit layer 220 and the liquid-cooled heat sink 210; a second insulating layer 250 is disposed between the second circuit layer 230 and the liquid-cooled heat sink 210.
The material used for the liquid-cooled heat sink 210 may cause abnormal operation of the printed circuit, for example, the printed circuit may be shorted, and/or impedance mismatched due to the high conductivity of the material used for the liquid-cooled heat sink 210. The conductivity threshold for the printed circuit short and/or impedance mismatch may be preset, and when the conductivity of the material used for the liquid-cooled heat sink 210 exceeds the conductivity threshold, it may be determined that the liquid-cooled heat sink 210 has short circuited the printed circuit, and/or has impedance mismatch, and so on.
In order to reduce the influence of the liquid-cooled radiator 210 on the printed circuit, a first insulating layer 240 may be disposed between the first circuit layer 220 and the liquid-cooled radiator 210, and a second insulating layer 250 may be disposed between the second circuit layer 230 and the liquid-cooled radiator 210, so as to perform an insulating function between the first circuit layer 220 and the liquid-cooled radiator 210, and between the second circuit layer 230 and the liquid-cooled radiator 210, reduce the influence of the liquid-cooled radiator 210 on the normal operation of the printed circuit, and improve the working stability of the printed circuit.
By way of example, the first insulating layer 240 and the second insulating layer 250 may be made of a highly thermally conductive, highly insulating material. For example, the first insulating layer 240 and the second insulating layer 250 may be polymers filled with ceramic powder. The first insulating layer 240 and the second insulating layer 250 may serve as insulation on the one hand, and on the other hand, heat generated at the first circuit layer 220 and the second circuit layer 230 may be conducted to the liquid-cooled radiator 210 through the first insulating layer 240 and the second insulating layer 250.
In one embodiment, the chip is electroplated with a metallic thermally conductive layer; the metal heat conductive layer is electrically connected to the first circuit layer 220 or the second circuit layer 230 through a solder layer.
As shown in fig. 4, an electronic component 300 such as an integrated circuit chip (IC) is soldered to the first circuit layer 220 and the second circuit layer 230 through a solder layer 270, and the integrated circuit chip includes a chip (Die) 301 for performing an operation and generating heat and a metal heat conductive layer 302, and the metal heat conductive layer 302 may include: wires for electrically connecting Die301 to the outside, heat conductors for conducting heat generated by Die301, and the like. The metal heat conductive layer 302 of the integrated circuit chip is connected to the first circuit layer 220 and the second circuit layer 230 by the solder layer 270.
Electronic components such as integrated circuit chips generate a large amount of heat during operation. Heat may be conducted by the electronic component to the first circuit layer 220 and/or the second circuit layer 230, such as through the metal conductive layer 302 in the integrated circuit chip to the first circuit layer 220 and/or the second circuit layer 230. Meanwhile, for electronic components with higher power, the current on the internal wires of the electronic components and the printed circuit wires connected with the electronic components is higher, and the heat generated by the current on the internal wires and the printed circuit is also higher, and the heat is also accumulated to the first circuit layer 220 and/or the second circuit layer 230. Since the first circuit layer 220 and the second circuit layer 230 cover the surface of the liquid-cooled radiator 210 and have a large contact area, heat collected in the first circuit layer 220 and the second circuit layer 230 can be directly transferred to the liquid-cooled radiator 210.
The heat generated in the first circuit layer 220 and/or the second circuit layer 230 is transferred to the liquid-cooled radiator 210 by heat conduction, and the liquid-cooled radiator 210 exchanges heat with the coolant to the outside, thereby cooling the first circuit layer 220 and/or the second circuit layer 230.
In this way, by providing the circuit layers on the two surfaces of the liquid-cooled radiator 210, on the one hand, providing the two circuit layers on the two surfaces of the liquid-cooled radiator 210 increases the circuit wiring area relative to a single circuit layer. On the other hand, since the first circuit layer 220 and the second circuit layer 230 are attached to the surface of the liquid-cooled radiator 210, the heat conduction area is large, and the heat generated by the circuit layers can be directly conducted to the liquid-cooled radiator 210, so that the liquid-cooled radiator has high heat conduction efficiency. On the other hand, the heat exchange is performed in a liquid cooling mode with higher heat dissipation efficiency, so that the heat dissipation efficiency of electronic components on the circuit layer is improved, and the heat dissipation requirement of the high-power integrated circuit chip is further met.
In one embodiment, if the coolant has better insulation properties, such as electronic fluorination, the liquid-cooled heat sink 210 may also be completely immersed in the coolant. Therefore, the surface of the whole liquid cooling radiator 210 can directly participate in the heat exchange of the cooling liquid, and the heat dissipation effect is further improved.
In one embodiment, the liquid-cooled heat sink 210 comprises:
a thermally conductive bracket; wherein, the heat conduction bracket is internally provided with a liquid cooling channel;
the liquid cooling channel is internally provided with cooling liquid.
Here, the liquid-cooled radiator 210 may be a heat-conductive bracket provided with a liquid-cooled channel through which the cooling liquid flows.
Illustratively, the thermally conductive holder may be a honeycomb structure with the honeycomb as the liquid cooling channels and the outermost side of the honeycomb structure as the first surface 211 and the second surface 212 of the liquid cooling radiator 210. The shape of the honeycomb may include hexagonal, quadrilateral, any irregular shape, etc. The thermally conductive holder may include one or more honeycomb channels.
The honeycomb structure can be built by different metal partition plates, or can be formed by processing single materials through drilling and the like.
By cooling the liquid flowing through the liquid cooling channels in the heat conducting bracket, on the one hand, the complexity of the structure and manufacturing process caused by the arrangement of the liquid cooling channels outside the liquid cooling radiator 210 can be reduced. On the other hand, the liquid cooling channel is disposed inside the liquid cooling radiator 210, so that the heat exchange path can be shortened, and the heat exchange efficiency can be improved.
In one embodiment, the thermally conductive holder comprises:
A metal substrate, the liquid cooling channel comprising: at least one through hole is formed in the metal substrate.
As shown in fig. 5 and fig. 6, which is a cross-sectional view of fig. 5 in the direction A-A, a liquid cooling channel 213 is provided on a liquid cooling heat sink 210, i.e., a metal substrate, and a PCB using metal as a substrate, i.e., a metal-based PCB, may be used as a printed wiring board. One or more through holes may be provided on the metal substrate as the liquid cooling channels 213.
A first insulating layer 240 is provided between the first circuit layer 220 and the metal substrate; the second circuit layer 230 has a second insulating layer 250 between the metal substrate. The heat of the first circuit layer 220 and the second circuit layer 230 can be conducted to the metal substrate, and the metal substrate exchanges heat with the cooling liquid flowing in the through holes, thereby playing a role in heat dissipation.
Through set up the through-hole as liquid cooling passageway 213 on the metal substrate, do not add additional liquid cooling passageway 213 in addition, on the one hand, simplified the structure of liquid cooling passageway 213, on the other hand liquid cooling passageway 213 sets up in the metal substrate inside, can shorten the heat exchange route, improves the efficiency of heat exchange.
In one embodiment, the metal substrate is an aluminum substrate.
The aluminum substrate has the characteristics of light weight and excellent thermal conductivity. The use of the aluminum substrate can reduce the weight of the printed circuit board 200 on the one hand, and can improve the heat conduction efficiency from the first circuit layer 220 and the second circuit layer 230 to the metal substrate on the other hand, thereby improving the heat dissipation effect.
In one embodiment, the liquid cooling channel 213 includes: the cooling device is provided with a liquid inlet for the cooling liquid to flow in and a liquid outlet for the cooling liquid to flow out;
the liquid inlet is used for being communicated with the heat exchange device;
the liquid outlet is used for being communicated with the heat exchange device.
The cooling liquid can flow into the liquid cooling radiator 210 from the liquid inlet from the outside, and after heat exchange with the liquid cooling radiator 210 is completed, the cooling liquid flows out from the liquid outlet and flows into the heat exchange device.
The heat exchange device is used for performing heat exchange between the cooling liquid and the external environment, reducing the temperature of the cooling liquid flowing out of the liquid-cooled radiator 210, and flowing the cooled cooling liquid into the liquid-cooled radiator 210 from the liquid inlet of the liquid-cooled radiator 210 again.
The heat exchange device may include a first conduit connected to the liquid inlet and a second conduit connected to the liquid outlet. The cooling liquid flows out of the heat exchange device, flows into the liquid cooling channel 213 of the liquid cooling radiator 210 from the liquid inlet after flowing through the heat of the first pipeline, absorbs the heat on the liquid cooling radiator 210 in the liquid cooling channel 213, flows out of the liquid outlet to the second pipeline, and flows back to the heat exchange device, and the heat exchange device exchanges heat between the cooling liquid and the external environment. One first pipe may be connected to a plurality of liquid inlets at the same time, or one first pipe may be connected to one liquid inlet. A second pipeline can be connected with a plurality of liquid outlets at the same time, and also can be connected with a liquid outlet. The heat exchange device may include a heat radiation fin and a heat radiation fan to radiate heat from the coolant flowing through the heat exchange device.
In one embodiment, a plurality of the liquid cooling channels are arranged in parallel and isolated from each other.
The liquid cooling channels can be arranged according to the distribution of the electronic components. The liquid cooling channels may be arranged according to the actual heat distribution. For example, the liquid cooling channels may be uniformly disposed in the metal substrate, so that the metal substrate may uniformly dissipate heat. The liquid cooling channels can be arranged at the positions corresponding to the high-power electronic components in a concentrated mode, and therefore the heat dissipation effect of the heat collection area can be enhanced.
Here, each liquid cooling channel 213 may be provided with a liquid inlet and a liquid outlet, respectively, and the cooling liquid in the plurality of liquid cooling channels 213 may be concentrated in one common heat exchange device to exchange heat with the external environment, or each liquid cooling channel 213 may be connected to one heat exchange device alone, or one heat exchange device may be connected to a predetermined number of liquid cooling channels, for example, one heat exchange device is connected to 3 liquid cooling channels 213.
In one embodiment, the spacing between the liquid cooling channels 213 may be set based on the heat generated by the first circuit layer 220 and/or the second circuit layer 230.
The liquid cooling channels 213 may be provided based on the heat distribution of the circuit layer, for example, in a region where heat is generated, the space between the liquid cooling channels 213 is reduced, so that a larger number of liquid cooling channels 213 may be provided in the same area, thereby improving heat exchange capability. In the region where the amount of generated heat is small, the space between the liquid cooling passages 213 is enlarged.
By adjusting the distance between the liquid cooling channels 213, different areas of the metal substrate have different heat dissipation capacities, and the temperature difference between different areas of the metal substrate is reduced. And the deformation of the metal substrate caused by the temperature difference of different areas is reduced.
As shown in fig. 7, and an enlarged view of a region B in fig. 7, the printed circuit board 200 is provided with: the liquid-cooled radiator 210, a first circuit layer 220 and a second circuit layer 230 provided on the upper and lower surfaces of the liquid-cooled radiator 210, a first insulating layer 240 between the first circuit layer 220 and the liquid-cooled radiator 210, and a first insulating layer 250 between the second circuit layer 230 and the liquid-cooled radiator 210. The liquid-cooled radiator 210 is provided therein with a plurality of liquid-cooled channels 213. The first circuit layer 220 and the second circuit layer 230 are provided with electronic components 300 such as an integrated circuit generating heat.
In operation, electronic components 300 such as integrated circuits generate heat that is conducted to liquid-cooled heat sink 210 through first circuit layer 220 and first insulating layer 240; and/or the electronic components 300 such as integrated circuits, generate heat that is conducted to the liquid-cooled heat sink 210 through the second circuit layer 230 and the second insulating layer 250. The heat transferred to the liquid-cooled radiator 210 exchanges heat with the cooling liquid flowing through the liquid-cooled channel 213, thereby reducing the temperature of the liquid-cooled radiator 210 and further performing a function of radiating heat to the printed circuit board 200.
In an embodiment of the present invention, as shown in fig. 10, there is provided an electronic apparatus 2, the electronic apparatus 2 including: the computing plate 20 shown in fig. 9. Here, the electronic device includes, but is not limited to, a terminal, a computer, a server, and the like. The electronic device provides machine computing power through the computing pad.
Here, the computing board 20 shown in fig. 9 includes: the printed wiring board 200 shown in fig. 2;
an electronic component 300, comprising at least: a chip; the electronic component is arranged on the first circuit layer and/or the first circuit layer of the printed circuit board.
Here, the computing pad is used to provide computing capabilities of a computer, including, but not limited to, integer computing capabilities, floating point computing capabilities, artificial Intelligence (AI) computing capabilities, and the like. The computing pad may be used in a computer, server, etc. to provide the necessary machine computing power.
The first circuit layer on the printed circuit board and/or the first circuit layer is used for connecting different electronic components, so that a complete circuit is realized, and a calculation function is further realized.
Here, the electronic components may include active electronic components such as chips, passive electronic components such as resistors and capacitors, and the like.
Here, the chip may include: unpackaged die may also refer to an Integrated Circuit (IC) containing die that has completed its package.
In one embodiment, the chip comprises: an application specific integrated chip ASIC.
An ASIC refers to an integrated circuit designed, manufactured based on user requirements and/or the needs of a particular electronic system. An ASIC may be used to perform certain computing functions. The ASIC may be connected to the first circuit layer or the second circuit layer by soldering or the like, and during operation the ASIC may generate heat which is spread onto the printed wiring board by conduction or the like.
As shown in fig. 2, a printed circuit board 200 is provided: comprising the following steps:
a liquid-cooled heat sink 210, wherein the liquid-cooled heat sink 210 has a first surface 211 and a second surface 212; wherein the second surface 212 is opposite to the first surface 211;
a first circuit layer 220 located on the first surface 211, wherein the first circuit layer 220 includes: a printed circuit;
a second circuit layer 230 located on the second surface 212, wherein the second circuit layer 230 comprises: and (3) a printed circuit.
The liquid-cooled radiator 210 may be made of a material having a high heat conduction capability, such as a metal material or a composite material. The printed circuits of the first circuit layer 220 and the printed circuits of the second circuit layer 230 may include, but are not limited to: etched copper-clad layers, and the like. The printed circuit may be used to connect electronic components. The electronic components may include, but are not limited to: power devices that generate heat, integrated circuit chips that perform a large number of calculations, such as high power computing chips like ASICs that are used in super computing devices, and the like.
The liquid-cooled radiator 210 may exchange heat with a cooling liquid. A liquid cooling channel through which a cooling liquid flows may be provided in the liquid cooling radiator 210 or the outer surface of the liquid cooling radiator 210, but not limited thereto. The liquid cooling channel provided on the surface of the liquid cooling radiator 210 may be a metal pipe or the like that is in close contact with the surface of the liquid cooling radiator 210 by welding or the like.
The cooling liquid flowing through the liquid cooling channel can have a lower temperature, and the cooling liquid exchanges heat with the liquid cooling radiator 210 with a higher temperature, so that the temperature of the liquid cooling radiator 210 is reduced, and the effect of radiating heat for electronic components is achieved. The cooling fluid includes, but is not limited to: water removal, ethanol, electronic fluorination and/or mineral oil.
In one embodiment, as shown in fig. 3, a first insulating layer 240 is disposed between the first circuit layer 220 and the liquid-cooled heat sink 210; a second insulating layer 250 is disposed between the second circuit layer 230 and the liquid-cooled heat sink 210.
The material used for the liquid-cooled heat sink 210 may cause abnormal operation of the printed circuit, for example, the printed circuit may be shorted, and/or impedance mismatched due to the high conductivity of the material used for the liquid-cooled heat sink 210. The conductivity threshold for the printed circuit short and/or impedance mismatch may be preset, and when the conductivity of the material used for the liquid-cooled heat sink 210 exceeds the conductivity threshold, it may be determined that the liquid-cooled heat sink 210 has short circuited the printed circuit, and/or has impedance mismatch, and so on.
In order to reduce the influence of the liquid-cooled radiator 210 on the printed circuit, a first insulating layer 240 may be disposed between the first circuit layer 220 and the liquid-cooled radiator 210, and a second insulating layer 250 may be disposed between the second circuit layer 230 and the liquid-cooled radiator 210, so as to perform an insulating function between the first circuit layer 220 and the liquid-cooled radiator 210, and between the second circuit layer 230 and the liquid-cooled radiator 210, reduce the influence of the liquid-cooled radiator 210 on the normal operation of the printed circuit, and improve the working stability of the printed circuit.
By way of example, the first insulating layer 240 and the second insulating layer 250 may be made of a highly thermally conductive, highly insulating material. For example, the first insulating layer 240 and the second insulating layer 250 may be polymers filled with ceramic powder. The first insulating layer 240 and the second insulating layer 250 may serve as insulation on the one hand, and on the other hand, heat generated at the first circuit layer 220 and the second circuit layer 230 may be conducted to the liquid-cooled radiator 210 through the first insulating layer 240 and the second insulating layer 250.
In one embodiment, the chip is electroplated with a metallic thermally conductive layer; the metal heat conductive layer is electrically connected to the first circuit layer 220 or the second circuit layer 230 through a solder layer.
As shown in fig. 4, an electronic component 300 such as an integrated circuit chip (IC) is soldered to the first circuit layer 220 and the second circuit layer 230 through a solder layer 270, and the integrated circuit chip includes a chip (Die) 301 for performing an operation and generating heat and a metal heat conductive layer 302, and the metal heat conductive layer 302 may include: wires for electrically connecting Die301 to the outside, heat conductors for conducting heat generated by Die301, and the like. The metal heat conductive layer 302 of the integrated circuit chip is connected to the first circuit layer 220 and the second circuit layer 230 by the solder layer 270.
Electronic components such as integrated circuit chips generate a large amount of heat during operation. Heat may be conducted by the electronic component to the first circuit layer 220 and/or the second circuit layer 230, such as through the metal conductive layer 302 in the integrated circuit chip to the first circuit layer 220 and/or the second circuit layer 230. Meanwhile, for electronic components with higher power, the current on the internal wires of the electronic components and the printed circuit wires connected with the electronic components is higher, and the heat generated by the current on the internal wires and the printed circuit is also higher, and the heat is also accumulated to the first circuit layer 220 and/or the second circuit layer 230. Since the first circuit layer 220 and the second circuit layer 230 cover the surface of the liquid-cooled radiator 210 and have a large contact area, heat collected in the first circuit layer 220 and the second circuit layer 230 can be directly transferred to the liquid-cooled radiator 210.
The heat generated in the first circuit layer 220 and/or the second circuit layer 230 is transferred to the liquid-cooled radiator 210 by heat conduction, and the liquid-cooled radiator 210 exchanges heat with the coolant to the outside, thereby cooling the first circuit layer 220 and/or the second circuit layer 230.
In this way, by providing the circuit layers on both surfaces of the liquid-cooled radiator 210, on the one hand, providing two circuit layers on both surfaces of the liquid-cooled radiator increases the circuit wiring area relative to a single circuit layer. On the other hand, since the first circuit layer 220 and the second circuit layer 230 are attached to the surface of the liquid-cooled radiator 210, the heat conduction area is large, and the heat generated by the circuit layers can be directly conducted to the liquid-cooled radiator 210, so that the liquid-cooled radiator has high heat conduction efficiency. On the other hand, the heat exchange is performed in a liquid cooling mode with higher heat dissipation efficiency, so that the heat dissipation efficiency of electronic components on the circuit layer is improved, and the heat dissipation requirement of the high-power integrated circuit chip is further met.
In one embodiment, if the coolant has better insulation properties, such as electronic fluorination, the liquid-cooled heat sink 210 may also be completely immersed in the coolant. Therefore, the surface of the whole liquid cooling radiator 210 can directly participate in the heat exchange of the cooling liquid, and the heat dissipation effect is further improved.
In one embodiment, the liquid-cooled heat sink 210 comprises:
a thermally conductive bracket; wherein, the heat conduction bracket is internally provided with a liquid cooling channel;
the liquid cooling channel is internally provided with cooling liquid.
Here, the liquid-cooled radiator 210 may be a heat-conductive bracket provided with a liquid-cooled channel through which the cooling liquid flows.
Illustratively, the thermally conductive holder may be a honeycomb structure with the honeycomb as the liquid cooling channels and the outermost side of the honeycomb structure as the first surface 211 and the second surface 212 of the liquid cooling radiator 210. The shape of the honeycomb may include hexagonal, quadrilateral, any irregular shape, etc. The thermally conductive holder may include one or more honeycomb channels.
The honeycomb structure can be built by different metal partition plates, or can be formed by processing single materials through drilling and the like.
By cooling the liquid flowing through the liquid cooling channels in the heat conducting bracket, on the one hand, the complexity of the structure and manufacturing process caused by the arrangement of the liquid cooling channels outside the liquid cooling radiator 210 can be reduced. On the other hand, the liquid cooling channel is disposed inside the liquid cooling radiator 210, so that the heat exchange path can be shortened, and the heat exchange efficiency can be improved.
In one embodiment, the thermally conductive holder comprises:
A metal substrate, the liquid cooling channel comprising: at least one through hole is formed in the metal substrate.
As shown in fig. 5 and fig. 6, which is a cross-sectional view of fig. 5 in the direction A-A, a liquid cooling channel 213 is provided on a liquid cooling heat sink 210, i.e., a metal substrate, and a PCB using metal as a substrate, i.e., a metal-based PCB, may be used as a printed wiring board. One or more through holes may be provided on the metal substrate as the liquid cooling channels 213.
A first insulating layer 240 is provided between the first circuit layer 220 and the metal substrate; the second circuit layer 230 has a second insulating layer 250 between the metal substrate. The heat of the first circuit layer 220 and the second circuit layer 230 can be conducted to the metal substrate, and the metal substrate exchanges heat with the cooling liquid flowing in the through holes, thereby playing a role in heat dissipation.
Through set up the through-hole as liquid cooling passageway 213 on the metal substrate, do not add additional liquid cooling passageway 213 in addition, on the one hand, simplified the structure of liquid cooling passageway 213, on the other hand liquid cooling passageway 213 sets up in the metal substrate inside, can shorten the heat exchange route, improves the efficiency of heat exchange.
In one embodiment, the metal substrate is an aluminum substrate.
The aluminum substrate has the characteristics of light weight and excellent thermal conductivity. The use of the aluminum substrate can reduce the weight of the printed circuit board 200 on the one hand, and can improve the heat conduction efficiency from the first circuit layer 220 and the second circuit layer 230 to the metal substrate on the other hand, thereby improving the heat dissipation effect.
In one embodiment, the liquid cooling channel 213 includes: the cooling device is provided with a liquid inlet for the cooling liquid to flow in and a liquid outlet for the cooling liquid to flow out;
the liquid inlet is used for being communicated with the heat exchange device;
the liquid outlet is used for being communicated with the heat exchange device.
The cooling liquid can flow into the liquid cooling radiator 210 from the liquid inlet from the outside, and after heat exchange with the liquid cooling radiator 210 is completed, the cooling liquid flows out from the liquid outlet and flows into the heat exchange device.
The heat exchange device is used for performing heat exchange between the cooling liquid and the external environment, reducing the temperature of the cooling liquid flowing out of the liquid-cooled radiator 210, and flowing the cooled cooling liquid into the liquid-cooled radiator 210 from the liquid inlet of the liquid-cooled radiator 210 again.
The heat exchange device may include a first conduit connected to the liquid inlet and a second conduit connected to the liquid outlet. The cooling liquid flows out of the heat exchange device, flows into the liquid cooling channel 213 of the liquid cooling radiator 210 from the liquid inlet after flowing through the heat of the first pipeline, absorbs the heat on the liquid cooling radiator 210 in the liquid cooling channel 213, flows out of the liquid outlet to the second pipeline, and flows back to the heat exchange device, and the heat exchange device exchanges heat between the cooling liquid and the external environment. One first pipe may be connected to a plurality of liquid inlets at the same time, or one first pipe may be connected to one liquid inlet. A second pipeline can be connected with a plurality of liquid outlets at the same time, and also can be connected with a liquid outlet. The heat exchange device may include a heat radiation fin and a heat radiation fan to radiate heat from the coolant flowing through the heat exchange device.
In one embodiment, a plurality of the liquid cooling channels are arranged in parallel and isolated from each other.
The liquid cooling channels can be arranged according to the distribution of the electronic components. The liquid cooling channels may be arranged according to the actual heat distribution. For example, the liquid cooling channels may be uniformly disposed in the metal substrate, so that the metal substrate may uniformly dissipate heat. The liquid cooling channels can be arranged at the positions corresponding to the high-power electronic components in a concentrated mode, and therefore the heat dissipation effect of the heat collection area can be enhanced.
Here, each liquid cooling channel 213 may be provided with a liquid inlet and a liquid outlet, respectively, and the cooling liquid in the plurality of liquid cooling channels 213 may be concentrated in one common heat exchange device to exchange heat with the external environment, or each liquid cooling channel 213 may be connected to one heat exchange device alone, or one heat exchange device may be connected to a predetermined number of liquid cooling channels, for example, one heat exchange device is connected to 3 liquid cooling channels 213.
In one embodiment, the spacing between the liquid cooling channels 213 may be set based on the heat generated by the first circuit layer 220 and/or the second circuit layer 230.
The liquid cooling channels 213 may be provided based on the heat distribution of the circuit layer, for example, in a region where heat is generated, the space between the liquid cooling channels 213 is reduced, so that a larger number of liquid cooling channels 213 may be provided in the same area, thereby improving heat exchange capability. In the region where the amount of generated heat is small, the space between the liquid cooling passages 213 is enlarged.
By adjusting the distance between the liquid cooling channels 213, different areas of the metal substrate have different heat dissipation capacities, and the temperature difference between different areas of the metal substrate is reduced. And the deformation of the metal substrate caused by the temperature difference of different areas is reduced.
As shown in fig. 7, and an enlarged view of a region B in fig. 7, the printed circuit board 200 includes: the liquid-cooled radiator 210, a first circuit layer 220 and a second circuit layer 230 provided on the upper and lower surfaces of the liquid-cooled radiator 210, a first insulating layer 240 between the first circuit layer 220 and the liquid-cooled radiator 210, and a first insulating layer 250 between the second circuit layer 230 and the liquid-cooled radiator 210. The liquid-cooled radiator 210 is provided therein with a plurality of liquid-cooled channels 213. The first circuit layer 220 and the second circuit layer 230 are provided with electronic components 300 such as an integrated circuit generating heat.
In operation, electronic components 300 such as integrated circuits generate heat that is conducted to liquid-cooled heat sink 210 through first circuit layer 220 and first insulating layer 240; and/or the electronic components 300 such as integrated circuits, generate heat that is conducted to the liquid-cooled heat sink 210 through the second circuit layer 230 and the second insulating layer 250. The heat transferred to the liquid-cooled radiator 210 exchanges heat with the cooling liquid flowing through the liquid-cooled channel 213, thereby reducing the temperature of the liquid-cooled radiator 210 and further performing a function of radiating heat to the printed circuit board 200.
The methods disclosed in the several method embodiments provided in the present disclosure may be arbitrarily combined without collision to obtain a new method embodiment.
The features disclosed in the several product embodiments provided in the present disclosure may be combined arbitrarily without conflict to obtain new product embodiments.
The features disclosed in the several method or product embodiments provided in the present disclosure may be combined arbitrarily without any conflict, resulting in new method embodiments or product embodiments.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any adaptations, uses, or adaptations of the disclosure following the general principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (11)
1. A printed wiring board, comprising:
a liquid-cooled heat sink, wherein the liquid-cooled heat sink has a first surface and a second surface; wherein the second surface is opposite to the first surface;
a first circuit layer located on the first surface, wherein the first circuit layer comprises: a printed circuit;
a second circuit layer located on the second surface, wherein the second circuit layer comprises: and (3) a printed circuit.
2. The printed wiring board of claim 1, wherein,
the liquid-cooled heat sink includes:
a thermally conductive bracket; wherein, the heat conduction bracket is internally provided with a liquid cooling channel;
the liquid cooling channel is internally provided with cooling liquid.
3. The printed wiring board of claim 2, wherein,
the heat conduction bracket includes:
a metal substrate, the liquid cooling channel comprising: at least one through hole is formed in the metal substrate.
4. The printed wiring board according to claim 3, wherein,
the metal substrate is an aluminum substrate.
5. The printed wiring board of claim 2, wherein,
the liquid cooling channel comprises: the cooling device is provided with a liquid inlet for the cooling liquid to flow in and a liquid outlet for the cooling liquid to flow out;
The liquid inlet is used for being communicated with the heat exchange device;
the liquid outlet is used for being communicated with the heat exchange device.
6. The printed wiring board of claim 2, wherein,
the liquid cooling channels are arranged in parallel and isolated from each other.
7. The printed wiring board according to any one of claims 1 to 6, wherein,
a first insulating layer is arranged between the first circuit layer and the liquid cooling radiator;
and a second insulating layer is arranged between the second circuit layer and the liquid cooling radiator.
8. A computing pad, comprising:
the printed wiring board of any one of claims 1 to 7;
an electronic component, the electronic component comprising at least: a chip; the electronic component is arranged on the first circuit layer and/or the first circuit layer of the printed circuit board.
9. The power board of claim 8, wherein the power board is configured to,
the chip comprises: an application specific integrated chip ASIC.
10. The power board of claim 8, wherein the power board is configured to,
the chip is electroplated with a metal heat conduction layer;
the metal heat conduction layer is electrically connected with the first circuit layer or the second circuit layer through the soldering tin layer.
11. An electronic device, the electronic device comprising: the power board of any one of claims 8 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111385603.4A CN116156733A (en) | 2021-11-22 | 2021-11-22 | Printed wiring board, power calculating board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111385603.4A CN116156733A (en) | 2021-11-22 | 2021-11-22 | Printed wiring board, power calculating board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116156733A true CN116156733A (en) | 2023-05-23 |
Family
ID=86339427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111385603.4A Pending CN116156733A (en) | 2021-11-22 | 2021-11-22 | Printed wiring board, power calculating board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116156733A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118574304A (en) * | 2024-07-30 | 2024-08-30 | 苏州元脑智能科技有限公司 | Printed circuit board and manufacturing method thereof |
| WO2024187842A1 (en) * | 2023-03-10 | 2024-09-19 | 华为数字能源技术有限公司 | Circuit board, circuit board assembly, and electronic device |
-
2021
- 2021-11-22 CN CN202111385603.4A patent/CN116156733A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024187842A1 (en) * | 2023-03-10 | 2024-09-19 | 华为数字能源技术有限公司 | Circuit board, circuit board assembly, and electronic device |
| CN118574304A (en) * | 2024-07-30 | 2024-08-30 | 苏州元脑智能科技有限公司 | Printed circuit board and manufacturing method thereof |
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