CN116156733A - Printed wiring board, power calculating board and electronic equipment - Google Patents

Abstract

The present disclosure relates to a printed wiring board, a power board, and an electronic device, the printed wiring board including: a liquid-cooled heat sink, wherein the liquid-cooled heat sink has a first surface and a second surface; wherein the second surface is opposite to the first surface; a first circuit layer located on the first surface, wherein the first circuit layer comprises: a printed circuit; a second circuit layer located on the second surface, wherein the second circuit layer comprises: and (3) a printed circuit. The circuit wiring area is increased. The heat exchange is performed in a liquid cooling mode with higher heat dissipation efficiency, so that the heat dissipation efficiency of electronic components on the circuit layer is improved, and the heat dissipation requirement of the high-power integrated circuit chip is further met.

Description

Printed circuit boards, hashboards and electronic equipment

technical field

The present disclosure relates to the technical field of circuit boards, in particular to a printed circuit board, a computing power board and electronic equipment.

Background technique

Integrated circuit chips for high-speed calculations in supercomputing equipment, such as ASIC (Application Specific Integrated Circuit) chips, etc., will generate a lot of heat during work. When the heat accumulates to a certain extent, the temperature of the integrated circuit chip will rise. The working ability of the integrated circuit chip is reduced, and the integrated circuit chip is burned. Therefore, for integrated circuit chips that generate heat, a heat sink is usually provided to dissipate heat from the integrated circuit chip to reduce the temperature of the integrated circuit chip during operation.

Contents of the invention

The present disclosure provides a metal-based circuit board, a circuit board and electronic equipment.

According to a first aspect of an embodiment of the present disclosure, there is provided a printed circuit board, including:

A liquid cooling radiator, wherein the liquid cooling radiator has a first surface and a second surface; wherein the second surface is the opposite surface of the first surface;

A first circuit layer located on the first surface, wherein the first circuit layer includes: a printed circuit;

The second circuit layer is located on the second surface, wherein the second circuit layer includes: a printed circuit.

In one embodiment, the liquid cooling radiator includes:

A heat conduction bracket; wherein, there is a liquid cooling channel in the heat conduction bracket;

There is cooling liquid in the liquid cooling channel.

In one embodiment, the heat conducting bracket includes:

The metal substrate, the liquid cooling channel includes: at least one through hole opened on the metal substrate.

In one embodiment, the metal substrate is an aluminum substrate.

In one embodiment, the liquid cooling channel includes: a liquid inlet for the cooling liquid to flow in, and a liquid outlet for the cooling liquid to flow out;

The liquid inlet is used to communicate with the heat exchange device;

The liquid outlet is used to communicate with the heat exchange device.

In one embodiment, a plurality of the liquid cooling channels are arranged in parallel and isolated from each other.

In one embodiment,

There is a first insulating layer between the first circuit layer and the liquid cooling radiator;

There is a second insulating layer between the second circuit layer and the liquid cooling radiator.

According to the second aspect of the embodiments of the present disclosure, there is provided a computing power board, including: the printed circuit board described in the first aspect;

The electronic components at least include: a chip; the electronic components are arranged on the first circuit layer and/or on the first circuit layer of the printed circuit board.

In one embodiment, the chip includes: an application specific integrated chip ASIC.

In one embodiment, the chip is electroplated with a metal heat conducting layer;

The metal heat conducting layer is electrically connected to the first circuit layer or the second circuit layer through a solder layer.

According to a third aspect of the embodiments of the present disclosure, an electronic device is provided, and the electronic device includes: the computing power board described in the second aspect.

An embodiment of the present disclosure provides a printed circuit board and a liquid cooling radiator, wherein the liquid cooling radiator has a first surface and a second surface; wherein the second surface is opposite to the first surface surface; a first circuit layer located on the first surface, wherein the first circuit layer comprises: a printed circuit; a second circuit layer located on the second surface, wherein the second circuit layer comprises: a printed circuit circuit. In this way, by arranging circuit layers on both surfaces of the liquid-cooled radiator, on the one hand, two circuit layers are arranged on both surfaces of the liquid-cooled radiator, which increases the circuit wiring area compared with a single circuit layer. On the other hand, since the first circuit layer and the second circuit layer are attached to the surface of the liquid-cooled radiator, the heat conduction area is relatively large, and the heat generated by the circuit layer can be directly conducted to the liquid-cooled radiator, which has high thermal conductivity. efficiency. On the other hand, heat exchange is carried out through liquid cooling with high heat dissipation efficiency, which improves the heat dissipation efficiency of electronic components on the circuit layer, thereby meeting the heat dissipation requirements of high-power integrated circuit chips.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.

Fig. 1 is a schematic diagram showing a heat dissipation structure of a printed circuit board according to related technologies;

Fig. 2 is a schematic structural diagram of a first printed circuit board according to an exemplary embodiment;

Fig. 3 is a schematic structural diagram of a second printed circuit board according to an exemplary embodiment;

Fig. 4 is a schematic structural diagram of a third printed circuit board according to an exemplary embodiment;

Fig. 5 is a schematic structural diagram of a liquid cooling radiator according to an exemplary embodiment;

Fig. 6 is a schematic cross-sectional view of a liquid cooling radiator according to an exemplary embodiment;

Fig. 7 is a schematic structural diagram of a fourth printed circuit board according to an exemplary embodiment;

Fig. 8 is a partially enlarged schematic diagram of a printed circuit board according to an exemplary embodiment;

Fig. 9 is a schematic structural diagram of a hash board according to an exemplary embodiment;

Fig. 10 is a schematic structural diagram of an electronic device according to an exemplary embodiment;

Detailed ways

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of devices consistent with aspects of the present disclosure as recited in the appended claims.

In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", " The orientation or positional relationship indicated by "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying References to devices or elements must have a particular orientation, be constructed, and operate in a particular orientation and therefore should not be construed as limiting the invention.

In the description of the present invention, "plurality" means two or more, and "several" means one or more.

As shown in Fig. 1, an integrated circuit chip (110) performing high-speed calculation in a supercomputing device is welded on a circuit layer (131) of a PCB (130) through a solder layer (120). Among them, the integrated circuit chip (110) is composed of a crystal grain (Die) (111) that performs calculation and generates heat and a metal heat conduction layer (111), and Die (111) refers to an unpackaged integrated circuit made of semiconductor material ontology. The metal heat conduction layer (111) may include: wires for forming electrical connection between the Die (111) and the outside, heat conductors for conducting the Die (111) to generate heat, and the like. The metal heat conducting layer (111) can be made of copper. The PCB (130) board comprises: a substrate (132), and a circuit layer (131) arranged on the substrate (132), wherein the circuit layer (131) may include but not limited to an etched copper clad layer.

For the heat dissipation of the integrated circuit chip (110) as shown in Figure 1, heat dissipation devices (140) such as metal heat sinks can be set above the Die (111), and the heat generated by the Die (111) is conducted to the heat dissipation device (140) by heat conduction. Heat exchange is formed on the upper surface, thereby reducing the temperature of the integrated circuit chip (110).

In order to ensure good direct contact between the Die (111) and the heat sink (140), it is usually necessary to arrange a thermal conduction medium (150) such as heat dissipation silica gel between the Die (111) and the heat sink (140).

As the computing power of the integrated circuit chip (110) is not enhanced, the heat generated by the integrated circuit chip (110) is getting higher and higher, and the thermal resistance of the heat conduction medium (150) between the Die (111) and the heat sink (140) is getting higher and higher. The conduction of heat cannot be satisfied more and more, that is, the heat dissipation requirement of the integrated circuit chip (110) cannot be satisfied, thereby affecting the working performance of the integrated circuit chip.

Therefore, how to improve the heat dissipation efficiency of integrated circuit chips and meet the heat dissipation requirements of high-power integrated circuit chips is an urgent problem to be solved.

In an embodiment of the present invention, as shown in FIG. 2 , a printed circuit board 200 is provided: comprising:

A liquid cooling radiator 210, wherein the liquid cooling radiator 210 has a first surface 211 and a second surface 212; wherein the second surface 212 is the opposite surface of the first surface 211;

The first circuit layer 220 is located on the first surface 211, wherein the first circuit layer 220 includes: a printed circuit;

The second circuit layer 230 is located on the second surface 212 , wherein the second circuit layer 230 includes: a printed circuit.

The liquid cooling radiator 210 can be made of materials with high thermal conductivity, such as metal materials or synthetic materials. The printed circuit of the first circuit layer 220 and the printed circuit of the second circuit layer 230 may include but not limited to: etched copper clad layer and the like. Printed circuits can be used to connect electronic components. Electronic components may include, but are not limited to: power devices that generate heat, integrated circuit chips that perform massive calculations, such as ASICs and other high-power computing chips used in supercomputing equipment.

The liquid cooling radiator 210 may use cooling liquid for heat exchange. A liquid cooling channel for cooling liquid to flow may be provided, but not limited to, inside the liquid cooling radiator 210 or on the outer surface of the liquid cooling radiator 210 . The liquid cooling channel provided on the surface of the liquid cooling radiator 210 may be a metal pipe or the like that is in close contact with the surface of the liquid cooling radiator 210 by means of welding or the like.

The coolant flowing through the liquid-cooling channel can have a lower temperature, and the coolant exchanges heat with the liquid-cooled radiator 210 with a higher temperature, thereby reducing the temperature of the liquid-cooled radiator 210 and playing the role of cooling the electronic components. . Cooling fluids include, but are not limited to: dehydration, ethanol, electronic fluorinated fluid, and/or mineral oil, etc.

In one embodiment, as shown in FIG. 3 , there is a first insulating layer 240 between the first circuit layer 220 and the liquid cooling radiator 210; the second circuit layer 230 and the liquid cooling radiator There is a second insulating layer 250 between 210 .

The material used in the liquid cooling radiator 210 may cause the abnormal operation of the printed circuit, for example, the high conductivity of the material used in the liquid cooling radiator 210 may cause a short circuit in the printed circuit and/or impedance mismatch. A conductivity threshold for a printed circuit short circuit and/or impedance mismatch can be preset, and when the conductivity of the material used in the liquid cooling radiator 210 exceeds the conductivity threshold, it can be determined that the liquid cooling radiator 210 causes a short circuit of the printed circuit and/or impedance Mismatch etc.

In order to reduce the influence of the liquid cooling radiator 210 on the printed circuit, a first insulating layer 240 can be provided between the first circuit layer 220 and the liquid cooling radiator 210, and a first insulating layer 240 can be provided between the second circuit layer 230 and the liquid cooling radiator 210. The second insulating layer 250 plays an insulating role between the first circuit layer 220 and the liquid cooling radiator 210, and between the second circuit layer 230 and the liquid cooling radiator 210, reducing the impact of the liquid cooling radiator 210 on the normal operation of the printed circuit. Influence, improve the stability of the printed circuit.

Exemplarily, the first insulating layer 240 and the second insulating layer 250 may be made of materials with high thermal conductivity and high insulation. For example, the first insulating layer 240 and the second insulating layer 250 may be a polymer filled with ceramic powder. On the one hand, the first insulating layer 240 and the second insulating layer 250 can play the role of insulation; on the other hand, the heat generated in the first circuit layer 220 and the second circuit layer 230 can pass through the first insulating layer 240 and the second The insulating layer 250 conducts to the liquid cooling heat sink 210 .

As shown in FIG. 4 , electronic components 300 such as an integrated circuit chip (IC) are welded on the first circuit layer 220 and the second circuit layer 230 through the solder layer 270, and the integrated circuit chip includes crystal grains (Die) that perform operations and generate heat. 301 and a metal heat conduction layer 302, the metal heat conduction layer 302 may include: Die301 is electrically connected with the outside wire, a heat conductor that conducts Die301 to generate heat, etc. The metal heat conduction layer 302 of the integrated circuit chip is connected to the first circuit layer 220 and the second circuit layer 230 through the solder layer 270 .

Electronic components such as integrated circuit chips generate a lot of heat during operation. Heat can be conducted from the electronic components to the first circuit layer 220 and/or the second circuit layer 230 , such as through the metal heat conduction layer 302 in the integrated circuit chip to the first circuit layer 220 and/or the second circuit layer 230 . At the same time, for electronic components with high power, the current on the internal wires of the electronic components and the printed circuit wires connected to the electronic components is relatively large, and the heat generated by the current in the internal wires and printed circuits is also high. Gather to the first circuit layer 220 and/or the second circuit layer 230 . Since the first circuit layer 220 and the second circuit layer 230 cover the surface of the liquid cooling radiator 210 and have a large contact area, the heat accumulated on the first circuit layer 220 and the second circuit layer 230 can be directly transferred to the liquid cooling radiator 210.

The heat generated in the first circuit layer 220 and/or the second circuit layer 230 is transferred to the liquid cooling radiator 210 through heat conduction, and the liquid cooling radiator 210 exchanges heat with the cooling liquid to the outside, Thereby, the temperature of the first circuit layer 220 and/or the second circuit layer 230 is lowered.

In this way, by disposing circuit layers on both surfaces of the liquid cooling radiator 210 , on the one hand, disposing two circuit layers on both surfaces of the liquid cooling radiator 210 increases the circuit wiring area compared with a single circuit layer. On the other hand, since the first circuit layer 220 and the second circuit layer 230 are attached to the surface of the liquid-cooled radiator 210, the heat conduction area is relatively large, and the heat generated by the circuit layer can be directly conducted to the liquid-cooled radiator 210. High thermal conductivity. On the other hand, heat exchange is carried out through liquid cooling with high heat dissipation efficiency, which improves the heat dissipation efficiency of electronic components on the circuit layer, thereby meeting the heat dissipation requirements of high-power integrated circuit chips.

In one embodiment, if the cooling liquid has better insulating properties, such as electronic fluorinated liquid, the liquid cooling radiator 210 can also be completely immersed in the cooling liquid. In this way, the entire surface of the liquid cooling radiator 210 can directly participate in the heat exchange of the cooling liquid, further improving the heat dissipation effect.

In one embodiment, the liquid cooling radiator 210 includes:

A heat conduction bracket; wherein, there is a liquid cooling channel in the heat conduction bracket;

There is cooling liquid in the liquid cooling channel.

Here, the liquid cooling radiator 210 may be a heat conduction bracket provided with a liquid cooling channel through which cooling liquid circulates.

Exemplarily, the heat conducting bracket may be a honeycomb structure, the honeycomb serves as a liquid cooling channel, and the outermost side of the honeycomb structure serves as the first surface 211 and the second surface 212 of the liquid cooling radiator 210 . The shape of the honeycomb can include hexagonal, four-sided, any irregular shape, etc. The thermally conductive support may include one or more honeycomb channels.

The honeycomb structure can be made of different metal partitions, or it can be made of a single material through drilling and other methods.

Heat dissipation is performed by cooling liquid flowing through the liquid cooling channel in the heat conducting bracket. On the one hand, the complexity of the structure and manufacturing process caused by the liquid cooling channel provided outside the liquid cooling radiator 210 can be reduced. On the other hand, the liquid cooling channel is arranged inside the liquid cooling radiator 210, which can shorten the heat exchange path and improve the efficiency of heat exchange.

In one embodiment, the heat conducting bracket includes:

The metal substrate, the liquid cooling channel includes: at least one through hole opened on the metal substrate.

As shown in Fig. 5 and the sectional view of the A-A direction in Fig. 5, as shown in Fig. 6, a liquid cooling channel 213 is provided on the liquid cooling radiator 210, that is, the metal substrate, and the printed circuit board may be a PCB with metal as the substrate, namely Metal-based PCBs. One or more through holes may be provided on the metal substrate as the liquid cooling channels 213 .

There is a first insulating layer 240 between the first circuit layer 220 and the metal substrate; there is a second insulating layer 250 between the second circuit layer 230 and the metal substrate. The heat of the first circuit layer 220 and the second circuit layer 230 can be conducted to the metal substrate, and the metal substrate performs heat exchange with the cooling liquid flowing in the through hole to play a role of heat dissipation.

By setting a through hole on the metal substrate as the liquid cooling channel 213, no additional liquid cooling channel 213 is required. On the one hand, the structure of the liquid cooling channel 213 is simplified. On the other hand, the liquid cooling channel 213 is arranged inside the metal substrate, which can shorten the heat The exchange path improves the efficiency of heat exchange.

In one embodiment, the metal substrate is an aluminum substrate.

The aluminum substrate has the characteristics of light weight and excellent thermal conductivity. On the one hand, the aluminum substrate can reduce the weight of the printed circuit board 200, and on the other hand, it can improve the heat conduction efficiency from the first circuit layer 220 and the second circuit layer 230 to the metal substrate, and improve the heat dissipation effect.

In one embodiment, the liquid cooling channel 213 includes: a liquid inlet for the cooling liquid to flow in, and a liquid outlet for the cooling liquid to flow out;

The liquid inlet is used to communicate with the heat exchange device;

The liquid outlet is used to communicate with the heat exchange device.

The cooling liquid may flow into the liquid cooling radiator 210 from the outside through the liquid inlet, and after completing heat exchange with the liquid cooling radiator 210 , flow out from the liquid outlet and flow into the heat exchange device.

The heat exchange device is used to exchange heat between the cooling liquid and the external environment, reduce the temperature of the cooling liquid flowing out of the liquid cooling radiator 210, and flow the cooled cooling liquid into the liquid cooling radiator 210 again to dissipate heat. device 210.

Exemplarily, the heat exchange device may include a first pipe connected to the liquid inlet, and a second pipe connected to the liquid outlet. The cooling liquid flows out from the heat exchange device, flows through the first pipe and then flows into the liquid cooling passage 213 of the liquid cooling radiator 210 from the liquid inlet. The cooling liquid absorbs the heat on the liquid cooling radiator 210 in the liquid cooling passage 213 , And flow out from the liquid outlet to the second pipeline, and then flow back to the heat exchange device, and the heat exchange device performs heat exchange between the cooling liquid and the external environment. One first pipeline can be connected to multiple liquid inlets at the same time, or one first pipeline can be connected to one liquid inlet. One second pipeline can be connected to multiple liquid outlets at the same time, or one second pipeline can be connected to one liquid outlet. The heat exchanging device may include cooling fins and cooling fans to dissipate heat from the coolant flowing through the heat exchanging device.

In one embodiment, a plurality of the liquid cooling channels are arranged in parallel and isolated from each other.

Liquid cooling channels can be set according to the distribution of electronic components. The liquid cooling channel can be set according to the actual heat distribution. For example, the liquid cooling channel can be evenly arranged in the metal substrate, so that the metal substrate can dissipate heat evenly. The liquid cooling channels can also be centrally arranged at the positions corresponding to the high-power electronic components, which can enhance the heat dissipation effect of the heat accumulation area.

Here, each liquid cooling channel 213 can be provided with a liquid inlet and a liquid outlet respectively, and the cooling liquid in the multiple liquid cooling channels 213 can be concentrated in a common heat exchange device for heat exchange with the external environment, or each The liquid cooling channel 213 is individually connected to one heat exchange device, and one heat exchange device may be connected to a predetermined number of liquid cooling channels, for example, one heat exchange device is connected to three liquid cooling channels 213 .

In one embodiment, the distance between the liquid cooling channels 213 can be set based on the heat generated by the first circuit layer 220 and/or the second circuit layer 230 .

The liquid cooling channel 213 can be set based on the heat distribution of the circuit layer. For example, in the area where the heat is generated, the distance between the liquid cooling channels 213 is reduced. In this way, a large number of liquid cooling channels 213 can be set under the same area. Improve heat exchange capacity. In the area where the heat generation is small, the distance between the liquid cooling channels 213 is enlarged.

By adjusting the distance between the liquid cooling channels 213, different regions of the metal substrate have different heat dissipation capabilities, reducing the temperature difference between different regions of the metal substrate. Reduce metal substrate deformation due to temperature differences in different areas.

As shown in FIG. 7 and the enlarged view of area B in FIG. 7 , the printed circuit board 200 includes: a liquid cooling radiator 210, a first circuit layer 220 and a second circuit layer arranged on the upper and lower surfaces of the liquid cooling radiator 210 230 , the first insulating layer 240 between the first circuit layer 220 and the liquid cooling radiator 210 , and the first insulating layer 250 between the second circuit layer 230 and the liquid cooling radiator 210 . A plurality of liquid cooling passages 213 are disposed inside the liquid cooling radiator 210 . The first circuit layer 220 and the second circuit layer 230 are provided with electronic components 300 such as integrated circuits that generate heat.

During operation, electronic components 300 such as integrated circuits generate heat, which is conducted to the liquid cooling radiator 210 through the first circuit layer 220 and the first insulating layer 240; and/or other electronic components 300 generate heat, which passes through the second circuit layer 230 and the second insulating layer 250 to the liquid cooling radiator 210 . Conducted to the liquid cooling radiator 210 to exchange heat with the cooling liquid circulating through the liquid cooling channel 213 , thereby reducing the temperature of the liquid cooling radiator 210 , and further dissipating heat for the printed circuit board.

In an embodiment of the present invention, as shown in FIG. 9 , a computing power board is provided, including:

The printed circuit board 200 shown in FIG. 2;

The electronic component 300, the electronic component at least includes: a chip; the electronic component is arranged on the first circuit layer and/or on the first circuit layer of the printed circuit board.

Here, the hash board is used to provide the computing power of the computer, and the computing power includes but is not limited to integer computing power, floating-point computing power, artificial intelligence (AI) computing power, and the like. Hashboards can be used in computers, servers and other equipment to provide the necessary machine computing power.

The first circuit layer on the printed circuit board and/or the first circuit layer are used to connect different electronic components, so as to realize a complete circuit and further realize a computing function.

Here, the electronic components 300 may include active electronic components such as chips, and passive electronic components such as resistors and capacitors.

Here, the chip may include: an unpackaged die, or may refer to a packaged integrated circuit (IC) including a die.

In one embodiment, the chip includes: an application specific integrated chip ASIC.

ASIC refers to integrated circuits designed and manufactured based on user requirements and/or the needs of specific electronic systems. ASICs can be used to perform specific computing functions. The ASIC can be connected to the first circuit layer or the second circuit layer by means of soldering or the like. During operation, the ASIC generates heat, which spreads to the printed circuit board by means of conduction or the like.

As shown in FIG. 2, a printed circuit board 200 is provided: comprising:

A liquid cooling radiator 210, wherein the liquid cooling radiator 210 has a first surface 211 and a second surface 212; wherein the second surface 212 is the opposite surface of the first surface 211;

The first circuit layer 220 is located on the first surface 211, wherein the first circuit layer 220 includes: a printed circuit;

The second circuit layer 230 is located on the second surface 212 , wherein the second circuit layer 230 includes: a printed circuit.

The liquid cooling radiator 210 can be made of materials with high thermal conductivity, such as metal materials or synthetic materials. The printed circuit of the first circuit layer 220 and the printed circuit of the second circuit layer 230 may include but not limited to: etched copper clad layer and the like. Printed circuits can be used to connect electronic components. Electronic components may include, but are not limited to: power devices that generate heat, integrated circuit chips that perform massive calculations, such as ASICs and other high-power computing chips used in supercomputing equipment.

The liquid cooling radiator 210 may use cooling liquid for heat exchange. A liquid cooling channel for cooling liquid to flow may be provided, but not limited to, inside the liquid cooling radiator 210 or on the outer surface of the liquid cooling radiator 210 . The liquid cooling channel provided on the surface of the liquid cooling radiator 210 may be a metal pipe or the like that is in close contact with the surface of the liquid cooling radiator 210 by means of welding or the like.

The coolant flowing through the liquid-cooling channel can have a lower temperature, and the coolant exchanges heat with the liquid-cooled radiator 210 with a higher temperature, thereby reducing the temperature of the liquid-cooled radiator 210 and playing the role of cooling the electronic components. . Cooling fluids include, but are not limited to: dehydration, ethanol, electronic fluorinated fluid, and/or mineral oil, etc.

In one embodiment, as shown in FIG. 3 , there is a first insulating layer 240 between the first circuit layer 220 and the liquid cooling radiator 210; the second circuit layer 230 and the liquid cooling radiator There is a second insulating layer 250 between 210 .

The material used in the liquid cooling radiator 210 may cause the abnormal operation of the printed circuit, for example, the high conductivity of the material used in the liquid cooling radiator 210 may cause a short circuit in the printed circuit and/or impedance mismatch. A conductivity threshold for a printed circuit short circuit and/or impedance mismatch can be preset, and when the conductivity of the material used in the liquid cooling radiator 210 exceeds the conductivity threshold, it can be determined that the liquid cooling radiator 210 causes a short circuit of the printed circuit and/or impedance Mismatch etc.

In order to reduce the influence of the liquid cooling radiator 210 on the printed circuit, a first insulating layer 240 can be provided between the first circuit layer 220 and the liquid cooling radiator 210, and a first insulating layer 240 can be provided between the second circuit layer 230 and the liquid cooling radiator 210. The second insulating layer 250 plays an insulating role between the first circuit layer 220 and the liquid cooling radiator 210, and between the second circuit layer 230 and the liquid cooling radiator 210, reducing the impact of the liquid cooling radiator 210 on the normal operation of the printed circuit. Influence, improve the stability of the printed circuit.

Exemplarily, the first insulating layer 240 and the second insulating layer 250 may be made of materials with high thermal conductivity and high insulation. For example, the first insulating layer 240 and the second insulating layer 250 may be a polymer filled with ceramic powder. On the one hand, the first insulating layer 240 and the second insulating layer 250 can play the role of insulation; on the other hand, the heat generated in the first circuit layer 220 and the second circuit layer 230 can pass through the first insulating layer 240 and the second The insulating layer 250 conducts to the liquid cooling heat sink 210 .

In one embodiment, the chip is electroplated with a metal heat conduction layer; the metal heat conduction layer is electrically connected to the first circuit layer 220 or the second circuit layer 230 through a solder layer.

As shown in Figure 4, electronic components 300 such as integrated circuit chips (IC) are welded on the first circuit layer 220 and the second circuit layer 230 through the solder layer 270, and the integrated circuit chip includes a chip (Die) 301 that performs operations and generates heat Composed of the metal heat conduction layer 302, the metal heat conduction layer 302 may include: wires for electrically connecting the Die 301 to the outside, heat conductors for conducting the Die 301 to generate heat, and the like. The metal heat conduction layer 302 of the integrated circuit chip is connected to the first circuit layer 220 and the second circuit layer 230 through the solder layer 270 .

Electronic components such as integrated circuit chips generate a lot of heat during operation. Heat can be conducted from the electronic components to the first circuit layer 220 and/or the second circuit layer 230 , such as through the metal heat conduction layer 302 in the integrated circuit chip to the first circuit layer 220 and/or the second circuit layer 230 . At the same time, for electronic components with high power, the current on the internal wires of the electronic components and the printed circuit wires connected to the electronic components is relatively large, and the heat generated by the current in the internal wires and printed circuits is also high. Gather to the first circuit layer 220 and/or the second circuit layer 230 . Since the first circuit layer 220 and the second circuit layer 230 cover the surface of the liquid cooling radiator 210 and have a large contact area, the heat accumulated on the first circuit layer 220 and the second circuit layer 230 can be directly transferred to the liquid cooling radiator 210.

The heat generated in the first circuit layer 220 and/or the second circuit layer 230 is transferred to the liquid cooling radiator 210 through heat conduction, and the liquid cooling radiator 210 exchanges heat with the cooling liquid to the outside, Thereby, the temperature of the first circuit layer 220 and/or the second circuit layer 230 is lowered.

In this way, by disposing circuit layers on both surfaces of the liquid cooling radiator 210 , on the one hand, disposing two circuit layers on both surfaces of the liquid cooling radiator 210 increases the circuit wiring area compared with a single circuit layer. On the other hand, since the first circuit layer 220 and the second circuit layer 230 are attached to the surface of the liquid cooling radiator 210, the heat conduction area is larger, and the heat generated by the circuit layer can be directly conducted to the liquid cooling radiator 210, which has the advantages of High thermal conductivity. On the other hand, heat exchange is carried out through liquid cooling with high heat dissipation efficiency, which improves the heat dissipation efficiency of electronic components on the circuit layer, thereby meeting the heat dissipation requirements of high-power integrated circuit chips.

In one embodiment, if the cooling liquid has better insulating properties, such as electronic fluorinated liquid, the liquid cooling radiator 210 can also be completely immersed in the cooling liquid. In this way, the entire surface of the liquid cooling radiator 210 can directly participate in the heat exchange of the cooling liquid, further improving the heat dissipation effect.

In one embodiment, the liquid cooling radiator 210 includes:

A heat conduction bracket; wherein, there is a liquid cooling channel in the heat conduction bracket;

There is cooling liquid in the liquid cooling channel.

Here, the liquid cooling radiator 210 may be a heat conduction bracket provided with a liquid cooling channel through which cooling liquid circulates.

Exemplarily, the heat conducting bracket may be a honeycomb structure, the honeycomb serves as a liquid cooling channel, and the outermost side of the honeycomb structure serves as the first surface 211 and the second surface 212 of the liquid cooling radiator 210 . The shape of the honeycomb can include hexagonal, four-sided, any irregular shape, etc. The thermally conductive support may include one or more honeycomb channels.

The honeycomb structure can be made of different metal partitions, or it can be made of a single material through drilling and other methods.

Heat dissipation is performed by cooling liquid flowing through the liquid cooling channel in the heat conducting bracket. On the one hand, the complexity of the structure and manufacturing process caused by the liquid cooling channel provided outside the liquid cooling radiator 210 can be reduced. On the other hand, the liquid cooling channel is arranged inside the liquid cooling radiator 210, which can shorten the heat exchange path and improve the efficiency of heat exchange.

In one embodiment, the heat conducting bracket includes:

The metal substrate, the liquid cooling channel includes: at least one through hole opened on the metal substrate.

As shown in Fig. 5 and the sectional view of the A-A direction in Fig. 5, as shown in Fig. 6, a liquid cooling channel 213 is provided on the liquid cooling radiator 210, that is, the metal substrate, and the printed circuit board may be a PCB with metal as the substrate, namely Metal-based PCBs. One or more through holes may be provided on the metal substrate as the liquid cooling channels 213 .

There is a first insulating layer 240 between the first circuit layer 220 and the metal substrate; there is a second insulating layer 250 between the second circuit layer 230 and the metal substrate. The heat of the first circuit layer 220 and the second circuit layer 230 can be conducted to the metal substrate, and the metal substrate performs heat exchange with the cooling liquid flowing in the through hole to play a role of heat dissipation.

By setting a through hole on the metal substrate as the liquid cooling channel 213, no additional liquid cooling channel 213 is required. On the one hand, the structure of the liquid cooling channel 213 is simplified. On the other hand, the liquid cooling channel 213 is arranged inside the metal substrate, which can shorten the heat The exchange path improves the efficiency of heat exchange.

In one embodiment, the metal substrate is an aluminum substrate.

The aluminum substrate has the characteristics of light weight and excellent thermal conductivity. On the one hand, the aluminum substrate can reduce the weight of the printed circuit board 200, and on the other hand, it can improve the heat conduction efficiency from the first circuit layer 220 and the second circuit layer 230 to the metal substrate, and improve the heat dissipation effect.

In one embodiment, the liquid cooling channel 213 includes: a liquid inlet for the cooling liquid to flow in, and a liquid outlet for the cooling liquid to flow out;

The liquid inlet is used to communicate with the heat exchange device;

The liquid outlet is used to communicate with the heat exchange device.

The cooling liquid may flow into the liquid cooling radiator 210 from the outside through the liquid inlet, and after completing heat exchange with the liquid cooling radiator 210 , flow out from the liquid outlet and flow into the heat exchange device.

The heat exchange device is used to exchange heat between the cooling liquid and the external environment, reduce the temperature of the cooling liquid flowing out of the liquid cooling radiator 210, and flow the cooled cooling liquid into the liquid cooling radiator 210 again to dissipate heat. device 210.

Exemplarily, the heat exchange device may include a first pipe connected to the liquid inlet, and a second pipe connected to the liquid outlet. The cooling liquid flows out from the heat exchange device, flows through the first pipe and then flows into the liquid cooling passage 213 of the liquid cooling radiator 210 from the liquid inlet. The cooling liquid absorbs the heat on the liquid cooling radiator 210 in the liquid cooling passage 213, And flow out from the liquid outlet to the second pipeline, and then flow back to the heat exchange device, and the heat exchange device performs heat exchange between the cooling liquid and the external environment. One first pipeline can be connected to multiple liquid inlets at the same time, or one first pipeline can be connected to one liquid inlet. One second pipeline can be connected to multiple liquid outlets at the same time, or one second pipeline can be connected to one liquid outlet. The heat exchanging device may include cooling fins and cooling fans to dissipate heat from the coolant flowing through the heat exchanging device.

In one embodiment, a plurality of the liquid cooling channels are arranged in parallel and isolated from each other.

Liquid cooling channels can be set according to the distribution of electronic components. The liquid cooling channel can be set according to the actual heat distribution. For example, the liquid cooling channel can be evenly arranged in the metal substrate, so that the metal substrate can dissipate heat evenly. The liquid cooling channels can also be centrally arranged at the positions corresponding to the high-power electronic components, which can enhance the heat dissipation effect of the heat accumulation area.

Here, each liquid cooling channel 213 can be respectively provided with a liquid inlet and a liquid outlet, and the cooling liquid in the plurality of liquid cooling channels 213 can be concentrated in a common heat exchange device for heat exchange with the external environment, or each Each liquid cooling channel 213 is individually connected to one heat exchange device, and one heat exchange device may be connected to a predetermined number of liquid cooling channels, for example, one heat exchange device is connected to three liquid cooling channels 213 .

In one embodiment, the distance between the liquid cooling channels 213 can be set based on the heat generated by the first circuit layer 220 and/or the second circuit layer 230 .

The liquid cooling channel 213 can be set based on the heat distribution of the circuit layer. For example, in the area where the heat is generated, the distance between the liquid cooling channels 213 is reduced. In this way, a large number of liquid cooling channels 213 can be set under the same area. Improve heat exchange capacity. In the area where the heat generation is small, the distance between the liquid cooling channels 213 is enlarged.

By adjusting the distance between the liquid cooling channels 213, different regions of the metal substrate have different heat dissipation capabilities, reducing the temperature difference between different regions of the metal substrate. Reduce metal substrate deformation due to temperature differences in different areas.

As shown in FIG. 7 and the enlarged view of area B in FIG. 7 and FIG. 8, the printed circuit board 200 includes: a liquid cooling radiator 210, a first circuit layer 220 and a second circuit layer arranged on the upper and lower surfaces of the liquid cooling radiator 210 layer 230 , the first insulating layer 240 between the first circuit layer 220 and the liquid cooling radiator 210 , and the first insulating layer 250 between the second circuit layer 230 and the liquid cooling radiator 210 . A plurality of liquid cooling passages 213 are disposed inside the liquid cooling radiator 210 . The first circuit layer 220 and the second circuit layer 230 are provided with electronic components such as integrated circuits 300 that generate heat.

During operation, electronic components 300 such as integrated circuits generate heat, which is conducted to the liquid cooling radiator 210 through the first circuit layer 220 and the first insulating layer 240; and/or electronic components 300 such as integrated circuits generate heat, which is transmitted through the second circuit Layer 230 and second insulating layer 250 conduct to liquid cooling heat sink 210 . Conducted to the liquid cooling radiator 210 to exchange heat with the cooling liquid circulating through the liquid cooling channel 213 , thereby reducing the temperature of the liquid cooling radiator 210 , and further dissipating heat for the printed circuit board 200 .

In an embodiment of the present invention, as shown in FIG. 10 , an electronic device 2 is provided, and the electronic device 2 includes: the computing power board 20 shown in FIG. 9 . Here, electronic devices include but are not limited to terminals, computers, servers, and the like. Electronic devices provide machine computing power through hash boards.

Here, the power board 20 shown in FIG. 9 includes: the printed circuit board 200 shown in FIG. 2 ;

The electronic component 300, the electronic component at least includes: a chip; the electronic component is arranged on the first circuit layer and/or on the first circuit layer of the printed circuit board.

Here, the hash board is used to provide the computing power of the computer, and the computing power includes but is not limited to integer computing power, floating-point computing power, artificial intelligence (AI) computing power, and the like. Hashboards can be used in computers, servers and other equipment to provide the necessary machine computing power.

The first circuit layer on the printed circuit board and/or the first circuit layer are used to connect different electronic components, so as to realize a complete circuit and further realize a computing function.

Here, the electronic components may include active electronic components such as chips, and passive electronic components such as resistors and capacitors.

Here, here, a chip may include: an unpackaged die, or may refer to a packaged integrated circuit (IC) including a die.

In one embodiment, the chip includes: an application specific integrated chip ASIC.

ASIC refers to integrated circuits designed and manufactured based on user requirements and/or the needs of specific electronic systems. ASICs can be used to perform specific computing functions. The ASIC can be connected to the first circuit layer or the second circuit layer by means of soldering or the like. During operation, the ASIC generates heat, which spreads to the printed circuit board by means of conduction or the like.

As shown in FIG. 2, a printed circuit board 200 is provided: comprising:

A liquid cooling radiator 210, wherein the liquid cooling radiator 210 has a first surface 211 and a second surface 212; wherein the second surface 212 is the opposite surface of the first surface 211;

The first circuit layer 220 is located on the first surface 211, wherein the first circuit layer 220 includes: a printed circuit;

The second circuit layer 230 is located on the second surface 212 , wherein the second circuit layer 230 includes: a printed circuit.

The liquid cooling radiator 210 can be made of materials with high thermal conductivity, such as metal materials or synthetic materials. The printed circuit of the first circuit layer 220 and the printed circuit of the second circuit layer 230 may include but not limited to: etched copper clad layer and the like. Printed circuits can be used to connect electronic components. Electronic components may include, but are not limited to: power devices that generate heat, integrated circuit chips that perform massive calculations, such as ASICs and other high-power computing chips used in supercomputing equipment.

The liquid cooling radiator 210 may use cooling liquid for heat exchange. A liquid cooling channel for cooling liquid to flow may be provided, but not limited to, inside the liquid cooling radiator 210 or on the outer surface of the liquid cooling radiator 210 . The liquid cooling channel provided on the surface of the liquid cooling radiator 210 may be a metal pipe or the like that is in close contact with the surface of the liquid cooling radiator 210 by means of welding or the like.

The coolant flowing through the liquid-cooling channel can have a lower temperature, and the coolant exchanges heat with the liquid-cooled radiator 210 with a higher temperature, thereby reducing the temperature of the liquid-cooled radiator 210 and playing the role of cooling the electronic components. . Cooling fluids include, but are not limited to: dehydration, ethanol, electronic fluorinated fluid, and/or mineral oil, etc.

In one embodiment, as shown in FIG. 3 , there is a first insulating layer 240 between the first circuit layer 220 and the liquid cooling radiator 210; the second circuit layer 230 and the liquid cooling radiator There is a second insulating layer 250 between 210 .

The material used in the liquid cooling radiator 210 may cause abnormal operation of the printed circuit. For example, the high conductivity of the material used in the liquid cooling radiator 210 may cause a short circuit in the printed circuit and/or impedance mismatch. A conductivity threshold for a printed circuit short circuit and/or impedance mismatch can be preset, and when the conductivity of the material used in the liquid cooling radiator 210 exceeds the conductivity threshold, it can be determined that the liquid cooling radiator 210 causes a short circuit of the printed circuit and/or impedance Mismatch etc.

In order to reduce the influence of the liquid cooling radiator 210 on the printed circuit, a first insulating layer 240 can be provided between the first circuit layer 220 and the liquid cooling radiator 210, and a first insulating layer 240 can be provided between the second circuit layer 230 and the liquid cooling radiator 210. The second insulating layer 250 plays an insulating role between the first circuit layer 220 and the liquid cooling radiator 210, and between the second circuit layer 230 and the liquid cooling radiator 210, reducing the impact of the liquid cooling radiator 210 on the normal operation of the printed circuit. Influence, improve the stability of the printed circuit.

Exemplarily, the first insulating layer 240 and the second insulating layer 250 may be made of materials with high thermal conductivity and high insulation. For example, the first insulating layer 240 and the second insulating layer 250 may be a polymer filled with ceramic powder. On the one hand, the first insulating layer 240 and the second insulating layer 250 can play the role of insulation; on the other hand, the heat generated in the first circuit layer 220 and the second circuit layer 230 can pass through the first insulating layer 240 and the second The insulating layer 250 conducts to the liquid cooling heat sink 210 .

In one embodiment, the chip is electroplated with a metal heat conduction layer; the metal heat conduction layer is electrically connected to the first circuit layer 220 or the second circuit layer 230 through a solder layer.

As shown in Figure 4, electronic components 300 such as integrated circuit chips (IC) are welded on the first circuit layer 220 and the second circuit layer 230 through the solder layer 270, and the integrated circuit chip includes a chip (Die) 301 that performs operations and generates heat Composed of the metal heat conduction layer 302, the metal heat conduction layer 302 may include: wires for electrically connecting the Die 301 to the outside, heat conductors for conducting the Die 301 to generate heat, and the like. The metal heat conduction layer 302 of the integrated circuit chip is connected to the first circuit layer 220 and the second circuit layer 230 through the solder layer 270 .

Electronic components such as integrated circuit chips generate a lot of heat during operation. Heat can be conducted from the electronic components to the first circuit layer 220 and/or the second circuit layer 230 , such as through the metal heat conduction layer 302 in the integrated circuit chip to the first circuit layer 220 and/or the second circuit layer 230 . At the same time, for electronic components with high power, the current on the internal wires of the electronic components and the printed circuit wires connected to the electronic components is relatively large, and the heat generated by the current in the internal wires and printed circuits is also high. Gather to the first circuit layer 220 and/or the second circuit layer 230 . Since the first circuit layer 220 and the second circuit layer 230 cover the surface of the liquid cooling radiator 210 and have a large contact area, the heat accumulated on the first circuit layer 220 and the second circuit layer 230 can be directly transferred to the liquid cooling radiator 210.

The heat generated in the first circuit layer 220 and/or the second circuit layer 230 is transferred to the liquid cooling radiator 210 through heat conduction, and the liquid cooling radiator 210 exchanges heat with the cooling liquid to the outside, Thereby, the temperature of the first circuit layer 220 and/or the second circuit layer 230 is lowered.

In this way, by disposing circuit layers on both surfaces of the liquid cooling radiator 210 , on the one hand, disposing two circuit layers on both surfaces of the liquid cooling radiator, compared with a single circuit layer, increases the circuit wiring area. On the other hand, since the first circuit layer 220 and the second circuit layer 230 are attached to the surface of the liquid cooling radiator 210, the heat conduction area is larger, and the heat generated by the circuit layer can be directly conducted to the liquid cooling radiator 210, which has the advantages of High thermal conductivity. On the other hand, heat exchange is carried out through liquid cooling with high heat dissipation efficiency, which improves the heat dissipation efficiency of electronic components on the circuit layer, thereby meeting the heat dissipation requirements of high-power integrated circuit chips.

In one embodiment, if the cooling liquid has better insulating properties, such as electronic fluorinated liquid, the liquid cooling radiator 210 can also be completely immersed in the cooling liquid. In this way, the entire surface of the liquid cooling radiator 210 can directly participate in the heat exchange of the cooling liquid, further improving the heat dissipation effect.

In one embodiment, the liquid cooling radiator 210 includes:

A heat conduction bracket; wherein, there is a liquid cooling channel in the heat conduction bracket;

There is cooling liquid in the liquid cooling channel.

Here, the liquid cooling radiator 210 may be a heat conduction bracket provided with a liquid cooling channel through which cooling liquid circulates.

Exemplarily, the heat conducting bracket may be a honeycomb structure, the honeycomb serves as a liquid cooling channel, and the outermost side of the honeycomb structure serves as the first surface 211 and the second surface 212 of the liquid cooling radiator 210 . The shape of the honeycomb can include hexagonal, four-sided, any irregular shape, etc. The thermally conductive support may include one or more honeycomb channels.

The honeycomb structure can be made of different metal partitions, or it can be made of a single material through drilling and other methods.

Heat dissipation is performed by cooling liquid flowing through the liquid cooling channel in the heat conducting bracket. On the one hand, the complexity of the structure and manufacturing process caused by the liquid cooling channel provided outside the liquid cooling radiator 210 can be reduced. On the other hand, the liquid cooling channel is arranged inside the liquid cooling radiator 210, which can shorten the heat exchange path and improve the efficiency of heat exchange.

In one embodiment, the heat conducting bracket includes:

The metal substrate, the liquid cooling channel includes: at least one through hole opened on the metal substrate.

As shown in Fig. 5 and the sectional view of the A-A direction in Fig. 5, as shown in Fig. 6, a liquid cooling channel 213 is provided on the liquid cooling radiator 210, that is, the metal substrate, and the printed circuit board may be a PCB with metal as the substrate, namely Metal-based PCBs. One or more through holes may be provided on the metal substrate as the liquid cooling channels 213 .

There is a first insulating layer 240 between the first circuit layer 220 and the metal substrate; there is a second insulating layer 250 between the second circuit layer 230 and the metal substrate. The heat of the first circuit layer 220 and the second circuit layer 230 can be conducted to the metal substrate, and the metal substrate performs heat exchange with the cooling liquid flowing in the through hole to play a role of heat dissipation.

By setting a through hole on the metal substrate as the liquid cooling channel 213, no additional liquid cooling channel 213 is required. On the one hand, the structure of the liquid cooling channel 213 is simplified. On the other hand, the liquid cooling channel 213 is arranged inside the metal substrate, which can shorten the heat The exchange path improves the efficiency of heat exchange.

In one embodiment, the metal substrate is an aluminum substrate.

The aluminum substrate has the characteristics of light weight and excellent thermal conductivity. On the one hand, the aluminum substrate can reduce the weight of the printed circuit board 200, and on the other hand, it can improve the heat conduction efficiency from the first circuit layer 220 and the second circuit layer 230 to the metal substrate, and improve the heat dissipation effect.

In one embodiment, the liquid cooling channel 213 includes: a liquid inlet for the cooling liquid to flow in, and a liquid outlet for the cooling liquid to flow out;

The liquid inlet is used to communicate with the heat exchange device;

The liquid outlet is used to communicate with the heat exchange device.

The cooling liquid may flow into the liquid cooling radiator 210 from the outside through the liquid inlet, and after completing heat exchange with the liquid cooling radiator 210 , flow out from the liquid outlet and flow into the heat exchange device.

The heat exchange device is used to exchange heat between the cooling liquid and the external environment, reduce the temperature of the cooling liquid flowing out of the liquid cooling radiator 210, and flow the cooled cooling liquid into the liquid cooling radiator 210 again to dissipate heat. device 210.

Exemplarily, the heat exchange device may include a first pipe connected to the liquid inlet, and a second pipe connected to the liquid outlet. The cooling liquid flows out from the heat exchange device, flows through the first pipe and then flows into the liquid cooling passage 213 of the liquid cooling radiator 210 from the liquid inlet. The cooling liquid absorbs the heat on the liquid cooling radiator 210 in the liquid cooling passage 213 , And flow out from the liquid outlet to the second pipeline, and then flow back to the heat exchange device, and the heat exchange device performs heat exchange between the cooling liquid and the external environment. One first pipeline can be connected to multiple liquid inlets at the same time, or one first pipeline can be connected to one liquid inlet. One second pipeline can be connected to multiple liquid outlets at the same time, or one second pipeline can be connected to one liquid outlet. The heat exchanging device may include cooling fins and cooling fans to dissipate heat from the coolant flowing through the heat exchanging device.

In one embodiment, a plurality of the liquid cooling channels are arranged in parallel and isolated from each other.

Liquid cooling channels can be set according to the distribution of electronic components. The liquid cooling channel can be set according to the actual heat distribution. For example, the liquid cooling channel can be evenly arranged in the metal substrate, so that the metal substrate can dissipate heat evenly. The liquid cooling channels can also be centrally arranged at the positions corresponding to the high-power electronic components, which can enhance the heat dissipation effect of the heat accumulation area.

Here, each liquid cooling channel 213 can be provided with a liquid inlet and a liquid outlet respectively, and the cooling liquid in the multiple liquid cooling channels 213 can be concentrated in a common heat exchange device for heat exchange with the external environment, or each The liquid cooling channel 213 is individually connected to one heat exchange device, and one heat exchange device may be connected to a predetermined number of liquid cooling channels, for example, one heat exchange device is connected to three liquid cooling channels 213 .

In one embodiment, the distance between the liquid cooling channels 213 can be set based on the heat generated by the first circuit layer 220 and/or the second circuit layer 230 .

The liquid cooling channel 213 can be set based on the heat distribution of the circuit layer. For example, in the area where the heat is generated, the distance between the liquid cooling channel 213 is reduced. In this way, a large number of liquid cooling channels 213 can be set under the same area. Improve heat exchange capacity. In the area where the heat generation is small, the distance between the liquid cooling channels 213 is enlarged.

By adjusting the distance between the liquid cooling channels 213, different regions of the metal substrate have different heat dissipation capabilities, reducing the temperature difference between different regions of the metal substrate. Reduce metal substrate deformation due to temperature differences in different areas.

As shown in FIG. 7 and the enlarged view of area B in FIG. 7 , the printed circuit board 200 includes: a liquid cooling radiator 210, a first circuit layer 220 and a second circuit layer arranged on the upper and lower surfaces of the liquid cooling radiator 210 230 , the first insulating layer 240 between the first circuit layer 220 and the liquid cooling radiator 210 , and the first insulating layer 250 between the second circuit layer 230 and the liquid cooling radiator 210 . A plurality of liquid cooling passages 213 are disposed inside the liquid cooling radiator 210 . The first circuit layer 220 and the second circuit layer 230 are provided with electronic components such as integrated circuits 300 that generate heat.

During operation, electronic components 300 such as integrated circuits generate heat, which is conducted to the liquid cooling radiator 210 through the first circuit layer 220 and the first insulating layer 240; and/or electronic components 300 such as integrated circuits generate heat, which is transmitted through the second circuit Layer 230 and second insulating layer 250 conduct to liquid cooling heat sink 210 . Conducted to the liquid cooling radiator 210 to exchange heat with the cooling liquid circulating through the liquid cooling channel 213 , thereby reducing the temperature of the liquid cooling radiator 210 , and further dissipating heat for the printed circuit board 200 .

The methods disclosed in several method embodiments provided in the present disclosure can be combined arbitrarily without conflict to obtain new method embodiments.

The features disclosed in several product embodiments provided in the present disclosure can be combined arbitrarily without conflict to obtain new product embodiments.

The features disclosed in several method or product embodiments provided in the present disclosure can be combined arbitrarily without conflict to obtain new method embodiments or product embodiments.

Other embodiments of the present disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. The present disclosure is intended to cover any modification, use or adaptation of the present disclosure. These modifications, uses or adaptations follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field not disclosed in the present disclosure. . The specification and examples are to be considered exemplary only, with the true scope and spirit of the disclosure indicated by the appended claims.

It should be understood that the present disclosure is not limited to the precise constructions which have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (11)

1. A printed circuit board, characterized in that, comprising: A liquid cooling radiator, wherein the liquid cooling radiator has a first surface and a second surface; wherein the second surface is the opposite surface of the first surface; A first circuit layer located on the first surface, wherein the first circuit layer includes: a printed circuit; The second circuit layer is located on the second surface, wherein the second circuit layer includes: a printed circuit. 2. The printed wiring board according to claim 1, characterized in that, The liquid cooling radiator includes: A heat conduction bracket; wherein, there is a liquid cooling channel in the heat conduction bracket; There is cooling liquid in the liquid cooling channel. 3. The printed wiring board according to claim 2, characterized in that, The heat conduction bracket includes: The metal substrate, the liquid cooling channel includes: at least one through hole opened on the metal substrate. 4. The printed wiring board according to claim 3, characterized in that, The metal substrate is an aluminum substrate. 5. The printed wiring board according to claim 2, characterized in that, The liquid cooling channel includes: a liquid inlet for the cooling liquid to flow in, and a liquid outlet for the cooling liquid to flow out; The liquid inlet is used to communicate with the heat exchange device; The liquid outlet is used to communicate with the heat exchange device. 6. The printed wiring board according to claim 2, characterized in that, A plurality of the liquid cooling channels are arranged in parallel and isolated from each other. 7. The printed wiring board according to any one of claims 1 to 6, characterized in that, There is a first insulating layer between the first circuit layer and the liquid cooling radiator; There is a second insulating layer between the second circuit layer and the liquid cooling radiator. 8. A hash board, characterized in that it includes: The printed wiring board according to any one of claims 1 to 7; The electronic components at least include: a chip; the electronic components are arranged on the first circuit layer and/or on the first circuit layer of the printed circuit board. 9. The hash board according to claim 8, characterized in that, The chip includes: an application specific integrated chip ASIC. 10. The hash board according to claim 8, characterized in that, The chip is electroplated with a metal heat conducting layer; The metal heat conducting layer is electrically connected to the first circuit layer or the second circuit layer through a solder layer. 11. An electronic device, characterized in that the electronic device comprises: the hashboard according to any one of claims 8 to 10.

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