CN116156301A - Lens base, lens assembly and camera module - Google Patents
Lens base, lens assembly and camera module Download PDFInfo
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- CN116156301A CN116156301A CN202111386026.0A CN202111386026A CN116156301A CN 116156301 A CN116156301 A CN 116156301A CN 202111386026 A CN202111386026 A CN 202111386026A CN 116156301 A CN116156301 A CN 116156301A
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- lens assembly
- supporting portion
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- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 12
- 238000009434 installation Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The application discloses a lens holder, camera lens subassembly and module of making a video recording. The lens base comprises: the lens assembly comprises a body, a lens assembly and a lens assembly, wherein the body is provided with a top surface, a bottom surface opposite to the top surface and a lens mounting hole penetrating from the top surface to the bottom surface; a support part extending and protruding from the edge of the bottom surface of the body along the direction from the top surface of the body to the bottom surface of the body; the supporting part surrounds the lens mounting hole, and at least one side wall of the supporting part is provided with an avoidance groove for accommodating electronic components. The lens assembly comprises a lens and the lens seat, and the lens is arranged in a lens mounting hole of the lens seat. The camera shooting module comprises a circuit board and the lens assembly, wherein at least one electronic component is installed on the surface of the circuit board, and the supporting part of the lens assembly is fixed on the circuit board. The embodiment of the application not only can reduce the size and realize the miniaturization of the camera module without reducing the area of the photosensitive chip and the number of electronic components, but also can prevent light leakage.
Description
Technical Field
The application relates to the technical field of optical elements, in particular to a lens base, a lens assembly and a camera module.
Background
Along with the popularization of intelligent equipment, a camera module applied to the intelligent equipment is rapidly developed and advanced, and miniaturization has become a development trend of the camera module. In order to meet the ever-increasing photographing demands of people, the pixels of the photographing module are more and more, and the area of the photosensitive chip is gradually increased, so that miniaturization is difficult to realize on the premise of not reducing the area of the photosensitive chip and the number of electronic components.
Content of the application
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the embodiment of the application provides a lens holder, a lens assembly and a camera module, so that the size of the camera module is reduced and the miniaturization of the camera module is realized on the premise of not reducing the area of a photosensitive chip and the number of electronic components, and light leakage is prevented.
According to an embodiment of the first aspect of the present application, a lens holder includes: the lens assembly comprises a body, a lens assembly and a lens assembly, wherein the body is provided with a top surface, a bottom surface opposite to the top surface and a lens mounting hole penetrating from the top surface to the bottom surface; and a support part extending and protruding from the edge of the bottom surface of the body along the direction from the top surface of the body to the bottom surface of the body; the support part surrounds the lens mounting hole, and at least one side wall of the support part is provided with an avoidance groove for accommodating electronic components.
According to one embodiment of the present application, the avoidance groove is formed on an inner side wall of the support portion or an outer side wall of the support portion.
According to one embodiment of the application, the wall thickness of the portion of the support part provided with the avoidance groove is not more than 0.1mm.
According to one embodiment of the application, the projection of the avoidance groove on the horizontal plane covers the projection of the electronic component on the horizontal plane.
According to one embodiment of the application, the volume of the avoidance groove is larger than the volume of the electronic component.
According to an embodiment of the second aspect of the present application, a lens assembly includes: a lens; and a lens mount as recited in any one of the first aspects; wherein, the lens is installed in the lens mounting hole of the lens holder.
According to an embodiment of the third aspect of the present application, an image capturing module includes: a circuit board; and the lens assembly described in the second aspect; at least one electronic component is mounted on the surface of the circuit board, and the supporting portion of the lens assembly is fixed to the circuit board.
According to an embodiment of the application, the avoidance groove is formed in the inner side wall of the supporting portion, and the distance between the edge of the circuit board and the outer edge of the electronic component is matched with the wall thickness of the position of the avoidance groove of the supporting portion.
According to an embodiment of the application, the avoidance groove is formed in the outer side wall of the supporting portion, and the edge of the circuit board is flush with the outer edge of the electronic component.
According to an embodiment of the application, the number of the electronic components is multiple, and the upper surfaces of the electronic components and the board surfaces of the circuit boards between two adjacent electronic components are all adhesive glue coating areas.
According to the lens base, the lens assembly and the camera shooting module, the avoidance groove for accommodating the electronic component is formed in the side wall of the supporting portion of the lens base, after the lens base is fixed to the circuit board, the electronic component mounted on the circuit board can be embedded into the supporting portion, so that the size of the lens base in the horizontal direction can be guaranteed to accommodate the photosensitive chip only by guaranteeing the space formed by surrounding the inner side wall of the supporting portion, the installation space is not required to be reserved for the electronic component, and the size of the lens base in the horizontal direction is remarkably reduced. In addition, the mirror base can realize that the mirror base is fixedly connected with the circuit board by means of the inner wall of the avoidance groove and the part of the support part, which is not provided with the avoidance groove, so that the circuit board does not need to reserve a gluing area at the periphery of the electronic component, and the size of the camera module is indirectly reduced. In addition, in order to facilitate installation and avoid damaging the electronic components, the size of the avoidance groove is usually slightly larger than that of the electronic components, that is, a certain gap exists between the electronic components and the inner wall of the avoidance groove after the electronic components are embedded into the avoidance groove. If the lens base is fixedly connected with the circuit board through the adhesive, the gap may not be filled with the adhesive, and thus the risk of light leakage may exist. Compared with the mode of accommodating the electronic component by arranging the through hole on the side wall of the supporting part, the avoiding groove in the embodiment of the application does not penetrate through the side wall of the supporting part, that is to say, the wall thickness of the part of the supporting part provided with the avoiding groove is larger than zero, so that the supporting part can shield light, and leakage of the light through the gap between the electronic component and the avoiding groove is prevented. In sum, the embodiment of the application not only can reduce the size and realize the miniaturization of the camera module without reducing the area of the photosensitive chip and the number of electronic components, but also can prevent light leakage.
It should be understood that the description of this section is not intended to identify key or critical features of the embodiments of the application or to delineate the scope of the application. Other features of the present application will become apparent from the description that follows.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings. The drawings are for better understanding of the present solution and do not constitute a limitation of the present application. In the drawings:
FIG. 1 is a schematic longitudinal cross-sectional view of a lens mount according to the present application;
FIG. 2 is a schematic bottom view of a lens mount according to the present application;
FIG. 3 is a schematic perspective view of a lens mount according to the present application;
FIG. 4 is a schematic longitudinal cross-sectional view of a camera module according to the present application;
fig. 5 is a schematic bottom view of an imaging module (wireless road board) according to the present application;
FIG. 6 is a schematic perspective view of a camera module according to the present application;
FIG. 7 is an exploded view of a camera module according to the present application;
FIG. 8 is a schematic installation view of a camera module according to the present application;
FIG. 9 is a schematic front view of a camera module according to the present application;
FIG. 10 is a schematic front view of a camera module according to the present application; and
fig. 11 is a schematic top view of a circuit board according to the present application.
Reference numerals:
100. a lens base; 110. a body; 111. a lens mounting hole; 112. a top surface of the body;
113. the bottom surface of the body; 120. a support part; 121. an avoidance groove; 200. a lens;
300. a circuit board; 301. an adhesive coating area; 310. an electronic component;
320. a photosensitive chip; 400. an optical filter.
Detailed Description
In the description of the embodiments of the present application, it should be noted that, the terms "longitudinal," "transverse," "upper," "lower," "top," "bottom," "inner," "outer," and the like indicate an orientation or a state relationship based on the orientation or state relationship shown in the drawings, which are only for convenience in describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the embodiments of the present application will be understood by those of ordinary skill in the art in a specific context.
In the examples herein, a first feature "on" or "under" a second feature may be either the first and second features in direct contact, or the first and second features in indirect contact via an intermediary, unless expressly stated and defined otherwise. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
Exemplary embodiments of the present application are described below in conjunction with the accompanying drawings, which include various details of the embodiments of the present application to facilitate understanding, and should be considered as merely exemplary. Accordingly, one of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present application. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
As shown in fig. 1 to 3, an embodiment of the present application provides a lens holder 100, where the lens holder 100 includes a body 110 and a supporting portion 120. The body 110 has a top surface, a bottom surface opposite to the top surface, and a lens mounting hole 111 penetrating from the top surface to the bottom surface. The support 120 extends from the edge of the bottom surface 113 of the body in a direction from the top surface 112 of the body to the bottom surface 113 of the body. Wherein, the supporting portion 120 surrounds the lens mounting hole 111, and at least one side wall of the supporting portion 120 is provided with a recess 121 for accommodating the electronic component. By way of example, the electronic components may be, but are not limited to, resistive, capacitive, inductive, diode, or triode components.
As shown in fig. 7 and 8, the following describes a method for mounting the lens holder 100 on the circuit board 300 according to the embodiment of the present application: the board surface of the circuit board 300 includes a first mounting area and a second mounting area surrounding the first mounting area, the photosensitive chip 320 is mounted on the first mounting area, and the electronic component 310 is mounted on the second mounting area.
When the lens holder 100 is fixed: as shown in fig. 11, first, an adhesive such as a thermosetting adhesive is applied to a portion of the second mounting region of the circuit board 300 where the electronic component 310 is not mounted; next, a thermosetting adhesive is also coated on the upper surface of the electronic component 310; then, after the lens mounting hole 111 of the lens holder 100 is aligned with the photosensitive chip 320 and the avoiding groove 121 of the lens holder 100 is aligned with the corresponding electronic component 310, the lens holder 100 is gradually moved closer to the circuit board 300 until the bottom surface of the supporting portion 120 is abutted against the board surface of the circuit board 300. Finally, the lens holder 100 and the circuit board 300 are baked. After baking, the inner wall of the avoidance groove 121 is bonded to the electronic component 310 through the thermosetting adhesive, and the part of the support portion 120, where the avoidance groove 121 is not formed, is directly bonded to the board surface of the circuit board 300 through the thermosetting adhesive, so that the lens holder 100 is firmly fixed to the circuit board 300. It should be noted that, besides the fixed connection between the lens base 100 and the circuit board 300 may be realized by adopting a bonding manner, that is, a manner of coating adhesive, other manners such as hot melt connection, welding, and the like may be adopted.
As can be seen from the above, in the embodiment of the present application, the side wall of the supporting portion 120 of the lens holder 100 is provided with the avoiding groove 121 for accommodating the electronic component 310, so, as shown in fig. 4, after the lens holder 100 is fixed on the circuit board 300, the electronic component 310 mounted on the circuit board 300 is embedded into the supporting portion 120, so that the size of the lens holder 100 in the horizontal direction only needs to ensure that the space surrounded by the inner side wall of the supporting portion 120 can accommodate the photosensitive chip 320, without reserving an installation space for the electronic component 310, and further, the size of the lens holder 100 in the horizontal direction is significantly reduced. In addition, the lens seat 100 can be fixedly connected with the circuit board 300 by means of the inner wall of the avoidance groove 121 and the part of the support part 120, where the avoidance groove 121 is not arranged, so that the circuit board 300 does not need to reserve a gluing area at the periphery of the electronic component 310, and the size of the camera module is indirectly reduced. In addition, in order to facilitate installation and avoid damage to the electronic component 310, the size of the avoidance groove 121 is generally slightly larger than the size of the electronic component 310, that is, a certain gap exists between the electronic component 310 and the inner wall of the avoidance groove 121 after the electronic component 310 is embedded into the avoidance groove 121. If the lens base 100 is fixedly connected to the circuit board 300 through the adhesive, the gap may not be filled with the adhesive, which may cause a risk of light leakage. Compared to the manner of accommodating the electronic component 310 by forming the through hole in the side wall of the supporting portion 120, since the avoiding groove 121 in the embodiment of the present application does not penetrate the side wall of the supporting portion 120, that is, the wall thickness of the portion of the supporting portion 120 where the avoiding groove 121 is disposed is greater than zero, the supporting portion 120 can shield light, and prevent the light from leaking through the gap between the electronic component 310 and the avoiding groove 121. Therefore, the lens holder 100 in the embodiment of the application not only can reduce the size and the size of the camera module without reducing the area of the photosensitive chip 320 and the number of the electronic components 310, but also can prevent light leakage.
The avoiding grooves 121 are provided in various positions on the side wall of the supporting portion 120: first, as shown in fig. 3 and 9, the escape groove 121 is formed in the inner side wall of the support portion 120, and in this case, a space formed around the inner side wall of the support portion 120 communicates with the escape groove 121. Second, as shown in fig. 10, the escape groove 121 is formed in the outer sidewall of the support portion 120, in which case the space formed by the inner sidewall of the support portion 120 is partitioned from the escape groove 121 by the remaining sidewall of the support portion 120 at the escape groove 121. Third, the inner side wall and the outer side wall of the supporting portion 120 are provided with the avoiding groove 121, that is, the space formed by surrounding the inner side wall of the supporting portion 120 is only communicated with a part of the avoiding groove 121. Compared with the second mode, if the first mode is adopted, after the lens holder 100 is fixed on the circuit board 300, the side of the electronic component 310 facing away from the photosensitive chip 320 is protected by the supporting portion 120, so as to avoid the electronic component 310 from being damaged due to collision by external force. It should be noted that, the "inner sidewall of the supporting portion 120" generally refers to a side of the supporting portion 120 facing the photosensitive chip 320, and the "outer sidewall of the supporting portion 120" generally refers to a side of the supporting portion 120 facing away from the photosensitive chip 320.
Because the mirror base 100 can be fixedly connected with the circuit board 300 by means of the inner wall of the avoidance groove 121 and the part of the support portion 120 where the avoidance groove 121 is not arranged, the circuit board 300 does not need to reserve a gluing area at the periphery of the electronic component 310, so that the wall thickness d of the part of the support portion 120 where the avoidance groove 121 is arranged can be not more than 0.1mm, and the size of the mirror base 100 in the horizontal direction is further reduced.
The projection of the avoidance groove 121 on the horizontal plane covers the projection of the electronic component 310 on the horizontal plane, that is, after the lens holder 100 is fixed to the circuit board 300, the electronic component 310 is entirely embedded in the supporting portion 120 of the lens holder 100. The advantage of this arrangement is that, in the case that the projection areas of the photosensitive chip 320, the electronic component 310 and the lens holder 100 in the horizontal direction are unchanged, the contact areas of the supporting portion 120 with the circuit board 300 and the electronic component 310 respectively can be increased, and the firmness of the supporting portion 120 on the circuit board 300 can be improved. It should be noted that, the "horizontal plane" in the present embodiment refers to a plane parallel to the board surface of the circuit board 300 when the circuit board 300 is horizontally placed after the lens holder 100 is fixed to the circuit board 300.
The volume of the avoidance groove 121 is larger than the volume of the electronic component 310 in order to facilitate installation and avoid damage to the electronic component 310. Wherein, the projection shape of the avoidance groove 121 on the horizontal plane and/or the vertical plane can be, but is not limited to, circular, elliptical, polygonal or irregularly shaped. For example, the avoidance groove 121 is a rectangular parallelepiped groove having a rectangular projection shape on both the horizontal plane and the vertical plane, and at least one of the length, the width, and the height of the avoidance groove 121 is larger than the dimensional parameter corresponding to the electronic component 310. The following describes a method for mounting the lens holder 100 on the circuit board 300, taking the avoidance groove 121 as a rectangular groove, where the length, width and height of the avoidance groove are larger than the corresponding dimensional parameters of the electronic component 310 as an example:
as shown in fig. 11, if the number of electronic components 310 is plural, the upper surface of the electronic components 310 and the board surface of the circuit board 300 between two adjacent electronic components 310 are both adhesive coated areas 301. When in installation: first, a thermosetting adhesive is coated on the surface of the electronic component 310 and the surface of the circuit board 300 between adjacent electronic components 310. In view of the fact that the length, width and height of the avoidance groove 121 are all greater than the corresponding dimensional parameters of the electronic component 310, a certain gap exists between the electronic component 310 and the inner wall of the avoidance groove 121 after the electronic component 310 is embedded into the avoidance groove 121, so that in order to fill the gap with thermosetting adhesive, the thickness of the thermosetting adhesive coated on the surface of the electronic component 310 is greater than the distance between the upper surface of the electronic component 310 and the upper surface of the avoidance groove 121, for example, if the distance between the upper surface of the electronic component 310 and the upper surface of the avoidance groove 121 is 50um, the thermosetting adhesive can be coated on the surface of the electronic component 310 in a thickness of 150 um. Then, after the lens mounting hole 111 of the lens holder 100 is aligned with the photosensitive chip 320 and the avoiding groove 121 of the lens holder 100 is aligned with the corresponding electronic component 310, the lens holder 100 is gradually moved closer to the circuit board 300 until the bottom surface of the supporting portion 120 is abutted against the board surface of the circuit board 300. In this process, a portion of the thermosetting adhesive coated on the upper surface of the electronic component 310 flows into the gap between the side wall of the electronic component 310 and the escape groove 121 under the extrusion of the upper surface of the escape groove 121. Finally, the lens holder 100 and the circuit board 300 are baked. After baking, the inner wall of the avoidance groove 121 is bonded with the electronic component 310 through thermosetting adhesive, and the part of the support part 120, which is not provided with the avoidance groove 121, is directly bonded with the board surface of the circuit board 300 through thermosetting adhesive. Since the avoiding groove 121 does not penetrate through the side wall of the supporting portion 120, even if the gap between the electronic component 310 and the avoiding groove 121 is not completely filled with the thermosetting adhesive, the remaining side wall of the supporting portion 120 at the avoiding groove 121 still can shield light, so that the light is prevented from leaking through the gap.
In addition, the embodiment of the application also provides a lens assembly, which comprises a lens 200 and the lens base 100, wherein the lens 200 is installed in the lens installation hole 111 of the lens base 100. Wherein the lens 200 may be fixed in the lens mounting hole 111 by a detachable connection such as a screw connection or a snap connection, but not limited thereto. For example, the inner wall of the lens mounting hole 111 is formed with an internal thread, and the outer wall of the lens 200 is formed with an external thread with which the internal thread is screw-fitted. By adopting the lens holder 100, the lens assembly in the embodiment of the application not only can reduce the size and realize the miniaturization of the camera module without reducing the area of the photosensitive chip 320 and the number of the electronic components 310, but also can prevent light leakage.
The lens assembly further comprises an optical filter 400 disposed opposite to the lens 200, wherein the optical filter 400 is disposed on one side of the lens 200 facing the bottom surface 113 of the body. The optical filter 400 may be fixed in the lens mounting hole 111 to reduce the size of the entire lens assembly in the optical axis direction of the lens 200. Of course, the filter 400 may be fixed in a space defined by the inner wall of the support portion 120. For easy maintenance and replacement, the optical filter 400 may also be detachably connected to the lens holder 100 by a threaded connection or a clamping connection.
As shown in fig. 4 to 10, the embodiment of the present application further provides an image capturing module, which includes a circuit board 300 and the lens assembly described above; at least one electronic component 310 is mounted on the board surface of the circuit board 300, and the supporting portion 120 of the lens assembly is fixed to the circuit board 300. The camera module in this application embodiment not only can reduce the size and realize the miniaturization of the camera module without reducing the area of the photosensitive chip 320 and the number of the electronic components 310, but also can prevent light leakage by adopting the lens assembly.
Because the mirror base 100 can realize its fixed connection with the circuit board 300 by means of the inner wall of the avoidance groove 121 and the portion of the support portion 120 where the avoidance groove 121 is not provided, the circuit board 300 does not need to reserve a glue coating area at the periphery of the electronic component 310, so that the circuit board 300 can further reduce the size of the mirror base in the horizontal direction according to the opening position of the avoidance groove 121, and in particular:
if the avoidance groove 121 is formed in the inner sidewall of the supporting portion 120, that is, the remaining sidewall of the supporting portion 120 at the avoidance groove 121 is located at the side of the electronic component 310 facing away from the photosensitive chip 320, in this case, the circuit board 300 only needs to reserve an area for supporting the supporting portion 120 at the side of the electronic component 310 facing away from the photosensitive chip 320. In order to further reduce the size of the circuit board 300, the distance between the edge of the circuit board 300 and the outer edge of the electronic component 310 is adapted to the wall thickness of the supporting portion 120 at the avoiding groove 121. For example, when the wall thickness of the supporting portion 120 at the escape groove 121 is 0.1mm, the interval between the edge of the circuit board 300 and the outer edge of the electronic component 310 is also 0.1mm. Through calculation, compared with the case that the circuit board 300 needs to reserve the glue coating area of 0.3mm on the side of the electronic component 310 facing away from the photosensitive chip 320, the area of the circuit board 300 can be reduced by 16.4% in the embodiment of the present application. Of course, when the wall thickness of the supporting portion 120 at the escape groove 121 is smaller than 0.1mm, for example, 0.05mm, the distance between the edge of the circuit board 300 and the outer edge of the electronic component 310 is reduced to 0.05mm.
If the avoidance groove 121 is formed on the outer sidewall of the supporting portion 120, that is, the remaining sidewall of the supporting portion 120 at the avoidance groove 121 is located on the side of the electronic component 310 facing the photosensitive chip 320, in this case, the circuit board 300 does not need to reserve an area for supporting the supporting portion 120 on the side of the electronic component 310 facing away from the photosensitive chip 320, so that in order to further reduce the size of the circuit board 300, the edge of the circuit board 300 is flush with the outer edge of the electronic component 310, that is, the interval between the edge of the circuit board 300 and the outer edge of the electronic component 310 is zero.
The above embodiments do not limit the scope of the application. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application are intended to be included within the scope of the present application.
Claims (10)
1. A lens mount, comprising:
the lens assembly comprises a body, a lens assembly and a lens assembly, wherein the body is provided with a top surface, a bottom surface opposite to the top surface and a lens mounting hole penetrating from the top surface to the bottom surface; and
a support part extending and protruding from the edge of the bottom surface of the body along the direction from the top surface of the body to the bottom surface of the body;
the support part surrounds the lens mounting hole, and at least one side wall of the support part is provided with an avoidance groove for accommodating electronic components.
2. The lens holder of claim 1, wherein the relief groove is open to an inner sidewall of the support portion or an outer sidewall of the support portion.
3. The lens holder according to claim 1, wherein a wall thickness of a portion of the support portion where the relief groove is provided is not more than 0.1mm.
4. A lens holder according to any one of claims 1 to 3, wherein the projection of the relief groove onto the horizontal plane covers the projection of the electronic component onto the horizontal plane.
5. The lens holder of claim 4, wherein the volume of the relief slot is greater than the volume of the electronic component.
6. A lens assembly, the lens assembly comprising:
a lens; and
a lens holder according to any one of claims 1 to 5;
wherein, the lens is installed in the lens mounting hole of the lens holder.
7. The utility model provides a module of making a video recording, its characterized in that, the module of making a video recording includes:
a circuit board; and
the lens assembly of claim 6;
at least one electronic component is mounted on the surface of the circuit board, and the supporting portion of the lens assembly is fixed to the circuit board.
8. The camera module of claim 7, wherein the avoidance groove is formed in an inner side wall of the supporting portion, and a distance between an edge of the circuit board and an outer edge of the electronic component is adapted to a wall thickness of the supporting portion at the avoidance groove.
9. The camera module of claim 7, wherein the relief groove is formed in an outer side wall of the support portion, and an edge of the circuit board is flush with an outer edge of the electronic component.
10. The camera module of claim 7, wherein the number of the electronic components is plural, and the upper surfaces of the electronic components and the board surfaces of the circuit boards between two adjacent electronic components are both adhesive coating areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111386026.0A CN116156301A (en) | 2021-11-22 | 2021-11-22 | Lens base, lens assembly and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111386026.0A CN116156301A (en) | 2021-11-22 | 2021-11-22 | Lens base, lens assembly and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116156301A true CN116156301A (en) | 2023-05-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111386026.0A Pending CN116156301A (en) | 2021-11-22 | 2021-11-22 | Lens base, lens assembly and camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116156301A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207782933U (en) * | 2017-11-28 | 2018-08-28 | 信利光电股份有限公司 | A kind of camera module and electronic equipment |
| CN108769491A (en) * | 2018-07-25 | 2018-11-06 | 宁波舜宇光电信息有限公司 | Microscope base, camera module and electronic equipment |
| CN212207932U (en) * | 2020-04-13 | 2020-12-22 | 佛山华永科技有限公司 | Lens mount integral type low noise shutter |
| CN113676634A (en) * | 2021-08-11 | 2021-11-19 | 余姚舜宇智能光学技术有限公司 | Lens module and manufacturing method thereof |
-
2021
- 2021-11-22 CN CN202111386026.0A patent/CN116156301A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207782933U (en) * | 2017-11-28 | 2018-08-28 | 信利光电股份有限公司 | A kind of camera module and electronic equipment |
| CN108769491A (en) * | 2018-07-25 | 2018-11-06 | 宁波舜宇光电信息有限公司 | Microscope base, camera module and electronic equipment |
| CN212207932U (en) * | 2020-04-13 | 2020-12-22 | 佛山华永科技有限公司 | Lens mount integral type low noise shutter |
| CN113676634A (en) * | 2021-08-11 | 2021-11-19 | 余姚舜宇智能光学技术有限公司 | Lens module and manufacturing method thereof |
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