CN113676634B

CN113676634B - Lens module and manufacturing method thereof

Info

Publication number: CN113676634B
Application number: CN202110933149.5A
Authority: CN
Inventors: 陈成权; 史欣欣; 徐杰伟; 杨旭峰; 潘周权
Original assignee: Yuyao Sunny Optical Intelligence Technology Co Ltd
Current assignee: Yuyao Sunny Optical Intelligence Technology Co Ltd
Priority date: 2021-08-11
Filing date: 2021-08-11
Publication date: 2023-08-04
Anticipated expiration: 2041-08-11
Also published as: CN113676634A

Abstract

The invention provides a lens module and a manufacturing method thereof, wherein the lens module comprises: a wiring board including a wiring surface; a component assembly provided on a peripheral portion of the wiring surface; and a lens mount assembly including an attachment support configured to be fixed to a peripheral portion of the wiring surface, the attachment support having a plurality of concave accommodation spaces to accommodate the component assembly. The lens module can realize miniaturization and microminiaturization.

Description

Lens module and manufacturing method thereof

Technical Field

The present disclosure relates to the field of optical elements, and more particularly, to a lens module and a method for manufacturing the same.

Background

With the miniaturization development of intelligent devices, a lens module applied to the intelligent devices also meets new challenges. The size of the lens module needs to be continuously miniaturized to improve the screen ratio.

The lens module comprises a circuit board, components and photosensitive chips welded on the circuit board, and a lens base assembly bonded on the circuit board. Under the requirements of high quality shooting in the market, the photosensitive chip is taken as an important component of the lens module, and the area of the photosensitive chip is not generally allowed to be reduced. Therefore, on the premise of not reducing the area of the photosensitive chip and the number of components, the structure of the existing lens module limits the further miniaturization to a certain extent, and the requirement of customers on the further miniaturization of the lens module cannot be met.

Disclosure of Invention

The present invention provides a lens module, which aims at the technical problems existing in the prior art, and the lens module comprises: a wiring board including a wiring surface; a component assembly provided on a peripheral portion of the wiring surface; and a lens mount assembly including an attachment support configured to be fixed to a peripheral portion of the wiring surface, the attachment support having a plurality of concave accommodation spaces to accommodate the component assembly.

The components and parts subassembly sets up in the week portion department of wiring surface of circuit board, effectively reduces the size of circuit board, and attached support piece bonds in the week portion of wiring surface, effectively reduces the size of mirror seat, is favorable to making the miniaturized of camera lens module.

In some embodiments, there is an adhesive region between adjacent component parts in the component assembly on a peripheral portion of the wiring surface, and the attaching support is fixed on the adhesive region. On one hand, the bonding area on the wiring surface is effectively utilized to reduce the area of the wiring surface, and on the other hand, the mirror base assembly can be supported and simultaneously prevented from being directly pressed on the surface of the component assembly to damage the component assembly.

In some embodiments, the shape of each of the plurality of concave receiving spaces is adapted to the shape of a corresponding one or more components in the component assembly. The components and parts are arranged in the concave accommodation space that is arranged on the attached support piece, and the lens seat component and the circuit board can be firmly bonded together without additionally reserving a bonding area or a gluing area on the periphery of the wiring surface.

In some embodiments, the plurality of concave receiving spaces are disposed at edges of the attachment support. The cross-sectional area of the lens mount assembly in a plane perpendicular to the optical axis of the lens can be further reduced so that the lens mount has as small a size as possible.

In some embodiments, each component in the component assembly is spaced less than 0.1 millimeters from a circumferential edge of the routing surface. In some embodiments, each component in the component assembly is spaced less than 0.01 millimeters from a circumferential edge of the routing surface. Thereby enabling the size of the circuit board to be reduced as much as possible.

In some embodiments, the lens module further comprises: a component adhesive filled between a bottom surface of each of the plurality of concave accommodation spaces and an upper surface of a corresponding component in the component assembly; and/or a circuit board adhesive filled between the attachment support and the wiring surface. Can make and have as many bonding areas as possible between circuit board and the mirror seat, and make bonding firm between circuit board and the mirror seat, make full use of components and parts are used for with mirror seat subassembly fixed connection to the upper surface of pair and the region between the adjacent components and parts simultaneously, need not additionally to increase bonding area on the circuit board.

In some embodiments, the lens module further includes a light and dust proof sealant filled between a sidewall of each of the plurality of concave accommodation spaces and a sidewall of a corresponding component in the component assembly. The light-proof and dust-proof sealant can prevent external light and substances from contacting the photosensitive chip to avoid influencing imaging, and meanwhile, the service life of the lens module is prolonged.

In some embodiments, the lens module further includes a photosensitive chip disposed in a middle portion of the wiring surface and surrounded by the component assembly. Under the condition that the size of the photosensitive chip and the number of components in the component assembly are unchanged, the photosensitive chip is arranged in the middle of the wiring surface of the circuit board, so that the occupied area of the circuit board can be reduced.

In some embodiments, the lens mount assembly includes: a light filter; a lens; and the lens seat comprises a hollow channel and the attached supporting piece, one part of the hollow channel is matched with the shape of the optical filter and used for accommodating and fixing the optical filter, and the other part of the hollow channel is matched with the shape of the lens and used for accommodating and fixing the lens. The size of the lens seat assembly in the optical axis direction of the lens is reduced, and meanwhile, the size of the lens seat assembly is reduced.

The invention also provides a manufacturing method of the lens module, which comprises the following steps: disposing a component assembly on a periphery of a wiring surface of a wiring board; and fixing an attachment support of a lens holder assembly to a peripheral portion of the wiring surface such that the component assembly is located in a plurality of concave accommodation spaces of the attachment support.

In some embodiments, after disposing the component assembly on the perimeter of the routing surface of the circuit board, the method further comprises: coating an adhesive on the periphery of the wiring surface; and after fixing the attachment support of the lens mount assembly to the peripheral portion of the wiring surface, the method further includes the step of baking the adhesive.

In some embodiments, after baking the binder, the method further comprises: and filling light-proof and dust-proof sealant between the side wall of each of the plurality of concave accommodating spaces and the side wall of the corresponding component in the component assembly.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings, in which:

fig. 1 is a schematic perspective view of a lens module according to a first embodiment of the invention.

Fig. 2 is an exploded view of the lens module shown in fig. 1.

Fig. 3 is an exploded view of the lens module shown in fig. 2 after being rotated by a certain angle.

Fig. 4 is a further exploded view of the lens module shown in fig. 1.

Fig. 5 is a schematic plan view of the wiring board shown in fig. 2 as seen in the direction indicated by arrow A1.

Fig. 6 is an enlarged perspective view of the lens holder shown in fig. 4.

Fig. 7 is a schematic plan view of the lens holder shown in fig. 6, as viewed along the direction indicated by the arrow A2.

Fig. 8 is a schematic plan view of a component assembly and a photosensitive chip in a lens module according to a second embodiment of the present invention.

Fig. 9 is a schematic plan view of a lens holder in a lens module according to a second embodiment of the invention.

Fig. 10 is a side view of the circuit board shown in fig. 8 and the lens holder shown in fig. 9 aligned in a direction perpendicular to the circuit board.

Fig. 11 shows a schematic plan view of the adhesive applied at the peripheral edge of the wiring surface of the wiring board in fig. 8.

Fig. 12 shows a side view of the lens mount of fig. 9 aligned with the adhesive coated circuit board of fig. 11.

Fig. 13 shows a side view of the lens mount and circuit board of fig. 12 bonded together.

Fig. 14 shows a side view of a gap-filling sealant between a plurality of concave accommodation spaces of the lens holder shown in fig. 13 and components on a wiring board.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed description are merely illustrative of exemplary embodiments of the application and are not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in the present specification, the expressions of first, second, third, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Thus, without departing from the teachings of the present application. And vice versa.

In the drawings, the thickness, size, and shape of the components have been slightly adjusted for convenience of description. The figures are merely examples and are not drawn to scale. For example, the thickness and size of the adhesive, the components, the wiring board, and the photosensitive chip are not in proportion to actual production. As used herein, the terms "about," "approximately," and the like are used as terms of a table approximation, not as terms of a table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by one of ordinary skill in the art.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the present application, use of "may" means "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

Unless otherwise defined, all terms (including engineering and technical terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. In addition, unless explicitly defined or contradicted by context, the particular steps included in the methods described herein are not necessarily limited to the order described, but may be performed in any order or in parallel. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Fig. 1 is a schematic perspective view of a lens module according to a first embodiment of the invention. As shown in fig. 1, the lens module 1 includes a circuit board 11, a component assembly 12 and a photosensitive chip 13 (fig. 1 shows only one side of the photosensitive chip 13) disposed on the circuit board 11, and a lens holder assembly 14 disposed opposite to the circuit board 11 and fixed on the circuit board 11.

Fig. 2 is an exploded view of the lens module 1 shown in fig. 1, and fig. 3 is an exploded view of the lens module 1 shown in fig. 2 rotated by a certain angle. As shown in fig. 2 and 3, the wiring board 11 has a wiring surface 110 disposed opposite to the lens holder 14. The routing surface 110 includes a central portion and a peripheral portion, wherein the peripheral portion may surround the central portion. The peripheral edge of the routing surface 110 is typically the outer boundary of the peripheral portion.

The component assembly 12 is fixed (for example, by soldering) on the peripheral portion of the wiring surface 110 of the wiring board 11. The photosensitive chip 13 is fixed in the middle of the wiring surface 110 of the wiring board 11. The photosensitive chip 13 may be surrounded by the component assembly 12.

For ease of illustration, fig. 2 and 3 schematically illustrate the plurality of components in the component assembly 12 in a plurality of rectangular parallelepiped shapes, but the present invention is not intended to limit each component to a rectangular parallelepiped shape. Those skilled in the art will appreciate that the component assembly 12 may include a variety of components as required by resistors, capacitors, inductors, diodes, transistors, etc.

Fig. 4 is a further exploded view of the lens module 1 shown in fig. 1. As shown in fig. 4, the lens holder assembly 14 includes a lens holder 141, a lens 142, and an optical filter 143. The optical filter 143 is in the shape of a sheet, and is disposed parallel to and opposite to the photosensitive chip 13. The lens 142 is substantially cylindrical, and an optical axis (not shown in fig. 4) thereof is perpendicular to the filter 143. The lens holder 141 has a hollow passage 1411, a portion of the hollow passage 1411 is adapted to the shape of the optical filter 16 and is used for accommodating the optical filter 143, and another portion of the hollow passage 1411 is adapted to the shape of the lens 142 and is used for accommodating the lens 142. When the optical filter 143 and the lens 142 are fixed in the hollow channel 1411 of the lens holder 141, the lens holder assembly 14 occupies a smaller volume, which is advantageous for reducing the size of the lens holder assembly 14 in the optical axis direction of the lens 142. The lens 142 and the lens holder 141 may be fixedly connected by a screw connection, thereby facilitating replacement and maintenance of the lens 142.

Fig. 5 is a schematic plan view of the wiring board 11 shown in fig. 2 as viewed in the direction indicated by the arrow A1. As shown in fig. 5, the routing surface 110 of the wiring board 11 is preferably square, with peripheral edges including edge 1101, edge 1102, edge 1103, and edge 1104. The square wiring board 11 is easy to manufacture and is easily commercially available. Component assembly 12 includes a plurality of components 121 located on a perimeter of routing surface 110 proximate edge 1101, a plurality of components 122 located on a perimeter of routing surface 110 proximate edge 1102, a plurality of components 123 located on a perimeter of routing surface 110 proximate edge 1103, and a plurality of components 124 located on a perimeter of routing surface 110 proximate edge 1104. Wherein the distance D11 between each component 121 and the edge 1101 of the routing surface 110 is preferably less than 0.1 mm, the distance D12 between the component 122 and the edge 1102 of the routing surface 110 is preferably less than 0.1 mm, the distance D13 between each component 123 and the edge 1103 of the routing surface 110 is preferably less than 0.1 mm, and the distance D14 between each component 124 and the edge 1104 of the routing surface 110 is preferably less than 0.1 mm. Wherein, on the periphery of the wiring surface 110, an uncovered bonding area 1105 (shown by a dashed box in fig. 5) is provided between the component 122 and the plurality of components 121, an uncovered bonding area 1106 (shown by a dashed box in fig. 5) is provided between the component 122 and the plurality of components 123, and an uncovered bonding area 1107 (shown by a dashed box in fig. 5) is provided between the adjacent plurality of components 123 and the plurality of components 124.

Fig. 6 is an enlarged perspective view of the lens holder 141 shown in fig. 4. Fig. 7 is a schematic plan view of the lens holder 141 shown in fig. 6, as viewed along the direction indicated by the arrow A2. As shown in fig. 6 and 7, the mirror mount 141 includes an attachment support 1411 provided opposite to the wiring board 11, the attachment support 1411 being used for bonding to the bonding region 1105, the bonding region 1106, and the bonding region 1107 of the peripheral portion of the wiring surface 110. The attaching support 1411 is provided with a concave accommodation space 1413, a concave accommodation space 1414, and a concave accommodation space 1415, wherein the concave accommodation space 1413 is used for accommodating the plurality of components 121 and the components 124 (see fig. 5), the concave accommodation space 1414 is used for accommodating the plurality of components 123 (see fig. 5), and the concave accommodation space 1415 is used for accommodating the components 122 (see fig. 5).

When the peripheral portion of the wiring surface 110 is coated with an adhesive, the attachment support 1411 of the mirror mount 141 can be fixed on the adhesive region 1105, the adhesive region 1106, and the adhesive region 1107 of the peripheral portion of the wiring surface 110, and the upper surfaces of the component 121 and the component 124 can be fixed on the bottom surface of the concave accommodation space 1413, the upper surface of the component 123 can be fixed on the bottom surface of the concave accommodation space 1414, and the upper surface of the component 122 can be fixed on the bottom surface of the concave accommodation space 1415. This allows as many bonding areas as possible to be provided between the circuit board 11 and the lens holder 141, so that the bonding between the circuit board 11 and the lens holder 141 is firm.

The component assembly 12 is disposed at the periphery of the wiring surface 110 of the circuit board 11, so that no bonding area or glue coating area is reserved at the periphery of the wiring surface 110 of the circuit board 11, and the size of the circuit board 11 is effectively reduced. The attachment support 1411 of the lens holder 141 is adhered to the peripheral portion of the wiring surface 110 while the component assembly 12 is located in the concave accommodation spaces 1413 to 1415 provided on the attachment support 1411, thereby effectively reducing the size of the lens holder 141. The lens module 1 is advantageously miniaturized without reducing the size of the photosensitive chip 13, thereby reducing the volume of the apparatus in which the lens module 1 of the present invention is mounted.

The concave accommodation space 1413, the concave accommodation space 1414, and the concave accommodation space 1415 are preferably provided at the edge of the attachment support 1411, whereby the cross-sectional area of the lens mount 141 on a plane perpendicular to the optical axis of the lens 142 can be further reduced so that the lens mount 141 has a size as small as possible.

The upper surface of the component assembly 12 is adhered to the bottom surface of the concave receiving space of the attachment support 1411 of the lens holder 141 by an adhesive, and the adhesive strength between the lens holder 141 and the circuit board 21 can be further improved.

The attaching support 1411 can be firmly adhered to the adhesion area 1105 to the adhesion area 1107 of the wiring surface 110, on one hand, the adhesion area on the wiring surface 110 is effectively utilized to reduce the area of the wiring surface 110, and on the other hand, the attaching support can support the lens 142 and the optical filter 143, and meanwhile, the attaching support can be prevented from being directly pressed on the surface of the component assembly 12 to damage the component assembly 12.

Fig. 8 is a schematic plan view of a component assembly and a photosensitive chip in a lens module according to a second embodiment of the present invention. As shown in fig. 8, the circuit board 21 and the photosensitive chip 23 are the same as the circuit board 11 and the photosensitive chip 13 shown in fig. 5, and will not be described again here. The component assembly 22 is substantially the same as the component assembly 12 shown in fig. 5, except that a plurality of components in the component assembly 22 are substantially uniformly arranged at intervals on the peripheral portion of the wiring surface 210 of the wiring board 21. An uncovered bonding area is provided between adjacent components on the periphery of the wiring surface 210. The distance D21 of the edge 2101 of component assembly 22 corresponding to component 221 from routing surface 210 is preferably less than 0.05 mm, the distance D22 of the edge 2102 of component 222 corresponding to routing surface 210 is preferably less than 0.05 mm, the distance D23 of the edge 2103 of component 223 corresponding to routing surface 210 is preferably less than 0.05 mm, and the distance D24 of the edge 2104 of component 224 corresponding to routing surface 210 is preferably less than 0.05 mm.

Fig. 9 is a schematic plan view of a lens base 241 in a lens module according to a second embodiment of the invention. As shown in fig. 9, a plurality of concave accommodation spaces 2412, 2413, 2414 and 2415 are provided at the edge of the attaching support 2411 of the lens holder 241, wherein the number of the plurality of concave accommodation spaces 2412, 2413, 2414 and 2415 is equal to the number of the plurality of components 221, 224, 223 and 222, respectively.

Referring again to fig. 8 and 9, in some embodiments, each concave accommodation space 2412 is aligned with and shape-adapted to a corresponding one of the components 221 in a direction perpendicular to the wiring board 21. Also, each concave accommodation space 2413 is aligned with and adapted to the shape of a corresponding one of the components 224 in a direction perpendicular to the wiring board 21. Each concave accommodation space 2414 is aligned with and adapted to the shape of a corresponding one of the components 223 in a direction perpendicular to the wiring board 21. Each concave accommodation space 2415 is aligned with and adapted to the shape of a corresponding one of the components 222 in a direction perpendicular to the wiring board 21.

Since each concave accommodation space on the attachment support 2411 corresponds to one component in the direction perpendicular to the wiring board 21, the attachment support 2411 can be fixed with the bonding area between adjacent components on the peripheral portion of the wiring surface 210, thereby increasing the contact area between the attachment support 2411 and the wiring surface 210 of the wiring board 21. Even if the adhesive area or the glue area is not reserved in the peripheral portion of the circuit board 21, the mirror mount 241 and the circuit board 21 can be firmly adhered together.

Fig. 10 is a side view of the wiring board 21 shown in fig. 8 and the lens holder 241 shown in fig. 9 aligned in a direction perpendicular to the wiring board 21, wherein fig. 10 does not show the shielded component 221, and the shielded concave accommodation space 2412, concave accommodation space 2413, and concave accommodation space 2415 (see fig. 9). As shown in fig. 10, the size of the concave accommodation space 2414 in the direction perpendicular to and parallel to the wiring board 21 is larger than the size of the corresponding component 223 in the direction perpendicular to and parallel to the wiring board 21, whereby the component 223 can be located in the corresponding concave accommodation space 2414, and the adhesion area of the peripheral portion of the wiring surface 210 can be contacted by the attachment support 2411, facilitating assembly adhesion of the mirror mount 241 and the wiring board 21.

The method of manufacturing the lens module will be described with reference to fig. 8, 9, and 11 to 14.

As shown in fig. 8, the photosensitive chip 23 is mounted in the middle of the wiring surface 210 of the wiring board 21, and a plurality of components 221, 222, 223, and 224 are mounted in the peripheral portion of the wiring surface 210.

An adhesive is applied to the periphery of the wiring surface 210 of the wiring board 21. Fig. 11 shows a schematic plan view of the adhesive applied at the peripheral portion of the wiring surface 210 of the wiring board 21 in fig. 8. As shown in fig. 11, the adhesive 25 is generally annular and is proximate to the circumferential edge (i.e., edge 2010-edge 2104) of the routing surface 210. The adhesive 25 includes a component adhesive 251 and a board adhesive 252, the component adhesive 251 being coated on the adhesive region of the peripheral portion of the wiring surface 210 of the board 21, and the board adhesive 252 being coated on the component assembly 22.

The lens mount 241 shown in fig. 9 and the adhesive-coated wiring board 21 shown in fig. 11 are aligned. Fig. 12 shows a side view of the lens mount 241 of fig. 9 and the adhesive coated circuit board 21 of fig. 11 aligned. As shown in fig. 12, the sum of the height of the component 223 and the thickness of the wiring board adhesive 252 is slightly larger than the depth of the concave accommodation space 2414 corresponding to the component 223.

Before the adhesive 25 does not become solid, the lens holder 241 and the wiring board 21 shown in fig. 12 are pressed together in a direction toward each other. Fig. 13 shows a side view of the lens mount 241 and the wiring board 21 of fig. 12 bonded together. As shown in fig. 13, the component 223 is bonded to the bottom surface of the concave accommodation space 2414 of the mirror mount 241 by the wiring board adhesive 252 on the surface thereof, and the attachment support 2411 of the mirror mount 241 is bonded to the bonding region of the peripheral portion of the wiring surface 210 of the wiring board 21 by the component adhesive 251. The component adhesive 251 and the wiring board adhesive 252 are then baked to become solid, so that the lens holder 241 and the wiring board 21 are firmly bonded together. Since the size of the concave accommodation space 2414 is larger than the size of the component 223 corresponding thereto, when the component 223 is positioned in the concave accommodation space 2414 corresponding thereto, there is a gap 26 between the component 223 and the side wall of the concave accommodation space 2414.

And filling the gaps between the corresponding components and the side walls of the concave accommodating space with sealant. Fig. 14 shows a side view of the gap 26 between the concave accommodation space 2414 of the lens holder 241 shown in fig. 13 and the component 223 on the wiring board 21 filled with the sealant. As shown in fig. 14, the gaps 26 between the side walls of any component 223 and the corresponding side wall of the concave accommodation space 2414 are filled with the sealant 27, and the sealant 27 can prevent external light and substances from contacting the photosensitive chip 23, thereby avoiding influencing imaging and prolonging the service life of the lens module.

The sealant 27 is preferably a black quick-drying adhesive or a shadowless adhesive (UV adhesive) having strong toughness, poor fluidity, light resistance and water resistance. During the process of filling the sealant 27, the sealant 27 can be effectively prevented from thermal expansion, breakage, and spilling onto the photosensitive chip 23.

The above manufacturing method can be used to manufacture the lens module 1 shown in fig. 1, and specific manufacturing steps are not described herein.

The present invention is merely illustrative of components disposed at the peripheral portion of the circuit board having a distance from the peripheral edge of the circuit board of less than 0.1 millimeters or less than 0.05 millimeters. Those skilled in the art will appreciate that in the lens module disclosed in the present invention, as the mounting accuracy of the component mounting apparatus increases, the distance between the component and the corresponding edge of the wiring surface of the circuit board may be smaller, for example, smaller than 0.01 mm or even close to 0.

The present invention is not intended to limit the shape of the wiring board 11 or 21 to a square shape, and in other embodiments of the present invention, the shape of the wiring board 11 or 21 may be other shapes such as a polygon, a circle, and the like. Accordingly, the shape of the lens holder 141 or 241 bonded to the wiring board 11 or 21 may be polygonal, circular, or the like.

In other embodiments of the present invention, the kinds and the number of components on the wiring board 11 or the wiring board 21 may be set according to actual needs.

The present invention is not intended to be limited to a fixed connection between a circuit board and a lens holder assembly in a lens module by an adhesive, and in other embodiments of the present invention, a fixed connection between a circuit board and a lens holder assembly may be achieved by a hot melt connection, welding, or by an additional connector, etc.

The above description is only illustrative of the preferred embodiments of the present application and of the principles of the technology employed. It should be understood by those skilled in the art that the scope of protection referred to in this application is not limited to the specific combination of the above technical features, but also encompasses other technical solutions formed by any combination of the above technical features or their equivalents without departing from the technical concept. Such as the above-mentioned features and the technical features having similar functions (but not limited to) in the application are replaced with each other.

Claims

1. A lens module, comprising:

a wiring board including a wiring surface;

a component assembly provided on a peripheral portion of the wiring surface; and

a lens mount assembly including an attaching support configured to be fixed to a peripheral portion of the wiring surface, the attaching support having a plurality of concave accommodation spaces to accommodate the component assembly, a shape of each of the plurality of concave accommodation spaces being adapted to a shape of a corresponding one of the component assemblies;

the size of the concave accommodating space is larger than that of a corresponding component in the component assembly in the direction parallel to the circuit board.

2. The lens module as claimed in claim 1, wherein an adhesive region is provided between adjacent ones of the component assemblies on a peripheral portion of the wiring surface, and the attachment support is fixed to the adhesive region.

3. The lens module of claim 1, wherein the plurality of concave receiving spaces are provided at edges of the attachment support.

4. The lens module of claim 1, wherein each component of the component assembly is spaced less than 0.1 millimeters from a circumferential edge of the routing surface.

5. The lens module of claim 4, wherein each component in the component assembly is spaced less than 0.01 millimeters from a circumferential edge of the routing surface.

6. The lens module of any one of claims 1 to 5, further comprising:

a component adhesive filled between a bottom surface of each of the plurality of concave accommodation spaces and an upper surface of a corresponding component in the component assembly; and/or

And a wiring board adhesive filled between the attaching support and the wiring surface.

7. The lens module of claim 6, further comprising a light and dust protective sealant filled between a sidewall of each of the plurality of concave receiving spaces and a sidewall of a corresponding component in the component assembly.

8. The lens module of any one of claims 1 to 5, further comprising a photosensitive chip disposed in a middle of the wiring surface and surrounded by the component assembly.

9. The lens module of any of claims 1-5, wherein the lens mount assembly comprises:

a light filter;

a lens; and

the lens base comprises a hollow channel and an attached supporting piece, one part of the hollow channel is matched with the shape of the optical filter and used for accommodating and fixing the optical filter, and the other part of the hollow channel is matched with the shape of the lens and used for accommodating and fixing the lens.

10. A method for manufacturing a lens module, comprising:

disposing a component assembly on a periphery of a wiring surface of a wiring board; and

and fixing an attaching support of a lens holder assembly to a peripheral portion of the wiring surface, and positioning the component assembly in a plurality of concave accommodation spaces of the attaching support, wherein a shape of each of the plurality of concave accommodation spaces is adapted to a shape of a corresponding one of the component assemblies, and a size of the concave accommodation space is larger than a size of the corresponding one of the component assemblies in a direction parallel to the wiring board.

11. The manufacturing method according to claim 10, wherein after the component assembly is provided on the peripheral portion of the wiring surface of the wiring board, the method further comprises: coating an adhesive on the periphery of the wiring surface; and

after securing the attachment support of the lens mount assembly to the perimeter of the wiring surface, the method further includes the step of baking the adhesive.

12. The method of manufacturing according to claim 11, wherein after baking the adhesive, the method further comprises: and filling light-proof and dust-proof sealant between the side wall of each of the plurality of concave accommodating spaces and the side wall of the corresponding component in the component assembly.