CN116140832B

CN116140832B - Method and system for automatically correcting precision of intelligent inductance coil laser cutting system

Info

Publication number: CN116140832B
Application number: CN202310427851.3A
Authority: CN
Inventors: 蔡旌章; 王其艮; 刘维坚; 张姝娟; 万芳中
Original assignee: SHENZHEN CENKER ENTERPRISE Ltd
Current assignee: Cenke Technology Shenzhen Group Co ltd
Priority date: 2023-04-20
Filing date: 2023-04-20
Publication date: 2023-07-04
Anticipated expiration: 2043-04-20
Also published as: CN116140832A

Abstract

The embodiment of the invention provides a method and a system for automatically correcting precision of an intelligent inductance coil laser cutting system, which relate to the field of laser cutting, wherein the method is applied to the laser cutting system, and the laser cutting system comprises the following steps: the laser comprises a laser, a cantilever for installing the laser, a beam emitter arranged on the cantilever, a workbench, N1 laser sensors arranged in a processing area of the workbench and a beam sensor arranged in a non-processing area of the workbench, wherein the beam irradiation direction of the beam emitter points to the beam sensor. The method comprises the following steps: judging whether the beam sensor receives the emitted light beam of the light beam emitter; when the beam sensor does not receive the emitted beam, starting a first correcting process; and initiating a second corrective procedure prior to laser cutting with the laser a workpiece to be machined placed in the machining region. According to the method, the laser is corrected before laser cutting, so that the laser cutting accuracy and the continuous accurate time can be improved.

Description

Method and system for automatically correcting precision of intelligent inductance coil laser cutting system

Technical Field

The invention relates to the technical field of laser cutting, in particular to a method and a system for automatically correcting accuracy of an intelligent inductance coil laser cutting system.

Background

Laser cutting is to irradiate a workpiece with a focused high power density laser beam to rapidly melt, vaporize, ablate or reach a fire point, while blowing away molten material with a high velocity gas stream coaxial with the beam to effect cutting of the workpiece. Laser cutting belongs to one of the thermal cutting methods. Laser cutting is one of the most important application techniques in the laser processing industry, and it accounts for more than 70% of the entire laser processing industry. The laser cutting is an advanced cutting process in the current world, and has the advantages of precision manufacturing, flexible cutting, special-shaped processing, one-step forming, high speed, high efficiency and the like, so that the difficult problem which cannot be solved by a plurality of conventional methods is solved in industrial production, and most of metal materials and nonmetal materials can be cut by the laser.

In the current industrial production, the precision requirement of the laser cutting technology is higher and higher, so that the loss caused by the abnormal precision in the cutting process is avoided. In order to improve the accuracy of the laser cutting technology, the means generally used at present are: improving the quality of the laser beam, controlling the beam to be more focused, optimizing cutting parameters, using high precision machine tools, etc. However, even if the above-mentioned means are adopted, it is difficult to avoid the occurrence of abnormality in the accuracy during the cutting with the laser, and thus a solution capable of improving the accuracy of laser cutting is urgently required at present.

Disclosure of Invention

Accordingly, the present invention is directed to a method and a system for automatically correcting accuracy of an intelligent inductance coil laser cutting system, which can improve the accuracy and the duration of laser cutting by correcting a laser before performing laser cutting.

In order to achieve the above object, the technical scheme adopted by the embodiment of the invention is as follows:

in a first aspect, the present invention provides a method for automatically correcting accuracy of an intelligent inductance coil laser cutting system, applied to a laser cutting system, the laser cutting system comprising: the laser comprises a laser, a cantilever for installing the laser, a beam emitter arranged on the cantilever, a workbench, N1 laser sensors arranged in a processing area of the workbench and a beam sensor arranged in a non-processing area of the workbench, wherein the beam irradiation direction of the beam emitter points to the beam sensor. The method of the first aspect comprises: judging whether the beam sensor receives the emitted light beam of the light beam emitter; when the beam sensor does not receive the emitted beam, starting a first correcting process; and starting a second correction process before laser cutting a workpiece to be processed placed in the processing area by using the laser; wherein the first corrective procedure comprises the steps of: acquiring the position of a beam falling point of the emitted beam irradiated to the workbench; driving the cantilever according to the position of the light beam sensor on the workbench and the position of the light beam falling point so as to enable the position of the light beam falling point to coincide with the position of the light beam sensor on the workbench; when the position of the beam drop point is coincident with the position of the beam sensor on the workbench, the irradiation range of the laser completely comprises a processing area; the second corrective procedure includes the steps of: controlling a laser to emit a laser beam to a preset cutting position on a processing area, wherein the power of the laser beam is lower than a preset power; receiving laser beams by using N1 laser sensors; when the laser sensors in the N1 laser sensors receive the laser beams, determining the laser landing point position of the laser beams in the processing area according to the positions of the laser sensors in the N1 laser sensors which receive the laser beams; and correcting the irradiation direction of the laser according to the laser landing point position and the preset cutting position so as to irradiate the laser beam to the preset cutting position.

In a second aspect, the invention provides a smart inductor laser cutting system. The system comprises a laser, a cantilever for installing the laser, a beam emitter arranged on the cantilever, a control host, a workbench, N1 laser sensors arranged in a processing area of the workbench and a beam sensor arranged in a non-processing area of the workbench, wherein the beam irradiation direction of the beam emitter points to the beam sensor, and the control host is connected with the laser, the cantilever, the beam emitter, the beam sensor and the laser sensor; the control host is used for judging whether the light beam sensor receives the light beam emitted by the light beam emitter or not; the control host is also used for starting a first correction process when the light beam sensor does not receive the emitted light beam; the control host is also used for starting a second correction process before the laser is used for cutting the workpiece to be processed placed in the processing area by the laser; wherein the first corrective procedure comprises the steps of: acquiring the position of a beam falling point of the emitted beam irradiated to the workbench; driving the cantilever according to the position of the light beam sensor on the workbench and the position of the light beam falling point so as to enable the position of the light beam falling point to coincide with the position of the light beam sensor on the workbench; when the position of the beam drop point is coincident with the position of the beam sensor on the workbench, the irradiation range of the laser completely comprises a processing area; the second corrective procedure includes the steps of: controlling a laser to emit a laser beam to a preset cutting position on a processing area, wherein the power of the laser beam is lower than a preset power; receiving laser beams by using N1 laser sensors; when the laser sensors in the N1 laser sensors receive the laser beams, determining the laser landing point position of the laser beams in the processing area according to the positions of the laser sensors in the N1 laser sensors which receive the laser beams; and correcting the irradiation direction of the laser according to the laser landing point position and the preset cutting position so as to irradiate the laser beam to the preset cutting position.

In an alternative embodiment of the invention, the second corrective procedure further comprises the steps of: when none of the N1 laser sensors receives the laser beams, an image acquisition device is utilized to shoot an image comprising a processing area; and acquiring the laser position of the laser beam in the processing area according to the image, and correcting the irradiation direction of the laser according to the laser position and the preset cutting position so as to irradiate the laser beam to the preset cutting position.

In an alternative embodiment of the invention, the control host is further used for performing laser cutting on the workpiece to be processed by using the laser; the control host is also used for starting a third correction process in the process of carrying out laser cutting on the workpiece to be processed by using the laser; wherein the third corrective procedure comprises the steps of: controlling a laser to emit a reference laser beam to a preset reference position on a processing area within a preset time window, wherein the preset reference position is not blocked by a workpiece to be processed; receiving reference laser beams by using N1 laser sensors, and determining a laser landing point reference position of the reference laser beams in a processing area according to the positions of the laser sensors which receive the reference laser beams in the N1 laser sensors; correcting the irradiation direction of the laser when the workpiece to be processed is subjected to laser cutting according to the laser falling point reference position and the preset reference position.

In an alternative embodiment of the present invention, the preset time window is a plurality of mutually spaced sub-time periods in a time period during which the laser performs laser cutting on the workpiece to be processed, and a time length of each sub-time period is smaller than the preset time length.

In an alternative embodiment of the invention, the laser comprises a laser generator and a mirror arranged on the laser emission path of the laser generator; wherein controlling the laser to emit a reference laser beam to a preset reference position on the processing region within a preset time window comprises: and controlling the emission direction of the reference laser beam emitted by the laser generator by controlling the reflecting mirror within a preset time window so as to irradiate the reference laser beam to a preset reference position on the processing area.

In an alternative embodiment of the invention, the laser comprises a laser generator, a spectroscope, a reflecting mirror and a controllable light shielding sheet, wherein the spectroscope is arranged on a laser emission path of the laser generator, the reflecting mirror is arranged on a first beam splitting path of the spectroscope, the controllable light shielding sheet is arranged on a second beam splitting path of the spectroscope, wherein a laser beam generated by the laser generator passes through the spectroscope to generate two beams of laser, the two beams of laser are respectively emitted along the first beam splitting path and the second beam splitting path, and a preset irradiation direction of the laser emitted along the second beam splitting path points to a preset reference position; wherein controlling the laser to emit a reference laser beam to a preset reference position on the processing region within a preset time window comprises: and in a preset time window, starting the controllable shading sheet so as to enable the laser emitted along the second sub-optical path to be used as a reference laser beam to irradiate to a preset reference position on the processing area.

In an alternative embodiment of the invention, the N1 laser sensors are distributed in a rectangular array.

In an alternative embodiment of the invention, the processing area is square, and the processing area comprises 9 sub-squares divided according to a three-division method, and each sub-square comprises 5×5 laser sensors distributed in an array.

In an alternative embodiment of the invention, the beam emitters provided to the cantilever comprise N2 beam emitters and the beam sensors provided to the non-processing area comprise N2 beam sensors; wherein an ith light beam emitter of the N2 light beam emitters corresponds to an ith light beam sensor of the N2 light beam sensors, and a light beam irradiation direction of the ith light beam emitter is directed to the ith light beam sensor.

Based on the embodiments provided in the above aspects, in the method for automatically correcting accuracy of the intelligent induction coil laser cutting system: the first correction process can be used to correct the position of the laser as a whole and the second correction process can be used to accurately correct the position of the laser irradiated onto the workpiece to be processed. And further, the irradiation range of the laser is limited, if the laser is corrected only by the second correction process, after long-time error accumulation, there is a case that the correction requirement exceeds the irradiation range of the laser (i.e., correction is out of limit), so that correction cannot be completed. Therefore, by adding the first correction process before the second correction process, the position of the laser can be corrected to the position of the processing area capable of irradiating the workbench in the maximum range, so that the problem of overrun correction in the second correction process is effectively avoided, the occurrence probability of manual correction on the laser cutting system is reduced, and the time of fault-free and accurate work of the laser cutting system is prolonged. That is, the embodiment of the invention can improve the laser cutting accuracy and the continuous accurate time by correcting the laser before the laser cutting.

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and should not be considered as limiting the scope, and other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of a laser cutting system according to an embodiment of the present invention;

FIG. 2 is a schematic view of the processing region of FIG. 1;

FIG. 3 is a schematic flow chart of a method for automatically correcting accuracy of an intelligent induction coil laser cutting system according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a structure of the laser shown in FIG. 1 according to an embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating a laser sensor in a processing area according to an embodiment of the present invention;

fig. 6 is a schematic diagram of a correction process in a processing area scenario according to an embodiment of the present invention.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.

It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.

In order to solve the above problems in the prior art. The embodiment of the invention provides a technical scheme, which comprises a method for automatically correcting accuracy of an intelligent induction coil laser cutting system and the laser cutting system. According to the embodiment of the invention, the laser is corrected before laser cutting, so that the laser cutting precision and the continuous precision time can be improved. First, the laser cutting system will be described below with reference to the accompanying drawings:

referring to fig. 1, fig. 1 shows a block diagram of a laser cutting system according to an embodiment of the invention. The intelligent induction coil laser cutting system 100 (hereinafter referred to as laser cutting system 100) includes: the laser 110, the cantilever 120 for mounting the laser 110, the beam emitter 130 disposed on the cantilever 120, the control host 170, the worktable 140, the N1 laser sensors 150 (i.e., laser sensors) disposed on the processing area 141 of the worktable 140, and the beam sensor 160 disposed on the non-processing area 142 of the worktable 140, and the beam irradiation direction of the beam emitter 130 is directed to the beam sensor 160. Control host 170 is coupled to laser 110, cantilever 120, beam emitter 130, beam sensor 160, and laser sensor 150.

Alternatively, the control host 170 may be an electronic device including a CPU, such as an industrial personal computer, a desktop computer, a notebook computer, a tablet computer, or the like. The laser 110 refers to a device capable of emitting laser light, including but not limited to a gas laser, a solid state laser, a semiconductor laser, etc.

Optionally, the cantilever 120 is provided with a motor and a joint capable of rotating with multiple degrees of freedom, the laser 110 may be disposed on the head of the cantilever 120, and the motor is controlled by the control host 170 to drive the joint to rotate, so as to drive the irradiation range of the laser 110 to change.

Alternatively, the beam emitter 130 may be a laser emitter, an infrared emitter, or the like. Correspondingly, when the beam emitter 130 is a laser emitter, the beam sensor 160 is a laser sensor (i.e., a laser sensor); when the beam emitter 130 is an infrared emitter, the beam sensor 160 is an infrared sensor. In this embodiment, the beam emitter 130 provided to the cantilever 120 may include N2 beam emitters, and the beam sensor 160 provided to the non-processing region 142 may include N2 beam sensors. Wherein an ith light beam emitter of the N2 light beam emitters corresponds to an ith light beam sensor of the N2 light beam sensors, and a light beam irradiation direction of the ith light beam emitter is directed to the ith light beam sensor.

The machining region 141 refers to a region for placing a workpiece to be machined.

Optionally, N1 laser sensors 150 are distributed in a rectangular array (as shown in fig. 1). Also, referring to fig. 2, in this embodiment, the processing region 141 may be set to be square, and 9 sub-squares divided according to a three-division method may be included in the processing region 141, each sub-square including 5×5 laser sensors distributed in an array. That is, a total of 255 laser sensors distributed in an array may be disposed in the processing region 141.

Alternatively, the laser cutting system 100 may be used for laser cutting of smart inductors.

Further, an implementation manner of the method for automatically correcting the precision of the intelligent induction coil laser cutting system is provided below. Referring to fig. 3, fig. 3 is a flow chart illustrating a method for automatically correcting accuracy of an intelligent inductor laser cutting system according to an embodiment of the present invention. Optionally, the method for automatically correcting the precision can be used for automatically correcting the precision of a laser cutting system of the intelligent inductance coil.

The method for automatically correcting the precision of the intelligent induction coil laser cutting system can be applied to the laser cutting system 100 shown in fig. 1 and can be executed by the control host 170 in the laser cutting system 100. Specifically, the method for automatically correcting the accuracy of the intelligent induction coil laser cutting system may include the following steps S310 to S330, which are sequentially described below.

S310, the control host 170 determines whether the beam sensor 160 receives the emitted beam of the beam emitter 130.

S320, when the beam sensor 160 does not receive the emitted beam, the control host 170 starts the first correction process.

It will be appreciated that when beam sensor 160 receives the emitted beam, control host 170 may not initiate the first corrective procedure.

When the beam emitter 130 includes N2 beam emitters and the beam sensor 160 includes N2 beam sensors, the determining manner of S310 includes: control host 170 in turn determines whether each of the N2 beamsensors receives the emitted beam from its corresponding beamer. When the beam sensor does not receive the emitted light beams of the corresponding beam emitters in the N2 beam sensors, a first correction process is started; otherwise the first corrective procedure may not be initiated.

S330, the control host 170 starts the second rectification process before laser cutting the workpiece to be processed placed in the processing region 141 by the laser 110.

Wherein the first corrective procedure may include the following steps 1.1 and 1.2:

in step 1.1, control host 170 obtains the beam landing position of the emitted beam onto stage 140.

Specifically, an image of the processing region 141 may be captured with an image acquisition device (e.g., a camera) and the beam landing position determined from the image. Accordingly, the laser cutting system 100 may further include an image acquisition device, which may be connected to the control host 170, and controlled by the control host 170.

In step 1.2, the control host 170 drives the cantilever 120 according to the position of the beam sensor 160 on the stage 140 and the beam landing position, so that the beam landing position coincides with the position of the beam sensor 160 on the stage 140. Wherein the irradiation range of the laser 110 completely includes the processing region 141 when the beam landing position coincides with the position of the beam sensor 160 on the stage 140.

Whether the beam drop position coincides with the position of the beam sensor 160 on the table 140 can be determined by whether the beam sensor 160 receives the beam from the beam emitter 130.

Specifically, a coordinate system may be established based on the beam landing position in the image and the position of the beam sensor 160 on the table 140, and the distance between the position of the beam sensor 160 on the table 140 and the beam landing position is calculated in the coordinate system to obtain the relative distance between the two positions. Then, the control host 170 drives the cantilever 120 to move according to the relative distance, so that the beam sensor 160 detects the beam emitted from the beam emitter 130. When the beam sensor 160 detects the beam emitted by the beam emitter 130, it indicates that the beam landing position coincides with the position of the beam sensor 160 on the stage 140. The manner of driving the cantilever 120 described above may be referred to as a conventional method.

Also, in this embodiment, the irradiation range of the laser 110 may be entirely included in the processing region 141 in a manner set in advance so that when the beam landing position coincides with the position of the beam sensor 160 on the stage 140.

In the first correction process described above, the position of the laser can be corrected as a whole by adjusting the cantilever 120 so that the irradiation range of the laser 110 entirely includes the processing region 141.

The second corrective procedure may include the following steps 2.1-2.3:

in step 2.1, the control host 170 controls the laser 110 to emit the laser beam to the preset cutting position on the processing area 141, wherein the power of the laser beam is lower than the preset power, that is, the low power laser, so that the power consumption can be saved.

It will be appreciated that the preset cut position may be manually configured and entered into the control host 170. The preset cutting position represents an irradiation position when the laser 110 is used to cut the workpiece to be processed placed in the processing region 141.

Moreover, when the laser 110 that has not completed the correction emits the laser beam to the preset cutting position on the processing area 141, the laser beam may just irradiate the preset cutting position, or there may be a certain offset, that is, irradiate the vicinity of the preset cutting position.

In step 2.2, control host 170 receives the laser beams using N1 laser sensors 150.

In step 2.3, when there are N1 laser sensors 150 that receive the laser beam, the control host 170 determines the laser landing position of the laser beam in the processing area 141 according to the positions of the laser sensors of the N1 laser sensors 150 that receive the laser beam.

In step 2.4, the control host 170 corrects the irradiation direction of the laser 110 according to the laser landing position and the preset cutting position, so that the laser beam irradiates the preset cutting position.

Specifically, a coordinate system may be suggested based on the machining region 141, and a relative distance between the two positions may be calculated from the laser landing position and the preset cutting position. Then, the control host 170 drives the laser 110 according to the relative distance to change the outgoing laser direction (i.e., irradiation direction) of the laser, so that the laser beam is irradiated to the preset cutting position.

Whether the laser beam irradiates the preset cutting position or not can be judged by whether the laser sensor at the preset cutting position receives the laser beam or not.

In the second correction process, by correcting the irradiation direction of the laser 110, it is possible to achieve that the laser 110 is precisely irradiated to the desired processing position (i.e., the preset cutting position) on the workpiece to be processed.

Therefore, in the method for automatically correcting the precision of the intelligent induction coil laser cutting system provided in the above embodiment: the first correction process can be used to correct the position of the laser 110 as a whole and the second correction process can be used to accurately correct the position of the laser 110 impinging on the workpiece to be processed. And further, the irradiation range of the laser 110 is limited, if the laser 110 is corrected only by the second correction process, after long-time error accumulation, there is a case that the correction requirement exceeds the irradiation range of the laser 110 (i.e., the correction is over-limited), so that the correction cannot be completed. Therefore, by adding the first correction process before the second correction process, the position of the laser 110 can be corrected to the position of the processing area 141 capable of irradiating the workbench 140 in the maximum range, so that the problem of overrun correction in the second correction process is effectively avoided, the occurrence probability of the correction condition of the laser cutting system by manpower is reduced, and the time period of no fault and accurate operation of the laser cutting system is prolonged. That is, the embodiment of the present invention can improve the laser cutting accuracy and the duration of the laser cutting accuracy by correcting the laser 110 before performing the laser cutting.

In an alternative embodiment, the second corrective procedure further includes the following steps 2.5-2.6:

in step 2.5, when none of the N1 laser sensors 150 receives the laser beams, the control host 170 captures an image including the processing region 141 using the image capturing apparatus.

In step 2.6, the control host 170 obtains the laser position of the laser beam in the processing area 141 according to the image, and corrects the irradiation direction of the laser 110 according to the laser position and the preset cutting position, so that the laser beam irradiates the preset cutting position.

Specifically, when none of the N1 laser sensors 150 receives the laser beams, an image of the processing region 141 may be captured by an image capturing device (e.g., a camera) and the laser position of the laser beam in the processing region 141 may be determined from the image.

Whether the laser beam irradiates to the preset cutting position or not can be judged by whether the laser sensor at the preset cutting position receives the laser beam or not.

Specifically, a coordinate system may be established based on the laser position and the preset cutting position in the image, and the distance between the laser position and the preset cutting position may be calculated in the coordinate system to obtain the relative distance between the two positions. Then, the control host 170 drives the laser 110 according to the relative distance to change the outgoing laser direction (i.e., irradiation direction) of the laser, so that the laser beam is irradiated to the preset cutting position.

In an alternative embodiment, the method for automatically correcting the precision of the intelligent induction coil laser cutting system further comprises the following steps 3.1-3.2:

in step 3.1, control host 170 uses laser 110 to laser cut the workpiece to be machined.

In step 3.2, during laser cutting of the workpiece to be processed using the laser 110, the control host 170 initiates a third corrective procedure.

Wherein the third correction process comprises the following steps 4.1-4.3:

step 4.1, controlling the laser 110 to emit a reference laser beam to a preset reference position on the processing area 141 within a preset time window, wherein the preset reference position is not blocked by the workpiece to be processed.

The preset time window may be one or more of the time periods during which the laser 110 laser cuts the workpiece to be processed. For example, the laser 110 performs laser cutting on the workpiece to be processed for a period of 0s-3.0s, and then the preset time window may be 0.5s-0.6s; or the preset time window may include 0.5s-0.6s,1.5s-1.6s, and 2.5s-2.6s.

Optionally, the preset time window is a plurality of sub-time periods spaced apart from each other in a time period during which the laser 110 performs laser cutting on the workpiece to be processed, and a time length of each sub-time period is less than the preset time length. Wherein the preset time length may be 10ms.

In step 4.2, N1 laser sensors 150 are used to receive the reference laser beams, and the laser landing reference position of the reference laser beam in the processing area 141 is determined according to the positions of the laser sensors of the N1 laser sensors 150 that receive the reference laser beams.

And 4.3, correcting the irradiation direction of the laser 110 when the workpiece to be processed is subjected to laser cutting according to the laser landing point reference position and the preset reference position.

Specifically, a coordinate system may be suggested based on the processing region 141, and a relative distance between the two positions may be calculated from the laser landing reference position and the preset reference position. Then, the control host 170 uses the relative distance as a correction value to drive the outgoing laser direction of the laser 110, so that the laser beam of the laser 110 irradiates the preset cutting position on the workpiece to be processed accurately.

In the above steps 4.1-4.3, the method provided by the embodiment of the invention can also realize that the laser 110 is corrected in real time in the process of performing laser cutting on the workpiece to be processed by using the laser 110, so that the laser cutting accuracy is further improved.

In one embodiment, the laser 110 includes a laser generator and a mirror disposed in a laser emission path of the laser generator. In this embodiment, for step 4.1 in the third correction process, controlling the laser 110 to emit the reference laser beam to the preset reference position on the processing region 141 within the preset time window may include: the control host 170 controls the emission direction of the reference laser beam emitted from the laser generator by controlling the mirror within a preset time window so that the reference laser beam is irradiated to a preset reference position on the processing region 141.

The manner in which the emission direction of the reference laser beam generated by the laser generator is adjusted by adjusting the mirror can be referred to conventional means.

In another embodiment, referring to fig. 4, the laser 110 includes a laser generator 111, a beam splitter 112, a reflecting mirror 113 and a controllable light shielding sheet 114, the beam splitter 112 is disposed on a laser emitting path of the laser generator 111, the reflecting mirror 113 is disposed on a first beam splitting path of the beam splitter 112, and the controllable light shielding sheet 114 is disposed on a second beam splitting path of the beam splitter 112. The controllable light shielding sheet 114 can be controlled by the control host 170 to be opened or closed, and when the controllable light shielding sheet 114 is opened, laser can be allowed to pass through; when closed, the controllable gobo 114 shields the laser light from transmission. The laser beam generated by the laser generator 111 passes through the beam splitter 112 to generate two laser beams, and the two laser beams are emitted along the first beam splitting path and the second beam splitting path, and the preset irradiation direction of the laser beam emitted along the second beam splitting path points to the preset reference position, that is, in the case of precise correction, the laser beam emitted along the second beam splitting path is preconfigured to be irradiated to the preset reference position. In this embodiment, for step 4.1 in the third correction process, controlling the laser 110 to emit the reference laser beam to the preset reference position on the processing region 141 within the preset time window may include: the control host 170 turns on the controllable light shielding sheet 113 within a preset time window so that the laser light emitted along the second split optical path is irradiated as a reference laser light beam to a preset reference position on the processing region 141.

A mirror may be disposed behind the controllable gobo 114 to control the direction of the laser light emitted along the second split optical path through the controllable gobo 114.

It will be appreciated that the configuration of the laser 110 shown in fig. 4, and the use of the configuration to implement real-time correction of the laser 110, can function: the laser 110 is calibrated in real time without interrupting the laser cutting process of the workpiece to be processed.

Wherein, during a period of time outside the preset time window, the controllable light shielding sheet 113 is closed.

On the basis of the method embodiment, the embodiment of the invention further describes the method embodiment by combining specific examples and application scenes, and the specific examples are as follows:

1, a preliminary inspection process of the laser cutting system 100. This process may be performed by an intelligent precision correction system intelligent laser cutting apparatus test module in control host 170.

The preliminary detection process includes: after control host 170 is started, in preparation for entering the working mode, laser cutting system 100 is first detected before entering the working mode, control host 170 acquires the authority of laser 110, and simultaneously starts the receivers (i.e., laser sensors 150) of 9 areas (9 sub-squares as shown in fig. 2) of the laser cutting device work table, which are closely spaced. Control host 170 sequentially emits laser light once to the receivers of 9 areas. When the receiver receives the laser, it feeds back the control host 170, if the number of the fed records reaches 9, it indicates that the laser cutting system 100 is abnormal, if the number is less than 9, it is set to an abnormal mode, and the area without feedback is sent to the user side, so as to remind the user that maintenance is needed.

Specifically, laser cutting system 100 is powered up, control host 170 is started, and first goes into a preliminary test to test before entering an operational mode, creating a thread, creating two modes:

mode one: no-anomaly mode of intelligent equipment workbench receiver

The control host 170 sequentially performs one-time low-efficiency laser cutting on the 9 areas, a receiver on the workbench receives the cut areas during cutting, feeds back the cut areas to the control host 170 after receiving the cut areas, and sets a non-abnormal mode when 9 pieces of feedback records are recorded.

Laser cutting system 100 is activated and control host 170 receives a control command to prepare for an operation mode, and control host 170 tests laser cutting system 100 before entering the operation mode. The laser cutting system 100 work platform is divided into 9 areas, each of which activates 1 receiver (receives and feeds back laser). Control host 170 obtains the authority of intelligent laser 110, and after obtaining the authority, control host 170 starts laser 110 to perform one-time inefficient laser cutting on 9 areas.

Control host 170 performs one time of low-efficiency laser cutting (set as time T1 laser cutting) on zone 1 (i.e., zone 1), and after receiving the low-efficiency laser cutting emitted by laser 110, the receiver in zone 1 feeds back to control host 170. And (3) performing one-time low-efficiency laser cutting on the No. 2 area after the T1 moment emission is completed for 5 seconds, setting the one-time low-efficiency laser cutting on the No. 3 area after the T2 moment emission is completed for 5 seconds, and so on, …, performing one-time low-efficiency laser cutting on the No. 9 area after the T8 moment emission is completed for 5 seconds, and setting the one-time low-efficiency laser cutting on the No. 9 area to be the T9 moment laser cutting. After completion, the feedback transmitted from the receiver is saved to the memory 01. The control host 170 reads the data fed back from the memory 01, determines that the receivers in 9 areas of the workbench of the laser cutting system 100 are currently operating normally, and sets the receiver of the workbench of the intelligent device to have no abnormal mode, so as to prepare for entering the working mode.

Mode two: abnormal mode of intelligent equipment workbench receiver

The control host 170 sequentially performs one-time low-efficiency laser cutting on the 9 areas, a receiver on the workbench receives the cutting areas during cutting, feeds back the cutting areas to the control host 170 after receiving the cutting areas, records 9 feedback records, sets an abnormal mode when 8 actual feedback records exist, and reminds a user of maintenance.

Specific: laser cutting system 100 is activated and control host 170 receives a control command to prepare for an operation mode, and control host 170 tests laser cutting system 100 before entering the operation mode. The laser cutting system 100 work platform was divided into 9 zones, each zone having 1 receiver activated. Control host 170 acquires laser 110 authority, and after acquiring the authority, control host 170 starts intelligent laser 110 to perform one-time inefficient laser cutting on 9 areas.

The control host 170 performs one time of low-efficiency laser cutting on the area 1 (i.e. the area 1) to set the time of laser cutting at the time of T1, and after the area 1 receiver receives the low-efficiency laser cutting emitted by the intelligent laser, the control host 170 is fed back. And (3) performing one-time low-efficiency laser cutting on the No. 2 area after the T1 moment emission is completed for 5 seconds, setting the one-time low-efficiency laser cutting on the No. 3 area after the T2 moment emission is completed for 5 seconds, and so on, …, performing one-time low-efficiency laser cutting on the No. 9 area after the T8 moment emission is completed for 5 seconds, and setting the one-time low-efficiency laser cutting on the No. 9 area to be the T9 moment laser cutting. After completion, the feedback transmitted from the receiver is saved to the memory 02 (8 records). The control host 170 reads the data fed back from the memory 02, judges that an abnormality occurs in one of 9 area receivers of the workbench of the current laser cutting system 100, 1 area does not send feedback, and saves the area mark without feedback to the memory 03. Setting an abnormal mode of a receiver of the workbench of the intelligent equipment, exiting the working mode, sending data of the memory 03 to the cloud, and reminding a user side that the receiver of one area is invalid by the cloud, so that maintenance is needed. Then, the memory 01 and the memory 03 are summed, and the result is saved to the memory 04.

2, a zone planning process of the laser cutting system 100. This process may be performed by an intelligent cutting correction system table area planning module in control host 170.

The area planning process includes: control host 170 obtains that laser cutting system 100 is not abnormal, then obtains the settings of the staff, and opens three modes of multi-plan/medium-plan/few-plan (default opening multi-plan mode). As shown in fig. 5, the multiple planning mode refers to: creating a square on a workbench, planning 9 areas (9 sub-squares) in the square by using a three-division method, then starting quadratic programming, planning the planned 9 areas again, planning 25 small squares again in each area, planning 225 small squares in total, wherein each small square represents a position and starting a receiver (shown in figure 2). The medium planning mode refers to: and performing secondary planning, planning 9 areas again in the planned area 1, and so on to totally draw 81 blocks. The less planning mode refers to: the planning is only once, i.e. 9 areas are planned and ended. Control host 170 then enters a standby mode and may enter an operational mode at any time. In fig. 5, the side length of the outermost square is: square side length of one-time planning: square side length of quadratic programming: side length of small square = 100:60:20:4.

Specifically: control host 170 obtains a value of memory 04 greater than 1, starts the workbench receiver, and creates a thread, creating the following three modes:

mode one: intelligent cutting correction system multi-zone planning

As shown in fig. 5, it is assumed that the operator sets to turn on the multi-planning mode, i.e., plans a square to circle 9 areas, and plans 9 areas, i.e., 9 squares, using the three-division method, then performs the secondary planning in the multi-area planning, plans again in the first area planned at a time, plans 25 small squares, and plans 225 small squares in total, where one small square represents one sensor position. As shown in FIG. 5, the first square below has the coordinates (P1-1), and the first square above has the coordinates (P5-1).

Specific: control host 170 obtains data from memory 04, determines that the current device preparation mode is not abnormal, and the device can operate normally. Then, control host 170 acquires the settings of the worker, saves the settings to memory 05, and control host 170 reads the data of memory 05 (multi-planning mode) to turn on the multi-zone planning mode (2-planning). Setting a square to circle 9 receiver areas, setting 3 rectangles with the proportion of 33% on the vertical direction from top to bottom, setting two transverse lines at the proportion of 33% and 66% from left to right after finishing, planning 9 square areas, setting 5 rectangles with the proportion of 20% on the vertical direction again by using the same method after finishing, setting 4 transverse lines from left to right, 40%,60% and 80%, planning 25 square areas, then reaching 2 nd area, …, setting 225 squares after finishing planning 9 areas, and starting one receiver in each square (each small square represents 1 position). After planning is completed, the control host 170 enters a standby mode, can enter a working mode at any time, performs laser cutting and stores the laser cutting into the memory 06, and the control host 170 transmits data of the memory 06 to the intelligent cutting correction system laser cutting feedback module.

Mode two: regional planning in intelligent cutting correction system

As shown in fig. 5, assuming a plan mode in the setting of the staff, a square is planned to circle 9 areas, and a three-division method is used to plan 9 areas, that is, 9 squares, and a multi-area planning is performed to plan again in the first area planned at a time, 9 small squares are planned, and 81 squares are planned in total.

Specific: control host 170 obtains data from memory 04, determines that the current device preparation mode is not abnormal, and the device can operate normally. Control host 170 acquires the settings of the worker, saves the settings to memory 07, and control host 170 reads the data on the area programming mode (2 times of programming) of memory 07 (medium programming mode). Setting a square, using a three-division method to circle 9 receiver areas, setting 3 rectangles with a 33% vertical proportion from top to bottom, setting two transverse lines at 33% and 66% from left to right after completion, planning 9 square areas, setting 3 rectangles with a 33% vertical proportion from left to right again using the same method after completion, setting two transverse lines at 33% and 66% from left to right, planning 9 square areas, then to 2 nd area, …, setting 81 squares after planning 9 areas, and starting one receiver in each square (each small square represents 1 position). After planning is completed, the control host 170 enters a standby mode, can enter a working mode at any time, performs laser cutting and stores the laser cutting into the memory 08, and the control host 170 transmits data of the memory 08 to the intelligent cutting correction system laser cutting feedback module.

Mode three, intelligent cutting correction system few area planning

As shown in fig. 5, assuming that the worker sets the less planning mode, 9 areas are circled using a three-division rule to draw one square, and planned into 9 areas, that is, 9 squares.

Specific: control host 170 obtains data from memory 04, determines that the current device preparation mode is not abnormal, and the device can operate normally. Control host 170 obtains the settings of the staff member, saves the settings to memory 09, and control host 170 reads the data of memory 09 (less planning mode) to turn on the less area planning mode (perform 2 planning). Setting a square to circle 9 receiver areas, setting 3 rectangles with the proportion of 33% on the vertical direction from top to bottom, setting two transverse lines at 33% and 66% from left to right after finishing, and dividing 9 square areas by using a three-division rule. After planning is completed, the control host 170 enters a standby mode, can enter a working mode at any time, performs laser cutting and stores the laser cutting into the memory 10, and the control host 170 transmits data of the memory 10 to the intelligent cutting correction system laser cutting feedback module. Wherein the memories 06, 08, 10 are also summed and saved to the memory 11.

3, correcting the laser cutting feedback process of the laser cutting system 100. This process may be performed by an intelligent cutting correction system laser cutting feedback module in control host 170.

The process comprises the following steps: control host 170 enters an operational mode and a worker may place the inductor in designated position number 5 or only enter a position. Assuming the current task is to cut the pins of the inductor, the pin positions are set at A1 and A2 (5 areas P2-2 and 5 areas P2-4, respectively) as shown in FIG. 6. After the control host 170 starts the scanner to acquire the pin position, starts the laser 110 to cut the pin position by laser, if the receivers at the two positions are impacted after cutting, the current position is fed back, and if the positions are the same, the cutting is completed. If the cutting is performed to other areas, feedback can be performed on the positions of the other areas, and abnormal cutting is reminded. And if all the positions have no feedback, starting the camera sensor to perform one-time laser cutting to confirm the cutting position. Control host 170 obtains a value of memory 11 greater than 1, and control host 170 laser cuts the feedback module. Creating a thread, creating the following three modes:

Mode one: abnormal laser cutting feedback mode of intelligent equipment

The worker carries out laser cutting after putting the inductance coil at the appointed position, and the intelligent system starts the scanner to confirm the cutting position, and cuts after starting the laser, does not receive feedback of the current inductance coil pin position, but receives feedback of a position C (namely a No. 9 area P5-1) in fig. 6 (the pin position can be matched with the feedback position), and the cutting abnormal mode is set.

Specifically, as shown in fig. 6, the control host 170 reads the data of the memory 11, and sets a multi-region planning mode to perform precise cutting. Control host 170 controls laser cutting system 100 to exit the ready mode into the operational mode. The worker places the inductor coil in area No. 5 in the middle of the table, and control host 170 turns on the intelligent scanner to detect that the inductor coil has been placed in the designated location of the table and saved it to memory 12. (assuming the inductor pins are laser cut) control host 170 reads the data from memory 12 and initiates a smart scanner scan to determine the location of the inductor pins to save to memory 13 (preset: 5 region P2-2 and 5 region P2-4). Control host 170 reads the data of memory 13, confirms the pin position of the current inductance coil, and control host 170 starts the intelligent laser to perform laser cutting on the designated position. The feedback received by control host 170 for zone 9 during laser cutting is saved to memory 14 (zone 9P 5-1). Control host 170 reads data of memory 14 to judge that the accuracy of current laser cutting system 100 is abnormal, and sets an intelligent device laser cutting abnormal feedback mode to store in memory 15. Control host 170 transmits the data of memory 15 to the smart device cutting anomaly correction module.

Mode two: laser cutting normal feedback mode of intelligent equipment

Starting the laser to cut, receiving feedback after cutting is completed, matching the pin position with the cutting feedback position, judging that the current cutting position is normal, and feeding back to the controller to remind that cutting is completed.

Specifically, referring to fig. 6, the control host 170 reads the data of the memory 11, and sets a multi-region planning mode to perform precise cutting. Control host 170 controls laser cutting system 100 to exit the ready mode into the operational mode. The worker places the inductor coil in area No. 5 in the middle of the table, and control host 170 turns on the intelligent scanner to detect that the inductor coil has been placed in the designated location of the table and saved it to memory 16. (assuming the inductor pins are laser cut) control host 170 reads the data from memory 16 and initiates a smart scanner scan to determine the location of the inductor pins to save to memory 17 (preset: 5 region P2-2 and 5 region P2-4). Control host 170 reads the data from memory 17, confirms the pin position of the current inductance coil, and control host 170 starts the intelligent laser to perform laser cutting on the designated position. The feedback received by control host 170 for zone 5 during laser cutting is saved to memory 18 (zone 5P 2-2, zone 5P 2-4). The control host 170 reads the data of the memory 18 to judge that the accuracy of the current laser cutting system 100 is not abnormal, the pin cutting is completed, and the normal feedback mode of the intelligent device laser cutting is set and stored in the memory 19. Control host 170 transmits data of memory 19 to the controller to indicate that the cut is complete.

Mode three, intelligent device laser cutting feedback-free abnormal mode

After the cutting is completed, the control host 170 starts the camera sensor to detect, starts the laser to cut again, and judges whether the cutting is out of the feedback range or the cutting is on the inductance coil to cause no feedback.

Specifically, referring to fig. 6, the control host 170 reads the data of the memory 11, and sets a multi-region planning mode to perform precise cutting. Control host 170 controls laser cutting system 100 to exit the ready mode into the operational mode. The worker places the inductor coil in area No. 5 in the middle of the workbench, and control host 170 turns on the intelligent scanner to detect that the inductor coil has been placed in the designated position of the workbench and stores the inductor coil in memory 20. (assuming laser cutting of the inductor pins) control host 170 reads the data from memory 20 and initiates a smart scanner scan to determine the location of the inductor pins to save to memory 21 (preset: 5 region P2-2 and 5 region P2-4). Control host 170 reads the data of memory 21, confirms the pin position of the current inductance coil, and control host 170 starts the intelligent laser to perform laser cutting on the designated position. The control host 170 receives no feedback after the completion of the cutting in the laser cutting. The control host 170 starts the camera sensor to detect, the control host 170 starts the intelligent laser again to cut the laser, the intelligent monitoring sensor detects that the laser cutting is outside the setting range, and the intelligent device laser cutting has no feedback abnormal mode to store data into the memory 22. Control host 170 transmits data of memory 22 to control host 170 device cut precision exception correction module. Finally, the memory 15, the memory 19, and the memory 22 are stored in the memory 23.

4, corrective action for the laser cutting system 100. This process may be performed by an intelligent precision correction system device cut precision exception correction module in control host 170.

The process comprises the following steps: the control host 170 judges that an abnormal start correction mode occurs at the laser cutting position, and obtains the position of the cutting pin and the current position of the cutting abnormality. The control host 170 controls the laser to emit an inefficient cut to acquire the current position, starts the movement drive to move to the correct position according to the feedback area, performs an inefficient cut to confirm that no deviation occurs when the first-stage movement is completed, and corrects the two stages to return to the normal position. Laser cutting is again performed back to the correct position if the pin cutting is complete, the following receiver is impacted after the cutting is complete and the system receives feedback indicating that the correction is complete. If feedback is not received, the intelligent camera sensor is started to assist, the fact that the cutting position appears on the induction coil body and is not cut at the correct position is confirmed, the intelligent camera sensor detection position is matched with the planned image, and the current laser cutting position is confirmed to be corrected. Control host 170 obtains a value of memory 23 greater than 1, control host 170 initiates a device cut precision exception correction module, creates a thread, creates the following two modes:

Mode one: abnormal correction module of intelligent accurate correction system position

Control host 170 obtains the location of the cutting pin and the location of the current cutting anomaly. The start of the movement drive to the correct position according to the feedback region confirms whether or not there is a deviation, and the correction is performed in two stages to return to the normal position.

Referring to fig. 6, control host 170 acquires data of memory 23 and determines that an abnormality occurs in the current laser cutting position of the smart device. Control host 170 obtains the current location to be cut and saves it to memory 24, and control host 170 reads the location of memory 24 as two locations of 5 region P2-2 and 5 region P2-4. Control host 170 obtains the feedback position received by the current cut and saves it to memory 25, and control host 170 reads memory 25 to 9 area P5-1. Control host 170 confirms the position, starts to correct, control host 170 obtains laser control authority, control host 170 starts to move the driving control laser to move to 8 region P5-2 position (namely D in FIG. 6) at 4 positions (16 mm) left in X axis, control host 170 starts the laser to perform one-time inefficient cutting at the current position, and the correction is not abnormal when the current position receiver is set to feedback, so that the second-stage correction is performed. Control host 170 initiates movement of the drive control laser in the Y-axis to move 2 positions (8 mm) back to 5 region P2-2 to save data to memory 25. Control host 170 initiates laser cutting of the corrected location, after cutting is completed control host 170 receives feedback from region P5-2, control host 170 confirms that correction was successful, and continues laser cutting to save data to memory 26.

Mode two: feedback-free abnormal correction module of intelligent accurate correction system

If feedback is not received, the intelligent camera sensor is started to assist, the fact that the cutting position appears on the induction coil body and the cutting position is not at the correct position is confirmed, the intelligent camera sensor detection position is matched with the planned image, and the current laser cutting position is confirmed to start the mobile drive to correct.

Referring to fig. 6, control host 170 obtains data of memory 23, and determines that the current laser cutting position of the smart device is abnormal and has no feedback. The control host 170 acquires the record shot by the image sensor, the control host 170 reads the record shot by the image sensor to judge that the position of the intelligent laser cut is on the induction coil body, and the control host 170 saves the position to the memory 26. Control host 170 matches the cut position of memory 26 with the planning image of memory 06, and determines that the current cut position is in region 5P 4-2. Control host 170 obtains pin position 5 and saves to memory 27 region P2-2. The control host 170 reads the data from the memory 27 to initiate the movement to drive the smart laser to move 2 positions (8 mm) in the Y-axis direction. After completion, control host 170 activates the laser to perform laser cutting. After cutting the pins, the area 2-2 of the area 5 will have feedback to confirm that the current position is stored in the memory 28, the control host 170 reads the data of the memory 28 to match the positions of the pins, the matching completion control host 170 confirms that the correction is successful, the intelligent device performs laser cutting operation, and the data is stored in the memory 29.

Wherein the memory 26 is summed with the memory 29 and the calculated value is saved to the memory 30.

5, corrective presentation of the laser cutting system 100. This process may be performed by a presentation module in control host 170.

Specifically: control host 170 obtains a value of memory 30 greater than 1 and initiates the presentation module. Control host 170 retrieves data from memory 26 and presents the retrieved data on a display screen. Control host 170 retrieves data from memory 29 and presents the retrieved data on a display screen.

Based on the above embodiments, the present invention further provides a computer readable storage medium, where a computer program is stored, and when the computer program is executed by a processor, the steps of the method for automatically correcting accuracy of the intelligent induction coil laser cutting system are executed.

In particular, the storage medium may be a general-purpose storage medium, such as a removable disk, a hard disk, or the like, and the computer program on the storage medium, when executed, is capable of executing the method in the above embodiment, thereby solving the problems existing in the prior art.

In the embodiments provided in the present invention, it should be understood that the disclosed apparatus and method may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.

Further, the units described as separate units may or may not be physically separate, and units displayed as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

Furthermore, functional modules in various embodiments of the present invention may be integrated together to form a single portion, or each module may exist alone, or two or more modules may be integrated to form a single portion.

In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.

The above description is only an example of the present invention and is not intended to limit the scope of the present invention, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a method of intelligent inductance coil laser cutting system automatic correction precision which characterized in that is applied to laser cutting system, laser cutting system includes: the laser comprises a laser, a cantilever for installing the laser, a beam emitter arranged on the cantilever, a workbench, N1 laser sensors arranged on a processing area of the workbench and a beam sensor arranged on a non-processing area of the workbench, wherein the beam irradiation direction of the beam emitter points to the beam sensor; wherein,,

the method for automatically correcting the precision of the intelligent inductance coil laser cutting system comprises the following steps:

judging whether the beam sensor receives the emitted light beam of the light beam emitter or not;

when the beam sensor does not receive the emitted beam, starting a first correction process; and

starting a second correction process before the laser is used for carrying out laser cutting on a workpiece to be processed, which is placed in the processing area;

wherein the first corrective procedure comprises the steps of:

acquiring the position of a beam falling point of the emitted beam irradiated to the workbench; and

driving the cantilever according to the position of the beam sensor on the workbench and the beam landing position so that the beam landing position coincides with the position of the beam sensor on the workbench; wherein when the beam landing position coincides with the position of the beam sensor on the stage, the irradiation range of the laser completely includes the processing region;

The second corrective procedure includes the steps of:

controlling the laser to emit a laser beam to a preset cutting position on the processing area, wherein the power of the laser beam is lower than a preset power;

receiving the laser beams by using the N1 laser sensors;

when the laser sensors in the N1 laser sensors receive the laser beams, determining the laser drop point position of the laser beams in the processing area according to the positions of the laser sensors in the N1 laser sensors which receive the laser beams; and

correcting the irradiation direction of the laser according to the laser drop point position and the preset cutting position so that the laser beam irradiates the preset cutting position.

2. The method for automatically correcting accuracy of a smart induction coil laser cutting system of claim 1, wherein the second correction process further comprises the steps of:

when none of the N1 laser sensors receives the laser beams, shooting an image comprising the processing area by using an image acquisition device; and

and acquiring the laser position of the laser beam in the processing area according to the image, and correcting the irradiation direction of the laser according to the laser position and the preset cutting position so as to irradiate the laser beam to the preset cutting position.

3. The method for automatically correcting accuracy of a smart induction coil laser cutting system according to claim 1, further comprising:

carrying out laser cutting on the workpiece to be processed by using the laser; and

starting a third correction process in the process of carrying out laser cutting on the workpiece to be processed by using the laser;

wherein the third corrective procedure comprises the steps of:

controlling the laser to emit a reference laser beam to a preset reference position on the processing area within a preset time window, wherein the preset reference position is not blocked by the workpiece to be processed;

receiving the reference laser beams by using the N1 laser sensors, and determining a laser drop point reference position of the reference laser beams in the processing area according to the positions of the laser sensors which receive the reference laser beams in the N1 laser sensors;

correcting the irradiation direction of the laser when the workpiece to be processed is subjected to laser cutting according to the laser falling point reference position and the preset reference position.

4. The method of claim 3, wherein the predetermined time window is a plurality of mutually spaced sub-time periods of a time period during which the laser cuts the workpiece to be processed, and a time length of each sub-time period is less than a predetermined time length.

5. The method for automatically correcting accuracy of intelligent induction coil laser cutting system according to claim 3, wherein the laser comprises a laser generator and a reflector, the reflector being disposed on a laser emission path of the laser generator; wherein,,

controlling the laser to emit a reference laser beam to a preset reference position on the processing area within a preset time window, including:

and controlling the emission direction of the reference laser beam emitted by the laser generator by controlling the reflecting mirror within the preset time window so as to irradiate the reference laser beam to a preset reference position on the processing area.

6. The method for automatically correcting accuracy of intelligent induction coil laser cutting system according to claim 3, wherein the laser comprises a laser generator, a beam splitter, a reflecting mirror and a controllable light shielding sheet, the beam splitter is arranged on a laser emission path of the laser generator, the reflecting mirror is arranged on a first beam splitting path of the beam splitter, the controllable light shielding sheet is arranged on a second beam splitting path of the beam splitter,

the laser beam generated by the laser generator passes through the spectroscope to generate two laser beams, the two laser beams are respectively emitted along the first beam splitting path and the second beam splitting path, and the preset irradiation direction of the laser emitted along the second beam splitting path points to the preset reference position;

Wherein controlling the laser to emit a reference laser beam to a preset reference position on the processing region within a preset time window comprises:

and in the preset time window, starting the controllable shading sheet so as to enable the laser emitted along the second sub-optical path to be used as the reference laser beam to irradiate to a preset reference position on the processing area.

7. The method for automatically correcting accuracy of an intelligent induction coil laser cutting system according to claim 1, wherein the N1 laser sensors are distributed in a rectangular array.

8. The method for automatically correcting accuracy of intelligent induction coil laser cutting system according to claim 7, wherein the processing area is square, the processing area comprises 9 sub-squares divided according to a three-division method, and each sub-square comprises 5 x 5 array-distributed laser sensors.

9. The method of claim 1, wherein the beam emitters disposed on the cantilever comprise N2 beam emitters and the beam sensors disposed on the non-processing region comprise N2 beam sensors; wherein an ith light beam emitter of the N2 light beam emitters corresponds to an ith light beam sensor of the N2 light beam sensors, and a light beam irradiation direction of the ith light beam emitter is directed to the ith light beam sensor.

10. An intelligent induction coil laser cutting system, characterized in that the laser cutting system comprises: the laser device comprises a laser, a cantilever for installing the laser device, a beam emitter arranged on the cantilever, a control host, a workbench, N1 laser sensors arranged on a processing area of the workbench and a beam sensor arranged on a non-processing area of the workbench, wherein the beam irradiation direction of the beam emitter points to the beam sensor, and the control host is connected with the laser device, the cantilever, the beam emitter, the beam sensor and the laser sensor; wherein,,

the control host is used for judging whether the light beam sensor receives the light beam emitted by the light beam emitter or not;

the control host is further used for starting a first correction process when the beam sensor does not receive the emitted beam; and

the control host is further used for starting a second correction process before the laser is used for carrying out laser cutting on the workpiece to be processed placed in the processing area;

wherein the first corrective procedure comprises the steps of:

the second corrective procedure includes the steps of:

receiving the laser beams by using the N1 laser sensors;