JPH058067A - Laser beam processing head - Google Patents
Laser beam processing headInfo
- Publication number
- JPH058067A JPH058067A JP3159295A JP15929591A JPH058067A JP H058067 A JPH058067 A JP H058067A JP 3159295 A JP3159295 A JP 3159295A JP 15929591 A JP15929591 A JP 15929591A JP H058067 A JPH058067 A JP H058067A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- side nozzle
- processing head
- processing
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、サイドガス用のサイ
ドノズルを最適な設定位置に設定できる機能を持つ溶接
用のレーザ加工ヘッドに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing head for welding having a function of setting a side nozzle for side gas at an optimum setting position.
【０００２】[0002]
【従来の技術】実開昭６３−２５２８４号公報にはレー
ザ加工ヘッドにカメラを取付けて加工材の加工開始点へ
正確にトーチ先端を位置させるものが開示されている。
これに対し本発明はサイドガスを加工点へ正しく噴射す
るようにサイドノズルをレーザ加工ヘッドに取り付ける
位置を調節することに関する。図５は、例えば特開昭５
９−２１８２８９号公報に示された、従来のレーザ加工
ヘッド用サイドノズルの取付け位置調節装置を示す概略
構成図である。図において、１は加工ヘッド、２はレー
ザービーム、３は加工材、４は加工材３の加工面に対し
約１０〜３０°の角度の傾斜を有する細径のサイドノズ
ル、５はサイドノズル４のノズル開口部とは反対側に取
付けられ、加工材３の加工面上の加工点をのぞき見るこ
とができる透明あるいは半透明の小窓、６はサイドノズ
ル４を上下に移動する時に、その位置の表示に参考とな
るスケール、７はサイドノズル４を上下に移動する際
に、基準となる軌道台、８は軌道台７に沿って移動する
ベアリングケース、９はスクリュー軸受、１０はスクリ
ュー、１１はサイドノズル４の上下移動調整用ハンド
ル、１２はサイドノズル４の上下移動錠止ピン、１３は
サイドノズル４の左右移動調整用ハンドルである。次
に、動作について説明する。まず、レーザービーム２の
焦点位置を知るために、その焦点付近に加工材３の加工
面がある時だけ青白い発光を示す様に、レーザ出力を約
数１０〜数１００Ｗに設定する。加工面上にレーザービ
ーム２の焦点が合った青白いプラズマ発光中に、サイド
ノズル４の小窓５から青白いプラズマ発光をのぞき見な
がらサイドノズル４の上下移動調整用ハンドル１１や左
右移動調整用ハンドル１３を回すことにより、加工面に
対し直角や平行にサイドノズル４を移動させ、サイドノ
ズル４からのサイドガスが加工点に正しく噴射するよう
に設定位置を決定する。2. Description of the Related Art Japanese Utility Model Laid-Open No. 63-25284 discloses a laser processing head in which a camera is attached to accurately position a tip of a torch at a processing start point of a processing material.
On the other hand, the present invention relates to adjusting the position where the side nozzle is attached to the laser processing head so that the side gas is properly injected to the processing point. FIG. 5 shows, for example, JP-A-5
It is a schematic block diagram which shows the mounting position adjusting device of the conventional side nozzle for laser processing heads shown by 9-218289. In the figure, 1 is a processing head, 2 is a laser beam, 3 is a processed material, 4 is a small diameter side nozzle having an inclination of about 10 to 30 ° with respect to the processed surface of the processed material 3, and 5 is a side nozzle 4. Of the transparent or translucent small window attached to the side opposite to the nozzle opening of the work piece 3 and capable of seeing the processing point on the processing surface of the processing material 3, 6 is the position when the side nozzle 4 is moved up and down Is a reference scale, 7 is a reference way for moving the side nozzle 4 up and down, 8 is a bearing case that moves along the way 7, 9 is a screw bearing, 10 is a screw, 11 Is a vertical movement adjustment handle of the side nozzle 4, 12 is a vertical movement locking pin of the side nozzle 4, and 13 is a horizontal movement adjustment handle of the side nozzle 4. Next, the operation will be described. First, in order to know the focus position of the laser beam 2, the laser output is set to about several tens to several hundreds of watts so as to emit a pale light only when the processed surface of the processed material 3 is near the focus. While the laser beam 2 is focused on the processing surface, the vertical movement adjustment handle 11 and the horizontal movement adjustment handle 13 of the side nozzle 4 are observed while observing the pale white plasma emission from the small window 5 of the side nozzle 4. By rotating, the side nozzle 4 is moved at a right angle or parallel to the processing surface, and the set position is determined so that the side gas from the side nozzle 4 is correctly injected to the processing point.
【０００３】[0003]
【発明が解決しようとする課題】従来の装置は以上のよ
うに構成されているので、サイドノズル４の位置調整に
あたっては、作業者が直接小窓５をのぞかねばならず、
またレーザ加工ヘッド１の設計に当っては小窓５周辺に
作業者の身体と干渉するものがない様にスペースを取っ
ておく必要があるなどの問題点があった。この発明はか
かる無駄なスペースをなくしてレーザ加工ヘッドをコン
パクトにすることを目的とする。Since the conventional apparatus is constructed as described above, the operator must look directly into the small window 5 when adjusting the position of the side nozzle 4.
Further, in designing the laser processing head 1, there is a problem that it is necessary to keep a space around the small window 5 so that there is nothing that interferes with the body of the operator. An object of the present invention is to make the laser processing head compact by eliminating such a wasteful space.
【０００４】[0004]
【課題を解決するための手段】この発明は加工面に対し
所定の角度の傾斜を有するサイドノズルにこのサイドノ
ズルのノズル開口部とは反対側に前記加工面上の加工点
を撮影できるカメラを取付け、これに接続されたディス
プレイ装置を通して加工点を明瞭に観察できる様にし、
これに基づき前記サイドノズルを前記加工面に対し直角
及び平行に移動調節する。According to the present invention, there is provided a side nozzle having an inclination of a predetermined angle with respect to a machining surface, and a camera capable of photographing a machining point on the machining surface on a side opposite to a nozzle opening of the side nozzle. Attach it so that you can clearly observe the machining point through the display device connected to it.
Based on this, the side nozzle is moved and adjusted at right angles and parallel to the processed surface.
【０００５】[0005]
【作用】これにより正確にかつ迅速にサイドノズルを位
置合せすることができる。勿論省スペースのレーザ加工
ヘッドが得られる。As a result, the side nozzles can be aligned accurately and quickly. Of course, a space-saving laser processing head can be obtained.
【０００６】[0006]
【実施例】以下この発明の一実施例を図について説明す
る。図１において１，２，３，６，７，８，９，１０，
１１，１２，１３は従来と同一又は同一機能品である。
４は加工材３の加工面に対し１０〜５０°の角度の傾斜
を有するサイドノズル、１４はサイドノズル４のノズル
開口部とは反対側に取付けられ加工材３の加工面上の加
工点を撮影できるカメラ、１５はカメラ１４により撮影
した映像を写し出すディスプレイ装置、１６はディスプ
レイ装置１５に写し出された溶接突合せ部の継目、１７
はディスプレイ装置１５に写し出されたレーザ光照射部
である。次に動作について説明する。まずレーザービー
ムの焦点位置を加工材３の加工面上に来るように加工ヘ
ッド１の高さを調整する。そしてレーザ出力を数１０〜
数１００Ｗに設定し加工面上に青白いプラズマを発光さ
せ、これをディスプレイ装置１５で観察できるようにサ
イドノズル４の上下移動調整用ハンドル１１や左右移動
調整用ハンドル１３を回すことによりサイドノズル４の
設定位置を決定する。このようにしてサイドノズル４の
位置合せ調整が完了するのでこれにより最適なレーザ加
工が可能になる。なお上記実施例ではサイドノズルの位
置合せについて示したが、図２に示すように溶加ワイヤ
１８を挿入する場合の溶加ワイヤ１８の左右挿入位置調
整においても同様の効果が得られる。この場合は先ずサ
イドノズル４の位置調整を行った後、溶加ワイヤ１８の
挿入位置調整を行う手順とする。なお、１９はチップ、
２０はワイヤ送給装置、２１はディスプレイ装置１５に
写し出された溶加ワイヤの先端である。そして７′，
８′，９′，１０′，１１′，１２′，１３′はそれぞ
れ軌道台７、ベアリングケース８、スクリュー軸受９、
スクリュー１０、上下移動調整用ハンドル１１、上下移
動錠止ピン１２、左右移動調整用ハンドル１３に相当す
る。また、上記実施例ではサイドノズル４や溶加ワイヤ
１８の上下移動調整および左右移動調整はハンドル操作
としているが、図３または図４に示すように、駆動モー
タ２２，２２′，２３，２３′を用いて遠隔操作として
もよい。この場合は、加工中での位置調整も可能とな
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1, 2, 3, 6, 7, 8, 9, 10,
Reference numerals 11, 12, and 13 are the same as or have the same function as the conventional one.
Reference numeral 4 denotes a side nozzle having an inclination of 10 to 50 ° with respect to the processing surface of the processing material 3, and 14 denotes a processing point on the processing surface of the processing material 3 which is attached to the side opposite to the nozzle opening of the side nozzle 4. A camera capable of photographing, 15 is a display device for projecting the image photographed by the camera 14, 16 is a seam of the welding butt portion projected on the display device 15, 17
Is a laser light irradiation unit projected on the display device 15. Next, the operation will be described. First, the height of the processing head 1 is adjusted so that the focus position of the laser beam is on the processing surface of the processing material 3. And the laser output is several 10
By setting a few hundred W and causing a pale white plasma to be emitted on the processed surface, and turning the side nozzle 4 up and down adjustment handle 11 or the left and right movement adjustment handle 13 so that the plasma can be observed on the display device 15, the side nozzle 4 is rotated. Determine the setting position. In this way, the alignment adjustment of the side nozzles 4 is completed, which enables optimum laser processing. Although the side nozzles are aligned in the above embodiment, the same effect can be obtained by adjusting the horizontal insertion position of the filler wire 18 when the filler wire 18 is inserted as shown in FIG. In this case, the position of the side nozzle 4 is first adjusted, and then the insertion position of the filler wire 18 is adjusted. In addition, 19 is a chip,
Reference numeral 20 is a wire feeding device, and 21 is a tip of the filler wire projected on the display device 15. And 7 ',
8 ', 9', 10 ', 11', 12 ', and 13' are respectively the rail 7, the bearing case 8, the screw bearing 9,
It corresponds to the screw 10, the vertical movement adjustment handle 11, the vertical movement locking pin 12, and the horizontal movement adjustment handle 13. Further, in the above-described embodiment, the vertical movement adjustment and the horizontal movement adjustment of the side nozzle 4 and the filler wire 18 are made by the handle operation, but as shown in FIG. 3 or 4, the drive motors 22, 22 ', 23, 23' are shown. May be used for remote control. In this case, it is possible to adjust the position during processing.
【０００７】[0007]
【発明の効果】以上のようにこの発明によれば、サイド
ノズルのノズル開口部とは反対側にカメラを取付け、こ
れを介してサイドノズルを加工面に対し直角及び平行に
移動する機構を備えたので、加工材の加工面上の加工点
をディスプレイ装置を通して明瞭に観察できることか
ら、作業者がサイドノズルを直接のぞく必要もなく、ま
た加工機の設計に当っても作業者との干渉がなくなるた
め、省スペース化できる効果がある。As described above, according to the present invention, the camera is attached to the side nozzle on the side opposite to the nozzle opening, and the side nozzle is provided with a mechanism for moving the side nozzle at right angles and parallel to the machined surface. Since the processing point on the processing surface of the processed material can be clearly observed through the display device, it is not necessary for the operator to directly look into the side nozzle, and there is no interference with the operator when designing the processing machine. Therefore, there is an effect that space can be saved.
【図１】この発明の一実施例によるレーザ加工ヘッドを
示す概略構成図。FIG. 1 is a schematic configuration diagram showing a laser processing head according to an embodiment of the present invention.
【図２】この発明の他の実施例によるレーザ加工ヘッド
を示す概略構成図。FIG. 2 is a schematic configuration diagram showing a laser processing head according to another embodiment of the present invention.
【図３】この発明の他の実施例によるレーザ加工ヘッド
を示す概略構成図。FIG. 3 is a schematic configuration diagram showing a laser processing head according to another embodiment of the present invention.
【図４】この発明の他の実施例によるレーザ加工ヘッド
を示す概略構成図。FIG. 4 is a schematic configuration diagram showing a laser processing head according to another embodiment of the present invention.
【図５】従来のレーザ加工ヘッドを示す概略構成図。FIG. 5 is a schematic configuration diagram showing a conventional laser processing head.
１ 加工ヘッド ２ レーザービーム ３ 加工材 ４ サイドノズル １１ 上下移動調整用ハンドル １３ 左右移動調整用ハンドル １４ カメラ １５ ディスプレイ装置 1 Processing Head 2 Laser Beam 3 Processing Material 4 Side Nozzle 11 Handle for Vertical Movement Adjustment 13 Handle for Horizontal Movement Adjustment 14 Camera 15 Display Device
Claims (1)
対し所定の角度の傾斜を有するサイドガス用のサイドノ
ズルを具備し、前記サイドノズルを前記加工面に対し直
角及び平行に移動するように前記レーザ加工ヘッドに対
してサイドノズルを調節する機構を備え、該サイドノズ
ルにそのノズル開口部とは反対側に前記加工面上の加工
点を観察することができるカメラを取付け、これを介し
て前記サイドノズルを調節する機構を操作することを特
徴とするレーザ加工ヘッド。Claim: What is claimed is: 1. A laser processing head is provided with a side nozzle for side gas which is carried by a laser processing head and has an inclination at a predetermined angle with respect to a processing surface. A camera that is provided with a mechanism for adjusting a side nozzle with respect to the laser processing head so as to move in parallel, and is capable of observing a processing point on the processing surface on a side opposite to the nozzle opening of the side nozzle. A laser processing head which is mounted and operates a mechanism for adjusting the side nozzles through the mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3159295A JP2624033B2 (en) | 1991-07-01 | 1991-07-01 | Laser processing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3159295A JP2624033B2 (en) | 1991-07-01 | 1991-07-01 | Laser processing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH058067A true JPH058067A (en) | 1993-01-19 |
| JP2624033B2 JP2624033B2 (en) | 1997-06-25 |
Family
ID=15690675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3159295A Expired - Lifetime JP2624033B2 (en) | 1991-07-01 | 1991-07-01 | Laser processing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2624033B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007268570A (en) * | 2006-03-31 | 2007-10-18 | Tokyu Car Corp | Laser beam welding equipment |
| JP2010023080A (en) * | 2008-07-18 | 2010-02-04 | Nippon Sharyo Seizo Kaisha Ltd | Laser beam machine |
| JP2010284698A (en) * | 2009-06-12 | 2010-12-24 | Ihi Corp | Torch head for laser welding and hybrid welding apparatus |
| JP2012143785A (en) * | 2011-01-12 | 2012-08-02 | Keyence Corp | Laser processing system and laser processing apparatus |
| CN103056522A (en) * | 2012-11-29 | 2013-04-24 | 中国航空工业集团公司北京航空制造工程研究所 | Nozzle capable of preventing reflectional burning during laser processing |
| JP5798689B2 (en) * | 2013-02-25 | 2015-10-21 | 株式会社エイチアンドエフ | Conveying apparatus and work conveying method using the same |
| CN105149777A (en) * | 2015-09-18 | 2015-12-16 | 宁波方太厨具有限公司 | Gas blowing protective device used during stainless steel sheet pulse laser welding and welding process |
| CN110856885A (en) * | 2018-08-17 | 2020-03-03 | 中国商用飞机有限责任公司 | Laser-arc hybrid welding gas protection device and method |
-
1991
- 1991-07-01 JP JP3159295A patent/JP2624033B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007268570A (en) * | 2006-03-31 | 2007-10-18 | Tokyu Car Corp | Laser beam welding equipment |
| JP2010023080A (en) * | 2008-07-18 | 2010-02-04 | Nippon Sharyo Seizo Kaisha Ltd | Laser beam machine |
| JP2010284698A (en) * | 2009-06-12 | 2010-12-24 | Ihi Corp | Torch head for laser welding and hybrid welding apparatus |
| JP2012143785A (en) * | 2011-01-12 | 2012-08-02 | Keyence Corp | Laser processing system and laser processing apparatus |
| CN103056522A (en) * | 2012-11-29 | 2013-04-24 | 中国航空工业集团公司北京航空制造工程研究所 | Nozzle capable of preventing reflectional burning during laser processing |
| JP5798689B2 (en) * | 2013-02-25 | 2015-10-21 | 株式会社エイチアンドエフ | Conveying apparatus and work conveying method using the same |
| CN105149777A (en) * | 2015-09-18 | 2015-12-16 | 宁波方太厨具有限公司 | Gas blowing protective device used during stainless steel sheet pulse laser welding and welding process |
| CN110856885A (en) * | 2018-08-17 | 2020-03-03 | 中国商用飞机有限责任公司 | Laser-arc hybrid welding gas protection device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2624033B2 (en) | 1997-06-25 |
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