CN106392309A - Imaging system and method of square scanning head of dual-light-path dual-imaging visual galvanometer - Google Patents
Imaging system and method of square scanning head of dual-light-path dual-imaging visual galvanometer Download PDFInfo
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- CN106392309A CN106392309A CN201510454115.2A CN201510454115A CN106392309A CN 106392309 A CN106392309 A CN 106392309A CN 201510454115 A CN201510454115 A CN 201510454115A CN 106392309 A CN106392309 A CN 106392309A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
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Priority Applications (1)
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CN201510454115.2A CN106392309B (en) | 2015-07-29 | 2015-07-29 | The imaging system and imaging method of the double imaging vision vibration mirror scanning square toes of double light path |
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CN201510454115.2A CN106392309B (en) | 2015-07-29 | 2015-07-29 | The imaging system and imaging method of the double imaging vision vibration mirror scanning square toes of double light path |
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CN106392309A true CN106392309A (en) | 2017-02-15 |
CN106392309B CN106392309B (en) | 2018-07-06 |
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CN201510454115.2A Active CN106392309B (en) | 2015-07-29 | 2015-07-29 | The imaging system and imaging method of the double imaging vision vibration mirror scanning square toes of double light path |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107138860A (en) * | 2017-05-31 | 2017-09-08 | 武汉森托尼激光有限公司 | A kind of interior engraving system quick and precisely positioned |
CN108406089A (en) * | 2018-01-26 | 2018-08-17 | 大族激光科技产业集团股份有限公司 | A kind of double light path laser marking equipment and its marking method |
CN109848138A (en) * | 2018-12-10 | 2019-06-07 | 北京电子工程总体研究所 | A kind of aiming point Calibration Method of power grid foreign matter laser cleaning plant |
CN112108776A (en) * | 2020-09-17 | 2020-12-22 | 广东吉洋视觉技术有限公司 | High-precision laser marking method for LED lamp bead defective product marking |
CN113260479A (en) * | 2018-12-20 | 2021-08-13 | Etxe-Tar有限公司 | Method and system for processing an object with a light beam |
CN113520594A (en) * | 2021-05-31 | 2021-10-22 | 浙江大学 | Assembling method of double-light-path 3D imaging module |
CN113703250A (en) * | 2020-12-31 | 2021-11-26 | 苏州立创致恒电子科技有限公司 | Imaging system and imaging method based on scanning galvanometer |
CN116140832A (en) * | 2023-04-20 | 2023-05-23 | 深圳市岑科实业有限公司 | Method and system for automatically correcting precision of intelligent inductance coil laser cutting system |
Citations (7)
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JPH07260416A (en) * | 1994-03-25 | 1995-10-13 | Toshio Honda | Vibration-proof interferometer |
WO1996004532A1 (en) * | 1994-08-04 | 1996-02-15 | Bayerische Motoren Werke Aktiengesellschaft | Process for determining the vibration characteristics of a body |
CN201721134U (en) * | 2010-06-04 | 2011-01-26 | 深圳市大族激光科技股份有限公司 | Near wavelength coaxial positioning laser marking system |
CN102000917A (en) * | 2010-10-25 | 2011-04-06 | 苏州德龙激光有限公司 | LED wafer laser inner cutting and scribing device |
KR20110129791A (en) * | 2010-05-26 | 2011-12-02 | 한국기계연구원 | Laser processing system and laser processing method using the same |
CN103128450A (en) * | 2013-02-19 | 2013-06-05 | 深圳市海目星激光科技有限公司 | Ultraviolet laser processing device |
JP2014210276A (en) * | 2013-04-17 | 2014-11-13 | 三菱マテリアル株式会社 | Laser processing method and processing device for rotating body |
-
2015
- 2015-07-29 CN CN201510454115.2A patent/CN106392309B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07260416A (en) * | 1994-03-25 | 1995-10-13 | Toshio Honda | Vibration-proof interferometer |
WO1996004532A1 (en) * | 1994-08-04 | 1996-02-15 | Bayerische Motoren Werke Aktiengesellschaft | Process for determining the vibration characteristics of a body |
KR20110129791A (en) * | 2010-05-26 | 2011-12-02 | 한국기계연구원 | Laser processing system and laser processing method using the same |
CN201721134U (en) * | 2010-06-04 | 2011-01-26 | 深圳市大族激光科技股份有限公司 | Near wavelength coaxial positioning laser marking system |
CN102000917A (en) * | 2010-10-25 | 2011-04-06 | 苏州德龙激光有限公司 | LED wafer laser inner cutting and scribing device |
CN103128450A (en) * | 2013-02-19 | 2013-06-05 | 深圳市海目星激光科技有限公司 | Ultraviolet laser processing device |
JP2014210276A (en) * | 2013-04-17 | 2014-11-13 | 三菱マテリアル株式会社 | Laser processing method and processing device for rotating body |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107138860A (en) * | 2017-05-31 | 2017-09-08 | 武汉森托尼激光有限公司 | A kind of interior engraving system quick and precisely positioned |
CN108406089B (en) * | 2018-01-26 | 2020-07-14 | 大族激光科技产业集团股份有限公司 | Double-light-path laser marking equipment and marking method thereof |
CN108406089A (en) * | 2018-01-26 | 2018-08-17 | 大族激光科技产业集团股份有限公司 | A kind of double light path laser marking equipment and its marking method |
CN109848138B (en) * | 2018-12-10 | 2021-09-10 | 北京电子工程总体研究所 | Aiming point calibration method of power grid foreign matter laser cleaning device |
CN109848138A (en) * | 2018-12-10 | 2019-06-07 | 北京电子工程总体研究所 | A kind of aiming point Calibration Method of power grid foreign matter laser cleaning plant |
CN113260479A (en) * | 2018-12-20 | 2021-08-13 | Etxe-Tar有限公司 | Method and system for processing an object with a light beam |
CN112108776A (en) * | 2020-09-17 | 2020-12-22 | 广东吉洋视觉技术有限公司 | High-precision laser marking method for LED lamp bead defective product marking |
CN113703250A (en) * | 2020-12-31 | 2021-11-26 | 苏州立创致恒电子科技有限公司 | Imaging system and imaging method based on scanning galvanometer |
CN113703250B (en) * | 2020-12-31 | 2023-04-07 | 苏州立创致恒电子科技有限公司 | Imaging system and imaging method based on scanning galvanometer |
CN113520594A (en) * | 2021-05-31 | 2021-10-22 | 浙江大学 | Assembling method of double-light-path 3D imaging module |
CN113520594B (en) * | 2021-05-31 | 2023-08-08 | 浙江大学 | Assembling method of double-light-path 3D imaging module |
CN116140832A (en) * | 2023-04-20 | 2023-05-23 | 深圳市岑科实业有限公司 | Method and system for automatically correcting precision of intelligent inductance coil laser cutting system |
CN116140832B (en) * | 2023-04-20 | 2023-07-04 | 深圳市岑科实业有限公司 | Method and system for automatically correcting precision of intelligent inductance coil laser cutting system |
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CN106392309B (en) | 2018-07-06 |
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Effective date of registration: 20180614 Address after: 518000 9 new West Road, North Nanshan District high tech park, Shenzhen, Guangdong Applicant after: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Applicant after: Shenzhen Dazu robot Co., Ltd. Address before: 518000 9 new West Road, North Nanshan District high tech park, Shenzhen, Guangdong Applicant before: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Applicant before: Shenzhen Hans Electric Motor Co., Ltd. |
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Effective date of registration: 20210914 Address after: 518103 workshop 601, building 3, Zhizao Center Park, No. 12, Chongqing Road, Heping community, Fuhai street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen Dazu robot Co.,Ltd. Address before: 518000 9 new West Road, North Nanshan District high tech park, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Patentee before: Shenzhen Dazu robot Co.,Ltd. |