CN116137045A - Method, device, equipment and storage medium for adjusting pad drawing - Google Patents
Method, device, equipment and storage medium for adjusting pad drawing Download PDFInfo
- Publication number
- CN116137045A CN116137045A CN202310347686.0A CN202310347686A CN116137045A CN 116137045 A CN116137045 A CN 116137045A CN 202310347686 A CN202310347686 A CN 202310347686A CN 116137045 A CN116137045 A CN 116137045A
- Authority
- CN
- China
- Prior art keywords
- pad drawing
- initial
- pad
- adjusting
- remade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—2D [Two Dimensional] image generation
- G06T11/60—Editing figures and text; Combining figures or text
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/74—Image or video pattern matching; Proximity measures in feature spaces
- G06V10/761—Proximity, similarity or dissimilarity measures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Databases & Information Systems (AREA)
- Artificial Intelligence (AREA)
- Computing Systems (AREA)
- Health & Medical Sciences (AREA)
- Evolutionary Computation (AREA)
- General Health & Medical Sciences (AREA)
- Medical Informatics (AREA)
- Software Systems (AREA)
- Multimedia (AREA)
- Processing Or Creating Images (AREA)
- Image Generation (AREA)
Abstract
The invention relates to the field of image processing, and discloses a method, a device, equipment and a storage medium for adjusting a bonding pad drawing. The method comprises the following steps: when an initial pad drawing is received, determining a target assembly in a preset assembly library according to the initial pad drawing; generating a remade pad drawing according to the target assembly; determining whether the remade pad drawing is different from the initial pad drawing; when the remade pad drawing is different from the initial pad drawing, determining a difference component in the remade pad drawing and acquiring splicing parameters corresponding to the difference component; and adjusting the splicing parameters and returning to execute the step of determining whether the remade pad drawing is different from the initial pad drawing. The invention reduces the workload of adjusting the pad drawing.
Description
Technical Field
The present invention relates to the field of image processing, and in particular, to a method, an apparatus, a device, and a storage medium for adjusting a pad drawing.
Background
When the existing single-sided PCB board is produced in batch, 3D rendering is needed to be carried out on PCB drawings, the model is loaded according to the corresponding packaged devices during rendering, each device has an angle requirement, the packaged drawings have no standard angle in strict sense, so that inconsistent packaging drawings for customers and packaging drawings for production and rendering can occur, the angles of the rendered devices deviate, the processing mode of the situation needs to be manually judged whether the angles are opposite or not, the adjustment is needed in time and time, the whole process is time-consuming and labor-consuming, and the workload for adjusting the pad drawings is increased.
Disclosure of Invention
The invention mainly aims to solve the technical problem of large workload of adjusting the pad drawing.
The first aspect of the invention provides a method for adjusting a pad drawing, which comprises the following steps:
when an initial pad drawing is received, determining a target component in a preset component library according to the initial pad drawing;
generating a remade pad drawing according to the target assembly;
determining whether the remade pad drawing is different from the initial pad drawing;
when the difference exists between the reproduced bonding pad drawing and the initial bonding pad drawing, determining a difference component in the reproduced bonding pad drawing and acquiring splicing parameters corresponding to the difference component;
and adjusting the splicing parameters and returning to the step of executing the step of determining whether the remade pad drawing is different from the initial pad drawing.
Optionally, in a first implementation manner of the first aspect of the present invention, the step of determining whether the remade pad drawing is different from the initial pad drawing includes:
comparing the similarity between the remade pad drawing and the initial pad drawing to obtain drawing similarity;
and determining whether the difference component exists between the remade pad drawing and the initial pad drawing according to the drawing similarity.
Optionally, in a second implementation manner of the first aspect of the present invention, the step of generating the remade pad drawing according to the target component includes:
and splicing the target assembly according to preset splicing parameters corresponding to the target assembly to obtain the remade bonding pad drawing.
Optionally, in a third implementation manner of the first aspect of the present invention, the step of adjusting the splicing parameter includes:
outputting prompt information for adjusting the splicing parameters;
and when the adjustment instruction is detected, adjusting the splicing parameters according to the adjustment instruction.
Optionally, in a fourth implementation manner of the first aspect of the present invention, after the step of determining whether the remade pad drawing is different from the initial pad drawing, the method further includes:
outputting prompt information corresponding to the remade pad drawing and the initial pad drawing when the remade pad drawing and the initial pad drawing do not have the difference.
Optionally, in a fifth implementation manner of the first aspect of the present invention, the step of determining whether the remade pad drawing is different from the initial pad drawing includes:
and adjusting the visual angle of the reproduced bonding pad drawing according to the visual angle of the initial bonding pad drawing and determining whether the difference component exists between the reproduced bonding pad drawing and the initial bonding pad drawing or not at the current angle.
Optionally, in a sixth implementation manner of the first aspect of the present invention, when the initial pad drawing is received, the step of determining the target component in the preset component library according to the initial pad drawing includes:
when the initial pad drawing is received, determining whether the initial pad drawing is a preset type document;
and when the initial pad drawing is not the preset type document, determining the target component in the preset component library according to the initial pad drawing.
The second aspect of the present invention provides an adjusting device for a pad drawing, including:
the receiving module is used for determining a target assembly in a preset assembly library according to the initial pad drawing when the initial pad drawing is received;
the generating module is used for generating a remade pad drawing according to the target assembly;
the determining module is used for determining whether the remade pad drawing is different from the initial pad drawing;
the acquisition module is used for determining a difference component in the reproduced pad drawing and acquiring splicing parameters corresponding to the difference component when the difference exists between the reproduced pad drawing and the initial pad drawing;
and the adjusting module is used for adjusting the splicing parameters and returning to the step of executing the step of determining whether the remade pad drawing is different from the initial pad drawing.
A third aspect of the present invention provides an adjustment apparatus for a pad drawing, including: a memory and at least one processor, the memory having instructions stored therein, the memory and the at least one processor being interconnected by a line; and the at least one processor calls the instruction in the memory so that the adjustment device of the pad drawing executes the adjustment method of the pad drawing.
A fourth aspect of the present invention provides a computer-readable storage medium having instructions stored therein, which when run on a computer, cause the computer to perform the above-described method of adjusting a pad drawing.
In the embodiment of the invention, when an initial pad drawing is received by adjusting equipment of the pad drawing, determining a target component in a preset component library according to the initial pad drawing; generating a remade pad drawing according to the target assembly; determining whether the remade pad drawing is different from the initial pad drawing; when the difference exists between the reproduced bonding pad drawing and the initial bonding pad drawing, determining a difference component in the reproduced bonding pad drawing and acquiring splicing parameters corresponding to the difference component; and adjusting the splicing parameters and returning to the step of executing the step of determining whether the remade pad drawing is different from the initial pad drawing. Because the adjusting equipment of the pad drawing can generate a new remapped pad drawing based on the initial pad drawing after receiving the initial pad drawing, and then the similarity between the remapped pad drawing and the initial pad drawing is compared to determine whether the remapped pad drawing needs to be adjusted, the rendered initial pad drawing can be replaced by the rendered remapped pad drawing when the PCB is produced in batches, and target components on the remapped pad drawing are spliced based on splicing parameters, so that each target component on the remapped pad drawing has a standard angle in a strict sense, the situation that the angle of a rendering device deviates does not occur, and the artificial judgment of whether the angle is opposite or not is not needed, and the workload of adjusting the pad drawing is reduced.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a method for adjusting a pad drawing according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an embodiment of an adjusting device for a pad drawing according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an embodiment of an adjustment apparatus for a pad drawing according to an embodiment of the present invention.
Detailed Description
The embodiment of the invention provides a method, a device, equipment and a storage medium for adjusting a bonding pad drawing.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims and in the above drawings, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments described herein may be implemented in other sequences than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus.
For easy understanding, the following describes a specific flow of an embodiment of the present invention, referring to fig. 1, and an embodiment of a method for adjusting a pad drawing in an embodiment of the present invention includes:
101. when an initial pad drawing is received, determining a target component in a preset component library according to the initial pad drawing;
PCB (printed circuit board), a printed wiring board, is one of the important components of the electronics industry. Almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device, a military weapon system, has only electronic components such as an integrated circuit, and a printed board is used for electrically interconnecting the respective components. The printed circuit board consists of an insulating base plate, connecting wires and bonding pads for assembling and welding electronic elements, and has the dual functions of a conductive circuit and the insulating base plate. The wiring device can replace complex wiring, realizes electric connection among elements in a circuit, simplifies assembly and welding work of electronic products, reduces wiring workload in a traditional mode, and greatly lightens labor intensity of workers; and the whole volume is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. The printed circuit board has good product consistency, can adopt standardized design, and is favorable for realizing mechanization and automation in the production process. Meanwhile, the whole printed circuit board subjected to assembly and debugging can be used as an independent spare part, so that the whole machine product can be conveniently exchanged and maintained. At present, the printed wiring board has been extremely widely applied to the production and manufacture of electronic products.
In this embodiment, the initial pad drawing is a model drawing for customers.
Optionally, the initial pad drawing is a packaged drawing.
Optionally, when the initial pad drawing is received, determining whether the initial pad drawing is a preset type document; and when the initial pad drawing is not the preset type document, determining the target component in the preset component library according to the initial pad drawing. When the initial pad drawing is the document of the preset type, outputting prompt information that the drawing can be directly used for mass production. The preset type document may be a Gerber file.
Specifically, when an initial pad drawing is obtained, the components carried by the drawing can be determined based on analysis of the initial pad drawing, and then the components are searched in the preset components to determine the corresponding target components.
102. Generating a remade pad drawing according to the target assembly;
specifically, determining azimuth information (including but not limited to contour information or corner information) of the component corresponding to the initial pad drawing based on an analysis result obtained by analyzing the initial pad drawing; and recombining and splicing the target assembly based on the azimuth information to generate a reproduced bonding pad drawing.
Optionally, splicing the target assembly according to preset splicing parameters corresponding to the target assembly to obtain the remade pad drawing. Specifically, each target component is preset with a default preset splicing parameter, where the preset splicing parameter is a preferred value, for example: the chip (target component A) and the target main body plate (target component B) are spliced at a preset angle (preset splicing parameters).
103. Determining whether the remade pad drawing is different from the initial pad drawing;
specifically, after the reproduced pad drawing is generated, it can be compared with the original pad drawing, thereby determining whether there is a difference.
Optionally, comparing the similarity between the remade pad drawing and the initial pad drawing to obtain drawing similarity; and determining whether the remade pad drawing has the difference with the initial pad drawing according to the drawing similarity.
104. When the difference exists between the reproduced bonding pad drawing and the initial bonding pad drawing, determining a difference component in the reproduced bonding pad drawing and acquiring splicing parameters corresponding to the difference component;
specifically, when the drawing similarity is smaller than the preset similarity, pixel coordinates with differences on the remade pad drawing are determined based on the image features, and the difference component is determined based on the pixel coordinates. In this case, it is necessary to extract image features when performing operations such as image recognition and classification. Image features are the basic information that distinguishes one image from another for identifying and marking the image content. Image features fall into two general categories: natural features and artificial features.
Natural characteristics: it is some information contained in the image content itself, for example: information about the size, color distribution, contour, edge gradients, texture, etc. of the image.
The artificial feature is as follows: later analysis and processing are carried out on the image, and the mined information which is considered and identified is obtained. For example: color histogram, moment characteristics, entropy, etc.
105. And adjusting the splicing parameters and returning to the step of executing the step of determining whether the remade pad drawing is different from the initial pad drawing.
Optionally, outputting prompt information for adjusting the splicing parameters; and when the adjustment instruction is detected, adjusting the splicing parameters according to the adjustment instruction and returning to the step of executing the difference component which determines that the difference exists between the reproduced pad drawing and the initial pad drawing.
Optionally, when the difference between the reproduced pad drawing and the initial pad drawing does not exist, outputting prompt information corresponding to the reproduced pad drawing and the initial pad drawing.
Alternatively, the reproduced drawing may be a Gerber file, which may be parsed and related information extracted, such as the layout of the PCB, the size and shape of the components, and the locations of the pads and traces. This information is stored in a data structure, such as an array, object, or database, to generate a database of preset components.
In the embodiment of the invention, when an initial pad drawing is received by adjusting equipment of the pad drawing, determining a target component in a preset component library according to the initial pad drawing; generating a remade pad drawing according to the target assembly; determining whether the remade pad drawing is different from the initial pad drawing; when the difference exists between the reproduced bonding pad drawing and the initial bonding pad drawing, determining a difference component in the reproduced bonding pad drawing and acquiring splicing parameters corresponding to the difference component; and adjusting the splicing parameters and returning to the step of executing the step of determining whether the remade pad drawing is different from the initial pad drawing. Because the adjusting equipment of the pad drawing can generate a new remapped pad drawing based on the initial pad drawing after receiving the initial pad drawing, and then the similarity between the remapped pad drawing and the initial pad drawing is compared to determine whether the remapped pad drawing needs to be adjusted, the rendered initial pad drawing can be replaced by the rendered remapped pad drawing when the PCB is produced in batches, and target components on the remapped pad drawing are spliced based on splicing parameters, so that each target component on the remapped pad drawing has a standard angle in a strict sense, the situation that the angle of a rendering device deviates does not occur, and the artificial judgment of whether the angle is opposite or not is not needed, and the workload of adjusting the pad drawing is reduced.
The method for adjusting the bonding pad drawing in the embodiment of the present invention is described above, and the device for adjusting the bonding pad drawing in the embodiment of the present invention is described below, referring to fig. 2, and one embodiment of the device for adjusting the bonding pad drawing in the embodiment of the present invention includes:
the receiving module 301 is configured to determine a target component in a preset component library according to an initial pad drawing when the initial pad drawing is received;
a generating module 302, configured to generate a remade pad drawing according to the target component;
a determining module 303, configured to determine whether the remade pad drawing is different from the initial pad drawing;
the obtaining module 304 is configured to determine a difference component on the remade pad drawing and obtain a splicing parameter corresponding to the difference component when the remade pad drawing and the initial pad drawing have the difference;
and an adjustment module 305, configured to adjust the splicing parameters and return to executing the step of determining whether the remade pad drawing is different from the initial pad drawing.
Optionally, the determining module 303 may be further specifically configured to:
comparing the similarity between the remade pad drawing and the initial pad drawing to obtain drawing similarity;
and determining whether the remade pad drawing has the difference with the initial pad drawing according to the drawing similarity.
Optionally, the generating module 302 may be further specifically configured to:
and splicing the target assembly according to preset splicing parameters corresponding to the target assembly to obtain the remade bonding pad drawing.
Optionally, the generating module 302 may be further specifically configured to:
outputting prompt information for adjusting the splicing parameters;
and when the adjustment instruction is detected, adjusting the splicing parameters according to the adjustment instruction.
Optionally, the determining module 303 may be further specifically configured to:
outputting prompt information corresponding to the remade pad drawing and the initial pad drawing when the remade pad drawing and the initial pad drawing do not have the difference.
Optionally, the determining module 303 may be further specifically configured to:
and adjusting the visual angle of the reproduced bonding pad drawing according to the visual angle of the initial bonding pad drawing and determining whether the difference exists between the reproduced bonding pad drawing and the initial bonding pad drawing at the current angle.
Optionally, the receiving module 301 may be further specifically configured to:
when the initial pad drawing is received, determining whether the initial pad drawing is a preset type document;
and when the initial pad drawing is not the preset type document, determining the target component in the preset component library according to the initial pad drawing.
In the embodiment of the invention, when an initial pad drawing is received by adjusting equipment of the pad drawing, determining a target component in a preset component library according to the initial pad drawing; generating a remade pad drawing according to the target assembly; determining whether the remade pad drawing is different from the initial pad drawing; when the difference exists between the reproduced bonding pad drawing and the initial bonding pad drawing, determining a difference component in the reproduced bonding pad drawing and acquiring splicing parameters corresponding to the difference component; and adjusting the splicing parameters and returning to the step of executing the step of determining whether the remade pad drawing is different from the initial pad drawing. Because the adjusting equipment of the pad drawing can generate a new remapped pad drawing based on the initial pad drawing after receiving the initial pad drawing, and then the similarity between the remapped pad drawing and the initial pad drawing is compared to determine whether the remapped pad drawing needs to be adjusted, the rendered initial pad drawing can be replaced by the rendered remapped pad drawing when the PCB is produced in batches, and target components on the remapped pad drawing are spliced based on splicing parameters, so that each target component on the remapped pad drawing has a standard angle in a strict sense, the situation that the angle of a rendering device deviates does not occur, and the artificial judgment of whether the angle is opposite or not is not needed, and the workload of adjusting the pad drawing is reduced.
The device for adjusting the pad drawing in the embodiment of the present invention is described in detail from the perspective of the modularized functional entity in fig. 2, and the device for adjusting the pad drawing in the embodiment of the present invention is described in detail from the perspective of hardware processing.
Fig. 3 is a schematic structural diagram of an adjustment device for a pad drawing, where the adjustment device 500 for a pad drawing may have a relatively large difference due to different configurations or performances, and may include one or more processors (central processing units, CPU) 510 (e.g., one or more processors) and a memory 520, and one or more storage media 530 (e.g., one or more mass storage devices) storing application programs 533 or data 532 according to an embodiment of the present invention. Wherein memory 520 and storage medium 530 may be transitory or persistent storage. The program stored in the storage medium 530 may include one or more modules (not shown), each of which may include a series of instruction operations in the adjustment device 500 for the drawing of the welding paper. Still further, the processor 510 may be configured to communicate with the storage medium 530 and execute a series of instruction operations in the storage medium 530 on the adjustment device 500 of the pad drawing.
The pad drawing based tuning device 500 may also include one or more power supplies 540, one or more wired or wireless network interfaces 550, one or more input/output interfaces 560, and/or one or more operating systems 531, such as Windows Serve, mac OS X, unix, linux, freeBSD, and the like. It will be appreciated by those skilled in the art that the arrangement of the adjustment device of the pad drawing shown in fig. 3 is not limiting and may include more or fewer components than shown, or may be combined with certain components, or may be arranged with different components.
The present invention also provides a computer readable storage medium, which may be a non-volatile computer readable storage medium, or may be a volatile computer readable storage medium, where instructions are stored in the computer readable storage medium, where the instructions, when executed on a computer, cause the computer to perform the steps of the method for adjusting a bonding pad drawing.
It will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working process of the system or apparatus and unit described above may refer to the corresponding process in the foregoing method embodiment, which is not repeated herein.
The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied essentially or in part or all of the technical solution or in part in the form of a software product stored in a storage medium, including instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a read-only memory (ROM), a random access memory (random access memory, RAM), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The method for adjusting the bonding pad drawing is characterized by comprising the following steps of:
when an initial pad drawing is received, determining a target component in a preset component library according to the initial pad drawing;
generating a remade pad drawing according to the target assembly;
determining whether the remade pad drawing is different from the initial pad drawing;
when the difference exists between the reproduced bonding pad drawing and the initial bonding pad drawing, determining a difference component in the reproduced bonding pad drawing and acquiring splicing parameters corresponding to the difference component;
and adjusting the splicing parameters and returning to the step of executing the step of determining whether the remade pad drawing is different from the initial pad drawing.
2. The method of adjusting a pad drawing according to claim 1, wherein the step of determining whether the reproduced pad drawing differs from the original pad drawing comprises:
comparing the similarity between the remade pad drawing and the initial pad drawing to obtain drawing similarity;
and determining whether the remade pad drawing has the difference with the initial pad drawing according to the drawing similarity.
3. The method of adjusting a pad drawing according to claim 1, wherein the step of generating a reproduced pad drawing from the target component comprises:
and splicing the target assembly according to preset splicing parameters corresponding to the target assembly to obtain the remade bonding pad drawing.
4. The method for adjusting the bonding pad drawing according to claim 1, wherein the step of adjusting the splicing parameters comprises:
outputting prompt information for adjusting the splicing parameters;
and when the adjustment instruction is detected, adjusting the splicing parameters according to the adjustment instruction.
5. The method of adjusting a pad drawing according to claim 1, wherein after the step of determining whether the reproduced pad drawing differs from the original pad drawing, the method further comprises:
outputting prompt information corresponding to the remade pad drawing and the initial pad drawing when the remade pad drawing and the initial pad drawing do not have the difference.
6. The method of adjusting a pad drawing according to claim 1, wherein the step of determining whether the reproduced pad drawing differs from the original pad drawing comprises:
and adjusting the visual angle of the reproduced bonding pad drawing according to the visual angle of the initial bonding pad drawing and determining whether the difference exists between the reproduced bonding pad drawing and the initial bonding pad drawing at the current angle.
7. The method for adjusting a pad drawing according to claim 1, wherein the step of determining a target component in a preset component library according to the initial pad drawing when the initial pad drawing is received comprises:
when the initial pad drawing is received, determining whether the initial pad drawing is a preset type document;
and when the initial pad drawing is not the preset type document, determining the target component in the preset component library according to the initial pad drawing.
8. An adjusting device of a bonding pad drawing, which is characterized in that the adjusting device of the bonding pad drawing comprises:
the receiving module is used for determining a target assembly in a preset assembly library according to the initial pad drawing when the initial pad drawing is received;
the generating module is used for generating a remade pad drawing according to the target assembly;
the determining module is used for determining whether the remade pad drawing is different from the initial pad drawing;
the acquisition module is used for determining a difference component in the reproduced pad drawing and acquiring splicing parameters corresponding to the difference component when the difference exists between the reproduced pad drawing and the initial pad drawing;
and the adjusting module is used for adjusting the splicing parameters and returning to the step of executing the step of determining whether the remade pad drawing is different from the initial pad drawing.
9. An adjustment device for a pad drawing, characterized in that the adjustment device for a pad drawing comprises: a memory and at least one processor, the memory having instructions stored therein, the memory and the at least one processor being interconnected by a line;
the at least one processor invokes the instructions in the memory to cause the adjustment device of the pad drawing to perform the adjustment method of the pad drawing according to any one of claims 1-7.
10. A computer readable storage medium having a computer program stored thereon, wherein the computer program when executed by a processor implements the method of adjusting a pad drawing according to any of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310347686.0A CN116137045B (en) | 2023-04-04 | 2023-04-04 | Method, device, equipment and storage medium for adjusting pad drawing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310347686.0A CN116137045B (en) | 2023-04-04 | 2023-04-04 | Method, device, equipment and storage medium for adjusting pad drawing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116137045A true CN116137045A (en) | 2023-05-19 |
| CN116137045B CN116137045B (en) | 2023-09-12 |
Family
ID=86334606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310347686.0A Active CN116137045B (en) | 2023-04-04 | 2023-04-04 | Method, device, equipment and storage medium for adjusting pad drawing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116137045B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116704009A (en) * | 2023-08-10 | 2023-09-05 | 深圳普达核工业数字测控有限公司 | Construction measurement data processing method, device and equipment based on prefabricated component |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015215637A (en) * | 2014-04-23 | 2015-12-03 | 富士ゼロックス株式会社 | Image forming apparatus, image processing apparatus, and program |
| CN105138745A (en) * | 2015-08-07 | 2015-12-09 | 苏州上声电子有限公司 | Correction method for geometric model of vibrating member in loudspeaker emulation analysis |
| KR101584745B1 (en) * | 2015-04-27 | 2016-01-13 | (주)일신이앤씨 | Drawing examination method |
| CN110516370A (en) * | 2019-08-29 | 2019-11-29 | 同济大学建筑设计研究院(集团)有限公司 | Prefabricated components deepen drawing creation method, apparatus, computer equipment and medium |
| CN110929310A (en) * | 2019-11-25 | 2020-03-27 | 杭州群核信息技术有限公司 | Cloud drawing intelligent generation and editing method |
| CN111368915A (en) * | 2020-03-04 | 2020-07-03 | 广东博智林机器人有限公司 | Drawing verification method, device, equipment and storage medium |
| CN111488647A (en) * | 2020-03-13 | 2020-08-04 | 上海外高桥造船有限公司 | Method and system for drawing ship design drawing |
| CN111563429A (en) * | 2020-04-23 | 2020-08-21 | 广东博智林机器人有限公司 | Drawing verification method and device, electronic equipment and storage medium |
| CN113282999A (en) * | 2021-06-25 | 2021-08-20 | 广东都市建筑规划设计有限公司 | Automatic modification generation method and device for electrical lighting drawing and computer equipment |
| CN114780005A (en) * | 2022-06-16 | 2022-07-22 | 国能日新科技股份有限公司 | Graph drawing method, graph drawing device, electronic device, and storage medium |
| CN115344907A (en) * | 2022-08-15 | 2022-11-15 | 广东三维家信息科技有限公司 | Home decoration design drawing generation method and device |
-
2023
- 2023-04-04 CN CN202310347686.0A patent/CN116137045B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015215637A (en) * | 2014-04-23 | 2015-12-03 | 富士ゼロックス株式会社 | Image forming apparatus, image processing apparatus, and program |
| KR101584745B1 (en) * | 2015-04-27 | 2016-01-13 | (주)일신이앤씨 | Drawing examination method |
| CN105138745A (en) * | 2015-08-07 | 2015-12-09 | 苏州上声电子有限公司 | Correction method for geometric model of vibrating member in loudspeaker emulation analysis |
| CN110516370A (en) * | 2019-08-29 | 2019-11-29 | 同济大学建筑设计研究院(集团)有限公司 | Prefabricated components deepen drawing creation method, apparatus, computer equipment and medium |
| CN110929310A (en) * | 2019-11-25 | 2020-03-27 | 杭州群核信息技术有限公司 | Cloud drawing intelligent generation and editing method |
| CN111368915A (en) * | 2020-03-04 | 2020-07-03 | 广东博智林机器人有限公司 | Drawing verification method, device, equipment and storage medium |
| CN111488647A (en) * | 2020-03-13 | 2020-08-04 | 上海外高桥造船有限公司 | Method and system for drawing ship design drawing |
| CN111563429A (en) * | 2020-04-23 | 2020-08-21 | 广东博智林机器人有限公司 | Drawing verification method and device, electronic equipment and storage medium |
| CN113282999A (en) * | 2021-06-25 | 2021-08-20 | 广东都市建筑规划设计有限公司 | Automatic modification generation method and device for electrical lighting drawing and computer equipment |
| CN114780005A (en) * | 2022-06-16 | 2022-07-22 | 国能日新科技股份有限公司 | Graph drawing method, graph drawing device, electronic device, and storage medium |
| CN115344907A (en) * | 2022-08-15 | 2022-11-15 | 广东三维家信息科技有限公司 | Home decoration design drawing generation method and device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116704009A (en) * | 2023-08-10 | 2023-09-05 | 深圳普达核工业数字测控有限公司 | Construction measurement data processing method, device and equipment based on prefabricated component |
| CN116704009B (en) * | 2023-08-10 | 2023-12-01 | 深圳普达核工业数字测控有限公司 | Construction measurement data processing method, device and equipment based on prefabricated component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116137045B (en) | 2023-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN116137045B (en) | Method, device, equipment and storage medium for adjusting pad drawing | |
| CN104765822A (en) | 3D database system of electronic device and application of system | |
| CN114798360A (en) | Real-time detection method for PCB dispensing and related device | |
| CN112597737B (en) | Method, system and readable storage medium for creating PCB test point identification | |
| CN111897660B (en) | Model deployment method, model deployment device and terminal equipment | |
| CN111475106A (en) | RAID customization creating method, system, terminal and storage medium | |
| CN108255950B (en) | Data storage method and terminal equipment | |
| US8245181B2 (en) | Printed circuit board layout system and method thereof | |
| CN110443777B (en) | PCB image alignment method and device and computer storage medium | |
| CN116187252A (en) | Acceleration generation method, device, equipment and storage medium for PCB drawing | |
| US6940506B2 (en) | Method and apparatus generating analysis mesh data, and computer product | |
| CN115374517A (en) | Testing method and device for wiring software, electronic equipment and storage medium | |
| CN114528798A (en) | Printed circuit board element inspection method and system thereof | |
| CN115619698A (en) | Method and device for detecting defects of circuit board and model training method | |
| CN113435908A (en) | Method for generating tracing information of PCBA (printed circuit board assembly) | |
| US6353676B1 (en) | Analyzing an acquired arrangement of object locations | |
| CN116912230B (en) | Patch welding quality detection method and device, electronic equipment and storage medium | |
| CN114441937A (en) | Method and device for testing circuit board, electronic equipment and storage medium | |
| CN109300157B (en) | Mechanical position determining method of visual machine, terminal equipment and storage medium | |
| CN115372793B (en) | Circuit detection method for integrated circuit | |
| CN117309603B (en) | Method, device, equipment and medium for detecting strength of welding spot of surface mount of circuit board | |
| CN111542175B (en) | Component packaging comparison method and related device | |
| CN116542926B (en) | Method, device, equipment and storage medium for identifying defects of two-dimension codes of battery | |
| JP2850807B2 (en) | Inspection data creation device | |
| CN115439720B (en) | CAM image reconstruction method, training method, device, equipment and medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |