CN116136831A - Mainboard capable of driving multiple displays - Google Patents
Mainboard capable of driving multiple displays Download PDFInfo
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- CN116136831A CN116136831A CN202310198589.XA CN202310198589A CN116136831A CN 116136831 A CN116136831 A CN 116136831A CN 202310198589 A CN202310198589 A CN 202310198589A CN 116136831 A CN116136831 A CN 116136831A
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- 230000007717 exclusion Effects 0.000 description 7
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- 238000013461 design Methods 0.000 description 3
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- 230000004048 modification Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/382—Information transfer, e.g. on bus using universal interface adapter
- G06F13/385—Information transfer, e.g. on bus using universal interface adapter for adaptation of a particular data processing system to different peripheral devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application discloses a mainboard capable of driving various displays, which comprises a mainboard, an interface conversion board and a connector, wherein the position and a bonding pad for installing the interface conversion board are reserved on the mainboard, and the bonding pad comprises all signals necessary for displaying an interface; the main control chip is integrated on the main board, the display interface conversion chip is integrated on the interface conversion board and is used for converting a display interface signal defaulted by the main control chip into a display interface signal of a display to be driven, the display interface signal is input to the input end of the connector through the bonding pad, and the output end of the connector is electrically connected with the display. According to the mainboard capable of driving multiple displays, the same mainboard can be used for driving display screens or displays with different interfaces under the condition that the change is not needed or the change is very small, the risk and the cost for redesigning different interfaces are greatly reduced, and meanwhile, the time for designing and verifying products is shortened.
Description
Technical Field
The application relates to the technical field of display interfaces, in particular to a main board capable of driving multiple displays.
Background
The display interface conversion of the existing main board is single configuration, for example, the main board is fixed with a mipi interface to be converted into an LVDS interface, then an LCD display screen displaying the LVDS interface is driven through the LVDS interface, or the main board is fixed with an EDP interface to be converted into an HDMI interface, and then a display displaying the HDMI interface is driven through the HDMI interface.
The conversion of the single-configuration main board display interface cannot be flexibly adjusted according to the requirements of clients, for example, clients can not drive the display screen of the MIPI-DSI interface if the clients need to drive the display screen of the LVDS interface, and clients can not drive the display screen of the EDP interface if the clients need to drive the display of the HDMI interface. Each time a different customer demand is encountered, the motherboard is completely redesigned.
Disclosure of Invention
Therefore, the present application provides a motherboard capable of driving multiple kinds of displays, so as to solve the problem that in the prior art, the display interface conversion of the motherboard is all in a single configuration.
In order to achieve the above object, the present application provides the following technical solutions:
the main board comprises a main board, an interface conversion board and a connector, wherein the position for installing the interface conversion board and a bonding pad are reserved on the main board, and the bonding pad comprises all signals necessary for displaying an interface;
the main control chip is integrated on the main board, the display interface conversion chip is integrated on the interface conversion board and used for converting display interface signals defaulted by the main control chip into display interface signals of a display to be driven, the display interface signals are input to the input end of the connector through the bonding pad, and the output end of the connector is electrically connected with the display.
Further, the bonding pads are arranged around the reserved position where the interface conversion board is installed according to the display interface.
Further, the interface conversion plate is an interface conversion half-orifice plate.
Further, a resistor or an anti-blocking pad is reserved on the main board, and the resistor or the anti-blocking pad is reserved at a default display interface pad of the main control chip.
Further, the pads include all signals necessary for the EDP interface, the LVDS interface, the HDMI interface, and the MIPI-DSI interface.
Further, when the display interface conversion chip converts the MIPI-DSI interface signal into the EDP interface signal, the display interface conversion chip adopts a conversion chip with the model of LT8911 EXB.
Further, when the display interface conversion chip converts the MIPI-DSI interface signal into the LVDS interface signal, the display interface conversion chip adopts a conversion chip with the model of GM 8775C.
Further, when the display interface conversion chip converts the MIPI-DSI interface signal into the HDMI interface signal, the display interface conversion chip adopts a conversion chip with a model LT 8912B.
Compared with the prior art, the application has the following beneficial effects:
the application provides a mainboard capable of driving various displays, which comprises a mainboard, an interface conversion board and a connector, wherein the position and a bonding pad for installing the interface conversion board are reserved on the mainboard, and the bonding pad comprises all signals necessary for displaying an interface; the main control chip is integrated on the main board, the display interface conversion chip is integrated on the interface conversion board and is used for converting default display interface signals of the main control chip into display interface signals of a display to be driven, the display interface signals are input to the input end of the connector through the bonding pad, and the output end of the connector is electrically connected with the display. According to the mainboard capable of driving multiple displays, the same mainboard can be used for driving display screens or displays with different interfaces under the condition that the change is not needed or the change is very small, the risk and the cost for redesigning different interfaces are greatly reduced, and meanwhile, the time for designing and verifying products is shortened.
The bonding pads are arranged around the position reserved with the mounting interface conversion board according to the display interface, so that the bonding pads are convenient to appear.
Drawings
For a more visual illustration of the prior art and the present application, several exemplary drawings are presented below. It should be understood that the specific shape and configuration shown in the drawings should not be considered in general as limiting upon the practice of the present application; for example, based on the technical concepts and exemplary drawings disclosed herein, those skilled in the art have the ability to easily make conventional adjustments or further optimizations for the add/subtract/assign division, specific shapes, positional relationships, connection modes, dimensional scaling relationships, etc. of certain units (components).
FIG. 1 is a schematic circuit diagram of a motherboard capable of driving multiple displays provided in the present application;
fig. 2 is a schematic diagram of converting MIPI-DSI interface to EDP interface provided in an embodiment of the present application.
Detailed Description
The present application is further described in detail below with reference to the attached drawings.
In the description of the present application: unless otherwise indicated, the meaning of "a plurality" is two or more. The terms "first," "second," "third," and the like in this application are intended to distinguish between the referenced objects without a special meaning in terms of technical connotation (e.g., should not be construed as emphasis on degree or order of importance, etc.). The expressions "comprising", "including", "having", etc. also mean "not limited to" (certain units, components, materials, steps, etc.).
The terms such as "upper", "lower", "left", "right", "middle", and the like, as referred to in this application, are generally used for convenience in visual understanding with reference to the drawings, and are not intended to be an absolute limitation of the positional relationship in actual products. Such changes in relative positional relationship are considered to be within the scope of the present description without departing from the technical concepts disclosed herein.
The application provides a mainboard capable of driving various displays, which comprises a mainboard, an interface conversion board and a connector, wherein the position and a bonding pad for installing the interface conversion board are reserved on the mainboard, and the bonding pad comprises all signals necessary for displaying an interface;
the main control chip is integrated on the main board, the display interface conversion chip is integrated on the interface conversion board and is used for converting default display interface signals of the main control chip into display interface signals of a display to be driven, the display interface signals are input to the input end of the connector through the bonding pad, and the output end of the connector is electrically connected with the display to be driven.
Preferably, the bonding pads are arranged around the position reserved with the mounting interface conversion board according to the display interfaces, and different interfaces are arranged around the position, so that outgoing wires are facilitated.
Preferably, the pads include all signals necessary for the EDP interface, the LVDS interface, the HDMI interface, and the MIPI-DSI interface.
In order to reduce the bifurcation of the high-speed signal, a resistor or an exclusion pad is reserved at a default display interface pad of a main control chip, for example, when the default display interface of the main control chip is an LVDS interface, the resistor or the exclusion pad is reserved at the pad of the LVDS interface, and when the LVDS interface is used for driving a display with the LVDS interface, the exclusion can be welded, so that the bifurcation of the high-speed signal is reduced, and when the LVDS interface is converted into other interfaces by using an interface conversion board, the welding resistor or the exclusion is not needed; when the default display interface of the main control chip is an MIPI-DSI interface, a resistor or an exclusion pad is reserved at a pad of the MIPI-DSI interface, the exclusion is welded when the MIPI-DSI interface is used for driving a display with the MIPI-DSI interface, and when the MIPI-DSI interface is converted into other interfaces by using an interface conversion board, the welding resistor or the exclusion is not needed.
The mainboard that can drive multiple display that this application provided, under the very little circumstances of need not changing or changing, same piece mainboard can have multiple display interface optional, can drive the display screen or the display of different interfaces with same piece mainboard, very big reduction the risk and the cost to the redesign mainboard of different display interfaces, shortened the time of design and verification product simultaneously. For example, in the case that the main control chip of the main board has an MIPI-DSI physical interface, the main control chip may drive a display screen or a display of the MIPI-DSI interface, or may drive a display of the HDMI interface, a display screen of the EDP interface, or a display screen of the LVDS interface.
For a clearer description of the present application, reference will be made to specific embodiments.
The main control chip generally has some kind of physical display interface, such as MIPI-DSI interface. MIPI-DSI is a serial interface applied to display technology, compatible with DPI (display pixel interface ), DBI (display bus interface, display Bus Interface) and DCS (display command set ), transmits pixel information or instructions to a peripheral in a serial manner, and reads status information or pixel information from the peripheral, and enjoys its own independent communication protocol during transmission, including packet format and error correction and detection mechanisms.
For example, a high-pass chip has a set of MIPI-DSI interfaces, and when designing a motherboard, a physical connector of the set of interfaces is reserved for driving a display screen of the MIPI-DSI interfaces, and a typical set of MIPI-DSI interfaces includes the following signals: MIPI_CLKP/N, MIPI _D0P/N, MIPI _D1P/N, MIPI _D2P/N and MIPI_D3P/N, wherein MIPI_CLKP/N is a differential clock signal and the remaining 4 groups are differential data signals. These signals are high speed signals and therefore require strict impedance control on the PCB.
In an actual application scenario, if a motherboard is required to drive a screen of an EDP interface, or a screen of an LVDS interface, or a display of an HDMI interface, in general, the motherboard needs to be redesigned, a chip from MIPI-DSI to EDP, from MIPI-DSI to LVDS, or from MIPI-DSI to HDMI interface is added, and a corresponding connector is reserved on the motherboard for connecting the display or the display of the corresponding interface.
In order to drive more types of screens by using one main board, the method of converting the half-aperture board by using the reserved interface is adopted in the design of the main board, and meanwhile, the branches of high-speed signal lines are reduced by using resistors or resistors.
Specifically, an interface conversion board position and a bonding pad with a certain area are reserved on the main board. The bonding pads comprise all signals required by the four interfaces, namely an EDP interface, an LVDS interface, an HDMI interface and an MIPI-DSI interface, and are respectively arranged around the interface conversion board, for example, the HDMI interface bonding pads are reserved above the position of the interface conversion board, the MIPI-DSI interface bonding pads are reserved at the left side of the position of the interface conversion board, the LVDS interface is reserved below the position of the interface conversion board, and the EDP interface is reserved at the right side of the position of the interface conversion board.
If the main control chip is provided with a native MIPI-DSI interface, when designing a main board, reserving a space and a bonding pad of the interface conversion board, and reserving a corresponding connector on the main board, wherein a user can select to directly drive a corresponding screen through the MIPI-DSI interface or select to attach a half-pore plate of the MIPI-DSI switching HDMI interface according to actual application requirements, so that a display for driving the HDMI interface is realized; or selecting and attaching a half-pore plate of the MIPI-DSI switching EDP interface, so as to realize driving of a screen of the EDP interface; or a half-aperture plate of the MIPI-DSI switching LVDS interface is selected to be attached, so that a screen for driving the LVDS interface is realized.
Referring to fig. 1, in the circuit design, a resistor or a resistor array is placed at the position of the conversion half-hole plate of the MIPI-DSI interface, and when the MIPI-DSI screen is driven, the resistor array is mounted without the conversion half-hole plate of the MIPI-DSI interface. When the screen of other interfaces is driven, the resistor is not mounted or the resistor is not arranged, the interface is mounted to convert the half-pore plate, the branches of the signal wires are reduced to the greatest extent, and the signal wires directly enter the interface to convert the half-pore plate, so that the signal integrity of the high-speed signal is not affected.
In this embodiment, the default interface of the main control chip is an MIPI-DSI interface, and in order to realize that the same motherboard can drive a screen of an MIPI-DSI, LVDS, EDP or HDMI interface, three additional interface adapter boards are required to be designed in a matching manner, namely, MIPI-DSI to LVDS, MIPI-DSI to EDP, and MIPI-DSI to HDMI. Preferably, when the MIPI-DSI interface signal is converted into the LVDS interface signal, a display interface conversion chip adopts a conversion chip with the model of GM 8775C; referring to fig. 2, when converting the MIPI-DSI interface signal into the EDP interface signal, the display interface conversion chip adopts a conversion chip with model LT8911 EXB; when the MIPI-DSI interface signal is converted into the HDMI interface signal, a display interface conversion chip adopts a conversion chip with the model number of LT 8912B. The same method can also be used for a main control chip with other interfaces as default interfaces, and is used for driving a plurality of different interface screens, for example, the default interfaces are EDP interfaces, so that a main board can drive a display with EDP, MIPI-DSI, LVDS and HDMI interfaces.
Any combination of the technical features of the above embodiments may be performed (as long as there is no contradiction between the combination of the technical features), and for brevity of description, all of the possible combinations of the technical features of the above embodiments are not described; these examples, which are not explicitly written, should also be considered as being within the scope of the present description.
The foregoing has outlined and detailed description of the present application in terms of the general description and embodiments. It should be appreciated that numerous conventional modifications and further innovations may be made to these specific embodiments, based on the technical concepts of the present application; but such conventional modifications and further innovations may be made without departing from the technical spirit of the present application, and such conventional modifications and further innovations are also intended to fall within the scope of the claims of the present application.
Claims (8)
1. The main board capable of driving various displays is characterized by comprising a main board, an interface conversion board and a connector, wherein the main board is reserved with a position for installing the interface conversion board and a bonding pad, and the bonding pad comprises all signals necessary for displaying an interface;
the main control chip is integrated on the main board, the display interface conversion chip is integrated on the interface conversion board and used for converting display interface signals defaulted by the main control chip into display interface signals of a display to be driven, the display interface signals are input to the input end of the connector through the bonding pad, and the output end of the connector is electrically connected with the display.
2. The motherboard capable of driving multiple displays according to claim 1, wherein the pads are arranged around a location reserved for mounting the interface conversion board according to a display interface.
3. The motherboard capable of driving multiple displays according to claim 1, wherein the interface conversion board is an interface conversion half-aperture board.
4. The motherboard capable of driving multiple displays according to claim 1, wherein a resistor or an anti-pad is reserved on the motherboard, and the resistor or the anti-pad is reserved at a default display interface pad of the main control chip.
5. The motherboard capable of driving multiple displays according to claim 1, wherein the pads include all signals necessary for EDP interface, LVDS interface, HDMI interface and MIPI-DSI interface.
6. The motherboard capable of driving multiple displays according to claim 5, wherein the display interface conversion chip is a conversion chip of model LT8911EXB when converting MIPI-DSI interface signals to EDP interface signals.
7. The motherboard capable of driving multiple displays according to claim 5, wherein the display interface conversion chip is a conversion chip of model GM8775C when converting MIPI-DSI interface signals to LVDS interface signals.
8. The motherboard capable of driving multiple displays according to claim 5, wherein the display interface conversion chip is a conversion chip of model LT8912B when converting MIPI-DSI interface signals to HDMI interface signals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310198589.XA CN116136831A (en) | 2023-03-03 | 2023-03-03 | Mainboard capable of driving multiple displays |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310198589.XA CN116136831A (en) | 2023-03-03 | 2023-03-03 | Mainboard capable of driving multiple displays |
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| Publication Number | Publication Date |
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| CN116136831A true CN116136831A (en) | 2023-05-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310198589.XA Pending CN116136831A (en) | 2023-03-03 | 2023-03-03 | Mainboard capable of driving multiple displays |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117640871A (en) * | 2023-12-07 | 2024-03-01 | 广东高云半导体科技股份有限公司 | Data conversion device and method from SDI interface to eDP interface |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203773917U (en) * | 2014-02-07 | 2014-08-13 | 深圳宝龙达信息技术股份有限公司 | Display drive board |
| CN114510127A (en) * | 2021-12-15 | 2022-05-17 | 北京云迹科技股份有限公司 | Mainboard and robot compatible with HDMI, MIPI and LVDS interfaces |
-
2023
- 2023-03-03 CN CN202310198589.XA patent/CN116136831A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203773917U (en) * | 2014-02-07 | 2014-08-13 | 深圳宝龙达信息技术股份有限公司 | Display drive board |
| CN114510127A (en) * | 2021-12-15 | 2022-05-17 | 北京云迹科技股份有限公司 | Mainboard and robot compatible with HDMI, MIPI and LVDS interfaces |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117640871A (en) * | 2023-12-07 | 2024-03-01 | 广东高云半导体科技股份有限公司 | Data conversion device and method from SDI interface to eDP interface |
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