CN116120084A - Method for efficiently producing ceramic copper-clad substrate with pins - Google Patents
Method for efficiently producing ceramic copper-clad substrate with pins Download PDFInfo
- Publication number
- CN116120084A CN116120084A CN202310061163.XA CN202310061163A CN116120084A CN 116120084 A CN116120084 A CN 116120084A CN 202310061163 A CN202310061163 A CN 202310061163A CN 116120084 A CN116120084 A CN 116120084A
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- Prior art keywords
- copper
- ceramic
- copper sheet
- supporting frame
- oxide layer
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- 239000000919 ceramic Substances 0.000 title claims abstract description 77
- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910052802 copper Inorganic materials 0.000 claims abstract description 66
- 239000010949 copper Substances 0.000 claims abstract description 66
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 26
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 26
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims abstract description 7
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229940112669 cuprous oxide Drugs 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 7
- 230000003647 oxidation Effects 0.000 claims abstract description 6
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 6
- 239000012535 impurity Substances 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims description 34
- 238000007639 printing Methods 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical group [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract 2
- 239000005751 Copper oxide Substances 0.000 abstract 2
- 229910000431 copper oxide Inorganic materials 0.000 abstract 2
- 239000000463 material Substances 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Abstract
The invention relates to a method for efficiently producing a ceramic copper-clad substrate with pins, which comprises the following steps: A. cleaning the ceramic plate and the copper sheet to remove surface impurities; B. drying the cleaned ceramic plate and copper sheet; C. and (3) carrying out single-sided oxidation treatment on the cleaned copper sheet, forming a copper oxide layer on the connection surface of the copper sheet and the ceramic plate, and then treating the copper oxide layer to form a cuprous oxide layer. According to the method for efficiently producing the ceramic copper-clad substrate with the pins, the ceramic plate is covered with the metal oxide layer, the connection between the ceramic plate and the cuprous oxide layer of the copper sheet is blocked by utilizing the characteristics of the metal oxide, and then the metal oxide layer is removed, so that the pins are directly formed, the production capacity is increased, and unnecessary troubles caused by later pin opening are prevented.
Description
Technical Field
The invention belongs to the technical field of ceramic copper-clad substrates, and particularly relates to a method for efficiently producing a ceramic copper-clad substrate with pins.
Background
The ceramic copper-clad plate is directly connected with the ceramic substrate by a DBC technology (direct copper-clad), the ceramic copper-clad substrate is structurally a ceramic substrate, copper is then coated on the ceramic substrate, common materials of the ceramic substrate are materials such as alumina (Al 2O 3), zirconia Toughened Alumina (ZTA), aluminum nitride (AlN), silicon nitride (Si 3N 4) and the like, alN ceramic has the advantages of being close to wafer materials such as optimal thermal conductivity and the like, and other materials can also be manufactured into the ceramic copper-clad substrate with copper. After the manufacturing is finished, pins are required to be arranged on the ceramic copper-clad ceramic substrate, so that time and labor are wasted, and the ceramic copper-clad ceramic substrate is damaged directly to cause loss due to poor arrangement.
Disclosure of Invention
In view of the defects of the prior art, the technical problem to be solved by the invention is to provide a method for efficiently producing a ceramic copper-clad substrate with pins, which can directly produce the ceramic copper-clad substrate with pins and increase the production efficiency.
In order to solve the technical problems, the invention adopts the following technical scheme: the method for efficiently producing the ceramic copper-clad substrate with the pins comprises the following steps:
A. cleaning the ceramic plate and the copper sheet to remove surface impurities;
B. drying the cleaned ceramic plate and copper sheet;
C. carrying out single-sided treatment on the cleaned copper sheet, and arranging pin grooves on the treated surface of the copper sheet;
D. covering a metal oxide layer on the ceramic plate at a position corresponding to the pin groove of the copper sheet, covering the surface of the copper sheet with the cuprous oxide layer on the metal oxide layer, and attaching the copper sheet with the ceramic plate;
E. sending the ceramic coated copper substrate to a sintering furnace for sintering to form the ceramic coated copper substrate with the pins.
In step B, a drying process is employed.
In step D, the metal oxide layer is magnesium oxide.
In step D, the metal oxide layer is covered by an auxiliary printing device.
The auxiliary printing device comprises a positioning seat, a lifting device, a throwing component and a positioning plate, wherein the lifting device is arranged on the positioning seat, the throwing component is arranged at the output end of the lifting device, the throwing end of the throwing component is arranged towards the positioning seat, the throwing component is positioned above the positioning seat, the positioning plate is movably connected with the throwing component, an elastic piece is arranged at the joint of the positioning plate and the throwing component, a plurality of positioning grooves are formed in the positioning plate, a sealing ring is arranged below the groove edge of each positioning groove in an extending mode, and a throwing pipe in one-to-one correspondence with the plurality of positioning grooves is arranged on the throwing component.
The positioning seat is provided with a positioning and placing groove for placing the ceramic plate, and the bottom of the placing groove is provided with a vibrator.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the method for efficiently producing the ceramic copper-clad substrate with the pins, the ceramic plate is covered with the metal oxide layer, the connection between the ceramic plate and the cuprous oxide layer of the copper sheet is blocked by utilizing the characteristics of the metal oxide, and then the metal oxide layer is removed, so that the pins are directly formed, the production capacity is increased, and unnecessary troubles caused by later pin opening are prevented.
2. According to the method for efficiently producing the ceramic copper-clad substrate with the pins, when the method is specifically used, the copper sheet is placed on the placement base, then the support frame is lowered and placed on the placement base, so that the copper sheet is placed in the support frame, the second screw is rotated to drive the second sealing elements corresponding to the side edges of the copper sheet to move towards the copper sheet and attach the side edges of the copper sheet, then the first screw is rotated to drive the first sealing elements corresponding to the side edges of the copper sheet to move towards the copper sheet and attach the side edges of the copper sheet, so that the side edges of the copper sheet are tightly attached to form a seal, oxidation of the side edges of the copper sheet is prevented, and the first sealing elements and the second sealing elements can be attached properly according to the size of the copper sheet, so that the method is convenient and quick.
3. According to the method for efficiently producing the ceramic copper-clad substrate with the pins, when the ceramic copper-clad substrate with the pins is specifically used, the ceramic plate is placed on the positioning seat, the lifting device drives the throwing component to descend, so that the sealing ring of the positioning plate is attached to the ceramic plate, the metal oxide layer is prevented from leaking, and then the throwing pipe is used for throwing in the positioning groove, so that the metal oxide layer is precisely covered.
Drawings
FIG. 1 is a schematic diagram of an auxiliary printing device according to the present invention;
FIG. 2 is a schematic view of the structure of the positioning plate of the present invention;
FIG. 3 is a schematic diagram of a single-sided oxidizing machine for copper sheets according to the present invention;
FIG. 4 is a schematic top view of a single-sided copper sheet oxidizing machine of the present invention;
the marks in the figure: 1. placing a base; 2. a support frame; 3. a first screw; 4. a second screw; 5. a first seal; 6. a second seal; 7. a positioning seat; 8. a lifting device; 9. a launch assembly; 10. a positioning plate; 11. an elastic member; 12. a positioning groove; 13. a seal ring; 14. a delivery tube; 15. positioning the placement groove.
Detailed Description
In order to make the above features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
As shown in fig. 1-4, the present embodiment provides a method for efficiently producing a ceramic copper-clad substrate with pins, comprising the steps of:
A. cleaning the ceramic plate and the copper sheet to remove surface impurities;
B. drying the cleaned ceramic plate and copper sheet;
C. carrying out single-sided treatment on the cleaned copper sheet, and arranging pin grooves on the treated surface of the copper sheet;
D. covering a metal oxide layer on the ceramic plate at a position corresponding to the pin groove of the copper sheet, covering the surface of the copper sheet with the cuprous oxide layer on the metal oxide layer, and attaching the copper sheet with the ceramic plate;
E. sending the ceramic coated copper substrate to a sintering furnace for sintering to form the ceramic coated copper substrate with the pins.
Through covering the metal oxide layer on the ceramic plate, the connection between the ceramic plate and the cuprous oxide layer of the copper sheet is blocked by utilizing the characteristics of the metal oxide, and then the metal oxide layer is removed, so that pins are directly formed, the production capacity is increased, and unnecessary troubles caused by pin opening in the later stage are prevented.
Further, in step B, a drying process is employed. The surfaces of the ceramic plate and the copper sheet are kept dry and free of impurities, and the next step is carried out better.
Further, the single-sided oxidation machine is adopted to oxidize the copper sheet in the single-sided oxidation machine. Specifically, copper sheet single face oxidation tooling machine is including placing base 1, carriage 2, a plurality of first screw rods 3, a plurality of second screw rods 4, a plurality of first sealing member 5 and a plurality of second sealing member 6, carriage 2 movable mounting is on placing base 1, carriage 2 includes four inside casing limits, a plurality of first screw rods 3 divide into two sets of setting respectively on two inside casing limits that carriage 2 corresponds to with carriage 2 threaded connection setting, and rotate the connection setting with a plurality of first sealing member 5 one-to-one, a plurality of second screw rods 4 divide into two sets of setting respectively on two other inside casing limits that carriage 2 corresponds to with carriage 2 threaded connection setting, and rotate the connection setting with a plurality of second sealing member 6 one-to-one, above-mentioned frock spare is high temperature resistant ceramic and makes.
When the copper sheet is specifically used, the copper sheet is placed on the placement base 1, then the supporting frame 2 is lowered and placed on the placement base 1, so that the copper sheet is placed in the supporting frame 2, the second screw 4 is rotated to drive the second sealing pieces 6 corresponding to the side edges of the copper sheet to move towards the copper sheet and attach the side edges of the copper sheet, the first screw 3 is rotated to drive the first sealing pieces 5 corresponding to the side edges of the copper sheet to move towards the copper sheet and attach the side edges of the copper sheet, the side edges of the copper sheet are tightly attached to form a seal, the side edges of the copper sheet are prevented from being oxidized, and the first sealing pieces 5 and the second sealing pieces 6 can be attached according to the size of the copper sheet, so that the copper sheet is convenient and rapid.
Further, in step D, the metal oxide layer is magnesium oxide. When sintering, the temperature is 1060-1080 ℃, and the melting point of magnesium oxide is 2852 ℃ which is far higher than the sintering stability, thus playing a good barrier role.
Further, in step D, the metal oxide layer is covered by an auxiliary printing device. Specifically, auxiliary printing device includes positioning seat 7, elevating gear 8, throw in subassembly 9 and locating plate 10, elevating gear 8 installs on positioning seat 7, throw in subassembly 9 and install on elevating gear 8's output, and throw in subassembly 9 throw in the end towards positioning seat 7 setting, throw in subassembly 9 and be located positioning seat 7 top, locating plate 10 and throw in subassembly 9 swing joint, the junction of locating plate 10 and throw in subassembly 9 is equipped with elastic component 11, be equipped with a plurality of constant head tanks 12 on the locating plate 10, the slot limit below extension of each constant head tank 12 is equipped with sealing washer 13, be equipped with on the throw in subassembly 9 with a plurality of constant head tanks 12 one-to-one throw in pipe 14. When the ceramic plate positioning device is specifically used, the lifting device 8 drives the throwing component 9 to descend so that the sealing ring 13 of the positioning plate 10 is attached to the ceramic plate by placing the ceramic plate on the positioning seat 7, the metal oxide layer is prevented from leaking, then the metal oxide layer is precisely covered by throwing in the positioning groove 12 through the throwing pipe 14, and the sealing ring 13 of the positioning plate 10 can be self-adaptively attached to the ceramic plate by the elastic piece 11, so that the ceramic plate is prevented from being crushed.
Further, a positioning placing groove 15 for placing the ceramic plate is formed in the positioning seat 7, a vibrator is arranged at the bottom of the placing groove, and a discharging overreach opening is formed in one side of the positioning placing groove 15. The ceramic plate is conveniently positioned by the positioning groove 12 so that the ceramic plate is covered with the metal oxide layer at a fixed position.
Further, the auxiliary printing device is also provided with a track, and the positioning seat 7 is arranged on the track in a sliding way. The push-pull positioning seat 7 is convenient to move to be separated from the lower part of the throwing component 9, and the ceramic plate is taken out.
While the basic principles and main features of the invention and advantages of the invention have been shown and described, it will be understood by those skilled in the art that the present invention is not limited by the foregoing embodiments, which are described in the foregoing description merely illustrate the principles of the invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined in the appended claims and their equivalents.
Claims (9)
1. The method for efficiently producing the ceramic copper-clad substrate with the pins is characterized by comprising the following steps of:
A. cleaning the ceramic plate and the copper sheet to remove surface impurities;
B. drying the cleaned ceramic plate and copper sheet;
C. carrying out single-sided treatment on the cleaned copper sheet, and arranging pin grooves on the treated surface of the copper sheet;
D. covering a metal oxide layer on the ceramic plate at a position corresponding to the pin groove of the copper sheet, covering the surface of the copper sheet with the cuprous oxide layer on the metal oxide layer, and attaching the copper sheet with the ceramic plate;
E. sending the ceramic coated copper substrate to a sintering furnace for sintering to form the ceramic coated copper substrate with the pins.
2. The method for efficiently producing the ceramic copper-clad substrate with pins according to claim 1, wherein: in step B, a drying process is employed.
3. The method for efficiently producing the ceramic copper-clad substrate with pins according to claim 2, wherein: the copper sheet single-sided oxidation tooling machine comprises a placing base, a supporting frame, two first screws, two second screws, a plurality of first sealing pieces and a plurality of second sealing pieces, wherein the supporting frame is movably mounted on the placing base, the supporting frame comprises four inner frame edges, two first screws are arranged on the two inner frame edges corresponding to the supporting frame, the output directions of the two first screws are opposite, two second screws are arranged on the other two inner frame edges corresponding to the supporting frame, the output directions of the second screws are located between the output directions of the two first propping sealing assemblies, a plurality of first sealing pieces penetrate through the outer frame edges of the supporting frame along the length equidistance of the outer frame edges of the supporting frame and are connected with the output ends of the first screws, the first screws are provided with a plurality of first driving ends, the second sealing pieces penetrate through the outer frame edges of the supporting frame along the length equidistance of the outer frame edges of the supporting frame and are connected with the output ends of the second screws, and the second sealing pieces are provided with a plurality of driving ends.
4. The method for efficiently producing a ceramic copper-clad substrate with pins according to claim 3, wherein: the first sealing piece comprises a first push rod and a first flexible sealing block, a movable hole is formed in the position, corresponding to the first push rod, of the supporting frame, the first push rod is arranged through the movable hole in a sliding mode, one end of the first push rod is fixedly connected with the first driving end, the other end of the first push rod is fixedly arranged with the first flexible sealing block, the adjacent first flexible sealing blocks are tightly attached to each other, and the bottom of the first flexible sealing block is flush with the bottom of the supporting frame.
5. The method for efficiently producing a ceramic copper-clad substrate with pins according to claim 3, wherein: the second sealing piece comprises a second push rod and a second flexible sealing block, a movable hole is formed in the position, corresponding to the second push rod, of the supporting frame, the second push rod is arranged through the movable hole in a sliding mode, one end of the second push rod is fixedly connected with the second driving end, the other end of the second push rod is fixedly arranged with the second flexible sealing block, the adjacent second flexible sealing blocks are tightly attached to each other, and the bottom of the second flexible sealing block is flush with the bottom of the supporting frame.
6. The method for efficiently producing the ceramic copper-clad substrate with pins according to claim 1, wherein: in step D, the metal oxide layer is magnesium oxide.
7. The method for efficiently producing the ceramic copper-clad substrate with pins according to claim 1, wherein: in step D, the metal oxide layer is covered by an auxiliary printing device.
8. The method for efficiently producing the ceramic copper-clad substrate with pins according to claim 7, wherein: the auxiliary printing device comprises a positioning seat, a lifting device, a throwing component and a positioning plate, wherein the lifting device is arranged on the positioning seat, the throwing component is arranged at the output end of the lifting device, the throwing end of the throwing component is arranged towards the positioning seat, the throwing component is positioned above the positioning seat, the positioning plate is movably connected with the throwing component, an elastic piece is arranged at the joint of the positioning plate and the throwing component, a plurality of positioning grooves are formed in the positioning plate, a sealing ring is arranged below the groove edge of each positioning groove in an extending mode, and a throwing pipe in one-to-one correspondence with the plurality of positioning grooves is arranged on the throwing component.
9. The method for efficiently producing the ceramic copper-clad substrate with pins according to claim 1, wherein: and the positioning seat is provided with a positioning and placing groove for placing the ceramic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310061163.XA CN116120084B (en) | 2023-01-15 | 2023-01-15 | Method for efficiently producing ceramic copper-clad substrate with pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310061163.XA CN116120084B (en) | 2023-01-15 | 2023-01-15 | Method for efficiently producing ceramic copper-clad substrate with pins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116120084A true CN116120084A (en) | 2023-05-16 |
| CN116120084B CN116120084B (en) | 2024-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310061163.XA Active CN116120084B (en) | 2023-01-15 | 2023-01-15 | Method for efficiently producing ceramic copper-clad substrate with pins |
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| CN113524884A (en) * | 2021-06-29 | 2021-10-22 | 上海旭思印刷设备有限公司 | Printing device for printing substrate |
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| CN114758956A (en) * | 2022-03-03 | 2022-07-15 | 上海富乐华半导体科技有限公司 | Method for simultaneously sintering two sides of copper-clad ceramic substrate |
| CN217470435U (en) * | 2022-05-13 | 2022-09-20 | 建业科技电子（惠州）有限公司 | Silver paste through hole template of circuit board |
| CN217569498U (en) * | 2022-05-20 | 2022-10-14 | 成都湛艺电子科技有限公司 | Device for accurately gluing on substrate |
-
2023
- 2023-01-15 CN CN202310061163.XA patent/CN116120084B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050051253A1 (en) * | 2003-09-09 | 2005-03-10 | Ngk Spark Plug Co., Ltd. | Method for producing ceramic substrate, and ceramic substrate |
| CN102206098A (en) * | 2010-03-30 | 2011-10-05 | 比亚迪股份有限公司 | Ceramic copper-clad substrate and preparation method thereof |
| CN206339101U (en) * | 2016-12-30 | 2017-07-18 | 南京中江新材料科技有限公司 | Copper sheet one side annealing support |
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| CN113524884A (en) * | 2021-06-29 | 2021-10-22 | 上海旭思印刷设备有限公司 | Printing device for printing substrate |
| CN216730714U (en) * | 2021-12-31 | 2022-06-14 | 无锡创捷精密模具有限公司 | Drilling workbench for precision parts |
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| CN217569498U (en) * | 2022-05-20 | 2022-10-14 | 成都湛艺电子科技有限公司 | Device for accurately gluing on substrate |
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| CN116120084B (en) | 2024-02-27 |
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