CN116119907A - Seamless bending equipment for semiconductor quartz plates - Google Patents
Seamless bending equipment for semiconductor quartz plates Download PDFInfo
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- CN116119907A CN116119907A CN202310146564.5A CN202310146564A CN116119907A CN 116119907 A CN116119907 A CN 116119907A CN 202310146564 A CN202310146564 A CN 202310146564A CN 116119907 A CN116119907 A CN 116119907A
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- bending
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B20/00—Processes specially adapted for the production of quartz or fused silica articles, not otherwise provided for
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a seamless bending device for a semiconductor quartz plate, wherein a roasting device comprises a roasting component arranged above the left parts of a pair of vertical support plates; the bending device and the cooling device are also included; the bending device comprises a U-shaped left-right moving seat which is arranged between the left parts of the pair of vertical support plates in a left-right moving way; a U-shaped vertical moving seat is vertically arranged in the opening of the left and right moving seat in a moving way; a bending guide roller is formed between the upper ends of a pair of vertical parts of the vertical moving seat; a bending assembly is rotatably arranged between the upper ends of the left and right moving seats; the bending assembly comprises a bending support seat and a bending driving plate, wherein the bending support seat is rotatably arranged between the upper ends of the left moving seat and the right moving seat; the cooling device is disposed between the upper left ends of the pair of vertical support plates and is used for cooling the bending guide rollers and the bending driving plate in a horizontal state. The invention has the effect that the bending part of the processed semiconductor quartz plate does not leave gaps and is smooth.
Description
Technical Field
The invention relates to the field of quartz plate processing, in particular to seamless bending equipment for a semiconductor quartz plate.
Background
In semiconductor devices, it is sometimes necessary to use relatively bulky quartz parts, such as quartz plates, and in particular applications, quartz plates with curved portions are sometimes required, such plates being obtained nowadays generally by split welding two flat quartz plates.
With respect to the related art in the above, the inventors consider that there are the following drawbacks: the partial missing welding condition exists in the welding process, and the quartz component is required to be completely sealed when being applied to semiconductor equipment; the quartz plate obtained in this way is often distorted at its welded location and subsequently requires machining of this part, which increases the number of process steps and also risks machining damage.
Disclosure of Invention
In order to solve the technical problems that a welding leakage part and a welding part of a quartz plate obtained by a welding mode need to be machined again, the invention provides seamless bending equipment for a semiconductor quartz plate.
The invention provides a seamless bending device for a semiconductor quartz plate, which adopts the following technical scheme:
a seamless bending device for a semiconductor quartz plate comprises a bracket and a roasting device; the bracket comprises a pair of vertical supporting plates which are distributed front and back; the semiconductor quartz plates enter from the right end openings of the pair of vertical support plates; a plurality of driving rollers are rotatably arranged between the upper right parts of the pair of vertical supporting plates; all the driving rollers are positioned on the same horizontal plane; the broil device comprises a broil component arranged above the left parts of a pair of vertical support plates; the roasting component is used for vertically spraying high-temperature flame downwards; the bending device and the cooling device are also included; the bending device comprises a U-shaped left-right moving seat which is arranged between the left parts of the pair of vertical support plates in a left-right moving way; a U-shaped vertical moving seat is vertically arranged in the opening of the left-right moving seat in a moving manner; a bending guide roller is formed between the upper ends of a pair of vertical parts of the vertical moving seat; a bending assembly is rotatably arranged between the upper ends of the left and right movable seats; the bending assembly comprises a bending support seat and a bending driving plate, wherein the bending support seat is rotatably arranged between the upper ends of the left moving seat and the right moving seat, and the bending driving plate is arranged on the bending support seat; the length direction of the bending driving plate is parallel to the axial direction of the bending guide roller; the cooling device is disposed between the upper left ends of the pair of vertical support plates and is used for cooling the bending guide rollers and the bending driving plate in a horizontal state.
By adopting the technical scheme, the semiconductor quartz plate is driven by the rotating driving roller to move from right to left until the left end of the semiconductor quartz plate is positioned at the lower side of the roasting assembly, then the roasting assembly works to roast and heat the left end of the semiconductor quartz plate, and then the left-right moving seat moves from left to right to enable the left end of the semiconductor quartz plate to be positioned between the bending guide roller and the bending driving plate; then the bending guide roller moves upwards to lean against the lower end face of the left end of the semiconductor quartz plate, then the bending support rotates anticlockwise for a certain angle to enable the left end of the semiconductor quartz plate to bend, then the bending guide roller and the bending driving plate return, the left-right moving seat moves leftwards from right to return to the cooling device, the cooling device cools the bending guide roller and the bending driving plate, the bending guide roller and the bending driving plate are placed to be excessively high in temperature and then adhered to the semiconductor quartz plate, the roasting assembly carries out roasting heating on the left end of the semiconductor quartz plate again, and according to the principle, the left end of the semiconductor quartz plate is finally bent for a plurality of times, so that a gap is not left on a bent part of the produced semiconductor quartz plate, the use requirement of semiconductor equipment is met, meanwhile, the bent position is smooth, and subsequent machining is not needed.
Optionally, the cooling device includes a cooling seat disposed between the upper left ends of the pair of vertical support plates; an upper cooling groove for horizontally inserting the bending driving plate is formed in the upper part of the right end surface of the cooling seat, and a lower cooling groove for horizontally inserting the bending guide roller is formed in the lower part of the right end surface of the cooling seat; a plurality of uniformly distributed air nozzles are respectively arranged on the upper side wall, the left side wall and the lower side wall of the upper cooling tank and the lower cooling tank; the air nozzle is connected with an external air supply device.
Through adopting above-mentioned technical scheme, be located the air nozzle around bending drive plate and the crooked guide roll and jet it simultaneously for bending drive plate and crooked guide roll cooling are quick.
Optionally, the bending device further comprises an intermittent equiangular rotation mechanism; the intermittent equiangular rotating mechanism drives the bending support to intermittently rotate at an equal angle.
By adopting the technical scheme, the semiconductor quartz plate can be prevented from excessively softening due to excessive heating of the semiconductor quartz plate by bending at equal angles for a plurality of times and being matched with intermittent heating for a plurality of times, and the situation that the bent part is excessively thin and is easy to break after being finally bent can be avoided.
Optionally, the bending support comprises a bending central shaft rotatably arranged at the upper end of the vertical part of the left-right movable seat; a bending driven gear is fixed at the outer side end of the bending central shaft; the outer side end of the bending central shaft is sleeved with a torsion spring; one end of the torsion spring is fixed on the vertical part of the left-right movable seat, and the other end of the torsion spring is fixed on the bending driven gear; a central transfer seat is arranged at the upper end of the middle part of the end face of the pair of vertical support plates, which is close to each other, in a left-right sliding way; the upper end face and the lower end face of the central transmission seat are respectively provided with a transmission rack; the intermittent equal-angle rotating mechanism comprises a pair of bending driving motors which are respectively fixed on the upper end surfaces of the pair of vertical supporting plates; the bending driving motor intermittently rotates at equal angles; a driving gear is fixed on an output shaft of the bending driving motor; the driving gear is meshed with the transmission rack on the upper side; and in the process of moving the central transmission seat leftwards, the transmission rack on the lower side is meshed with the bending driven gear on the corresponding side.
Through adopting above-mentioned technical scheme, can realize bending the equiangular rotation of drive plate in order to carry out equiangular bending with the semiconductor quartz plate, simultaneously after cooling off the drive plate of bending at right removal in-process, the downside the transmission rack drives the driven gear rotation of bending, when the seat removal is put in place about, the angle when bending the drive plate and can reach the last time bending, and the convenience is follow-up to continue equiangular bending.
Optionally, the bending support comprises a pair of bending support plates distributed front and back; the bending driving plate is vertically arranged between the pair of bending supporting plates in a moving mode.
By adopting the technical scheme, the position of the bending driving plate between the pair of bending supporting plates is adjustable so as to adapt to semiconductor quartz plates with different thicknesses.
Optionally, a vertical moving groove is formed on the bending support plate; a vertical driving threaded rod is pivoted between the upper side wall and the lower side wall of the vertical moving groove; vertical moving blocks matched with the vertical moving grooves are respectively formed on the front end face and the rear end face of the bending driving plate; the vertical moving block is in threaded connection with the vertical driving threaded rod; the upper end of the vertical driving threaded rod is provided with a vertical driving block in a regular hexagon shape.
Through adopting above-mentioned technical scheme, drive a pair of vertical drive threaded rod rotation through rotatory a pair of vertical drive piece simultaneously, a pair of vertical drive threaded rod drive a pair of vertical movable block along the removal of vertical movement groove like this, drive the drive board of bending promptly and remove.
Optionally, a width limiting mechanism is arranged between the right parts of the pair of vertical support plates; the width limiting mechanism comprises a rectangular frame-shaped supporting frame fixed between the right parts of the pair of vertical supporting plates; a pair of width limiting seats are arranged in the supporting frame in a back-and-forth movement mode, and the pair of width limiting seats are synchronously arranged far away from or close to each other; a plurality of cylindrical vertical guide rods which are uniformly distributed left and right are formed on the upper end surface of the width limiting seat; the vertical guide rod vertically passes through a pair of adjacent driving rollers and an upper end of the vertical guide rod is higher than the driving rollers.
Through adopting above-mentioned technical scheme, the interval between the vertical guide arm of the synchronous keeping away from of a pair of width spacing seat and being close to can adjust front and back side to be suitable for the semiconductor quartz plate of different width.
Optionally, the upper end of the vertical guide rod is vertically sleeved and rotatably provided with a guide sleeve.
By adopting the technical scheme, the abrasion of the front end face and the rear end face of the semiconductor quartz plate in the moving process of the left and right directions can be reduced due to the guide sleeve.
Optionally, the grilling component includes a grilling base; the height and the left and right positions of the roasting base are adjustable; a flame spray gun supporting seat moves back and forth on the upper end surface of the roasting base; the right end face of the flame spray gun supporting seat is provided with a plurality of flame spray guns which are uniformly distributed in the front-back direction.
By adopting the technical scheme, the height and the left and right positions of the roasting base are adjustable, the flame spray gun supporting seat moves back and forth on the upper end surface of the roasting base, the position of the flame spray gun supporting seat can be adjusted to be suitable for different semiconductor quartz plates, and the distance between the flame spray gun and the full position of the semiconductor quartz plates is controlled.
Optionally, an air valve is arranged on an air inlet pipe of each flame spray gun.
By adopting the technical scheme, the gas valve is controlled to control the flame spray gun, so that the used flame spray gun can be increased or decreased according to the width of the semiconductor quartz plate, and the waste of the cost of fuel gas and the like is reduced.
In summary, the beneficial effects of the invention are as follows:
1. the bending part of the produced semiconductor quartz plate can not leave gaps, thereby meeting the use requirements of semiconductor equipment; and meanwhile, the bending position is smooth, and subsequent machining is not needed.
2. Is suitable for semiconductor quartz plates with different sizes.
Drawings
Fig. 1 is a schematic sectional view of the right-and-left movable base 53 of the present invention.
Fig. 2 is a schematic view of the structure of the section A-A of fig. 1 according to the present invention.
Fig. 3 is a schematic view of the structure of the section B-B of fig. 1 according to the present invention.
Fig. 4 is a schematic cross-sectional view of bending assembly 56 of the present invention.
Fig. 5 is a partially enlarged structural schematic view of fig. 3C according to the present invention.
Fig. 6 is a schematic view of the left-right movable base 53 according to the present invention in a cross section at the leftmost end.
Reference numerals illustrate:
10. a vertical support plate; 100. a left and right sliding groove; 11. a lower vertical support plate; 111. left and right guide posts; 12. a driving roller; 13. left and right guide rails;
20. a width limiting mechanism; 21. a support frame; 211. a lower vertical plate; 212. front and rear guide posts; 22. a centering drive motor; 23. a worm; 24. a front-rear driving lever; 241. a worm wheel; 25. a width limiting seat; 251. a vertical guide rod; 26. a guide sleeve;
30. a roasting device; 31. a horizontal drive motor for roasting; 32. the roasting horizontal driving threaded rod; 33. a movable base; 331. a left and right slider; 34. a vertical driving cylinder; 35. a roasting base; 350. a front-rear sliding groove; 36. a front-rear driving motor; 361. driving the threaded rod back and forth; 37. a flame spray gun support base; 371. front and rear sliders; 38. a flame spray gun; 381. a gas valve;
40. a semiconductor quartz plate;
50. a bending device; 51. a translation driving motor; 52. translating the threaded rod; 53. a left-right moving seat; 54. a lower electric cylinder; 55. bending the guide roller; 551. a vertical moving seat; 56. a bending assembly; 561. bending the supporting plate; 5610. a vertical movement groove; 562. bending the central shaft; 563. bending the driving plate; 5631. a vertical moving block; 564. driving the threaded rod vertically; 5641. a vertical driving block; 565. bending the driven gear; 566. a torsion spring; 57. intermittent equiangular rotation mechanism; 571. a bending driving motor; 572. a drive gear; 573. a center transfer seat; 574. a transfer rack;
60. a cooling device; 61. a cooling seat; 610. an upper cooling tank; 6100. a lower cooling tank; 611. a support connection plate; 612. cooling the working seat; 62. an air nozzle.
Detailed Description
The invention is described in further detail below with reference to fig. 1-6.
The application discloses seamless bending equipment for a semiconductor quartz plate, referring to FIG. 1, comprising a bracket, a width limiting mechanism 20, a roasting device 30, a bending device 50 and a cooling device 60; the bracket comprises a pair of vertical support plates 10 which are distributed back and forth; a plurality of driving rollers 12 are rotatably provided between right upper portions of the pair of vertical support plates 10; all driving rollers 12 are on the same horizontal plane; the width limiting mechanism 20 is disposed between right portions of the pair of vertical support plates 10 and is used for centering limitation of the semiconductor quartz plates 40 of different widths; the broil device 30 is provided at the left portion of the pair of vertical support plates 10 and serves to heat the left end of the semiconductor quartz plate 40; the bending device 50 is disposed between left portions of the pair of vertical support plates 10 and is used for bending left ends of the semiconductor quartz plates 40; the cooling device 60 is disposed between the left ends of the pair of vertical support plates 10 and cools the bending device 50.
Referring to fig. 1 and 2, the width limiting mechanism 20 includes a rectangular frame-shaped support frame 21 fixed between right portions of a pair of vertical support plates 10 and a pair of width limiting seats 25 provided in the support frame 21 to move forward and backward; a pair of left and right front and rear guide posts 212 are formed between the front and rear side walls of the support frame 21; a front and rear driving rod 24 is pivoted between the centers of the front and rear side walls of the supporting frame 21; the middle part of the front and rear driving rod 24 is formed with a worm wheel 241, the front and rear parts are respectively formed with external threads and the rotation directions of the external threads are opposite; a pair of width limiting seats 25 are sleeved on a pair of front and rear guide posts 212 and are respectively screwed on different external thread parts of the front and rear driving rods 24; lower vertical plates 211 are respectively formed in the middle of the left end and the middle of the right end of the lower end surfaces of the pair of support frames 21; a worm 23 is pivoted between the pair of lower vertical plates 211; a centering driving motor 22 is fixed on the right end surface of the right lower vertical plate 211; the right end of the worm 23 is fixedly connected with the output shaft of the centering driving motor 22; the worm 23 is meshed with the worm wheel 241; a plurality of cylindrical vertical guide rods 251 which are uniformly distributed left and right are formed on the upper end surface of the width limiting seat 25; the vertical guide bar 251 vertically passes through a pair of adjacent driving rollers 12 and the upper end of the vertical guide bar 251 is higher than the driving rollers 12; the upper end of the vertical guide rod 251 is vertically sleeved and rotatably connected with a guide sleeve 26 through a bearing.
Referring to fig. 1 and 3, the grilling apparatus 30 includes a pair of moving bases 33 and a grilling component; the middle parts of the pair of vertical support plates 10 are formed with left and right sliding grooves 100; a horizontal drive threaded rod 32 for baking is pivoted between the left and right side walls of the left and right sliding grooves 100; a horizontal drive motor 31 for baking is fixed on the right end surface of the vertical support plate 10; the right end of the horizontal drive threaded rod 32 for roasting is fixedly connected with the output shaft of the horizontal drive motor 31 for roasting; left and right sliders 331 which are matched with the left and right sliding grooves 100 are respectively formed on the end surfaces of the pair of movable bases 33, which are close to each other; the left and right sliding blocks 331 are screwed on the horizontal driving threaded rod 32 of the baking at the corresponding side; a vertical driving cylinder 34 is fixed on the upper end surface of the movable base 33; the broil assembly comprises a broil base 35 fixed on the upper ends of the piston rods of a pair of vertical driving cylinders 34 and a flame spray gun support seat 37 arranged on the upper end surface of the broil base 35 in a back-and-forth movement manner; the upper end surface of the roasting base 35 is formed with a front-rear sliding groove 350; a front and rear driving threaded rod 361 is pivoted between the front and rear side walls of the front and rear sliding groove 350; a front and rear driving motor 36 is fixed on the rear end face of the roasting base 35; the rear end of the front and rear driving threaded rod 361 is fixedly connected with the output shaft of the front and rear driving motor 36; front and rear sliders 371 which are matched with the front and rear sliding grooves 350 are formed on the lower end surface of the flame spray gun supporting seat 37; the front and rear sliding blocks 371 are screwed on the front and rear driving threaded rods 361; a plurality of flame spray guns 38 which are uniformly distributed in the front-back direction are fixed on the right end surface of the flame spray gun supporting seat 37; a gas valve 381 is provided on the intake pipe of each flame gun 38.
Referring to fig. 1, 3 to 5, a pair of lower vertical support plates 11 distributed left and right are formed at the left lower portion of a pair of vertical support plates 10; the bending device 50 includes a left-right moving seat 53 provided between a pair of lower vertical support plates 11 to move left-right; a pair of front-back symmetrical left and right guide posts 111 are formed between the end surfaces of the pair of lower vertical support plates 11, which are close to each other; a translational threaded rod 52 is pivoted between the centers of the end surfaces of the pair of lower vertical support plates 11, which are close to each other; a translation driving motor 51 is fixed on the right end surface of the lower vertical supporting plate 11; the right end of the translation threaded rod 52 is fixedly connected with the output shaft of the translation driving motor 51; the lower part of the left-right moving seat 53 is sleeved on the pair of left-right guide posts 111 in the left-right direction and is screwed on the translation threaded rod 52; a pair of lower cylinders 54 which are distributed back and forth are fixed on the upper end surface of the horizontal part of the left and right moving seat 53; the upper ends of the piston rods of the pair of lower electric cylinders 54 are fixed with U-shaped vertical moving seats 551; a curved guide roller 55 is formed between the upper ends of a pair of vertical parts of the vertical moving seat 551; a bending component 56 is rotatably arranged between the upper ends of the left and right movable seats 53;
bending assembly 56 includes a bending support; the bending support comprises a pair of bending support plates 561 which are distributed front and back; a bending driving plate 563 is arranged between the pair of bending supporting plates 561; the length direction of the bending drive plate 563 is parallel to the axial direction of the bending guide roller 55; the lower ends of the end surfaces of the pair of bending support plates 561, which are far away from each other, are respectively formed with a bending central shaft 562; a pair of folded center shafts 562 are rotatably provided at upper ends of a pair of vertical portions of the left and right moving seat 53 through bearings, respectively; a bending driven gear 565 is fixed at one end of the bending central shaft 562 away from the bending supporting plate 561; a torsion spring 566 is sleeved on the bending central shaft 562; one end of the torsion spring 566 is fixed on the vertical part of the left-right moving seat 53, and the other end is fixed on the bending driven gear 565;
an intermittent equiangular rotation mechanism 57 is provided on the pair of vertical support plates 10; the intermittent equal-angle rotating mechanism 57 drives the bending support to intermittently rotate at equal angles;
the intermittent equiangular rotation mechanism 57 includes a pair of bending drive motors 571 fixed to the upper end surfaces of the pair of vertical support plates 10, respectively, and a pair of center transfer seats 573; the bending driving motor 571 intermittently rotates at an equal angle; a driving gear 572 is fixed on the output shaft of the bending driving motor 571; left and right guide rails 13 are respectively formed at the upper ends of the middle parts of the end surfaces of the pair of vertical support plates 10, which are close to each other; the cross sections of the left and right guide rails 13 are T-shaped; the end surface of the central transfer seat 573, which is close to the vertical support plate 10, is provided with left and right guide grooves matched with the left and right guide rails 13; the center transfer seat 573 is sleeved on the left and right guide rails 13 on the corresponding sides in the left and right directions; the upper and lower end surfaces of the central transmission seat 573 are respectively provided with a transmission rack 574; the driving gear 572 is engaged with the upper transfer rack 574; during the leftward movement of the center transfer holder 573, the lower transfer rack 574 is engaged with the corresponding side bending driven gear 565.
Referring to fig. 4, a vertical moving groove 5610 is formed in the bending support plate 561; a vertical driving threaded rod 564 is pivoted between the upper and lower sidewalls of the vertical moving groove 5610; vertical movement blocks 5631 which are matched with the vertical movement grooves 5610 are respectively formed on the front end face and the rear end face of the bending driving plate 563; the vertical moving block 5631 is screw-coupled to the vertical driving threaded rod 564; the upper end of the vertical driving threaded rod 564 is formed with a vertical driving block 5641 in a regular hexagonal shape.
Referring to fig. 1 and 3, the cooling device 60 includes a cooling seat 61; the cooling seat 61 includes a support connection plate 611 fixed between the upper left ends of the pair of vertical support plates 10; a cooling working seat 612 is formed on the right end surface of the support connecting plate 611; an upper cooling groove 610 for horizontally inserting the bending drive plate 563 is formed in the upper part of the right end surface of the cooling seat 612, and a lower cooling groove 6100 for horizontally inserting the bending guide roller 55 is formed in the lower part thereof; the front and rear openings of the upper cooling tank 610 and the lower cooling tank 6100 are provided; a plurality of uniformly distributed air nozzles 62 are respectively arranged on the upper side wall, the left side wall and the lower side wall of the upper cooling tank 610 and the lower cooling tank 6100; the air nozzle 62 is connected to an external air supply device.
The working principle of the seamless bending equipment for the semiconductor quartz plate is as follows:
before working, firstly, the space between the front side and the rear side vertical guide rods 251 is adjusted according to the front-rear width of the semiconductor quartz plate 40; the position of the bending driving plate 563 between the pair of bending supporting plates 561 is adjusted according to the thickness of the semiconductor quartz plate 40, and the gas valve 381 is controlled to increase or decrease the number of flame spray guns 38 required to work; adjusting the upper and lower positions of the roasting base 35 so that the heating efficiency of the flame to the semiconductor quartz plate 40 is the highest; the front and rear positions of the flame spray gun support seat 37 and the left and right positions of the roasting base 35 are adjusted according to the bending position of the semiconductor quartz plate 40; the practical semiconductor quartz plates 40 with different sizes are designed in this way;
when the device works, the semiconductor quartz plate 40 is driven by the rotating driving roller 12 to move from right to left until the bending position of the semiconductor quartz plate 40 is located right below the flame spray gun 38, then the flame spray gun 38 works to bake and heat the bending position of the semiconductor quartz plate 40, and then the left-right moving seat 53 moves from left to right so that the left end of the semiconductor quartz plate 40 is located between the bending guide roller 55 and the bending driving plate 563; then the bending guide roller 55 moves upwards to abut against the lower end face of the bending position of the semiconductor quartz plate 40, then the bending support rotates anticlockwise for a certain angle to enable the left end of the semiconductor quartz plate 40 to bend for a certain angle, then the bending guide roller 55 and the bending driving plate 563 return, the left-right moving seat 53 moves from right to left to reach the cooling device 60, the cooling device 60 cools the bending guide roller 55 and the bending driving plate 563, the bending guide roller 55 and the bending driving plate 563 are placed to be excessively high in temperature and then adhered to the semiconductor quartz plate 40, at the moment, the flame spray gun 38 is used for roasting and heating the bending position of the semiconductor quartz plate 40 again, and according to the principle, the bending of the left end of the semiconductor quartz plate 40 is finally completed, and therefore the bending part of the produced semiconductor quartz plate can not leave gaps, the use requirements of semiconductor equipment are met, and meanwhile, the bending position is smooth, and subsequent machining is not needed.
The above embodiments are not intended to limit the scope of the present invention, so: all equivalent changes in structure, shape and principle of the invention should be covered in the scope of protection of the invention.
Claims (10)
1. A seamless bending device for a semiconductor quartz plate comprises a bracket and a roasting device (30); the bracket comprises a pair of vertical support plates (10) which are distributed back and forth; a semiconductor quartz plate (40) enters from the right end openings of the pair of vertical support plates (10); a plurality of driving rollers (12) are rotatably arranged between the upper right parts of the pair of vertical supporting plates (10); all the driving rollers (12) are on the same horizontal plane; the broil device (30) comprises a broil component arranged above the left part of a pair of vertical support plates (10); the roasting component is used for vertically spraying high-temperature flame downwards; the method is characterized in that: further comprising bending means (50) and cooling means (60); the bending device (50) comprises a left-right moving seat (53) which moves left and right and is arranged between the left parts of a pair of vertical support plates (10) in a U shape; a U-shaped vertical moving seat (551) is vertically arranged in the opening of the left-right moving seat (53) in a moving manner; a bending guide roller (55) is formed between the upper ends of a pair of vertical parts of the vertical moving seat (551); a bending assembly (56) is rotatably arranged between the upper ends of the left and right moving seats (53); the bending assembly (56) comprises a bending support seat rotatably arranged between the upper ends of the left and right moving seats (53) and a bending driving plate (563) arranged on the bending support seat; the length direction of the bending driving plate (563) is parallel to the axial direction of the bending guide roller (55); the cooling device (60) is provided between the upper left ends of the pair of vertical support plates (10) and is used for cooling the bending guide roller (55) and the bending drive plate (563) in a horizontal state.
2. The seamless bending apparatus for a semiconductor quartz plate according to claim 1, wherein: the cooling device (60) comprises a cooling seat (61) arranged between the upper left ends of a pair of vertical support plates (10); an upper cooling groove (610) for horizontally inserting a bending driving plate (563) is formed in the upper part of the right end surface of the cooling seat (61), and a lower cooling groove (6100) for horizontally inserting a bending guide roller (55) is formed in the lower part of the cooling seat; a plurality of uniformly distributed air nozzles (62) are respectively arranged on the upper side wall, the left side wall and the lower side wall of the upper cooling groove (610) and the lower cooling groove (6100); the air nozzle (62) is connected to an external air supply.
3. The seamless bending apparatus for a semiconductor quartz plate according to claim 1, wherein: the bending device (50) further comprises an intermittent equiangular rotation mechanism (57); the intermittent equiangular rotation mechanism (57) drives the bending support to intermittently and equiangular rotate.
4. A seamless bending apparatus for a semiconductor quartz plate according to claim 3, wherein: the bending support comprises a bending central shaft (562) rotatably arranged at the upper end of the vertical part of the left-right moving seat (53); a bending driven gear (565) is fixed at the outer side end of the bending central shaft (562); a torsion spring (566) is sleeved at the outer side end of the bending central shaft (562); one end of the torsion spring (566) is fixed on the vertical part of the left-right moving seat (53), and the other end is fixed on the bending driven gear (565); the upper ends of the middle parts of the end faces, close to each other, of the pair of vertical support plates (10) are provided with center transmission seats (573) in a sliding manner left and right; the upper end surface and the lower end surface of the central transmission seat (573) are respectively provided with a transmission rack (574); the intermittent equiangular rotation mechanism (57) comprises a pair of bending driving motors (571) which are respectively fixed on the upper end surfaces of the pair of vertical support plates (10); the bending driving motor (571) rotates intermittently at equal angles; a driving gear (572) is fixed on an output shaft of the bending driving motor (571); the drive gear (572) is engaged with the upper transmission rack (574); during the leftward movement of the central transfer holder (573), the transfer rack (574) on the lower side is engaged with the bending driven gear (565) on the corresponding side.
5. The seamless bending apparatus for a semiconductor quartz plate according to claim 1, wherein: the bending support comprises a pair of bending support plates (561) which are distributed back and forth; the bending driving plate (563) is vertically movably arranged between a pair of bending supporting plates (561).
6. The seamless bending apparatus for a semiconductor quartz plate according to claim 5, wherein: a vertical moving groove (5610) is formed on the bending supporting plate (561); a vertical driving threaded rod (564) is pivoted between the upper side wall and the lower side wall of the vertical moving groove (5610); vertical moving blocks (5631) matched with the vertical moving grooves (5610) are respectively formed on the front end face and the rear end face of the bending driving plate (563); the vertical moving block (5631) is in threaded connection with the vertical driving threaded rod (564); the upper end of the vertical driving threaded rod (564) is provided with a regular hexagonal vertical driving block (5641).
7. The seamless bending apparatus for a semiconductor quartz plate according to claim 1, wherein: a width limiting mechanism (20) is arranged between the right parts of the pair of vertical supporting plates (10); the width limiting mechanism (20) comprises a rectangular frame-shaped supporting frame (21) fixed between the right parts of the pair of vertical supporting plates (10); a pair of width limiting seats (25) are arranged in the supporting frame (21) in a back-and-forth moving mode, and the pair of width limiting seats (25) are synchronously arranged far away from or close to each other; a plurality of cylindrical vertical guide rods (251) which are uniformly distributed left and right are formed on the upper end surface of the width limiting seat (25); the vertical guide bar (251) vertically passes through a pair of adjacent driving rollers (12) and an upper end of the vertical guide bar (251) is higher than the driving rollers (12).
8. The seamless bending apparatus for a semiconductor quartz plate according to claim 7, wherein: the upper end of the vertical guide rod (251) is vertically sleeved and rotatably provided with a guide sleeve (26).
9. The seamless bending apparatus for a semiconductor quartz plate according to claim 1, wherein: the grilling component comprises a grilling base (35); the height and the left and right positions of the roasting base (35) are adjustable; a flame spray gun supporting seat (37) moves back and forth on the upper end surface of the roasting base (35); the right end face of the flame spray gun supporting seat (37) is provided with a plurality of flame spray guns (38) which are uniformly distributed in the front-back direction.
10. The seamless bending apparatus for a semiconductor quartz plate according to claim 1, wherein: a gas valve (381) is arranged on the gas inlet pipe of each flame spray gun (38).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310146564.5A CN116119907A (en) | 2023-02-15 | 2023-02-15 | Seamless bending equipment for semiconductor quartz plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310146564.5A CN116119907A (en) | 2023-02-15 | 2023-02-15 | Seamless bending equipment for semiconductor quartz plates |
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| Publication Number | Publication Date |
|---|---|
| CN116119907A true CN116119907A (en) | 2023-05-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310146564.5A Pending CN116119907A (en) | 2023-02-15 | 2023-02-15 | Seamless bending equipment for semiconductor quartz plates |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117923768A (en) * | 2024-03-25 | 2024-04-26 | 上海强华实业股份有限公司 | Quartz bending plate processing equipment and processing method thereof |
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2023
- 2023-02-15 CN CN202310146564.5A patent/CN116119907A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117923768A (en) * | 2024-03-25 | 2024-04-26 | 上海强华实业股份有限公司 | Quartz bending plate processing equipment and processing method thereof |
| CN117923768B (en) * | 2024-03-25 | 2024-06-07 | 上海强华实业股份有限公司 | Quartz bending plate processing equipment and processing method thereof |
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