CN116117136A - Silver-coated copper powder and application thereof - Google Patents
Silver-coated copper powder and application thereof Download PDFInfo
- Publication number
- CN116117136A CN116117136A CN202310128258.9A CN202310128258A CN116117136A CN 116117136 A CN116117136 A CN 116117136A CN 202310128258 A CN202310128258 A CN 202310128258A CN 116117136 A CN116117136 A CN 116117136A
- Authority
- CN
- China
- Prior art keywords
- copper powder
- silver
- coated copper
- flake
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 201
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 115
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 113
- 239000004332 silver Substances 0.000 title claims abstract description 113
- 239000011247 coating layer Substances 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 claims description 3
- 238000011068 loading method Methods 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 41
- 229910052802 copper Inorganic materials 0.000 description 25
- 239000010949 copper Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 25
- 239000002994 raw material Substances 0.000 description 22
- 239000000843 powder Substances 0.000 description 17
- 238000007650 screen-printing Methods 0.000 description 16
- 238000001878 scanning electron micrograph Methods 0.000 description 13
- 238000001723 curing Methods 0.000 description 12
- 238000003475 lamination Methods 0.000 description 12
- 238000013035 low temperature curing Methods 0.000 description 12
- 238000007639 printing Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 6
- -1 for example Substances 0.000 description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 6
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 5
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 230000001788 irregular Effects 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 241000251468 Actinopterygii Species 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 238000007790 scraping Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000004626 scanning electron microscopy Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000007765 extrusion coating Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- WNEODWDFDXWOLU-QHCPKHFHSA-N 3-[3-(hydroxymethyl)-4-[1-methyl-5-[[5-[(2s)-2-methyl-4-(oxetan-3-yl)piperazin-1-yl]pyridin-2-yl]amino]-6-oxopyridin-3-yl]pyridin-2-yl]-7,7-dimethyl-1,2,6,8-tetrahydrocyclopenta[3,4]pyrrolo[3,5-b]pyrazin-4-one Chemical compound C([C@@H](N(CC1)C=2C=NC(NC=3C(N(C)C=C(C=3)C=3C(=C(N4C(C5=CC=6CC(C)(C)CC=6N5CC4)=O)N=CC=3)CO)=O)=CC=2)C)N1C1COC1 WNEODWDFDXWOLU-QHCPKHFHSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- PLKATZNSTYDYJW-UHFFFAOYSA-N azane silver Chemical compound N.[Ag] PLKATZNSTYDYJW-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 235000012907 honey Nutrition 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention provides silver-coated copper powder and application thereof, wherein the silver-coated copper powder comprises flaky copper powder and a silver coating layer existing on the surface of the flaky copper powder, and the diameter-thickness ratio of the flaky copper powder is 35:1-200:1. The silver-coated copper powder has good conductivity and usability, and can improve the conductivity and electromagnetic shielding performance of the conductive material prepared from the silver-coated copper powder.
Description
Technical Field
The invention relates to the technical field of conductive materials, in particular to silver-coated copper powder and application thereof.
Background
The use of silver-coated copper powder can effectively reduce the use amount of expensive silver powder, has the advantages of low cost and the like, and is gradually and widely focused and applied, for example, as a conductive material, an electromagnetic shielding material and the like.
However, the existing silver-coated copper powder has poor conductive performance and service performance, for example, is not suitable for forming structures such as conductive films (especially ultrathin conductive films) or wires (such as thin-gate thick-gate wires of heterojunction solar photovoltaic (HJT) cells and RFID (radio frequency identification) tag wires) in a screen printing mode and the like, and has the defects that the screen printing line width is wider, good lamination type micro-morphology features cannot be formed with organic matters such as resin and the like, so that the conductive performance of the formed conductive films and the like is poor, the electromagnetic shielding efficiency of the formed conductive films and the like is poor (especially the electromagnetic shielding efficiency under the electromagnetic wave impact of medium-high frequency or ultra-high frequency (such as not lower than 250 Hz) and the like are needed to be solved.
Disclosure of Invention
The invention provides silver-coated copper powder and application thereof, wherein the silver-coated copper powder has good conductivity and usability, and can effectively overcome the defects in the prior art.
In one aspect of the invention, a silver-coated copper powder is provided, which comprises flaky copper powder and a silver layer existing on the surface of the flaky copper powder, wherein the diameter-thickness ratio of the flaky copper powder is 35:1-200:1.
According to an embodiment of the present invention, the longest diameter of the copper flake is 1 μm to 20 μm, and/or the thickness of the copper flake is 0.005 μm to 0.57 μm.
According to one embodiment of the present invention, the flake copper powder has a loose loading ratio of 0.6g/cm 3 ～1.8g/cm 3 。
According to one embodiment of the invention, the copper flake powder is a single sheet or a layered structure formed by stacking multiple single sheets.
According to an embodiment of the present invention, the copper flake powder is in a scaly or imbricated form.
According to one embodiment of the invention, the mass of the silver layer is 3% -65% of the mass of the silver-coated copper powder.
In another aspect of the present invention, a conductive structure is provided, including the silver-coated copper powder described above.
In still another aspect of the present invention, there is provided a conductive material for electromagnetic shielding, comprising the above silver-coated copper powder.
In still another aspect of the present invention, a low temperature curing conductive paste is provided, comprising the silver-coated copper powder described above.
According to an embodiment of the present invention, the low-temperature-curable conductive paste further includes a resin material, wherein the resin material includes one or more of epoxy resin, TPU resin, PU resin, silicone rubber, and ternary vinyl chloride-vinyl acetate resin.
The silver-coated copper powder provided by the invention is a silver-coated copper powder with a large diameter-thickness ratio, a silver layer (or called silver coating layer) exists on the surface of the copper powder, wherein the copper powder is sheet copper powder, and the diameter-thickness ratio is 35:1-200:1, so that the silver-coated copper powder has good conductivity and usability, the conductivity and electromagnetic shielding performance of materials such as a conductive film formed by adopting the silver-coated copper powder can be improved, and the electromagnetic shielding efficiency of the silver-coated copper powder under the impact of medium-high frequency or ultrahigh frequency electromagnetic waves can be especially improved.
The silver-coated copper powder provided by the invention is widely applied, and can be used for manufacturing products such as conductive paint, conductive adhesive, low-temperature curing conductive paste (such as low-temperature curing conductive paste for HJT batteries or RFID radio frequency identification tag wires, conductive ink and the like), conductive films (such as conductive films or electromagnetic shielding films for electromagnetic shielding and the like), conductive circuits (such as fine-grid coarse-grid wires for HJT batteries, RFID radio frequency identification tag wires) and the like.
In addition, the laminated structure (such as a conductive film, a conductive wire and the like) formed by the silver-coated copper powder and the organic matters such as resin and the like has the characteristics of good appearance and the like (the silver-coated copper powder can exist in the laminated structure such as the conductive film and the like in a laminated mode in a linear and relatively regular mode), and the performances such as the conductive performance and the electromagnetic shielding performance of the formed laminated structure can be improved.
In addition, the silver-coated copper powder can provide space for compound spherical or fibrous powder (such as pure gold powder, silver-coated copper powder or other high-conductivity powder and the like), so that the filling rate and the contact surface are improved, and the silver-coated copper powder is mixed with the spherical or fibrous powder to form the conductive material with higher filling rate, higher compactness and larger contact area between substances, so that the performances of conductivity, electromagnetic shielding and the like are improved.
In addition, the silver-coated copper powder provided by the invention is suitable for forming structures such as a conductive film and a conductive circuit (especially an ultrathin conductive film or a conductive circuit) in a screen printing mode and the like, realizes an ultrafine line width, has good characteristic of being suitable for high-speed printing, improves the screen printing speed, and improves the performance and the manufacturing yield of the formed structures such as the conductive film and the conductive circuit.
Drawings
Fig. 1 is an SEM image of the multilayer flake copper powder of example 1 (SEM images at different magnifications for a and B of fig. 1, respectively);
fig. 2 is an SEM image of single-layered copper flake powder of example 10 (SEM images at different magnifications for a and B of fig. 2, respectively);
fig. 3 is a cross-sectional SEM image of the conductive lines of experimental example 1;
fig. 4 is a cross-sectional SEM image of the electromagnetic shielding film of experimental example 11.
Detailed Description
The present invention will be described in further detail below for the purpose of better understanding of the aspects of the present invention by those skilled in the art. The following detailed description is merely illustrative of the principles and features of the present invention, and examples are set forth for the purpose of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be made by those skilled in the art based on the examples of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention provides silver-coated copper powder, which comprises flaky copper powder and a silver layer existing on the surface of the flaky copper powder, wherein the diameter-thickness ratio of the flaky copper powder is 35:1-200:1.
Illustratively, the flake copper powder may have a ratio of thicknesses ranging from 35:1, 40:1, 45:1, 50:1, 55:1, 60:1, 65:1, 70:1, 75:1, 80:1, 85:1, 90:1, 95:1, 100:1, 120:1, 150:1, 180:1, 200:1, or any two of these.
Specifically, the flake copper powder is in the form of particles, and the aspect ratio of the flake copper powder is the ratio of the longest diameter (i.e., the length of the longest portion) of the flake copper powder particles to the thickness of the particles, and may be referred to as the aspect ratio.
In some embodiments, the longest diameter of the copper flake may be 1 μm to 20 μm, for example, 1 μm, 3 μm, 4 μm, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm or any two of them, and preferably the longest diameter of the copper flake is 5 μm to 10 μm, and further, it is studied that too large or too small a longest diameter of the copper flake affects the properties such as conductivity and electromagnetic shielding property of a film formed by using the copper silver-coated powder, and is disadvantageous in terms of film formation, especially in terms of screen printing process, for example, when the longest diameter of the copper flake is too large, a large mesh number and a large blade inclination angle and a large blade squeegee hardness are required in screen printing, printing conditions are severe, and the increase in the consumption of the low-temperature curable conductive paste is disadvantageous in terms of industrial production, and the printing speed is slow, and the line width is large, and is disadvantageous in terms of forming the ultra-fine line width. Therefore, controlling the longest diameter of the flake copper powder within the above range is advantageous for further improving the properties such as conductivity and usability of the silver-coated copper powder.
Specifically, the flake copper powder (particles) may be in the form of a flake, which may be in the form of a regular or irregular flake, or may be in the form of a single flake (or in the form of a single-layer flake copper powder, i.e., the flake copper powder has a single-layer structure), or may be in the form of a layered structure in which a plurality of layers are stacked (i.e., the flake copper powder has a multi-layer structure), for example, in the form of a tile or a fish scale, which is stacked from a single layer, or may include a single-layer copper powder and/or a stacked copper powder (or a multi-layer copper powder), for example, in the form of a tile or a fish scale, which is stacked from a plurality of layers, and the stacked copper powder may further improve the properties such as conductivity and electromagnetic shielding property of the silver-coated copper powder.
Illustratively, in the above-mentioned stacked copper powder formed by stacking multiple monolithic sheets, each monolithic sheet has a first portion and a second portion, respectively, the first portions of two adjacent monolithic sheets are connected (i.e., the first portion of one monolithic sheet is connected to the first portion of the other monolithic sheet) so that the two adjacent monolithic sheets are fixed together, and a gap may exist between the second portions of the two adjacent monolithic sheets (i.e., a gap exists between the second portion of one monolithic sheet and the second portion of the other monolithic sheet), or may be at least partially contacted, and the second portions of the two monolithic sheets may not be flush or have other regular or irregular shapes, thereby forming a fish scale-shaped or imbricated stacked copper powder (as shown in fig. 1).
Specifically, the flake copper powder is an ultrathin flake copper powder, for example, an ultrathin stacked copper powder. In some embodiments, the thickness of the copper flake powder may be in the range of 0.005 μm to 1 μm, such as 0.005 μm, 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1 μm, or any two of these, such as 0.005 μm to 0.57 μm.
The flake copper powder may have a bulk ratio (or bulk density) of 0.6g/cm 3 ～1.8g/cm 3 For example 0.6g/cm 3 、0.8g/cm 3 、1g/cm 3 、1.2g/cm 3 、1.5g/cm 3 、1.8g/cm 3 Or a range of any two of these. In specific implementation, the apparent density of the flaky copper powder can be measured by the national standard GB/T1479.1-2011.
Specifically, the flake copper powder can be prepared by adopting a mode that copper powder raw materials are based on a high shear force and extrusion principle and the like, for example, a three-roller grinder and other conventional high-energy high-speed shear force equipment in the field are adopted, and the copper powder raw materials are subjected to grinding and other treatments to prepare the flake copper powder.
The shapes of the copper powder raw materials used can comprise one or more of dendritic, flaky, spheroid, spherical, fibrous, amorphous (irregular) and the like, namely, the copper powder raw materials used can comprise one or more of dendritic copper powder raw materials, flaky copper powder raw materials, spheroid copper powder raw materials, spherical copper powder raw materials, fibrous copper powder (namely copper fibers) and amorphous copper powder raw materials, but the shape of the copper powder raw materials used can also comprise other regular or irregular shapes.
The copper powder raw material may be micro-nano-sized, and the flake copper powder raw material may include micro-nano-sized flake copper powder, for example, and the copper fiber may include chopped copper fiber having a fiber diameter of less than 0.2 μm, for example.
The above copper powder raw material may be prepared by a method conventional in the art, for example, by electrolytic method, chemical method (such as chemical reduction method, etc.), vacuum spray method, etc., and the above dendritic copper powder raw material may include dendritic electrolytic copper powder prepared by electrolytic method, the above flake copper powder raw material may be prepared by chemical reduction method, the above spherical copper powder raw material may be prepared by vacuum spray method, and the above copper fiber may be prepared by chemical method, but is not limited thereto.
In some embodiments, the preparation process of the flaky copper powder may include: copper powder raw material is ground in an inert gas atmosphere and/or in the presence of an antioxidant, for example, using a three-roll mill or similar high energy high speed shearing device, to produce flake copper powder.
Wherein the inert gas comprises, for example, nitrogen and/or helium and the like.
The antioxidants may include, among other things, strongly reducing chemicals, including, for example, formaldehyde and/or hydrazine hydrate, and the like.
Further, the copper powder raw material may be ground in the presence of a dispersant, for example, a mixture containing the copper powder raw material and the dispersant may be ground as described above to obtain flake copper powder. The copper powder raw material is dispersed by the dispersing agent, so that the preparation efficiency of the flaky copper powder and the performance of the prepared flaky copper powder can be further improved.
The dispersing agent used may include one or more of honey, palmitic acid wax, triethanolamine, etc., but is not limited thereto.
Illustratively, the process for preparing the flake copper powder may include: mixing copper powder raw materials with a dispersing agent to obtain a mixture; and grinding the mixture in an inert gas protection atmosphere to obtain the flaky copper powder.
Alternatively, the mixture may further include an antioxidant, and the preparation process of the flake copper powder may include: mixing copper powder raw materials, an antioxidant and a dispersing agent to obtain a mixture; the mixture is then ground, specifically with or without inert gas, to produce copper flake powder.
In the silver-coated copper powder, the silver layer exists on the surface of the flaky copper powder, and can be coated with the flaky copper powder. In some embodiments, the silver layer is 3% -65% by mass of the silver-coated copper powder, i.e., the silver content in the silver-coated copper powder is 3% -65% by mass, e.g., 3%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65% or any two of these ranges, which can improve the conductivity and other properties of the silver-coated copper powder while avoiding excessive increases in the cost of the silver content.
In the embodiment of the invention, the silver layer can be formed on the surface of the flaky copper powder by the conventional methods in the field such as chemical plating or ultra-micro plating, and the silver-coated copper powder can be prepared.
The electroless plating method is exemplified by, for example, a method of uniformly coating silver on a copper surface based on a substitution method in a liquid phase, a method of coating silver in a plating solution containing a reducing agent, and the like, wherein the method of coating silver on a copper surface based on a substitution method may specifically include: adding flaky copper powder into a silver ion-containing solution, and forming a silver layer on the surface of the flaky copper powder through the replacement reaction of the flaky copper powder and silver ions to prepare silver-coated copper powder; the method of coating silver in a plating solution containing a reducing agent may specifically include: the method comprises the steps of enabling flaky copper powder to react with silver sources such as silver ammonia complexing solution and the like, enabling the surface of the copper powder to adsorb a certain amount of silver ions, then injecting a liquid phase containing a reducing agent, coating a layer of compact and uniform silver simple substance on the surface of the copper powder to form a silver layer, and generally carrying out the reaction in the liquid phase under the protection of inert gas, so that the extremely low oxygen content of the silver layer formed on the surface of the flaky copper powder is ensured, and the silver-coated copper powder with excellent performance is obtained.
In general, after silver plating is performed on the surface of the flake copper powder by the above-mentioned chemical plating or ultra-micro plating, the obtained flake copper powder after silver plating may be dried in a reducing atmosphere to obtain silver-coated copper powder.
The conductive structure provided by the embodiment of the invention comprises the silver-coated copper powder, and the conductive structure can be a laminated structure or a strip structure, such as a conductive film, but is not limited to the laminated structure or the strip structure, and can be other regular or irregular structures.
The volume resistivity of the conductive structure can be lower than 120×10 -5 Omega cm or less than 110X 10 -5 Omega cm or less than 6X 10 -5 Omega cm or less than 1X 10 -5 Omega cm, which has good electrical conductivity, electromagnetic shielding, and good weather resistance and resistanceWeldability and other properties, and has wide application range.
In addition, according to the research of the inventor, the silver-coated copper powder can be used for preparing ultrathin (such as a structure as thin as 5-30 mu m and even 5-20 mu m) conductive films/conductive circuits and the like, can improve the conductive performance, electromagnetic shielding performance and the like of the conductive films/conductive circuits and the like, and can be applied to thin-grid thick-grid wires of HJT photovoltaic solar cells and/or RFID radio frequency identification tag wires, electromagnetic shielding films of flexible printed circuit boards (FPCs) serving as electronic products such as smart phones, automobiles and the like.
The thickness of the above-described conductive structure may be, for example, 5 to 30 μm, for example, 5 μm, 8 μm, 10 μm, 13 μm, 15 μm, 18 μm, 20 μm, 23 μm, 25 μm, 28 μm, 30 μm, or a range of any two of them.
The conductive material for electromagnetic shielding provided by the embodiment of the invention comprises the silver-coated copper powder, and the conductive material for battery shielding, such as the electromagnetic shielding film, can be applied to electronic products such as mobile phones, automobiles and the like, has good electromagnetic shielding performance, and can still keep good electromagnetic shielding performance even under the impact of electromagnetic waves with medium-high frequency or ultra-high frequency (not lower than 250 Hz).
In general, the above-mentioned conductive structure (such as a conductive film/conductive line) may further include an organic material, which includes, for example, a resin material, and the resin material may specifically include one or more of epoxy resin, TPU resin, PU resin, silicone rubber, and trichloroethylene vinyl acetate resin, wherein the epoxy resin may include an unmodified epoxy resin and/or a modified epoxy resin modified for the purpose of toughening or increasing elasticity, etc.
Specifically, the conductive structure may be formed by curing a mixed system (hereinafter referred to as conductive silver paste) containing silver-coated copper powder, an organic material, a curing agent, a solvent, and the like, and specifically, the mixed system may be applied to a wet film by screen printing or the like, and then cured to form the conductive film or the like.
The curing temperature may be specifically 130 to 200 ℃, for example 130 ℃, 140 ℃, 150 ℃, 160 ℃, 170 ℃, 180 ℃, 190 ℃, 200 ℃ or any two thereof, and the curing time may be 30 to 45 minutes, for example 30 minutes, 33 minutes, 35 minutes, 38 minutes, 40 minutes, 42 minutes, 45 minutes or any two thereof.
The low-temperature curing conductive paste provided by the embodiment of the invention comprises the silver-coated copper powder, and can be used for forming the conductive structure in a printing or coating mode, such as screen printing, for example, forming the conductive film/electromagnetic shielding film and the like, and has good characteristics suitable for high-speed printing, so that superfine line width can be realized, screen printing speed can be improved, and performance and manufacturing yield of the formed conductive structure such as the conductive film and the like can be improved.
Specifically, the low-temperature-curable conductive paste may further include a resin material including one or more of epoxy resin, TPU resin (i.e., thermoplastic Polyurethane (Thermoplastic polyurethanes)), PU resin (i.e., polyurethane resin), rubber, and trichloroethylene vinyl acetate resin. The resin material is exemplified by, but not limited to, an epoxy resin, or a TPU resin, or a mixture of an epoxy resin and a PU resin, or a mixture of an epoxy resin and a rubber, or a ternary vinyl chloride-vinyl acetate resin, or the like.
The low-temperature curing conductive paste is in a paste form, and generally further includes a solvent, and the solvent may include an organic solvent, for example, an ester solvent and/or an ether solvent, such as one or more of diethylene glycol butyl ether acetate, diethylene glycol butyl ether, alcohol ester twelve, terpineol, ethylene glycol phenyl ether, diethylene glycol diethyl ether, and dimethyl adipate, but not limited thereto.
In addition, the low-temperature curing conductive paste can further comprise a curing agent so as to form the conductive structure and other products through curing. The curing agent used may be any curing agent conventional in the art, including, for example, imidazole-based curing agents, such as, but not limited to, one or more of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole and 2-phenylimidazole.
In some embodiments, in the low-temperature cured conductive paste, the mass ratio of the silver-coated copper powder to the resin material may be 1: (0.125-8), such as 1:0.125, 1:0.13, 1:0.135, 1:0.14, 1:0.145, 1:0.15, 1:0.155, 1:0.16, 1:0.2, 1:0.5, 1:1, 1:2, 1:3, 1:4, 1:5, 1:6, 1:7, 1:8, or any two of these.
In addition, in the low-temperature curing conductive paste, the mass ratio of the silver-coated copper powder to the curing agent may be 1: (0.0125-0.35), for example, 1:0.0125, 1:0.013, 1:0.0135, 1:0.014, 1:0.0145, 1:0.015, 1:0.0155, 1:0.016, 1:0.02, 1:0.05, 1:0.1, 1:0.15, 1:0.2, 1:0.25, 1:0.3, 1:0.35 or any two thereof.
The low-temperature curing conductive paste may be cured to form a film, and the curing temperature may be in a range of 150 to 250 ℃, such as 150 ℃, 180 ℃, 200 ℃, 230 ℃, 250 ℃, or any two thereof, and the curing time may be in a range of 30 to 45 minutes, such as 30 minutes, 33 minutes, 35 minutes, 38 minutes, 40 minutes, 42 minutes, 45 minutes, or any two thereof.
In specific implementation, the low-temperature curing conductive paste can be formed into a wet film by screen printing, extrusion coating or other modes, and then the wet film is cured to form a dry film structure such as a conductive film.
The low-temperature cured conductive paste may be a paste, specifically, a low-temperature cured conductive paste for HJT cells (heterojunction solar photovoltaic cells) for preparing HJT cells, or a low-temperature cured conductive paste for RFID tag wires and other high-conductivity lines, or a conductive ink, but is not limited thereto.
For the purpose of promoting an understanding of the principles of the invention, reference will now be made in detail to specific examples, some but not all of which are illustrated in the accompanying drawings. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
1. Silver coated copper powder
In the following examples, the relevant parameters of the silver-coated copper powder (copper powder structure, aspect ratio of copper powder, thickness, longest diameter, loose loading ratio, and silver mass content in the silver-coated copper powder) are shown in table 1.
The multilayer copper flake powder of example 1 was analyzed by Scanning Electron Microscopy (SEM), and the SEM images obtained were shown in fig. 1 (SEM images at different magnifications for a and B of fig. 1, respectively), and SEM images of the multilayer copper flake powder used in examples 1 to 8 were similar to example 1.
SEM images of the single-layered copper flake powder of example 10 are shown in fig. 2 (SEM images at different magnifications for a and B of fig. 2, respectively).
TABLE 1 parameters relating to silver-coated copper powder
2. Low-temperature curing conductive paste
2-1 conductive film conductivity test
Using the silver-coated copper powders of examples 1 to 10 and comparative example 1, respectively, experimental examples 1 to 10 and comparative experimental example 1 were carried out according to the following procedures, and the silver-coated copper powders (corresponding examples and comparative examples) used in the respective experimental examples are shown in Table 2:
s2-1a, preparing silver-coated copper powder into low-temperature curing conductive slurry; the low-temperature curing conductive paste comprises the silver-coated copper powder, epoxy resin, 2-methylimidazole and diethylene glycol butyl ether acetate, wherein the mass ratio of the silver-coated copper powder to the epoxy resin to the 2-methylimidazole is 1: (0.16): (0.016).
S2-1b, printing the conductive silver paste into a conductive film (namely a conductive line with the thickness shown in Table 2) by a screen printing mode, wherein the specific process comprises the following steps: the conductive silver paste is firstly screen printed into wet lines with the thickness of 25 micrometers by a screen printer, and then cured for 30 minutes at 200 ℃ to obtain conductive lines (dry films).
Wherein, the model of the screen printer is MPM-UP2000; in the screen printing process, the printing speeds of experimental examples 1 to 9 were 15 m/s, the inclination angle of the squeegee was 60 °, and the Shore hardness of the squeegee blade was 80, respectively. The printing speed of experimental example 10 was 10 m/s, the squeegee inclination angle was 75 °, the shore hardness of squeegee blade scraping was required to be 120 to 200, and the screen printing line widths of examples 1 to 9 were smaller than that of example 10. Examples 1 to 10 and comparative experiment 1 were each printed with different mesh numbers of screen plates so that the screen printing process was smoothly performed, the mesh numbers of the screen plates used were all 50 mesh to 200 mesh, and the larger the longest diameter of copper powder in the silver-coated copper powder was, the smaller the mesh number of the screen plate used was.
Specifically, compared with the experimental example 10, the experimental examples 1 to 9 can form continuous conductive lines at a larger printing speed, have narrower line widths, and realize ultra-fine line widths. In addition, when the printing parameters of the experimental examples 1 to 9 (the inclination angle of the squeegee is 60 °, the mohs hardness of the squeegee is 80) were used for the experimental example 10, the continuous conductive line could not be formed, the experimental example 10 required a larger inclination angle, and had a higher requirement for the hardness of the squeegee, and thus had a higher requirement for the screen plate and the like in the screen printing process. This demonstrates that the silver-coated copper powders of examples 1-9 have relatively better properties for high-speed printing.
In addition, according to SEM analysis, the silver-coated copper powder in the conductive lines of examples 1 to 8 can be formed into a linear shape and exist in a more regular lamination manner, and has a better lamination structure, and particularly examples 1 to 2 and examples 5 to 8 have a more excellent lamination structure, compared with examples 9 to 10. Taking experiment example 1 as an example, the SEM image of the cross section of the conductive line of experiment example 1 is shown in fig. 3, and it can be seen that the silver-coated copper powder forms a line shape (white line in fig. 3) which is distributed in the conductive line in a relatively regular lamination manner, so that the conductive line has a good lamination structure.
In addition, compared with the experimental examples 1 to 10, the printing speed of the comparative experimental example 1 is reduced, the inclination angle of the scraping plate is 60 degrees, the Shore hardness of scraping glue of the scraping plate is 80, the formed conductive line has serious burr phenomenon, good lamination type micro-morphology characteristics cannot be formed, and the screen printing characteristic is poor.
The volume resistivity of the conductive lines of each experimental example was also measured and is shown in table 2.
TABLE 2 volume resistivity of conductive lines
Electromagnetic shielding performance test of 2-2 electromagnetic shielding film
The following experimental examples 11 to 21 and comparative experimental example 2 were carried out using the silver-coated copper powders of examples 1 to 10, respectively, according to the following procedure, and the silver-coated copper powders (corresponding examples and comparative examples) used in the respective experimental examples are shown in table 3:
s2-2a, preparing silver-coated copper powder into conductive ink; wherein, the conductive ink comprises the silver-coated copper powder, epoxy resin, 2-methylimidazole and diethylene glycol butyl ether acetate, and the mass ratio of the silver-coated copper powder to the epoxy resin to the 2-methylimidazole is 10:80:3.5.
s2-2b, according to the process of S2-1b, the conductive ink is coated on a base material (high borosilicate glass) in a extrusion coating mode, and is cured at 180 ℃ to form an electromagnetic shielding film, wherein the thickness of the electromagnetic shielding film is shown in Table 3.
In addition, according to SEM analysis, the silver-coated copper powder in the electromagnetic shielding films of examples 11 to 19 can be formed in a linear shape and exist in a more regular lamination manner, and have a better lamination structure, and particularly examples 11 to 12 and examples 16 to 19 have a more excellent lamination structure, compared with examples 20 to 21. For example, as shown in fig. 4, the SEM image of the cross section of the electromagnetic shielding film of experimental example 11 shows that the silver-coated copper powder forms a stripe shape (white stripe in fig. 4) which is distributed in a thin film in a relatively regular lamination manner, so that the thin film has a good lamination structure to obtain good electrical conductivity and electromagnetic shielding performance.
The electromagnetic shielding performance of the above electromagnetic shielding film was tested using an electromagnetic wave having a frequency of 1GHz, and the results are shown in table 3.
TABLE 3 electromagnetic shielding property test results
The results show that parameters such as the structure, the diameter-to-thickness ratio, the longest diameter, the silver content in the silver-coated copper powder and the like of the copper powder influence the conductivity and the electromagnetic shielding performance of the silver-coated copper powder.
Specifically, the higher the silver content in the silver-coated copper powder, the lower the volume resistivity thereof, and the better the conductivity and electromagnetic shielding properties (as shown in example 1 and example 2) are exhibited.
Specifically, the diameter-thickness ratio of copper powder in the silver-coated copper powder is in the range of 10:1-200:1, the longest diameter is in the range of 1-20 μm, the thickness is in the range of 0.1-1 μm, and the loose ratio is 0.6g/cm 3 ～1.8g/cm 3 In the range of (2), the silver-coated copper powder has good electric conductivity and electromagnetic shielding performance, and particularly when the diameter-thickness ratio of copper powder in the silver-coated copper powder is in the range of 40:1-100:1 and the longest diameter is about 7 mu m (5-10 mu m), the silver-coated copper powder has more excellent electric conductivity and electromagnetic shielding performance.
In particular, the copper powder of the multilayer flake structure (fish scale or imbricate) can remarkably improve the performances such as conductivity and electromagnetic shielding property of the silver-coated copper powder, compared with the flake copper powder of the single-layer structure.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (10)
1. The silver-coated copper powder is characterized by comprising flaky copper powder and a silver coating layer existing on the surface of the flaky copper powder, wherein the diameter-thickness ratio of the flaky copper powder is 35:1-200:1.
2. Silver-coated copper powder according to claim 1, characterized in that the longest diameter of the flake copper powder is 1 μm to 20 μm and/or the thickness of the flake copper powder is 0.005 μm to 0.57 μm.
3. The silver-coated copper powder according to claim 1 or 2, wherein the flake copper powder has a loose loading ratio of 0.6g/cm 3 ～1.8g/cm 3 。
4. The silver-coated copper powder according to claim 1, wherein the flake copper powder is a single sheet or a layered structure formed by stacking a plurality of single sheets.
5. The silver-coated copper powder according to claim 1 or 4, wherein the flake-like copper powder is scaly or imbricated.
6. The silver-coated copper powder according to claim 1, wherein the mass of the silver layer is 3 to 65% of the mass of the silver-coated copper powder.
7. An electrically conductive structure comprising the silver-coated copper powder of any one of claims 1-6.
8. An electroconductive material for electromagnetic shielding, characterized by comprising the silver-coated copper powder according to any one of claims 1 to 6.
9. A low temperature cured conductive paste comprising the silver-coated copper powder of any one of claims 1-6.
10. The low temperature-curable conductive paste according to claim 9, further comprising a resin material including one or more of epoxy resin, TPU resin, PU resin, silicone rubber, and ternary vinyl chloride-vinyl acetate resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310128258.9A CN116117136A (en) | 2023-02-16 | 2023-02-16 | Silver-coated copper powder and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310128258.9A CN116117136A (en) | 2023-02-16 | 2023-02-16 | Silver-coated copper powder and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116117136A true CN116117136A (en) | 2023-05-16 |
Family
ID=86308016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310128258.9A Pending CN116117136A (en) | 2023-02-16 | 2023-02-16 | Silver-coated copper powder and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116117136A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105149575A (en) * | 2015-10-23 | 2015-12-16 | 乐山新天源太阳能科技有限公司 | Preparation method of silver coated copper powder |
| CN107708893A (en) * | 2015-05-15 | 2018-02-16 | 住友金属矿山株式会社 | Cover silver-bearing copper powder and using its copper cream, conductive coating paint, conductive sheet and the manufacture method for covering silver-bearing copper powder |
| JP2020033610A (en) * | 2018-08-30 | 2020-03-05 | Ｄｏｗａエレクトロニクス株式会社 | Cleaning method for silver-coated metal powder, producing method for silver-coated metal powder, silver-coated copper powder, silver-coated copper alloy powder, conductive paste and production method for conductive film, electronic component, and electronic apparatus |
| CN111318689A (en) * | 2020-04-20 | 2020-06-23 | 沈阳工业大学 | Silver-coated copper powder with shell-core structure and preparation method and application thereof |
| CN111360246A (en) * | 2020-04-24 | 2020-07-03 | 刘勤华 | Silver-coated copper powder with high coating rate and excellent quality and preparation method thereof |
| WO2022044676A1 (en) * | 2020-08-26 | 2022-03-03 | 三井金属鉱業株式会社 | Silver-coated flake-form copper powder, and method for manufacturing same |
| CN115365494A (en) * | 2022-09-13 | 2022-11-22 | 嘉兴学院 | Preparation method of silver-coated copper powder and application of silver-coated copper powder in conductive paste |
-
2023
- 2023-02-16 CN CN202310128258.9A patent/CN116117136A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708893A (en) * | 2015-05-15 | 2018-02-16 | 住友金属矿山株式会社 | Cover silver-bearing copper powder and using its copper cream, conductive coating paint, conductive sheet and the manufacture method for covering silver-bearing copper powder |
| CN105149575A (en) * | 2015-10-23 | 2015-12-16 | 乐山新天源太阳能科技有限公司 | Preparation method of silver coated copper powder |
| JP2020033610A (en) * | 2018-08-30 | 2020-03-05 | Ｄｏｗａエレクトロニクス株式会社 | Cleaning method for silver-coated metal powder, producing method for silver-coated metal powder, silver-coated copper powder, silver-coated copper alloy powder, conductive paste and production method for conductive film, electronic component, and electronic apparatus |
| CN111318689A (en) * | 2020-04-20 | 2020-06-23 | 沈阳工业大学 | Silver-coated copper powder with shell-core structure and preparation method and application thereof |
| CN111360246A (en) * | 2020-04-24 | 2020-07-03 | 刘勤华 | Silver-coated copper powder with high coating rate and excellent quality and preparation method thereof |
| WO2022044676A1 (en) * | 2020-08-26 | 2022-03-03 | 三井金属鉱業株式会社 | Silver-coated flake-form copper powder, and method for manufacturing same |
| CN115365494A (en) * | 2022-09-13 | 2022-11-22 | 嘉兴学院 | Preparation method of silver-coated copper powder and application of silver-coated copper powder in conductive paste |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6410064B2 (en) | Conductive fine particles and conductive sheet | |
| US11202398B2 (en) | Electromagnetic shielding material and method for producing the same | |
| CN111267434B (en) | Heat-conducting electromagnetic shielding material with oriented structure and preparation method thereof | |
| WO2021115067A1 (en) | Composite material with high thermal conductivity and electromagnetic shielding, and preparation method therefor | |
| CN104464883A (en) | Graphene electrocondution slurry with dispersants adsorbed on surface and manufacturing method and application thereof | |
| WO1996024938A1 (en) | Composite conductive powder, conductive paste, method of producing conductive paste, electric circuit and method of fabricating electric circuit | |
| JP2007224191A (en) | Electroconductive paste composition, solar battery cell using the paste composition, and solar battery module using the cell | |
| CN101641210A (en) | Shielding and apparatus and method thereof based on metallic nanoparticle compositions | |
| CN108541204A (en) | High shielding slimming emi shielding film of combined type and preparation method thereof | |
| CN113707362A (en) | High-conductivity copper paste, preparation method, flexible high-conductivity copper film and application thereof | |
| CN116195007A (en) | Conductive composite material | |
| KR20170131930A (en) | Composition and composite sheet for dissipating heat and shielding emi | |
| JP5859823B2 (en) | Heat curable conductive paste composition | |
| CN102378482A (en) | Circuit board substrate and manufacturing method thereof | |
| KR102310824B1 (en) | Silver powder | |
| JP2010083952A (en) | Conductive ink composition and solar cell module formed using the same | |
| CN116117136A (en) | Silver-coated copper powder and application thereof | |
| CN116705421A (en) | Silver composite conductive particles and preparation method and application thereof | |
| CN205030030U (en) | Ultra -thin nanometer thermal film material | |
| JPH0992026A (en) | Complex conductive powder, conductive paste, manufacture of conductive paste, electric circuit, and manufacture of electric circuit | |
| US20230411041A1 (en) | Conductive wire, conductive coil, and conductive device | |
| CN1465075A (en) | Method for producing nanocomposite magnet using atomizing method | |
| CN102387661A (en) | Circuit board substrate and manufacture method thereof | |
| JP2012045470A (en) | Method of manufacturing conductive coating film, and conductive coating film | |
| JPH10188670A (en) | Flat conductive metal powder, its manufacture, and conductive paste with flat conductive metal powder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |