CN116113139B - High-heat-conductivity aluminum-based circuit board and preparation process thereof - Google Patents
High-heat-conductivity aluminum-based circuit board and preparation process thereof Download PDFInfo
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- CN116113139B CN116113139B CN202211490803.0A CN202211490803A CN116113139B CN 116113139 B CN116113139 B CN 116113139B CN 202211490803 A CN202211490803 A CN 202211490803A CN 116113139 B CN116113139 B CN 116113139B
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 184
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 184
- 238000002360 preparation method Methods 0.000 title abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 239000003607 modifier Substances 0.000 claims abstract description 32
- 238000001035 drying Methods 0.000 claims abstract description 22
- 238000012986 modification Methods 0.000 claims abstract description 21
- 230000004048 modification Effects 0.000 claims abstract description 21
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011889 copper foil Substances 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 4
- 239000004411 aluminium Substances 0.000 claims description 28
- 239000011684 sodium molybdate Substances 0.000 claims description 14
- 235000015393 sodium molybdate Nutrition 0.000 claims description 14
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 claims description 14
- KEZYHIPQRGTUDU-UHFFFAOYSA-N 2-[dithiocarboxy(methyl)amino]acetic acid Chemical compound SC(=S)N(C)CC(O)=O KEZYHIPQRGTUDU-UHFFFAOYSA-N 0.000 claims description 13
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 13
- 239000012964 benzotriazole Substances 0.000 claims description 13
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000004381 surface treatment Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- 229940102253 isopropanolamine Drugs 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000012805 post-processing Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 2
- -1 wherein Chemical compound 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 114
- 230000000052 comparative effect Effects 0.000 description 25
- 230000000694 effects Effects 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 8
- 239000012756 surface treatment agent Substances 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 4
- 230000005764 inhibitory process Effects 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The application relates to the field of circuit board processing, and discloses a high-heat-conductivity aluminum-based circuit board and a preparation process thereof, wherein the high-heat-conductivity aluminum-based circuit board comprises an aluminum substrate layer, a heat-conductivity insulating layer and a circuit layer, the aluminum substrate layer is a surface modified aluminum substrate, the heat-conductivity insulating layer is heat-conductivity insulating glue, the circuit layer is copper foil, and the aluminum substrate layer is prepared by the following steps: a1, treating the surface of an aluminum substrate by adopting a surface treating agent, and forming a plurality of micropores on the surface of the aluminum substrate for 5-15min; a2, carrying out surface modification on the aluminum substrate cleaned in the step A1 by adopting a surface modifier for 10-20min; a3, drying the aluminum substrate subjected to surface modification in the step A2 at 110-130 ℃ for 5-15min. The high-heat-conductivity aluminum-based circuit board has good heat conduction performance, improves the heat dissipation performance of the aluminum-based circuit board, and prolongs the service life of the aluminum-based circuit board.
Description
Technical Field
The application relates to the field of circuit board processing, in particular to a high-heat-conductivity aluminum-based circuit board and a preparation process thereof.
Background
The laser projector is an instrument which uses laser beams to transmit pictures, red, green and blue laser is emitted from a shell of the laser projector through a light valve, the three-color laser is projected after being expanded through corresponding optical elements and processing chips in a machine, a circuit board used for connecting various electric element circuits and optical element circuits is arranged in the laser projector, the circuit board generates higher heat along with long-time operation of the laser projector, and the heat is locally concentrated on the circuit board, so that the temperature of the whole circuit board is higher, heat dissipation is difficult to perform, and therefore the circuit board with better heat conducting property is needed, so that the circuit board can dissipate heat in time, and the condition that the circuit board is damaged by high temperature is reduced.
The heat conduction performance of the circuit board mainly depends on the circuit board substrate, and the circuit board substrate commonly adopted at present is mainly divided into two types: the first is an organic resin substrate, and a glass fiber board substrate is conventionally used, so that the heat dissipation efficiency of the glass fiber board substrate is low, and the glass fiber board substrate can only be suitable for electronic equipment with low power; the second type is a metal substrate, and a commonly used metal substrate is generally an aluminum substrate, and compared with a glass fiber board substrate, the aluminum substrate has excellent heat dissipation performance and mechanical property, so that the aluminum substrate is widely applied to circuit board substrates.
The aluminum-based circuit board that conventional adopted is usually formed by aluminum-based layer, heat conduction insulating layer and circuit layer directly through hot pressing technology, and the circuit is connected at the circuit layer, and the produced heat when the device is operated is conducted to the aluminum-based layer through heat conduction insulating layer fast, then is got rid of the heat transfer by aluminum-based layer to realize the heat dissipation to the device, nevertheless when aluminum-based layer, heat conduction insulating layer and circuit layer carry out hot pressing laminating, the space appears easily between aluminum-based layer, heat conduction insulating layer and the circuit layer for the inhomogeneous phenomenon of heat conduction appears in the aluminum-based circuit board that forms, and the produced heat is concentrated in part easily, does not have the method to disperse well, has reduced aluminum-based circuit board's heat conductivility, and the circuit board is damaged easily in long-term use.
Disclosure of Invention
In order to solve the problem that gaps are easy to appear between layers when the aluminum-based circuit board is attached, so that the heat conduction performance of the aluminum-based circuit board is reduced, the application provides the high-heat conduction aluminum-based circuit board and the preparation process thereof.
In a first aspect, the present application provides a high heat conduction aluminum-based circuit board, which adopts the following technical scheme:
the utility model provides a high heat conduction aluminium base circuit board, includes aluminium base board layer, heat conduction insulating layer and the circuit layer that follow supreme setting gradually down, aluminium base board layer is surface modification aluminium base board, heat conduction insulating layer is heat conduction insulating glue, the circuit layer is the copper foil, wherein, aluminium base board layer adopts following step to make:
A1, surface treatment: treating the surface of the aluminum substrate by adopting a surface treating agent to form a plurality of micropores on the surface of the aluminum substrate, wherein the treatment time is 5-15min;
A2, surface modification: carrying out surface modification on the aluminum substrate subjected to surface treatment in the step A1 by adopting a surface modifier for 10-20min;
A3, drying: and (3) drying the aluminum substrate subjected to surface modification in the step A2 at 110-130 ℃ for 5-15min to form the aluminum substrate layer.
Through adopting above-mentioned technical scheme, carry out surface treatment to aluminium base board for aluminium base board forms the micropore of even corruption, the surface modifier of being convenient for adheres to at aluminium base board surface, surface modifier plays the effect of surface modification to aluminium base board, surface modifier is embedded in aluminium base board surface formation's micropore, form the attached membrane at the micropore pore wall that forms, promote aluminium base board and heat conduction insulating glue's bonding effect and attaching effect, make when aluminium base board layer and heat conduction insulating layer are carried out the laminating, be difficult for appearing the void phenomenon between aluminium base board layer and the heat conduction insulating layer, can realize stable laminating, make the heat conduction of aluminium base circuit board that makes, the heat conduction stability is good, and then promote aluminium base circuit board's heat dispersion, promote the life of circuit board.
Preferably, the surface treating agent is composed of the following raw materials in parts by weight: 5-15 parts of sodium metasilicate pentahydrate, 3-8 parts of ammonia water, 2-5 parts of isopropanolamine, 0.5-2.5 parts of sodium molybdate and 60-80 parts of water.
By adopting the technical scheme, the surface treatment is carried out on the aluminum substrate, so that uniformly corroded micropores are formed on the surface of the aluminum substrate, sodium metasilicate pentahydrate plays a role in corroding the surface of the aluminum substrate, sodium molybdate is slightly deposited on the surface of the aluminum substrate, the uniform corrosion inhibition is achieved, ammonia water and isopropanolamine play a role in uniform permeation, and the surface treatment agent of an alkaline system with a better proportion is adopted for treating the surface of the aluminum substrate, so that stable and uniform micropores are formed on the surface of the aluminum substrate, and the stable combination of a follow-up surface modifier on the surface of the aluminum substrate is improved.
Preferably, the mass ratio of the sodium metasilicate pentahydrate to the sodium molybdate is 1: (0.1-0.3).
By adopting the technical scheme, the sodium metasilicate pentahydrate and the sodium molybdate with the optimal proportion can form uniform and stable corrosion micropores on the surface of the aluminum substrate, when the content of the sodium metasilicate pentahydrate is higher, the corroded micropores are uneven, the adhesion of a subsequent surface modifier is not facilitated, and when the content of the sodium molybdate is higher, excessive deposition is easy on the surface of the aluminum substrate, and the surface micro corrosion treatment of the aluminum substrate is not facilitated.
Preferably, the surface roughness Ra of the aluminum substrate treated in the A1 step is 5.5-7.5 μm.
By adopting the technical scheme, the moderate roughness enables the surface modifier to be easy to adhere and combine with the surface of the aluminum substrate, and meanwhile, the laminating stability of the aluminum substrate layer and the heat conduction insulating layer can be improved.
Preferably, the surface modifier consists of the following raw materials in parts by weight: 5-25 parts of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane, 10-20 parts of ethanol, 2.5-5.5 parts of benzotriazole and 58-78 parts of water.
By adopting the technical scheme, the surface modifier formed by the method has good adhesiveness and adhesiveness, so that the surface modifier is easy to attach to the pore walls of the micropores formed by the aluminum base plate, the bonding effect of the aluminum base plate layer and the heat conduction insulating layer is improved, the situation that gaps are generated between the aluminum base plate layer and the heat conduction insulating layer due to unstable bonding is reduced, the heat conduction and heat dissipation performance of the manufactured aluminum base circuit board is further improved, and the working efficiency is improved.
Preferably, the mass ratio of the N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane to the benzotriazole is 1: (0.2-0.5).
By adopting the technical scheme, the N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane is stably attached to the micropore wall of the aluminum substrate, has a crosslinked reticular structure, has good adhesion stability with the heat conduction insulating layer, can reduce the problem that gaps are easy to generate due to unstable adhesion between the formed aluminum substrate layer and the heat conduction insulating layer, is an oily substance, has better adsorption bonding effect with the heat conduction insulating layer of an organic system, can be compatible and permeate into the heat conduction insulating layer of the organic system, improves the bonding property between the aluminum substrate layer and the heat conduction insulating layer, and is favorable for improving the adhesion effect between the aluminum substrate layer and the heat conduction insulating layer by combining the N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane and the benzotriazole in a better proportion.
Preferably, the surface modifier is coated on the inner surface of the circuit layer and then baked at 110-130 ℃ for 10-20min.
By adopting the technical scheme, the surface modifier can improve the adhesion stability of the circuit layer and the heat-conducting insulating layer, and the benzotriazole has a good coordination corrosion inhibition effect on the copper foil, so that a uniform coordination corrosion inhibition film can be formed on the surface of the copper foil, and the combination stability of the circuit layer and the heat-conducting insulating layer can be improved; the aluminum substrate layer subjected to surface modification treatment and the circuit layer subjected to surface modifier coating and baking treatment can be well combined with the heat conduction insulating layer, so that interlayer combination property of the aluminum substrate layer, the heat conduction insulating layer and the circuit layer can be improved, and heat conduction stability of the prepared aluminum substrate circuit board is further improved.
Preferably, the heat conducting insulating layer is heat conducting silica gel.
Through adopting above-mentioned technical scheme, heat conduction silica gel has better heat conduction insulating properties, has better high temperature resistance and leveling simultaneously, can carry out stable adhesion with circuit layer and aluminium base board layer through surface modification, reduces the condition that the space appears between the layers.
In a second aspect, the application provides a preparation process of a high heat conduction aluminum-based circuit board, which adopts the following technical scheme: a preparation process of a high-heat-conductivity aluminum-based circuit board comprises the following steps:
s1, laminating: coating a heat conduction insulating layer on an aluminum substrate layer, attaching a circuit layer on the surface of the heat conduction insulating layer, and attaching to obtain an aluminum-based copper-clad plate;
S2, cutting and drilling: the aluminum-based copper-clad plate prepared in the step S1 is subjected to material cutting, drilling and pretreatment according to the circuit design requirement; s3, forming a circuit diagram: coating photosensitive ink on the aluminum-based copper-clad plate subjected to cutting and drilling in the step S2, wherein the drying temperature is 120-140 ℃, exposing is carried out after drying, developing is carried out after exposing by adopting a developing solution, and the developing solution is sodium carbonate solution with the mass concentration of 0.8-1.2%;
s4, etching to remove the film: etching the aluminum-based copper-clad plate subjected to the development treatment in the step S3 by adopting an etchant, removing photosensitive ink, and then drying and cleaning;
s5, solder mask: carrying out pattern printing on the aluminum-based copper-clad plate from which the photosensitive ink is removed in the step S4, and then drying at 130-150 ℃ to form a solder resist pattern on the surface of the circuit layer;
S6, exposure and development: aligning the solder resist pattern formed on the surface of the circuit layer, exposing, developing by adopting the developing solution, and cleaning and drying;
S7, post-processing: and finally, punching, V-cutting and oxidation preventing treatment are carried out on the formed circuit board by adopting a conventional PCB manufacturing process, so that the high-heat-conductivity aluminum-based circuit board is formed.
Through adopting above-mentioned technical scheme, under specific pressure effect for heat conduction insulating layer, aluminium base sheet layer and circuit layer laminate steadily, form aluminium base copper-clad plate, promoted the laminating stability between aluminium base sheet layer, heat conduction insulating layer and the circuit layer, reduced the condition in space appears easily between aluminium base sheet layer, heat conduction insulating layer and the circuit layer, promoted the heat conduction homogeneity of aluminium base circuit board of formation, and then promoted the heat dispersion of aluminium base circuit board, improved the work efficiency of circuit board, it is not fragile.
And then the formed aluminum-based copper-clad film is processed by a specific process to form a circuit board finished product, wherein a circuit pattern is formed on the circuit layer by a circuit pattern forming process, and then a circuit is formed by an etching film removing process, so that the formed circuit board has good interlayer bonding force, good heat conduction and heat dissipation performance and high working efficiency, and the process is simple in preparation method and convenient to operate.
Preferably, the bonding pressure in the step S1 is 0.1-0.3KPa, and the bonding time is 15-30min.
Through adopting above-mentioned technical scheme for circuit layer, heat conduction insulating layer and aluminium base board layer laminate steadily, be difficult for appearing because laminating unstable and the condition in space appears.
In summary, the application has the following beneficial effects:
1. According to the high-heat-conductivity aluminum-based circuit board, the surface of the aluminum substrate is corroded by adopting the surface treatment agent, so that uniform corrosion micropores are formed on the surface of the aluminum substrate, and then the surface adhesion performance of the aluminum substrate is improved by adopting the surface modification agent, so that the formed aluminum substrate layer and the heat-conducting insulating layer can be stably combined, the occurrence of gaps is reduced, the heat-conducting uniformity of the formed aluminum-based circuit board is improved, the heat dissipation performance of the formed whole aluminum-based circuit board is further improved, and the working efficiency and the service life of the aluminum-based circuit board are improved.
2. The surface modifier is coated on the inner surface of the circuit layer, so that the bonding capability of the circuit layer and the heat conduction insulating layer is further improved, and the interlayer bonding force of the prepared aluminum-based circuit board is good.
3. The preparation process of the high-heat-conductivity aluminum-based circuit board is simple and convenient to operate, and the prepared high-heat-conductivity aluminum-based circuit board has good heat conduction uniformity and heat dissipation.
Detailed Description
The present application will be described in further detail with reference to examples.
The sources and specifications of some of the raw materials of the present application are as follows, see table 1.
TABLE 1 partial raw material sources and specification sheet
Preparation example of aluminum substrate layer
Preparation example 1
The aluminum substrate layer is prepared by the following steps:
A1, surface treatment: mixing and dissolving 0.5kg of sodium metasilicate pentahydrate, 0.3kg of ammonia water, 0.5kg of isopropanolamine, 0.25kg of sodium molybdate and 7kg of water, uniformly stirring to form a surface treating agent, and carrying out surface treatment on an aluminum substrate by adopting the prepared surface treating agent, wherein the specific treatment mode is soaking treatment, the treatment time is 5min, washing and drying are carried out after the surface treatment, and the roughness Ra of the aluminum substrate after the surface treatment is 6.2 mu m;
A2, surface modification: stirring and dissolving 0.5kg of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane, 1.5kg of ethanol and 0.55kg of benzotriazole, uniformly dissolving, adding 7.8kg of water, uniformly stirring to prepare a surface modifier, and carrying out surface modification on the aluminum substrate treated in the step A1 by adopting the prepared surface modifier, wherein the specific surface modification mode is soaking treatment, and the modification time is 10min;
A3, drying: and (3) directly drying the aluminum substrate subjected to surface modification in the step A2 at 110 ℃ for 5min to obtain the aluminum substrate layer.
PREPARATION EXAMPLES 2-3
Preparation examples 2 to 3 differ from preparation example 1 in that the composition raw material ratios of the surface treatment agent and the surface modifier used are different, and the conditions and parameters for surface modification of the aluminum substrate are also different, see in particular table 2 below.
TABLE 2 raw materials and condition parameters tables of preparation examples 1-3
Preparation example 4
Preparation example 4 differs from preparation example 2 in that the ratio of sodium metasilicate pentahydrate and sodium molybdate in the surface treatment agent used in step A1 is different, and in preparation example 4, the amount of sodium metasilicate pentahydrate is 0.8kg, the amount of sodium molybdate is 0.24kg, other conditions and parameters are unchanged, and the roughness Ra of the aluminum substrate treated in step A1 is 6.5 μm.
Preparation example 5
Preparation example 5 differs from preparation example 2 in that the ratio of sodium metasilicate pentahydrate and sodium molybdate in the surface treatment agent used in step A1 is different, and in preparation example 5, the amount of sodium metasilicate pentahydrate is 0.95kg, the amount of sodium molybdate is 0.1kg, other conditions and parameters are unchanged, and the roughness Ra of the aluminum substrate treated in step A1 is 6.7 μm.
Preparation example 6
Preparation example 6 differs from preparation 4 in that the ratio of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane to benzotriazole in the surface modifier used in step A2 was different, and in preparation example 5, the amount of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane was 1.45kg, the amount of benzotriazole was 0.3kg, and the other conditions and parameters were unchanged.
Preparation example 7
Preparation example 7 differs from preparation 4 in that the ratio of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane to benzotriazole in the surface modifier used in step A2 is different, and in preparation example 7, the amount of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane used is 1.17kg, the amount of benzotriazole used is 0.58kg, and other conditions and parameters are unchanged.
Preparation of comparative example 1
The difference between the preparation example 1 and the preparation example 6 is that the sodium molybdate in the surface treatment agent used in the step A1 was replaced with water in equal amount, and the roughness Ra of the aluminum substrate treated in the step A1 was 8.3 μm without changing other conditions and parameters.
Preparation of comparative example 2
The preparation of comparative example 2 differs from that of preparation example 6 in that the equivalent amount of benzotriazole in the surface modifier used in step A2 is replaced with water, and other conditions and parameters are unchanged.
Examples
Example 1
The high-heat-conductivity aluminum-based circuit board is prepared by adopting the following steps:
s1, attaching an aluminum-based copper-clad plate: coating heat conduction silica gel on the aluminum substrate layer prepared in preparation example 1, wherein the heat conduction coefficient of the heat conduction silica gel is 1W/m.K, forming a heat conduction insulating layer, then attaching copper foil on the surface of the heat conduction insulating layer, attaching the circuit layer which is copper foil under the pressure of 0.1KPa for 15min, and preparing the aluminum-based copper-clad plate;
S2, cutting and drilling: the aluminum-based copper-clad plate prepared in the step S1 is subjected to material cutting, drilling and pretreatment according to the circuit design requirement;
s3, forming a circuit diagram: coating photosensitive ink on the aluminum-based copper-clad plate prepared in the step S2, drying at 120 ℃, exposing, and developing by adopting sodium carbonate solution with the mass concentration of 0.8%;
S4, etching to remove the film: etching the aluminum-based copper-clad plate prepared in the step S3 by adopting an etchant, removing photosensitive ink, and then drying and cleaning;
S5, solder mask: adopting solder resist black oil to carry out pattern printing on the aluminum-based copper-clad plate from which the photosensitive ink is removed in the step S4, then drying the aluminum-based copper-clad plate at the temperature of 130 ℃, and forming a solder resist pattern on the surface of the circuit layer after drying;
s6, exposure and development: aligning the solder resist pattern formed by the circuit layer, exposing, developing with a developing solution, and cleaning and drying;
S7, post-processing: and finally, punching, V-cutting and oxidation preventing treatment are carried out on the formed circuit board by adopting a conventional PCB manufacturing process, so that the high-heat-conductivity aluminum-based circuit board is formed.
Examples 2 to 3
Examples 2-3 differ from example 1 in that examples 2-3 differ from example 1 in the source and preparation conditions of the aluminum substrate layers, otherwise identical to example 1, see in particular table 3 below.
Table 3 comparative tables for parameters for the differences of examples 1-3
Example 4
Example 4 differs from example 2 in that the source of the aluminum substrate layer was different, and the aluminum substrate layer produced in production example 4 was used in example 4, and the other is the same as in example 2.
Example 5
Example 5 differs from example 2 in that the source of the aluminum substrate layer was different, and the aluminum substrate layer produced in production example 5 was used in example 5, and the other is the same as in example 2.
Example 6
Example 6 differs from example 2 in that the source of the aluminum substrate layer was different, and the aluminum substrate layer produced in production example 6 was used in example 6, and the other is the same as in example 2.
Example 7
Example 7 differs from example 2 in that the source of the aluminum substrate layer was different, and the aluminum substrate layer produced in production example 7 was used in example 7, and the other is the same as in example 2.
Example 8
Example 8 differs from example 7 in that in example 8, the inner surface of the circuit layer used was also modified with the surface modifier formulated in preparation example 2, specifically by coating the inner surface of the circuit layer with the surface modifier formulated in preparation example 2 and baking at a temperature of 110 to 130 c for 10 to 20min, preferably at a baking temperature of 110 c for 10min in this example, and otherwise as in example 7.
Comparative example
Comparative example 1
Comparative example 1 differs from example 7 in that the source of the aluminum substrate layer in comparative example 1 is different, and the aluminum substrate layer produced in comparative example 1 is used in comparative example 1, and otherwise is the same as in example 7.
Comparative example 2
Comparative example 2 is different from example 7 in that the source of the aluminum substrate layer in comparative example 2 is different, and the aluminum substrate layer prepared in comparative example 2 is used in comparative example 2, otherwise the same as in example 7.
Comparative example 3
Comparative example 3 is different from example 7 in that the aluminum substrate layer used was not subjected to the treatment of the surface modifier in the A2 step, and otherwise is the same as example 7.
Comparative example 4
Comparative example 4 is different from example 7 in that the aluminum substrate layer used was not subjected to the surface treatment agent in the A1 step, and otherwise the same as example 7.
Performance test
The high heat conduction aluminum-based circuit boards prepared in the above examples 1 to 8 and comparative examples 1 to 4 were used for performance test, wherein the specification parameters of the high heat conduction aluminum-based circuit boards were as follows:
Length, width, thickness of 10cm, 5cm, 0.5cm;
1. Thermal conductivity testing
And (3) detecting and recording a result of the thermal conductivity coefficient (unit: W/m.K) of the prepared high-thermal-conductivity aluminum-based circuit board by adopting a thermal conductivity coefficient tester and referring to ASTM D5470-2017 (Standard test method of thermal transfer characteristics of thermal-conductive insulating materials).
2. Interlayer bonding force test
Referring to ASTM-D3330 test method for peel strength, the peel strength (unit: N/mm) between the thermally conductive insulating layer and the aluminum substrate layer of the prepared high thermally conductive aluminum substrate was measured and the result was recorded.
The thermal conductivity and peel strength test data for the high thermal conductivity aluminum-based circuit boards of examples 1-8 and comparative examples 1-4 are shown in table 4 below.
Table 4 Performance test data for examples 1-8 and comparative examples 1-4
As can be seen from the combination of examples 1 to 5 and comparative example 1 and the combination of table 4, when the surface treatment agent prepared by sodium metasilicate pentahydrate and sodium molybdate with a better proportion is used for surface treatment of the surface of the aluminum substrate, uniform corrosion micropores are formed on the surface of the aluminum substrate, and the adhesion and binding force between the formed aluminum substrate layer and the heat conducting insulating layer are improved, so that the heat conduction of the formed circuit board is uniform, the heat accumulation of the circuit board is reduced, and the heat dissipation performance of the circuit board is further improved.
It can be seen from the combination of examples 1 to 3, 4 to 5 and comparative example 2 and the combination of table 4 that when the surface-modified aluminum substrate is surface-modified with the N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane and benzotriazole in a preferable ratio, the adhesion between the aluminum substrate layer and the heat conductive insulating layer can be improved well, uniform and stable adhesion can be realized, the occurrence of voids between the aluminum substrate and the heat conductive insulating layer is reduced, and the interlayer bonding force and heat conductive performance of the formed aluminum substrate are improved well.
It can be seen from the combination of examples 6 to 8 and table 4 that when the surface modifier is used to surface modify the inner surface of the circuit layer, the heat conductive property and interlayer bonding force property of the manufactured aluminum-based circuit board are promoted.
As can be seen from the combination of examples 1 to 8 and comparative examples 3 to 4 and the combination of table 4, when the surface of the aluminum substrate is not modified by the surface modifier or the surface of the aluminum substrate is not treated by the surface modifier, the thermal conductivity and interlayer bonding force of the prepared aluminum substrate are obviously lower, which indicates that the thermal conductivity and interlayer bonding force of the aluminum substrate can be effectively improved by sequentially treating the aluminum substrate by the surface modifier and modifying the aluminum substrate by the surface modifier.
The present embodiment is only for explanation of the present application and is not to be construed as limiting the present application, and modifications to the present embodiment, which may not creatively contribute to the present application as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present application.
Claims (8)
1. The utility model provides a high heat conduction aluminium base circuit board which characterized in that: including aluminium base board layer, heat conduction insulating layer and the circuit layer that follow supreme setting gradually down, aluminium base board layer is surface modification aluminium base board, heat conduction insulating layer is heat conduction insulating glue, the circuit layer is the copper foil, wherein, aluminium base board layer adopts following step to make:
A1, surface treatment: treating the surface of the aluminum substrate by adopting a surface treating agent to form a plurality of micropores on the surface of the aluminum substrate, wherein the treatment time is 5-15min;
A2, surface modification: carrying out surface modification on the aluminum substrate treated in the step A1 by adopting a surface modifier for 10-20min;
a3, drying: drying the aluminum substrate subjected to surface modification in the step A2 at 110-130 ℃ for 5-15min to form an aluminum substrate layer;
The surface treating agent consists of the following raw materials in parts by weight: 5-15 parts of sodium metasilicate pentahydrate, 3-8 parts of ammonia water, 2-5 parts of isopropanolamine, 0.5-2.5 parts of sodium molybdate and 60-80 parts of water;
the surface modifier consists of the following raw materials in parts by weight: 5-25 parts of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane, 10-20 parts of ethanol, 2.5-5.5 parts of benzotriazole and 58-78 parts of water.
2. The high thermal conductivity aluminum-based circuit board of claim 1, wherein: the mass ratio of the sodium metasilicate pentahydrate to the sodium molybdate is 1: (0.1-0.3).
3. The high thermal conductivity aluminum-based circuit board of claim 1, wherein: the surface roughness Ra of the aluminum substrate treated in the A1 step is 5.5-7.5 mu m.
4. The high thermal conductivity aluminum-based circuit board of claim 1, wherein: the mass ratio of the N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane to the benzotriazole is 1: (0.2-0.5).
5. The high thermal conductivity aluminum-based circuit board of claim 1, wherein: and (3) coating the surface modifier on the inner surface of the circuit layer, and then baking at 110-130 ℃ for 10-20min.
6. The high thermal conductivity aluminum-based circuit board according to any one of claims 1-5, wherein: the heat-conducting insulating layer is heat-conducting silica gel.
7. A process for preparing a high thermal conductivity aluminum-based circuit board according to any one of claims 1 to 6, wherein: the method comprises the following steps:
s1, laminating: coating a heat conduction insulating layer on an aluminum substrate layer, attaching a circuit layer on the surface of the heat conduction insulating layer, and attaching to obtain an aluminum-based copper-clad plate;
S2, cutting and drilling: the aluminum-based copper-clad plate prepared in the step S1 is subjected to material cutting, drilling and pretreatment according to the circuit design requirement;
s3, forming a circuit diagram: coating photosensitive ink on the aluminum-based copper-clad plate subjected to the material cutting and drilling treatment in the step S2, drying, exposing at 120-140 ℃, and developing by adopting a developing solution after exposure, wherein the developing solution is sodium carbonate solution with the mass concentration of 0.8-1.2%;
s4, etching to remove the film: etching the aluminum-based copper-clad plate subjected to the development treatment in the step S3 by adopting an etchant, removing photosensitive ink, and then drying and cleaning;
S5, solder mask: adopting a solder resist black oil to carry out pattern printing on the aluminum-based copper-clad plate from which the photosensitive ink is removed in the step S4, and then drying the aluminum-based copper-clad plate at 130-150 ℃ to form a solder resist pattern on the surface of the circuit layer;
s6, exposure and development: aligning the solder resist pattern formed by the circuit layer, exposing, developing by adopting the developing solution, and cleaning and drying;
S7, post-processing: and finally, punching, V-cutting and oxidation preventing treatment are carried out on the formed circuit board by adopting a conventional PCB manufacturing process, so that the high-heat-conductivity aluminum-based circuit board is formed.
8. The process for preparing the high-heat-conductivity aluminum-based circuit board according to claim 7, wherein the process comprises the following steps: the bonding pressure in the step S1 is 0.1-0.3 KPa, and the bonding time is 15-30min.
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| CN104928749A (en) * | 2014-03-17 | 2015-09-23 | 柯惠兰 | Method for forming protective coating layer on surface of magnesium alloy and protective coating layer thereof |
| CN105792505A (en) * | 2016-03-25 | 2016-07-20 | 龙南骏亚电子科技有限公司 | Aluminum-based circuit board of high thermal conductivity |
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| FR2646311B1 (en) * | 1989-04-24 | 1994-04-08 | Pechiney Recherche | INSULATED METAL SUBSTRATES AND METHOD OF MANUFACTURING SUCH SUBSTRATES |
| JP2693005B2 (en) * | 1990-02-16 | 1997-12-17 | 三菱電機株式会社 | Metal core substrate and manufacturing method thereof |
| JP2014221539A (en) * | 2013-05-14 | 2014-11-27 | 藤森工業株式会社 | Method for joining metal and polyolefin resin, and laminate |
| CN107665878A (en) * | 2016-07-29 | 2018-02-06 | 奥特斯奥地利科技与系统技术有限公司 | Paper tinsel, the component carrier with paper tinsel and the electronic system with component carrier |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104928749A (en) * | 2014-03-17 | 2015-09-23 | 柯惠兰 | Method for forming protective coating layer on surface of magnesium alloy and protective coating layer thereof |
| CN105792505A (en) * | 2016-03-25 | 2016-07-20 | 龙南骏亚电子科技有限公司 | Aluminum-based circuit board of high thermal conductivity |
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Denomination of invention: A high thermal conductivity aluminum based circuit board and its preparation process Granted publication date: 20240716 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: Dongguan Haolong Laser Technology Co.,Ltd. Registration number: Y2024980043933 |