CN116093000A - Automatic wafer alignment device and alignment method thereof - Google Patents

Automatic wafer alignment device and alignment method thereof Download PDF

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Publication number
CN116093000A
CN116093000A CN202310057061.0A CN202310057061A CN116093000A CN 116093000 A CN116093000 A CN 116093000A CN 202310057061 A CN202310057061 A CN 202310057061A CN 116093000 A CN116093000 A CN 116093000A
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China
Prior art keywords
wafer
image information
edge finder
automatic
deviation value
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CN202310057061.0A
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Chinese (zh)
Inventor
王进文
韦晨
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Wuhan Jingce Electronic Group Co Ltd
Wuhan Jingli Electronic Technology Co Ltd
Suzhou Hirose Opto Co Ltd
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Wuhan Jingce Electronic Group Co Ltd
Wuhan Jingli Electronic Technology Co Ltd
Suzhou Hirose Opto Co Ltd
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Priority to CN202310057061.0A priority Critical patent/CN116093000A/en
Publication of CN116093000A publication Critical patent/CN116093000A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application relates to an automatic wafer alignment device and an alignment method thereof, comprising the following steps: the wafer edge finder is provided with an adsorption carrier used for adsorbing the wafer, and drives the adsorption carrier to move along an X axis and a Y axis and rotate to a set angle; the large-view cameras are provided with two groups and are respectively positioned at two sides of the top of the wafer edge finder so as to respectively acquire the arc edge image information of the wafer to be tested; and the controller is used for acquiring the arc edge image information to determine the deviation value of the wafer center position and the preset position, and transmitting the deviation value to the wafer edge finder. The method and the device collect the arc edge image information of the wafer to be measured by the large-view camera, and determine the deviation value of the circle center position and the preset position of the wafer to be measured by the arc edge image information of the wafer to be measured. The controller sends the deviation value to the wafer edge finder, and the wafer edge finder overlaps the circle center position of the tested wafer with the preset position, so that automatic correction and alignment of the wafer are completed, and the automatic detection efficiency is improved.

Description

Automatic wafer alignment device and alignment method thereof
Technical Field
The present disclosure relates to wafer positioning devices, and particularly to an automatic wafer positioning device and a positioning method thereof.
Background
In the front-end fabrication of semiconductor large-scale integrated circuits, a large number of non-patterned, non-feature-edge wafers are required to be inspected or inspected for defects. The wafer process of the current wafer processing equipment comprises that a manipulator in a mechanical module at the front end of the equipment takes the wafer out of a wafer box and sends the wafer to a prealigner therein for prealignment.
And then the wafer is sent to a mechanical motion platform through a mechanical hand, if the wafer is based on electron beam scanning, the wafer is not accurate enough in center and angle after reaching the platform through a vacuum transition chamber, and the position is deviated. Many devices have higher demands on the accuracy of the position when processing non-patterned, non-feature-edge wafers, and the accuracy of such pre-alignment processes is clearly inadequate.
After the wafer is placed on the platform, the center of the circle of the wafer and the center of the platform are deviated, and the notch of the wafer does not coincide with the coordinate axis of the platform, so that the position of the wafer needs to be determined to align the wafer.
Because of different process sections or different process application requirements, the specifications of the wafers have various differences, so that when the wafers are automatically aligned, different pre-alignment structures are designed according to the specification types of the wafers to be inspected. In some inspection scenarios, different types of wafers need to be compatible, and a commonly used pre-alignment edge finder can only deal with wafers with characteristic edges, so that a pre-alignment structure capable of coping with different characteristics needs to be developed to solve the problem of positioning compatibility of different types of wafers.
Disclosure of Invention
The embodiment of the application provides an automatic wafer alignment device and an alignment method thereof, which are used for solving the problem that wafers with characteristic edges and wafers without characteristic edges cannot be aligned in a compatible manner in the related art.
An embodiment of the present application provides an automatic wafer alignment device, including:
the wafer edge finder is provided with an adsorption carrier used for adsorbing the wafer, and drives the adsorption carrier to move along an X axis and a Y axis and rotate to a set angle;
the large-view cameras are provided with two groups and are respectively positioned at two sides of the top of the wafer edge finder so as to respectively acquire the arc edge image information of the wafer to be tested;
and the controller is used for acquiring the arc edge image information to determine the deviation value of the wafer center position and the preset position, and transmitting the deviation value to the wafer edge finder.
In some embodiments: the device also comprises a bottom plate for fixing the wafer edge finder, wherein the bottom plate is provided with a profile frame for fixing two groups of large-view cameras;
the profile frame is provided with a horizontal adjusting plate for adjusting the shooting angle of the large-view camera and a front adjusting plate and a rear adjusting plate for adjusting the distance between the large-view camera and the wafer edge finder;
the large-view camera is connected to the horizontal adjusting plate through a camera mounting plate.
In some embodiments: the large-view cameras are connected with large-view lenses, and coaxial light sources for supplementing light towards the adsorption carrier are arranged at the front ends of the large-view lenses.
In some embodiments: the bottom of the adsorption carrier is provided with a backlight source for supplementing light to the bottom of the wafer, and the backlight source is provided with a backlight adjusting plate for adjusting the irradiation angle of the backlight source.
In some embodiments: the backlight and the coaxial light source are provided with a light source controller for controlling the coaxial light source and the backlight.
In some embodiments: the wafer edge finder camera is used for collecting wafer characteristic image information, the edge finder camera is connected with the controller, the controller obtains the wafer characteristic image information, and the wafer on the adsorption carrier is rotated to a set angle through the wafer edge finder.
In some embodiments: the device also comprises a code reader for reading character information on the wafer, and the code reader is fixed on one side of the adsorption carrier through a code reader mounting frame.
In some embodiments: the code reader is rotatably connected with the code reader mounting frame so as to adjust the scanning angle of the code reader for collecting the wafer character information.
In some embodiments: the section bar frame is a rectangular frame structure erected by aluminum sections, the bottom plate is a rectangular metal plate, and a plurality of mounting holes are formed in the bottom plate.
A second aspect of the embodiments of the present application provides an alignment method of an automatic wafer alignment device, where the method uses the automatic wafer alignment device described in any one of the embodiments, and the method includes:
the mechanical arm conveys the tested wafer to an adsorption carrier at the top of the wafer edge finder, and the adsorption carrier adsorbs the tested wafer by using a sucker;
the two groups of large-view cameras respectively collect the arc edge image information of the wafer to be tested and send the arc edge image information of the wafer to be tested to the controller;
the edge finder camera collects the characteristic image information of the wafer to be detected and sends the characteristic image information of the wafer to be detected to the controller;
the controller determines a distance deviation value between the center position of the wafer and a preset position according to the arc edge image information, and sends the distance deviation value to the wafer edge finder;
the controller determines the angle deviation value of the groove feature and the plane feature orientation angle of the wafer and a preset angle according to the feature image information, and sends the angle deviation value to the wafer edge finder;
the wafer edge finder drives the adsorption carrier to move along the X axis and the Y axis and rotate to a set angle according to the distance deviation value and the angle deviation value.
The beneficial effects that technical scheme that this application provided brought include:
the embodiment of the application provides an automatic wafer alignment device and an alignment method thereof, because the automatic wafer alignment device is provided with a wafer edge finder, an adsorption carrier for adsorbing a wafer is arranged on the wafer edge finder, and the wafer edge finder drives the adsorption carrier to move along an X axis and a Y axis and rotate to a set angle; the large-view cameras are provided with two groups and are respectively positioned at two sides of the top of the wafer edge finder so as to respectively acquire the arc edge image information of the wafer to be tested; and the controller is used for acquiring the arc edge image information to determine the deviation value of the wafer center position and the preset position, and transmitting the deviation value to the wafer edge finder.
Therefore, the wafer automatic alignment device acquires the arc edge image information of the wafer to be detected by utilizing two groups of large-view cameras which are respectively positioned at the two sides of the top of the wafer edge finder, and determines the deviation value of the circle center position and the preset position of the wafer to be detected by the arc edge image information of the wafer to be detected. The controller sends the deviation value to the wafer edge finder, and the wafer edge finder adjusts the X-axis and Y-axis positions of the adsorption carrier according to the deviation value so as to coincide the circle center position of the tested wafer with the preset position, thereby completing the automatic correction and alignment of the wafer, improving the automation level of the automatic alignment of the wafer and improving the automatic detection efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view of a structure of an embodiment of the present application;
FIG. 2 is a front view of a structure of an embodiment of the present application;
fig. 3 is a structural top view of an embodiment of the present application.
Reference numerals:
1. a horizontal adjustment plate; 2. a section bar frame; 3. a coaxial light source; 4. a light source controller; 5. a bottom plate; 6. a wafer edge finder; 7. a backlight; 8. front and rear adjusting plates; 9. a large field lens; 10. a large field of view camera; 11. an adsorption carrier; 12. an edge finder camera; 13. a backlight adjusting plate; 14. a camera mounting plate; 15. a code reader mounting rack; 16. a code reader.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
The embodiment of the application provides an automatic wafer alignment device and an alignment method thereof, which can solve the problem that wafers with characteristic edges and wafers without characteristic edges cannot be aligned in a compatible manner in the related art.
Referring to fig. 1 to 3, a first aspect of an embodiment of the present application provides an automatic wafer alignment device, including:
the wafer edge finder 6 is provided with an adsorption carrier 11 for adsorbing wafers, and the wafer edge finder 6 can drive the adsorption carrier 11 to move along an X axis and a Y axis and rotate to a set angle.
The large-view camera 10 is provided with two groups of large-view cameras 10 and is respectively positioned at two sides of the top of the wafer edge finder 6 so as to respectively acquire the arc edge image information of the tested wafer. The arc edge image information acquired by the two large-field cameras 10 can accurately determine the diameter and the center position of the wafer.
And a controller (not shown in the figure) for acquiring the arc edge image information shot by the large-field camera 10 to determine the deviation value between the wafer center position and the preset position, and sending the deviation value to the wafer edge finder 6, wherein the wafer edge finder 6 completes automatic correction and alignment of the wafer.
The wafer automatic alignment device in the embodiment of the application utilizes two groups of large-field cameras 10 which are respectively positioned at two sides of the top of the wafer edge finder 6 to collect the arc edge image information of the wafer to be tested, and the arc edge image information of the wafer to be tested is used for determining the deviation value of the circle center position and the preset position of the wafer to be tested.
The controller sends the deviation value to the wafer edge finder 6, and the wafer edge finder 6 adjusts the X-axis and Y-axis positions of the adsorption carrier 11 according to the deviation value so as to coincide the circle center position of the tested wafer with the preset position, thereby completing the automatic correction and alignment of the wafer, improving the automation level of the automatic alignment of the wafer and improving the automatic detection efficiency.
In some alternative embodiments: referring to fig. 1 to 3, an embodiment of the present application provides an automatic wafer alignment device, which further includes a base plate 5 for fixing a wafer edge finder 6, and a profile frame 2 for fixing two groups of large-view cameras 10 is disposed on the base plate 5. The profile frame 2 is provided with a horizontal adjusting plate 1 for adjusting the shooting angle of the large-view camera 10 and a front and back adjusting plate 8 for adjusting the distance between the large-view camera 10 and the wafer edge finder 6. The large-field camera 10 is connected to the horizontal adjustment plate 1 through a camera mounting plate 14. The section bar frame 2 is of a rectangular frame structure erected by aluminum sections, the bottom plate 5 is of a rectangular metal plate, and a plurality of mounting holes are formed in the bottom plate 5.
The embodiment of the application is provided with a section bar frame 2 for supporting and positioning two groups of large-view cameras 10, wherein a horizontal adjusting plate 1 for adjusting the shooting angle of the large-view cameras 10 and a front-back adjusting plate 8 for adjusting the distance between the large-view cameras 10 and a wafer edge finder 6 are arranged on the section bar frame 2, and the horizontal adjusting plate 1 and the front-back adjusting plate 8 are used for adjusting and positioning the positions and the angles of the large-view cameras 10 so that the large-view cameras 10 can shoot the image information of the wafer at the optimal positions and angles.
In some alternative embodiments: referring to fig. 1 to 3, an embodiment of the present application provides an automatic wafer alignment device, a large-field camera 10 of the device is connected with a large-field lens 9, and a coaxial light source 3 for supplementing light towards an adsorption stage 11 is disposed at the front end of the large-field lens 9. The large-field lens 9 is suitable for large-range observation and measurement, and improves the measurement efficiency. The coaxial light source 3 supplements light for the large-field camera 10 to assist the high-definition shooting of the large-field camera 10.
A backlight 7 for supplying light to the bottom of the wafer is provided at the bottom of the adsorption stage 11, and the backlight 7 is provided with a backlight adjusting plate 13 for adjusting the irradiation angle of the backlight. The backlight 7 and the coaxial light source 3 are provided with a light source controller 4 that controls the coaxial light source 3 and the backlight 7. The light source controller 4 is used for adjusting the light intensity and the light source color of the coaxial light source 3 and the backlight 7 so as to highlight the edge contour shape of the wafer.
In some alternative embodiments: referring to fig. 1 to 3, an embodiment of the present application provides an automatic wafer alignment device, which further includes an edge finder camera 12 for collecting characteristic image information of a wafer, where the edge finder camera 12 is connected to a controller, and the controller obtains characteristic image information of the wafer captured by the edge finder camera 12, and rotates the wafer on the adsorption carrier 11 to a set angle through the wafer edge finder 6, so as to maintain a groove feature and a flat-mouth feature on the wafer towards a set direction.
In some alternative embodiments: referring to fig. 1 to 3, the embodiment of the present application provides an automatic wafer alignment device, which further includes a code reader 16 for reading character information on a wafer, wherein the code reader 16 is fixed on one side of the adsorption stage 11 through a code reader mounting frame 15. The code reader 16 is rotatably connected with the code reader mounting frame 15 so as to adjust the scanning angle of the wafer character information collected by the code reader. The code reader 16 can track the source information of each wafer, and can establish a traceability environment by printing bar codes or characters on the wafer and the label so as to meet the requirement of collecting the wafer information.
Referring to fig. 1 to 3, a second aspect of the embodiments of the present application provides an alignment method of an automatic wafer alignment device, where the method uses the automatic wafer alignment device according to any one of the embodiments, and the method includes:
step 101, the robot carries the wafer to be tested onto the adsorption carrier 11 at the top of the wafer edge finder 6, and the adsorption carrier 11 adsorbs the wafer to be tested by using the suction cup.
Step 102, two groups of large-view cameras 10 respectively collect the arc edge image information of the wafer to be tested, and send the arc edge image information of the wafer to be tested to the controller.
Step 103, the edge finder camera 12 collects the feature image information of the wafer to be tested, and sends the feature image information of the wafer to be tested to the controller.
Step 104, the controller determines a distance deviation value between the center position of the wafer and the preset position according to the arc edge image information, and sends the distance deviation value to the wafer edge finder 6.
Step 105, the controller determines an angle deviation value between the orientation angle of the groove feature and the flat feature of the wafer and a preset angle according to the feature image information, and sends the angle deviation value to the wafer edge finder 6.
And step 106, the wafer edge finder 6 drives the adsorption carrier 11 to move along the X axis and the Y axis and rotate to a set angle according to the distance deviation value and the angle deviation value so as to correct the circle center coordinates of the wafer and the orientation angles of the groove features and the flat-mouth features.
Principle of operation
The embodiment of the application provides an automatic wafer alignment device and an alignment method thereof, because the automatic wafer alignment device is provided with a wafer edge finder 6, the wafer edge finder 6 is provided with an adsorption carrier 11 for adsorbing a wafer, and the wafer edge finder 6 drives the adsorption carrier 11 to move along an X axis and a Y axis and rotate to a set angle; the large-view camera 10 is provided with two groups of large-view cameras 10 and is respectively positioned at two sides of the top of the wafer edge finder 6 so as to respectively acquire the arc edge image information of the wafer to be tested; and the controller is used for acquiring the arc edge image information to determine the deviation value of the wafer center position and the preset position, and transmitting the deviation value to the wafer edge finder 6.
Therefore, the wafer automatic alignment device of the present application uses two groups of large-field cameras 10 respectively positioned on two sides of the top of the wafer edge finder 6 to collect the arc edge image information of the wafer to be tested, and determines the deviation value of the center position and the preset position of the wafer to be tested from the arc edge image information of the wafer to be tested. The controller sends the deviation value to the wafer edge finder 6, and the wafer edge finder 6 adjusts the X-axis and Y-axis positions of the adsorption carrier 11 according to the deviation value so as to coincide the circle center position of the tested wafer with the preset position, thereby completing the automatic correction and alignment of the wafer, improving the automation level of the automatic alignment of the wafer and improving the automatic detection efficiency.
In the description of the present application, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of description of the present application and simplification of the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
It should be noted that in this application, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely a specific embodiment of the application to enable one skilled in the art to understand or practice the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. An automatic wafer alignment device, comprising:
the wafer edge finder (6), wherein an adsorption carrier (11) for adsorbing the wafer is arranged on the wafer edge finder (6), and the wafer edge finder (6) drives the adsorption carrier (11) to move along an X axis and a Y axis and rotate to a set angle;
the large-view camera (10) is provided with two groups of cameras (10) which are respectively positioned at two sides of the top of the wafer edge finder (6) so as to respectively acquire the arc edge image information of the wafer to be tested;
and the controller is used for acquiring the arc edge image information to determine the deviation value of the wafer center position and the preset position, and transmitting the deviation value to the wafer edge finder (6).
2. The automatic wafer alignment device according to claim 1, wherein:
the device also comprises a bottom plate (5) for fixing the wafer edge finder (6), wherein the bottom plate (5) is provided with a profile frame (2) for fixing two groups of large-view cameras (10);
the profile frame (2) is provided with a horizontal adjusting plate (1) for adjusting the shooting angle of the large-view camera (10) and a front and rear adjusting plate (8) for adjusting the distance between the large-view camera (10) and the wafer edge finder (6);
the large-view camera (10) is connected to the horizontal adjusting plate (1) through a camera mounting plate (14).
3. An automatic wafer alignment device according to claim 1 or 2, wherein:
the large-view cameras (10) are connected with large-view lenses (9), and coaxial light sources (3) for supplementing light towards the adsorption carrier (11) are arranged at the front ends of the large-view lenses (9).
4. An automatic wafer alignment device according to claim 3, wherein:
the bottom of absorption microscope carrier (11) is equipped with backlight (7) towards the bottom light filling of wafer, backlight (7) are equipped with backlight (7) of adjusting backlight (7) irradiation angle.
5. The automatic wafer alignment device according to claim 4, wherein:
the backlight (7) and the coaxial light source (3) are provided with a light source controller (4) for controlling the coaxial light source (3) and the backlight (7).
6. An automatic wafer alignment device according to claim 1 or 2, wherein:
the wafer edge finder camera (12) is used for collecting wafer characteristic image information, the edge finder camera (12) is connected with a controller, the controller obtains the wafer characteristic image information, and the wafer on the adsorption carrier (11) is rotated to a set angle through the wafer edge finder (6).
7. An automatic wafer alignment device according to claim 1 or 2, wherein:
the device also comprises a code reader (16) for reading character information on the wafer, wherein the code reader (16) is fixed on one side of the adsorption carrier (11) through a code reader mounting frame (15).
8. The automatic wafer alignment device according to claim 7, wherein:
the code reader (16) is rotatably connected with the code reader mounting frame (15) so as to adjust the scanning angle of the wafer character information collected by the code reader (16).
9. An automatic wafer alignment device as claimed in claim 2, wherein:
the profile frame (2) is of a rectangular frame structure erected by aluminum profiles, the bottom plate (5) is of a rectangular metal plate, and a plurality of mounting holes are formed in the bottom plate (5).
10. A wafer automatic alignment device alignment method, characterized in that the method uses the wafer automatic alignment device according to any one of claims 1 to 9, the method comprising:
the mechanical arm conveys the tested wafer to an adsorption carrying platform (11) at the top of the wafer edge finder (6), and the adsorption carrying platform (11) adsorbs the tested wafer by utilizing a sucker;
the two groups of large-view cameras (10) respectively collect the arc edge image information of the wafer to be tested and send the arc edge image information of the wafer to be tested to the controller;
the edge finder camera (12) collects the characteristic image information of the wafer to be detected and sends the characteristic image information of the wafer to be detected to the controller;
the controller determines a distance deviation value between the center position of the wafer and a preset position according to the arc edge image information, and sends the distance deviation value to the wafer edge finder (6);
the controller determines the angle deviation value of the groove feature and the plane feature orientation angle of the wafer and a preset angle according to the feature image information, and sends the angle deviation value to the wafer edge finder (6);
the wafer edge finder (6) drives the adsorption carrier (11) to move along the X axis and the Y axis and rotate to a set angle according to the distance deviation value and the angle deviation value.
CN202310057061.0A 2023-01-16 2023-01-16 Automatic wafer alignment device and alignment method thereof Pending CN116093000A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310057061.0A CN116093000A (en) 2023-01-16 2023-01-16 Automatic wafer alignment device and alignment method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310057061.0A CN116093000A (en) 2023-01-16 2023-01-16 Automatic wafer alignment device and alignment method thereof

Publications (1)

Publication Number Publication Date
CN116093000A true CN116093000A (en) 2023-05-09

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CN202310057061.0A Pending CN116093000A (en) 2023-01-16 2023-01-16 Automatic wafer alignment device and alignment method thereof

Country Status (1)

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CN (1) CN116093000A (en)

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