CN116086535A - Temperature and pressure compound sensor - Google Patents
Temperature and pressure compound sensor Download PDFInfo
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- CN116086535A CN116086535A CN202310064610.7A CN202310064610A CN116086535A CN 116086535 A CN116086535 A CN 116086535A CN 202310064610 A CN202310064610 A CN 202310064610A CN 116086535 A CN116086535 A CN 116086535A
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- 150000001875 compounds Chemical class 0.000 title claims 2
- 238000009434 installation Methods 0.000 claims abstract description 105
- 238000001514 detection method Methods 0.000 claims abstract description 98
- 239000002131 composite material Substances 0.000 claims abstract description 23
- 230000001681 protective effect Effects 0.000 claims abstract description 19
- 230000007423 decrease Effects 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims 3
- 238000007789 sealing Methods 0.000 abstract description 15
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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- 238000004458 analytical method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010965 in-process control Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- G—PHYSICS
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
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- G—PHYSICS
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
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- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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Abstract
本发明提供了一种温压复合传感器,包括外壳和检测单元,外壳包括沿第一方向依次设置的封堵头、主体和护管,所述主体沿所述第一方向开设有相互连通第一安装腔、第二安装腔和第三安装腔,其中,所述封堵头连接于所述第一安装腔内,所述护管连接于所述第三安装腔内;检测单元设于所述第一安装腔和所述第二安装腔内,所述检测单元包括控制模组、压力检测件和温度检测件,所述压力检测件和所述温度检测件分别与所述控制模组电连接,且所述温度检测件的检测端沿所述第一方向伸入所述护管内。本发明提供的温压复合传感器,旨在解决现有技术中温度检测元件无法与待检测介质直接接触,导致检测时间延长,检测精度存在误差的问题。
The invention provides a temperature-pressure composite sensor, which includes a casing and a detection unit. The casing includes a sealing head, a main body and a protective tube arranged in sequence along a first direction. The installation cavity, the second installation cavity and the third installation cavity, wherein, the sealing head is connected in the first installation cavity, and the protective tube is connected in the third installation cavity; the detection unit is arranged in the In the first installation cavity and the second installation cavity, the detection unit includes a control module, a pressure detection part and a temperature detection part, and the pressure detection part and the temperature detection part are respectively electrically connected to the control module , and the detection end of the temperature detection element extends into the protection tube along the first direction. The temperature-pressure composite sensor provided by the present invention aims to solve the problems in the prior art that the temperature detection element cannot be in direct contact with the medium to be detected, resulting in prolonged detection time and errors in detection accuracy.
Description
技术领域technical field
本发明属于传感器技术领域,更具体地说,是涉及一种温压复合传感器。The invention belongs to the technical field of sensors, and more specifically relates to a temperature-pressure composite sensor.
背景技术Background technique
传感器是现代测量和自动化系统的重要技术之一,传感器广泛应用于从生产的过程控制到现代科技化的生活。有些地方需要同时测量温度和压力时,经常需要配合使用温度传感器和压力传感器。Sensors are one of the important technologies of modern measurement and automation systems. Sensors are widely used in process control from production to modern technological life. When temperature and pressure need to be measured at the same time in some places, it is often necessary to use a temperature sensor and a pressure sensor together.
目前,在现有的传感器技术中,通常是温度传感器和压力传感器采用分体式构造,分别使用温度传感器和压力传感器进行测量,通过单独设置的温度传感器和柔性电路板中与温度传感器连接的一个导电延伸部进行温度的测量,实现采集温度的数据,再通过单独设置的压力传感器和柔性电路板中与压力传感器连接的另一个导电延伸部进行压力的测量,来实现采集压力的数据。温度传感器一般包括检测元件和封装于检测元件外的金属壳体,检测元件灌胶后固定于金属壳体内。在检测时金属壳体直接与待测介质接触,检测元件通过感应金属壳体的温度完成对待测介质进行检测。由于检测元件无法直接与待测介质接触,温度传导需要一定的时间,因此不仅造成检测时间延长,而且金属壳体的导热损失还会造成检测结果与实际情况存在一定的误差,影响检测精度。At present, in the existing sensor technology, the temperature sensor and the pressure sensor usually adopt a split structure, and the temperature sensor and the pressure sensor are used for measurement respectively. The extension part measures the temperature to collect temperature data, and then measures the pressure through the separately provided pressure sensor and another conductive extension connected to the pressure sensor in the flexible circuit board to realize the pressure data collection. The temperature sensor generally includes a detection element and a metal casing packaged outside the detection element, and the detection element is fixed in the metal casing after being filled with glue. During detection, the metal shell is in direct contact with the medium to be measured, and the detection element completes the detection of the medium to be measured by sensing the temperature of the metal shell. Since the detection element cannot directly contact the medium to be measured, it takes a certain amount of time for temperature conduction, which not only prolongs the detection time, but also causes a certain error between the detection result and the actual situation due to the heat conduction loss of the metal shell, which affects the detection accuracy.
发明内容Contents of the invention
本发明的目的在于提供一种温压复合传感器,旨在解决现有技术中温度检测元件无法与待检测介质直接接触,导致检测时间延长,检测精度存在误差的问题。The purpose of the present invention is to provide a temperature-pressure composite sensor, aiming to solve the problems in the prior art that the temperature detection element cannot be in direct contact with the medium to be detected, resulting in prolonged detection time and errors in detection accuracy.
为实现上述目的,本发明采用的技术方案是:提供一种温压复合传感器,包括:In order to achieve the above object, the technical solution adopted by the present invention is to provide a temperature-pressure composite sensor, comprising:
外壳,包括沿第一方向依次设置的封堵头、主体和护管,所述主体沿所述第一方向开设有相互连通第一安装腔、第二安装腔和第三安装腔,其中,所述封堵头连接于所述第一安装腔内,所述护管连接于所述第三安装腔内;以及The casing includes a plugging head, a main body and a protective tube arranged in sequence along the first direction, and the main body is provided with a first installation cavity, a second installation cavity and a third installation cavity communicating with each other along the first direction, wherein the The plugging head is connected to the first installation cavity, and the protective tube is connected to the third installation cavity; and
检测单元,设于所述第一安装腔和所述第二安装腔内,所述检测单元包括控制模组、压力检测件和温度检测件,所述压力检测件和所述温度检测件分别与所述控制模组电连接,且所述温度检测件的检测端沿所述第一方向伸入所述护管内。The detection unit is arranged in the first installation cavity and the second installation cavity, and the detection unit includes a control module, a pressure detection part and a temperature detection part, and the pressure detection part and the temperature detection part are respectively connected with the The control modules are electrically connected, and the detection end of the temperature detection element extends into the protection tube along the first direction.
在一种可能的实现方式中,所述第一安装腔、所述第二安装腔和所述第三安装腔均为圆柱状的腔室,且所述第一安装腔、所述第二安装腔和所述第三安装腔的内径逐渐减小。In a possible implementation manner, the first installation cavity, the second installation cavity and the third installation cavity are all cylindrical cavities, and the first installation cavity, the second installation cavity The inner diameters of the cavity and the third installation cavity gradually decrease.
在一种可能的实现方式中,所述封堵头包括沿所述第一方向设置的固定部和连接部,所述连接部插设于所述第一安装腔内,且所述连接部内开设有容纳腔,所述容纳腔在所述第一方向与所述第一安装腔连通。In a possible implementation manner, the sealing head includes a fixing part and a connecting part arranged along the first direction, the connecting part is inserted into the first installation cavity, and an opening is opened in the connecting part. There is an accommodating cavity, and the accommodating cavity communicates with the first installation cavity in the first direction.
在一种可能的实现方式中,所述固定部沿所述第一方向开设有连接槽,所述连接槽用于与外部设备插接配合。In a possible implementation manner, the fixing part is provided with a connection groove along the first direction, and the connection groove is used for plug-fitting with an external device.
在一种可能的实现方式中,所述连接槽的内壁设有多个沿所述第一方向设置的插条,所述插条用于与外部设备插接。In a possible implementation manner, the inner wall of the connecting groove is provided with a plurality of inserting strips arranged along the first direction, and the inserting strips are used for inserting with external devices.
在一种可能的实现方式中,所述控制模组包括:In a possible implementation manner, the control module includes:
柔性电路件,设于所述第一安装腔内,所述柔性电路件用于与外部设备电连接;A flexible circuit part is arranged in the first installation cavity, and the flexible circuit part is used for electrical connection with external equipment;
基座,设于所述第二安装腔内,与所述柔性电路件电连接,所述基座将所述第二安装腔与所述第一安装腔隔绝;a base, disposed in the second installation cavity, electrically connected to the flexible circuit, and the base isolates the second installation cavity from the first installation cavity;
PCB电路板,设于所述基座,分别与所述压力检测件、所述温度检测件和所述柔性电路件电连接,所述压力检测件焊接于所述PCB电路板;以及The PCB circuit board is arranged on the base and is electrically connected to the pressure detection part, the temperature detection part and the flexible circuit part respectively, and the pressure detection part is welded to the PCB circuit board; and
控制器,设于所述PCB电路板。The controller is arranged on the PCB circuit board.
在一种可能的实现方式中,所述柔性电路件包括:In a possible implementation manner, the flexible circuit component includes:
柔性电路板,设于所述第一安装腔内,与所述PCB电路板电连接;以及a flexible circuit board, disposed in the first installation cavity, electrically connected to the PCB circuit board; and
导电连接片,一端与所述柔性电路板电连接,另一端沿所述封堵头的轴向延伸出所述第一安装腔,所述导电连接片用于与外部设备电连接。One end of the conductive connecting piece is electrically connected to the flexible circuit board, and the other end extends out of the first installation cavity along the axial direction of the sealing head, and the conductive connecting piece is used for electrical connection with external equipment.
在一种可能的实现方式中,所述基座与所述第二安装腔过盈配合。In a possible implementation manner, the base is in interference fit with the second installation cavity.
在一种可能的实现方式中,所述基座为圆台状构件,且所述基座的直径沿所述第一方向逐渐减小。In a possible implementation manner, the base is a conical member, and a diameter of the base gradually decreases along the first direction.
在一种可能的实现方式中,所述温度检测件包括检测元件和连接元件,所述检测元件位于所述护管内,用于感应温度;所述基座沿所述第一方向开设有散热槽,所述PCB电路板封盖于所述散热槽的开口,且所述PCB电路板开设有与所述连接元件相适配的让位孔,所述连接元件穿过所述让位孔插入所述散热槽内。In a possible implementation manner, the temperature detecting element includes a detecting element and a connecting element, and the detecting element is located in the protective tube for sensing temperature; the base is provided with a heat dissipation groove along the first direction , the PCB circuit board covers the opening of the heat sink, and the PCB circuit board is provided with a relief hole suitable for the connection element, and the connection element is inserted through the relief hole into the inside the heat sink.
本发明提供的温压复合传感器的有益效果在于:与现有技术相比,本发明温压复合传感器压力检测件和温度检测件分别对待测环境的压力和温度进行检测,并将检测到的新型反馈给控制模组,控制模组根据反馈信息进行处理后得到检测结果。封堵头设于第一安装腔内,从而将第一安装腔与外部隔绝,避免水汽和灰尘等杂质由第一安装腔进入第二安装腔和第三安装腔内,确保了检测单元处于洁净干燥的环境,提高检测单元的使用寿命。温度检测件的检测端伸入护管内,护管能够避免温度检测件受到外力磕碰后被损坏,保护温度检测件。另外,护管与外部连通,待测介质可以进入护管内与温度检测件接触,从而可以实现温度检测件直接测量出待测介质的温度,不仅缩短了测量时间,而且避免了待测介质通过中间件时的温度损失,降低检测误差。The beneficial effect of the temperature-pressure composite sensor provided by the present invention is that compared with the prior art, the pressure detection part and the temperature detection part of the temperature-pressure composite sensor of the present invention respectively detect the pressure and temperature of the environment to be measured, and the detected new Feedback to the control module, and the control module processes the feedback information to obtain the detection result. The plugging head is set in the first installation cavity, thereby isolating the first installation cavity from the outside, preventing impurities such as water vapor and dust from entering the second and third installation cavities from the first installation cavity, ensuring that the detection unit is kept clean A dry environment increases the service life of the detection unit. The detection end of the temperature detection part extends into the protection tube, and the protection tube can prevent the temperature detection part from being damaged after being bumped by external force, and protect the temperature detection part. In addition, the protective tube is connected to the outside, and the medium to be measured can enter the protective tube and contact the temperature detection part, so that the temperature detection part can directly measure the temperature of the medium to be measured, which not only shortens the measurement time, but also avoids the medium to be measured from passing through the middle. The temperature loss during the assembly reduces the detection error.
附图说明Description of drawings
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the descriptions of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only of the present invention. For some embodiments, those of ordinary skill in the art can also obtain other drawings based on these drawings without creative effort.
图1为本发明实施例提供的温压复合传感器的结构示意图;Fig. 1 is a schematic structural diagram of a temperature-pressure composite sensor provided by an embodiment of the present invention;
图2为本发明实施例提供的温压复合传感器的爆炸图;Fig. 2 is an explosion diagram of the temperature-pressure composite sensor provided by the embodiment of the present invention;
图3为本发明实施例提供的温压复合传感器的俯视图;Fig. 3 is a top view of the temperature-pressure composite sensor provided by the embodiment of the present invention;
图4为图3中的A向剖视图;Fig. 4 is a cross-sectional view of A direction in Fig. 3;
图5为图3中的B向剖视图;Fig. 5 is a B-direction sectional view in Fig. 3;
图6为本发明实施例采用的检测单元的结构示意图。FIG. 6 is a schematic structural diagram of a detection unit used in an embodiment of the present invention.
图中:In the picture:
1、封堵头;101、连接槽;102、插条;103、固定部;104、连接部;1. Plugging head; 101, connecting groove; 102, inserting strip; 103, fixing part; 104, connecting part;
2、主体;201、第一安装腔;202、第二安装腔;203、第三安装腔;2. Main body; 201, the first installation cavity; 202, the second installation cavity; 203, the third installation cavity;
3、护管;3. Protective tube;
4、温度检测件;401、连接元件;402、检测元件;4. Temperature detection piece; 401, connection element; 402, detection element;
5、压力检测件;5. Pressure detection parts;
6、检测单元;601、基座;6011、散热槽;602、PCB电路板;603、柔性电路板;604、导电连接片;605、金属插针。6. Detection unit; 601, base; 6011, heat sink; 602, PCB circuit board; 603, flexible circuit board; 604, conductive connecting piece; 605, metal pin.
具体实施方式Detailed ways
为了使本发明所要解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
本发明的权利要求书、说明书及上述附图中,除非另有明确限定,如使用术语“第一”、“第二”或“第三”等,都是为了区别不同对象,而不是用于描述特定顺序。除非另有说明,其余方位词,例如“垂直”、“顺时针”、“逆时针”等指示方位或位置关系乃基于附图所示的方位和位置关系,且仅是为了便于叙述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位或以特定的方位构造和操作,所以也不能理解为限制本发明的具体保护范围。本发明的权利要求书、说明书及上述附图中,除非另有明确限定,如使用术语“固接”或“固定连接”,应作广义理解,即两者之间没有位移关系和相对转动关系的任何连接方式,也就是说包括不可拆卸地固定连接、可拆卸地固定连接、连为一体以及通过其他装置或元件固定连接。本发明的权利要求书、说明书及上述附图中,如使用术语“包括”、“具有”以及它们的变形,意图在于“包含但不限于”。In the claims, description and above-mentioned drawings of the present invention, unless otherwise clearly defined, the terms "first", "second" or "third" are used to distinguish different objects, not for Describe a specific order. Unless otherwise stated, other orientation words, such as "vertical", "clockwise", "counterclockwise", etc. indicating orientation or positional relationship are based on the orientation and positional relationship shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions do not indicate or imply that the referred device or element must have a specific orientation or be constructed and operated in a specific orientation, so it should not be construed as limiting the specific protection scope of the present invention. In the claims, description and above-mentioned drawings of the present invention, unless otherwise clearly defined, if the term "fixed connection" or "fixed connection" is used, it should be understood in a broad sense, that is, there is no displacement relationship and relative rotation relationship between the two. Any connection method, that is to say, includes non-detachable fixed connection, detachable fixed connection, integral connection and fixed connection through other devices or elements. In the claims, description and above-mentioned drawings of the present invention, if the terms "comprising", "having" and their variants are used, it is intended to mean "including but not limited to".
请一并参阅图1至图6,现对本发明提供的温压复合传感器进行说明。温压复合传感器,包括外壳和检测单元6,外壳包括沿第一方向依次设置的封堵头1、主体2和护管3,主体2沿第一方向开设有相互连通第一安装腔201、第二安装腔202和第三安装腔203,其中,封堵头1连接于第一安装腔201内,护管3连接于第三安装腔203内;检测单元6设于第一安装腔201和第二安装腔202内,检测单元6包括控制模组、压力检测件5和温度检测件4,压力检测件5和温度检测件4分别与控制模组电连接,且温度检测件4的检测端沿第一方向伸入护管3内。Please refer to FIG. 1 to FIG. 6 together, and now the temperature-pressure composite sensor provided by the present invention will be described. The temperature-pressure composite sensor includes a casing and a
本发明提供的温压复合传感器,与现有技术相比,本发明温压复合传感器压力检测件5和温度检测件4分别对待测环境的压力和温度进行检测,并将检测到的新型反馈给控制模组,控制模组根据反馈信息进行处理后得到检测结果。封堵头1设于第一安装腔201内,从而将第一安装腔201与外部隔绝,避免水汽和灰尘等杂质由第一安装腔201进入第二安装腔202和第三安装腔203内,确保了检测单元6处于洁净干燥的环境,提高检测单元6的使用寿命。温度检测件4的检测端伸入护管3内,护管3能够避免温度检测件4受到外力磕碰后被损坏,保护温度检测件4。另外,护管3与外部连通,待测介质可以进入护管3内与温度检测件4接触,从而可以实现温度检测件4直接测量出待测介质的温度,不仅缩短了测量时间,而且避免了待测介质通过中间件时的温度损失,降低检测误差。The temperature-pressure composite sensor provided by the present invention, compared with the prior art, the
可选的,控制模组可以与外部显示设备连接,将检测结果通过外部显示设备输出,也可以在外壳上设置显示屏,控制模组与显示屏电连接,检测结果通过显示屏对外输出。Optionally, the control module can be connected to an external display device to output the test results through the external display device, or a display screen can be set on the housing, the control module is electrically connected to the display screen, and the test results are output through the display screen.
在一些实施例中,请参阅图4至图5,第一安装腔201、第二安装腔202和第三安装腔203均为圆柱状的腔室,且第一安装腔201、第二安装腔202和第三安装腔203的内径逐渐减小。In some embodiments, please refer to FIG. 4 to FIG. 5 , the
第三安装腔203通过护管3与外部连通,将第一安装腔201、第二安装腔202和第三安装腔203的内径设置的逐渐减小,降低水汽和灰尘等杂质由护管3进入第三安装腔203和第二安装腔202内的几率,确保第二安装腔202和第三安装腔203的环境整洁。第一安装腔201通过封堵头1与外部隔绝,因此第一安装腔201较大的直径可以增加与封堵头1的接触面积,提高连接的稳定性。The
在一些实施例中,请参阅图2,封堵头1包括沿第一方向设置的固定部103和连接部104,连接部104插设于第一安装腔201内,且连接部104内开设有容纳腔,容纳腔在第一方向与第一安装腔201连通。In some embodiments, please refer to FIG. 2 , the plugging
连接部104插设于第一安装腔201内,从而实现与主体2的连接。在封堵头1上开设容纳腔,不仅可以减小封堵头1的重量,而且容纳腔与第一安装腔201连通,可以将检测单元6设于容纳腔内,确保密封效果,避免检测单元6受到外部环境的干扰。The
在一些实施例中,请参阅图4至图5,固定部103沿第一方向开设有连接槽101,控制模组具有设于连接槽101内的连接件,连接件用于与外部设备电连接,连接槽101用于与外部设备插接配合。In some embodiments, please refer to FIG. 4 to FIG. 5 , the fixing
连接槽101与外部设备插接配合,从而使位于连接槽101内的连接件与外部设备上相应的插片连接,实现控制模组与外部设备电连接,将检测模组的检测结果通过外部设备对外输出。连接槽101与外部设备插接,可以增加控制模组与外部设备连接的稳定性,而且插接的方式更加方便拆装。The
可选的,连接件为金属构件,外部设备上设有与连接件对应的金属连接片,从而实现导电连接。Optionally, the connecting piece is a metal component, and the external device is provided with a metal connecting piece corresponding to the connecting piece, so as to realize the conductive connection.
在一些实施例中,请参阅图3至图5,连接槽101的内壁设有多个沿第一方向设置的插条102,插条102用于与外部设备插接。In some embodiments, please refer to FIG. 3 to FIG. 5 , the inner wall of the
外部设备具有与插头相适配的插槽,插头与插槽插接,不仅可以对连接槽101和外部设备提供导向,而且避免连接后封堵头1沿周向移动,从而影响连接件与外部设备的电连接。The external device has a slot suitable for the plug, and the plug is plugged into the slot, which not only provides guidance for the
在一些实施例中,请参阅图4至图6,控制模组包括柔性电路件、基座601、PCB电路板602和控制器,柔性电路件设于第一安装腔201内,柔性电路件用于与外部设备电连接;基座601设于第二安装腔202内,与柔性电路件电连接,基座601将第二安装腔202与第一安装腔201隔绝;PCB电路板602设于基座601,分别与压力检测件5、温度检测件4和柔性电路件电连接,压力检测件5焊接于PCB电路板602;控制器设于PCB电路板602。In some embodiments, please refer to FIG. 4 to FIG. 6, the control module includes a flexible circuit, a
PCB电路板602作为控制器、温度检测件4和压力检测件5电连接的媒介,固定于基座601上,基座601将第一安装腔201和第二安装腔202隔绝,避免水汽和灰尘等杂物沿护管3、第三安装腔203、第二安装腔202进入第一安装腔201内,确保第一安装腔201内柔性电路件的安全。温度检测件4和压力检测件5将检测结果传送给控制器,控制器经过分析出来后将信息反馈至柔性电路件,再由柔性电路件向外部设备输出。The
需要说明的是,压力检测件5焊接在PCB电路板602上,并且具有四个焊点。采用焊接的方式可以实现压力检测件5与PCB电路板602的电连接。It should be noted that the
可选的,基座601采用玻璃金属烧结工艺制备,PCB电路板602与基座601焊接。Optionally, the
可选的,基座601上开设有密封孔,密封孔内穿设有用于传递电信号的金属插针605,金属插针605一端连接在PCB电路板602上,另一端与柔性电路件连接,用于将电信号传递至柔性电路件。为保证基座601的密闭性,首先将基座601用于容纳金属插针605的密封孔内填充玻璃体并借助玻璃高温烧结成型工艺将金属插针605限位于密封孔内,实现隔离的同时保证密封孔处的密闭性。Optionally, a sealing hole is opened on the
在一些实施例中,请参阅图4至图6,柔性电路件包括柔性电路板603和导电连接片604,柔性电路板603设于第一安装腔201内,与PCB电路板602电连接;导电连接片604一端与柔性电路板603电连接,另一端沿封堵头1的轴向延伸出第一安装腔201,导电连接片604用于与外部设备电连接。In some embodiments, please refer to FIG. 4 to FIG. 6, the flexible circuit component includes a
导电连接片604将柔性电路板603与外部设备电连接,从而将柔性电路板603上的信号传递给外部设备。The conductive connecting
具体地,柔性电路板603上设有信号传递元件,能够接收PCB电路板602(控制器通过PCB电路板602与柔性电路板603电连接)的信号,并将信号传输给外部设备。Specifically, the
在一些实施例中,请参阅图4至图5,基座601与第二安装腔202过盈配合。In some embodiments, please refer to FIG. 4 to FIG. 5 , the
基座601与第二安装腔202过盈配合,从而实现将第二安装腔202与第一安装腔201隔绝,提高第一安装腔201内的密封性。本实施例中的方案相对于传统的将基座601与第二安装腔202焊接实现密封,密封效果更好,而且第二安装腔202内空间有限,焊接不易操作。另外,若焊点不牢固极易导致基座601与第二安装腔202分离。The
在一些实施例中,请参阅图4至图5,基座601为圆台状构件,且基座601的直径沿第一方向逐渐减小。In some embodiments, please refer to FIG. 4 to FIG. 5 , the
由于第一安装腔201的内径大于第二安装腔202的内径,可以从第一安装腔201内沿第一方向放置基座601,基座601直径沿第一方向逐渐减小,从而方便将基座601插入第二安装腔202内,随着基座601直径的逐渐增加,使基座601与第二安装腔202紧密接触,实现密封连接。Since the inner diameter of the
在一些实施例中,请参阅图6,温度检测件4包括检测元件402和连接元件401,检测元件402位于护管3内,用于感应温度;基座601沿第一方向开设有散热槽6011,PCB电路板602封盖于散热槽6011的开口,且PCB电路板602开设有与连接元件401相适配的让位孔,连接元件401穿过让位孔插入散热槽6011内。In some embodiments, please refer to FIG. 6 , the
PCB电路板602在工作时会产生大量的热量,散热槽6011可以将PCB电路板602产生的热量快速向外散发,提供PCB板的使用寿命。另外,散热槽6011还可以减少基座601的重量,避免在重力作用下与第二安装腔202分离。连接元件401穿过让位孔插入散热槽6011内,然后再将连接元件401与PCB电路板602焊接,不仅避免了损坏连接元件401,而且可以从PCB电路板602的两侧分别焊接连接元件401,增加连接的稳定性。The
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.
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