CN217032584U - Temperature and pressure sensor - Google Patents

Abstract

The utility model discloses a temperature and pressure sensor, which belongs to the technical field of sensors and comprises a shell, a flexible circuit board and a temperature and pressure detection mechanism, wherein the flexible circuit board is arranged in the shell; the temperature and pressure detection mechanism includes: the packaging piece is provided with a pressure detection end and a temperature detection end, the pressure detection end is installed in the shell, the temperature detection end is located outside the shell, and the pressure detection end is located between the flexible circuit board and the temperature detection end; the pressure sensing element is arranged in the pressure detection end and comprises a pressure sensing area, a plurality of PIN needles and a semicircular groove, the PIN needles are connected with the flexible circuit board, and the semicircular groove is located between the pressure sensing area and the PIN needles; the temperature sensing element is arranged in the temperature detection end; one end of the lead is connected with the temperature sensing element, and the other end of the lead penetrates through the semicircular groove to be connected with the flexible circuit board. The utility model achieves the technical effects of simplifying the structure and reducing the cost.

Description

Temperature and pressure sensor

Technical Field

The utility model belongs to the technical field of sensors, and particularly relates to a temperature and pressure sensor.

Background

Sensor technology is one of the important technologies of modern measurement and automation systems, and sensors are widely used in processes from production control to modern technological life. When a plurality of places need to measure the temperature and the pressure, a temperature sensor and a pressure sensor are often used in cooperation.

At present, in the existing sensor technology, a temperature sensor and a pressure sensor are usually in a split type structure, the temperature sensor and the pressure sensor are used for measuring respectively, the temperature is measured through a conductive extension part connected with the temperature sensor in the separately arranged temperature sensor and flexible circuit board, so that the data of temperature can be collected, and the pressure is measured through another conductive extension part connected with the pressure sensor in the separately arranged pressure sensor and flexible circuit board, so that the data of pressure can be collected. However, the use of the temperature sensor and the pressure sensor alone may complicate the structure of the flexible circuit board, and may result in more parts, increase the difficulty of manufacturing, and increase the production cost in order to transmit the temperature signal and the pressure signal simultaneously.

In summary, the conventional sensor technology has the technical problems of complex structure and high cost.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problems of complex structure and higher cost.

In order to solve the above technical problem, the present invention provides a temperature and pressure sensor, including: the temperature and pressure detection device comprises a shell, a flexible circuit board and a temperature and pressure detection mechanism, wherein the flexible circuit board is arranged in the shell; the temperature pressure detection mechanism includes: the packaging piece is provided with a pressure detection end and a temperature detection end, the pressure detection end is installed in the shell, the temperature detection end is located outside the shell, and the pressure detection end is located between the flexible circuit board and the temperature detection end; the pressure sensing element is arranged in the pressure detection end and comprises a pressure sensing area and a plurality of PIN needles, the PIN needles are connected with the flexible circuit board, and the pressure sensing element further comprises a semicircular groove, and the semicircular groove is located between the pressure sensing area and the PIN needles; the temperature sensing element is arranged in the temperature detection end; one end of the lead is connected with the temperature sensing element, and the other end of the lead penetrates through the semicircular groove to be connected with the flexible circuit board.

Further, the housing comprises an open end, a connecting end and a through hole; the flexible circuit board is arranged in the opening end; the pressure detection end is positioned in the opening end, and the other end of the lead sequentially penetrates through the connecting end and the semicircular groove to be connected with the flexible circuit board.

Furthermore, the wrapping piece is also provided with a medium hole, the medium hole is connected with the pressure sensing area, and the medium hole is positioned in the opening end; the shell comprises a through hole, one end of the through hole penetrates through the connecting end, and the other end of the through hole is communicated with the medium hole.

Further, the method also comprises the following steps: an electrical connector connected to the flexible circuit board.

Furthermore, a positioning groove is arranged outside the pressure detection end.

Further, the method also comprises the following steps: a seal mounted within the open end, the seal being located between the open end and the pressure sensing element.

Furthermore, the pressure sensing element is circular, and the axis of the sealing element is the same as the axis of the pressure sensing element.

Further, the sealing member is an O-shaped sealing ring.

Further, the temperature sensing element is a thermistor.

Furthermore, the wrapping piece is made of a high-temperature-resistant heat conduction material.

Has the beneficial effects that:

the utility model provides a temperature and pressure sensor which is arranged in a shell through a flexible circuit board, wherein a pressure detection end of a wrapping piece in a temperature and pressure detection mechanism is arranged in the shell, a temperature detection end of the wrapping piece is positioned outside the shell, the pressure detection end is positioned between the flexible circuit board and the temperature detection end, a pressure sensing element in the temperature and pressure detection mechanism is arranged in the pressure detection end of the wrapping piece, a plurality of PIN needles of the pressure sensing element are connected with the flexible circuit board, a semicircular groove of the pressure sensing element is positioned between a pressure sensing area and the plurality of PIN needles, a temperature sensing element in the temperature and pressure detection mechanism is arranged in the temperature detection end, one end of a lead in the temperature and pressure detection mechanism is connected with the temperature sensing element, and the other end of the lead penetrates through the semicircular groove and is connected with the flexible circuit board. Wrapping piece, forced induction component, temperature-sensing component and PIN combination form an organic whole among the temperature pressure detection mechanism like this, and the pressure signal that forced induction district surveyed among the forced induction component transmits to the flexible circuit board through many PIN needles, and the temperature signal that the temperature-sensing component surveyed transmits to the flexible circuit board through the lead wire, is favorable to simplifying the structure of flexible circuit board, reduces spare part for compact structure is favorable to reduce cost. Thereby the technical effects of simplifying the structure and reducing the cost are achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a first schematic diagram of a temperature and pressure sensor according to an embodiment of the present invention;

fig. 2 is a second schematic diagram of a temperature and pressure sensor according to an embodiment of the present invention;

fig. 3 is a third schematic diagram of a temperature and pressure sensor according to an embodiment of the present invention;

fig. 4 is a fourth schematic diagram of a temperature and pressure sensor according to an embodiment of the present invention;

fig. 5 is a fifth schematic diagram of a temperature and pressure sensor according to an embodiment of the present invention.

Detailed Description

The utility model discloses a temperature and pressure sensor which is arranged in a shell 1 through a flexible circuit board 4, wherein a pressure detection end of a wrapping piece 304 in a temperature and pressure detection mechanism 3 is arranged in the shell 1, the temperature detection end of the wrapping piece 304 is arranged outside the shell 1, the pressure detection end is arranged between the flexible circuit board 4 and the temperature detection end, a pressure sensing element 303 in the temperature and pressure detection mechanism 3 is arranged in the pressure detection end of the wrapping piece 304, a plurality of PIN needles 303c of the pressure sensing element 303 are connected with the flexible circuit board 4, a semicircular groove 303b of the pressure sensing element 303 is arranged between a pressure sensing area 303a and the PIN needles 303c, the temperature sensing element 301 in the temperature and pressure detection mechanism 3 is arranged in the temperature detection end, one end of a lead 302 in the temperature and pressure detection mechanism 3 is connected with the temperature sensing element 301, and the other end of the lead 302 penetrates through the semicircular groove 303b to be connected with the flexible circuit board 4. Like this temperature pressure detection mechanism 3 in piece 304, pressure-sensitive component 303, temperature-sensitive component 301 and lead wire 302 combine to form an organic whole, the pressure signal that pressure-sensitive area 303a surveyed among the pressure-sensitive component 303 transmits to flexible circuit board 4 through many PIN needles 303c, the temperature signal that temperature-sensitive component 301 surveyed transmits to flexible circuit board 4 through lead wire 302, be favorable to simplifying the structure of flexible circuit board 4, reduce spare part, make compact structure, be favorable to reduce cost. Thereby achieving the technical effects of simplifying the structure and reducing the cost.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by one skilled in the art based on the embodiments of the present invention, belong to the protection scope of the present invention; the "and/or" keyword referred to in this embodiment represents sum or two cases, in other words, a and/or B mentioned in the embodiment of the present invention represents two cases of a and B, A or B, and describes three states where a and B exist, such as a and/or B, which represents: only A does not include B; only B does not include A; including A and B.

It will be understood that, although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments. Spatially relative terms, such as "below," "above," and the like, may be used herein to describe one element or feature's relationship to another element or feature. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "lower" would then be oriented "upper" other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Also, in embodiments of the utility model where an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the utility model.

Referring to fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, fig. 1 is a first schematic diagram of a temperature and pressure sensor provided in an embodiment of the present invention, fig. 2 is a second schematic diagram of a temperature and pressure sensor provided in an embodiment of the present invention, fig. 3 is a third schematic diagram of a temperature and pressure sensor provided in an embodiment of the present invention, fig. 4 is a fourth schematic diagram of a temperature and pressure sensor provided in an embodiment of the present invention, and fig. 5 is a fifth schematic diagram of a temperature and pressure sensor provided in an embodiment of the present invention. The temperature and pressure sensor provided by the embodiment of the utility model comprises a shell 1, a flexible circuit board 4 and a temperature and pressure detection mechanism 3, wherein the shell 1, the flexible circuit board 4 and the temperature and pressure detection mechanism 3 are respectively explained in detail:

for the housing 1 and the flexible circuit board 4:

the housing 1 includes an open end 102, a connection end 101, and a penetration hole 103. The housing 1 includes a through hole 103, one end of the through hole 103 penetrates the connection end 101, and the other end of the through hole 103 and the medium hole 304a communicate with each other. A flexible circuit board 4 is mounted in the housing 1; the flexible circuit board 4 is mounted inside the open end 102.

Specifically, the material of the housing 1 may be a metal material, the open end 102 and the connecting end 101 are opposite ends of the housing 1, the open end 102 has a space for accommodating the flexible circuit board 4, the wrapping member 304, the pressure sensing element 303, the sealing member 2 and the electrical connector 5, a through hole 103 is provided in the housing 1, and the medium hole 304a communicates with the outside through the through hole 103, so that the pressure sensing area 303a of the pressure sensing element 303 is connected with the outside. The connecting end 101 has a threaded structure, and the connecting end 101 and the opening end 102 are communicated with each other to form a space matched with the wrapping piece 304 in the temperature and pressure detecting mechanism 3, so that after the wrapping piece 304 is embedded in the space, the pressure detecting end of the wrapping piece 304 is positioned in the space, and the temperature detecting end of the wrapping piece 304 is positioned outside the space. The flexible circuit board 4 can be installed inside the open end 102 of the housing 1, one end of the flexible circuit board 4 is installed on the pressure sensing element 303 and is coupled with the temperature sensing element 301 and the pressure sensing element 303 respectively to process the temperature signal and the pressure signal simultaneously and process and convert the temperature signal and the pressure signal, and the other end of the flexible circuit board 4 is coupled with the electrical connector 5 to output the temperature signal and the pressure signal.

For the temperature pressure detection mechanism 3:

the temperature and pressure detection mechanism 3 comprises a wrapping piece 304, a pressure sensing element 303, a temperature sensing element 301 and a lead 302, wherein the wrapping piece 304 is provided with a pressure detection end and a temperature detection end, the pressure detection end is installed in the shell 1, the temperature detection end is positioned outside the shell 1, and the pressure detection end is positioned between the flexible circuit board 4 and the temperature detection end; the wrapping member 304 is further provided with a medium hole 304a, and the medium hole 304a is connected with the pressure sensing area 303 a; wherein, a positioning groove 304b is arranged outside the pressure detection end. The wrapping member 304 is made of a high temperature resistant heat conducting material. The pressure sensing element 303 is installed inside the pressure detection end, the pressure sensing element 303 includes a pressure sensing area 303a and a plurality of PIN PINs 303c, the plurality of PIN PINs 303c are connected with the flexible circuit board 4, the pressure sensing element 303 further includes a semicircular groove 303b, and the semicircular groove 303b is located between the pressure sensing area 303a and the plurality of PIN PINs 303 c. The temperature sensing element 301 is installed in the temperature detection end; the temperature sensing element 301 is a thermistor. One end of the lead 302 is connected to the temperature sensing element 301, and the other end of the lead 302 penetrates the semi-circular groove 303b and is connected to the flexible circuit board 4. The pressure detection end is located in the opening end 102, and the other end of the lead 302 sequentially penetrates through the connection end 101 and the semicircular groove 303b to be connected with the flexible circuit board 4.

Specifically, the temperature sensing element 301, the pressure sensing element 303 and the lead 302 can be shaped into an integrated structure through the wrapping member 304, the whole formed integrated structure can be in a T-shaped structure, the pressure detection end and the temperature detection end are two opposite ends of the wrapping member 304 respectively, the pressure detection end can be located inside the opening end 102 to sense a pressure signal, and the temperature detection end extends out of the connecting end 101 to sense an external medium temperature signal. The side wall of the pressure detection end in the opening end 102 is provided with a positioning groove 304b, which can play a positioning role during assembly and is convenient for assembly. Inside the pressure sensing terminal is a space for accommodating the pressure sensing element 303, and a medium hole 304a is formed in the pressure sensing terminal such that the medium pressure can be transmitted to the pressure sensing area 303a of the pressure sensing element 303 through the medium hole 304 a. Pressure sensing element 303 can wholly present "protruding" type structure in temperature pressure detection mechanism 3, and the less end of pressure sensing element 303 is pressure sensing district 303a promptly, and pressure sensing district 303a can the inductive medium pressure, and the great end of pressure sensing element 303 stretches out 3 PIN needles 303c, and 3 PIN needles 303c and flexible circuit board 4 couplings can realize converting pressure signal into the signal of telecommunication. The lead 302 can be in a shape of a "Z" as a whole, one end of the lead 302 is connected to the temperature sensing element 301, the other end of the lead 302 penetrates through a semicircular groove 303b located on the side wall of the pressure sensing element 303, the cross section of the semicircular groove 303b can be in a semicircular shape, and the other end of the lead 302 extends out of the pressure detection end of the wrapping member 304 and then is coupled with the flexible circuit board 4, so that the temperature signal can be converted into an electrical signal.

The temperature and pressure sensor further comprises an electrical connector 5 and a sealing element 2, wherein the electrical connector 5 is connected with the flexible circuit board 4. The sealing member 2 is installed in the open end 102, and the sealing member 2 is located between the open end 102 and the pressure sensing element 303. The pressure sensing element 303 is circular, and the axis of the sealing element 2 is the same as the axis of the pressure sensing element 303. The sealing element 2 is an O-shaped sealing ring.

Specifically, a groove matched with the sealing element 2 may be provided inside the open end 102 of the housing 1, the sealing element 2 may be embedded in the groove, an axis of the sealing element 2 (a central axis in a vertical direction as shown in fig. 2) is the same as an axis of the pressure sensing element 303 (a central axis in a vertical direction as shown in fig. 2), and the sealing element 2 may be located between the open end 102 and the pressure sensing element 303, so that a closed space may be formed between an inner end surface of the open end 102 and a pressure detection end of the wrapping element 304, thereby preventing a medium from diffusing inside the sensor, and facilitating improvement of use accuracy and service life.

Referring to fig. 1 and fig. 2, the lower end of the housing 1 is in a thread form 101 to achieve connection with the outside, a through hole 103 is provided inside the threaded connection end 101 located at the lower end of the housing 1, a medium can enter the inside of the housing 1 from the through hole 103 located inside the threaded connection end 101, the upper end of the housing 1 is an open cavity structure, the flexible circuit board 4, the wrapping piece 304, the pressure sensing element 303, the sealing piece 2 and the electrical connector 5 can be placed inside the open cavity, the temperature and pressure detecting mechanism 3 is an integrated structure of the temperature sensing element 301 and the pressure sensing element 303, and the temperature and pressure detecting mechanism 3 can be located outside the connection end 101 as a whole, or a part of the temperature and pressure detecting mechanism 3 extends to the outside of the connection end 101, and the other part is inside the open end 102. The sealing member 2 is disposed inside the opening end 102, so that an isolated medium channel is formed between the casing 1 and the wrapping member 304, and the accuracy is prevented from being affected by the interference of the external medium on the electrical connection. The sealing element 2 can be an O-shaped sealing ring, and the material for manufacturing the sealing element 2 can be hydrogenated nitrile rubber or other high-low temperature resistant and corrosion resistant materials. The temperature and pressure detecting mechanism 3 may be provided with a medium hole 304a, so that the pressure sensing region 303a of the pressure sensing element 303 may be communicated with the outside to sense a pressure signal. The temperature and pressure detecting mechanism 3 is coupled with the flexible circuit board 4 to transmit the temperature signal sensed by the temperature sensing element 301 and the pressure signal sensed by the pressure sensing element 303. The flexible circuit board 4 can be made of a PI material, the flexible circuit board 4 is a printed circuit board with high reliability and good flexibility, and the flexible circuit board 4 has the advantages of high wiring density, light weight, thin thickness and good bending performance. One end of the flexible circuit board 4 is coupled with the temperature sensing element 301 and the pressure sensing element 303 respectively to process and convert the temperature signal and the pressure signal, and the other end of the flexible circuit board 4 is coupled with the electrical connector 5 to output the temperature signal and the pressure signal. The flexible circuit board 4 and the temperature and pressure detecting mechanism 3 may be coupled by soldering.

Referring to fig. 3 and 4, the temperature sensing element 301 and the pressure sensing element 303 can be integrated by injection molding, so that the overall structure is more compact and simple, and is easy to assemble and cost-effective. The manufacturing material of the wrapping piece 304 can be a high-temperature-resistant heat conduction material, the high-temperature-resistant heat conduction material is a material with high temperature resistance and high-efficiency heat conduction, a temperature signal can be conducted to the temperature sensing element 301 through the temperature detection end of the wrapping piece 304, and meanwhile, the effect of protecting the temperature sensing element 301 can be achieved in a corrosion-resistant medium environment. The lead 302 passes through the semicircular groove 303b of the pressure sensing element 303 and then is exposed outside the wrapping member 304 to be coupled with the flexible circuit board 4, so as to transmit a temperature signal, and the temperature sensing element 301 can be a thermistor or other temperature sensing sensitive component.

Referring to fig. 5, the smaller end of the pressure sensing element 303 is a pressure sensing area 303a, the pressure sensing area 303a can be used for sensing the medium pressure transmitted from a medium hole 304a formed in the temperature and pressure detecting mechanism 3, and 3 PIN PINs 303c extending from the larger end of the pressure sensing element 303 are coupled with the flexible circuit board 4, so that the pressure signal can be converted into an electrical signal. The pressure sensing element 303 may be a ceramic capacitive sensor element of a "convex" type as a whole, and the material of which the pressure sensing element 303 is made includes ceramic, metal, and the like.

The utility model provides a temperature and pressure sensor which is arranged in a shell 1 through a flexible circuit board 4, wherein a pressure detection end of a wrapping piece 304 in a temperature and pressure detection mechanism 3 is arranged in the shell 1, a temperature detection end of the wrapping piece 304 is arranged outside the shell 1, the pressure detection end is arranged between the flexible circuit board 4 and the temperature detection end, a pressure sensing element 303 in the temperature and pressure detection mechanism 3 is arranged in the pressure detection end of the wrapping piece 304, a plurality of PIN needles 303c of the pressure sensing element 303 are connected with the flexible circuit board 4, a semicircular groove 303b of the pressure sensing element 303 is arranged between a pressure sensing area 303a and the PIN needles 303c, the temperature sensing element 301 in the temperature and pressure detection mechanism 3 is arranged in the temperature detection end, one end of a lead 302 in the temperature and pressure detection mechanism 3 is connected with the temperature sensing element 301, and the other end of the lead 302 penetrates through the semicircular groove 303b to be connected with the flexible circuit board 4. Like this temperature pressure detection mechanism 3 in piece 304, pressure-sensitive component 303, temperature-sensitive component 301 and lead wire 302 combine to form an organic whole, the pressure signal that pressure-sensitive area 303a surveyed among the pressure-sensitive component 303 transmits to flexible circuit board 4 through many PIN needles 303c, the temperature signal that temperature-sensitive component 301 surveyed transmits to flexible circuit board 4 through lead wire 302, be favorable to simplifying the structure of flexible circuit board 4, reduce spare part, make compact structure, be favorable to reduce cost. Thereby the technical effects of simplifying the structure and reducing the cost are achieved.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.

Claims (10)

1. A temperature-pressure sensor, comprising: the temperature and pressure detection device comprises a shell, a flexible circuit board and a temperature and pressure detection mechanism, wherein the flexible circuit board is arranged in the shell; the temperature and pressure detection mechanism includes: the packaging piece is provided with a pressure detection end and a temperature detection end, the pressure detection end is installed in the shell, the temperature detection end is located outside the shell, and the pressure detection end is located between the flexible circuit board and the temperature detection end; the pressure sensing element is arranged in the pressure detection end and comprises a pressure sensing area and a plurality of PIN needles, the PIN needles are connected with the flexible circuit board, and the pressure sensing element further comprises a semicircular groove, and the semicircular groove is positioned between the pressure sensing area and the PIN needles; the temperature sensing element is arranged in the temperature detection end; one end of the lead is connected with the temperature sensing element, and the other end of the lead penetrates through the semicircular groove to be connected with the flexible circuit board.

2. The temperature pressure sensor of claim 1, wherein:

the shell comprises an opening end, a connecting end and a through hole;

the flexible circuit board is arranged in the opening end;

the pressure detection end is positioned in the opening end, and the other end of the lead sequentially penetrates through the connecting end and the semicircular groove to be connected with the flexible circuit board.

3. The temperature pressure sensor according to claim 2, wherein:

the wrapping piece is also provided with a medium hole, the medium hole is connected with the pressure sensing area, and the medium hole is positioned in the opening end;

the shell comprises a through hole, one end of the through hole penetrates through the connecting end, and the other end of the through hole is communicated with the medium hole.

4. The temperature pressure sensor of claim 1, further comprising:

an electrical connector connected to the flexible circuit board.

5. The temperature pressure sensor of claim 1, wherein:

and a positioning groove is arranged outside the pressure detection end.

6. The temperature pressure sensor of claim 2, further comprising:

a seal mounted within the open end, the seal being located between the open end and the pressure sensing element.

7. The temperature pressure sensor of claim 6, wherein:

the pressure sensing element is circular, and the axis of the sealing element is the same as that of the pressure sensing element.

8. The temperature pressure sensor of claim 6, wherein:

the sealing element is an O-shaped sealing ring.

9. The temperature pressure sensor of claim 1, wherein:

the temperature sensing element is a thermistor.

10. The temperature pressure sensor of claim 1, wherein:

the wrapping piece is made of high-temperature-resistant heat-conducting materials.

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