CN114427887A - Temperature and pressure sensor - Google Patents

Temperature and pressure sensor Download PDF

Info

Publication number
CN114427887A
CN114427887A CN202210066975.9A CN202210066975A CN114427887A CN 114427887 A CN114427887 A CN 114427887A CN 202210066975 A CN202210066975 A CN 202210066975A CN 114427887 A CN114427887 A CN 114427887A
Authority
CN
China
Prior art keywords
sensing element
temperature
diameter section
pressure
pressure sensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210066975.9A
Other languages
Chinese (zh)
Inventor
何文超
何俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiaogan Huagong Gaoli Electron Co Ltd
Original Assignee
Xiaogan Huagong Gaoli Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiaogan Huagong Gaoli Electron Co Ltd filed Critical Xiaogan Huagong Gaoli Electron Co Ltd
Priority to CN202210066975.9A priority Critical patent/CN114427887A/en
Publication of CN114427887A publication Critical patent/CN114427887A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • G01D21/02Measuring two or more variables by means not covered by a single other subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00Component parts of measuring arrangements not specially adapted for a specific variable
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24Housings ; Casings for instruments
    • G01D11/245Housings for sensors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention provides a temperature and pressure sensor which comprises a shell, a temperature sensing element, a pressure sensing element, a flexible circuit board and an electric connector, wherein the electric connector and the shell are enclosed to form an accommodating cavity, the temperature sensing element, the pressure sensing element and the flexible circuit board are sequentially arranged in the accommodating cavity along the direction from the shell to the electric connector, the temperature sensing end of the temperature sensing element extends out of the shell, the electric connector is provided with a limiting structure for limiting and fixing the pressure sensing element and the temperature sensing element, the limiting structure is positioned in the accommodating cavity, and the pressure sensing element and the temperature sensing element are respectively provided with a limiting groove matched with the limiting structure.

Description

Temperature and pressure sensor
Technical Field
The invention relates to the technical field of pressure sensors, in particular to a temperature and pressure sensor.
Background
Sensor technology is one of the important technologies of modern measurement and automation systems, and almost every technology cannot be separated from a sensor from the process control of production to the life of modern science and technology. Temperature and pressure sensors are two of the most widely used sensors in the sensor industry, and are often used together, especially in some places, temperature and pressure are measured at multiple positions, and the use of the temperature and pressure sensors alone makes the system more complicated and costly. The temperature and pressure sensor well solves the problem, and particularly shows unique charm in places with limited space. The temperature and pressure sensor is a novel sensor, conforms to the development requirement, can better meet the requirement of a customer, is a breakthrough in the sensor industry, and is a new research hotspot.
The existing temperature and pressure sensor has a complex structure, so that the manufacturing process and the assembling process of the sensor are complex, and the manufacturing cost is increased.
Therefore, there is a need to design a new temperature and pressure sensor to overcome the above problems.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a structural design of a temperature and pressure sensor which has the advantages of compact structure, simple components, low manufacturing cost and convenient assembly, and at least solves part of problems in the prior art.
The invention is realized by the following steps:
the invention provides a temperature and pressure sensor which comprises a shell, a temperature sensing element, a pressure sensing element, a flexible circuit board and an electric connector, wherein the electric connector and the shell are enclosed to form an accommodating cavity, the temperature sensing element, the pressure sensing element and the flexible circuit board are sequentially arranged in the accommodating cavity along the direction from the shell to the electric connector, the temperature sensing end of the temperature sensing element extends out of the shell, the electric connector is provided with a limiting structure for limiting and fixing the pressure sensing element and the temperature sensing element, the limiting structure is positioned in the accommodating cavity, and the pressure sensing element and the temperature sensing element are respectively provided with a limiting groove matched with the limiting structure.
Further, temperature-sensing element is the step shaft structure, including big diameter section and little diameter section, big diameter section is located accept the cavity, little diameter section stretches out the casing, pressure-sensing element locates on the big diameter section.
Further, the temperature sensing element comprises a temperature sensing chip, a lead and a wrapping piece, the temperature sensing chip is arranged in the small-diameter section, and the temperature sensing chip, the lead and the wrapping piece are integrally formed in an injection molding mode.
Furthermore, a shell threaded connection end connected with the outside is arranged at one end of the shell, a shell through hole for the small-diameter section to extend out is formed in the shell threaded connection end, a shell opening cavity is formed in the other end of the shell, the large-diameter section, the pressure sensing element and the flexible circuit board are located in the shell opening cavity, and the electrical connector blocks the shell opening cavity.
Furthermore, a guide square groove for the limiting structure to penetrate through is formed in the side wall of the pressure sensing element, a buckle guide square groove for the limiting structure to stretch into is formed in the side wall of the large-diameter section, a buckle is arranged on the buckle guide square groove, and a buckle groove matched with the buckle is formed in the limiting structure.
Further, the horizontal cross section of the large-diameter section and the horizontal cross section of the pressure sensing element are both circular, and the diameter of the large-diameter section is equal to that of the pressure sensing element.
Furthermore, two leads connected with the temperature sensing chip extend out of the large-diameter section, a semicircular groove for the leads to penetrate through is further formed in the side wall of the pressure sensing element, the leads are coupled with a flexible circuit board, the flexible circuit board is arranged on the upper end face of the pressure sensing element, and the electric connector and the pressure sensing element are coupled with the flexible circuit board.
Furthermore, the lower end face of the pressure sensing element is a pressure sensing area, the lower end face of the pressure sensing element is in contact with the upper end face of the large-diameter section, a gap for medium to flow in is formed between the small-diameter section and the through hole of the shell, and the large-diameter section is provided with a medium channel which enables the pressure sensing area of the pressure sensing element to be in contact with external medium.
Furthermore, a first groove is formed in the end face, facing the large-diameter section, of the shell opening cavity, and a first sealing element is arranged in the first groove.
Furthermore, a second groove is formed in the upper end face of the large-diameter section, a second sealing element is arranged in the second groove, a sealed area is formed between the pressure sensing element and the temperature sensing element, and the second sealing element is arranged around the medium channel.
The invention has the following beneficial effects:
according to the structural design of the temperature and pressure sensor, the main components are only the shell, the temperature sensing element, the pressure sensing element, the flexible circuit board and the electrical connector, so that the number of parts is small, the adhesion is close and reliable, and the cost is low; the temperature sensing element is integrally formed, additional processing is not needed, the manufacturing is simple and rapid, the lead passes through the pressure sensing element and is directly coupled with the flexible circuit board, and the problems that the temperature sensing element is coupled with the flexible circuit board by using a complex structure and the assembly is complex in the traditional sensor are solved; the flexible circuit board has a simple structure, and can be coupled with a pressure sensing element and a temperature sensing element to process pressure and temperature signals at the same time by changing the flexible circuit board into a complex structural form different from the traditional sensor; the electric connector, the pressure sensing element and the temperature sensing element are all in a structure design with limited fixing, the temperature sensing element, the pressure sensing element, the flexible circuit board and the electric connector can be assembled into a whole in advance during assembly, and the electric connector is directly installed in an opening of the shell, so that the electric connector is compact in structure, convenient to assemble and convenient for batch production.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is an exploded view of a temperature and pressure sensor provided by an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a temperature and pressure sensor provided by an embodiment of the present invention;
FIG. 3 is a schematic diagram of a temperature sensing device according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of a temperature sensing device according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a pressure sensing component according to an embodiment of the present invention;
FIG. 6 is a schematic view of an electrical connector according to an embodiment of the present invention;
fig. 7 is a schematic diagram of an assembly of an electrical connector, a flexible circuit board, a pressure sensing element, and a temperature sensing element according to an embodiment of the invention.
The reference numbers in the figures denote: 1-a shell; 101-a housing threaded end; 102-a housing open cavity; 103-housing through hole; 2-a first seal; 3-a temperature sensing element; 301-temperature sensing chip; 302-lead; 303-a wrapper; 304-a media channel; 305-a snap guide square groove; 4-a second seal; 5-a pressure sensitive element; 501-a semicircular groove; 502-a guide square groove; 6-a flexible circuit board; 7-an electrical connector; 701-limiting structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if the present embodiment relates to directional indications (such as upper, lower, front, and rear … …), the directional indications are only used to explain the relative relationship between the components in a specific posture (as shown in the figure), and if the specific posture changes, the directional indications also change accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature.
Referring to fig. 1 to 7, an embodiment of the present invention provides a temperature and pressure sensor, including a housing 1, a temperature sensing element 3, a pressure sensing element 5, a flexible circuit board 6, an electrical connector 7, the electric connector 7 and the shell 1 enclose to form a containing cavity, the temperature sensing element 3, the pressure sensing element 5 and the flexible circuit board 6 are sequentially arranged in the containing cavity along the direction from the shell 1 to the electric connector 7, the temperature sensing end of the temperature sensing element 3 extends out of the shell 1, the electric connector 7 is provided with a limiting structure 701 for limiting and fixing the pressure sensing element 5 and the temperature sensing element 3, the limiting structure 701 is located in the accommodating cavity, and limiting grooves (a guide square groove 502 and a buckle guide square groove 305 respectively) matched with the limiting structure 701 are formed in the pressure sensing element 5 and the temperature sensing element 3.
Temperature-sensing element 3 is the step shaft structure, including big diameter section and little diameter section, big diameter section is located accept the cavity, little diameter section stretches out casing 1, be equipped with temperature sensing chip 301 in the little diameter section, forced induction element 5 is located on the big diameter section. The temperature sensing element 3 is integrally formed. The temperature sensing element 3 comprises a temperature sensing chip 301, a lead 302 and a wrapping piece 303, wherein the temperature sensing chip 301, the lead 302 and the wrapping piece 303 are integrally formed by injection molding, the wrapping piece 303 is made of high-temperature-resistant heat-conducting material, and the lead 302 is partially exposed outside the wrapping piece 303.
The casing 1 one end is equipped with the casing threaded connection end 101 with external connection, threaded connection end 101 is equipped with the casing through hole 103 that supplies the minor diameter section to stretch out, the other end of casing 1 is equipped with casing opening chamber 102, major diameter section, pressure-sensitive element 5, flexible circuit board 6 are located in casing opening chamber 102, electrical connector 7 part is arranged in casing opening chamber 102, electrical connector 7 blocks up casing opening chamber 102.
The side wall of the pressure sensing element 5 is provided with a guide square groove 502 for the limiting structure 701 to pass through, the side wall of the large-diameter section is provided with a buckle guide square groove 305 for the limiting structure 701 to extend into, the buckle guide square groove 305 is provided with a buckle, and the limiting structure 701 is provided with a buckle groove matched with the buckle. The horizontal cross section of the large-diameter section and the horizontal cross section of the pressure sensing element 5 are both circular, and the diameter of the large-diameter section is equal to that of the pressure sensing element 5. Two leads 302 connected with the temperature sensing chip 301 extend out of the large-diameter section, a semicircular groove 501 for the leads 302 to pass through is further arranged on the side wall of the pressure sensing element 5, the leads 302 are coupled (electrically connected) with the flexible circuit board 6, the flexible circuit board 6 is arranged on the upper end face of the pressure sensing element 5, and the electrical connector 7 and the pressure sensing element 5 are both coupled (electrically connected) with the flexible circuit board 6.
The lower end face of the pressure sensing element 5 is a pressure sensing area, the lower end face of the pressure sensing element 5 is in contact with the upper end face of the large-diameter section, a gap for medium to flow in is formed between the small-diameter section and the shell through hole 103, and the large-diameter section is provided with a medium channel 304 which enables the pressure sensing area of the pressure sensing element 5 to be in contact with an external medium. The end face of the shell opening cavity 102 facing the large-diameter section is provided with a first groove, and a first sealing element 2 is arranged in the first groove, so that a closed space is formed between the end face and the temperature sensing element 3, and external media are prevented from diffusing in the sensor, so that the use precision and the service life are influenced. A second groove is formed in the upper end face of the large-diameter section, a second sealing element 4 is arranged in the second groove, a sealed interval is formed between the pressure sensing element 5 and the temperature sensing element 3, and the second sealing element 4 is arranged around the medium channel 304.
As shown in fig. 3-7, the end face of the electrical connector 7 is designed with a position-limiting structure 701, which is matched with the guide square groove 502 of the pressure-sensing element 5 and the snap guide square groove 305 of the temperature-sensing element 3, so as to combine the electrical connector 7, the flexible circuit board 6, the pressure-sensing element 5, the second sealing element 4 and the temperature-sensing element 3 into a whole, and then the whole is installed in the housing 1, so that the assembly is convenient and efficient.
A temperature and pressure sensor structure design comprises a shell, a temperature sensing element, a pressure sensing element, a flexible circuit board, an electric connector and the like. One end of the shell is in a thread form and is connected with the outside, and the other end of the shell is an open cavity; the temperature sensing element part is arranged in the opening cavity, and a sealing piece is arranged between the temperature sensing element and the cavity to form a sealing interval; the temperature sensing element is of a T-shaped structure, part of the temperature sensing element extends to the outside of the threaded connection end of the shell, and a temperature sensing chip is arranged on the temperature sensing element; the temperature sensing element is in contact with the pressure sensing element in the shell and is coupled with the flexible circuit board, and a sealing member is arranged between the temperature sensing element and the pressure sensing element; the temperature sensing element is provided with a medium channel, so that a pressure sensing area of the pressure sensing element is connected with the outside; the pressure sensing element is coupled with a flexible circuit board; one end of the flexible circuit board is coupled with the temperature sensing element and the pressure sensing element to process and convert the pressure signal and the temperature signal, and the other end of the flexible circuit board is coupled with the electrical connector; the electric connector is provided with a limiting structure which can limit and fix the pressure sensing element and the temperature sensing element.
Preferably, the housing is a generally metal housing having a threaded end for connection to the outside and an open cavity at the other end for receiving the temperature sensing element, the pressure sensing element, the flexible circuit board and a portion of the electrical connector.
Preferably, a part of the temperature sensing element is arranged in the opening cavity of the shell, and the other part of the temperature sensing element extends to the outside of the threaded connection part of the shell to sense an external medium temperature signal.
Preferably, the end face of the inner part of the cavity of the shell is provided with a groove, a first sealing element is arranged in the groove, and the first sealing element and the temperature sensing element are coaxial, so that a closed space is formed between the end face of the inner part of the cavity of the shell and the temperature sensing element, and the medium is prevented from diffusing in the sensor, so that the use precision and the service life are influenced.
Preferably, the temperature sensing element comprises a temperature sensing chip, a lead and a wrapping piece, and the temperature sensing chip can be a thermistor and other sensitive parts; the lead extends from the temperature sensing chip, is coupled with the flexible circuit board and transmits temperature signals, the wrapping piece is filled with the temperature sensing chip and part of the lead, and can be made of metal or plastic, insulating temperature-resistant heat-conducting materials, so that the temperature sensing chip is protected, the reliability of temperature sensing is enhanced, and the service life of the temperature sensing chip is prolonged.
Preferably, the temperature sensing element is provided with a medium channel, and an external medium can be transmitted to the surface of the pressure sensing area of the pressure sensing element through a through hole at the threaded connection part of the shell and the opening of the temperature sensing element.
Preferably, the upper end surface of the temperature sensing element is provided with a groove, and a second sealing member is arranged in the groove, so that a sealed interval is formed between the pressure sensing element and the temperature sensing element, and the medium is prevented from overflowing and scattering out of the pressure sensing area.
Preferably, guide buckle square grooves are formed in two sides of the upper end of the temperature sensing element, a limiting structure is arranged on the upper end face of the electric connector, and the limiting structure is clamped in the guide buckle square grooves.
Preferably, the lower end face of the pressure sensing element is a pressure sensing area capable of sensing a pressure signal, and the upper end face of the pressure sensing element is coupled with the flexible circuit board to convert the pressure signal into an electrical signal.
Preferably, two square guide grooves are formed in the side wall of the pressure sensing element, and the electrical connector is provided with a limiting structure matched with the square guide grooves to limit the installation position of the pressure sensing element.
Preferably, the side wall of the pressure sensing element is provided with a semicircular groove, and a lead of the temperature sensing element passes through the semicircular groove to be coupled with the flexible circuit board.
Preferably, the flexible circuit board is disposed on the pressure sensing element, is coupled with the pressure sensing element and the temperature sensing element, processes the temperature signal and the pressure signal, and converts the temperature signal and the pressure signal into electrical signals for output.
Preferably, the electrical connector portion is disposed in the open cavity of the housing, coupled to the flexible circuit board, and configured to receive electrical signals of temperature and pressure.
Preferably, the upper end face of the electrical connector is provided with an extended limiting structure, and the limiting structure penetrates through the pressure sensing element and is clamped with the temperature sensing element.
As shown in fig. 1-2, the present embodiment provides a structural design of a temperature and pressure sensor, which mainly includes a housing 1, a temperature sensing element 3, a pressure sensing element 5, a flexible circuit board 6, an electrical connector 7, and other components. One end of the shell 1 is a threaded connection end 101 and is connected with the outside, a through hole 103 is formed in the threaded connection end 101 of the shell 1, a medium can enter the shell 1 through the through hole 103 in the threaded connection end 101, and the other end of the shell is an open cavity (a shell opening cavity 102); the temperature sensing element 3 is partially arranged in the open cavity, a first sealing element 2 is arranged between the temperature sensing element 3 and the open cavity, and the first sealing element 2 can prevent external media from overflowing to other areas in the shell 1 through a through hole 103 of the threaded connection end 101 of the shell 1, so that the media are prevented from generating interference on electrical connection to cause failure; in this embodiment, the first sealing element 2 is an O-ring made of hydrogenated nitrile rubber or other high/low temperature and corrosion resistant materials; the temperature sensing element 3 is of a T-shaped structure, part of the temperature sensing element extends to the outside of the threaded connection end 101 of the shell 1, and a temperature sensing chip 301 is arranged on the temperature sensing element, wherein the temperature sensing chip is a thermistor in the embodiment and can also be other sensitive parts; the temperature sensing element 3 is provided with a lead 302 led out from the temperature sensing chip 301, and the lead 302 passes through the pressure sensing element 5 and is coupled with the flexible circuit board 6; the pressure sensing element 5 is arranged in the shell opening cavity 102, the lower end face of the pressure sensing element 5 is in contact with the upper end face of the temperature sensing element 3, a second sealing element 4 is arranged between the pressure sensing element 5 and the temperature sensing element 3, and the second sealing element 4 is also an O-shaped sealing ring in the embodiment and is made of hydrogenated nitrile rubber or other high-low temperature resistant and corrosion resistant materials; the flexible circuit board 6 is arranged at the upper end of the pressure sensing element 5, is made of PI (polyimide) in the embodiment, has the characteristics of high reliability, excellent flexible printed circuit board, high wiring density, light weight, thin thickness and good bending, and one end of the flexible circuit board 6 is coupled with the pressure sensing element 5 to process and convert pressure signals into electric signals; the other end of the flexible circuit board 6 is coupled with the electrical connector 7, and the temperature and pressure electrical signals are output to the electrical connector 7.
As shown in fig. 3-6, the temperature sensing element 3 includes a temperature sensing chip 301, a lead 302 and a wrapping member 303; the temperature sensing chip 301, the lead 302 and the wrapping piece 303 are integrally formed in an injection molding mode in the embodiment, additional processing and manufacturing are not needed, the manufacturing process is simple, the structure is compact, and the occupied space is small; the wrapping piece 303 is a high-temperature-resistant heat-conducting material, can transmit a temperature signal to the temperature sensing chip 301, and plays a role in protecting the temperature sensing chip 301, particularly in a corrosion-resistant medium environment; the lead 302 is partially exposed outside the packaging member 303 and can pass through the semicircular groove 501 of the pressure sensing element 5 to be coupled with the flexible circuit board 6 to transmit a temperature signal; the temperature sensing element 3 is provided with a medium channel 304, so that a pressure sensing area of the pressure sensing element 5 is connected with the outside, and an external medium can reach the pressure sensing area of the pressure sensing element 5 through the medium channel 304 to sense external pressure; the temperature sensing element 3 is provided with a square buckle guide groove 305, and the square buckle guide groove 305 can be connected with a limiting structure 701 of the electrical connector 7 in a clamping manner to play a role in fixing and limiting.
As shown in fig. 3 to 6, the pressure sensing element 5 is a ceramic capacitive sensor element in this embodiment, and is made of a material such as ceramic, metal, or other suitable sensor elements; the pressure sensing element is provided with a semicircular groove 501 for the lead 302 of the temperature sensing element 3 to pass through; the pressure sensing element is provided with a guide square groove 502 which can be matched with a limiting structure 701 of the electrical connector 7 to limit the position of the pressure sensing element 5 and prevent the pressure sensing element from shifting randomly.
Details not described in this specification are within the skill of the art that are well known to those skilled in the art.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (10)

1. A temperature-pressure sensor, characterized by: including casing, temperature-sensing element, forced induction component, flexible circuit board, electric connector with the casing encloses into one and accepts the cavity, temperature-sensing element, forced induction component, flexible circuit board are followed the casing extremely electric connector's direction is located in proper order in acceping the cavity, the temperature sensing end of temperature-sensing element stretches out the casing, electric connector is last to be equipped with the limit structure who is used for spacing fixed forced induction component and temperature-sensing element, limit structure is located accept in the cavity, all be equipped with on forced induction component, the temperature-sensing element with limit structure complex spacing groove.
2. The temperature pressure sensor of claim 1, wherein: the temperature sensing element is the step shaft structure, including big diameter section and little diameter section, big diameter section is located accept the cavity, little diameter section stretches out the casing, the forced induction component is located on the big diameter section.
3. The temperature pressure sensor according to claim 2, wherein: the temperature sensing element comprises a temperature sensing chip, a lead and a wrapping piece, wherein the temperature sensing chip is arranged in the small-diameter section, and the temperature sensing chip, the lead and the wrapping piece are integrally formed through injection molding.
4. The temperature pressure sensor according to claim 3, wherein: casing one end is equipped with the casing threaded connection end with external connection, casing threaded connection end is equipped with the casing through hole that supplies the minor diameter section to stretch out, the other end of casing is equipped with casing open cavity, major diameter section, pressure-sensitive element, flexible circuit board are located in the casing open cavity, the shutoff of electrical connector the casing open cavity.
5. The temperature pressure sensor according to claim 4, wherein: the lateral wall of the pressure sensing element is provided with a guide square groove for the limiting structure to pass through, the lateral wall of the large-diameter section is provided with a buckle guide square groove for the limiting structure to stretch into, the buckle guide square groove is provided with a buckle, and the limiting structure is provided with a buckle groove matched with the buckle.
6. The temperature pressure sensor of claim 5, wherein: the horizontal cross section of the large-diameter section and the horizontal cross section of the pressure sensing element are both circular, and the diameter of the large-diameter section is equal to that of the pressure sensing element.
7. The temperature pressure sensor of claim 6, wherein: two leads connected with the temperature sensing chip extend out of the large-diameter section, a semicircular groove for the leads to penetrate is further formed in the side wall of the pressure sensing element, the leads are coupled with a flexible circuit board, the flexible circuit board is arranged on the upper end face of the pressure sensing element, and the electric connector and the pressure sensing element are coupled with the flexible circuit board.
8. The temperature pressure sensor of claim 7, wherein: the lower end face of the pressure sensing element is a pressure sensing area, the lower end face of the pressure sensing element is in contact with the upper end face of the large-diameter section, a gap for medium to flow into is formed between the small-diameter section and the through hole of the shell, and a medium channel enabling the pressure sensing area of the pressure sensing element to be in contact with an external medium is formed in the large-diameter section.
9. The temperature pressure sensor of claim 8, wherein: a first groove is formed in the end face, facing the large-diameter section, of the shell opening cavity, and a first sealing element is arranged in the first groove.
10. The temperature pressure sensor of claim 8, wherein: and a second groove is formed in the upper end face of the large-diameter section, a second sealing element is arranged in the second groove, so that a sealed interval is formed between the pressure sensing element and the temperature sensing element, and the second sealing element is arranged around the medium channel.
CN202210066975.9A 2022-01-20 2022-01-20 Temperature and pressure sensor Pending CN114427887A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210066975.9A CN114427887A (en) 2022-01-20 2022-01-20 Temperature and pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210066975.9A CN114427887A (en) 2022-01-20 2022-01-20 Temperature and pressure sensor

Publications (1)

Publication Number Publication Date
CN114427887A true CN114427887A (en) 2022-05-03

Family

ID=81313486

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210066975.9A Pending CN114427887A (en) 2022-01-20 2022-01-20 Temperature and pressure sensor

Country Status (1)

Country Link
CN (1) CN114427887A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024077820A1 (en) * 2022-10-09 2024-04-18 无锡莱顿电子有限公司 Temperature and pressure sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024077820A1 (en) * 2022-10-09 2024-04-18 无锡莱顿电子有限公司 Temperature and pressure sensor

Similar Documents

Publication Publication Date Title
EP1980830B1 (en) Pressure sensor device including temperature sensor contained in common housing
EP2559987B1 (en) Combination pressure/temperature in a compact sensor assembly
KR100983814B1 (en) Pressure sensor having a metal diaphragm responsive to pressure
US11422050B2 (en) Temperature-pressure integrated sensor with improved assembly and processing
KR100534560B1 (en) Pressure sensor device having temperature sensor
CN216954627U (en) Quick temperature-sensing square capacitive temperature and pressure sensor
KR102006750B1 (en) Sensor assembly for measuring temperature or pressure
CN216954626U (en) Temperature and pressure sensor
JP2009544028A (en) Pressure detection device
CN114427887A (en) Temperature and pressure sensor
US5848094A (en) Heat transmission monitoring and/or measuring apparatus
US20210381909A1 (en) Sensor Arrangement Having a Temperature Sensor Element and Method For Its Production
CN218121028U (en) Temperature and pressure sensor
CN211877068U (en) Sensor with a sensor element
CN114427886A (en) Quick temperature-sensing square capacitive temperature and pressure sensor
CN214308873U (en) Sensor with a sensor element
CN219869750U (en) Quick temperature sensing temperature pressure sensor
CN210981349U (en) Temperature and pressure integrated transmitter
JP2006194682A (en) Pressure sensor system with integrated temperature sensor
US6962085B2 (en) Pressure detector having elongate housing containing pressure-sensitive element therein
CN113108829A (en) Sensor assembly
CN220380654U (en) Low pressure sensor
CN109073492B (en) Pressure sensor device
CN217032584U (en) Temperature and pressure sensor
CN218724903U (en) Ceramic capacitance type pressure sensor

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination