CN220729491U - Temperature and pressure sensor - Google Patents
Temperature and pressure sensor Download PDFInfo
- Publication number
- CN220729491U CN220729491U CN202322404861.3U CN202322404861U CN220729491U CN 220729491 U CN220729491 U CN 220729491U CN 202322404861 U CN202322404861 U CN 202322404861U CN 220729491 U CN220729491 U CN 220729491U
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- China
- Prior art keywords
- circuit board
- flexible circuit
- injection molding
- temperature
- connector
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- 238000001746 injection moulding Methods 0.000 claims abstract description 37
- 239000000523 sample Substances 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 239000003990 capacitor Substances 0.000 claims abstract description 7
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000004720 fertilization Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002354 daily effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The utility model discloses a temperature and pressure sensor, which comprises a connector, a flexible circuit board, a chip element, a capacitance element, a thermistor, a shell and a temperature probe; the connector comprises a connector, a first flexible circuit board, a chip element and a second flexible circuit board, wherein a connector assembly is arranged at one end of the connector, and the other end of the connector is sequentially connected with the first flexible circuit board, the chip element and the second flexible circuit board; the second flexible circuit board is connected with the capacitive element, and the second flexible circuit board and the capacitive element are provided with a limiting hole of the concentric capacitive element and a limiting hole of the injection molding piece; the thermistor is connected with an injection molding piece, and the injection molding piece is tightly connected with the capacitor element through an internal sealing ring; and the thermistor is tightly connected with the shell through the shell sealing ring after being welded with the injection molding piece. Compared with the prior art, the structure is simpler and more compact, the installation is convenient, and the application range is wide.
Description
Technical Field
The utility model belongs to the technical field of sensors, and particularly relates to a temperature and pressure sensor.
Background
Sensors are used in everyday items such as touch-sensitive elevator buttons (tactile sensors) and lights that are dimmed or lightened by touching the base, and countless applications that most people have never come to appreciate. With the development of micro-mechanical technology and the development of an easy-to-use micro-controller platform, the application of sensors has been extended to the traditional temperature, pressure or flow measurement field, for example to MARG sensors. In addition, analog sensors such as potentiometers and force sensing resistors are still widely used. The range of applications includes manufacturing and machinery, aircraft and aerospace, automotive, medical, robotics, and many other aspects of our daily lives. There are a variety of other sensors that can measure chemical and physical properties of materials. Some examples include optical sensors for refractive index measurements, vibration sensors for fluid viscosity measurements, and electrochemical sensors for monitoring fluid pH.
As in chinese patent CN102980714, a compact pressure/temperature combined sensor assembly is disclosed, which is provided with a middle plate assembly comprising at least one disc-shaped element and a hollow probe element, in which a temperature sensor element is mounted, the lead wires of which pass through the hollow probe element and through the middle plate assembly to the hollow volume of the recess and finally coupled with the terminals of the electronic circuit. In such a sensor assembly, the threading operation of the wires of the temperature sensor element is inefficient, and the coupling of the wires to the terminals requires a proper process, which may cause damage to the wires, thereby affecting the electrical connection performance of the sensor. In addition, the disk-shaped element and the hollow probe element which form the middle plate assembly are required to be assembled after being respectively processed and molded, so that the manufacturing process of the sensor is complicated, and the manufacturing cost of the sensor is increased.
European patent EP2749855A2 discloses a sensor assembly having a protective cover injection molded from plastic for mounting and exposing the sensor assembly to a medium measured by the sensor, the sensor assembly being relatively large in size and limited in application, and in addition, the sensor assembly being adapted to different temperature measurement requirements by varying the length of the sensor probe, which means that the sensor probe is injection molded to different lengths for different measurement applications as required, which is complex and costly to manufacture.
US7762140B2 discloses a temperature and pressure sensor, in which a ceramic chip printed circuit and a temperature probe are injection molded in a plastic part, and a temperature signal is contacted with the circuit of the ceramic chip by a spring plate mode, but the scheme is not reliable in linkage, and the printed circuit is easily worn in vibration occasions, so that the signal contact is good.
The problem in the prior art is that the assembly is relatively complicated, and the ceramic capacitor and the base are required to be wound after being bent during the assembly, so that the automatic assembly is difficult to realize, and the assembly efficiency is reduced.
Disclosure of Invention
In view of the above, the utility model aims to provide a temperature and pressure sensor for realizing the mechanization of soil loosening and fertilization, which can effectively improve the working efficiency of soil loosening and fertilization, reduce the investment of manpower and lower the labor cost.
In order to solve the technical problems, the technical scheme of the utility model is that the temperature and pressure sensor comprises a connector, a flexible circuit board, a chip element, a capacitance element, a thermistor, an injection molding piece, a shell and a temperature probe; the connector comprises a connector, a first flexible circuit board, a chip element and a second flexible circuit board, wherein a connector assembly is arranged at one end of the connector, and the other end of the connector is sequentially connected with the first flexible circuit board, the chip element and the second flexible circuit board; the second flexible circuit board is connected with the capacitive element, and the second flexible circuit board and the capacitive element are provided with a limiting hole of the concentric capacitive element and a limiting hole of the injection molding piece; the thermistor is connected with an injection molding piece, and the injection molding piece is tightly connected with the capacitor element through an internal sealing ring; and the thermistor is tightly connected with the shell through the shell sealing ring after being welded with the injection molding piece.
Preferably, the housing includes a receiving cavity and a temperature probe in communication with the receiving cavity.
Preferably, the outer part of the accommodating cavity is in a threaded cylindrical shape.
Preferably, the PIN of the injection molding part is electrically linked with the flexible circuit board through a capacitive element.
Preferably, the number of the shell sealing rings is two.
Preferably, the shape of the capacitive element is a notch shape or a via shape.
Preferably, when the shape of the capacitive element is a notch shape, the injection molding piece is in snap connection with the capacitive element; when the shape of the capacitive element is a notch shape, the injection molding piece is connected with the capacitive element in an embedded mode.
Compared with the prior art, the utility model provides a temperature and pressure sensor, which has the following beneficial effects:
(1) Compared with the prior art, the structure is simpler and more compact, the installation is convenient, and the application range is wide;
(2) The assembly is more convenient, and the manufacturing efficiency is high;
(3) The PIN foot injection molding design is beneficial to the assembly of the temperature sensor;
(4) And the design of the through holes or the gaps of the ceramic capacitor is beneficial to the assembly of the assembly.
Drawings
FIG. 1 is an exploded view of the present utility model;
FIG. 2 is a first exploded view of the present utility model;
FIG. 3 is a second exploded view of the present utility model;
fig. 4 is a schematic view of an injection molding part without the PIN wrap of the present utility model;
fig. 5 is a schematic view of an injection molding part with an injection molded package on a PIN of the present utility model;
FIG. 6 is a schematic view of the shape of the through hole of the container according to the present utility model;
FIG. 7 is a schematic view of the shape of the notch of the container of the present utility model.
Wherein, 1-connector; 2-a flexible circuit board; 3-chip elements; a 4-capacitance element; 401-a limiting aperture of the capacitive element; a 5-thermistor; 6-a housing; 7-a temperature probe; 9-injection molding; 10-an inner seal ring; 11-a housing seal ring; 201-a first flexible circuit board; 202-a second flexible circuit board; a 101-connector; 601-a receiving cavity; 602-threaded cylinder; 901-PIN foot; 902-limiting holes of the injection molding.
Detailed Description
The following detailed description of the utility model is provided in connection with the accompanying drawings to facilitate understanding and grasping of the technical scheme of the utility model.
In this embodiment, it should be understood that the directions or positional relationships indicated by the terms "middle", "upper", "lower", "top", "right", "left", "upper", "back", "middle", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present utility model, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model.
In this embodiment, if not specifically described, the connection or fixation between the members may be by a bolt, a pin, or a pin, which are commonly used in the prior art, and therefore, will not be described in detail in this embodiment.
Referring to fig. 1-2, the technical effects of the present utility model are mainly that a temperature and pressure sensor includes a connector 1, a flexible circuit board 2, a chip element 3, a capacitor element 4, a thermistor 5, a housing 6, a temperature probe 7 and an injection molding 9; wherein, a connector 101 is installed at one end of the connector 1, and the other end of the connector 1 is sequentially connected with a first flexible circuit board 201, a chip element 3 and a second flexible circuit board 202; the second flexible circuit board 202 is connected with the capacitive element 4, and the second flexible circuit board 202 and the capacitive element 4 are provided with a limiting hole 8 of the concentric capacitive element 4 and a limiting hole 902 of the injection molding piece 9; the thermistor 5 is connected with an injection molding piece 9, and the injection molding piece 9 is tightly connected with the capacitor element 4 through an internal sealing ring; the thermistor 5 is tightly connected with the shell 6 through the shell sealing ring 11 after being welded with the injection molding piece 9.
Preferably, the housing 6 comprises a receiving cavity 601 and a temperature probe 7 in communication with the receiving cavity 601.
Preferably, the outer part of the accommodating cavity 601 is a threaded cylinder 602.
Preferably, PIN 901 of injection molding 9 is electrically linked to flexible circuit board 201 through capacitive element 4.
Preferably, the number of the housing seal rings 11 is two.
Preferably, as shown in fig. 6-7, the capacitive element 4 has a shape of a notch or a via. The capacitive element 4 is a ceramic capacitor.
Preferably, when the shape of the capacitive element 4 is a notch shape, the injection molding piece 9 is in snap connection with the capacitive element 4; when the shape of the capacitive element 4 is a notch shape, the injection molding piece 9 is connected with the capacitive element 4 in an embedded manner.
Specifically, as shown in fig. 4-5, the injection molding member 9 has two design modes, specifically: the first is an injection molding piece without a PIN PIN injection molding package, and is connected with the design of the shape of a through hole of the capacitor element 4 through an internal sealing ring 10; the second is an injection molding piece wrapped by PIN foot injection molding, and is connected with the notch shape design of the capacitive element 4 through an internal sealing ring 10.
Of course, the above is only a typical example of the utility model, and other embodiments of the utility model are also possible, and all technical solutions formed by equivalent substitution or equivalent transformation fall within the scope of the utility model claimed.
Claims (7)
1. The temperature and pressure sensor is characterized by comprising a connector, a flexible circuit board, a chip element, a capacitor element, a thermistor, an injection molding piece, a shell and a temperature probe; the connector comprises a connector, a first flexible circuit board, a chip element and a second flexible circuit board, wherein a connector assembly is arranged at one end of the connector, and the other end of the connector is sequentially connected with the first flexible circuit board, the chip element and the second flexible circuit board; the second flexible circuit board is connected with the capacitive element, and the second flexible circuit board and the capacitive element are provided with a limiting hole of the concentric capacitive element and a limiting hole of the injection molding piece; the thermistor is connected with an injection molding piece, and the injection molding piece is tightly connected with the capacitor element through an internal sealing ring; and the thermistor is tightly connected with the shell through the shell sealing ring after being welded with the injection molding piece.
2. A temperature and pressure sensor as set forth in claim 1 wherein said housing includes a receiving chamber and a temperature probe in communication with said receiving chamber.
3. A temperature and pressure sensor according to claim 2, wherein the housing is externally threaded in cylindrical form.
4. A temperature and pressure sensor as in claim 1 wherein PIN PINs of said injection molded part are electrically linked to said flexible circuit board through capacitive elements.
5. A temperature and pressure sensor according to claim 1, wherein the number of housing seal rings is two.
6. A temperature and pressure sensor according to claim 1, wherein the capacitive element has a notch shape or a through hole shape.
7. A temperature and pressure sensor according to claim 6, wherein when the capacitive element is in the shape of a notch, the injection molding is snap-fit with the capacitive element; when the shape of the capacitive element is a notch shape, the injection molding piece is connected with the capacitive element in an embedded mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322404861.3U CN220729491U (en) | 2023-09-05 | 2023-09-05 | Temperature and pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322404861.3U CN220729491U (en) | 2023-09-05 | 2023-09-05 | Temperature and pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220729491U true CN220729491U (en) | 2024-04-05 |
Family
ID=90524609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322404861.3U Active CN220729491U (en) | 2023-09-05 | 2023-09-05 | Temperature and pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220729491U (en) |
-
2023
- 2023-09-05 CN CN202322404861.3U patent/CN220729491U/en active Active
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