CN217403499U - Welding sealed temperature and pressure composite sensor - Google Patents
Welding sealed temperature and pressure composite sensor Download PDFInfo
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- CN217403499U CN217403499U CN202220693324.8U CN202220693324U CN217403499U CN 217403499 U CN217403499 U CN 217403499U CN 202220693324 U CN202220693324 U CN 202220693324U CN 217403499 U CN217403499 U CN 217403499U
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Abstract
The utility model provides a welding sealed temperature and pressure composite sensor, belonging to the technical field of temperature and pressure composite sensors, comprising a shell component, a core body module and an induction device; the shell component comprises an upper mounting cavity and a lower mounting cavity, and the side wall of the lower mounting cavity is sealed with the temperature probe through laser welding; the lower part of the shell component is provided with a first channel; the core body module comprises a metal base and a ceramic circuit board, and the metal base and the side wall of the upper mounting cavity are sealed through laser welding; an electric conductor is arranged on the metal base in a penetrating way; the sensing device comprises a temperature sensing component and a pressure sensing component. The utility model provides a welded seal's warm-pressing composite sensor seals temperature probe and the lower installation cavity laser welding of casing part, and the last installation cavity laser welding of metal base and casing part is sealed, has improved the inside seal of temperature composite sensor, improves the overload pressure value that it can bear to and guaranteed its reliability in long-term use.
Description
Technical Field
The utility model belongs to the technical field of the compound sensor is pressed to the temperature, more specifically says, relates to a welded seal's compound sensor is pressed to temperature.
Background
At present, most of commonly used temperature and pressure composite sensors adopt ceramic pressure cores or MEMS pressure cores and NTC resistors to carry out combined packaging for pressure and temperature measurement, but the internal medium sealing of the sensor adopts an O-shaped ring mode, and the defects of small overload pressure, low long-term reliability and the like exist.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a welded seal's warm-pressing composite sensor aims at solving the problem that the inside medium seal overload pressure of sensor is little, and long-term reliability is low.
In order to achieve the purpose, the utility model adopts the technical proposal that: provided is a weld-sealed temperature-pressure composite sensor, including:
the temperature probe is arranged in the lower mounting cavity in a penetrating manner, and the side wall of the lower mounting cavity is sealed with the temperature probe through laser welding; the upper end of the shell component is provided with an electrical connecting piece; a first channel is arranged at the lower part of the shell component, is positioned at one side of the lower mounting cavity and is communicated with the upper mounting cavity;
the core body module comprises a metal base arranged in the upper mounting cavity and a ceramic circuit board arranged on the lower end face of the metal base, and the metal base and the side wall of the upper mounting cavity are sealed through laser welding; a conductor penetrates through the metal base and is connected with the electrical connecting piece and the ceramic circuit board;
the sensing device comprises a temperature sensing component arranged in the temperature probe and connected with the ceramic circuit board, and a pressure sensing component arranged on the ceramic circuit board and corresponding to the first channel.
As another embodiment of the application, a tin block is arranged between the pressure sensing component and the ceramic circuit board.
As another embodiment of the present application, the solder bumps are spherical or cylindrical.
As another embodiment of the application, the pressure sensing component is an MEMS silicon-based flip chip bonding piezoresistive chip.
As another embodiment of the application, a connecting hole is formed in the ceramic circuit board, and the end part of the temperature sensing component penetrates through the connecting hole.
As another embodiment of the application, the temperature sensing component is an NTC thermistor, and the NTC thermistor is welded with the ceramic circuit board.
As another embodiment of the present application, the conductive body is plural; and the ceramic circuit board is provided with a plurality of conductive parts corresponding to the conductive bodies one by one.
As another embodiment of the present application, the conductive portion includes a conductive hole penetrating through the ceramic circuit board, and an inner sidewall of the conductive hole is attached to an outer sidewall of the conductive body.
As another embodiment of the present application, the ceramic circuit board is welded to the lower end surface of the metal base.
The utility model provides a welded seal's warm-pressing composite sensor's beneficial effect lies in: compared with the prior art, the utility model discloses welded seal's warm-pressing combined sensor seals temperature probe and the lower installation cavity laser welding of housing part, and the last installation cavity laser welding of metal base and housing part is sealed, has improved the inside seal of temperature combined sensor, improves the overload pressure value that it can bear to and guaranteed its reliability of using for a long time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a welded and sealed temperature and pressure composite sensor provided in an embodiment of the present invention;
fig. 2 is an exploded view of a welded and sealed temperature and pressure composite sensor according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a welded and sealed temperature and pressure composite sensor according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;
fig. 5 is a schematic front view of a housing component according to an embodiment of the present invention;
fig. 6 is a bottom view of the housing component according to the embodiment of the present invention;
FIG. 7 is a cross-sectional view taken along line B-B of FIG. 6;
fig. 8 is a schematic structural diagram of a core module according to an embodiment of the present invention;
fig. 9 is a schematic front view of a core module according to an embodiment of the present invention;
FIG. 10 is a cross-sectional view taken along line C-C of FIG. 9;
fig. 11 is a schematic structural diagram of a flexible circuit unit according to an embodiment of the present invention.
In the figure: 100. a housing component; 101. an electrical connector; 102. a temperature probe; 103. a temperature sensing component; 104. a metal base; 105. a flexible circuit unit; 105a, a lower connecting plate; 105b, an upper connecting plate; 105c, a support plate; 106. a first channel; 107. an electrical conductor; 108. a glass insulator; 109. an upper mounting cavity; 110. a ceramic circuit board; 111. a pressure sensing component.
Detailed Description
In order to make the technical problem, technical solution and beneficial effects to be solved by the present invention more clearly understood, the following description is made in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Referring to fig. 1 to 11, a welded and sealed temperature and pressure composite sensor according to the present invention will now be described. The welding sealed temperature and pressure composite sensor comprises a shell component 100, a core body module and an induction device; the shell component 100 comprises an upper mounting cavity 109 and a lower mounting cavity which are coaxially arranged and are mutually communicated, the temperature probe 102 penetrates through the lower mounting cavity, and the side wall of the lower mounting cavity is sealed with the temperature probe 102 through laser welding; the upper end of the housing member 100 is provided with an electrical connector 101; the lower part of the shell component 100 is provided with a first channel 106, and the first channel 106 is positioned at one side of the lower mounting cavity and communicated with the upper mounting cavity 109; the core body module comprises a metal base 104 arranged in the upper mounting cavity 109 and a ceramic circuit board 110 arranged on the lower end face of the metal base 104, and the metal base 104 and the side wall of the upper mounting cavity 109 are sealed through laser welding; the metal base 104 is provided with a conductor 107 in a penetrating way, and the conductor 107 is connected with the electrical connector 101 and the ceramic circuit board 110; the sensing device comprises a temperature sensing component 103 arranged in the temperature probe 102 and connected with the ceramic circuit board 110, and a pressure sensing component 111 arranged on the ceramic circuit board 110 and corresponding to the first channel 106.
Compared with the prior art, the temperature and pressure composite sensor for welding and sealing mainly comprises a shell component 100, an electrical connecting piece 101 and a temperature probe 102; the upper installation cavity 109 and the lower installation cavity of temperature probe 102 that hold the core module are provided with in the casing part 100, and go up installation cavity 109 and lower installation cavity intercommunication, connect in temperature sensing components and parts 103 downwardly extending to temperature probe 102 on the ceramic circuit board 110 on the core module for the induced temperature value. The temperature probe 102 and the side wall of the lower mounting cavity are sealed by laser welding, so that the connection strength of the temperature probe 102 and the lower mounting cavity and the sealing strength of the lower mounting cavity are ensured.
The shell component 100 is further provided with a first channel 106, the first channel 106 is communicated with the outside and the upper mounting cavity 109, and the first channel 106 is used for measuring the pressure value of an outside medium by means of a pressure sensing component 111 on a ceramic circuit board 110; the core body module is arranged in the upper mounting cavity 109, a certain space exists between the core body module and the bottom of the upper mounting cavity 109, and the first channel 106 is communicated with the space; when an external medium enters the space through the first channel 106, the pressure sensing component 111 disposed on the ceramic circuit board 110 senses a pressure value of the medium, and transmits a signal to the ceramic circuit board 110, and then transmits the signal to the electrical connector 101 through the ceramic circuit board 110.
The core module further comprises a metal base 104, wherein the metal base 104 is used for supporting and protecting the ceramic circuit board 110 and sealing the upper mounting cavity 109; the side walls of the metal base 104 and the upper mounting cavity 109 are sealed by laser welding, so that the sealing performance between the metal base 104 and the shell component 100 is ensured, the sealing performance of the space between the upper mounting cavity 109 and the first channel 106 is ensured, the measurement accuracy of the pressure sensing component 111 is improved, the overload pressure of medium sealing in the temperature and pressure composite sensor is improved, and the reliability of the temperature and pressure composite sensor is improved. The metal base 104 is provided with the conductor 107 in a penetrating way, the conductor 107 is connected with the electric connector 101 and the ceramic circuit board 110, and the conductor 107 is used for transmitting the signal received by the ceramic circuit board 110 to the electric connector 101, so that the convenience and the stability of signal transmission are improved.
The utility model provides a welded seal's warm-pressing composite sensor seals temperature probe 102 with the lower installation cavity laser welding of casing part 100, and metal base 104 is sealed with the last installation cavity 109 laser welding of casing part 100, has improved the inside seal of temperature composite sensor, improves the overload pressure value that it can bear to and guaranteed its reliability in long-term use.
Optionally, the inner diameter of the upper mounting cavity 109 is greater than the inner diameter of the lower mounting cavity, the upper end surface of the temperature probe 102 is flush with the upper end surface of the lower mounting cavity, and the upper end surfaces of the upper end surface of the temperature probe 102 and the side wall of the lower mounting cavity are sealed by a laser welding process, so that a gap is prevented from being formed between the outer side wall of the temperature probe 102 and the side wall of the lower mounting cavity.
Be equipped with spacing step on the lateral wall of last installation cavity 109, metal base 104 gets into in installation cavity 109 from the top of last installation cavity 109, and metal base 104's lower terminal surface and spacing step butt, the up end of metal base 104 and the up end parallel and level of last installation cavity 109 this moment, and the up end of metal base 104 and the up end of the lateral wall of last installation cavity 109 adopt laser welding technology sealed, prevent to have the clearance between metal base 104 and the lateral wall of last installation cavity 109.
Optionally, the ceramic circuit board 110 is a ceramic PCB.
In some possible embodiments, as shown in fig. 8, a solder bump is disposed between the pressure sensing component 111 and the ceramic circuit board 110.
The pressure sensing component 111 is arranged on the ceramic circuit board 110, the upper end of the pressure sensing component 111 is fixed on the ceramic circuit board 110 by a tin block by adopting a soldering process, and the tin block can realize the support of the pressure sensing component 111; and when the pressure sensing component 111 detects the pressure value, the tin block can also transmit the electric signal to the ceramic circuit board 110 as a conductor.
Optionally, the tin block is spherical or columnar. The solder bumps are provided at the four corners of the pressure sensitive component 111, so that the pressure sensitive component 111 and the ceramic wiring board 110 can be stably connected. The spherical tin block is more convenient to weld and fix in the soldering process.
Optionally, the pressure sensing component 111 is an MEMS silicon-based flip-chip bonded piezoresistive chip. And the back surface of the chip is implanted with solder balls for chip welding support and electric signal conduction.
In some possible embodiments, as shown in fig. 3 to 8, a connection hole is formed on the ceramic circuit board 110, and an end of the temperature sensing component 103 penetrates through the connection hole.
A connecting hole for connecting the temperature sensing component 103 is formed in the middle of the ceramic circuit board 110, the temperature sensing component 103 is an NTC thermistor, the sensing end of the NTC thermistor extends into the temperature probe 102, and the signal transmission end of the NTC thermistor extends into the connecting hole and is fixed in the connecting hole by welding with the connecting hole.
The connecting holes are two and are arranged in the middle of the ceramic circuit board 110 and correspond to the lower mounting cavity.
In some possible embodiments, the conductive body 107 is plural; the ceramic circuit board 110 is provided with a plurality of conductive portions corresponding to the conductors 107 one by one.
The electric conductors 107 penetrate through the metal base 104 to connect the ceramic circuit board 110 and the electric connecting part 101, in order to improve the transmission efficiency of electric signals, a plurality of electric conductors 107 are arranged, the plurality of electric conductors 107 are uniformly distributed on the ceramic circuit board 110, and the electric conductors 107 penetrate through the metal base 104 to be connected with the electric connecting part 101 above the metal base 104.
The ceramic substrate 110 is provided with a plurality of conductive portions connected to the conductors 107, and the conductive portions are used to complete signal transmission between the ceramic substrate 110 and the conductors 107.
Optionally, the conductive body 107 is cylindrical, the conductive portion includes a conductive hole penetrating through the ceramic circuit board 110, and an inner side wall of the conductive hole is attached to an outer side wall of the conductive body 107.
To increase the contact area between the conductive body 107 and the conductive portion to improve the signal transmission efficiency. The conductor 107 is formed in a columnar shape, and the columnar conductor 107 is attached to the conductive hole or welded by a soldering process to increase the connection strength and ensure the transmission efficiency of the electrical signal.
Optionally, the number of the conductive bodies 107 is six, the number of the corresponding conductive holes is also six, and the six conductive holes are uniformly distributed outside the connection hole.
Optionally, the conductor 107 is made of a metal material, an insulator is sleeved outside the conductor 107, and the insulator isolates the metal base 104 and the conductor 107, so that normal transmission of an electrical signal is ensured.
Optionally, the insulator is a glass insulator 108. The metal base 104 is made by a process of high-temperature sintering and molding of metal and glass, a compression sealing and sealing mode is adopted, a metal shell forms compression force after the sintering temperature is reduced to wrap a glass body, and oxides on the surface of the metal can be melted into the glass to form a part of glass components in the sealing and sealing process, so that good sealing is obtained. The withstand voltage can reach 60 MpaA; and the glass-to-metal seal can ensure normal operation in harsh environments, such as applications at high pressures, temperatures, and corrosive chemicals.
Optionally, the lower ends of the ceramic circuit board 110 and the metal base 104 are soldered to increase the connection strength between the ceramic circuit board 110 and the metal base 104.
Optionally, the electrical connector 101 comprises a flexible circuit unit 105 and a standard connector, wherein the flexible circuit unit 105 is disposed at the upper end of the housing member 100, and the flexible circuit unit 105 is provided with a signal transmission hole connected with the conductor 107. The flex circuit unit 105 can process the small signals output by the chip while interconnecting the signals to a standard connector.
As shown in fig. 11, the flexible circuit unit 105 includes an upper connection plate 105b and a lower connection plate 105a, and a support plate 105c connecting the upper connection plate 105b and the lower connection plate 105a, the upper connection plate 105b being connected to a standard connector, and the lower connection plate 105a being connected to the conductors 107. The signal transmission hole is opened in the lower connection plate 105 a.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. Welding is sealed warm and pressure composite sensor, its characterized in that includes:
the temperature probe is arranged in the lower mounting cavity in a penetrating manner, and the side wall of the lower mounting cavity is sealed with the temperature probe through laser welding; the upper end of the shell component is provided with an electrical connecting piece; the lower part of the shell component is provided with a first channel, and the first channel is positioned on one side of the lower mounting cavity and communicated with the upper mounting cavity;
the core body module comprises a metal base arranged in the upper mounting cavity and a ceramic circuit board arranged on the lower end face of the metal base, and the metal base and the side wall of the upper mounting cavity are sealed through laser welding; the metal base is provided with a conductor in a penetrating way, and the conductor is connected with the electrical connecting piece and the ceramic circuit board;
the sensing device comprises a temperature sensing component arranged in the temperature probe and connected with the ceramic circuit board, and a pressure sensing component arranged on the ceramic circuit board and corresponding to the first channel.
2. The soldering-sealed temperature-pressure composite sensor according to claim 1, wherein a tin block is arranged between the pressure sensing component and the ceramic circuit board.
3. The solder-sealed thermo-compression composite sensor according to claim 2, wherein the solder bumps are spherical or cylindrical.
4. The solder-sealed temperature-pressure composite sensor according to claim 3, wherein the pressure sensing component is a MEMS silicon-based flip-chip-bonded piezoresistive chip.
5. The soldering-sealed temperature-pressure composite sensor according to claim 1, wherein the ceramic circuit board is provided with a connecting hole, and an end of the temperature sensing component penetrates through the connecting hole.
6. The welding-sealed temperature-pressure composite sensor according to claim 5, wherein the temperature sensing component is an NTC thermistor, and the NTC thermistor is welded with the ceramic circuit board.
7. The weld-sealed thermopiezoelectric composite sensor according to claim 1, wherein the conductive body is plural; and the ceramic circuit board is provided with a plurality of conductive parts corresponding to the conductive bodies one to one.
8. The solder-sealed temperature-pressure composite sensor according to claim 7, wherein the conductive part comprises a conductive hole penetrating through the ceramic circuit board, and an inner side wall of the conductive hole is attached to an outer side wall of the conductive body.
9. The solder-sealed temperature-pressure composite sensor according to claim 8, wherein the ceramic circuit board is soldered to the lower end surface of the metal base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220693324.8U CN217403499U (en) | 2022-03-28 | 2022-03-28 | Welding sealed temperature and pressure composite sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220693324.8U CN217403499U (en) | 2022-03-28 | 2022-03-28 | Welding sealed temperature and pressure composite sensor |
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| Publication Number | Publication Date |
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| CN217403499U true CN217403499U (en) | 2022-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220693324.8U Active CN217403499U (en) | 2022-03-28 | 2022-03-28 | Welding sealed temperature and pressure composite sensor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114719903A (en) * | 2022-03-28 | 2022-07-08 | 河北美泰电子科技有限公司 | Temperature and pressure composite sensor based on metal glass sintered base welding seal |
| CN116105801A (en) * | 2023-04-11 | 2023-05-12 | 河北美泰电子科技有限公司 | Pressure and temperature sensor assembled in modularized mode and assembling method thereof |
-
2022
- 2022-03-28 CN CN202220693324.8U patent/CN217403499U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114719903A (en) * | 2022-03-28 | 2022-07-08 | 河北美泰电子科技有限公司 | Temperature and pressure composite sensor based on metal glass sintered base welding seal |
| CN116105801A (en) * | 2023-04-11 | 2023-05-12 | 河北美泰电子科技有限公司 | Pressure and temperature sensor assembled in modularized mode and assembling method thereof |
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