CN217032852U - Small-diameter pressure sensor - Google Patents
Small-diameter pressure sensor Download PDFInfo
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- CN217032852U CN217032852U CN202220070622.1U CN202220070622U CN217032852U CN 217032852 U CN217032852 U CN 217032852U CN 202220070622 U CN202220070622 U CN 202220070622U CN 217032852 U CN217032852 U CN 217032852U
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- diameter pressure
- sintering base
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Abstract
The embodiment of the utility model provides a small-diameter pressure sensor. During pressure measurement, a measured medium enters through a pressure cavity of the metal shell, the flip chip senses pressure data and transmits pressure signals, standard current and voltage signals are acted through the PCBA amplification board, and the pressure signals are output through the outgoing lines. By utilizing the characteristic of small size of the flip-chip bonding pressure sintering base, a sensor packaging structure is designed, structures such as pressure transmission oil and a diaphragm are omitted, the overall size of the sensor is greatly reduced, and the small-diameter pressure sensor provided by the utility model can be embedded into a fine instrument or equipment.
Description
Technical Field
The utility model relates to the field of sensors, in particular to a small-diameter pressure sensor.
Background
A micro-electromechanical system (MEMS) refers to a small device with a size of a few centimeters or less, and is an independent intelligent system. MEMS technology has been widely used in the fields of electronics, medicine, industry, automotive, aerospace systems, etc., because of its advantages of miniaturization, intelligence, high integration, and mass production. The MEMS small-diameter pressure sensor is a small-diameter pressure sensor produced and manufactured by adopting MEMS technology.
The existing MEMS small-diameter pressure sensor mostly adopts the structural form of an oil-filled core body, the structure is usually packaged by adopting a metal diaphragm and a glass sintering base, and pressure transmission oil and a pressure chip for transmitting pressure are packaged inside the structure. The diaphragm is deformed by external pressure, so that a pressure signal is transmitted to the pressure chip through pressure transmitting oil, the pressure chip outputs a millivolt signal, and the signal which can be collected by the instrument can be output only by conditioning of the transmitter. The small-diameter pressure sensor based on the oil-filled core body encapsulation needs to encapsulate the oil-filled core body in a mode of compressing, sealing or welding an O-shaped ring, and the output of signals needs to adopt a cable leading-out mode or an aviation plug leading-out mode.
However, the adoption of the oil-filled core body packaging mode leads to larger overall size of the sensor, which is not suitable for being integrally embedded into a fine instrument or equipment, and the whole manufacturing process of the sensor needs various complex processes such as vacuum oil filling, gold wire binding, membrane welding and the like, so that the overall cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a small-diameter pressure sensor, which is used for solving the technical problems that the traditional sensor adopts an oil-filled core body packaging mode to cause the whole size of the sensor to be larger and the sensor is not suitable for being integrally embedded into a fine instrument or equipment.
In order to realize the purpose, the utility model adopts the technical scheme that: there is provided a small-diameter pressure sensor including:
a metal housing;
the sintering base is arranged at the end part of the metal shell and is provided with a metal pin;
the flip chip is arranged on one side, close to the metal shell, of the sintering base and is communicated with metal pins of the sintering base;
the metal upper cover is arranged on one side, far away from the metal shell, of the sintering base;
the PCBA is arranged inside the metal upper cover and communicated with the metal pins of the sintering base;
a plurality of lead-out wires, the lead-out wire set up in on the PCBA board and with PCBA board intercommunication.
In one embodiment, the sintering base further comprises an insulating block and a shell arranged around the outside of the insulating block, the metal pin is embedded in the insulating block, and the metal pin is not in contact with the shell.
In one embodiment, the insulating block is made of a ceramic material or a glass material.
In one embodiment, the sintered base is connected with the metal shell and the metal upper cover by laser welding.
In one embodiment, the outgoing lines comprise four lines, namely a red silica gel line, a black silica gel line, a yellow silica gel line and a white silica gel line.
In one embodiment, the outlet is a standard soft silicone wire.
In one embodiment, the outer surface of the metal shell is provided with external threads.
One or more technical solutions in the embodiments of the present invention at least have the following technical effects or advantages:
the embodiment of the utility model provides a small-diameter pressure sensor. During pressure measurement, a measured medium enters through a pressure cavity of the metal shell, the flip chip senses pressure data and transmits pressure signals, the PCBA amplification board acts as standard current and voltage signals, and the pressure signals are output through the outgoing line. By utilizing the characteristic of small size of the flip-chip bonding pressure sintering base, a sensor packaging structure is designed, and structures such as pressure transmitting oil, a diaphragm and the like are avoided, so that the overall size of the sensor is greatly reduced, and the small-diameter pressure sensor provided by the utility model can be embedded into a fine instrument or equipment.
In addition, the sintered base, the metal shell and the metal upper cover are connected by utilizing a mature laser welding process, so that the sensor has good sealing performance and high reliability, and can effectively cover the full-range pressure range ((0-10 MPa).
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a small-diameter pressure sensor provided in an embodiment of the present invention;
fig. 2 is a perspective view of a small-diameter pressure sensor provided in an embodiment of the present invention.
Wherein the respective reference numerals are as follows:
1. a metal housing; 2. sintering the base; 3. flip chip mounting; 4. a metal upper cover; 5. PCBA board; 6. leading-out wires; 21. a housing; 22. a metal pin; 23. an insulating block.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and intended to explain the present invention and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Referring to fig. 1 to 2, an embodiment of the present application provides a small-diameter pressure sensor, which includes a metal housing 1, a sintered base 2, a flip chip 3(FC chip), a metal top cover 4, a PCBA board 5, and a plurality of lead wires 6. Wherein, the sintering base 2 is arranged at the end of the metal shell 1, and the sintering base 2 is provided with a metal pin 22. The flip chip 3 is disposed on the sintering base 2 near one side of the metal housing 1, and the flip chip 3 is communicated with the metal pins 22 of the sintering base 2. The metal upper cover 4 is arranged on one side of the sintering base 2 far away from the metal shell 1. The PCBA board 5 is disposed inside the metal upper cover 4, and the PCBA board 5 is in communication with the metal pins 22 of the sintered base 2. The lead-out wire sets up on PCBA board 5 and is linked together with PCBA board 5.
The small diameter pressure sensor provided by the present embodiment. During pressure measurement, a measured medium enters through a pressure cavity of the metal shell 1, the flip chip 3 senses pressure data and transmits pressure signals, the standard current and voltage signals are acted through the PCBA amplification board, and the pressure signals are output through the outgoing line 6. By utilizing the characteristic of small volume of the flip-chip bonding pressure sintering base 2, a sensor packaging structure is designed, and structures such as pressure transmitting oil, a diaphragm and the like are avoided, so that the overall size of the sensor is greatly reduced, and the pressure sensor provided by the utility model can be embedded into a fine instrument or equipment.
In one embodiment, the sintering base 2 further comprises an insulating block 23 and a housing 21 disposed around the outside of the insulating block 23, the metal pins 22 are embedded in the insulating block 23, and the metal pins 22 are not in contact with the housing 21. The insulating block 23 fixes the metal pin 22 to the housing 21 so that the metal pin 22 is fixed and does not electrically conduct with the metal housing 21.
In one embodiment, the insulating block 23 is made of a ceramic material or a glass material. The ceramic material and the glass material both have good insulating property and pressure bearing capacity, can prevent the metal pin 22 from being conducted with the shell 21, and also have good thermal stability, when the insulating block 23 is heated, the insulating block 23 is not easy to expand and deform, so that the thermal stress generated to the packaged sensor is small. Illustratively, the insulating block 23 in this embodiment is made of glass, and the glass insulating block 23 has the advantage of being convenient to sinter.
In one embodiment, the sintered base 2 is connected to the metal casing 1 and the metal top cover 4 by laser welding. The sintered base 2, the metal shell 1 and the metal upper cover 4 are connected by utilizing a mature laser welding process, so that the sensor has good sealing performance and high reliability, and can effectively cover a full-range pressure range ((0-10 MPa).
In one embodiment, the lead-out wires 6 comprise four, namely red silica gel wires, black silica gel wires, yellow silica gel wires and white silica gel wires. Through adopting different colours to distinguish each lead-out wire 6 to in the installation of pressure sensor is connected, avoid the lead wire intercommunication to make mistakes.
In one embodiment, the outlet 6 is a standard soft silicone wire. The installation convenience of the pressure sensor can be improved by adopting a standard soft silica gel lead as the leading-out wire 6. In one embodiment, the outer surface of the metal housing 1 is provided with an external thread. The external thread on the metal shell 1 can facilitate the installation of the pressure sensor and has the effect of being connected with the pressure medium container to be measured in a sealing way.
The production process of the pressure sensor provided by the utility model comprises the following specific steps:
s1: the flip chip 3 is communicated with the metal pins 22 of the sintering base 2 through reflow soldering;
s2: connecting the lower part of the sintering base 2 with the flip chip 3 and the metal shell 1 by laser welding;
s3: the upper part of the sintering base 2 is connected with the metal upper cover 4 through laser welding;
s4: arranging the PCBA board 5 inside the metal upper cover 4, and connecting the metal pins 22 of the sintered base 2 to the upper bonding pads of the PCBA board 5 in a soldering mode;
s5: respectively soldering the red silica gel wire, the black silica gel wire, the yellow silica gel wire and the white silica gel wire to the PCBA board 5 according to the sequential definition;
s6: and (5) carrying out complete machine calibration test.
In the step S1, the flip chip 3 can be directly connected to the metal pins 22 of the sintered base 2 by soldering via ball-implanting discs, so as to reduce the process requirements of conventional wire binding and dispensing protection.
The sintering base 2 in the step S2 is directly welded with the metal shell 1 in a butt joint mode, and the sealing performance is good.
The sintering base 2 in the steps S2 and S3 is directly used as a carrier of the shell 21 for up-and-down laser welding, the structure size is small, and the package is light.
And in the step S5, standard soft silica gel wires are used for connection, so that the connection is convenient.
Because of using flip-chip bonding pressure chip encapsulation, all-welded structural design for the product just possesses pressure measurement's function under less encapsulation volume, and the outside of metal casing 1 sets up the screw thread that the model is M5, and 11mm on the four sides of installation, excircle diameter 12mm, product overall height 25.5 mm.
When the pressure sensor provided by the embodiment works, a measured medium enters through the pressure cavity formed by the metal shell 1, the flip chip 3 senses pressure data and transmits a pressure signal, the pressure signal is acted into a standard current and voltage signal through the PCBA amplification board, and the pressure signal is output through the lead-out wire 6. And the pressure sensor has reasonable structural design, the production process is convenient for batch production, and the cost performance is high.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalents and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A small diameter pressure sensor, characterized in that it comprises:
a metal housing;
the sintering base is arranged at the end part of the metal shell and is provided with a metal pin;
the flip chip is arranged on one side, close to the metal shell, of the sintering base and is communicated with metal pins of the sintering base;
the metal upper cover is arranged on one side, far away from the metal shell, of the sintering base;
the PCBA is arranged inside the metal upper cover and communicated with the metal pins of the sintering base;
a plurality of lead-out wires, the lead-out wire set up in on the PCBA board and with the PCBA board communicates.
2. A small diameter pressure sensor as claimed in claim 1, wherein:
the sintering base further comprises an insulating block and a shell arranged outside the insulating block in a surrounding mode, the metal pins are embedded in the insulating block, and the metal pins are not in contact with the shell.
3. A small diameter pressure sensor according to claim 2, wherein:
the insulating block is made of ceramic materials or glass materials.
4. A small diameter pressure sensor as claimed in claim 1, wherein:
the sintering base, the metal shell and the metal upper cover are connected through laser welding.
5. A small diameter pressure sensor according to claim 1, wherein:
the outgoing lines comprise four lines, namely a red silica gel line, a black silica gel line, a yellow silica gel line and a white silica gel line.
6. A small diameter pressure sensor according to claim 1, wherein:
the outgoing line adopts a standard soft silica gel wire.
7. A small diameter pressure sensor as claimed in claim 1, wherein:
the outer surface of the metal shell is provided with external threads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220070622.1U CN217032852U (en) | 2022-01-12 | 2022-01-12 | Small-diameter pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220070622.1U CN217032852U (en) | 2022-01-12 | 2022-01-12 | Small-diameter pressure sensor |
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| Publication Number | Publication Date |
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| CN217032852U true CN217032852U (en) | 2022-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220070622.1U Active CN217032852U (en) | 2022-01-12 | 2022-01-12 | Small-diameter pressure sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116558700A (en) * | 2023-07-12 | 2023-08-08 | 合肥皖科智能技术有限公司 | All-welded oil filling pressure sensor based on sintering seat packaging |
-
2022
- 2022-01-12 CN CN202220070622.1U patent/CN217032852U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116558700A (en) * | 2023-07-12 | 2023-08-08 | 合肥皖科智能技术有限公司 | All-welded oil filling pressure sensor based on sintering seat packaging |
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