CN116083987A - Electroplating diamond wire with protective layer and preparation process thereof - Google Patents

Electroplating diamond wire with protective layer and preparation process thereof Download PDF

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Publication number
CN116083987A
CN116083987A CN202211493984.2A CN202211493984A CN116083987A CN 116083987 A CN116083987 A CN 116083987A CN 202211493984 A CN202211493984 A CN 202211493984A CN 116083987 A CN116083987 A CN 116083987A
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China
Prior art keywords
layer
protective layer
electroplated
diamond wire
treatment
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Pending
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CN202211493984.2A
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Chinese (zh)
Inventor
董保东
苏仔见
费明桃
杨明道
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Yancheng Jiwa New Material Technology Co ltd
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Yancheng Jiwa New Material Technology Co ltd
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Priority to CN202211493984.2A priority Critical patent/CN116083987A/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires

Abstract

The invention relates to the technical field of electroplating diamond wires, in particular to the field of IPC B28D5, and further relates to an electroplating diamond wire with a protective layer and a preparation process thereof. The electroplating diamond wire with the protective layer comprises a bus matrix, an electroplated layer and an anti-corrosion protective layer. The electroplating diamond wire with the protective layer prepared by the invention has a denser electroplating layer, effectively fixes diamond, and is added with an anti-corrosion protective layer in post-treatment to prevent the electroplating layer from being corroded, prevent the electroplating layer from peeling off from a bus matrix and avoid the cracking phenomenon of the electroplating layer.

Description

Electroplating diamond wire with protective layer and preparation process thereof
Technical Field
The invention relates to the technical field of electroplating diamond wires, in particular to the field of IPC B28D5, and further relates to an electroplating diamond wire with a protective layer and a preparation process thereof.
Background
With the rapid development of the photovoltaic industry, the silicon wafer cutting mode is greatly changed, the original steel wire abrasive cutting processing is evolved into diamond wire cutting processing, and the diamond wire cutting technology, namely the technology for cutting by using diamond particles fixed on a diamond wire, has the advantages of high cutting efficiency, low silicon consumption, good surface shape precision, environmental protection, cleanness and the like, and the industries of silicon wafer cutting, semiconductor cutting, sapphire cutting, magnetic material cutting, glass cutting, marble cutting and the like at present are changed from sand wire cutting to diamond wire cutting, so that the quality of the diamond wire directly determines the cutting effect.
With the improvement of cutting technology, the silicon wafer cutting and flaking have become the necessary trend of the development of the silicon wafer cutting industry, the size gradually develops from 158/166mm before to 182/210mm at present, the thickness of the cut wafer is reduced from 200 μm before to 140 μm at present, the thickness of the cut wafer is subsequently developed to 120 μm, and the quality requirement on diamond wires is gradually increased with the silicon wafer becoming large and flaked. The cutting force of the large piece and the thin piece is required to be stronger, the cutting time is longer as the cutting silicon chip is bigger, the slot distance is narrower, the longer the steel wire is soaked in the cutting liquid, the higher the compactness of the plating layer in the cutting process is required, and the corrosion resistance is stronger; the compactness is stronger, so that the diamond is fixed more firmly by the plating layer, and the cutting time is long, and the sand cannot fall off; the corrosion resistance is stronger, so that the plating layer is not easy to be corroded by an acidic cooling liquid system, the plating layer is not cracked, no corrosion holes are formed, and the normal cutting of the steel wire can be ensured without the problem of cutting an interrupted line. Therefore, the plating diamond wire with higher compactness and higher corrosion resistance is a main research direction for solving the subsequent cutting of large sheets and slices.
Chinese patent CN 111267253A discloses a wire for electroplating diamond and application thereof, the wire for electroplating diamond comprises a busbar, an electroplated layer plated on the surface of the busbar, and a diamond particle layer embedded on the electroplated layer. According to the technical scheme, the cutting yield of the polycrystalline impurity rod can be improved, the breakage rate is reduced, meanwhile, the consumption of single steel wires is reduced, the slicing processing cost is obviously reduced, and the corrosion resistance of the diamond wire cannot be solved.
Disclosure of Invention
In order to solve the problems in the background art, the invention discloses an electroplating diamond wire with a protective layer and a preparation process thereof, the prepared diamond wire has good plating compactness, and an anti-corrosion protective layer is added in the last procedure, so that the plating can be prevented from being corroded while the diamond is fixed.
The first aspect of the invention provides a plating diamond wire with a protective layer, which comprises a bus bar matrix, a plating layer and an anti-corrosion protective layer.
Preferably, the busbar matrix is any one of a steel wire, a high alloy carbon steel wire, a tungsten wire and a tungsten aluminum alloy wire.
Preferably, the section of the busbar matrix is elliptical, and the diameter is 10-300 mu m.
Preferably, the electroplated layer is any one of a nickel plating layer and a nickel-cobalt alloy plating layer.
Preferably, the electroplated layer is a nickel-cobalt alloy layer.
Preferably, the raw materials of the electroplating solution of the nickel-cobalt alloy plating layer comprise water, cobalt sulfamate and nickel sulfamate.
Preferably, the mass ratio of the cobalt sulfamate to the nickel sulfamate is 1: (1-10).
Preferably, the electroplated layer comprises a pre-plating layer, a sand-coated plating layer and a thickened plating layer.
Preferably, the thickness of the pre-plating layer is 0.01-1 μm.
Preferably, the sand coating layer contains diamond.
Preferably, the diamond has a particle size of 2 to 300 μm.
Preferably, the diamond has a particle size of 2 to 20 μm.
Preferably, the thickness of the sand coating is 1-5 μm.
Preferably, the thickness of the thickened plating layer is 3-10 μm.
In the invention, the plating solution of cobalt sulfamate and nickel sulfamate is adopted, and the mass ratio of cobalt sulfamate to nickel sulfamate is controlled to be 1: (1-10), compared with the traditional plating solution only containing nickel sulfamate, under the condition of certain current density, the deposition rate of cobalt sulfamate is slower, the obtained plating layer has smaller crystal grains and the plating layer is denser; the fixation of diamond is effectively enhanced and the penetration corrosion of acidic substances is prevented by controlling the thickness of the pre-plating layer to be 0.01-1 mu m, the thickness of the sand-coated plating layer to be 1-5 mu m and the thickness of the thickened plating layer to be 3-10 mu m.
Preferably, the anti-corrosion protective layer is a boric acid protective layer.
Preferably, the concentration of boric acid in the boric acid protection layer is 15-45 g/L.
The second aspect of the invention provides a process for preparing an electroplated diamond wire with a protective layer, comprising the following steps:
(1) Pretreatment: sequentially carrying out ultrasonic treatment, electrolytic degreasing, hot water washing, cold water washing, ultrasonic acid washing and cold water washing treatment on a bus matrix;
(2) Electroplating: sequentially performing preplating, sanding and thickening treatment on the bus matrix obtained in the step (1);
(3) Post-treatment: and (3) sequentially performing ultrasonic hot water washing, cold water washing and drying treatment on the electroplated busbar matrix obtained in the step (2).
Preferably, the ultrasonic frequency of the ultrasonic treatment and ultrasonic pickling in the step (1) is 2-7A; the flow density of the electrolytic degreasing treatment is 0.2-2A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The temperature of the hot water washing treatment is 50-70 ℃; the temperature of the cold water washing treatment is 20-30 ℃.
Preferably, the sanding treatment in the step (2) is to plate diamond on the bus bar matrix at the same time of plating nickel-cobalt alloy.
Preferably, in the step (3), a boric acid protection layer is added in the ultrasonic hot water washing treatment process.
Preferably, the temperature of the ultrasonic hot water washing treatment is 55-75 ℃.
According to the invention, the electroplated diamond wire is subjected to ultrasonic hot water washing treatment, so that the surface of the electroplated layer of the diamond wire is wrapped with a compact boric acid protection layer, the electroplated layer is prevented from being corroded, and the electroplated layer is prevented from peeling off from a bus substrate and cracking.
The beneficial effects are that: the method comprises the steps of adopting an electroplating solution of cobalt sulfamate and nickel sulfamate, and controlling the mass ratio of the cobalt sulfamate to the nickel sulfamate to be 1: (1-10), compared with the traditional plating solution only containing nickel sulfamate, under the condition of certain current density, the deposition rate of cobalt sulfamate is slower, the obtained plating layer has smaller crystal grains and the plating layer is denser; the fixation of diamond is effectively enhanced and the penetration corrosion of acidic substances is prevented by controlling the thickness of the pre-plating layer to be 0.01-1 mu m, the thickness of the sand-coated plating layer to be 1-5 mu m and the thickness of the thickened plating layer to be 3-10 mu m; and a boric acid protective layer is added in the post-treatment, so that the electroplated layer is further prevented from being corroded, the electroplated layer is prevented from peeling off from a bus matrix, and the phenomenon of cracking of the electroplated layer is avoided.
Detailed Description
Example 1
Example 1 provides a plated diamond wire with a protective layer, which includes a busbar matrix, a plating layer, and an anti-corrosion protective layer.
The bus matrix is a high alloy carbon steel wire.
The section of the bus bar matrix is elliptical, and the diameter is 42 mu m.
The electroplated layer is a nickel-cobalt alloy plated layer.
The raw materials of the electroplating solution of the nickel-cobalt alloy plating layer comprise water, cobalt sulfamate and nickel sulfamate.
The mass ratio of the cobalt sulfamate to the nickel sulfamate is 1:9.
the electroplated layer comprises a pre-plating layer, a sand-coated plating layer and a thickened plating layer.
The thickness of the pre-plating layer was 0.5 μm.
The sand coating contains diamond.
The particle size of the diamond was 8 μm.
The thickness of the sand coating is 3 mu m.
The thickness of the thickened plating layer is 5 mu m.
The anti-corrosion protective layer is a boric acid protective layer.
The concentration of boric acid in the boric acid protection layer is 25g/L.
A preparation method of an electroplating diamond wire with a protective layer comprises the following steps:
(1) Pretreatment: sequentially carrying out ultrasonic treatment, electrolytic degreasing, hot water washing, cold water washing, ultrasonic acid washing and cold water washing treatment on a bus matrix;
(2) Electroplating: sequentially performing preplating, sanding and thickening treatment on the bus matrix obtained in the step (1);
(3) Post-treatment: and (3) sequentially performing ultrasonic hot water washing, cold water washing and drying treatment on the electroplated busbar matrix obtained in the step (2).
The ultrasonic frequency of ultrasonic treatment and ultrasonic pickling in the step (1) is 3.5A; the flow density of the electrolytic degreasing treatment is 0.5A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The temperature of the hot water washing treatment is 60 ℃; the temperature of the cold water washing treatment is 25 ℃.
And (3) sanding treatment in the step (2) is to plate diamond on the bus matrix at the same time of plating nickel-cobalt alloy.
And (3) adding a boric acid protection layer in the ultrasonic hot water washing treatment process.
The temperature of the ultrasonic hot water washing treatment in the step (3) is 60 ℃.
Example 2
Example 2 provides a plated diamond wire with a protective layer, which includes a busbar matrix, a plating layer, and an anti-corrosion protective layer.
The bus matrix is a tungsten aluminum alloy wire.
The section of the bus bar matrix is elliptical, and the diameter of the bus bar matrix is 33 mu m.
The electroplated layer is a nickel-cobalt alloy plated layer.
The raw materials of the electroplating solution of the nickel-cobalt alloy plating layer comprise water, cobalt sulfamate and nickel sulfamate.
The mass ratio of the cobalt sulfamate to the nickel sulfamate is 3:7.
the electroplated layer comprises a pre-plating layer, a sand-coated plating layer and a thickened plating layer.
The thickness of the pre-plating layer was 0.9 μm.
The sand coating contains diamond.
The particle size of the diamond was 5 μm.
The thickness of the sand coating is 4 mu m.
The thickness of the thickened plating layer is 5.5 mu m.
The anti-corrosion protective layer is a boric acid protective layer.
The concentration of boric acid in the boric acid protection layer is 40g/L.
A preparation method of an electroplating diamond wire with a protective layer comprises the following steps:
(1) Pretreatment: sequentially carrying out ultrasonic treatment, electrolytic degreasing, hot water washing, cold water washing, ultrasonic acid washing and cold water washing treatment on a bus matrix;
(2) Electroplating: sequentially performing preplating, sanding and thickening treatment on the bus matrix obtained in the step (1);
(3) Post-treatment: and (3) sequentially performing ultrasonic hot water washing, cold water washing and drying treatment on the electroplated busbar matrix obtained in the step (2).
The ultrasonic frequency of ultrasonic treatment and ultrasonic pickling in the step (1) is 5.5A; the flow density of the electrolytic degreasing treatment is 1.5A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The temperature of the hot water washing treatment is 60 ℃; the temperature of the cold water washing treatment is 25 ℃.
And (3) sanding treatment in the step (2) is to plate diamond on the bus matrix at the same time of plating nickel-cobalt alloy.
And (3) adding a boric acid protection layer in the ultrasonic hot water washing treatment process.
The temperature of the ultrasonic hot water washing treatment in the step (3) is 70 ℃.
Example 3
Example 3 provides a plating diamond wire with a protective layer, and the specific embodiment is the same as example 1, except that the plating layer is a nickel plating layer.
Example 4
Example 4 provides an electroplating diamond wire with a protective layer, and the specific embodiment of the electroplating diamond wire is the same as example 1, wherein the mass ratio of cobalt sulfamate to nickel sulfamate is 2:1.
example 5
Example 5 provides a plating diamond wire having a protective layer, which is similar to example 1 in specific embodiment, except that the concentration of boric acid in the boric acid protective layer is 50g/L.
Example 6
Example 6 provides a electroplated diamond wire with a protective layer, which is similar to example 1 in its specific embodiment except that there is no boric acid protective layer.
The performance test method comprises the following steps:
1. the samples of silicon wafers were cut using the wire-cut electric plating diamond having a protective layer prepared in examples 1 to 2, and the sizes of samples 1 to 5 were 210mm, and the results are shown in Table 1.
2. The plating diamond wires with protective layers prepared in examples 1 to 6 were tested for corrosion resistance according to the acetate salt spray test (AASS test) in the GB/T101252012 artificial atmosphere corrosion test salt spray test, and the results are shown in table 1.
Test results:
table 1:
Figure BDA0003964793970000061
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Claims (10)

1. the electroplated diamond wire with the protective layer is characterized by comprising a bus bar matrix, an electroplated layer and an anti-corrosion protective layer.
2. The electroplated diamond wire with a protective layer of claim 1, wherein the busbar matrix is any one of a steel wire, a high alloy carbon steel wire, a tungsten aluminum alloy wire.
3. The electroplated diamond wire with a protective layer according to claim 1, wherein the electroplated layer is any one of a nickel-plated layer and a nickel-cobalt-plated layer.
4. A plating diamond wire having a protective layer according to claim 3, wherein the raw materials of the plating solution of the nickel-cobalt alloy plating layer include water, cobalt sulfamate and nickel sulfamate; the mass ratio of the cobalt sulfamate to the nickel sulfamate is 1: (1-10).
5. The electroplated diamond wire with protective layer of claim 1, wherein the electroplated layer comprises a pre-coat layer, a sand-on layer and a thickened layer.
6. The electroplated diamond wire with a protective layer as set forth in claim 5, wherein the thickness of the pre-plating layer is 0.01 to 1 μm; the thickness of the sand coating is 1-5 mu m; the thickness of the thickened plating layer is 3-10 mu m.
7. The electroplated diamond wire with a protective layer of claim 5, wherein the sanding layer contains diamond; the grain diameter of the diamond is 2-300 mu m.
8. The electroplated diamond wire with a protective layer of claim 1, wherein the corrosion protection layer is a boric acid protective layer; the concentration of boric acid in the boric acid protective layer is 15-45 g/L.
9. A process for producing the electroplated diamond wire with the protective layer as claimed in any one of claims 1 to 8, comprising the steps of:
(1) Pretreatment: sequentially carrying out ultrasonic treatment, electrolytic degreasing, hot water washing, cold water washing, ultrasonic acid washing and cold water washing treatment on a bus matrix;
(2) Electroplating: sequentially performing preplating, sanding and thickening treatment on the bus matrix obtained in the step (1);
(3) Post-treatment: and (3) sequentially performing ultrasonic hot water washing, cold water washing and drying treatment on the electroplated busbar matrix obtained in the step (2).
10. The process for producing a plated diamond wire with a protective layer according to claim 9, wherein a boric acid protective layer is added during the ultrasonic hot water washing treatment in the step (3).
CN202211493984.2A 2022-11-25 2022-11-25 Electroplating diamond wire with protective layer and preparation process thereof Pending CN116083987A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08225888A (en) * 1995-02-14 1996-09-03 Nkk Corp Production of corrosion resistant steel sheet excellent in chemical convertibility and cold rolled steel sheet therefrom
CN104152972A (en) * 2014-05-07 2014-11-19 厦门凯璇玑金刚石线锯有限公司 Manufacturing method for diamond wire saw
CN105803427A (en) * 2014-12-31 2016-07-27 中国科学院宁波材料技术与工程研究所 Method for preparing diamond with thinned surface plating layer
WO2018234229A1 (en) * 2017-06-23 2018-12-27 Atotech Deutschland Gmbh Nickel electroplating bath for depositing a decorative nickel coating on a substrate
CN109097811A (en) * 2018-09-13 2018-12-28 济南东方结晶器有限公司 Electroplate liquid of Co-Ni-P- diamond coating and preparation method thereof and electro-plating method
CN114411225A (en) * 2021-12-13 2022-04-29 广东金湾高景太阳能科技有限公司 Manufacturing method of superfine electroplating diamond wire

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08225888A (en) * 1995-02-14 1996-09-03 Nkk Corp Production of corrosion resistant steel sheet excellent in chemical convertibility and cold rolled steel sheet therefrom
CN104152972A (en) * 2014-05-07 2014-11-19 厦门凯璇玑金刚石线锯有限公司 Manufacturing method for diamond wire saw
CN105803427A (en) * 2014-12-31 2016-07-27 中国科学院宁波材料技术与工程研究所 Method for preparing diamond with thinned surface plating layer
WO2018234229A1 (en) * 2017-06-23 2018-12-27 Atotech Deutschland Gmbh Nickel electroplating bath for depositing a decorative nickel coating on a substrate
CN109097811A (en) * 2018-09-13 2018-12-28 济南东方结晶器有限公司 Electroplate liquid of Co-Ni-P- diamond coating and preparation method thereof and electro-plating method
CN114411225A (en) * 2021-12-13 2022-04-29 广东金湾高景太阳能科技有限公司 Manufacturing method of superfine electroplating diamond wire

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